VITA Technologies Spring 2023 with Resource Guide

Pg Advertiser

3 Behlman Electronics, Inc. –No one powers the Army like Behlman

31 Behlman Electronics, Inc. –When it comes to VPX, one company has the most flavors

11 Dawn VME Products –Dawn powers VPX

1 Elma Electronic –

Elma Electronic: 3U VPX based rugged CMFF ATR field system for CMOSS and aligned to SOSA 1.0

9 Elma Electronic –Ready to report for MOSA & CMOSS duty

15 LCR Embedded Systems, Inc. –Develop. Demonstrate. Deploy.

32 Mercury Systems, Inc. –

The next big thing in RFSoC is here. And it’s only 2.5” x 4”

17 Milpower Source –

Your design partner for fieldproven MIL-grade power & networking solutions

EVENTS

IEEE Nuclear & Space Radiation Effects Conference (NSREC)

July 24-28, 2023

Kansas City, MO https://www.nsrec.com/

DSEI 2023

September 12-15, 2023

London, England https://www.dsei.co.uk/

AUSA 2023

October 9-11, 2023

Washington, DC

https://meetings.ausa.org/Annual/index.cfm

Aerospace Tech Week Americas

November 14-15, 2023

Atlanta, GA

https://www.aerospacetechweek.com/ americas/

VITA EDITORIAL DIRECTOR Jerry Gipper jerry.gipper@opensysmedia.com

GROUP EDITORIAL DIRECTOR John McHale john.mchale@opensysmedia.com

ASSISTANT MANAGING EDITOR Lisa Daigle lisa.daigle@opensysmedia.com

TECHNOLOGY EDITOR – WASHINGTON BUREAU Dan Taylor dan.taylor@opensysmedia.com

CREATIVE DIRECTOR Stephanie Sweet stephanie.sweet@opensysmedia.com

WEB DEVELOPER Paul Nelson paul.nelson@opensysmedia.com

EMAIL MARKETING SPECIALIST Drew Kaufman drew.kaufman@opensysmedia.com

WEBCAST MANAGER Marvin Augustyn marvin.augustyn@opensysmedia.com

SALES/MARKETING

DIRECTOR OF SALES Tom Varcie tom.varcie@opensysmedia.com (734) 748-9660

DIRECTOR OF MARKETING Eric Henry eric.henry@opensysmedia.com

OPERATIONS & AUDIENCE DEVELOPMENT (541) 760-5361

STRATEGIC ACCOUNT MANAGER Rebecca Barker rebecca.barker@opensysmedia.com (281) 724-8021

STRATEGIC ACCOUNT MANAGER Bill Barron bill.barron@opensysmedia.com (516) 376-9838

STRATEGIC ACCOUNT MANAGER Kathleen Wackowski kathleen.wackowski@opensysmedia.com (978) 888-7367

SOUTHERN CAL REGIONAL SALES MANAGER Len Pettek len.pettek@opensysmedia.com (805) 231-9582

DIRECTOR OF SALES ENABLEMENT Barbara Quinlan barbara.quinlan@opensysmedia.com AND PRODUCT MARKETING (480) 236-8818

INSIDE SALES Amy Russell amy.russell@opensysmedia.com

STRATEGIC ACCOUNT MANAGER Lesley Harmoning lesley.harmoning@opensysmedia.com

EUROPEAN ACCOUNT MANAGER Jill Thibert jill.thibert@opensysmedia.com

TAIWAN SALES ACCOUNT MANAGER Patty Wu patty.wu@opensysmedia.com

CHINA SALES ACCOUNT MANAGER Judy Wang judywang2000@vip.126.com

www.opensysmedia.com

PRESIDENT Patrick Hopper patrick.hopper@opensysmedia.com

EXECUTIVE VICE PRESIDENT John McHale john.mchale@opensysmedia.com

EXECUTIVE VICE PRESIDENT AND ECD BRAND DIRECTOR Rich Nass rich.nass@opensysmedia.com

ECD EDITOR-IN-CHIEF Brandon Lewis brandon.lewis@opensysmedia.com

TECHNOLOGY EDITOR Curt Schwaderer curt.schwaderer@opensysmedia.com

ASSOCIATE EDITOR Tiera Oliver tiera.oliver@opensysmedia.com

ASSISTANT EDITOR Taryn Engmark taryn.engmark@opensysmedia.com

PRODUCTION EDITOR Chad Cox chad.cox@opensysmedia.com

CREATIVE PROJECTS Chris Rassiccia chris.rassiccia@opensysmedia.com

GRAPHIC DESIGNER Kaitlyn Bellerson kaitlyn.bellerson@opensysmedia.com

FINANCIAL ASSISTANT Emily Verhoeks emily.verhoeks@opensysmedia.com

SUBSCRIPTION

CORPORATE

subscriptions@opensysmedia.com

REPRINTS

NO ONE POWERS THE ARMY LIKE BEHLMAN

FIRST UNIVERSAL POWER SUPPLY FOR ALL ARMY CMFF APPLICATIONS

Introducing the VPXtra® 400DW-IQI, Behlman’s first power supply with a wide range DC input that is fully compliant for all platforms in the Army CMFF program. This rugged, highly reliable switch mode 3U VPX unit meets a new standard of adaptability, and is backed by unmatched integration support from the Behlman team.

> Developed in alignment with the SOSA™ Technical Standard and VITA 62.0

> Delivers over 400 watts of DC power via two outputs

> 90% typical efficiency

> Features cutting-edge Tier 3 software

> System management integration via VITA 46.11 compatible IPMC

The Power Solutions Provider

400DW-IQI

the cover

The VITA Technologies 2023 Resource Guide features technologies and products based on VITA standards, including those in the FMC, OpenVPX, PMC/XMC, and VPX categories.

Featured on the cover: VITA Editorial Director Jerry Gipper takes an AI chat engine for a spin on the topics of critical embedded computing, open standards, and the impact and future of VITA standards on embedded computing.

By Jerry Gipper, Editorial Director

After a three-year hiatus, we were finally able to hold an in­person Embedded Tech Trends! It was wonderful to see everyone in the flesh, and to enjoy a good conversation and a meal in a restaurant. We had a full house with 15 sponsors and 15 members of the industry media in attendance. The energy at the event, when it is held inperson, is impossible to emulate in a virtual environment. The exchanging of ideas and networking was great to see. I enjoyed the presentations, despite spending over 40 years in this industry, and I always learn something new. A full summary of the event is included in this edition of VITA Technologies. The presentations and videos have been posted at www.embeddedtechtrends.com. We are already deep into planning for next year’s event, to be held January 22 and 23 at a warm location that we hope to announce soon.

VITA membership ended 2022 with 29 new members and the new ­ member pace remains high with seven new members since the start of this year. Most of the new members are in the defense and aerospace industry, with several from the space industry. We look forward to their contributions. The standards arm of VITA is busier than ever with several exciting new projects just getting started. The demand for open standards for the intelligent and critical embedded computing industry has never been higher. Check out the Standards Update column on page 6 for a summary of the most recent activities. VITA members can get full working group reports on the VITA website.

In this issue, I test the world of artificial intelligence (AI) with a chat with a bot (see page 8). I asked it several questions about our industry, open standards, and VITA’s role in the development of those

standards. The answers were interesting and surprisingly accurate. The impact of AI on the development of standards is sure to be great, but the contributions of humans will remain critical. I am hoping that AI will help us develop better tools to verify, test, and implement future standards development. The VITA staff is always on the lookout for tools and methods that will improve our processes. New tools for modeling and verification are on the agenda for the May VITA Standards Organization (VSO) meeting. It is expected that a study group will be launched to further study the requirements and possible solutions. The complexity of many of the standards is making it necessary to get to the next level using some kind of automation and assistance from artificial intelligence.

VITA has recently published two market reports: The first is analyst Brian Arbuckle’s quarterly “VITA Market Developments” (https://www.vita.com/VITA_Market_Development) report, focusing on the VITA members and new products. The second is Ray Alderman’s first-half report, “2023 State of the VITA Technology Industry” (www.vita.com/ VITA_Technology_Industry) in which he delves into economic and technology issues at a macro level. Both reports have interesting perspectives as we navigate through the current global challenges. I am also working with Brian to develop our next indepth industry survey to scope the size of the VITA technologies market. We hope to begin collecting responses this summer in preparation for the release of a report this fall. Gathering data is a challenge in this market, so we have developed a new survey that we hope can get us more information from a broader spectrum of contributors.

I’m off to Seattle to visit our boat builder. My wife and I hope to start our adventure on the Great Loop waterways this coming winter. The dream is coming closer to reality as the boat nears completion. We have a lot of work ahead as we learn about the boat, the Great Loop, and living aboard!

Stay healthy, stay safe.

VITA Standards Update

By Jerry Gipper

jerry.gipper@opensysmedia.com

VITA standards activity updates

Note: This update is based on the results of the May 2023 VITA Standards Organization (VSO) meeting, held in Atlanta and hosted by GTRI. Contact VITA if you are interested in participating in any of these working groups. The full reports can be accessed at www.vita.com/StandardsUpdates. Visit the VITA website (http://www.vita.com) for details on upcoming VITA meetings.

ANSI accreditation

Accredited as an American National Standards Institute (ANSI) developer, VITA provides its members with the ability to develop and promote open technology standards.

The following standards have recently been ANSI­ and VITAapproved via public VITA consensus ballot:

› ANSI/VITA 48.4-2022, Mechanical Standard for VPX REDI Liquid Flow Through Cooling (revision)

› ANSI/VITA 48.8-2022, Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.0” to 1.5” Pitches (revision)

› ANSI/VITA 62.1-2023, Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Standard (new standard)

› ANSI/VITA 66.5-2022, Optical Interconnect on VPX –Hybrid Variants (new standard)

› ANSI/VITA 67.3-2022, Coaxial Interconnect on VPX –Spring-Loaded Contact on Backplane (revision)

All published standards are available for download by VITA members and are posted at the online VITA Store for purchase by nonmembers.

VSO study and working group activities

Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, while a working group requires sponsorship of at least three VITA members. Several working groups have current projects underway. Here’s a roundup of these projects:

Draft/VITA 46.0-2019 Revision: VPX Baseline

Abstract: This standard describes VITA 46.0 VPX Baseline Standard: an evolutionary step forward for the provision of high­speed interconnects in harsh­environment applications. This revision supports compliance requirements of higher­level open system standards, adds guide socket/pin rotations for additional power-supply configurations, and provides further clarifications to power wafer current ratings.

Status: The working group made updates for compliance requirements and support for 12 V power. The revised draft is in public ballot.

Draft/VITA 46.31: Higher Data Rate VPX –Solder Tail in Blind Via

Abstract: This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud, for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher­data­rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

Status: VITA 46.31 is approved for VITA Standard Draft Trial Use available to VITA members and is available at the VITA online store. The plan is to complete the ANSI process and release once further connector qualification testing is completed.

ANSI/VITA 48.x: VPX REDI: Cooling

Abstract: The VITA 48 standards provide an overview of the associated plug­in units for air cooling, conduction cooling, and liquid-flow-thru (LFT) and spray-cooling applications.

Status: Several of the standards in this series are being updated to allow for a 100­mm­deep, 1.2­inch­pitch VPX module, or other updates. The working group has completed the public consensus ballot and has submitted document for final ANSI/VITA approval.

VITA 51.4: Reliability Component Derating

Abstract: The goal of this working group is to develop a new component derating standard.

Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE­2818. The working group is preparing for public consensus ballot. The working group is developing a draft document that is in review.

VITA 65.x: OpenVPX System Standard

Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses plug­in module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of slot, backplane, module, and standard development chassis profiles. This revision adds additional profiles, additional communication protocols, higher­speed copper connectors, and a new naming methodology for module profiles.

Status: The working group is adding additional profiles to this standard.

ANSI/VITA 67.3-2020: VPX: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

Abstract: The VITA 67.3 standard defines an open standard for configuration and interconnect (within the structure of VITA 67.0) enabling an interface compatible with VITA 46 containing multiposition blind­mate analog connectors with coaxial contacts, having fixed contacts on the plug-in module and spring action on the backplane.

Status: The standard is open for revision.

VITA 68.3: Reference SI Model Standard for Gen 4 and Higher Speeds

Abstract : This standard documents a reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10.3125 Gbaud. It defines reference OpenVPX Plug­In Module and backplane s­parameter models that can be used to create end­end OpenVPX reference channels in conjunction with reference VPX connector and device s ­ parameter models. Signal Integrity compliance for an OpenVPX Plug­In Module or backplane is based on simulation of end­end channel compliance against the requirements of the applicable protocol standard.

Status: The working group is addressing signal integrity compliance for Gen4 and higher speeds for VPX.

Draft/VITA 78.0-2022 Revision: SpaceVPX System

Abstract: This document describes an open standard for creating high­performance fault­tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.

Status: The working group is evaluating options to support for SpaceFibre, updates for PCIe and system management, and aligning with requirements from the Space Power Consortium.

Draft/VITA 86-2019 Revision:

High Voltage Input Sealed Connector Power Supply

Abstract: This standard defines an environmentally sealed connector pair which is compatible with the backplane footprint as defined in VITA 62.0 for 3U power supplies operating in harsh environments operating off of a high­voltage input.

Status: The working group was launched in March and is developing a draft document.

Draft/VITA 87: MT Circular Connectors – Type 1

Abstract: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL­STD­38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.

Status: The working group is reviewing a draft document.

Draft/VITA 89: MT Circular Connectors – Type 2

Abstract: The VITA 89 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL­STD­38999. MT offer options for 48 fibers per MT and for physical contact or lensed MT.

Status: The working group is reviewing a draft document.

Draft/VITA 90.x: VNX+

Abstract: Standards for an enhanced small­form­factor system that meets the growing needs of improved size, weight, and power (SWaP) with a rugged, low­cost, fast serial fabric interconnect­based plug­in module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework.

Status: New working group formed to make revisions to VNX under VNX+.

Draft/VITA 91: Connector for Higher Density VITA 46 Applications

Abstract: This standard defines a connector system that provides higher pin density to the backplane for VITA 46 3U and 6U VPX applications.

Status: VITA working group to develop a new standard for higher pin density for VPX. Working group is reviewing draft.

Draft/VITA 92: High Performance Cable –

Ruggedized 10 Gbaud Bulkhead High Speed, D- Sub, Rectangular Connector for Copper Cables

Abstract: This standard defines a rugged standardized 10 Gbaud interconnect system with a high pin count and high­density, lightweight, rectangular connector (meets MIL­DTL­24308 physical envelope) for I/O. It can support multiple high­bandwidth protocols and power while optimizing SWaP benefits in smaller systems with limited panel space availability.

Status: VITA working group to develop a new standard and is developing a draft.

Draft/VITA 93: Small Form Factor Mezzanine

Abstract: This standard defines a Small Form Factor mezzanine (SFFm) that is significantly smaller than XMC with host and I/O interface connectors. The host interface supports modern high­speed serial fabrics. The I/O interface supports either front­panel or backplane I/O. Multiple SFFm modules can be installed on various carrier­card form factors including 3U/6U Eurocards (VPX, cPCI, VME, etc.), VNX+, PCIe expansion cards, and others. It is suitable for deployment in commercial, industrial, space, or military­grade rugged environments with air­cooled or conduction­cooled formats.

Status: VITA working group to develop a new standard for a small-form-factor mezzanine. Working group is developing a draft.

For a complete list of VITA standards available for purchase and their status, go to www.vita.com/Standards.

Defining Standards

By Jerry Gipper

VITA standards: An editor’s chat with AI

Artificial intelligence (AI) is a hot topic these days. It has evolved to the next level of gaining the ability to carry on an intelligent conversation. It will not be long before it becomes a key tool in our lives. I thought I would give it a try and see what it understands about VITA technologies and the impact they have on intelligent and critical embedded computing. The answers provided actually were quite accurate; it warms my heart that AI was able to craft such good and accurate responses.

The following is my interview with the YouChat bot at You.com.

What is intelligent and critical embedded computing?

Intelligent and critical embedded computing refers to the design, development, and deployment of computing systems that are capable of processing and analyzing data in real time, and that are critical to the overall operation of a larger system. These systems are commonly used in applications such as aerospace and defense, transportation, and industrial automation, where there is a high degree of complexity and reliability required. They typically involve multiple hardware and software components working together to provide a sophisticated level of functionality and performance, and often require the development of specialized standards and specifications to ensure interoperability and compatibility among different systems.

Why are open standards important to the computer industry?

Open standards are important to the computer industry for several reasons. Firstly, open standards promote interoperability between different systems and applications, allowing them to work seamlessly together. This can increase efficiency and reduce costs for businesses and consumers. Secondly, open standards stimulate innovation by allowing developers to build upon and improve existing technologies, which can lead to new products and services. Thirdly, open standards promote fairness and competition by preventing any one company from monopolizing a particular technology or market. This creates a level playing field for businesses of all sizes and allows for greater consumer choice. Furthermore, open standards can make systems and applications more secure and reliable by allowing for peer review and collaborative development. Lastly, open standards can be more accessible to underprivileged communities and governments, allowing them to benefit from the latest technology advances and improve their economic and social development. Overall, open standards are important for fostering innovation, fair competition, efficiency, and accessibility in the computer industry.

What is the VITA Standards Organization?

The VITA Standards Organization is an industry trade group that develops open, widely adopted standards for embedded computing systems for both commercial and defense applications. The group is made up of vendors, integrators, and end users who collaborate on the development of standards that help promote interoperability and reduce costs in the industry. The organization has developed many popular standards, including VITA 46 (VPX), VITA 48 (VPX REDI), VITA 57 (FMC), and VITA 65 (OpenVPX). VITA standards are used by many industries, including aerospace, defense, telecommunications, and medical electronics, among others.

What is the process used by the VITA standards organization to develop standards?

The VITA Standards Organization develops open, widely adopted standards for embedded computing systems through a collaborative process involving its members.

VITA standards are developed by VITA members, who are industry experts from various organizations including defense contractors, electronics manufacturers, and government agencies. The members meet regularly to discuss, plan, and develop standards that support their interests and address emerging technology trends. The process starts with identifying a need for a new standard or the need to update an existing standard.

The relevant technical subcommittee within the organization then crafts a draft of the standard, which is subject to review and comment by all members. After the draft is revised based on the comments received, the final standard is balloted for approval by the membership. Once it is approved, the standard is published, and VITA members can implement it in their products. The organization also conducts interoperability testing to ensure compliance with the standard and to ensure that products from different vendors are capable of working together.

Overall, the development process ensures that VITA standards are robust, widely adopted, and responsive to the evolving needs of the industry. The standards development process is transparent, and outsiders can participate as observers or join as members to contribute to the development process. Once the standards are released, VITA members can implement them in their products, enabling interoperability and interchangeability between different components and systems.

What are the most popular VITA standards?

The most popular VITA standards depend on the application and industry, but some of the widely used standards are VITA 46 (also known as VPX), VITA 48 (also known as VPX REDI), and VITA 57 (also known as FMC or FPGA Mezzanine Card). VITA 46 defines a highspeed switched fabric architecture for embedded computing systems, while VITA 48 defi nes the mechanical and thermal requirements for VPX modules. VITA 57 defines a small-form-factor mezzanine module and connector for FPGAs. Other popular VITA standards include VITA 65 (also known as Open­VPX), VITA 62 (power supply module), and VITA 71 (air transport rack form factor).

Why are VITA standards so popular?

VITA standards are popular because they provide a common framework for designing, developing, and implementing embedded computing systems. By using standard interfaces and architectures, developers and system integrators can easily combine off­the­shelf modules and components from multiple vendors to create complex systems that meet their specific application requirements. This interoperability also reduces development time and costs while increasing system reliability and maintainability. Additionally, VITA standards are developed by industry experts and are updated on a regular basis to keep pace with the latest technology advancements in the market.

What is the advantage of being an ANSI accredited standards development organization?

The advantage of being an ANSI (American National Standards Institute) accredited standards development organization is that it demonstrates a commitment to openness, transparency, and impartiality in the development of standards. ANSI provides a respected and recognized accreditation program that allows organizations to demonstrate their conformance to internationally recognized standards of development practice. Accreditation can also help organizations gain credibility and visibility

in the standards development community, which can lead to more opportunities for collaboration and networking. Additionally, ANSI membership provides access to a range of resources, including training, technical support, and advocacy on behalf of the organization’s interests.

What is the importance of patent ex-ante terms in the development of standards?

Ex­ante licensing terms of patents can be important in the development of standards as they can help prevent patent holders from later engaging in patent hold­up, where they extract higher royalties for the use of their patented technology than they would have been able to before a standard was adopted. By disclosing licensing terms in advance, it enables other members of a standard-setting organization (SSO) to

Ready to report for MOSA & CMOSS Duty

From development to deployment: backplane includes slot profiles aligned to SOSATM 1.0 and CMOSS, and you get the latest in VITA 46.11 chassis management, air or conduction cooled guides, integration of wide range of ecosystem plug-in cards, and so much more from your reliable solution partner.

With you at every stage!

make informed decisions about which patented technologies to include in the standard. This can promote competition, reduce transaction costs, and lead to more efficient development and adoption of standards. Furthermore, patent ex-ante terms can help ensure that a fair, reasonable, and nondiscriminatory (FRAND) system of licensing is established, which can benefit all parties involved in the development and use of new technologies.

Can artificial intelligence file a U.S. patent?

As of now, artificial intelligence cannot be listed as an inventor on a United States patent. A federal appeals court in the U.S. has ruled that only natural persons, i.e., human beings, can be named as inventors on a U.S. patent. However, AI technology can still be used in the patent application process to assist human inventors and reduce the time and effort required to complete a patent application. The United States Patent and Trademark Office (USPTO) is actively exploring the use of AI in the patent application process and seeking feedback on the topic through public comments.

When will we see AI used to create open standards for the embedded computer industry?

I couldn’t find any specific information on when we might see AI used to create open standards for the embedded computer industry. While AI is increasingly being used in various industries and applications, the development of open standards for computing systems typically involves a collaborative effort among human experts in the field. However, it’s possible that AI could be used to assist human experts in developing and testing open standards, potentially leading to more efficient and effective processes for standardization in the future.

What are some of the major accomplishments of the VITA Standards Organization?

Some of the major accomplishments of the VITA Standards Organization include the development of a wide range of technical standards and specifications for critical embedded computing systems, including the widely used VME64 and VPX standards. VITA has also been involved in the development of standards for other technologies, such as XMC and PMC mezzanine cards, and has worked closely with other industry organizations to promote interoperability and compatibility among different computing systems. Additionally, VITA has been actively involved in promoting the adoption of open standards and has worked to ensure that its standards are welldocumented, thoroughly tested, and fully supported by the industry.

How do I join the VITA Standards Organization?

To join the VITA Standards Organization, you can visit their website at www.vita.com/ join/, select the membership level that best fits your organization, and follow the instructions for submitting an application and paying the membership fee. There are different membership levels available, ranging from individual membership to full corporate membership, each with different benefits and fees. On the website, you can also find more information about the organization and its activities, as well as the standards and specifications that have been developed by VITA.

What is the impact and future of VITA Standards in embedded computing?

The VMEbus International Trade Association (VITA) is a nonprofit organization dedicated to developing open standards for the embedded computing industry. VITA standards define the electrical and mechanical specifications for various form factors and interconnects used in the design of embedded systems. The VITA standards cover a wide range of technologies, such as VPX, VME, and PMC, and are widely used in government, defense, and commercial applications. The adoption of VITA standards has been critical to the success of the embedded computing industry, enabling greater modularity, interoperability, and connectivity between embedded systems.

WHILE AI IS INCREASINGLY BEING USED IN VARIOUS INDUSTRIES AND APPLICATIONS, THE DEVELOPMENT OF OPEN STANDARDS FOR COMPUTING SYSTEMS TYPICALLY INVOLVES A COLLABORATIVE EFFORT AMONG HUMAN EXPERTS IN THE FIELD. HOWEVER, IT’S POSSIBLE THAT AI COULD BE USED TO ASSIST HUMAN EXPERTS IN DEVELOPING AND TESTING OPEN STANDARDS, POTENTIALLY LEADING TO MORE EFFICIENT AND EFFECTIVE PROCESSES FOR STANDARDIZATION IN THE FUTURE.

The impact of VITA standards in embedded computing has been vast, with the most significant being the establishment of the VMEbus architecture. The VMEbus became the most widely adopted embedded system architecture due to its modular design, industry­standard connectors, and scalability. VMEbus has been integrated into many different systems, from automotive to aerospace, to national defense applications.

One of the most recent and significant VITA contributions is the OpenVPX standard. OpenVPX was created to address some of the limitations of VMEbus, such as limited bandwidth and processing power. OpenVPX is scalable, modular, and high ­ performance, enabling designers to create advanced embedded systems that were once unattainable.

The future of VITA standards in embedded computing looks bright, with the continuation of VITA initiatives, including the support for the development of open standards such as the Sensor

Open Systems Architecture (SOSA) and the OpenVPX standard. These initiatives aim to enhance the interoperability and modularity of embedded systems, thereby making them easier to design, develop, test, maintain, and upgrade.

In the future, VITA standards will continue to be instrumental in furthering the embedded computing industry. The modularity and scalability of VITA standards enable designers to leverage the latest technological advances and make it easier to upgrade systems in the future. For example, VITA has recently started work on developing a standard for graphics processors and computers on modules. These standards will enable better integration of advanced graphics technologies into embedded systems, expanding the use cases for these systems from automotive to gaming and everything in between.

VITA standards may also play a crucial role in the adoption of emerging technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT) in embedded systems. The IoT relies on the interconnectivity of devices and systems, which VITA standards have already addressed. AI and ML require high processing power and advanced processing capabilities that are not possible with the current generation of embedded systems.

As these technologies become more prevalent, VITA standards will help to provide a common interface that allows different systems to communicate, thereby enhancing the connectivity and interoperability of embedded systems.

Moreover, VITA standards can help to address the growing concern over the security and safety of embedded systems. The standards promote the development of secure and reliable systems by defining robust hardware and software interfaces and by providing guidelines for system design and testing. As the number and complexity of security threats increase, adherence to VITA standards will become more critical to ensure the integrity and resilience of embedded systems.

VITA standards will pave the way for the creation of embedded systems that can handle the demands of these advanced technologies through the expansion of current VITA standards and the development of new ones.

In conclusion, VITA standards have a bright future in embedded computing, as they continue to provide a common interface that allows different systems to communicate, enhance the interoperability and modularity of embedded systems, and promote secure and reliable system design. Adherence to VITA standards will be critical in ensuring the continued success of the embedded computing industry and the adoption of emerging technologies.

Dawn Powers VPX

Dawn’s PSC-6238 VITA 62 compliant 3U VPX Power Supply for conduction cooled systems is designed to operate in a military environment over a wide range of temperatures at high power levels. Up to 800 Watts available power.

Dawn is the leader in VITA 62 compliant power supplies for the mission critical market. Wide range of standard features, highly configurable through custom firmware.

(510) 657-4444

dawnvme.com

Onboard embedded RuSH™ technology. Switchable Battleshort and NED functions.

Embedded Tech Trends 2023 Wrapup

By Jerry Gipper, Editorial Director

In January, Embedded Tech Trends 2023 was held in Chandler, Arizona at the Crowne Plaza San Marcos. After missing the past two years due to the pandemic, it felt great to be meeting in person again!

The theme for 2023 was “Livin’ la Vida MOSA!” The presenters were encouraged to weave the theme of modular open system architectures into their presentations.

Embedded Tech Trends is a small, but extremely effective forum where suppliers of components, boards, and system-level solutions can meet exclusively with members of relevant industry media to discuss technologies, trends, and products.

The following is synopsis of the presentations at this year’s event:

Upside, Inside Out, Researchin’ the VITA MOSA!

By Brian Arbuckle, Analyst, Embedded Market Research

Brian started off the event by reviewing highlights from market research he recently conducted for VITA. VITA publishes quarterly reports reviewing activity from financial performance to new products, contracts, and mergers in the VITA technology market. An annual report goes deeper into revenue estimates of VITA technology suppliers forecasting market sizes and shares across the various VITA technologies. Brian closed

with a timeline of research planned for 2023. (www.vita.com/MarketData)

Connectivity Trends in the Data Center

By Bob Hult, Director of Product Technology, Bishop & Associates Inc.

High performance demands in data centers drive new solutions in connectivity. Challenges faced in commercial data centers tend to be the same as those using VITA technology. Increased capacity, faster switching speeds, reduced latency, reduced power, and reduced cost are but a few challenges.

Bob reviewed these challenges and various solutions used to address them.

100G VPX Optimization and Interoperability

By Ivan Straznicky, Technical Fellow, Curtiss-Wright Defense Solutions

The road to higher data path performance for VPX is bumpy. Ivan discussed how we got to today’s level of performance and how we might get to the next step. In 2018, Curtiss­Wright presented simulation results showing that 100 Gbaud transmission (at 25 Gbaud per lane speed) was possible

Billy Rhea, Sr. Product Manager, AirBorn, took the Embedded Tech Trends audience through a detailed analysis of what makes a connector truly “rugged.” Photo courtesy Jerry Gipper.

with VPX using existing and recently announced copper connectors. This was at a time when it was thought by some that optical interconnects were required for these speeds. Now that it has been shown conclusively that 100G VPX over copper is here to stay, the focus has shifted to interoperability and optimization. Interoperability can be demonstrated using the emerging VITA 68.3 Reference SI Model Standard for Gen4 and Higher Speeds draft standard. Much of this work has been done using 3D electromagnetic simulations; however, test results show the simulations are accurate. This rigorous and detailed approach provides a template for ensuring open architectures and reliable operation of 100G systems for customers and suppliers alike.

Versatility through FMC+

By Patrick Mechin, CEO, TECHWAY Signal Vision System

The FMC+ (VITA 57.4) standard offers a broad ecosystem to provide access to easy flexibility for high-end applications. Thanks to connectors and COTS cards,

Patrick demonstrated how to leverage the VITA 57.4 FMC+ standard to provide highend solutions to industrial markets by pairing up PCIe FPGA platforms with FMC+.

Chronicles From the Book of MOSA: The Journey Continues

By

Ken Grob, Director, Elma Electronic

Ken chronicled the evolution of modular open standards based on personal experiences. Ken participates in many of the active MOSA [modular open systems approach] initiatives, so his firsthand experience provides unique insight into what it takes to develop and implement a modular open system. His position gives him a multiperspective view of the challenges that very few people in this industry have available to them.

High-Performance I/O Connectivity for Next-Gen Embedded Applications

By Matthew Burns, Technical Marketing Manager, Samtec, Inc.

Embedded compute engines including CPUs, GPUs, SoCs, and FPGAs feature the latest high­performance I/O connectivity. Copper­based interconnect solutions are typically used to route high­performance I/O connectivity from IC­to­IC or PCB­to­PCB. However, as system data rates and I/O counts increase, new and emerging embedded system architectures will leverage optical connectivity for routing data system to system. Matt summarized the technical advantages and benefits of on-board optical transceivers for the next generation of commercial and rugged embedded applications.

High-Density, Rugged Connectors: Smaller Doesn’t Mean Less

By Billy Rhea, Sr. Product Manager, AirBorn

The term “rugged and reliable” is a common phrase used in countless marketing pieces within the electronic component industry. That distinction is also applied specifically to connectors, one of the core components of many electronic systems. Because no easily referenced grading system exists to distinguish truly rugged and reliable connectors from commercial­grade connectors only claiming to be, engineers must see through the marketing hype to determine a connector’s true nature. Billy provided a detailed analysis of what it takes to classify a connector as truly rugged.

Dreams to Reality

By Nigel Forrester, Director of Strategy, Concurrent Technologies

A lot of progress has been made since the last Embedded Tech Trends to deliver MOSA solutions based on 3U VPX plug­in cards. Nigel examined a few of the key technological advancements and showed how they have enabled complex solutions to be constructed much more speedily.

Advancing SpaceVPX Interoperability

By Wesley Powell, Technical Lead, NASA Space Technology Mission Directorate (STMD)

As NASA exploration moves beyond low­Earth orbit (LEO), the need for interoperable avionics systems becomes more important due to the cost, complexity, and the need to maintain distant systems for long durations. The existing SpaceVPX standard, as specified in VITA 78, addresses some of the needs of the space avionics community but falls short of an interoperability standard that would enable reuse and common sparing on long duration missions and reduce NRE for missions in general.

Wesley reviewed a recent NASA study to assess SpaceVPX interoperability challenges and define a proposed solution. Using the NASA study recommendations as a starting point for discussion, NASA is engaging with the spaceflight avionics community to develop a SpaceVPX (VITA 78) ”dot spec” that enhances interoperability.

Rugged System Design Realization

By Bill Pilaud, Director of Systems Architecture, LCR Embedded Systems,

Inc.

The positive impact of MOSA initiatives is rippling across the embedded defense systems industry and the primary goal of reducing time to deployment for leading­edge

systems is becoming a reality. System development timelines are getting shorter as the principles of modularity, interoperability, interchangeability, and scalability are applied to system function. That success has had an impact on system and chassis hardware design. In order to keep up the pace with hotter payloads and shorter lead time expectations, system integrators and chassis designers are driving innovative design approaches in electronic packaging that meet these challenges. Bill discussed the challenges and presented examples of how to streamline the path to the deployed system.

MOSA, SOSA, and NO-SA: A Comparison of Chassis Platforms for MIL/Rugged Applications

By Justin Moll,

VP

Sales

and Marketing, Pixus Technologies Inc.

Common design challenges among MOSA, SOSA, and non­standard enclosures for mil/aero applications were discussed by Justin. Details of the different requirements in each environment for these enclosure classes were compared and design solutions to meet them were presented. The focus was on RF/optical implementations, cooling configurations, SWaP [size, weight, and power] requirements, and 100GbE/PCIe Gen4 backplane speed performance.

VPX Power: Present and Future

By Jerry Hovdestad, Director, AirBorn

Providing power to high-performance computing modules is defined in the VITA 62 Modular Power Supply standard. Recent updates added new configurations and extended the robustness of the standard. Jerry went through the changes made in the 2022 release that designers should be aware of for their future projects.

VNX+ At a Glance

By

Bill Ripley,

Business Development, Samtec, Inc.

Going faster with open standards means higher data rates, shorter design cycle times, and smaller architectures that feature improved performance and optimized SWaP-C [SWaP plus cost]. VNX+ (VITA 90.x) is the new and improved small­form­factor (SFF) draft standard with 4th­generation speeds, coaxial RF/video, and optical MT connectivity. VNX+ has been included in the new Sensor Open Systems Architecture (SOSA) Technical Standard. Bill detailed the standard’s new architecture, improved environmental specifications, and current and future functionality.

The Value of SOSA Beyond the U.S. Military

By Mark Littlefield, System Products Director, Elma Electronic

The work being done under the SOSA Consortium focuses on defense applications, but the improved integration capability of SOSA aligned products benefits many other

applications. Mark illustrated how integration capability is improved with the SOSA Technical Standard.

How High-Speed Video Is Unlocking Fast and Reliable Connectivity Solutions

By Michael Walmsley, Global Product Management,

TE Connectivity

Demand for higher­resolution imaging and processing with low latency is driving changes in the system design for video applications. Video protocols have evolved to support data rates in excess of 12 Gbaud, thus presenting new challenges. Mike reviewed new developments in interconnects that are addressing the need for higher bandwidth and meeting signal­integrity challenges at higher data rates, from box to box and within a chassis. Industry standards are playing a key role in capturing these interconnect solutions to assure interoperability and optimize implementation.

Direct RF Revolutionizes Military EW and Radar Systems

By Rodger

Hosking, Director of Sales, Mercury Systems

Advanced wideband data ­ converter technology supports direct sampling of wideband RF signals, thus disrupting traditional software radio architectures and yielding numerous benefits to virtually all high­performance military EW [electronic warfare], radar, and communications systems. Now capable of directly digitizing RF signals at 64 GS/sec, ADCs and DACs can now directly digitize and generate RF signals with bandwidths up to 30 GHz, thus eliminating complex and costly analog RF tuners and upconverters to cover many critical signal frequencies as high as K band. Additional benefits include reduced SWaP and cost per channel, both vitally important to highchannel count systems using phasedarray antennas. With faster interfaces to FPGAs, many of these devices also offer much lower latency, which is essential for the latest adaptive EW and radar systems. Rodger discussed benefits and tradeoffs of these new devices and how they drive software radio architectures towards higher performance with lower cost and complexity.

Rodger Hosking, Director, Mercury Systems, discussed direct RF’s role in high-performance EW and radar. Photo courtesy Jerry Gipper.

Optical communications: Use case – A new ODI solution

By Patrick Mechin, CEO, TECHWAY Signal Vision System

High­speed optical communications offer faster throughput and scalability to systems and hardware engineers looking for performance in their design. The Optical Data Interface (ODI) defined by the AXIe Consortium is one way to get high­speed, high­density solutions. Patrick illustrated how the ODI standard leverages three layers of technology, including the VITA 49 VITA Radio Link Layer (VRL) standard, to improve ODI solutions.

Enabling Space 2.0: Driving Affordability & Reliability in Space with Mil-Aero COTS

By Pratish Shah, General Manager, Aitech USA

Space electronics are evolving faster than ever. Common infrastructure, improved connectivity, reliable and integrated computing, and AI implementation are at the top of the list of challenges. Pratish launched into the challenges being addressed with next­generation space electronics and how the industry is responding.

OpenVPX Trends and Updates

By Greg Rocco, Member Technical Staff, MIT Lincoln Laboratory

OpenVPX is a living standard quickly adapting to the needs of the market. Greg Rocco is the father of OpenVPX (VITA 65). His open VPX tutorial is the beginning point for anyone new to the VPX concept and is a handy reference source for anyone designing with VPX. He reviewed the latest enhancements and changes to OpenVPX that will be in the 2023 release, now in its final approval stage.

NAVAIR Advances to HOST Standard

By LCDR Ryan Camasso and Sean McCormick, NAVAIR

The PMA ­ 209 Avionics Architecture team stepped through updates made to the HOST [Hardware Open Systems Technologies] standards. The HOST team leads the development and guides platform implementation of Open Architecture (OA) standards, processes, and best business

practices for NAVAIR, resulting in DoD hardware and software product lines that increase the portability of applications, reuse of components, and the ability to adapt to changing requirements at a faster rate. They are a key pillar in the SOSA Consortium.

All of these presentations, with video, are posted at www.EmbeddedTechTrends.com. It is highly recommended that you view the videos to get the maximum information.

Deployment system realization is the culmination of 3 top level activities:

• Lab development and integration

• Field test and demonstration

• Create deployable solution

LCR has the products and experience to ensure success every step of the way.

Optimizing 100G VPX

By Ivan Straznicky

At the 2018 Embedded Tech Trends conference, results were presented from early simulations that conclusively established 100 Gigabit Ethernet could be successfully implemented on VPX using existing and newly announced copper connect-ors. At that time, many in the industry thought that optical interconnects and fiber would be required to support 100 GbE speeds.

VPX began back in 2005 with a focus on protocols such as Serial RapidIO, which were operating around 2.5 to 3.1 Gbaud/sec per lane. As these protocols progressed with successive generations, and new protocols were considered and adopted, transmission speeds increased substantially. It wasn’t long before industry was designing Gen 3 VPX products at 8 Gbaud for PCI Express and 10 Gbaud for 40G Ethernet. Then along came higher­speed PCIe Gen 4 (16 Gbaud) and 100G Ethernet (25 Gbaud) and it became evident that the VPX transmission channel needed an upgrade. (Figure 1.)

One of the main elements of the transmission channel is the VPX connector, which is a key enabling technology for 100G systems. Although it was proven back in 2018 that 100G could be achieved using the first two generations of VPX connectors (known as RT2), the more recent VITA 46.30 Higher Data Rate VPX Standard – which supports data rates to at least 25 Gbaud per lane – enables more signal margin and supports larger systems. Currently, there are two options for VITA 46.30 connectors: the TE Connectivity RT3 and Amphenol R­VPX EVO2 connectors, both of which meet the ANSI/VITA 46.30 standard intended for 100G (4 lanes @ 25 Gbaud) systems, and potentially beyond.

One of the main tenets of VPX and OpenVPX is interoperability, and that concept extends to the signal integrity (SI) of the VPX channel. The VITA 68 (VPX Compliance Channel) series of

standards addresses the SI interoperability of OpenVPX modules and backplanes. The most recent addition to VITA 68 is VITA 68.3, which is intended for 16G (PCIe Gen 4) and 100G channels. At these speeds, each of the physical blocks that comprise the parts of the VPX transmission channel needs to be modeled in 3D using specialized tools such as Ansys HFSS, and then solved in the frequency domain to create so­called “s­parameter” characteristics. It is these s­parameters that get stitched together to form the channel model in VITA 68.3.

FIGURE 1 The VPX connector, a main element of the VPX transmission channel, is a key enabling technology for 100G systems.

The figure of merit for a good 100G channel is a calculation called channel operating margin (COM), which is a measure of the overall signal­to­noise ratio. The IEEE 802.3 Ethernet standard states that COM should be greater than 3 dB; however, that is for a measured physical channel. VITA 68.3 uses simulations rather than quantitative measurements, and data (measured vs. simulated) shows that 100G VPX performance needs to be greater than 3.5 dB in VITA 68.3 to provide a reliable signal channel.

As an example of how to use VITA 68.3, Curtiss­Wright has simulated 100G VPX Fabric100 modules at either end of the VPX channel – and using two VITA 68.3 cases (i.e., long lossy and med­long lossy) – resulting in a comfortable margin of at least 0.25 dB over the 3.5 dB requirement. In this scenario, the Fabric100 simulated modules are based on several worst­case assumptions, so results will only improve in many applications.

How close are the simulations to reality? Multiple rounds of testing prove that the products and channels will meet the COM target. The results of these tests are the base of the proposed 3.5 dB COM target for VITA 68.3.

For the warfighter, today’s technology is all about data-centricity, meaning they receive the relevant data they need when they need it to make superior decisions. In fact, 100G connectivity and digital convergence are enabling that kind of decisionmaking superiority through open standards like CMOSS [C5ISR/

MOSA Virtual Summit 2023

Powered by Military Embedded Systems

Today, the Modular Open Systems Approach (MOSA) for new program designs and refreshes is changing U.S. military acquisition and procurement strategies. MOSA initiatives like FACE, SOSA, CMOSS, and others are becoming system requirements across multiple domains – air, land, sea, space, and spectrum.

The MOSA Virtual Summit was designed to drive awareness and thought leadership around MOSA initiatives and aimed to study how they impact signal-processing, software, hardware, AI, and RF designs. (This is an archived event.)

Watch the webcast: https://bit.ly/45f6dy0

WATCH MORE WEBCASTS: https://militaryembedded.com/webcasts/

Electronic Warfare Modular Open Suite of Standards], SOSA [Sensor Open Systems Architecture], and VITA.

The VITA Standards Organization is already looking ahead to the next generations of VPX: Study groups are actively investigating what it will take to implement even higher speeds and bandwidths using protocols such as PCI Express 5.0, operating at 32 Gbaud, and 200G Ethernet, which complicates signal integrity with PAM4 (multibit) encoding. There is even discussion of going up to 400G Ethernet, increasing signal speeds up to 50 Gbaud.

With the Modular Open Systems Approach (MOSA) mandate now firmly entrenched in the defense-electronics industry, the VITA 68 signal integrity standards have paved, and will continue to pave, the path to high performance and true interoperability that MOSA delivers to the warfighter.

Ivan Straznicky is Technology Director, Curtiss-Wright. Ivan has been with CurtissWright for more than 23 years, having served as a Technical Fellow and in several engineering positions. Ivan holds a B.Eng. in mechanical engineering from McGill University in Montreal, Canada.

Curtiss-Wright Defense Solutions

https://www.curtisswrightds.com/

2023 RESOURCE GUIDE INDEX

High-speed communications interfaces – VITA 57.4 Optical FMC

New generations of FPGAs offer faster and denser serial links. We outperform speed and density challenges by designing optical interfaces dedicated to high-bandwidth data-communication. TECHWAY’s optical FMCs support advanced communications as required by the latest SoC/FPGA families. Our FMCs are 100% VITA 57.4 compliant to fit all carrier boards with FMC+ connectors. Our optical FMCs are ready-to-integrate solutions: no specific firmware is required, and multiple example designs are included in the development kit. Our FMCs can operate several different protocols concurrently thanks to an on-board programmable multi-clock generator. Available in industrial or rugged versions, our FMC product lines are based on two advanced optical technologies to meet multiple levels of ruggedization.

• Based on Samtec FireFly™ technology, TigerFMCs are dedicated to industrial environments. The new TigerFMC range provides 4 full duplex links @ 25 Gbps. Our roadmap plans a 12 full duplex links @ 25 Gbps optical FMC. TigerFMCs are proposed in standard or extended temperature ranges.

• Based on Radiall D-Lightsys® technology, WildcatFMCs are MIL-AERO oriented. Indeed, these cards are rugged to meet the toughest environmental constraints with dedicated packaging including metal-based connectors. These cards are designed for RADAR/SONAR, Electronic Warfare, Telecommunications, Avionics, Video broadcast and switching.

FEATURES

Ą High-speed: Up to 25 Gbps per link

Ą High-density: Up to 12 full duplex links

Ą Protocol agnostic: Support all communication protocols

Ą Multi-clock generator: Several protocols on one board at the same time

Ą Industrial range: Samtec FireFly™ technology

Ą Rugged range: Radiall D-Lightsys® technology

Ą Front or rear connection

Chassis Managers Optimized for VITA 65/SOSA™

The VITA 46.11-aligned WILD™ VPX Chassis Managers (WABGM0/2) enable critical chassis control, maintenance, and security functions, were developed in alignment with SOSA Technical Standard 1.0, and offer commercialoff-the-shelf (COTS) availability.

They are highly-integrated modules. They provide access to plug in card (PIC) JTAG and Maintenance ports, CLK1 usage via on-board Zynq FPGA, network functions, and some optional advanced security functions. For security, the Chassis Managers implement security signal interfaces and a Xilinx UltraScale+ Zynq MPSoC and latest Microsemi PolarFire FPGA, which can be end-user modified with the optional BSP.

FEATURES

Ą Capability: Provides control and access to Plug-In Card JTAG and Maintenance ports, CLK1 usage, network functions & optional advanced security functions

Ą FPGAs: Xilinx UltraScale+™ Zynq (ZU5EG or ZU11EG) & Microsemi PolarFire

Ą Mounting: Directly on backplane, or via 3U or 6U VPX plug-in carrier card

Ą Power: Only requires 3.3V

Ą Optional BSP: For customizing Zynq PS & PL for security

Ą Standards: VITA 46.11, SOSA 1.0 & MIL-STD-1553

Ą Availability: Commercial off-the-shelf

www.annapmicro.com/product-category/chassis-and-backplane-accessories/



Shown mounted to a 3U VPX Backplane

100GbE SOSA™ Aligned Development Kit

This next-generation 3U OpenVPX Benchtop Development Platform (WS3A01-S1) is both SOSA aligned and 100Gb Ethernet capable, and is designed from the ground up to economically speed development of EW applications that align with SOSA 1.0.

The stock Kit includes a 3U Chassis, Backplane, Chassis Manager, FPGA Board with Gen 3 RFSoC Mezz Card, 100GbE Switch, SBC, VITA blocks, and MIL-DTL-38999 cable.

Also Available: Larger & rugged versions

> WILD100 14-Slot 3U OpenVPX Chassis – WC31E0

> WILD100 8-Slot 3U OpenVPX ATR – WC3A80

OVERALL SYSTEM FEATURES

Ą Front-loading, air-cooled system with conduction-cooled boards

Ą Seven 3U OpenVPX slots with SOSA aligned backplane profiles

• One 14.6.11 Payload

• Three 14.6.11 Empty Payload (for expansion)

• One 14.2.16 I/O-intensive SBC

• One 14.4.14 100GbE Switch

• One VITA 62 Power Supply – 12V-Heavy

Ą 25 Gbps Line Rates on Data and Expansion Planes

• 25/40/100Gb Ethernet

• SDR/DDR/QDR/EDR InfiniBand

• Gen 3/4 PCI Express

• Custom protocols up to 25Gbps per lane

Ą VITA 66.5C and VITA 67.3C for payload slots

Ą Four MIL-DTL-38999 SOSA aligned circular connectors with 19 RF connections

Ą One MIL-DTL-38999 Cable

Ą Multiple levels of hardware and software security

CHASSIS MANAGER

Ą SOSA aligned and VITA 46.11 compliant

Ą Enables control, maintenance, and security functions

Ą One Xilinx® Zynq® UltraScale+™ MPSoC (ZU5EG or ZU11EG) & Microsemi PolarFire

Ą Supports MIL-STD-1553

100Gb ETHERNET SWITCH

Ą 40/100Gb Ethernet Data Plane Switch

• 6.4Tb/s switching capacity

• Industry-leading, true cut through latency

Ą 1/10/25/40/100Gb Ethernet Control Plane Switch

• Layer-2 Wire-Speed Switching Engine

Ą Two Xilinx Zynq UltraScale+ MPSoCs (XCZU5EG)

FPGA PROCESSOR + RFSoC I/O CARD

Ą One Xilinx Virtex® UltraScale+ FPGA (XCVU7P)

Ą One Xilinx Zynq UltraScale+ MPSoC (XCZU7EV)

Ą One Xilinx Zynq UltraScale+ Gen 3 RFSoC (ZU47DR)

Ą ADC: 4 Channel, 5.0+GSps Sample Rate, 14 bit Resolution

Ą DAC: 4 Channel, 10.0+GSps Sample Rate, 14 bit Resolution

Ą Also Available: Swap in our DME1 Card, with 64.0 GSps, 10 bit ADC/DAC capability

SINGLE BOARD COMPUTER (SBC)

Ą Intel® Xeon® D-1559

Ą 32G DRAM

Ą 60GB M.2 SSD/Linux – Standard

APPLICATION DEVELOPMENT

Ą Standard support delivered with all systems

Ą Optional full Board Support Package

• Enables customization of Zynq PS and PL for security

• Provides fast and robust HDL-based environment For a virtual or in-person Demo, contact us.

& 6U 100GbE FPGA Boards are SOSA™ Aligned

Annapolis WILDSTAR™ Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100Gb Ethernet over copper on the VPX backplane. Blind mate optical and/or RF (VITA 66/67) is also available. All 100GbE boards are VITA 65-compliant and align with SOSA Technical Standard 1.0.

High Performance

These high-performance boards integrate the latest AMD Xilinx Versal, UltraScale+, Gen 3 RFSoCs, or Intel Agilex FPGAs. They enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. High-performance digitization is via Mezzanine Card(s) connected to FMC+ based I/O site(s), or included in the FPGA. Gen 3 delivers 8 channels of ADC, 5.0+ GS/s, at 14 bit resolution, and 8 channels of DAC, 10.0+ GS/s, at 14 bit resolution. Our new DME1 Mezz Card delivers an impressive 64.0 GS/s, 10-bit ADC and DAC performance.

Rugged

Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high performance air, conduction, or air-flow-through cooling for thermal control.

Designed & Manufactured in USA

All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.

Ą General Features

• Up to three Xilinx or Intel FPGAs

• A Full Board Support Package for fast and easy Application Development –BSP options include 40/100GbE IP and both VxWorks 7 and Linux support

• Multiple levels of hardware and software security

Ą Front Panel and/or Backplane I/O

• Based on FMC+

• Available options:

� Analog Devices MXFE: 2TX (12GSps)/4RX (6GSps)

� Analog Devices MXFE: 1TX (12GSps)/8RX (4GSps)

� Jariet Electra-MA: 2TX (64GSps)/2RX (64GSps)

� Xilinx RFSoC: 2TX (5GSps)/8RX (5GSps)

� Xilinx RFSoC: 4TX (5GSps)/4RX (5GSps)

� Others covered under NDA

Ą Mechanical and Environmental

• Air, conduction, or AFT cooled: -55°C to +85°C Operating

• Available in extended temperature grades

• Optional blind mate optical and/or RF (VITA 66/67)

• Hot swappable for air-cooled variants

• RTM available for additional I/O

WILDSTAR Boards are cooled via Air, Conduction, or

WILDSTAR Boards integrate the latest FPGAs – Versal, Gen3 RFSoC, and Agilex www.annapmicro.com/product-category/fpga-boards-2/

3U

Card Combines High Rates & Wide Coverage

The WILD FMC+ DME1 Card is the first COTS card with 64 GS/s, 10-bit ADC and DAC capability. It is targeted at demanding applications requiring direct sampling frequency coverage from VHF through Ka-band, and/or wide instantaneous bandwidths.

The breakthrough direct sampling Jariet transceiver performs frequency conversion and filtering in the digital domain, eliminating the need for costly analog frequency conversion.

The card has a usable analog bandwidth of 36 GHz and a maximum instantaneous bandwidth of 6.4 GHz on both channels simultaneously. All transceiver channels feature onboard digital downconverters (DDCs) and digital upconverters (DUCs), including sub-band channelizers for dynamic frequency selection.

In development are two additional products that also deliver sample rates of 64 GSps at 10-bit resolution:

• WILDSTAR 3AE1 – a 3U OpenVPX Baseboard

• WILDSTAR SAF1 (below) – a standalone Small Form Factor Module

FEATURES

Ą General Features

• ADC: 2 Channel, 40-64 GS/s, 10 bit Resolution

• DAC: 2 Channel, 40-64 GS/s, 10 bit Resolution

• Usable Analog Bandwidth: 36GHz

• Maximum Instantaneous Bandwidth: 6.4GHz

• Run Time Selectable ADC Decimation: 8-1024x

• Adjustable attenuation: 0-31.5dB

• Supports JESD204B/C interface with 16 lanes up to 30Gbps (dependent on mode configuration)

• Firmware and Software for four channel data transmit interface and clock trigger synchronization provided in CoreFire Next and VHDL source

Ą Software-Selectable ADC/DAC Clock Source

• External Divide by 16 Reference Clock

• External Divide by 16 Reference Clock + 2x Divide by 2 Clocks

• Internal PLL with Run Time Selectable Reference Source

Ą Nine 50Ω RF Connectors

• Two Analog ADC Inputs

• Two Analog DAC Outputs

• One External Sample Clock Divide by 16 Input

• One Optional External PLL Reference Input

• Two Optional External Sample Clock Divide By 2 Inputs

• One Optional High Precision Trigger Input. Options:

°

°

° 3.3V LVCMOS

Ą Mechanical & Environmental

• Air, Conduction, or Air-Flow-Through cooled

• Developed in alignment with SOSA™ 1.0

www.annapmicro.com/products/wild-fmc-dme1/

COTS Rugged Chassis/Enclosures

Imagine a single source for your electronic packaging requirements, from components to assemblies to fully integrated systems.

With 50+ years of experience providing highly reliable computing enclosures, Atrenne is the partner of choice for mission-critical and performance-critical applications. Our deep expertise in addressing mechanical design, thermal management, signal integrity, rugged system design, and a wide variety of standard form factors enables our customers to meet the most stringent application requirements with lower technical and business risk.

Atrenne, A Celestica Company offers a wide range of COTSenabled enclosures including rackmount, ATR, small form factor, and the industry's widest selection of VPX and VME lab development chassis and standard backplanes.

Our military enclosures support standard 3U and 6U modules for SOSA1.0, OpenVPX/VPX/VPX-REDI, VME/VME64x/VXS, CompactPCI, and small form factors. We have vast experience designing backplanes and enclosures for qualification under MIL standards including MIL-STD-461, MIL-STD-704, MIL-STD-1275, MIL-STD-810, MIL-S-901, RTCA/DO-160 and many others.

FEATURES

Ą ATR, Rackmount, Small Form Factor, and Lab Development Chassis/Backplanes

Ą SOSA 1.0, VPX /OpenVPX, VXS, VME64x, VME, CompactPCI and other embedded form factors

Ą 100s of backplane configurations including pass-through backplanes ready for cabling to central switched, distributed, daisy chain and many other topologies

Ą Wide range of thermal options available including, air cooled, conduction cooled and liquid cooled

DEV-4200 3U OpenVPX up to 8-slot Development System

Available for convection and conduction cooled boards. OpenVPX 3U up to 8 slot development system. Specifically supports OpenVPX and VPX REDI 3U boards and modules. Portable, attractive and travels well. Up to 8-Slots of OpenVPX on 1" pitch with or without RTM connectors.

Available with any backplane topology. OpenVPX Development System for 3U Modules. 3U version of our most popular 6U Development System. Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers.

Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1.08 of Vita65. Provides up to an 8-slot system for 3U convection cooled boards and 3U transition modules on 1.0 inch pitch. RuSH controlled power and cooling supports high current demands and corresponding high cooling requirements. Backplane profiles and topologies are available to test any board configuration.

FEATURES

Ą A wide variety of Backplane Profiles available using Dawn’s Patent Pending FMM Technology.

Ą Connectors may be partially populated for cost savings.

Ą Dawn’s RuSH System Health Monitor and Controller with LCD Display.

Ą Choice of 12H, 5VH, or VEN Power Systems.

Ą Performance Tested Cooling provides up to 20CFM/Slot at .24" H2O.

Ą Legacy wedge-lock or VITA 48.2 style card guides available as an option.

Ą Chassis side panels removable (as shown) for side board access and probing.

The ComEth4420e is a high-performance non-blocking, fully managed Layer 2/3 hybrid switch. It combines, in a single 3U VPX board, a PCI Express (PCIe) Gen3/4 switch for the data plane and a 10/40G Ethernet switch for the control plane. The ComEth4420e data plane switch provides up to 12 PCIe Gen4 ports, while the control plane switch offers up to 11 multi-rate high-speed Ethernet interfaces as 1000BASE-T, 10GBASE-T, 1000/10/40GBASE-KR, QSFP+ ports. This switch has been developed in alignment with the SOSA™ Technical Standard. It meets several VITA 65 slot and module profiles. The ComEth4420e provides IPv4/IPv6 routing functions. It can be remotely configured by the Interface Concept’s Switchware web interface, SNMP or CLI interfaces. In addition to all switching and routing basic features, it supports IEEE 1588 PTP (Precision Time Protocol) for precise network timing and includes protection for Non-Volatile Memory Read Only (NVMRO). It has been designed for use in harsh environments and is available in conduction-cooled environmental grade. Consult us for more information about the available configurations.

FEATURES

Ą 3U VPX

Ą Managed Layer 2+/3 switch

Ą Up to 11 Eth. ports

Ą Up to 12 PCIe ports

Ą 1000BASE-KX/10GBASE-KR/40GBASE-KR4, 1000BASE-T (rear)

Ą 10GBASE-T, QSFP+ (front)

Ą Aligned with the SOSA™ Technical Standard

 info@interfaceconcept.com

 510-656-3400

https://www.interfaceconcept.com/products/Ethernet-Switches/3U-VPX/375-ComEth4420e-3U-VPX-Dual-Plane-Gen34-PCIe-40-Gigabit-Ethernet-Switch Interface Concept www.interfaceconcept.com

 www.linkedin.com/company/interface-concept

ComEth4420e - 3U VPX Dual-Plane Gen3/4 PCIe & 40 GbE switch

Gigabit Ethernet Switch

The brand-new ComEth4682e is a 3U OpenVPX Ethernet switch that is 25/100Gb Ethernet capable. It has been developed for high-computing applications, including radar, sensor, electronic warfare, and network processing. The ComEth4682e integrates a Layer 2 (Ethernet) and Layer 3 switch, as well as a control processor to support Control and Data Planes that are virtually separated for highly secured 3U VPX systems. The switch features a total of 56 x 25Gbps SerDes: 32 lanes are routed to the rear VPX connectors as 1/10/25Gbs Ethernet ports or can be merged into 4-lane Fat Pipes to obtain 8 lanes as 40/100Gbs Ethernet ports. Likewise for the 24 optical fiber ports, they are routed to the front panel (2*MPO connectors) as 1/10/25Gbs Ethernet ports or can be merged in set of 4 fibers to obtain 3 lanes as 40/100Gbs Ethernet ports. The ComEth4682e benefits from the proven and switchware network management application. It can be remotely configured by the switchware web interface, SNMP or CLI interfaces. The ComEth4682e complies with the following VITA 65.0 slot profiles SLT3-SWH-2F24U-14.4.3, SLT3-SWH-4F16U14.4.13, SLT3-SWH-8F-14.4.2 and SLT3-SWH-6F8U-14.4.15. A version is also aligned with the SOSA™ Technical Standard (VITA 65.0 SLT3-SWH-6F1U7U-14.4.14).

FEATURES

Ą 3U VPX Managed Layer 2+/3 switch

Ą VITA 65.0 SLT3-SWH-2F24U-14.4.3

Ą VITA 65.0 SLT3-SWH-6F1U7U-14.4.14 (option)

Ą Up to 56 ports

Ą 24 optical fibers (2 front MPO connector)

Ą 1GBASE-KX, 10 & 25GBASE-KR, 40 & 100GBASE-KR4 ports (rear)

Ą Air-cooled and conduction-cooled versions

https://www.interfaceconcept.com/products/Ethernet-Switches/3U-VPX/376-ComEth4682e-3U-VPX-1102540100-Gigabit-Ethernet-and-IP-router

The VP1-250-eSSDC is a Conduction Cooled (VITA 48) Open VPX NVMe Solid State Disk storage module that delivers extremely high performance via a single fat pipe (PCIe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. NVMe is an industry standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. The NVMe protocol was established in collaboration by server industry leaders to standardize a scalable PCIe interface, making it easier for designers to unlock the full potential of PCIe. NVME provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed –both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems.

Phoenix International is an AS9100D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.

FEATURES

Ą Storage Capacity to 16TB

Ą Designed to align with SOSA Technical Standards

Ą Operational Altitude to 80,000 Feet

Ą Operational Temperature from -40 degrees to +85 degrees C

Ą Streamlined protocol with efficient queuing mechanism to scale with multi-core CPUs

Ą Optional AES 256/FIPS140-2 Encryption

Ą Also Available in Air Cooled Configurations

VP1-250-eSSDC

SOSA Aligned, OpenVPX, and SpaceVPX Products

Pixus offers high-performance chassis platforms, backplanes, and chassis managers. Specialists in advanced cooling solutions and high-speed backplane designs, Pixus offers MIL rugged and commercial grade modular configurations.

Our SOSA Aligned products include multiple 100GbE and PCIe Gen4 designs and cooling solutions from airflow over conduction, Air Flow Through, Air Flow By, and Liquid Cooling options. The company has various SpaceVPX and rugged ATR solutions, contact Pixus for details today!

Pixus USA is a member of the SOSA Consortium.

FEATURES

Ą SOSA Aligned OpenVPX chassis in ATR, MIL rugged rackmount, and lab/test formats

Ą Backplane design expertise up to and above 100GbE speeds, RT3 connector

Ą SlotSaver mezzanine-based SOSA aligned chassis manager Tier 3+

Ą 100% US based software/firmware for SOSA / OpenVPX chassis manager, versatile design

Ą SpaceVPX test/dev and deployable rugged systems

XMC with Removable SSD module

Red Rock Technologies releases new XMC product that provides up to 16TB of removable data storage in a standard XMC slot. It can support one or two COTS M.2 NVME SSDs; 2260, 2280, or 22110. Designed for frequent SSD removal with SSD module connectors rated for 100,000 mating cycles.

FEATURES

Ą Eliminates need for extra VPX slot for data storage

Ą Capacities up to 16TB (0 to 70C) and 8TB (-40 to 85C)

Ą Transfer rates of 3000 MB/s (0-70C) and 1500MB/S (-40 to 85C)

Ą Removable SSD module rated for 100,000 mating cycles

Ą COTS NVME SSDs with TLC, MLC, pSLC NAND

Ą Military erase, FIPS140-2, FIPS197, TCG Opal options

https://www.redrocktech.com/products/pmcxmc

Red Rock Technologies

www.redrocktech.com 

3U VPX Product Family

Rantec’s family of 3U VPX power supplies are designed to meet the rigorous demands of modern defense applications for airborne, land, and sea environments. Our family of 3U VPX power supplies offers versatile, reliable, and highperformance solutions for demanding defense applications. With strict adherence to industry standards, certifications, and a commitment to quality, these power supplies are a valuable choice for meeting the stringent requirements of the defense sector.

Our VITA compliant, SOSA aligned power supplies are designed with input voltages of either 28VDC or 270VDC and output power capabilities of up to 1000W. Rantec’s conformance to VITA 62.0, VITA 86.0, and SOSA standards ensure seamless integration into MOSA-aligned defense systems, make these power supplies invaluable assets in mission critical systems.

Manufactured in the USA in an AS9100 and ISO9001 certified facility, Rantec power supplies ensure the highest quality and reliability.

FEATURES

Ą SOSA aligned products conform to VITA 62.0 and VITA 86.0 standards

Ą Input voltages of 28VDC or 270VDC

Ą Output power up to 1000W

Ą Designed and tested to meet MIL-STD-461, MIL-STD-704 or MIL-STD-1275, and MIL-STD 810

Ą Designed using NAVSO P-3641A derating guidelines

Ą MTBF: 50,000 hours per MIL-HDBK-217

Ą IPMI Communication Bus per VITA 46.11

Ą Input/Output/Temperature protection

Ą Custom capabilities such as hold-up, nuclear event detection, lightning protection, inrush suppression, and more

Serial Communication Products

<<Description>>

TEWS Technologies offers a wide selection of serial communication products, including fixed RS232, RS422, RS485 and programmable transceiver interfaces for industry-standard high-speed serial data connections.

To meet customer requirements the products are offered in various configurations with programmable interfaces, galvanic isolation, type of cooling, channel density and different front I/O connectors.

FEATURES

FEATURES

Ą XMC and PMC Formfactor

Ą <<Feature 1>>

The COTS products are designed to meet demanding use cases – All communication products are suitable to operate in an extended temperature range of -40 °C to +85 °C.

Ą <<Feature 2>>

Ą RS232 / RS422 / RS485 and high-speed serial data communication

Ą <<Feature 3>>

Ą Half-duplex mode available

Ą Air cooled and conduction cooled versions

Ą <<Feature 4>>

Software Support for different operating systems like Windows, VxWorks, Linux, QNX and GreenHills Integrity is available. Using the available device drivers significantly reduces the required integration work, and allows focussing on the customer-specific software development.

Ą <<Feature 5>>

Ą Several communication protocols like asynchronous UART and synchronous HDLC

Ą <<Feature 6>>

Ą 100% tested

Ą 5 years warranty

Carriers for PCI Express, PCI, Compact PCI Serial and Compact PCI are available to allow seamless system integration.

https://www.tews.com/products/communication

<<Description>>

TEWS Technologies offers a wide range of Gigabit and 10 Gigabit Ethernet interface solutions for industrial and COTS applications in XMC and PMC form factor.

Ethernet products are available in air cooled and conduction cooled configurations. Depending on the selected product the Ethernet interfaces are provided via RJ45, SFP or SFP+ connectors. Conduction cooled products provide the Ethernet interface via Rear I/O, corresponding transition modules are available as well.

Carriers for PCI Express, PCI, Compact PCI Serial and Compact PCI are available to allow seamless system integration.

TEWS Technologies is an AS9100 and ISO9001 certified company. All products are designed and produced to the highest quality standards. Each individual product is extensively tested before delivery. All products come with a standard warranty of 5 years.

FEATURES

FEATURES

Ą <<Feature 1>>

Ą XMC and PMC Formfactor

Ą <<Feature 2>>

Ą Gigabit and 10 Gigabit Ethernet

Ą <<Feature 3>>

Ą Air cooled and conduction cooled versions

Ą <<Feature 4>>

Ą RJ45, SFP, SFP+ and Rear I/O

Ą <<Feature 5>>

Ą 100% tested

Ą <<Feature 6>>

Ą 5 years warranty

https://www.tews.com/products/network

<<magazine_url>>/<<product_id_number>>

TEWS Technologies GmbH

Company name

www.tews.com

 info@tews.com

 +49410140580

 www.linkedin.com/company/tewstechnologies/

Ethernet Products

VPX-20-06-15-XX

VPX 3U backplane with full access open frame P/N VPX-20-06-15-XX:

• Test and development system for developing VPX 3U cards with SOSA aligned RF and Optical connectors.

• Open frame allows access to both sides of the cards for probing and monitoring.

• 2 mm Headers allow for monitoring of all currents and voltages of a P0 connectors and insertion of all P0 utility signals.

• ATX power connector.

• Reset signal generated by push-button.

• Small breadboard area allows to add custom circuitry. Available options include RT-2, RT-2R or Smith Hypertronics connectors, Available with Meritec shrouds for custom mapping between slots. Cooling fans are available for cards with high power consumption. Dual slot and 6U versions are available.

AZ-COM Inc.

www.az-com.com

FEATURES

Ą SOSA Aligned RF / Optical connectors in J2 location

Ą Conduction cooled, Air cooled optional

Ą RT-2, RT-2R or Smith Hypertronic connector versions, Meritec shrouds.

Ą Current and Voltage monitoring for all powers.

Ą Monitoring and insertion of all P0 utility signals.

Ą ATX power supply connection.

 sales@az-com.com

 925-254-5400

The IC-INT-VPX3k, is a 3U VPX single board computer based on the 11th Gen Intel Core Xeon® W series (codename: Tiger Lake-H) processor. It is aimed at large bandwidth and high-demanding applications located at the edge of networks which may have to meet thermal and environmental constraints and have real-time functionality and operational safety mechanisms. This COTS VPX board leverages the latest Intel 10nm Intel® Xeon® W series processor enhancements to provide high-computing performance and a complete set of high speed interfaces to system integrators with power, fast IO needs and latest generation video interfaces. The IC-INT-VPX3k takes advantage of the Xeon® W eight cores running at 2,1GHz, 64G DDR4 at 3200MT/s and a large number of PCIe gen3 and Gen4 lanes ideal to connect peripherals with tremendous bandwidth. In addition, it supports the well-proven Intel® Advanced Vector Extensions 512 (AVX-512) instruction and the security protect modules of the Slim Bootloader. Interface Concept provides Board Support Packages for Linux® (IC SDK, others...) and VxWorks®. Other RTOS can be supported on request. The IC-INT-VPX3k is available in air-cooled and conduction-cooled versions.

FEATURES

Ą 3U VPX

Ą Intel Xeon® W (Tiger Lake-H) processor

Ą DR4 with ECC up to 64GB

Ą 1 x Gen4 PCIe x4 (Data Plane)

Ą 1 x Gen4 PCIe x16 (Expansion Plane)

Ą BSP for Linux® and VxWorks®

Ą Air-cooled and conduction-cooled versions

https://www.interfaceconcept.com/products/FPGA-Boards/3U-VPX/338-IC-FEP-VPX3f-3U-VPX-VITA-665-FPGA-board-with-FMC-Site

 510-656-3400

IC-INT-VPX3k

VPX

Add data storage to your VPX system!

Red Rock Technologies provides a range of 3U VPX SSD products using COTS NVME and SATA SSDs.

FEATURES

Ą Capacities up to 32TB (0 to 70C) and 20TB (-40 to 85C)

Ą NVME transfer rates of 3500MB (0-70C), 1500MB/S (-40 to 85C)

Ą Conduction and air-cooled options

Ą Removable SSD module rated for 100,000 mating cycles

Ą TLC, MLC, pSLC NAND for NVME and TLC, MLC, SLC for SATA

Ą Military erase, FIPS140-2, FIPS197, TCG Opal options

Ą 6U VPX SSD modules also available

This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports FIPS 140-2 AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media.

The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity.

Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.

FEATURES

Ą SLC or MLC SATA Solid State Disk

Ą VITA 48/REDI Air or Conduction Cooled

Ą Operational Altitude to 80,000 Feet

Ą Operational Temperature from -40 °C to +85 °C

Ą Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC)

Ą Optional AES 256/FIPS 140-2 Encryption

Ą Designed to align with SOSA Technical Standards

VP1-250-SSDX

3U VPX NVME and SATA SSD Modules

THE NEXT BIG THING IN RFS o C IS HERE

AND IT’S ONLY 2.5" × 4"

POWERFUL SMALL DEPLOYABLE

Models 6001 and 6003 QuartzXM modules enable the rapid integration and deployment of RFSoC technology. And the SWaP-friendly design is ideal for aircraft pods, unmanned vehicles and mast-mounted radars.

A Zynq® UltraScale+™ RFSoC plus a full suite of pre-loaded IP modules, robust Navigator ® software, high-speed 100 GigE interfaces and fully integrated hardware from Mercury, formerly Pentek, helps shorten your development time and reduce your design risk.

mrcy.com/go/mesrfsoc

[Form Factors]

QuartzXM Module

SOSA aligned 3U VPX 3U VPX

SFF platforms

PCIe