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September 2020 | Volume 16 | Number 6
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TABLE OF CONTENTS 18
September 2020 Volume 16 | Number 6
24
COLUMNS Editor’s Perspective 7 Steady defense market for new and aftermarket designs By John McHale
Technology Update 8 Video games on the hunt to build a better virtual AI teammate By Lisa Daigle
Mil Tech Insider 10 Keeping up to date with CSfC capability packages By Steven Petric
Guest Blog 48 Military power conversion: the value of strategic customization By Mike Eyre, Milpower Source
THE LATEST Defense Tech Wire 12 By Emma Helfrich Connecting with Mil Embedded 102 By Military Embedded Staff
WEB RESOURCES Subscribe to the magazine or E-letter Live industry news | Submit new products http://submit.opensystemsmedia.com WHITE PAPERS – Read: https://militaryembedded.com/whitepapers
FEATURES SPECIAL REPORT: Shipboard Electronics 14 U.S. Navy taps advanced radar and laser tech for missile and drone threats By Sally Cole, Senior Editor
MIL TECH TRENDS: Test and Measurement Trends 18 Failure is not an option: the trends behind military test systems By Emma Helfrich, Associate Editor 24 Expanding software-defined radio versatility for the digital battlefield By Haydn Nelson, NI and Justin Moll, Pixus Technologies 28 SDR for the rapidly evolving demands of test and measurement By Reza Mohammadi, Neelam Mughees, and Ghozali Suhariyanto Hadi, Per Vices Corporation
INDUSTRY SPOTLIGHT:
Managing Supply Chain, Obsolescence, and Counterfeit Parts 32 Military IC aftermarket trends Q&A with Dale Lillard, president of Lansdale Semiconductor By John McHale, Group Editorial Director 36 True cost: Obsolescence can mean millions By Lynnette Reese 40 ITAR compliance and the great regulatory maze By Kevin Deal, IFS North America 44 Counterfeit components: Risky business By Marti McCurdy, Spirit Electronics
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ON THE COVER: As hypersonic missiles, stealthy drones, and myriad other threats continue to emerge, Navy ships are adapting by bringing more sophisticated laser and radar technologies aboard. In photo, the Arleigh Burke-class guided-missile destroyer USS Winston S. Churchill (DDG 81) patrols the Atlantic Ocean at dusk. (U.S. Navy photo by Mass Communication Specialist 3rd Class Louis Thompson Staats IV.)
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WEBCASTS Leveraging Artificial Intelligence and Machine Learning for Military Systems Sponsored by Abaco, Concurrent Technologies, Crystal Group, and Wind River https://bit.ly/33YLQrs SOSA and VITA: Enabling Open Standards for Improved Capability Sponsored by Annapolis Micro Systems, Epiq Solutions, Pentek, and TE Connectivity https://bit.ly/326WVo7 For more webcasts: https://militaryembedded.com/webcasts
www.MilitaryEmbedded.com 6 September 2020
GROUP EDITORIAL DIRECTOR John McHale john.mchale@opensysmedia.com ASSISTANT MANAGING EDITOR Lisa Daigle lisa.daigle@opensysmedia.com SENIOR EDITOR Sally Cole sally.cole@opensysmedia.com ASSOCIATE EDITOR Emma Helfrich emma.helfrich@opensysmedia.com DIRECTOR OF E-CAST LEAD GENERATION AND AUDIENCE ENGAGEMENT Joy Gilmore joy.gilmore@opensysmedia.com ONLINE EVENTS MANAGER Josh Steiger josh.steiger@opensysmedia.com CREATIVE DIRECTOR Stephanie Sweet stephanie.sweet@opensysmedia.com SENIOR WEB DEVELOPER Aaron Ganschow aaron.ganschow@opensysmedia.com WEB DEVELOPER Paul Nelson paul.nelson@opensysmedia.com CONTRIBUTING DESIGNER Joann Toth joann.toth@opensysmedia.com EMAIL MARKETING SPECIALIST Drew Kaufman drew.kaufman@opensysmedia.com VITA EDITORIAL DIRECTOR Jerry Gipper jerry.gipper@opensysmedia.com
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EDITOR’S PERSPECTIVE
Steady defense market for new and aftermarket designs John.McHale@opensysmedia.com
By John McHale, Editorial Director
Welcome to our 2020 September Resource Guide, which is more than 100 pages for the eighth straight year. Shows you that print is not dead yet – not here – and definitely not in the military-electronics arena. So thank you to our loyal readers and advertisers for continuing to support our flagship publication. Thanks for supporting our print and online channels, but also for your support of and respect toward our warfighters and the sacrifices they make every day. This year’s edition of our Resource Guide also set a record for advertising sales – nearly 70 pages of ads. Please be sure to check out the categories in this year’s guide and see what the Department of Defense (DoD) is buying, starting on page 50. Many of these offerings are new designs or refreshed versions of other products and play into the open architecture trend in new DoD designs. This issue size is clearly a sign of healthy defense market due in large part to a steady flow of funding from the DoD, even during the pandemic. Companies – from commercial off-the-shelf (COTS) suppliers to major prime contractors like Lockheed Martin and Northrop Grumman – are still considered essential businesses and as such have been operating and delivering systems to the DoD. We expect to see this funding continue somewhat steadily for the next two years, even with the uncertainty of the outcome of the U.S election and as the government moves funding to pay for economic stimulus packages and other COVID-19-related aid. The military market does not have the peaks and valleys that can devastate other markets. Analysts at Frost & Sullivan see that being the case globally as well. “The decline in GDP and the increase of budget deficits would have an impact on defense spending, but the effect would be lower than other industries,” says Alexander Clark, Aerospace & Defense Research Analyst at Frost & Sullivan. “With increasing geopolitical tensions, the regional defense spending ratio will remain unaffected as the underlying political factors continue to remain constant. Further, the United States, Asia, and Europe, respectively, will remain the biggest consumers of defense products.” Spending continues to be steady for new technology and new designs as well as decades-old designs that continue to support legacy platforms. With military technology … some things never go away. In this vein, obsolescence is and always will be a problem, as the deployed platforms often have a service life of five-plus decades, forcing system designers to rely on endof-life buys and aftermarket suppliers. “Electronics makers constantly obsolete parts, boards, and entire systems for new technology that provides a performance edge over the competition,” observes Lynette Reese, writing for aftermarket board supplier GDCA in her page 36 article, “True cost: Obsolescence can mean millions.” She cites those on the Obsolescence Management team, housed within the U.S. Army’s Aviation and Missile Research, Development, and Engineering Center, as reporting that “70% of electronics are obsolete before a system is deployed, and one component can become obsolete in a weapon system’s life cycle as many as ten times.” www.militaryembedded.com
Given those stats, we can say that the military-electronics aftermarket has a strong future. However, growth cycles typically behave opposite of the rest of the military-electronics market; in other words, when funding for new tech is up, business slows a bit, Dale Lillard, president and owner of IC aftermarket supplier Lansdale Semiconductor tells me in our Q&A on page 32. In some ways that is the case today, but Lillard says the increased spending from U.S. allies on older platforms has increased his business. “There has been an uptick in Foreign Military Sales of weapon system platforms made in the 1980s and 1990s, such as the F-16,” he says. He goes on: “Approximately 80% of the weapons systems in service from that [the 1980s] are still using some military ICs manufactured during the 1970s and ‘80s,” he tells me. “All those lines are still active – the last one I purchased was in 1993.” Lillard also touched on counterfeit avoidance in our chat. Marti McCurdy, owner and CEO of Spirit Electronics, goes into detail on the topic in her article titled “Counterfeit components: Risky business.” She writes that “the U.S. Naval Air Systems Command (NAVAIR) Aging Aircraft Program estimates that as many as 15% of all the spare and replacement microchips the Pentagon buys are counterfeit.” Check it out on page 44. Many things go obsolete in this world – as you will see from this month’s content – but I would say again that print is not one of them, not yet. My 17-year-old nephew, a top student and athlete, told me he just started subscribing to the print edition of the Wall Street Journal. Why? Because he says he likes holding a newspaper and reading a printed book, and doesn’t want to see printed matter go away… I loved hearing that but was embarrassed to then admit I get the WSJ Online. In all forms, folks: Keep reading.
MILITARY EMBEDDED SYSTEMS Resource Guide
September 2020 7
TECHNOLOGY UPDATE
Video games on the hunt to build a better virtual AI teammate By Lisa Daigle, Assistant Managing Editor Military teams operating in the battlespace against opponents under often-adverse conditions must act and react incredibly quickly, as adversaries become more adept and gather data on the fly. Artificial intelligence (AI) will become increasingly critical in helping commanders and team members with decision-making. AI at this point, however, is more a limited tool than a teammate. AI as we currently know it is limited in its reasoning and integration with human teams, as it lacks an element called “theory of mind,” a kind of skill that enables humans to in a large part figure out the cognitive state of the people around them. So, just a modest goal: To instill social intelligence into a machine. Toward this end, engineering firm Aptima (Woburn, Massachusetts) has announced a multiyear contract award from the Defense Advanced Research Projects Agency (DARPA) for ADAPT [Adaptive Distributed Allocation of Probabilistic Tasks]. ADAPT is an innovative program to develop a new generation of AI and software agents designed to work alongside, learn from, and interact with human teams. Under ADAPT, Aptima and partner Arizona State University (ASU) will design, build, and validate collaborative and – hopefully – adaptive AI agents. These innovations will drive forward communications and cooperation between human and artificial agents; eventually they will also help real-world commanders process data streams, mount functional battle teams, and adapt action plans as missions change. The research team will test its socially intelligent agents in a search-and-rescue scenario within the virtual world of the incredibly successful Minecraft video game (officially the best-selling video game in the world – ask any middle-schooler about it), in a testbed developed with ASU researchers. In the first year of the ADAPT program, the team will work to train its software agent to infer the state of mind of an individual team member while playing the game. In subsequent project years, the agent will interact with multiple human players and attempt to understand what each of them is thinking, even as the virtual environment around them changes. ADAPT’s agents and AI systems – inspired by certain qualities of human cognition, using a type of reasoning based on “active inference” – will enable computer-based agents to perceive, learn, and adapt based on their observations of the environment and their interactions with human team members. ADAPT will also look at another critical drawback of current AI agents: A lack of two-way communication and reasoning input that is needed between team members for collaboration. The team will attempt to remedy this situation using a variety of advanced interfaces, visualizations, and models. Adam Fouse, Ph.D., Director, Performance Augmentation Division and ADAPT Program Manager, says of the program: “ADAPT will take a significant step forward in human-AI collaboration so warfighters and intelligent technology can reason and work together to make better, faster decisions than either could do on their own.
8 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
Figure 1 | DARPA is using the popular video game Minecraft to teach military AI how to be a better teammate.
“By learning from its human counterparts, and taking into account their goals, preferences, and constraints, these more informed agents can guide AI in forecasting, creating, and adapting action plans as missions evolve,” he adds. One example Fouse gives: Urban search and rescue in which advanced AI agents would review millions of possible scenarios to help commanders deploy resources to the correct areas while minimizing risk to human or autonomous assets. “Humans excel at learning from one another but can only process so much incoming information. AI on the other hand has incredible computational abilities but requires the ability to learn from and communicate with humans in order to be used effectively in dynamic team situations,” Fouse says. “These combined attributes will elevate a commander’s expertise and decision making in fastchanging, information-intensive environments so they can respond, and adapt quickly, while also considering future possibilities.” The ADAPT project, according to Aptima officials, builds on previous work that the company has done with DARPA – dubbed ASIST, or Artificial Social Intelligence for Successful Teams – that aimed to engineer software to help DARPA create and assess socially competent AI.
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Keeping up to date with CSfC capability packages By Steven Petric An industry perspective from Curtiss-Wright Defense Solutions Since its introduction in 2014, the National Security Agency Commercial Solutions for Classified (CSfC) program has proven very effective in lowering the cost and speeding the accessibility of encryption for critical data-at-rest (DAR). Compared to the time and expense associated with acquiring certification and approval for Type 1 encryption solutions, CSfC has provided a breakthrough for defense and aerospace system integrators by establishing an approved means for using commercial encryption to protect critical data. What makes CSfC innovative is that it provided, for the first time, an authorized process for employing two layers of commercial off-the-shelf (COTS) encryption. These could be two layers of hardware, two layers of software, or a mix of hardware and software. The very problem that CSfC addresses, the constant and ever-evolving threat of cyberattacks, has led to a regular update for the directives – called a Capability Package (CP) – on how to best implement CSfC. The CPs, published by the NSA Capabilities Directorate, provide the architectures and configuration requirements that enable customers to implement secure solutions using independent, layered COTS products. While the DAR CP is primarily a guideline for solution users and integrators, it also provides a set of guidelines for COTS vendors and system developers. CPs are product-neutral and describe system-level solution frameworks, documenting security and configuration requirements for customers and/or integrators. The most recent CSfC CP for data-at-rest, the CSfC Data-at-Rest Capability Package 4.8 (CSfC DAR CP 4.8), was published in October 2019. The next major release, CSfC DAR CP 5.0, would likely have been released early in 2020, if not for delays caused by COVID-19, but it is expected to become available relatively soon. As CSfC is a relatively new program, the CPs enable updates that reflect lessons learned, new application cases, and technological evolution. Because the CSfC DAR CP is a living document that reflects the protean nature of cyberthreats, it’s imperative that systems integrators stay up to date on the latest editions of the directive in order to eliminate risk to their programs. Keeping abreast of the latest CSfC DAR CP helps to ensure that when a proposed CSfC solution is submitted to the Authorizing Official for approval, the solution is likely to be accepted, eliminating additional scheduling and cost burdens. One of the most important new additions in CSfC DAR CP 4.8 is the Unattended Operations (UO) Use Case, which covers the management of unattended or remote managed DAR solutions and systems. “Unattended” implies “unmanned” or simply no person in the actual vehicle. Examples of unattended/unmanned vehicles or applications include: › › › › › ›
Unmanned aerial vehicles (UAVs) Unmanned underwater vehicles (UUVs) Unmanned surface vehicles (USVs) Unmanned ground vehicles (UGVs) Unmanned ISR [intelligence, surveillance, and reconnaissance] or radar site Unmanned EW [electronic warfare] monitoring station
As the use of unmanned applications has greatly increased, the importance of protecting critical data has become all the more important. For that reason, guidance for the UO use case was long suggested and desired, and its debut in CP 4.8 was a very welcome enhancement. A use case for Enterprise Management (EM) was also added in
10 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
Figure 1 | The Data Transport System (DTS1) network attached storage (NAS) device can be used in unmanned aerial systems operating as high as 40,000 feet (7.5 miles).
CP 4.8, but for defense deployed-ystem integrators, the corporate enterprise environment is less germane. The individual layers in a CSfC solution are called components; commercial vendors develop products that are considered components in the CSfC program. Those products are put together and tested by trusted integrators to produce a solution. The guidance provided in DAR CP 4.8 helps integrators develop CSfC solutions for unattended operations. It also provides guidance to component developers for enhancing existing components or develop new ones. A CSfC solution can only be developed with components that are either in, or have completed, the CSfC approval process. Each of the layers (HWFDE and SWFDE) in the Curtiss-Wright Data Transport System (DTS1) COTS network attached storage (NAS) device appear on the CSfC Components List. The unit (Figure 1) has been tested and validated to operate in the extended -45 ºC to +85 ºC operating temperature range – per MIL-STD-810G methods and procedures – which enables its use in very harsh deployed military environments, including high-altitude, long-endurance (HALE) UAS platforms that must operate as high as 40,000 feet (7.5 miles). Steven Petric is senior product manager, data storage, in the Defense Solutions Division at Curtiss-Wright. Curtiss-Wright Defense Solutions www.curtisswrightds.com www.militaryembedded.com
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DEFENSE TECH WIRE NEWS | TRENDS | DoD SPENDS | CONTRACTS | TECHNOLOGY UPDATES
By Emma Helfrich, Associate Editor
AI algorithms beat human fighter pilot in virtual dogfight trials An artificial intelligence (AI) algorithm beat a human fighter pilot during a simulated dogfight in the recent Defense Applied Research Projects Agency (DARPA) AlphaDogfight trials, officials report. This competition was held as the military puts more of its pilots in a digital cockpit, rather than a physical one, for qualifications and training. Teams from eight defense contractors flew simulated F-16 fighter planes against AI-controlled planes in aerial combat.
Figure 1 | Lockheed Martin is more than two years into development of the F-16V and is now in the flight-test phase of the program. U.S. Air Force photo.
Maryland-based Heron Systems came in first place among eight companies who pitted their AI-powered simulated aircraft against one another for two days straight. On the third day of the trials – held virtually at the Applied Physics Lab of Johns Hopkins University in Baltimore due to COVID-19 restrictions and livestreamed on ZoomGov – Heron’s system beat an F-16 Fighting Falcon pilot in five straight simulated dogfights, DARPA said. The trials were designed to energize AI developers for DARPA’s Air Combat Evolution (ACE) program.
Hypersonic weapon system undergoes testing on B-52 Stratofortress The U.S. Air Force and Lockheed Martin completed the second hypersonic air-to-ground weapon test on a B-52 Stratofortress bomber. The final early-testing portion on the AGM-183A Air-Launched Rapid Response Weapon (ARRW) was conducted from Edwards Air Force Base, California. The first sensor-only prototype of the ARRW was carried externally by a B-52 during a flight test in 2019. Officials said at the time they had set an accelerated development schedule for the weapon system. Hypersonic weapons are designed to travel at five times the speed of sound or higher, denoted as Mach 5 and above, making them more difficult to intercept or defend against. Hypersonic weapons are expected to provide the U.S. Air Force with “time critical capability that will overcome distance in contested environments using high speed,” according to an announcement.
Classified stealth drone used in USAF EW exercise The U.S. Air Force concluded a test of tactics involving use of its highly classified RQ-170 surveillance drone with other stealth aircraft. The exercise also included an Air Force B-2 bomber and F-22 and F-15 fighter planes, as well as the U.S. Navy’s E/A-18G Growler electronic warfare (EW) plane. The pairing of fourthand fifth-generation aircraft with the drone was a simulation of electronic attack missions – the use of electromagnetic energy to destroy enemy combat capability – using the more advanced F-35 as anti-air-defense cover. According to the Air Force statement, the first-of-its kind exercise used the more advanced F-35s as critical anti-air-defense cover and focused on stealthy penetration into denied areas, suppression and destruction of enemy air defenses, and electronic attack tactics. The Large Force Test Event was part of an effort to develop solutions to Tactics Improvement Proposals.
12 September 2020
Figure 2 | The RQ-170 Sentinel is an American unmanned aerial vehicle developed by Lockheed Martin and operated by the U.S. Air Force for the CIA. Lockheed Martin image.
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AI-enabled unmanned “wingman” project for USAF awards four contracts The U.S. Air Force selected Boeing, Northrop Grumman, General Atomics, and Kratos for the Air Force program to build an AI-enabled drone wingman, known as Skyborg. Each company will operate under an indefinite-delivery/ indefinite-quantity contract worth up to $400 million. Seed money was not allocated at the time of the award, according to the U.S. Department of Defense (DoD), because the companies will have to compete for future orders. DoD information shows that the Skyborg prototyping, experimentation, and autonomy development contract will be used to deliver missionized unmanned aerial system (UAS) prototypes in support of operational experimentation. The goal, say Air Force officials, is to develop the first Skyborg air platform with modular hardware and software payloads that will incorporate the Skyborg autonomy core system and use AI to enable manned/unmanned teaming.
Figure 3 | Conceptual design for Skyborg/Artwork courtesy AFRL.
Centrifugal Impulse Drive introduced as new form of propulsion for space flight
AI technology to be leveraged for DoD supply-chain risk management
Engineering startup Quantum Dynamics Enterprises announced what it calls the first propellantless drive for space flight. The Centrifugal Impulse Drive (CID) uses a new form of propulsion in which electricity is turned directly into thrust to propel the spacecraft without expelling any mass.
Exiger – a technology-enabled regulatory, financial crime, risk, and compliance solutions company – won a $9.9 million subcontract award from prime contractor Alion Science & Technology to combat the threat landscape of supply-chain vulnerabilities within the national-security enterprise. According to the terms of the contract, Exiger will work with Alion to implement AI-powered supply chain risk management, vendor and entity screening, and supply-chain illumination solutions. The contract is intended to support operations in the DoD.
According to the company, CID is the propellantless alternative to the ion drive and hall thruster currently used in satellites. CID is designed to be a reactionless drive or inertia impulse propulsion engine (also termed a reactionless thruster, reactionless engine, and inertia drive). By definition, a reactionless drive or inertia propulsion engine is any form of propulsion of a space or other aircraft not based around the expulsion of fuel or reaction mass, the company asserts.
The AI-powered platform, according to the contract win announcement, is designed to drive change in how entities are vetted: It aims to identify, validate, and analyze global risk indicators by aggregating open source information, performing entity disambiguation, and assessing and continuously monitoring ongoing risk to the companies and suppliers within the relevant supply chain network. Exiger’s platform is intended to enable the DoD to obtain supply-chain risk management capabilities and ultimately safeguard the global supply chain.
U.S. Navy guided-missile destroyers will get phased-array antenna capabilities Ball Aerospace was contracted by the DoD’s Defense Innovation Unit (DIU) to develop a prototype of a new multiband, low- observable satellite communications antenna that will be installed on the U.S. Navy’s newest stealth-enabled ships, the DDG 1000 Zumwalt-class destroyers. According to Ball Aerospace, the company is applying its experience in electronically steerable phased-array antenna technology and high-performance stealth technology to design a solution that can operate over multiple frequency bands, meet existing signature requirements, and be applied for use on the Zumwalt-class destroyers. Dr. Jake Sauer, vice president and general manager, Tactical Solutions, Ball Aerospace, said of the news: “We are pleased to partner with DIU and the U.S. Navy to explore ways to quickly and cost-effectively increase the capabilities of the DDG 1000.” www.militaryembedded.com
Figure 4 | The USS Zumwalt, the lead ship in the Zumwalt class of guided-missile destroyers in the U.S. Navy. Photo courtesy U.S. Navy.
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U.S. Navy taps advanced radar and laser tech for missile and drone threats By Sally Cole, Senior Editor
As hypersonic missiles, stealthy drones, and myriad other threats continue to emerge, ships are adapting by bringing more sophisticated laser and radar technologies aboard.
The U.S. Navy is turning to a wide range of directed-energy weapons (DEWs) – high- powered lasers – and more sophisticated radar systems to expand both its short- and long-range defense capabilities. Laser weapons, no longer science fiction, are changing the way the U.S. military counters drones, missiles, and other threats. Earlier this year, Lockheed Martin and the U.S. Navy moved a step closer to integrating a laser weapon system onto an Arleigh Burke destroyer by successfully conducting a critical design review for the High-Energy Laser with Integrated Optical Dazzler and Surveillance (HELIOS) system.
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Shipboard Electronics
Artist’s rendering of Lockheed Martin’s HELIOS system. Photo courtesy of Lockheed Martin.
Scalable laser design for DDG ships HELIOS is a 60 kw-class high-energy laser weapon system that will initially be installed on an Arleigh Burke Class DDG (guided missile destroyer) Flight IIA and integrated with the Aegis Combat System. “This allows the system to pass tracks back and forth between Aegis and the laser subsystem that supports sailors in providing an overall tactical picture,” explains Joe Ottaviano, business development director, Lockheed Martin Rotary and Mission Systems (Washington, D.C.). Lockheed Martin’s scalable laser design combines multiple kilowatt lasers to attain various weapon power levels. “Laser power can be dialed up or down,” Ottaviano says. “This modularity results in a reliable and low-maintenance laser system that minimizes single points of failure – graceful degradation – and supports low manufacturing and life cycle costs.” HELIOS is 100% structurally integrated directly into the ship’s electrical system and doesn’t require a separate energy magazine. “Due to the efficiency of the laser, the ship has the power bandwidth to support it,” Ottaviano says. It’s a “transformational new weapon system with a deep magazine, low cost-perkill, speed-of-light delivery, and precision response,” he adds. As far as capabilities go, HELIOS’s spectrally beam-combined high-energy fiber laser is designed to counter unmanned aerial systems (UASs) and fast inshore attack boats. “It also has a counter-UAS dazzler capability, which is designed to obscure adversarial UAS-based surveillance capabilities – disrupting their surveillance systems,” Ottaviano notes. (See lead image, above.) Beyond this, the system features a long-range ISR [intelligence, surveillance, and reconnaissance] capability. “HELIOS high-powered optical sensors will be part of an integrated weapon system designed to provide decision makers with maximum access to information,” says Ottaviano. “And its data will be available on the Lockheed Martin-led Aegis Combat System.”
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HELIOS is designed for warfighting within a maritime environment under demanding operational conditions, so it relies, Ottaviano says, on “commonality between HELIOS subsystem components and existing shipboard equipment (cabinets, dry air, power distribution, cooling) to reduce training and logistics impacts.” How can HELIOS change Navy surface fleet-operations? Ottaviano answers: “It provides a game-changing tactically integrated direct energy capability and optical intelligence, surveillance, and reconnaissance data to warfighters at sea that will lead to the development of new tactics, training, and procedures as well as new concepts of operation.” The most surprising thing about HELIOS, Ottaviano adds, is that it “operates at the speed of light and with its deep magazine complements existing weapon systems to provide additional, integrated capability against surface and airborne threats.” Solid-state lasers In March 2020, amphibious dock ship USS Portland successfully disabled UAS via a solid-state laser developed by Northrop Grumman. This was the first system-level use of a high-energy class solid-state laser by a U.S. Navy Pacific Fleet ship. (Figure 1.) The Office of Naval Research developed a “laser weapon system demonstrator” (LWSD) to demonstrate high-energy laser weapons and installed it on the USS Portland for an at-sea demonstration. Navy ships are facing increasing threats, such as UASs, armed small boats, and adversaries’ intelligence, surveillance, and reconnaissance systems. The Navy’s DEWs, such as the LWSD, are intended to provide commanders with more decision space and response options. Conducting advanced at-sea tests against UASs and small craft is providing valuable information about the capabilities of the solid-state laser weapons system demonstrator against potential threats, according to Captain Karrey Sanders, commanding officer of the USS Portland. www.militaryembedded.com
Figure 1
The USS Portland successfully disabled an unmanned aerial vehicle with a solid-state laser. Photo courtesy of U.S. Navy.
The Navy has been working on DEWS, including lasers, since the 1960s. DEWS are essentially electromagnetic systems that convert chemical or electrical energy to radiated energy and then focus it on a target – resulting in physical damage that can destroy an adversary’s capability. USS Portland was tapped in 2018 to become the first ship to test the Solid-State Laser – Technology Maturation (SSL-TM) laser weapon system demonstrator MK 2 MOD 0 at sea. The second iteration of SSL-TM is ultimately expected to be turned into a 150-kw laser weapon, thanks to lessons learned via Office of Naval Research (ONR) demonstrations and testing that began back in 2011. Its original 30-kw laser-weapon system collected data from 2014 to 2017 about how the system performed within an operational setting. This collected data challenged scientists to make advances in areas such as beam directors and spectral-beam combining, according to the Navy, which uses many layers of different wavelengths to create a more powerful beam. The weapon has been undergoing testing at a Northrop Grumman facility in Redondo Beach, California, so that engineers could test subsystems to reduce risk before sending the weapon system to conduct land-based testing and then at-sea testing on the Portland. It will be interesting to see what other types of advanced radar and directed energy technologies – that we can know about –make their way onto ships within the next few years. Tracking the threats Among the most intriguing tech being added to ships or tested this year: Raytheon’s SPY-6 family of radars, Lockheed Martin’s HELIOS system, and a solid-state laser developed by Northrop Grumman. Among the important features for these radars and lasers are modular assemblies, scalability, commercial off-the-shelf (COTS) components, open architectures, 360-degree situational awareness, enhanced range and sensitivity, and easy maintenance. SPY-6 radar family Raytheon has developed a line of scalable radars, known as the SPY-6 family, which can be designed and scaled to meet the specific mission needs of each ship class.
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Shipboard Electronics
Each variant uses the same hardware and software, and their construction is modular, thereby making them more reliable and less expensive to maintain. “SPY-6 radars are built from individual ‘building blocks’ called radar modular assemblies (RMAs), or self-contained radars that come in two-foot by two-foot by two-foot boxes,” says Don Schmieley, requirements and capabilities lead at Raytheon (Washington, D.C.) for the SPY-6. “Those boxes stack together to fit the mission requirements of any ship – a feature that makes the SPY-6 family the Navy’s first truly scalable radars.” As far as capabilities go, SPY-6 “is an integrated air and missile defense radar that can simultaneously defend against ballistic missiles, cruise missiles, hostile aircraft, and surface ships,” he adds. “SPY-6 produces significantly greater detection range, increased sensitivity, and more accurate discrimination over legacy radars it’s replacing.” To create a significantly more powerful and precise radar beam, SPY-6 uses digital beamforming technology and gallium nitride (GaN) components. “This capability enables SPY-6 to counter large and complex raids, and to work within high-clutter and jamming environments,” Schmieley says. Its software baseline is reprogrammable, so that it’s able to adapt to new missions and emerging threats. “And the radar harnesses gallium nitride, a semiconductor technology that enables its 360-degree active electronically scanned array (AESA) capability,” Schmieley points out. “These features mean AESA radars like SPY-6 can automatically adjust radar beams in ways older systems can’t.” Along with COTS components, open architectures play an important role in the SPY-6(V), which features a fully programmable back-end radar controller unit built out of COTS x86 processors. “Each of Raytheon’s SPY-6 family of radars is constructed from a common set of components to enable common logistics across the SPY-6 naval battle force,” Schmieley explains. All SPY-6 radar modular assemblies (RMA) and line-replaceable unit (LRU) cards – the lowest level of component able to be replaced – are interchangeable among platforms with SPY-6 radars. Any technician trained for RMA-based radar maintenance can work on any RMA-based radar, which simplifies radar technician training to a common curriculum. It only takes two tools and one piece of test equipment to maintain the radar arrays of the SPY-6 family. (Figure 2.) One example in the radar family is the SPY-6(V)1, designed for DDG 51 Flight III destroyers, is known as the air and missile defense radar (AMDR). It has four array faces, each with 37 RMAs, to provide 360-degree situational awareness. This capability provides enhanced range and sensitivity compared to the radar it replaces; it simultaneously defends against ballistic missiles, cruise missiles, antisurface and antiair threats, plus jamming/clutter and electronic warfare. SPY-6(V)2 is intended for use on amphibious assault ships and Nimitz-class aircraft carriers. It’s known as the enterprise air surveillance radar (EASR – rotator variant), and has one rotating array face with nine RMAs to provide continuous 360-degree situational awareness SPY-6(V)3 is for Ford-class aircraft carriers and FFG(X) guided missile frigates and is known as the enterprise air surveillance radar (EASR) (fixed variant). It features three fixed-array faces, each with nine RMAs, to provide continuous, 360-degree situational awareness. It also has air-traffic control and ship self-defense capabilities to deal
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Figure 2 | SPY-6 radars are built from individual “building blocks” called Radar Modular Assemblies, or self-contained radars that come in two-foot-cube boxes. Those boxes stack together to fit the mission requirements of any ship – a feature that makes the SPY-6 family the Navy’s first truly scalable radars. Courtesy of Raytheon.
with cruise missiles and antisurface and antiship threats. SPY-6(V)4 is for backfit on DDG 51 Flight IIA destroyers, also known as AMDR. This one has four array faces, each with 24 RMAs, to provide 360-degree situational awareness. Compared to the radar it replaces, it has significantly enhanced range and sensitivity. “It can provide what other radars can’t: simultaneous defense against a wide range of threats,” Schmieley says. “SPY-6’s increased sensitivity allows it to detect and track hard targets like stealthy drones and hypersonic glide vehicles.” SPY-6’s significantly increased detection ranges will enable ships to “provide coverage for much larger areas and help naval commanders to consider more flexible ship operating areas,” he says. “And it gives them a larger battlespace that may permit changes to weapon inventory and shot doctrine management.” Overall, with the threat of hypersonic missiles looming, SPY-6’s multimission radar capability to detect and track ballistic missiles, air-, and surface-borne threats simultaneously within a contested environment is a big evolutionary step forward in the Navy’s warfighting capability. “Its unmatched range, high sensitivity, and increased raid handling, combined with its superior operation in adverse environments and high operational availability, achieves full-time 360-degree situational awareness,” Schmieley says. MES www.militaryembedded.com
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Test and Measurement Trends
Failure is not an option: the trends behind military test systems By Emma Helfrich, Associate Editor
Before any military technology can be fielded, it must undergo a barrage of test and measurement (T&M) scenarios to ensure its operability. The importance of these evaluation systems and their criticality is simple yet profound: The lives of warfighters are dependent on them. In recent years, varying demands and challenges have pushed manufacturers to innovate. Military T&M systems are going digital, becoming software-defined, and are undergoing widespread standardization right alongside so much of the technology used by the U.S. Department of Defense (DoD) today. This inexorable march then prompts the question of what takes priority with the DoD: ensuring compatibility with reliable legacy systems or moving forward with the wave of standardization?
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If anything, maybe it’s a good problem for the DoD and technology manufacturers to have. Producing military assets that provide such a high level of longevity while maintaining and increasing current capabilities could not only result in long-term safety for the end user but also puts a premium on test systems that can adapt over time to changing capabilities or test requirements. Due to this reality, companies in the industry are seeing a widespread push toward test systems that can be customized or evolved through software. Companies are being asked for systems able to do both the component-level test and the system-level test, all of which require a multitude of I/O, data storage, and streaming capabilities. With these huge asks, issues can arise in areas such as obsolescence management and technology-insertion challenges. Maintaining backward compatibility To avoid often-costly software upgrades, industry officials argue that backward compatibility in T&M systems is generally considered a necessity. DoD initiatives that are aimed at keeping legacy assets in the field do still have skin in the game even during budget shifts, but at the same time it’s also true that funding of interoperable test systems is being allocated elsewhere. “With ensuring backward compatibility in T&M systems and keeping legacy systems in the field, I don’t think the DoD has the luxury of choosing one or the other,” says Nick Butler, chief marketing lead for aerospace and defense at NI (National Instruments – Austin, Texas). “And it’s challenging for them. They’re asked to take a budget and make it work across both new platforms and new-product introduction as well as maintaining decades-old assets.” The DoD is tasked with maintaining that backward compatibility while looking for opportunities to standardize their equipment to make it useful across assets. Doing all of this at the same time as maintaining and performing technology insertion and handling life cycle management for dozens of legacy T&M systems can prove to be a challenge. Let’s just say the road to both backward compatibility and standardization of test systems is paved with good intentions. “Ensuring backward compatibility leads to maintainability, which in turn provides reliability in the field. So the budget precedence is clear: backward compatibility,” says Dan Dunn, vice president and general manager of Aerospace Defense Government Solutions at Keysight Technologies (Santa Rosa, California). “To move toward a noncompatible piece of equipment within the T&M system leads to expensive software modifications, requiring the whole system to be revalidated. A certain amount of adaptability is required of both the equipment supplier and the user. Gaining true backward compatibility may require a certain degree of customization within the new instrument.”
Industry officials might argue that the U.S. Department of Defense (DoD) desire to keep the military’s trusted legacy systems fielded without having to proliferate test systems unique to the capability has fostered a culture of adaptability. What seems to have thrown a wrench in the advancement of test and measurement (T&M) systems, however, has been a skewed consideration of longevity needs. But that isn’t to say it’s completely halted any progress. www.militaryembedded.com
Certifying that modern military test systems can both evolve alongside the threat environment and can also reach back to keep legacy systems fielded are the overarching goals for the DoD and manufacturers. Innovative methodologies to maintain this backward compatibility in T&M systems are starting at the software level, with standardization also playing a pivotal role. Standardization symbiosis A widely adopted idea across military-technology manufacturers is that standardization is the key to building efficiency. Groups and consortia formed around that objective aim to use standardization to “reduce the cost of test through economy of scale in procurement, common training, and improved maintainability,” Dunn says. “Having a broad range of capability intrinsic to the T&M hardware enables a software- definability model where standardization and flexibility can coexist.”
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There’s a potentially symbiotic relationship between the standardization of military assets and the standardization of test and measurement capabilities. As assets standardize, so too would test and evaluation requirements. “From our perspective, we are seeing increasing standardization using a consolidated approach, such as what’s used in eCASS and VIPER/T [DoD test solutions],” says Tim Webb, director of U.S. defense sales at Astronics (East Aurora, New York). “We continue to implement strategies to allow for technology insertion as the next-generation approach. Standardization of capabilities would certainly bolster the efficiency of test equipment, especially for those with the ability to insert new technology and make adjustments for the next generation. These systems can help ensure seamless compatibility with any legacy equipment that the DoD wishes to maintain, especially existing TPSs.” (Figure 1)
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The methods through which respective companies choose to reach widespread compatibility of T&M systems, whether consolidation or standardization efforts, both aim to achieve a proliferation of capabilities in defense and military organizations. Moreover, the driving force for test organizations to combat the challenges presented by these new capabilities has conferred a premium on software and on developing more software-defined test systems overall. Engineering T&M systems to be software-defined Customers – and, no doubt, the DoD – see a lot of value in software-defined systems that can evolve or be customized over time to meet the requirements of new and old programs alike, Not only does it save money, but it also makes for quicker and more efficient technology refresh (Figure 2). “That trend around incorporating advanced capabilities and specifically a trend around more autonomous and cognitive systems puts a real challenge on test,” Butler says. “And it puts a premium on software-connected test systems that can be customized and that can adapt over time to changing capabilities or changing test requirements. Our customers can’t go out and build an entirely new test systems every time their capabilities increase, or their requirements change.” T&M systems and mission-critical software often converge: The software that’s running the aircraft subsystem or the software that’s helping drive the missilenavigation system, for example, has to be extensively tested, validated, and run www.militaryembedded.com
the equipment must have either a removable NVM for hosting sensitive information or an option to prevent a customer from writing anything sensitive to NVM.” Organizations seem to agree that customers want the ability to have control over what data is stored in volatile versus nonvolatile memory. Manufacturers are being asked to design test systems that give users the ability to choose what goes into nonvolatile storage while retaining the ability to wipe that nonvolatile storage completely before reuse or transfer of the test system. Figure 2 | Keysight Technology’s M980xA PXIe vector network analyzer supports signal analysis capabilities with vector signal analysis (VSA) software interoperability.
through varying simulations to make sure it works properly in all operational scenarios. But the test system itself needs its own software to execute the test and evaluation in the first place, which can create security risks. The solution used in the past to safeguard T&M data, Butler says, was to airgap the systems, a network-security measure used to ensure the security of a computer or network by physically isolating it from unsecured networks, such as the public internet or an unsecured local area network. However, the recent industry push toward digital transformation – connecting and networking systems across an enterprise with the aim of improving access to data – although widely discussed and adopted, means that manufacturers can no longer airgap these systems. This new, networked reality ostensibly makes it easier for an adversary to access test data and therefore boosts the importance of encryption during both data transfer and storage. “Measurement data must be secured, and so should measurement setup information, user-specific calibration data, information about the end user, and equipment usage data,” Dunn says. “In a nonsecure use model, this data would be kept on nonvolatile memory (NVM) inside the instrument or transferred to a larger data repository on a server that may be cloud-based. However, for the secure environment cloud-based data storage, this is not acceptable and storage inside an instrument may be problematic, even if it resides in a secure lab. If the instrument must ever leave the lab for repair or calibration, the data must stay behind. So, the solution is that www.militaryembedded.com
Automating and digitizing test and evaluation To achieve this level of control over what T&M data is being stored and where, an industrywide shift toward automation and digital engineering is underway. From preproduction to postproduction, test data needs to be a critical component of that emerging digital product thread. “There is a transformation underway, thanks to the digitization of manufacturing, sometimes termed Industry 4.0,” Dunn says. “This enables customization of products under high-mix, low-volume production with improved efficiency. This type of production and test process is well-suited for military systems from radar to SATCOM. The move is away from highly integrated monolithic test systems to a more distributed approach for these types of systems under test (SUT) and increased use of robotics. Artificial intelligence (AI) and machine learning capabilities will play a large role in dramatically improving uptime and utilization of test assets while reducing overall manufacturing costs. Interaction between machines and T&M equipment enables prediction of failures and triggers rework processes autonomously, as well as the ability to react to unexpected changes in production.”
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The proliferation of automation and predictive maintenance in test, monitoring, and manufacturing continues to emphasize the importance of software in T&M systems because the algorithm is what automates them (Figure 3). End users continue to seek out data and systems management and asset monitoring systems that include predictive maintenance algorithms and these digital engineering initiatives are designed to simplify the acquisition process for them.
in helping them set up digital twins and perform digital simulation, and we’re using model-based engineering to create a complete digital product thread of information about the asset or product they’re creating,” Butler says.
“The U.S. Air Force has a lot of digital engineering initiatives and goals for the short term, and we’re working very closely with them to understand what role we can play
Programming autonomy into a test system is a welcome advance in a field where the push for software definability and digitization is so prevalent. A machine learning algorithm in a T&M system could in fact cut technology insertion costs, maintain backward compatibility, and limit workload for the warfighter.
Figure 3 | National Instruments’ VeriStand software is designed to configure real-time I/O, create plug-ins, import and simulate models, and automate real-time tests.
“We believe autonomy will absolutely play a role in future test and measurement equipment as AI-powered capabilities become embedded in the systems more and more,” Webb says. “The better we get at monitoring and collecting meaningful data and predicting failures, the more reliable an end product will become.” MES
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Expanding software-defined radio versatility for the digital battlefield By Haydn Nelson and Justin Moll On the increasingly connected battlefield, the electromagnetic spectrum is a critical resource that can mean the difference between victory and defeat. In recent conflicts, simply geolocating the source of enemy communications signals gave a competitive advantage to the victor. On the battlefield, software-defined radio (SDR) is used for sensors, communications, and electronic warfare – in short, it’s almost everywhere. SDR’s single-technology architecture and reprogrammable nature make it ideal for a broad range of applications.
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Test and Measurement Trends
Imagine the scenario: A lone reconnaissance soldier is positioned behind a rock outcropping for concealment outside of a suspected enemy training-andresearch base. Silently, they observe the facility from afar, working hard to avoid detection. With a software-defined radio (SDR), the soldier scans the RF spectrum for possible enemy communications and known frequencies. Suddenly, they see an unfamiliar signal frequency and format. “Is this a new threat? Have I been detected?” The new signal is quickly transmitted to an analyst at a forward operating base, where the analyst determines that the signal belongs to an undiscovered unmanned aircraft system (UAS) command data stream. The analyst quickly decodes the signal through a machine-learning algorithm, and a demodulation routine is deployed back to the soldier’s SDR. Now that the new signal is known, our protagonist can move with confidence and return to base, knowing that the UAS threat can be rapidly mitigated. This hypothetical tale of a battlefield signals intelligence (SIGINT) operation is made possible by flexible SDR: Rapidly detecting, analyzing, and deploying solutions. SDR is a popular technology for a wide range of applications, from hobbyist ham radio, to defense wireless systems, to commercial wireless networks. SDR includes any RF or radio system in which software, rather than fixed-function hardware, performs the physical layer function. While early FM radio implementations had an analog-demodulation solution, today, it’s predominantly software-based. The term “SDR” is broadly used and applied to technologies including softwarebased instrumentation and purpose-built tactical military radios. While they are “software-based,” many of these products don’t have built-in user-programmable
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Figure 2 | SDR-based drone detection deployed to protect an operating base. Drone position is determined by time-difference-of-arrival at SDR receivers.
functionality. One benefit of a fully user-programmable system is the ability to rapidly upgrade it to adapt to new needs and threats in the field. (Figure 1.) SDR can detect drones Multifunctional drone defense systems are a recent and rapidly evolving SDR application. Many commercial drones rely on GPS for navigation and direct command-andcontrol links to a remote operator. Battlefield drone-detection systems use several technologies for mitigation, including active radar, electro-optical/infrared sensors, and passive SIGINT, often sniffing GPS location information from the drone’s communications data stream. SDR is ideal for this use because it rapidly adapts to different communication protocols, detects various drone types, and even injects false data into the drone’s command stream to prevent the operator from completing their mission. In addition to standalone use, SDR often protects major assets such as ships, airports, forward operating bases, and critical installations. Using SDR with time-difference-of-arrival (TDoA) algorithms is yet another way to detect threats and protect valuable assets. If nondestructive electronic warfare (EW) methods fail, alternative engagement systems are often employed – such as directed munitions, high-energy lasers, or high-power electromagnetic methods. (Figure 2.)
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Drone defense systems benefit from SDR’s user-programmable adaptability to keep up with rapidly evolving wireless protocols. Drone defense providers must be able www.militaryembedded.com
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MIL TECH TRENDS to quickly deploy new countermeasures through software updates without major hardware changes. Some lower-end drones have no communication encryption and simply can be defeated by denying GPS, whereas more sophisticated models operate autonomously and can be stopped by intercepting and injecting commands into their data stream. SDR technology enables a single deployed asset to both gather data on new threats and defeat existing ones. (Figure 3.)
Test and Measurement Trends Using a radio in an environmentally controlled lab is different from mounting it on a vehicle or deploying it in the elements, to contend with rain, sand, sea, and a wide temperature range. Rugged, deployable mission hardware not only needs processing, signals, and systems capability, it must survive under shock, vibration, and harsh environments.
Figure 3 | USRP X310 used for drone defense application. Courtesy of SkySafe.
In order to keep that critical edge on the electromagnetic battlefield, many researchers use commercial off-the-shelf (COTS) SDRs to research, prototype, and test new techniques. Often, performing research and prototyping on mission hardware results in longer lead times and greater expenses, thus limiting development hardware access. Ettus Research Universal Software Radio Peripheral (USRP) supports many software design flows. Engineers using COTS SDRs with tools such as GNU Radio, REDHAWK, and LabVIEW have deployed hundreds of SIGINT, EW, and communications capabilities. Taking an idea from the research lab to a deployed asset can be challenging, as many hardware and software development workflows don’t translate to a rugged, weatherproof, deployable solution. Using a radio in an environmentally controlled lab is different from mounting it on a vehicle or deploying it in the elements, to contend with rain, sand, sea, and a wide temperature range. Rugged, deployable mission hardware not only needs processing, signals, and systems capability, it must survive under shock, vibration, and harsh environments. When failure is not an option, having trusted hardware in the field is critical to the warfighter. Moving the USRP for advanced RF and DSP applications to the field from the lab requires reliable manufacturing, a trusted supply chain, and experience of thermal modeling and failure analysis. Using a rugged USRP SDR places the RF subsystem processing near the tactical edge, removing the need to integrate into centralized onboard embedded systems. Additionally, decoupling the radio hardware from the control system makes scaling to multi-radio functionality much easier. (Figure 4.) Why ruggedness is important Flexible ruggedness levels are important to support multiple application requirements. Many cases require an SDR in the field outdoors, where the unit is pole-mounted
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or secured on the back of a vehicle. In other cases, the SDR may be handcarried in a protective case with other equipment. In all of these scenarios, IP67 protection ensures that the unit is fully protected from rain, water, and dust ingress. Additionally, with IP67, a unit can stand in water for as long as 30 minutes. Because a unit may be transported on the back of a vehicle or aircraft, it is critical that it meets shock and vibration specifications per MILSTD-810G. With a specialty heat sink design, a conduction-cooled chassis can dissipate enough heat to support -20 °C to +50 °C temperature ranges – even with a powerful Xilinx Kintex-7 410T FPGA [field-programmable gate array] onboard – to meet or surpass many application specifications. In extreme environments, operating temperature levels can be as hot as 70 °C, and the shock/vibration may need to meet Procedure 1 of the Test Method 514.7 vibration test and the 20 G level of shock under Test Method 516.7. It is important to be able to adjust the design to meet these specifications – for example, providing extra-secure heat sink and cabling mounting in the enclosure. Supplemental cooling options also help under extreme temperatures. www.militaryembedded.com
lessly connected. New threats require field-upgradable hardware so that allies can detect new signals and rapidly deploy enhanced capabilities. SDR’s singletechnology architecture and reprogrammable nature make it ideal for a broad range of applications. MES
Figure 4 | An example of a USRP for advanced RF and DSP applications is the Pixus Technologies RX310: Rugged USRP X310.
On the other end of the spectrum, some units don’t require weatherproof rugged design: The SDR may be placed in a protected shelter, but still needs to meet more advanced shock/vibration levels than the commercial unit. In these applications, a semirugged design meets moderate shock/vibration levels and may even sport fans, offering powerful FPGA compatibility for multiple levels of high-performance processing. In today’s rapidly evolving commercial technology market, everything is wire-
Haydn Nelson is a U.S. Navy veteran with more than 17 years of experience in wireless and DSP technology applications. He has worked in several industries – from military and aerospace research to RF semiconductor test – and has broad experience in radar/EW and communications systems. Haydn currently serves as a business leader at NI for their wireless prototyping and deployment applications in military and aerospace markets. Justin Moll is vice president of sales and marketing at Pixus Technologies. He has been a sales and marketing management consultant and senior-level manager for embedded computing companies for more than 20 years. Justin has led various committees in the open standards community and is a regular guest speaker at several industry events. He holds a degree in business administration from University of California, Riverside. NI • https://www.ni.com/en-us.html Pixus Technologies • https://pixustechnologies.com/
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MIL TECH TRENDS
SDR for the rapidly evolving demands of test and measurement By Reza Mohammadi, Neelam Mughees, and Ghozali Suhariyanto Hadi As communications technologies evolve rapidly, performing test and measurement on communications equipment more easily and flexibly has become increasingly crucial, particularly in military applications. Software-defined radio (SDR) technologybased testing equipment provides the cost efficiency, flexibility, and power to move forward these communications. Test-andmeasurement equipment manufacturers must ensure that their product can help their customers accelerate their testing process and expand their testing capabilities, in order to shorten their time to market, reduce costs (as fewer pieces of testing equipment would be needed), and gain a better return on investment (ROI) on their existing testing equipment.
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Test and Measurement Trends
Software-defined radio (SDR) is capable of testing multiple current standards – such as Bluetooth, WiFi, GNSS, 4G, and 5G – and has the potential to work with future standards. This versatility means that even military users can accelerate the testing process, reduce inventory, and decrease human-resource costs with a single piece of equipment. The core principle of the SDR technology is that the radio can be programmed, controlled, or specified completely using software. In contrast to conventional radios that are developed for a unique application and frequency, SDR can be programmed to test a wide range of frequencies and can be tailored to work in any application. For example, testing of a cellphone requires testing of its GPS, Bluetooth, cellular bands, and Wi-Fi. SDR enables and supports the testing of each of these components’ previous and latest versions with no need to replace or modify the testing hardware. SDR achieves this functionality due to its design (Figure 1). Market trends In a recent market statement issued by Acumen Research and Consulting titled “Global Software-Defined Radio Market – Analysis and Forecast, 2020-2027,” the SDR industry was worth $21.85 billion in 2019 and is likely to hit $31.69 billion in 2027. The study anticipates that the industry will grow at compound annual growth rate of 7.19% over the 2020-2027 forecast period. While SDR technology has been around since 1993, it is more directly the advances in semiconductor and software technology that have pushed higher development productivity in SDRs and made them valuable. With its widespread benefits, SDR is becoming the industry standard in markets such as test and measurement, electronic warfare (EW), spectrum monitoring, public-safety communications, signals intelligence, and military communications.
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Problems and how SDR addresses them Many criteria are taken into account when choosing a test and measurement system, the most important of which are the complexity of design being tested, volume of production, and test time. SDR is desirable in test-and-measurement applications that feature moderate to high complexity, low-to-moderate volumes, and moderate-to-high flexibility needs. In these test-and-measurement scenarios, many complex systems with various independent devices operating at different frequencies must be tested before their release into the market. Figure 2 shows a radio spectrum, outlining the range in which different devices fall. Every device can have different protocol and testing requirements that may need to be adapted with time. Moreover, many communication protocols and products are still maturing, and system models are being replaced or
Figure 1 | Block diagram shows a general SDR architecture, with transmit and receive sides.
tailored to handle the never-ending flood of data. Customers need a single device to work for several applications. Additionally, as they deal with the emergence of new communication standards, many customers prefer to update the existing equipment as opposed to replacing it. Those who use SDRs have more flexibility: Unlike replacing the hardware, SDR testing can be patched, updated, or completely changed to address the latest protocols. Moreover, the commercially available high-performance programmable signal-processing devices used in SDR help in meeting testing’s throughput, flexibility, and development cost. For example, in the case of 5G, the new high frequencies permit more data movement and signal processing, but 5G also needs more testing for optimizing the traffic. Earlier, 100 MHz was considered a “wideband” instrument, but now the market demands
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Test and Measurement Trends
Figure 2 | Spectrum graph shows frequency designation.
bandwidths more than 1 GHz. Currently, various technology gears are expected in 5G, beginning with 4.5G and eventually going towards millimeter-wave technology. If testing is to be performed using traditional hardware, it may be too slow and expensive.
with low-volume projects, an SDR will be a more effective tool than a traditional testing suite.
It is likely that when the hardware required for testing a particular protocol of 5G becomes available, that particular protocol may have changed. Therefore, the testing hardware becomes outdated shortly after that 5G technology hits the market. SDR’s wideband performance can be configured for use with many different devices as users address the need to use the 71 to 76 GHz band for 5G; moreover, SDR is very compatible with the upcoming millimeter-wave bands. SDR’s support of high bandwidth also means there are no restrictions on testing a variety of equipment (that is, it can be either narrow band or wideband).
Reducing testing time Another “must-have” for test and measurement is reducing the test time. For example, in a standard RF or mixed-signal test, the testing time is made up of dataprocessing and data-acquisition time, the setup time of the testing device, and the response time of the device under test (DUT). All of these, except DUT response, are largely a function of the test device. The test equipment should have minimal effect on the overall testing period. SDR can do inline testing through the onboard FPGA [field-programmable gate array] for a broad variety of complex consumer, industrial, and electronic products without the need for a host system when deployed, thereby speeding up the testing process.
For products that are tested in low to moderate volumes in comparison to devices such as base stations or mobile phones, setting up a new hardware test bench for every new design will cause major inefficiencies. Software-defined radios enable connection with a host where application development can be done through software. Especially
Many manufacturers are offering a variety of SDR products to meet varying needs in markets such as satellites, military communications, LTE, and wireless connectivity. The accelerated development of the latest wireless technologies such as 5G and 802.11ax are spurring engineers to utilize flexible testing and measurement devices. MES Reza Mohammadi is an engineering student at the University of Toronto; his work at Per Vices focuses on network infrastructure. Neelam Mughees is a registered engineer and a Ph.D. candidate in electrical engineering. Ghozali Suhariyanto Hadi is a Ph.D. candidate in computer science. His focus is on wireless (RF-based) sensing to combine robust hardware design and post-processing using machine learning. Per Vices Corporation www.pervices.com
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INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
Military IC aftermarket trends By John McHale, Editorial Director
Decades-old military platforms like the Aegis weapon system and the Patriot missile defense systems, as well as key systems for fighter jets like the F-16, continue to go through modernizations and embrace open architecture designs, but critical integrated circuits (ICs) used in these systems have not changed since they were originally designed in the 1970s and 1980s. The U.S. military relies on aftermarket suppliers such as Lansdale Semiconductor to design these components exactly as they were first built by various semiconductor companies decades ago.
R. Dale Lillard President of Lansdale Semiconductor
In this Q&A with Dale Lillard, president of Lansdale Semiconductor (Phoenix, Arizona), he shares how the military IC aftermarket performs compared to the rest of the defense electronics market, how this market segment is impacted by the global pandemic, and the vagaries of counterfeit-part mitigation. He also provides updated insights into several controversies he called attention to in the government IC-procurement process over the years. Edited excerpts follow. MIL-EMBEDDED: Dale, please provide a brief description of your responsibility with Lansdale and how the company participates in the military-electronics aftermarket industry. LILLARD: I am the president and owner of Lansdale Semiconductor, having purchased the company in 1987. I came up with idea of a military-semiconductor aftermarket in 1980, 40 years ago. My passion and hobby is restoring classic automobiles, where I’ve nearly always had the benefit of aftermarket support for most of the cars that I buy. It’s essential to restoring these classic cars and I thought that if I were a weapons-system supplier, I would want that same type of aftermarket support. Lansdale now manufactures more than 2,500 classic design ICs in the original package, exactly as they were created and produced by AMD, Fairchild, Freescale Semiconductor, Harris, Intel, Motorola, National, Philips (formerly Signetics), and Raytheon. We were able to buy the tooling and manufacture the militarized ICs used during the military buildup of the Reagan administration in the 1980s. Approximately 80% of the weapons systems in service from that time are still using some military ICs manufactured during the 1970s and ‘80s. All those lines are still active – the last one I purchased was in 1993. I also have a commercial product line I purchased in 2002 that produces building-block
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ICs for the RF industry and for some aerospace applications. They don’t make militarized ICs anymore, so the end user is forced to go with COTS [commercial off-the-shelf] technology. However, it’s more difficult for aftermarket support of commercial parts for military systems today. In the 1980s and 1990s militarized products were consolidated and the DLA [Defense Logistics Agency] maintained the specifications in a QML ([qualified military line] ensuring consistent support from the various manufacturers. The military components were designed into systems and aftermarket suppliers knew they would need to be supported. It is difficult to determine which commercial products would be profitable to support. My recommendation to customers is that if you have a system using commercial ICs that needs to maintain a long life, you should make EOL [end-oflife] buys, as you will never get the parts cheaper and also because you will not www.militaryembedded.com
get the support that we have provided for military ICs of the ‘80s or ‘90s. MIL-EMBEDDED: Has the current downturn due to the pandemic impacted your market? I’ve been told that it’s making many companies rethink using overseas foundries and suppliers and to buy more from American suppliers. Do you see that as well? LILLARD: It impacted me. My manufacturer for the commercial market, based in Indonesia, was forced to shut down immediately one day. When I looked at where to go next, there were not a lot of options and I wanted to avoid China. So I brought the test part of that business into the U.S. For the assembly I moved it to Thailand.
new production. The major contractors are selling major systems – that still use the parts Lansdale produces – and we are supporting those systems. The DLA itself, which usually buys spare parts from us, has been extremely slow in its procurement activity compared to last year. As money has moved to new systems, there has been a shift. There has also been an uptick in Foreign Military Sales of weapon system platforms made in the 1980s and 1990s, such as the F-16 and [Patriot Missile Long-Range Air Defense System]. Some components in these systems are still supplied by Lansdale, which has of course been good for business. MIL-EMBEDDED: Over the decades Lansdale has always been bold in standing up when it sees bad practices by the government. Most recent was in 2013 when the DoD was looking to mark components with plant DNA to help mitigate the spread
Our commercial-product-line business – which supplies commercial communication applications such as televisions – has also slowed down because of the virus. Hotels are not ordering TVs right now. Regarding future onshore semiconductor manufacturing, Arizona may be a location for U.S. suppliers to turn to, as Taiwan Semiconductor is looking to build its newest fab here in the state. That’s an indication that people are waking up to the semiconductor supply-chain challenges. Currently, the DLA auditors are not allowed into Taiwan Semiconductor in Taiwan, but perhaps that will change when it’s located in the U.S. Because the reality is it’s better to be here in the U.S. when it comes to IC production. MIL-EMBEDDED: Department of Defense (DoD) funding is strong and flowing down through the supply chain. Does that benefit aftermarket suppliers as well? What would be a bad climate for aftermarket suppliers – a shrinking defense budget? LILLARD: It’s kind of interesting. The aftermarket business cycle is typically the opposite from the rest of the defense-electronics market. When the government doesn’t have money to buy new toys, they make sure they maintain the old ones. As the DoD funding is at a high right now, my best business is in www.militaryembedded.com
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Managing Supply Chain, Obsolescence, and Counterfeit Parts
of counterfeit parts. This practice was quite controversial, as it technically did not ensure that a part was not counterfeit and was instead a way for unauthorized distributors to become suppliers to the DoD. Eventually the practice stopped, correct? Where do things stand now? LILLARD: I have not watched it closely since the DLA stopped making us mark the products we sell to them with DNA, but it is my understanding that the DLA continues to put DNA on each IC component they purchase. I’m not sure exactly why they still use the plant DNA, but when I talk with inspectors, I hear they are doing it for logistics and to maintain date codes and traceability on when products come in. They appear to have stopped claiming it prevents counterfeits, because it doesn’t. Counterfeit parts have been found with plant DNA markings on them. Marking the products with DNA was an expensive process for suppliers to take on. Lansdale never did it as we sold through our distributor, who then added the DNA markings. Distributors are no longer required to do that, but we still use our distributor when selling to DLA. [To read more on the DNA marking controversy, go to https://militaryembedded.com/ comms/rf-and-microwave/dna-problem-solver-money-pit.] MIL-EMBEDDED: What is the biggest challenge when mitigating counterfeit parts today? How do you overcome it? LILLARD: There is no other solution except to buy from authorized suppliers. I look at the auto analogy again: When I’m working on my 1965 Ford Mustang and looking for
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replacement parts, I can buy something from China that has on paper all the right information, but when I go to put it in the car I find that the holes don’t match or it’s incompatible in some other way. Only the original manufacturer knows what they’re doing, whether it is automotive parts or military ICs. Lansdale has supported and contracted with the original manufacturer on our military ICs, so you know you are getting the same part. If you can’t guarantee that with a modern part, then I say it again, make big EOL buys. MIL-EMBEDDED: Nearly 20 years ago, you raised some red flags about the fact that when manufacturing processes change, it can impact the reliability of a part, say, in an F-15 radar system. You were referring to the emulation methods used by the Generalized Emulation of Microcircuits (GEM) program at the U.S. Defense Supply Center Columbus (DSCC) in Columbus, Ohio. GEM was essentially
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trying to create new versions of components that you and other companies supply. Does this still occur, or have the processes become more reliable over the last two decades? LILLARD: The processes are not, in fact, more reliable. The more advanced technology gets, the harder it is to duplicate our parts. Rochester Electronics, Lansdale, and others are doing a good job taking care of military-aftermarket IC needs. The GEM program doesn’t do a part if we make it, and the end user has to be cautious before they use it. I suspect they are still playing that game. You cannot just take a part and put into a radar system if you change the original technology. There is a risk involved. Also, much like when restoring antique cars, you have a new generation of engineers, who – while talented and smart – are not the original designers that worked on these systems in the ‘70s, ‘80s, and ‘90s. They’re gone, and the new engineers may not understand the system completely, especially if the process has changed. It becomes more difficult with product insertions. [To read more on the GEM process issue, go to http://www.lansdale.com/news_ about_lansdale.php?a=detail&id=12.] MIL-EMBEDDED: What are the typical defense applications Lansdale components end up in? Radar systems? Missile guidance? Communications? LILLARD: The Aegis Combat System has used components from Lansdale over the decades and still does. No matter how much this system is modernized, it still needs the parts we make. The Patriot Missile Long-Range Air Defense System is another that is still active. Outside of that it is hard to say, especially with U.S. applications, as the DLA doesn’t tell us what systems the parts end up in. I must sell 150-200 different sole-sourced military parts each year of the 800 solesourced ICs I have. MIL-EMBEDDED: What is the oldest product line Lansdale still supplies to defense customers? LILLARD: The oldest is one of my favorites and it’s not a military system per se, www.militaryembedded.com
but has similar characteristics. We sell robust HTL (High Threshold Logic 18-volt) products originally designed by Motorola in the 1960s for Westinghouse nuclear power controllers. We get business every year from them. Bulletproof parts that you can’t change, just as with our military ICs. MIL-EMBEDDED: Looking forward, what disruptive technology or innovation will be a game-changer in the aftermarket world five to 10 years out? Predict the future. LILLARD: I don’t believe the U.S. military will get rid of all these older systems; Congress will prioritize spending more on social programs than on replacing F-16s with F-35s, as the F-16 and platforms like it can be maintained for another 50 years. It is difficult to replace everything in an old platform with newer systems. Developing new platforms like the F-35 while maintaining and upgrading older, defensive systems like the Aegis is how the U.S. military maintains its role as the world’s most powerful military force. MES R. Dale Lillard, president of Lansdale Semiconductor (Phoenix, Arizona), is an industry pioneer in the manufacturing of high-reliability aftermarket ICs and semiconductors. Lillard joined the company in 1980 as operations manager. He previously was product manager at Motorola Semiconductor Products Sector in Phoenix. Six months after joining Lansdale, Lillard was promoted to company president at just 29 years of age. He purchased Lansdale in 1987. Under his leadership, Lansdale continued its unprecedented growth by recognizing the critical need to support legacy ICs. With Lillard at the helm, Lansdale is today a leading supplier for the global electronics-components marketplace. He coined the term “semiconductor aftermarket.” Lillard graduated in 1972 from the University of New Mexico at Albuquerque with a bachelor of science degree in electrical engineering. Lansdale Semiconductor • http://www.lansdale.com
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INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
caption
Title By John McHale, Editorial Director
True cost: Obsolescence can mean millions abstract
By Lynnette Reese
Dealing with military users who still want obsolete products is not a new problem for original equipment manufacturers (OEMs), who make more revenue on the The latest products as users migrate away from mature products to faster, better versions. However, people don’t always jump quickly to the next revision because they can’t upgrade an entire system when one electronics card is no longer available. In the military realm, mature systems can remain in use for decades.
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A symbiotic relationship exists between rhinos and the cattle egrets that clear “passengers” from the rhino’s back. A similar relationship can be seen between a small company and an OEM as they work to sustain mature products that some key customers still need. (Stock image.)
Maintaining old products makes it exceedingly more difficult for engineers to meet key customer demand (for these older products) while designing new revenue-generating products. A good customer may feel neglected and start thinking about migrating the entire account to a different supplier out of sheer frustration. It’s unlikely to work smoothly with obsolete components. Electronics makers constantly obsolete parts, boards, and entire systems for new technology that provides a performance edge over the competition. According to the Obsolescence Management team, housed within the U.S. Army’s Aviation and Missile Research, Development, and Engineering Center, 70% of electronics are obsolete before a system is deployed, and one component can become obsolete in a weapon system’s life cycle as many as ten times.1 There’s a point where it’s unprofitable to continue supporting mature products. (Figure 1.) The true cost of maintaining legacy products Maintaining many legacy products ties up critical resources and is not worth the profit loss. The true cost of supporting older, low volume products can translate to millions of dollars in support, inventory management, and lost opportunity cost. Difficult decisions must be made around products at end-of-life (EOL). Only
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Figure 1 | At some point, the true cost of extending a product lifecycle becomes unprofitable for OEMs; urgent redesigns can be expensive and mature products can generate high inventory stocking costs. Otherwise excellent teams that deliver old, discontinued products can lose sight of profitability. (Image: GDCA, Inc.)
A more cost-effective solution The LEM’s cost-effective solution sustains older electronics products, extends the life cycle, and frees up engineers, production, and component buyers for innovating new product designs. Sales can maintain focus on selling the new rather than on placating customers. Production doesn’t get congested by supporting older products.
products sold to strategic customers or at high enough volume survive. When a product is deemed EOL, military programs must forecast demand far into the future and plan inventory space for a lifetime buy order. Other options may be to upgrade systems, find parts, or repair products themselves. However, there’s another option that few know about. Maintaining older electronic products means handing off the headache to a Legacy Equipment Manufacturer (LEM). An LEM specializes in managing and engineering mature and already obsolete products. Like a cattle egret on the Rhino’s back, a symbiotic relationship can be formed between both OEM and LEM – accommodating obsolescence as a core competency – in manufacturing, repairing, and supporting legacy products for OEM customers. www.militaryembedded.com
Ethan Plotkin, CEO of manufacturing company GDCA, Inc. (Livermore, California), states, “OEMs often continue to support old boards to avoid customer issues. Conservatively, 25% of overhead efforts are exhausted on less than four percent of sales revenue. Most of these sales are old designs. OEMs don’t make enough money to champion old designs – even if they increase prices.” GDCA does not reverseengineer products, Plotkin notes; it enters into a secure agreement with the OEM to accept original design files and take it from there. Boards are built to fit, form, and function as the OEM originals. The OEM’s key customers – often the military – are no longer hindered by last-time-buy (LTB) notices. lotkin recalls a large company that agonized over ending the life of 80% of its legacy P products following a strategic shift. Although many customers were upset by the EOL event, supporting these old designs was simply unprofitable. “[GDCA] accepted their legacy designs and their customers get more OEM-designed cards as they need them as well as support and repairs. It’s a win-win-win.” Any engineer in their right mind would be skeptical. How can a company like that make money? LEMs are set up to provide sustainment services as a core competency. Sustaining the life of old products is different than new product development. The cattle bird and the rhino (see lead photo) operate differently, but together they both win in a symbiotic, mutualistic relationship. The smaller bird picks the parasites off the rhino’s back for its dinner. The rhino continues foraging over the new ground rather than trying to scratch insects off his back on a tree limb. This is a symbiotic, win-win relationship; routine sustainment activities that are normal operations for the “cattle bird company” are business exceptions for the OEM. Late adopters to OEM products can migrate to the latest version at their own pace. Customers gain assurance that a product will not fall out of support, and OEM bandwidth is freed up to reduce time-to-market for other products, unlocking pockets of
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INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
hidden revenue. Customers are confident to use OEM designs for future projects, no longer worried about products getting orphaned. When asked how GDCA manages a new legacy product, Plotkin states, “GDCA works with OEMs on a case-by-case basis to license and then remanufacture mature designs, often without requiring requalification. We can’t accept every single legacy product, but we can offer solutions for most of them.” Sustaining critical legacy products Rochester Electronics is a component-level LEM that sells parts which have been EOL by many different companies. Rochester obtains remaining EOL components from a manufacturer for inventory, but also has the capability of manufacturing chips using information transferred directly from original component manufacturers. A symbiotic
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Just like the legendary Ford Built GT500 Mustang classic design… Lansdale Semiconductor still manufactures some of the most popular… and timeless commercial wireless, telecommunications, military and aerospace integrated circuits (ICs) classic designs.
relationship in product life cycle management (PLM) with an LEM can remove frustration, reduce costs, and improve the OEM’s responsiveness and reputation. Customers may even remain unaware that an LEM is carrying the load for sustaining a critical legacy product. An LEM should enter into a binding agreement to protect the OEM’s intellectual property (IP), receive design files, and take over supply streams and manufacturing. The OEM’s customers are happy, and OEM engineers can concentrate on what they do best. An LEM can comply with original commercial off-the-shelf (COTS) design and test specifications; participate in a counterfeit-avoidance program; and perform the manufacturing, repair, and customer support of legacy products. For embedded board OEMs, optimizing product life cycle with a partner in a symbiotic relationship can remove the “ticks” that suck profits from ROI. Optimizing a product’s life cycle via an LEM allows an OEM to gain greater control of product profitability, optimize the product’s ROI to the fullest, and satisfy strategic legacy customers at no cost to the OEM. An OEM may even be able to negotiate royalties with the LEM. Contact a “cattle egret” – rather, a legacy equipment manufacturer – about starting a mutually beneficial, symbiotic relationship in legacy optimization to manage product life cycles. MES
This means Lansdale eliminates the need to go to the time or expense of designing in a replacement part or even doing a complete product redesign – not when we still make ‘em… exactly like they used to.
Lynnette Reese has a B.S. in electrical engineering from Louisiana State University and has worked in embedded hardware and software for over two decades. She now freelances in technical writing and works with technology companies such as GDCA.
Log on to our Web site at www.lansdale.com to review our up-to-date product listings and data sheets.
GDCA • www.gdca.com
As a global pioneer in IC products life cycle management, Lansdale manufactures over 3,000 classic design ICs in the original package, exactly as they were created and produced by AMD, Farchild, Freescale Semiconductor, Harris, Intel, Motorola, National, Philips (formerly Signetics), and Raytheon. Our exclusive life cycle management program assures you of a dependable, continuous, cost effective, and high quality source of classic designed ICs today… and tomorrow!
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INDUSTRY SPOTLIGHT
ITAR compliance and the great regulatory maze By Kevin Deal Substantial penalties wait for global defense and aerospace manufacturers and contractors that fail to comply with International Traffic in Arms Regulations (ITAR), which exist to track military- and defense-sensitive material and to keep that material out of the hands of adversaries. Many organizations opt to mitigate this regulatory-heavy environment by using manual, labor-intensive internal processes or employing third-party compliance entities. Another approach: Enterprise software built on ITAR principles can help organizations overcome compliance concerns and ensure data, supply-chain information, products, and services are available to a global audience.
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Managing Supply Chain, Obsolescence, and Counterfeit Parts
Despite International Traffic in Arms Regulations (ITAR) regulations being in place for decades, the latest rules from the U.S. Departments of State and Commerce require companies across the world that manufacture, export, or reexport ITAR-controlled items to assess and modify their existing authorizations and restructure compliance activities. Compliance failures can result in severe punishment: As recently as January 2020, Airbus agreed to pay almost $4 billion to resolve an ITAR and bribery case. A tough environment to navigate Even with some recent streamlining, the ITAR complexity facing defense manufacturers is significant. This starts with several regulatory documents which manufacturers must meet, such as the Commerce Control List (CCL) and the United States Munitions List (USML), which both cover a number of different items. To further add to the complexity, different agencies are responsible for different types of application procedures – the Department of Commerce for the CCL items and the Department of State controlling the USML items. Each agency has its own way of wording things and may even have different meanings for the same words. Due to these differences, manufacturers must keep abreast of multiple Denied Party Lists or Specially Designated Nationals and Blocked Persons Lists; these no-go lists are issued by various departments of government, including the Department of the Treasury. The ideal end outcome would be a single point of control, with a primary enforcement and coordination agency, one IT system, and a single licensing agency. As it stands currently, however, manufacturers must come to grips with
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resource planning (ERP). It is increasingly crucial for companies to ensure that any ERP solution used for defense manufacturing has functionality specifically designed for export control.
Defense manufacturers need a fully integrated application suite which enables data to flow seamlessly between different functions including supply-chain management, manufacturing, engineering, and customer relationship management (CRM). Without access to the data, it is difficult to establish which products, parts, or transactions could put the company in jeopardy. Any business working with regulated materials needs to be able to quickly and efficiently extract this information from within its ERP system and link it with external regulatory data to stay compliant as it processes orders and other transactions. Such companies also must be able to share the data with overseas partner companies in a frictionless environment. The ITAR compliance puzzle Defense manufacturers need a fully integrated application suite which enables data to flow seamlessly between different functions including supply-chain management, manufacturing, engineering, and customer relationship management (CRM). Without access to the data, it is difficult to establish which products, parts, or transactions could put the company in jeopardy.
the fact that while many items are under ITAR control, other items are covered by the Export Administration Regulations (EAR), all while the Department of the Treasury keeps track of sanctions that are in force against foreign nations. Maintain compliance – but how? One way to remain compliant is to implement manual controls, such as hiring export-control compliance officers that attempt to keep tabs on orders and deliveries in progress to ensure that forbidden materials are not shared with anyone on the control lists. These moves, however, can be extremely time-consuming and expensive. Another option is to hire a service agency to provide analysis of the denied-party listings and consolidate that information into a database which can be accessed for a fee. Whichever compliance model is in force, export-control regulations will also have consequences for underlying enterprise systems, including enterprise www.militaryembedded.com
Instead of complex third-party solutions integrated between export control functions and ERP, a streamlined approach can be achieved with ERP that has the functionality to complete the necessary checks against third-party lists and manage orders, transactions, and other activities accordingly. (Figure 1.)
Figure 1 | Integrated ERP systems can help defense and aerospace manufacturers manage ITAR compliance. IFS photo.
There are several key functions defense and aerospace manufacturers should weigh when looking for an ERP solution to support ITAR compliance: ›› Denied-party checks: When committing to a sales order, the ERP software must check to ensure the order isn’t going to a denied party. This certainty can be achieved through a link to a database of denied parties which is compiled and updated regularly by an agency or third-party. The software must ensure that the denied-parties list is cross-checked before the order is processed.
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INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
› Management of part-specific regulatory schema: For items that might be export-controlled, the parts catalog needs to contain that information; in addition, the ERP system must indicate which regulation and regulatory body covers the part or material and the classification or rating within that schema which applies to it. › Management on the assembly level: If a manufacturer is handling an order for an assembly, an ERP application needs to record the parts within that assembly and the extent to which they are covered by different export regulations and commodity jurisdictions. › License application & usage reporting: ERP must aid in identifying, escalating, and resolving licensing issues. In addition, the software must report on and monitor the consumption of licenses by orders and manage license consumption. › Secure document management: Some documents for control items have licenses that can only be viewed by certain authorized people. ERP with embedded,
native document-management functionality will be best suited to export control. Ideally, the same user permissions used in the ERP software to manage access of sensitive data within the enterprise can be applied to the documentmanagement solution. › Control of the export of data and intangibles: The ERP system must provide some level of support in controlling processes such as shipment of a controlled product for display at an exposition or exchange of data with overseas vendors. › International requirements: Regardless of where they are based, exporters typically have operations in other countries, each with their own set of export controls regulations. ITAR compliance – there is no hiding place Costly and damaging litigation as a result of inadequate materials and equipment export control is an outcome defense manufacturers and contractors simply cannot afford. By implenting an all-encompassing ERP system, the reliance on inaccurate manual processes or expense of spending large sums on thirdparty agencies can be avoided. MES
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Kevin Deal is vice president for Aerospace and Defense, IFS North America. Kevin is responsible for all aspects of IFS in aerospace and defense within North America and has been in the A&D IT business for more than 25 years. Prior to joining IFS, Kevin held a number of roles as director of Mid-Americas and Federal at BroadVision, as well as director of national sales at Cincom. Kevin was also a logistics war modeler and former director of the DoD’s Supportability Investment Decision Analysis Center (SIDAC). Readers may reach the author at kevin.deal@ifsworld.com. IFS North America www.ifsworld.com www.militaryembedded.com
INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
Title By John McHale, Editorial Director
Counterfeit components: Risky business abstract
By Marti McCurdy
The challenge of microelectronics counterfeit prevention is to detect fake OEM parts, but what if the part is an actual OEM’s part and yet still counterfeit? The Not only is it possible, it’s common. The most counterfeited product in the global microelectronics market is not always a fake. Very often it is a true OEM original but has been altered and is not suitable for the full requirements of system performance and use in a critical military system.
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How can one identify questionable microelectronic parts? How can one know if the speed grade – or any other binning parameter purchased – will work as marked for any product not bought through an authorized distributor? For example, take an FPGA [field-programmable gate array] that has four speed grades. Speed grade #1 is priced at $350.00; speed grade #2 at $3,500.00; speed grade #3 at $35,000 and so on. In this example, the core/parent part numbers are consistently the same, with the last -XX being the unique identifier for binning (ex: SE123456789-01). The counterfeiters take the speed grade #1, change the last -01 to an -03 marking, and ostensibly make it a speed grade #3. While it is an original, it is just incorrectly marked, resulting in an inadequate product for the buyer and a large profit margin for the counterfeiters. This defect cannot be detected through standard methods of counterfeit detection; it can only be detected through a thorough electrical test of the device. It must be a thorough test, not a continuity test, not a simple rack-and-stack test, and not a test from a lab that lacks the instruments to test the device at its peak ratings. This identification requires a true test using automatic test equipment, at speed, full throttle. This caution applies to all components but is more prevalent and undetectable where components contain high-speed SerDes [serializer/deserializer] and highperformance DDR3 and DDR4+ memories.
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In 2018, Operation Chain Reaction (OCR) – a coordinated effort led by Homeland Security Investigation (HSI) along with the Intellectual Property Rights Center (IPRC) and 16 federal law-enforcement agencies – initiated 24 criminal investigations, conducted 15 criminal arrests, and helped secure 18 indictments and seven convictions. The 2018 OCR effort also performed 68 counterfeit-goods seizures, with the contraband valued at approximately $4.9 million. OCR is primarily focused on microelectronics, in part because they are used in virtually every system and they are easy to counterfeit. Counterfeit microelectronics pose a significant health and safety threat,
Figure 1 | Reports of nonconforming or suspect counterfeit semiconductor parts vs. sales, 2005-2018. Graph courtesy ERAI.
www.interfaceconcept.com
Real cost of counterfeit components Electronic parts counterfeiting was estimated to have cost U.S. semiconductor manufacturers around $7.5 billion in 2018; 69.9% ($5.24 billion) of those fake parts were integrated circuits (ICs), according to ERAI. (Figure 1.) Even the U.S. Department of Defense (DoD) supply chain is vulnerable to the risk of counterfeit parts: The DoD estimates that as much as 15% of all spare and replacement parts for military electronics turn out to be counterfeit. ICs are especially difficult to protect from counterfeiting because often they come from an overseas manufacturer and are resold by several subcontractors before a large military supplier like Lockheed Martin or Boeing embeds them in technology that it then sells to the U.S. government. www.militaryembedded.com
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Manufacturer of Ethernet switches, Intel® or NXP ARM® processor-based Single Board Computers and FPGA boards • Ethernet Switches developed in alignment with the SOSA™ Technical Standard • 3U and 6U VPX form factors • Optical VITA 66.5 standard • Switch management software stack • Expert technical support and custom-design • From standard to conduction-cooled grades For more info, contact:
Since 1987, Interface Concept has been a leading developer and manufacturer of leading-edge HPEC embedded boards and systems for military, aerospace and industrial applications. Elma Electronic Inc. is the North American sales and support provider for Interface Concept.
www.elma.com sales@elma.com • 510-656-3400
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INDUSTRY SPOTLIGHT
Managing Supply Chain, Obsolescence, and Counterfeit Parts
with the use of substandard parts potentially having catastrophic outcomes: delayed DoD missions, unreliable weapons systems, imperiled warfighter safety, and lowered integrity of sensitive data and secure networks. The U.S. Naval Air Systems Command (NAVAIR) Aging Aircraft Program estimates that as many as 15% of all the spare and replacement microchips the Pentagon buys are counterfeit. Incidents involved in counterfeit parts include a naval destroyer that failed a training launch of a Tomahawk missile; counterfeit components installed into a communications array of Coast Guard helicopters; and the discovery of counterfeit ICs in the navigation and targeting program of U.S. Navy F-14 Tomcat fighter aircraft. How it’s done In 2019, Rogelio Vasquez, the owner of PRB Logics (Costa Mesa, California) – which billed itself as a “distributor of obsolete electronic components,” – admitted to
trafficking more than 9,000 integrated circuits with a total value of $894,218 between July 2009 and May 2016. Over seven years, Vasquez bought old, used, and previously discarded ICs from Chinese suppliers; these parts had been refurbished and marked with counterfeit logos. The circuits had undergone a process known as “blacktopping,” in which existing markings on old, used, or discarded components are sanded off and remarked. The devices were painted and outfitted with altered dates, lot codes, and countries of origin and sold as new. Vasquez admitted that he instructed a Chinese testing laboratory to provide two reports on his components – one accurate report and one “sanitized” – that excluded any results that indicated the components were used, remarked, or in poor condition. Vasquez sold the counterfeit electronics as new parts made by manufacturers such as Xilinx, Analog Devices, and Intel. In 2012, Vasquez acquired and sold counterfeit circuits from China and sold components to a U.S. defense subcontractor that later ended up in a classified Air Force weapon system. In another well-known instance, from February 2007 through April 2012, Peter Picone of Massachusetts purchased millions of dollars’ worth of integrated circuits bearing counterfeit markings of approximately 35 major electronics manufacturers – including Motorola, Xilinx, and National Semiconductor – from suppliers in China and Hong Kong. Picone resold the counterfeit integrated circuits to domestic and international customers, including to defense contractors that intended to supply them to the U.S. Navy for use in nuclear submarines and other critical applications. One more example: In 2015, federal agents arrested three Chinese nationals for crimes that included selling 45 counterfeit Intel microchips to an undercover agent with the understanding the chips would be used by the U.S. Navy for a project involving submarines. Had those parts been installed in a missile-guidance system, the missiles would either not function at all or would likely not proceed to their intended target; they
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likely would have struck a completely unintended destination, according to a senior engineer at the U.S. Air Force Research Laboratory. Detection can be difficult Counterfeit parts are dangerous not because they don’t work outright, but because they nearly work, a condition some refer to as the “walking wounded.” They may perform intermittently, not to spec, or not at all. The components can degrade system performance, cause intermittent performance snags or delays, and – above all – slow memory components and throttle down all other chips on the system. Problems may not even arise until the parts have been in the application for some time. Counterfeit parts can fail at any point; they may work during testing and use where conditions are ideal, but fail under extreme environments, wider temperature and voltage ranges, or under stressed performance conditions such as those in military and space applications. Secure sources Of the electronic components being counterfeited, Xilinx is known to be the most copied brand with more than twice the number of “fakes” as compared with other manufacturers, according to reports from the ECIA [Electronic Components Industry Association]. How do companies make sure that their parts are what they say they are? Makers and distributors must manage their supply chain very tightly, perform in-house testing to qualify components, and assume full ownership of failures. Control is the key: As the OEM guarantees supply chain and component integrity, OEM-accredited and OEMauthorized testing and screening assures that components are suited for their performance, that they are not “walking wounded,” and that they are undamaged by improper testing and handling of the components post-sale by labs that may not have the proper diagnostic resources to even power up the devices as required.
and function at speed or temperature, and the explicit description of the part is paramount. Short of all of these, the end product is at risk, with no recourse and no insurance. Clearly, that’s a risk not worth taking, especially when lives are on the line. MES Marti McCurdy is the owner and CEO of Spirit Electronics, a value-added supplier of high-reliability components and supplychain solutions. She is a U.S. Air Force veteran who served the military and the space industry around the world throughout her career, starting with working on jamming radar systems for fighter jets to being a Level 3 ultrasonic specialist performing ultrasonic inspections in more than 20 countries. Spirit Electronics www.spiritelectronics.com
No Boundaries! When engineers need resistors for critical missions in a no-replace environment like Mars, they choose State of the Art. We are aboard three Mars orbiters: Odyssey, MRO, and Maven. We are aboard four rovers: Pathfinder, Spirit, Opportunity, and Curiosity, with another rover to be launched in 2020. And we are aboard the InSight lander that is studying the interior of the planet. Working toward a manned mission to Mars, NASA chose State of the Art resistors. Whose resistors will you choose for next mission?
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GUEST BLOG
Military power conversion: the value of strategic customization By Mike Eyre Customization of power supplies provides a distinct yet obvious advantage to the design engineer to meet performance specifications. Whether it be saving a card slot in a chassis, reducing the number of power supplies required, or addressing a unique EMC requirement, customization can reduce total system cost and technical risk to put increased capabilities rapidly into the hands of the warfighter. It also provides a pathway to support the Department of Defense’s (DoD’s) open-architecture standards. When approached strategically, customization can be a cost-effective and low-risk approach to address requirements. Read more of Mike’s take on custom parts at https://bit.ly/32F5Hde. The benefits of defined design standards are numerous, especially in support of open-architecture system designs that shoot for reducing life cycle costs and development time. However, the ability to deviate from design standards can be a priceless aid for engineers in order to meet the unique performance requirements prevalent in military platforms. Let’s look at a few real-world examples of this approach in practice. Example one: varying output voltage and current An engineer wants to use a commercial off-the-shelf (COTS) product with its baseline capabilities, but the specification requires specific output voltage and current levels to effectively support its rugged, single-board computer (SBC) and storage cards within the enclosure via custom backplane design. Rather than accepting the suboptimal COTS product and sacrificing the capability or performance of their existing design, the engineer should request to speak with the powersupply manufacturer’s design team. After learning about the target specification, the manufacturer’s design team rapidly implements the necessary changes to support the integration of those peripherals, providing a customized power supply that continues to comply with the vast majority of industry standards. Adjusting the outputs to meet the customer’s unique current and voltage requirements is a low-cost, low-risk, and rapid solution to enable system-level performance. Leveraging the proven performance of a mature design, this approach allows the engineer to successfully achieve qualification of the system upon first attempt and leverage the unique backplane design. While the COTS product was 90% of the solution, rapid tailoring of the product to the needs of this customer ultimately addresses the unique needs of the warfighter without significant changes to system, cost, or delivery timeline. The intent of the U.S. Department of Defense (DoD) Modular
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Open Systems Approach (MOSA) program can be addressed with architectures, such as Sensor Open Systems Architecture (SOSA)-aligned system designs. To further this point, modifying the mature design to provide increased voltage and current limits at these three outputs, and deviating from the VITA standard, ensures a second power supply was not required within the enclosure. This approach not only saved the cost of a second power supply, but also saves an open card slot to support integration of future product enhancements and capabilities. This is an excellent example of both how customization need not be considered risky or expensive, and how sticking with the VITA VPX standards to ensure an open architecture at the system level can significantly drive life cycle costs and development time down for the end user component versus system requirements. Standardization is an industry trend providing positive results for both the cost and schedule of defense programs, large and small. A fine balance between component-level specifications and system-level specifications is a key aspect in any engineering effort. An excellent example of a component-level specification is the VITA 62 VPX standard defining electrical connector parameters, including voltage and current levels. Standards such as MIL-STD-1275 may be applied at either a component level or system level to control 28 VDC electrical power in a military ground platform. It can be stated that industry appreciates and values standards at both the component and system level. However, it is often necessary to deviate from the standard to meet 100% of both component- and system-level requirements. Every system on the battlefield poses a unique set of challenges, forcing design engineers to make difficult decisions affecting cost, schedule, and risk. Customization to meet open architecture standards can be done in a cost-effective and schedule-driven environment. Example two: unique mechanical and thermal management challenges In this example, the engineer’s requirement includes the need to incorporate a redundant AC power connector into a 3U VPX power supply. This factor takes customization of a baseline VPX power supply one step further than our previous example, tailoring both mechanical and thermal design features. In this instance, a customization effort similarly reduces risk while incorporating important capabilities at a system level. As before, the project starts with the engineer identifying a mature COTS solution that closely matches the specifications they’re
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looking for, then engaging with the manufacturer’s design team to discuss the unique specifications of their requirement compared to this COTS product. In this example, the mechanical housing can be quickly designed around the board to address the redundant input power requirements (a second connector compliant to MIL-STD-38999) at the system level. Such an approach not only addresses the redundant AC power connector requirement, but also allows for improved thermal management while ensuring the integration of other COTS VPX peripheral cards. With close communication and collaboration with the manufacturer, it is realistic to complete the above design modifications and rapidly develop and test prototypes within 60 days. At the end of this exercise, a design review provides the engineer with enough confidence and data on the modified VPX power supply to begin design modifications to the enclosure and backplane to accommodate the added connector. Starting from an existing and mature MIL-VPX product that addressed a large percentage of the power supply performance specification was a no-nonsense and schedule-driven decision that enables the engineer to obtain a 100% solution for their requirement. Considering our earlier example, a VPX form factor SBC required 360 watts of power, exceeding the VITA 62 standard for the VS2 connector contact. While deviating from the VITA electrical standard, the desired 3U mechanical form factor is not changed, ensuring an open architecture system and retention of the benefits of the VPX form factor. Further, following SOSA-aligned design practices ensures the ability to maximize COTS components within the enclosure – the best of both worlds. At a system level, a standardized chassis and backplane can be maintained, along with use of peripheral devices, reducing total life cycle costs and maximizing the intended nature of standardized enclosure designs. Supporting both component- and system-level requirements is achievable by tailoring the design of standard products, which can be done in an expedited and cost-effective manner, significantly decreasing risk and keeping the project on course with existing delivery and cost projections. Example three: EMC and standardization In the ever-evolving world of defense electronics, higher power densities, increasing current and faster switching, and EMC continues to be one of the most challenging endeavors of the system designer. Modern power switches offer significantly higher switching speeds. This means that the rise and fall times for both voltage and current waveforms are much shorter – a root cause of many electromagnetic interference (EMI) issues in switching power supply design. As such, solutions to address the litany of EMI challenges need to remain agile and creative when it comes to power-supply design. Standardization on the other hand, encourages repeatability and deincentivizes change. To solve EMI issues, customization is a key element in the toolbox of the design engineer, especially in keeping with the DoD’s intent of maintaining an open-architecture approach. www.militaryembedded.com
Adjusting the outputs to meet the customer’s unique current and voltage requirements is a low-cost, low-risk, and rapid solution to enable system-level performance. To qualify a power supply, it is tested in cascade with a line impedance stabilization network (LISN) to standardize test results and simulate the run of cables feeding the tested item. Typically, power supplies installed in small platforms are allowed to be tested with low-inductance LISN, so they will not become unstable and oscillate. However, in scenarios where long cable runs are prevalent, the standard 50 μH must be used. In this example, an engineer identifies a COTS 350 watt DC/DC converter for integration into their airborne application. After engaging with the manufacturer’s design team, the engineer states that the converter must be tested for compliance with MIL-STD-461F when connected to the power line through 50 μH LISNs. The design team modifies the existing COTS product design by integrating a larger bulk capacitance to help support the 50 μH inductance requirement. Again, deviating from the VITA 62 electrical standard to rapidly address a unique EMC requirement, a close partnership with the manufacturer’s design team enables the engineer to identify a schedule-friendly, low-risk solution. Powering nonstandard loads with standard power supplies The standard VPX chassis is commonly used by integrators as an enclosure for a wide variety of applications, including radar, electronic warfare, communications, and more. Each application brings its own unique set of performance and operational requirements. In this example, an engineer needs a VPX power supply to feed a radar load, made up of digital circuits (signal conditioner), analog low power circuits (preamplifier), and analog high-power circuits (power amplifier). The form factor and connector are standard VITA 62 and 46, but the output voltages and current limits are completely different, with odd voltage levels, such as 6 VDC for the GPS board, 5.5 VDC for the wideband amplifier, and 28 VDC for the power amplifier. Not only are the voltage values not standardized, the digital and analog outputs’ return paths are required to be isolated from one another. Leveraging an existing COTS product enables a manufacturer’s design team to tailor the output voltages according to the requirement and separate the outputs into two isolated groups. This design approach helps the customer achieve a complete radar design with an integrated power solution in a single VPX chassis, all of which can be completed in a short schedule of less than three months from engagement to delivery, and aligning to recent open architecture acquisition directives, such as SOSA and MOSA. MES Mike Eyre is global marketing manager at Milpower Source in Belmont, New Hampshire. Milpower Source • https://milpower.com
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RESOURCE GUIDE PROFILE INDEX ARTIFICIAL INTELLIGENCE/ MACHINE LEARNING
EMBEDDED HARDWARE – CONTINUED
GSI Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Memkor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
One Stop Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
MPL AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
LCR Embedded Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
MilSource . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
AVIONICS
Omnetics Connector Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
GSI Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
JMR Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Opal Kelly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Spirit Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Pentek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
VPT Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
COMMUNICATIONS
RTD Embedded Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . 87-89 X-ES/Extreme Engineering Solutions . . . . . . . . . . . . . . . . . . . . . . . 89
Analog Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Vector Electronics & Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Dolphin ICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Zmicro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 JMR Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
CYBERSECURITY
EMBEDDED SOFTWARE Lauterbach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91-93
Aitech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
HARDWARE
Wolf SSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Annapolis Micro Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
ELECTRONIC WARFARE
OPENVPX
TE Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Annapolis Micro Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
EMBEDDED HARDWARE
POWER SUPPLIES
ACCES I/O Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60-62
Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Milpower Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Advantech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Annapolis Micro Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64, 65
SIGNAL PROCESSING
Apacer Memory America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65, 66
Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Crystal Group . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Dedicated Computing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Dolphin ICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
SPACE ELECTRONICS & SERVICES
Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Apogee Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Eurotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Radiation Test Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Galleon Embedded Computing . . . . . . . . . . . . . . . . . . . . . . . . . 71, 72
Renesas Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
General Micro Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73-78
TopLine Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Holt Integrated Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
TEST & MEASUREMENT
JMR Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Ellisys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100, 101
50 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
Gemini® Chip and Leda-G® Board To meet the demand for faster deep learning processors, GSI Technology has developed a patented processing technology called the Gemini® Associative Processing Unit (APU). The Gemini APU features massive parallel data processing, compute, and search in-place, directly in the memory array. Gemini’s architecture enables program instructions to be broken down into basic operations that can be performed in parallel. The microcode orchestrates these parallel operations, utilizing Single Instruction, Multiple Data (SIMD), allowing multiple processing elements to perform the same operation on multiple data points, simultaneously. GSI’s in-place associative computing technology eliminates bandwidth-costly data transfers between the memory and processor. Data is accessed by content (or value) and processed in-place in the memory array. The result is an orders of magnitude performance-over-power ratio improvement compared to conventional methods that use CPU and GPGPU (General Purpose GPU) along with DRAM. Gemini performs simple logic operations – with the aid of additional patented logic – directly on the bitline (an array of memory cells) of a standard SRAM memory array. Millions of bitlines become millions of processors. By combining fast Boolean and memory operations, Gemini’s microcode instructions can significantly improve certain complex functions that can be so decomposed; particularly when required to operate on large datasets. The microcode can control all bitlines simultaneously, but also perform operations on a subset of the data, through conditional execution of the microcode, per bitline. Gemini also has patented technology for performing neighborhood operations – such as convolutions – on a set of bitlines.
FEATURES Ą Fast ANN database search supporting 1B, 40B, and greater sizes Ą Fast query-by-query performance Ą Unlimited linear scalability
Ą Lowers system power by a factor of 3.5 in many search
applications vs. CPU alone
Ą Demonstrated radiation performance for harsh environments Ą PCIe card for standard server installation
Ą Configurable for mobile server applications
Ą Flexible bit-configurable structure supports variable precision
data types and large 8096-bit signatures
Ą Simplified use model with available APIs, libraries, code generator,
and compiler
Ą Support for space and rugged application environments Ą Available now
Gemini’s in-place design delivers flexible processing power that can be fully utilized for a wide range of functions including transpose, top-k, conv2d, maxpool, SHA, and SoftMax. The APU also allows fast data storage, retrieval, and search. This makes the Gemini APU a tremendous hardware accelerator for large data similarity search applications, as well as certain signal processing functions. Current applications include molecular search, Automatic Target Recognition (ATR), DSP, signal classification, and object recognition. www.gsitechnology.com/APU
GSI Technology
www.gsitechnology.com/APU www.militaryembedded.com
associativecomputing@gsitechnology.com
www.linkedin.com/company/gsi-technology MILITARY EMBEDDED SYSTEMS Resource Guide
408-331-8800
@gsitechnology September 2020 51
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Artificial Intelligence/Machine Learning
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Artificial Intelligence/Machine Learning
OSS Rugged GPU Accelerated Server The OSS GAS-Rugged offers unprecedented compute density, performance, and flexibility in the first 10 PetaOPS† AI system for rugged edge computing environments. OSS GAS-R features the world’s most advanced accelerator, the NVIDIA A100 Tensor Core GPU, enabling AI on the Fly® customers to consolidate training, inference, and analytics into a unified, deployable AI solution at the edge. With available rack and flange mounting options, adaptable power subsystem and unheard-of performance in a modest 23" depth aluminum enclosure the GAS-R excels in demanding autonomous driving vehicle and airborne applications with true “Datacenter in the Sky” capability. AI on the Fly applications require computing power that can perform an enormous amount of calculations per second. Increasing the compute density of each server node dramatically reduces the number of servers required, resulting in huge savings in cost, power, and space consumed, all tenets of edge AI deployments. Whether your application needs enhanced AI model compute power, high-dimension matrix multiplication, loading and transforming large datasets or scale out inference, eight A100 GPUs with 320 GB high-bandwidth memory, interconnected with six NVSwitches using 3rd generation NVLink at 600GB/s aggregate bandwidth will handle just about any task.
The complete OSS GAS-R solution incorporates building blocks across hardware, networking, software, libraries, and optimized AI models and applications from NGC™. Representing the most powerful end-to-end AI and HPC platform for high-end edge applications, it allows researchers to deliver real-world results in the real world instead of in a sterile environment and deploy solutions into production at scale. †
INT8 inference with sparsity
FEATURES Ą 8x A100 GPUs with 4.8TB/s Aggregate NVLink Bandwidth Ą 8U x 23" Depth Enclosure Ą Up to 64 Core AMD Epyc 7002 or Intel Scalable Processors Ą Up to 4TB System Memory Ą Over 200TB PCIe Gen4 NVMe storage Ą Four 200Gb/s NICs Ą System monitoring and control through BMC Ą MIL-STD 810G Tested Ą AC (50-400Hz) and DC power options
www.onestopsystems.com
One Stop Systems
www.onestopsystems.com 52 September 2020
sales@onestopsystems.com
877-438-2724 or 760-745-9883 _OneStopSystems
www.linkedin.com/company/one-stop-systems
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
Rad-Hard and Rad-Tolerant Memories for A&D GSI Technology’s inaugural projects in the Aerospace and Defense industry are groups of Radiation-Hardened and Radiation-Tolerant synchronous SRAMs:
•
A family of SigmaQuad-II+ products: available in 288Mb, 144Mb, and 72Mb densities, x18 and x36 configurations, On-Die Termination (ODT), and up to 350 MHz performance
•
A family of SyncBurst & NBT products: available in 144Mb, 72Mb, and 36Mb densities, x18 and x36 configurations, and up to 333 MHz performance
These Rad-Hard SRAMs serve as a critical element for advanced systems that leverage leading-edge FPGAs, ADCs, and DACs that until now lacked the high density, high performance, and power efficiency that our outstanding memory products bring. These devices are qualified to Class-Q and Class-V levels to meet the rigorous requirements of aerospace and defense customers. For our satellite and defense customers that have been anxiously awaiting an alternative to current Rad-Hard memory solutions, our Rad-Hard SRAMs leverage our proven commercial technology and architecture with radiation-hardening, creating an efficient, high performance, leading-edge memory at the 40nm technology node. For less robust applications, GSI offers Radiation-Tolerant SRAMs, as well.
GSI Technology
FEATURES Ą Aerospace-Level Products Ą SigmaQuad/DDR-II+, Synchronous Burst, and No Bus
Turnaround
Ą Speeds up to 350 MHz Ą Qualified to Class-Q and Class-V Levels Ą JEDEC-standard Pinout and Package Ą Proven Technology and Architecture Ą High Performance
www.gsitechnology.com/Aerospace-and-Defense
aerospace@gsitechnology.com
www.linkedin.com/company/gsi-technology
www.gsitechnology.com/Aerospace-and-Defense
408-331-8800
@gsitechnology Avionics
DDR4 DRAM – Upscreened (MT40A1G16RC-062E) The demand in the Aerospace and Defense business to move toward the newer platform of DDR4 DRAM has put the Micron DDR4 family in the crosshairs for design applications from Spirit Electronics, the A&D distributor for Micron. The advantages of DDR4 in reduced memory power demand and low voltage standards is accentuated by the migration to a higher speed I/O on the DDR4. Compared to the DDR3, the DDR4 has better enablement for larger-capacity memory subsystems with densities from 2Gb-16Gb, almost double that of the DDR3. Coupling that with doubling of the internal banks from 8 to 16 and Bank groups (BG) from 0 to 4, gives the DDR4 the advantage for faster burst accesses. With Spirit's ability to screen and qualify this device for Aerospace and Defense, this has given our customer base an excellent opportunity to migrate any DDR3 applications to the Micron DDR4 for use with the latest FPGA technologies and memory use applications, with easy migration to DDR5 when applicable. The Screened DDR4 is fully characterized and tested over extended temperatures at full speed, which is the only way to verify the device can withstand the harsh environments of the A&D market.
Spirit Electronics
www.spiritelectronics.com www.militaryembedded.com
FEATURES Ą Ą Ą Ą Ą Ą Ą
Voltage (core and I/O) 1.2V VREF inputs = 1-CMD/ADDR (VREFDQ now internal) Data Rate (Mb/s) = 1600, 1866, 2133, 2400, 2666, 3200 Densities = 2Gb-16Gb tCK-DLL enabled 667 MHz to 1.6GHz tCK-DLL disabled Undefined to 125MHz Part Number Family: MT40A1G16RC-062E
info@spiritelectronics.com
www.linkedin.com/company/spirit-electronics/ MILITARY EMBEDDED SYSTEMS Resource Guide
480-998-1533 @SpiritDisti
September 2020 53
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Avionics
Military Embedded Systems Resource Guide
Avionics, Communications, Embedded Hardware
Keeping Pace with Military Technologies As a pioneer for advancements in new military technology and aeronautics, JMR Electronics, Inc. (JMR/ICS) has manufactured thousands of costeffective custom, semi-custom and COTS products in support of US and worldwide government defense and research programs over the past 35+ years. By continuously developing complex solutions for our customers’ global defense infrastructure, we build military network and systems solutions as well as high-performance information systems that secure and transmit highly sensitive data around the world. Our real-time computing and data storage systems provide a sturdy foundation for intelligence professionals to fulfill their duties to the highest potential on any given mission, 24/7. And our products are all proudly “Made in the USA”.
Providing the Best in ISR, Network & Data Storage Our multitude of high speed, state-of-the-art storage duplication devices and computer forensic systems are relied upon to effectively manage sensitive data, handling system tasks quickly and reliably for decades. Military technology evolves rapidly, so JMR/ICS works diligently to contribute to the growth and efficiency of new technologies by developing the latest advanced storage, network solutions, data management and forensic analysis products.
Extensive Capabilities for Military Missions JMR/ICS develops rugged, air- and conduction-cooled systems chassis and primary/backup power systems for either military-specification or industrystandard types and sizes. We can design from the ground-up or modify our existing extended-series of COTS subsystems. System platforms include manned and unmanned airborne vehicles and above and below water shipborne systems, ground-fixed, ground mobile, permanent and temporary emplacements operating and surviving reliably in the harshest military environments. Our highly skilled engineers can take notional or refined system requirements from initial design, to development and prototypes to qualification and production manufacturing – quickly and cost-effectively – while meeting delivery schedules and design-to-cost targets with program management oversight, as required.
Proven Technology; Trusted Performance For more than three decades, JMR/ICS has been recognized as a worldwide leader in the development and production of forensics and IT/enterprise disk duplication products as well as for mil & aero, embedded, COTS and custom-based products, focusing on subsystem enclosure/chassis design and production. This powerful technological leadership in multiple markets is further enhanced by the synergistic blend of small company innovation, agility and responsiveness.
FEATURES Ą
Qualified for air, land, sea or LEO space
Ą
Rugged air- and conduction-cooled
Ą
Ą
Ą
Ą
Latest high-speed serial or parallel bus profiles and architectures Modular single or redundant power supplies, with or without JMR’s primary Power-assist™ battery backup Wide input voltage range from 115 VAC 50-400 Hz single- or three-phase, 28 or 270 VDC, etc. Sophisticated wire harness/cable assemblies or modular rigid/flex cable assemblies and interconnects
Ą
Copper, fiber optic or hybrid interconnect assemblies
Ą
MIL-DTL-38999 or standard PC connectors, as needed
Ą
Designed and manufactured in the USA
The Value of JMR/ICS Products & Services Encompass: Ą
Leading-edge technology excellence
Ą
Cost-effective customization
Ą
SWaP-optimized and small form factors (SFFs)
Ą
Subsystem integration
Ą
ISO-9001-certified quality system
Ą
World-class technical support and customer service www.jmr.com
JMR Electronics, Inc. www.jmr.com 54 September 2020
dpatterson@jmr.com
818-739-1140
www.linkedin.com/company/jmr-electronics-inc./
MILITARY EMBEDDED SYSTEMS Resource Guide
twitter.com/jmrelectronics www.militaryembedded.com
VXR Series Hi-Rel COTS DC-DC Converters VPT’s high-reliability VXR Series of DC-DC converters are optimized for a broad range of applications from military ground vehicles to commercial and military aircraft and is intended for harsh environments including severe vibration, shock and temperature cycling.
FEATURES 7 to 250 Watts Ą Wide input voltage range: 9 V to 60 V Ą Single outputs of 3.3V, 5V, 7V, 12V, 15V, and 18V Ą Rugged epoxy encapsulated V-SHIELD® package Ą Fully compatible with aqueous cleaning processes Ą -55 °C to +105 °C operation Ą Integral EMI shield Ą Dual-sided thermal conduction Ą
The VXR Series patented epoxy encapsulated V-SHIELD® packaging is highly resistant to chemical, solvent and salt environments and is fully compatible with high volume manufacturing processes including wave solder, cleaning solvents, high pressure sprays, and aqueous wash processes. A unique integral six-sided metalized shield improves system EMI compatibility. Dual sided conduction cooling coupled with reduced power dissipation simplifies system thermal design.
Proven Power Conversion Solutions for Mission Critical Applications
VPT’s product designs are based on decades of proven heritage and deliver high-reliability at a reasonable cost.
VPT, Inc.
www.vptpower.com
vptsales@vptpower.com
425-353-3010
https://www.linkedin.com/company/vpt-inc-
@vptnews
Communications Application MPI
eXpressWare™ software enables Military applications to easily migrate to
SISCI - Shared Memory API
PCIe Networks using standard PCI Express. It supports a low level direct remote memory access API – SISCI API, a sockets API – SuperSockets™, and SmartIO technology. The SISCI API enables customers to time efficiently exploit the PCIe model. It offers a C programming API for shared/remote memory access, including reflective memory/multi-cast, peer-to-peer memory transfers, RDMA capabilities, and direct support for FPGAs, GPUs, or any combination of communication with FPGAs, CPUs, GPUs or system memory over PCIe. SuperSockets™ enables applications to benefit from a low-latency high throughput PCIe network without any modifications. It delivers maximum application performance without application changes. SuperSockets™ is a unique implementation of the Berkeley Sockets API that capitalizes on the PCIe transport to transparently achieve performance gains for existing socket-based network applications. PCIe SmartIO is a collection of software for PCI Express enabling customers to utilize standard PCIe devices in a new and flexible way. It includes capabilities to share devices and includes features for device lending, hot adding transparent devices and sharing PCIe endpoints. eXpressWare™ is a complete software suite that supports Linux, Windows and VxWorks. Dolphin supports both standard and custom designs.
www.dolphinics.com www.militaryembedded.com
Socket Switch
User Space SuperSockets
eXpressWare PCIe Software Suite
Dolphin ICS
NVMe Lib
Device Driver
SISCI SmartIO
Device Lending
TCP/IP Stack
Windows User SuperSockets
IP-Driver
IRM - Interconnect Resource Manager
IP- Driver
Ethernet Hardware
PCIe Hardware Failover Support
FEATURES Ą PCIe Gen 1, 2, 3, 4 and beyond support Ą Address based Multi-cast/reflective memory Ą Point-to-point and switched network support Ą Low latency direct memory and peer-to-peer transfers Ą Operating systems – Windows, Linux, VxWorks,
and RTX
Ą FPGA and GPU direct memory transfers Ą Microsemi, Broadcom, IDT and Intel NTB support
info@dolphinics.com
+1 469-482-2140
www.linkedin.com/company/dolphin-interconnect-solutions MILITARY EMBEDDED SYSTEMS Resource Guide
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Avionics
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Communications
ADRV9002 High Dynamic Range Integrated Radio Transceiver for Mission Critical Communications Applications Analog Devices introduced the first direct conversion highly integrated radio ICs for cellular wireless infrastructure in 2013. Commercial cellular networks have become ubiquitous in their deployment. The limited spectrum availability and growing usage within the cellular bands has resulted in many challenging adjacent channel blocking conditions for mission critical communications applications. Never before, has it been more important to develop technology for our first responders and armed forces to communicate effectively across highly congested spectrum. Analog Devices is introducing the first agile software defined radio (SDR) capable of handling narrow band Evaluation Board KHz signals for critical voice applications and/or wideband signals up From a performance perspective the ADRV9002 builds upon ADI’s to 40MHz. The new ADRV9002 is a dual channel SDR that operates transceiver legacy and offers an effective receiver dynamic range of from 30MHz to 6000MHz. 150dBc/Hz. The high dynamic range is achieved through the use of high performance front end mixers and sigma delta converter technology. The ADRV9002 provides a level of performance, flexibility and agility This allows the ADRV9002 to absorb the signal of interest and close not available in integrated radio ICs as the design complexity becomes in blockers and down convert them to digital. The ADRV9002 does inordinately more difficult. not rely on the analog baseband filters shown in the block diagram for The ADRV9002 has two independent receivers and transmitters and rejection. This enables the use of full bandwidth and capturing multitwo separate LOs, all can be enabled and disabled for a given applicacarrier signals. tion. Each receiver or transmit path interface is serialized and made The ADRV9002 allows the user to dynamically change the perforavailable. mance and power and the operating profile (sample and data rate). Unique to the ADRV9002 either of the two integrated independent This flexibility enables adaptability for different waveform and or data LO synthesizers can be routed to any of the receivers or transmitters. rates on demand. Allows FDD and TDD offset LO operation, MIMO and or wide bandShown below is basic block diagram of the ADRV9002 and key features. width dual receiver architectures.
FEATURES Ą Frequency Range 30MHz to 6000MHz Ą Radio Signal Bandwidth 12KHz to 40MHz Ą Simplified Serial Interface LVDS or CMOS Ą Low Power Monitor / Sleep Modes Ą Automatic Gain Control Ą Digital Pre Distortion Ą Multi Chip Synchronization Ą Fast Frequency Hopping Ą Radio Impairment Corrections Algorithms Ą Small Footprint 12 x 12 mm CSP_BGA
www.analog.com/adrv9002
Analog Devices Inc www.analog.com 56 September 2020
https://ez.analog.com/r?1
MILITARY EMBEDDED SYSTEMS Resource Guide
781-329-4700 / 1-800-262-5643
www.militaryembedded.com
ComEth4590a – VPX 10/40 GbE Layer 3 switch The ComEth4590a is the first and only 3U VPX 10/40 Gigabit Ethernet Layer 3 switch currently on the embedded market which has two separate and independent on-board Ethernet switch matrices – one for the Data Plane and one for the Control Plane. These two separate switch matrices or packet processors are managed by two independent dual core processors. Each matrix supports separate instances of Interface Concept Switchware network management which allows independent network configuration for features such as network optimization, monitoring and security. In addition to offering the outstanding switching capabilities you’ve come to expect from Interface Concept, this high-performance Layer3 switch can be remotely configured by the Switchware web interface, SNMP or CLI interfaces. It features a total of 41 SerDes or Lanes routed to the rear VPX connectors as 1000Base-KX, 10GBase-KR or even 40GBase-KR4 ports and to the front panel as 10GBase-SR or 1000Base-SX fiber optical ports. Moreover, the Cometh4590a is fully compatible with the Intelligent Platform Management Interface (IPMI) required by the most recent high performance VPX systems, and it supports Precision Time Protocol (PTP) IEEE 15888-2008 (v2) for networks requiring sub-microsecond synchronization capabilities throughout the IP network.
Interface Concept
www.interfaceconcept.com
FEATURES Ą 3U VPX 10/40 Gigabit Ethernet Layer 3 switch Ą 2*on-board Ethernet switch matrices Ą 2*dual-core processors Ą Switchware network management Ą 41*SerDes or Lanes Ą 1000Base-KX, 10GBase-KR or even 40GBase-KR4 ports
(rear)
Ą 10GBase-SR or 1000Base-SX fiber optical ports (front)
www.interfaceconcept.com
info@interfaceconcept.com www.linkedin.com/company/interface-concept
510-656-3400
Communications ComEth4070e – 6U VME 1/10/40 Gigabit Ethernet Switch The ComEth4070e is a cutting-edge 6U VME Layer 2/3 Ethernet switch, offering up to 32*1/10/40 Gigabit Ethernet ports. The switch integrates a high performance Marvell System On-aChip that supports up to 320 Gbps packet throughput. Different board configurations are possible going from a version that includes 24 rear Gigabit Base-T Ethernet ports and 8 front SFP+ (1/10Gbps) to a version that includes 20 rear Gigabit Base-T Ethernet ports, 8 front SFP+ (1/10Gbs) and a front panel mezzanine. Various types of front-panel mezzanine exist to offer a QSFP+ interface (40Gbps), 4 SFP+ (1/10Gbps) or two 10GBase-T ports. In addition, a comprehensive switch management stack, called Switchware, is running on the ComEth4070e on-board processor and supports a rich set of Layer 2/3 features that can be controlled through a Graphical User Interface. The ComEth4070e can also be managed via a serial interface (serial or TELNET or SSH) and SNMP (SNMPv2 and v3).
FEATURES Ą Managed Layer 2+/3 Ą Up to 32 ports Ą SFP+ (front) Ą 10/100/1000Base-T (rear)
The ComEth4070e is available in standard, extended, rugged aircooled and conduction-cooled grades.
Ą VME 64x compliant
www.interfaceconcept.com
Interface Concept
www.interfaceconcept.com www.militaryembedded.com
info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept
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Electronic Warfare
OUTCOMPUTE THE ENEMY Lighter, faster, and tougher: TE Connectivity’s (TE) MULTIGIG RT 3 connectors and MULTIGIG RT 2-S connectors deliver unmatched reliability in embedded computing and OpenVPX systems. The lightest design ever achieved in any comparable backplane connector, the MULTIGIG RT 3 connectors and MULTIGIG RT 2-S connectors owe their strength and performance to durable, weight-saving thermoplastic and copper alloy construction. These backplane connectors have been rigorously tested and proven in military, avionics, ground defense, missile defense, and space applications. As our warfighters become increasingly dependant on technological innovation, we’re excited to expand our offering of VPX-compliant solutions that support 10G Ethernet, RapidIO, InfiniBand, HyperTransport, and other high-speed protocols.
FAST • Enhanced PCB wafer and contact design supports increased bandwidth up to 25+ Gb/s FLEXIBLE • Meets interface requirements for VITA 46 connectors allowing backward compatibility with legacy VPX products • Customizable to meet unique application requirements MODULAR • Modular design enables numerous configurations by interchanging higher-speed MULTIGIG RT 3 connectors with the legacy MULTIGIG RT 2 connectors and MULTIGIG RT 2-R connectors RUGGED • Contact design utilizes quad redundant contacts for optimum performance in shock and vibration
Visit te.com/embeddedcomputing to learn more.
TE Connectivity
te.com/embeddedcomputing 58 September 2020
800-522-6752 @TEConnectivity www.linkedin.com/company/te-connectivity/
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
???? Cybersecurity in Intel Xeon SBCs Help Protect Data Both On-site and Remotely The need for reliable, secure, protected data is top of mind in any missioncritical application, from safeguarding assets to ensuring proper system operation. Recognizing the increasing number of potential tamper attacks and theft of data in embedded systems, Aitech Group developed the AiSecure™ cybersecurity architecture. This proprietary set of tools, currently available on the Intel Xeon-based C875 and C877 SBCs, help protect against data breaches from remote threats as well as those found at the system site itself. Comprised of a set of trusted hardware and firmware, AiSecure provides the tools to maintain a highly secured system and supports a wide range of user-defined security policies, including system element integrity, access permissions and authentication of system resources and external interfaces. These security mechanisms protect embedded systems against threats such as theft of control, theft of intellectual property, theft of secrets and cloning. The AiSecure architecture works in tandem with Intel’s inherent security features, which include the Trusted Platform architecture, Secure Boot and BIOS Guard based on Intel’s TXT, TPM 2.0 and BIOS security SSD.
C877-Rugged 3U VPX using Intel Xeon D
FEATURES
The new C877 provides one of the most powerful combinations of data processing and cybersecurity for rugged, high reliability, mission-critical environments that need high levels of data security and peak processing performance. It combines the latest generation 16-core Intel Xeon D processor and up to 1 terabyte of onboard security-protected SATA SSD with an optional, large onboard Xilinx Zynq UltraScale+ FPGA. The Zynq FPGA contains user-programmable code to independently monitor onboard I/O ensuring data to/from the C877 is legitimate and authorized depending on the application. It also employs a high-bandwidth bus architecture and offers versatile onboard I/O interfaces, with an XMC site for additional I/O options.
Complementing its data protection advantages, the C875 offers powerful performance attributes with three independent Intel UHD graphics ports, an onboard Microsemi SmartFusion FPGA (with ARM core) and exceptional storage capacities as well as a host of standard I/O. It uses the Intel Xeon E with a 6-core (12-thread) architecture and 12 MB of Smartcache to deliver an impressive 2.7 GHz of performance that increases up to 4.4 GHz when Turbo Mode is enabled. Complete with an 8-lane PCIe Gen 3 VPX data plane, the SBC offers several VITA 65 OpenVPX slot profiles to meet different configurations.
www.aitechsystems.com www.militaryembedded.com
Ą
Firmware and hardware-based measures for increased data security
Ą
Protects against theft of control, IP, secrets and cloning
Ą
Works in tandem with Intel’s inherent security features
Ą
Supports a wide range of user-defined policies
SBC TECHNOLOGY HIGHLIGHTS Ą
C875-Rugged 3U VPX using Intel Xeon E
Aitech
AiSecure™ CYBERSECURITY ARCHITECTURE
Ą
Ą Ą
Rugged 3U VPX SBCs for harsh applications High performance, high reliability processing • C875: 6-core (12-thread) Intel Xeon E • C877: 16-core Xeon D Large memory resources such as 1 TB Onboard SSD Versatile I/O including USB 3.0 & 2.0; Serial; SATA III; Discrete; GbE
Ą
Expandable through standard XMC slot w/PCIe x8 Gen3
Ą
8 Lane PCIe Gen3 VPX Data Plane
sales@aitechsystems.com
www.linkedin.com/company/Aitech
888-Aitech-8
@AitechDefense
MILITARY EMBEDDED SYSTEMS Resource Guide
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Cybersecurity
Military Embedded Systems Resource Guide
Cybersecurity
wolfSSL Embedded TLS Library wolfSSL provides embedded security solutions with an emphasis on speed, size, portability and standards compliance. wolfSSL is the #1 TLS and the first embedded TLS 1.3 implementation with TPM 2.0, MQTT, SSH, Secure Boot, hardware crypto acceleration, a strong history in FIPS, and support for DO-178. wolfSSL is the most comprehensively tested and supported crypto available, securing more than 2 billion connections world wide! All products are backed by 24/7 support. The wolfCrypt cryptographic module is FIPS 140-2 Level 1 validated, with certificates #2425 & #3389. wolfCrypt will be the first implementation of FIPS 140-3.
wolfSSL
www.wolfssl.com
FEATURES Ą SSL 3.0 and TLS 1.0, 1.1, 1.2 and TLS 1.3! (client and server) Ą DTLS 1.0 and 1.2 support (client and server) Ą Minimum size of 20-100kb Ą Runtime memory usage between 1-36kb Ą OpenSSL compatibility layer Ą ECC and RSA Key Generation Ą FIPS Ready
www.wolfssl.com
facts@wolfSSL.com
www.linkedin.com/company/wolfssl/
+1 425-245-8247 @wolfSSL
Embedded Hardware
ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easyto-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM. Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more are also available.
ACCES I/O Products, Inc.
www.accesio.com/eth-dio-48 60 September 2020
FEATURES Ą Ethernet 10/100 RJ45 connector for interfacing to CPU or network Ą 48 or 24 channel high-current TTL digital I/O lines Ą Compatible with industry standard I/O racks such as Grayhill, Opto 22,
Western Reserve Controls, etc.
Ą Eight-bit ports software selectable for inputs or outputs Ą All 48 digital I/O lines buffered with 32 mA source/64mA sink current
capabilities
Ą Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring, Ą Ą Ą Ą
pulled down to ground or floating Resettable 0.5A fused +5VDC output per I/O connector OEM version (board only), features PC/104 size and mounting compatibility Small, (4"x4"x1.7") rugged, steel industrial enclosure LVTTL (3.3V) and -40°C to +85°C industrial operating temperature available as factory options
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
MILITARY EMBEDDED SYSTEMS Resource Guide
858-550-9559 twitter.com/accesio
www.militaryembedded.com
mPCIe-COM Family PCI Express Mini Cards ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port-by-port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource. Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits. The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.
ACCES I/O Products, Inc. www.accesio.com
FEATURES Ą PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O
connectors
Ą 4 or 2-port serial communication cards with optional DB9M connectivity Ą Software selectable RS-232, RS-422, and RS-485 protocols, per port
stored in EEPROM
Ą High performance 16C950 class UARTs with 128-byte FIFO for each
TX and RX
Ą Port-by-port field selectable termination for RS-422/485 applications Ą Industrial operating temperature (-40°C to +85°C) and RoHS standard Ą Supports data communication rates up to 3Mbps simultaneously,
(RS-232 up to 921.6 kbps)
Ą Custom baud rates easily configured Ą ±15kV ESD protection on all signal pins Ą CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully
supported
Ą RS-232 only and RS-422/485 versions available
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
858-550-9559 twitter.com/accesio
Embedded Hardware
mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232/422/485 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming. The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out. The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.
ACCES I/O Products, Inc. www.accesio.com
www.militaryembedded.com
FEATURES Ą PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors Ą 4 or 2-port mPCIe RS232/422/485 serial communication cards Ą Tru-Iso™ 1500V isolation port-to-computer and 500V isolation
port-to-port on ALL signals
Ą High performance 16C950 class UARTs with 128-byte FIFO for each
TX and RX
Ą Industrial operating temperature (-40°C to +85°C) and RoHS standard Ą Supports data communication rates as high as 3Mbps – 12MHz with Ą Ą Ą Ą
custom crystal Custom baud rates easily configured ±15kV ESD protection on all signal pins 9-bit data mode fully supported Supports CTS and RTS handshaking
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
858-550-9559 twitter.com/accesio
MILITARY EMBEDDED SYSTEMS Resource Guide
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Embedded Hardware
Military Embedded Systems Resource Guide
Embedded Hardware
USB3-104-HUB – Rugged, Industrial Grade, 4-Port USB 3.1 Hub Designed for the harshest environments, this small industrial/military grade 4-port USB 3.1 hub features extended temperature operation (-40°C to +85°C), locking USB and power connections, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104-sized and can easily be installed in new or existing PC/104-based systems as well. The USB3-104-HUB makes it easy to add USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Security, Embedded OEM, Laboratory, Kiosk, Military/Mission Critical, Government, and Transportation/Automotive. This versatile four-port hub can be bus powered or self (externally) powered. You may choose from two power inputs (power jack and terminal block) to provide a full 900mA source at 5V on each of the downstream ports. Additionally, a wide-input power option exists to accept from 7VDC to 28VDC. All type A and type B USB connections feature a locking, high-retention design.
ACCES I/O Products, Inc.
FEATURES Ą Rugged, industrialized, four-port USB 3.1 hub Ą USB 3.1 Gen 1 with data transfers up to 5Gbps (USB 2.0 and 1.1 compatible) Ą Extended temperature (-40°C to +85°C) for industrial/military grade applications Ą Locking upstream, downstream, and power connectors prevent accidental disconnects Ą SuperSpeed (5Gbps), Hi-speed (480Mbps), Full-speed (12Mbps), and Low-speed (1.5Mbps) transfers supported Ą Supports bus-powered and self-powered modes, accessible via DC power input jack or screw terminals Ą LED for power, and per-port RGB LEDs to indicate overcurrent fault, High-Speed, and SuperSpeed Ą Wide input external power option accepts from 7-28VDC Ą OEM version (board only) features PC/104 module size and mounting compatibility
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
www.accesio.com
858-550-9559 twitter.com/accesio
Embedded Hardware
SOM-9590 SOM-9590 delivers powerful server-grade performance powered by
Intel® Xeon® processors and integrated with two 10GBASE-KR interfaces to help fulfill ever-increasing computing application demands in the area of edge networks. Users can take advantage of SOM-9590’s native 10GBASE-KR interface to design 10GbE carrier boards. TPM 2.0 is secured with 128bit capability (up to 256bit), a secure boot, and frozen BIOS to provide the best possible protection for user applications. SOM-9590 features many design elements that fulfill the requirements of demanding environments. All components, including the processor, DDR4 memory, and SSD storage use onboard design, meet industrialgrade standards, and are IPC-A-6012 class 3 compliant in the hardware and layout phase. With certification from the MIL-STD-810G standard, SOM-9590 meets the exact demands of military applications. It’s capable of survival at vibration 7.7Grms (Method 514.7C-4), operating at a 50,000 feet altitude (Method 500.6 Procedure II), and it can perform in a -40 ~ 85°C temperature range. SOM-9590 has the IPC-A-610G Class 3 qualification – defined by IPC-org as fulfilling the highest quality product demands for critical applications.
FEATURES Ą COM Express R3.0 Basic Module Type 7 pin out Ą Intel® Xeon® Processor D-1500 Product Family Ą Solder-down Memory and SSD w/ ECC
Ą High speed Ethernet (dual 10GBASE-KR interfaces, one GbE) Ą Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
Ą Supports iManager, WISE-PaaS/DeviceOn and embedded
software APIs Ą Certified by Miltary Standard MIL-STD-810G
www.advantech.com/products/770fe072-dea9-417c-8475-21218b711d12/som-9590/mod_a5d378d2-b213-46a2-b756-c0824ac5eaf5
Advantech
www.advantechusa.com/military/ 62 September 2020
Militaryinfo@advantech.com
1-949-420-2500
www.linkedin.com/showcase/advantech-embedded-boards
MILITARY EMBEDDED SYSTEMS Resource Guide
@Advantech_USA www.militaryembedded.com
ADLMES9200 Series Rugged Chassis Systems ADL Embedded Solutions’ (ADLES) new ADLMES9200 chassis is a low weight, competitively priced and highly durable IP67 solution specifically designed for rugged applications including MIL-STD 810G shock and vibration and MIL-STD 461F/704F/1275D compliant systems. The ADLMES9200 is compatible with all ADLES’ full catalog of Intel-based PC/104 and 3.5" computer boards which range from low-power Intel Atom to the latest Intel Core i5/i7 processors. ADLES Power supplies feature >500,000 hours MTBF with options for MILCOTs filtering.
Applications Military/Defense:
• • • •
Ground Vehicles Computing Mission/Payload Computing Secure Communications SWaP-Constrained systems for mobile, airborne, and unmanned vehicles
Heavy Industrial:
• Traffic Technology and Monitoring
• Transportation • Energy Industries • Port Security
Features Ą Two COTS sizes available plus custom designs per customer
specifications
Ą Support for Passive Fanless and High-Power Conductive-Cooled
Designs
Ą Uni-body Construction with minimal Gasket Interfaces Ą SWaP-Optimized for Size, Weight or Power Constrained Applications Ą Front I/O Plate can be easily customized for feature and function Ą Designed for:
• MIL-STD 810 Rugged Applications • Optional MIL-COTS Filter for MIL-STD 461 EMI Compliance • Optional MIL-COTS Filter for MIL-STD 704/1275 Power for Military Ground Vehicles and Avionics
Customization At ADLES, we recognize the challenges that our clients face in designing, developing and maximizing embedded systems for specific applications. For over 25 years, we offer consistent and robust technical, engineering and design support beyond just the hardware. ADLES excels at creating innovative, customized solutions that ensure our clients’ design process and optimized results are delivered both within the most efficient timeframe and at the lowest costs.
Our clients’ success is ADLES’ success. ADL Embedded Solutions, Inc. www.adl-usa.com www.militaryembedded.com
sales@adl-usa.com
855-727-4200
www.linkedin.com/company/adl-embedded-solutions MILITARY EMBEDDED SYSTEMS Resource Guide
@ADLEmbedded September 2020 63
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Embedded Hardware
Military Embedded Systems Resource Guide
Embedded Hardware
WILDSTAR Boards include optional optical and/or RF (VITA 66/67)
100GbE FPGA Boards are SOSA™-Aligned The 6XB2 (6U), 6XBU (6U), and 3XBP (3U) WILDSTAR Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100GbE over copper on the VPX backplane. All 3 boards are VITA 65-compliant and align with the SOSA™ standard. High Performance These high-performance boards combine the latest Xilinx Virtex UltraScale+ FPGAs with a powerful Zynq UltraScale+ MPSoC. They are 2.5X faster than existing technology, and enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. Superior speed and bandwidth is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects. Rugged Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high-performance air, conduction, or air-flow-through cooling for thermal control. Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.
MADE IN
U. S. A.
FEATURES Ą General Features • Up to two Xilinx® Virtex® UltraScale+™ FPGAs • Xilinx Zynq® UltraScale+ MPSoC Motherboard Controller • 6XBU features integrated ADCs • – 2 channels at 32GSps • – 4 channels at 16GSps • – Resolution: 10 Bits • A Full Board Support Package for fast and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 and Linux support • Multiple levels of hardware and software security Ą OpenVPX Backplane I/O • Up to 38 HSS I/O lanes to VPX backplane for up to 182 GB/s of full duplex bandwidth • Up to 32 LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization Ą Front Panel I/O • WILD FMC+ (WFMC+™) next generation I/O site(s) • – Accepts standard FMC and FMC+ cards • – Supports stacking (2 I/O cards per site) • – Up to 32 HSS and 100 LVDS pairs connections to FPGA Ą Mechanical and Environmental • Air, conduction, or AFT cooled: -55°C to +85°C Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable • RTM available for additional I/O • Developed in alignment with the SOSA™ Technical Standard
www.annapmicro.com
WILDSTAR Boards are cooled via Air, Conduction, or Air-Flow-Through
Annapolis Micro Systems, Inc.
www.annapmicro.com/product-category/fpga-boards-2/ 64 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
wfinfo@annapmicro.com 410-841-2514
www.militaryembedded.com
WILDSTAR 6SN0 6U VPX Storage boasts up to 64TB depth and 10GB/sec bandwidth
100GbE VPX Storage Combines Depth & Bandwidth When storage capability is needed, Annapolis offers the highest density OpenVPX data recording solution on the market.. Its combination of capacity and speed is unmatched. Available in 6U and 3U form factors, the WILDSTAR Data Storage Solution is hot swappable (10,000 insertion cycles), is 100GbE capable, and is developed in alignment with SOSA™. One Xilinx® Zynq® UltraScale+™ MPSoC ZU11 Motherboard Controller allows standalone operation, and supports multiple levels of hardware and software security. Annapolis high-performance storMADE IN age boards are optimized for SIGINT, ELINT, EW, and other highU. S. A. bandwidth storage applications.
FEATURES Ą 3U Boards feature 32 TB storage depth and 5 GB/s BW
Ą 6U Boards feature 64 TB storage depth and 10 GB/s BW Ą Scalable depth and bandwidth using multiple cards
Ą Backplane I/O using PCIe or 1/10/25/50/100Gb Ethernet
Ą 6U/3U OpenVPX (VITA 65) compliant, 1" VITA 48.1 spacing Ą Hot swappable (exclusive to WILD EcoSystem) Ą Optional VITA 66 support
Ą RTM available for additional I/O
Ą Available for Air, Conduction, Air-Flow-Through, and Liquid-Cooled
environments Ą Full BSP for fast and easy Application Development
Annapolis Micro Systems, Inc.
www.annapmicro.com/product-category/storage-boards/
www.annapmicro.com wfinfo@annapmicro.com 410-841-2514
Embedded Hardware
DefensePro SSD Apacer has developed the ”DefensePro™“ technology set to meet the multi-faceted requirements of defense applications and help customers find the right solutions, further simplifying the implementation process. DefensePro™ is categorized into three levels based on customer requirements. Level one enhances survivability and operational stability even under tough conditions. Level two provides a higher level of protection for operation in extreme environments and increases data security using customized firmware, preventing data leakage and delivering higher reliability. Level three ensures reliability and data security to prevent unexpected data loss or unauthorized access. FEATURES
Ą Available form factors are NVMe PCIe 2280/2242, SATA 2.5" & 1.8"/2280 & 2242/mSATA/CFast. Ą DataDefender combines both firmware and hardware mechanisms to ensure data integrity. Together, they allow more time for volatile data to be stored in the event of power loss. Ą Thermal Shock protection technology prevents damage to components when wild temperature swings take place. Apacer’s in-house testing facility can check to ensure thermal shock resistance and modify a standard product if needed. Ą End-to-End Data Protection ensures that whenever data moves from the host to the controller or from the controller to DRAM or NAND flash, error checking is applied. In some cases, error correction will be included in the circuit. Ą Instant Keychange is based on AES encryption and can be trigged via hardware or software. Destroying the original key and creating a new one takes less than a second – much faster than traditional forms of drive erasure. Ą TCG Opal 2.0 handles the encryption/decryption of information within the device without requiring a host, enabling fast encryption/decryption and minimizing the risk of data leakage without undermining system performance. Ą CoreDestroyer is a software function that renders the entire SSD unusable, for cases where the SSD is about to fall into the hands of an unauthorized user. TM
APACER MEMORY AMERICA INC.
https://industrial.apacer.com/en-ww/Application/Defense www.militaryembedded.com
408-518-8699
ssdsales@apacerus.com
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Military Embedded Systems Resource Guide
Embedded Hardware Industrial DRAM module Defense applications are mission-critical operations, requiring the most demanding, reliable, and robust systems. Without protective technologies, these applications can’t survive hostile environments with punishing temperatures, altitudes, and humidity. Anti-vibration and shock resistance are additional vital system requirements. Apacer offers DRAM module solutions which not only meet these requirements but also offer features such as wide temperature operation, conformal coating, and underfill to ensure reliability in extreme environments. FEATURES
Ą XR-DIMM is available for DDR4 technologies. Ą Rugged SODIMM is available for DDR3 and DDR2 technologies. Ą Apacer’s patented anti-sulfuration technology, uses special alloy materials
which have passed the ASTM B809-95 anti-sulfuration test.
Ą A wide operational temperature range between -40ºC to 85ºC is achieved by
using industrial grade chips from original manufacturers to ensure stability and reliability. Ą Conformal coating improves product reliability when applied on the surface of printed circuit boards. This protective film can safeguard devices from dust ingression and liquid immersion. Ą Underfill is deployed under the BGA to strengthen solder joints and reinforce the product’s resistance against vibration and thermal shock. Ą With30µ gold plating, the connector inferface is more reliable and can withstand the potential damages in industrial applications.
APACER MEMORY AMERICA INC.
https://industrial.apacer.com/en-ww/Application/Defense
408-518-8699
ssdsales@apacerus.com
Embedded Hardware
RS1.532L21X2F RUGGED TWIN SERVER
Increase readiness.
FEATURES
The RS1.532L21X2F 1.5U rugged server delivers proven reliability and computing performance in extreme and unpredictable environments – critical for successful execution of combat, sonar and electronic warfare applications across all domains, including cyber. The smaller, integrated footprint of the unit fits easily into standard rack slots. With system availability, superior cooling and shock/vibe resistance, this 1.5U rugged server stands ready to perform.
Ą
Rugged 1.5U, 21 deep rack mounted dual node, front I/O server
Ą
Lightweight aluminum construction – 28-32 lbs.
Ą
Shared 1500W power supply, operates off 110/220V 50/60Hz AC or 180-350VDC
Ą
Dense SWaP capability with two dual socket motherboards per chassis
Ą
2nd Gen Intel® Xeon® Scalable processors up to 125W each
Ą
Up to four removable U.2 NVMe SSDs
Ą Ą
Four low profile PCIe x16 slots, plus 2x SIOM modules with up to eight ports of network connectivity per chassis 4x USB 3.0, 2x VGA, 2x Gigabit IPMI
www.crystalrugged.com/product/rs1-532l21x2f-rugged-twin-server/
Crystal Group
www.crystalrugged.com 66 September 2020
info@crystalrugged.com
800-378-1636
www.linkedin.com/company/crystal-group
MILITARY EMBEDDED SYSTEMS Resource Guide
@CrystalGroup www.militaryembedded.com
Aura 8100 Ultimate Scene Generation Performance and Reliability in a Small Form Factor. Ideal for all Military Training & Simulation systems: Create immersive virtual reality experiences with the power to simulate your virtual or constructive training environment precisely. Aura enables the flexibility of integrating the latest highperformance Nvidia GPU to produce the lowest latency and highest performance available for your application. This Intel® XeonTM E processor platform delivers server-class performance with the built-in security features and reliability that professionals demand – combining memory access and error correcting stability with commercial gamer-class performance and value.
• Portable • Extensible • Integratable
by world-class service and support, including device health monitoring and remote management capabilities.
This Dedicated Computing platform ensures an industry-leading reliability and platform stability experience and a comprehensive, workloadoptimized testing approach, backed
Dedicated Computing is a global technology company committed to solving customer business problems through the design and deployment of innovative solutions.
RACK INTEGRATION SERVICES
Global OEMs Choose Dedicated for Rack Integration: • World Class ISO9001 & 13485 Process Management
FEATURES Ą Lightweight Small Form Factor Design Minimizes
Shipping Costs
Ą Advanced Component Retention Promotes
Transportability
• Change Management for Cabinet and
Ą Multi-Axis Drop-Tested Design Supports Repeated
• • •
Ą Contains the Latest Compute and Graphics Capabilities
• • • • •
Component parts PMP Certified Project Managers Lean-Based Best Practices Digital Work Instructions with Engineering Change Control Complete Functional and Stress Testing Full Software Integration & Testing Capabilities Flexibility to Use Customer Process or Manage End-to-End Deployments Custom Branding Options Global Shipping to 40+ Countries Worldwide
Transport
Ą Designed with Future Technology Generations in Mind Ą Multiple Performance Tiers with Scalable Options Ą AR/MR/VR Ready Ą Minimal Desktop Footprint (1⁄2ft2) Ą Library-Quiet Operation Ą Integrated VESA Mount Pattern Ą Under-desk or Fixed-mount Design
www.dedicatedcomputing.com/products/image-generation/
Dedicated Computing
www.dedicatedcomputing.com www.militaryembedded.com
inquiry@dedicatedcomputing.com
www.linkedin.com/company/dedicated-computing/ MILITARY EMBEDDED SYSTEMS Resource Guide
877-333-4848 @Dedicated
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Military Embedded Systems Resource Guide
Embedded Hardware
PXH82X Gen 3 XMC Module PXH82X XMC Adapters come in various formats supporting transparent and non-transparent operations. PXH82X brings up to 128 GT/S connectivity and advanced connection features to embedded computers and carrier cards that support XMC mezzanine cards. The cards provide external connectivity with a quad SFF-8644 connector that supports standard MiniSAS-HD or PCIe 3.0 cables. The PXH822 and PXH826 are Dolphin’s transparent host/target adapters. These quad SFF8644 cable adapters support the new PCI SIG External Cabling Specification 3.0. enabling connections to compliant Dolphin products and third-party PCI Express cabled systems. The adapters can act as either hosts or targets when connecting to expansion chassis. The PXH820 and PXH824 are Dolphin’s non-transparent host adapters. They come with Dolphin’s comprehensive PCIe NTB eXpressWare™ software suite that reduces time to market. eXpressWare™ software includes several components to support connecting systems, SOCs, FPGAs, and GPUs. It comes with a shared memory API (SISCI), sockets API, SuperSockets™, and a TCP/IP driver. These components create a robust and powerful programming environment for easy use of shared memory in multi host/root systems and removes the traditional network bottlenecks by taking advantage of high performance of the PCIe interconnect. eXpressWare™ delivers extremely low latency starting at 540 nanoseconds.
Dolphin ICS
www.dolphinics.com
FEATURES Ą VITA 42.0 XMC 1.0/VITA 61.0 XMC 2.0 SUPPORT Ą UP TO 128 GBIT/S PERFORMANCE Ą X4, X8 OR X16 PCI EXPRESS HOST PORT Ą QUAD SFF-8644 CONNECTOR FOR X4, X8 OR X16
PCIe CABLING
Ą UP TO 9M COPPER AND 100M FIBER CABLES Ą TRANSPARENT AND NON-TRANSPARENT BRIDGING Ą PIO AND DMA RDMA SUPPORT
info@dolphinics.com
+1 469-482-2140
www.linkedin.com/company/dolphin-interconnect-solutions
OpenSystems Media works with industry leaders to develop and publish content that educates our readers. High-Performance Edge Computing for Real Time Decision Making By One Stop Systems/PureBtoB Businesses across multiple industries will increasingly embrace high-performance edge computing to fulfill the demand for processing locally sourced digital data to drive precise real-time decision-making. Edge computing enhanced with high-performance capabilities – such as those that deploy rugged AI on the Fly systems at the edge powered by NVIDIA V100S GPUs – will enable many companies to overcome the performance, latency, and security challenges that occur when remote locations rely on traditional data center or cloud computing models. In this white paper, explore the underlying market trends and unique requirements driven by this imperative to create actionable intelligence at the edge.
Read this white paper at https://bit.ly/3aHXMzo 68 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
Read more white papers: https://militaryembedded.com/whitepapers www.militaryembedded.com
VITA 48.4 Liquid Flow-Through (LFT) ATR Platform Increasingly power-hungry OpenVPX modules require a cooling solution guaranteed to keep the mission on course. Elma Electronic’s rugged OpenVPX ATR platform is designed to accommodate 6U boards requiring liquid flow-through (LFT) cooling per the VITA 48.4 standard. VITA 48.4 establishes the mechanical design interface, outline and mounting requirements for 6U OpenVPX liquid-flow-through cooled plug-in modules within associated sub-racks. While the connector layout remains common with VITA 46, VITA 48.4 standard modules are cooled by liquid flowing through an integral heatsink. Circuit boards and electronic components are cooled more effectively as compared to other more traditional cooling methods such as air or conduction cooling alone. Quick disconnect coupling assemblies allow fluidic coupling to the chassis manifold.
FEATURES Ą 1 ATR tall short with rugged, bolted construction
Ą 6U OpenVPX backplane with 6-slots on 1.2" pitch supports
300W/slot
Ą Configurable front I/O connectors on removable panel
Ą Individual card coolant flow rates are adjustable with selectable
openings
Designed for data rates up to 10 Gbps, the backplane is designed to handle 300 Watts per slot. It features eight 6U slots on a 1.2" pitch. Clockable guide pins are included at each slot to allow for easier keying (angle rotation) without having to deal with the removal of the backplane from chassis.
Ą Supports dual VITA 62 power supplies and option for VITA 46.11
https://bit.ly/VITA-484-ATR
Ą Designed to meet MIL-STD-461, MIL-STD-810, MIL-STD-1275
Elma Electronic Inc.
https://www.elma.com
compliant Shelf Manager
Ą On/off power switch with guard, LED status indicators & filtered
power input connector
sales@elma.com
510-656-3400
https://www.linkedin.com/company/elma-electronic
@elma_electronic Embedded Hardware
RF & Optical Backplanes for OpenVPX & SOSA Systems As the leader in backplane designs and manufacturing, our latest OpenVPX designs support optical and RF apertures (VITA 66 and 67) for high performance connectivity modules. Elma engineers developed the industry’s first VPX backplanes and we are the innovation leaders in signal speeds and system complexity. We offer the largest selection of 3U and 6U OpenVPX backplane profiles, in slot counts from 2 to 16, including the newest profiles aligned with the SOSA Technical Standard. TM
VPX presents design challenges with high layer-count backplanes, and more demanding power and cooling requirements. We tackle these problems with extensive signal integrity testing plus thermal simulation and functional testing to produce the most reliable backplanes and enclosures on the market. That’s why our partners and our customers rely on Elma to address their VPX backplane requirements. The latest interactive backplane charts are now available on our website – hover over any backplane profile to see the topology for that particular backplane configuration. Don’t see the one you need? Talk to us about a tailored slot configuration. https://bit.ly/VITAbkps
Elma Electronic Inc.
https://www.elma.com www.militaryembedded.com
FEATURES Ą Support for VITA 66.4 optical, 67.1 RF and 67.3 RF/Optical modules Ą Designs support 1000BASE-BX, 1000BASE-KX, 10GBASE-KX4,
10GBASE-KR, or 40GBASE-KR4 connectivity
Ą Radial clock slot for IEEE 1588 precision timing protocol and Ą Ą Ą Ą
sales@elma.com
network synchronization Support for VITA 62 pluggable power modules Many power and ground designs available standard Designed and manufactured in the US Details on all backplanes aligned to OpenVPX and SOSA, and the interactive charts
510-656-3400 https://www.linkedin.com/company/elma-electronic
@elma_electronic
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CPU-162-23 COM Express Basic Type 7 – Rugged Intel Xeon D The CPU-162-23 brings the computational performance and RAM capacity of a server to the field. It supports extended temperature range (-40 to +85°C) and ECC memory to operate reliably in industrial and rugged applications. The CPU-162-23 can be configured with any member of the Xeon/Pentium D-1500 family, ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECC. The CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout, delivering very high speed interfaces, like up to x32 PCIe lanes, two 10Gbps (10GBASE-KR) and one 10/100/1000Mbps Ethernet port (1000BASE-T). Other interfaces include two SATA 3.0 ports, four USB 3.0 and four USB 2.0 ports. Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-162-23 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT Edge Gateways. Eurotech Professional Services are available for the CPU-162-23, starting from BIOS personalization and include carrier board design, system development and production. Deep module customization, such as feature changes are also available.
FEATURES Ą Up to 16 Cores for HPEC and Microserver-ready
Applications Ą Powerful Intel Xeon D-1500 CPU Ą Up to 64GB ECC RAM Ą 2x 10Gb Ethernet Ą Rugged and Fanless Design Ą Full HW/SW Customization Ą Eurotech Professional Services
www.eurotech.com/en/products/boards-modules/comexpress/cpu-162-23
Eurotech
www.eurotech.com
sales@eurotech.com
www.linkedin.com/company/eurotech
+39 0433 485 411 @eurotechfan
Embedded Hardware
Server-class capabilities for AI and other demanding applications at the Edge Industry 4.0, Edge servers, robotics, and AI applications demand more computing power, storage, and networking capabilities at the Edge. Eurotech is a leader in providing rugged and fanless embedded computers that provide server-class performance.
FEATURES
The new CPU-162-24 is a COM Express Basic Type 6 module that Ą Powerful – Supports server-class, power efficient Xeon E3-1500 v6 CPUs features Intel Xeon E3 processors combined with Intel HD graphics Ą High Performance Graphics – Features Intel HD Graphics, with VGA, LVDS for hardware video and AI acceleration. Soldered-down components and two HDMI/DP++/DVI displays, and HW accelerated video encoding and decoding and a fanless design allow for sustained reliable operations in a wide temperature range (-40 to +85°C) in demanding environments like Ą Rugged and Fanless – Operates from -40 to +85°C, with error correcting code memory and soldered CPU for reliable, fanless design those of industrial, transportation and defense applications. Ą Customizable – Comes with optional personalization and full
It supports IoT applications and cloud connectivity thanks to the customization services, ranging from factory options to deep HW/SW integration with Everyware Software Framework (ESF), Eurotech’s configuration changes IoT Edge Framework. ESF allows connectivity to leading IoT Cloud Ą Professional Services – Provides the foundation for Eurotech Professional services such as Everyware Cloud, Eurotech’s IoT Integration Services that span from carrier board development to complete system design, certification and manufacturing Platform. www.eurotech.com/en/products/boards-modules/comexpress/cpu-162-24
Eurotech
www.eurotech.com 70 September 2020
sales.us@eurotech.com
www.linkedin.com/company/eurotech
MILITARY EMBEDDED SYSTEMS Resource Guide
+1 301 490 4007 @eurotechfan
www.militaryembedded.com
G1 microNAS The G1 microNAS is ideal for use in manned or unmanned systems deployed from deep subsea to high altitude and everywhere in between with demanding space and power constraints. Removable storage ensures short ground times for airborne applications. Industry standard solid-state drives are used to benefit from the ever increasing storage densities and cost reductions as the technology evolves. The removable storage subsystem offers up to 40TB of Industrial grade MLC storage or up to 20TB Military grade SLC storage, supporting JBOD and RAID modes 0 and 1. The removable data module allows easy transport of data between the mission platform and the command station or lab where the data is used. Passive docking stations allows easy data exchange between the deployed servers and the ground infrastructure such as mission planning and debriefing systems. The G1 microNAS is capable of handling a high number of simultaneous connections without compromising system performance. Four channels of Gigabit Ethernet connections are available as well as an optional 10GBase-T port. The unit can be delivered with Windows Embedded Storage Server or Linux Enterprise Server preconfigured to suit your application needs. Optional FIPS 140-2 and AES-256 hardware encryption provides a high level of data security with flexible key management options, including physical key tokens through front panel key loading port and remote loading over a secure network connection.
FEATURES Ą
Up to 40TB MLC or 20TB SLC removable solid-state storage
Ą
Quad Gigabit Ethernet ports
Ą
1x 10GbE (10GBase-T) port
Ą
SMB/CIFS, NFS, AFP, FTP, HTTP and rsync
Ą
RAID 0 and 1 support
Ą
Low power: 16V-50V DC power
Ą
Ą
Ą Ą
Ą
Tested to MIL-STD-810, MIL-STD-461 and MIL-STD-704 Rugged conduction or natural convection cooled designs SWaP optimized External dimensions from only 3.3" x 2.5" x 7.3" Ultra lightweight, <2.6 lb (incl. storage)
www.galleonec.com/project/g1-rugged-nas/
Galleon Embedded Computing www.galleonec.com www.militaryembedded.com
us_sales@galleonec.com 281-769-8211 @GalleonEmbedded www.linkedin.com/company/galleon-embedded-computing-as/
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XSR NAS The Galleon XSR Rugged NAS offers superior performance in a very small form factor. Removable storage ensures short ground times for airborne applications. Industry standard solid-state drives are used to benefit from the ever-increasing storage densities and cost reductions as the technology evolves. The removable storage subsystem offers up to 80TB of Industrial grade MLC storage or 40TB Military grade SLC storage. RAID modes 0, 1 and 5 are supported. The RDM allows easy transport of data between the vehicle or aircraft and the command station or lab where the data is used. The XSR NAS is capable of handling a high number of simultaneous connections without compromising system performance. It supports up to 13 Ethernet connections, configurable as 1Gb, 10Gb, 25Gb and 40Gb interfaces on both copper and optical media. The unit can be delivered with Windows Embedded Storage Server, Linux Enterprise Server or FreeNAS SW preconfigured to suit your application needs. An optional FIPS 140-2 validated hardware encryption module provides a high level of data security with flexible key loading options, including physical key tokens through front panel key loading port and remote loading over a secure network connection. The design concept of XSR is based on the use of COTS Open Architecture modules, that allow the unit to make use of the latest generation Intel Core-i7 and Xeon processors. This enables the XSR to keep pace with increasing technology advancement and
provides a key mitigation strategy for Obsolescence Management, which helps to protect the user’s design for 10 years or more. The extremely rugged design makes it ideal for deployed applications in rugged or harsh environments. Optional FIPS 140-2 and AES-256 hardware encryption provides a high level of data security with flexible key management options, including physical key tokens through front panel key loading port and remote loading over a secure network connection.
FEATURES Ą
Up to 80TB MLC or 40TB SLC removable solid-state storage
Ą
RAID 0, 1 and 5 support
Ą
Up to 13 ports 1Gb Ethernet
Ą
Up to 8 ports 10Gb Ethernet
Ą
Up to 4 ports 25Gb Ethernet
Ą
Up to 2 ports 40Gb Ethernet
Ą
SWaP optimized
Ą
Rugged conduction or air cooled designs
Ą
SMB/CIFS, NFS, AFP, FTP, HTTP and rsync
Ą
Optional hardware AES-256 encryption
Ą
GPS unit for date and time synchronization
www.galleonec.com/project/xsr-rugged-nas
Galleon Embedded Computing www.galleonec.com 72 September 2020
us_sales@galleonec.com 281-769-8211 @GalleonEmbedded www.linkedin.com/company/galleon-embedded-computing-as/
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
“TIGER” S402-SW The S402-SW “Tiger” is a third-generation, fan-less (conductioncooled) fully rugged, low cost Intel® Xeon® E5 server. It is designed to provide the highest level of server-class performance possible in a fully ruggedized, conduction-cooled system, operating up to -40° C to +85° C. Tiger simplifies local data processing tasks that require an ultra-fast, Xeon®-class server with vast amounts of high-speed, ECC-protected RAM and storage in one ultrarugged chassis. S402-SW is ideal for the application that requires the horsepower of a high-performance server deployed onto a rugged platform with no fans required. When equipped with the Layer 2/3 intelligent ethernet switch, Tiger becomes a rugged compact server, router, switch, NAS subsystem weighing only about 10 pounds. The switch is intentionally segregated from the processor subsystem for cybersecurity purposes; it can be optionally internally connected to provide one 10GbE from the CPU and one 10GbE from the switch.
The Tiger is an 8 to 18-core Xeon® E5 server intended for commercial, industrial, military, defense, and aerospace applications with the greatest SWaP-Efficiency (SWaP-E) on the market due to its compact size and robust computing and I/O performance. Tiger is an ideal forwardly deployed vehicle-mounted battlefield/ airborne/shipboard server/router/switch/NAS that offers the greatest reliability in the smallest packaging. Tiger can also be used in industrial and commercial platforms since it has serverclass performance, significant networking options, exceptional I/O capabilities and removable storage. The S402-SW is fully compliant to MIL-STD-810G, MIL-STD1275D, MIL-S-901D, DO-160D, MIL-STD-461F and has ingress protection up to IP67. This system may also be ordered from the factory with operating systems such as Windows® or Linux® pre-installed.
FEATURES Ą
Intel® Xeon® E5 v4 CPU with up to 18 cores
Ą
Hyper-Threading on each core for total of 36 logical cores
Ą
Supports up to 128 GB of DDR4 memory with ECC
Ą
Ą
Optional fixed M.2 or NVMe SSD for OS boot (Optional for I/O) Up to four 10 GbE plus twelve 1 GbE Ethernet ports (two from CPU, two from switch)
Ą
Personal Profile Module™ (PPM) uses SD card authentication
Ą
Optional AMD® Radeon® GPU E8860, up to 768 GFLOPS
Ą
Optional NVIDIA® Quadro® GPU M2200M, up to 1.32 TFLOPS
Ą
Size: 11.75" x 7.75" x 2.0" Weight: 10 lbs.
Ą
MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, MIL-STD-461F, DO-160D, IP67 compliant
Ą
Temperature: Operates up to extended temp -40° C to +85° C (Optional) http://www.gms4sbc.com
General Micro Systems, Inc. www.gms4sbc.com
www.militaryembedded.com
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
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“PEACOCK III” S1202-XVE The S1202-XVE “Peacock III” is a third-generation, ultra-rugged, small, lightweight workstation computer system with up to two GPU sites for MXM 3.0 graphics expansion or GPGPU algorithm processing. It is designed to provide a rugged system optimized for the lowest cost and weight in a fully sealed case, while providing the highest level of workstation performance possible in a fully ruggedized, conduction-cooled, sealed system, operating up to -40°C to +85°C (0°C to +55°C standard). This system is designed for applications that require a small enclosure with the highest possible performance per dollar and per watt while utilizing rugged interconnects to provide a fully sealed system. This system can also be equipped with an optional radiator system that can cool the system with front to back air cooling. Peacock III supports the Kaby Lake Intel® Core™ i7 (E3-1505Mv6) processor with Hyper-Threading for a total of 8 logical cores, each operating at 3.0 GHz with the ability to Turbo Boost up to 4.0 GHz. The CPU is coupled with up to 64 GB of RAM organized in two banks that support error correcting code (ECC). The S1202-XVE standard configuration supports three 1 GigE and two 10 GigE channels with a TCP/IP offloading engine (TOE),
four USB 2.0 ports with power, four USB 3.0 ports, eight buffered digital I/O lines, one DVI/HDMI and one RGB video port, and full HD audio with a 5 W audio amplifier and mic-in. Additional I/O functions include one expansion I/O site (SAM™) for I/O such as GPS, Video capture, CANbus, MIL-STD-1553, ARINC-429, and more on a PCIe-mini card. Peacock III also includes the most secure storage subsystem possible. The system supports M.2 as a boot device, removable 2.5" SATA or NVMe SSD, Trusted Platform Module (TPM) 2.0, Secure Erase/Write Protect/Encryption SSDs and discrete triggers for Secure Erase and Write Protect and encryption up to FIPS-140-2. There are hard-wired status/Secure Erase signals used for total system cyber security. The graphics subsystem is provided by native Intel Graphics Processing (IGP) plus a separate optional primary GPU. There is one HDMI/DVI output plus one HD analog (VGA) output via IGP, plus dual 4K/UHD outputs via the primary (optional) MXM. A second MXM 3.0 site provides additional graphics outputs or GPGU co-processing with up to 8.7 TFLOPS algorithm capability.
FEATURES Ą
3.0 GHz Intel® Quad Core™ Kaby Lake E3 Processor (E3-1505Mv6)
Ą
Supports max Turbo Boost frequency of up to 4.0 GHz using Intel’s Turbo Boost Technology
Ą
Up to 64 GB of DDR4 memory with ECC
Ą
Up to 1 TB of fixed M.2 SSD (optional)
Ą Ą Ą Ą Ą Ą
Up to 4 TB of removable 2.5" SSD with SATA III or NVMe interface (optional) Removable Drive secured behind EMI/IP-rated door SSD drives support optional Encrypt/Secure Erase/Write Protect Size: 10.0" x 5.38" x 2.6" Weight: 7 lbs. MIL-STD: MIL-STD 810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD 461E and IP66 compliant Temperature: Operates up to extended temp -40°C to +85°C (Optional) http://www.gms4sbc.com
General Micro Systems, Inc. www.gms4sbc.com 74 September 2020
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
MILITARY EMBEDDED SYSTEMS Resource Guide
@gms4sbc www.militaryembedded.com
“THUNDER” S422 The S422-LC/SW/RT/AI is fan-less fully rugged, low cost Intel® Xeon® E5 server family available in four variants. It is designed to provide the highest level of server-class performance possible in a fully ruggedized, conduction-cooled system, operating up to -40 °C to +85 °C. “Thunder” simplifies local data processing tasks that require an ultra-fast, Xeon®-class server with vast amounts of high-speed, ECC-protected RAM and storage in one ultra-rugged chassis. Thunder is ideal for the application that requires the horsepower of a high-performance server, enterprise-class multi-port LAN or a NAS subsystem appliance, while deployed into a rugged platform with no fans required. When equipped with the router or intelligent Layer 2/3/4 Ethernet switch, Thunder becomes a rugged compact server, with a dedicated switch or router capabilities to offer maximum network flexibility. Networking capability starts with three 1 GbE and two 40 GbE fiber ports on the Low Cost (LC) variant and expands to an additional 40 GbE port and twenty 10 GbE ports (in variants SW, RT and AI). The 10 GbE ports can be configured with a Broadcom® Layer 2/3/4
enterprise class switch (SW) or as segregated and secure port connections each with their own subnet mask to avoid data crossover (RT). In the RT every Ethernet port is directly coupled to the CPU(s), an architecture that is ideal for secure communications or dedicated hypervisor/virtual environments. Network routing technology includes software-defined networking (SDN) on various operating systems and virtual machine (VM) hypervisor environments. Each of the 10 GbE ports support powerover-Ethernet (POE+) to directly power remote nodes while simplifying wiring requirements, up to 100 W maximum total power sourced. Integrated support is available for a lower power commercial General-Purpose Graphics Processing Unit (GPGPU), full size and height, for applications where large data processing tasks are required. The integrated GPGPU can “link” with other external GPGPUs, such as the GMS’s companion X422 Co-Processor, via the PCIe 3.0 FlexIO™ bus expansion feature. This bus expansion provides flexibility to upscale computing resources to match application computing requirements.
FEATURES Ą
Intel® Xeon® E5 v4 CPU with up to 22 cores (E5-2699RV4)
Ą
Hyper-Threading on each core for total system with 44 logical cores
Ą
Supports up to 512 GB of DDR4 memory with ECC
Ą Ą Ą Ą
Optional 20 port x 10 GbE ports configured as enterprise switch or segregated subnets Optional x8 PCIe add-in card slot for GPGPU, co-processor, I/O (FHFL size) Optional PCIe-over-cable bus extension for chassis expansion to external PCIe co-processors GMS FlexIO™ x16 PCIe Gen 3.0 8 Gbits/s fabric expansion architecture for inter-chassis co-processor sub-rack (connects to X422 co-processor chassis)
Ą
Dual 40 GbE ports directly coupled to CPU/FlexIO™ PCIe fabric for non-blocking data movement
Ą
Size: 7.75" x 11.60"
Ą
MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, MIL-STD-461F, DO-160D, IP67 compliant
Ą
Temperature: Operates up to extended temp -40°C to +85°C (Optional) http://www.gms4sbc.com/s422
General Micro Systems, Inc. www.gms4sbc.com
www.militaryembedded.com
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
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“LIGHTNING” X422 The X422 is a GPGPU Co-Processor System that supports GMS’ companion S422 SW Server. Up to two full size GPGPU cards can be installed, either as two independent processing units or they can be intelligently linked together to form one virtual processing unit. In addition to the GPGPU capabilities, “Lightning” offers bus expansion capabilities to virtually any full size, full height PCIe 3.0 card, but is optimized to harness multiple GPGPU systems. The X422 affords the use of commercially available, full size, GPGPU products in a completely sealed and protected, extended temperature fully ruggedized enclosure that utilizes GMS’ patented RuggedCool™ technology. Owing to the underlying GPGPU architecture with multiple cores and threads, the X422 can accelerate large data processing tasks such as image recognition, digital signal processing, data mining, block chain computation, artificial intelligence, machine vision, image processing, vector processing, and other compute-intensive tasks. PCIe 3.0 bus expansion allows upward-scaling by cascading (daisy chaining) additional GPGPUs as as necessary via additional X422 chassis. The X422 utilizes GMS’s FlexIO™ flow-through architecture which is based upon wide PCIe 3.0 lanes (x16) operating at 8 Gbps. When connected via x16 PCIe 3.0 to the companion S422 dual Xeon® conductioncooled rugged server, the GPGPUs (or any PCIe cards) appear to be within the same “bus” of the main server. This closely-coupled architecture allows for rapid data passing, RDMA and “atomic” operations, or provides
a fully autonomous GPGPU co-processor where only data is shared asymmetrically from the main CPUs. The onboard intelligent PCIe 3.0 switch provides packet processing and local “routing”, allowing the user to customize a homogeneous or heterogeneous architecture between the local GPGPU resources. For example, the X422 can be partitioned for GPGPU A to operate separately and independently from GPGPU B – or they can pass data between each other via the dual x16 PCIe 3.0 fabric. Separate, GPGPU-specific, and customizable I/O “pipes” are available to the front panel for each PCIe slot. This allows sensor-to-GPGPU processing, down- or up-stream processing, or an additional data path that bypasses the companion S422 dual-Xeon® server. The X422 is a high performance GPGPU co-processor and bus expansion system designed for use with the S422 SW Server. The X422 is an ideal forwardly-deployed, vehicle-mounted, high performance GPGPU co-processing system. Applications include computing clusters and parallel computing, digital signal processing, digital image processing, video processing, neural networks, data mining, cryptography, and intrusion detection. The X422 system is fully compliant to MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD-461E and has ingress protection up to IP64.
FEATURES Ą PCIe-over-cable local bus extension for inter-/intra chassis
expansion for two full-size PCIe co-processors
Ą Supports up to two full size commercially-available
General-Purpose Computing on Graphics Processing Units (GPGPUs) Ą FlexIO™ backplane provides internal/external PCIe Gen 3 at 8 Gbps Ą GPGPU modules support a total of 32 PCIe Gen 3 lanes, 16 lanes of input and 16 lanes of output Ą X422 system daisy chains to multiple Lightning GPGPU co-processor units Ą Software support for NVIDIA™ CUDA proprietary framework and OpenCL open framework Ą PCIe-over-cable bus extension for co-processor cards Ą Up to two full size GPGPUs (dual x16 PCIe 3.0 slots) Ą Size: 12.45" x 11.6" x 2.54" (including fins) Ą MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, MIL-STD-461F, DO-160D, IP64 Ą Temperature: Operates up to extended temp -20° C to +55° C (Optional) http://www.gms4sbc.com/x422
General Micro Systems, Inc. www.gms4sbc.com 76 September 2020
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
MILITARY EMBEDDED SYSTEMS Resource Guide
@gms4sbc www.militaryembedded.com
“TITAN” The rugged “TITAN” 1U and 2U servers are unique expandable standard rackmount servers using Intel’s second-generation Scalable Xeon® processors. Designed for high-reliability aerospace, defense, military and industrial applications, “TITAN” is set apart by extreme density and expandability with air- and conduction-cooling options. It includes more networking I/O, memory, PCIe card add-in options, and removable storage than found anywhere in a in a 1U or 2U rackmount server. Additionally, “TITAN” is exceptionally rugged and designed for technology refresh and pre-planned product improvement (P3I) in long-life applications. Available in air-cooled and sealed conduction-cooled versions, “TITAN” is like no other server on the market. Air-cooled versions feature either internal fans or external rack-supplied plenum cooling, and either COTS or mil-circular (38999) connectors.
In shock- and vibration-resistant conduction-cooled versions, “TITAN” is equipped with military-style circular 38999 connectors for assured reliability. “TITAN” uses patented internal cold plates and thermal mitigation in a sealed chassis to protect against ingress and EMI. “TITAN” is also expandable from a 1U high, 2S dual-socket version to a 2U high, 4S (four socket) four-way symmetric multiprocessing (SMP) 2U version with exceptionally high-performance inter-processor UPI connections. Alternatively, the system can remain a dual socket server (2S) but grow from 1U to 2U, adding additional storage (up to 18 SSDs total), additional PCIe slots (up to 10 total), and a segregated 20-port managed Ethernet switch. In either 1U or 2U variants, “TITAN” is an exceptionally rugged, densely packed, well-equipped rackmount server with Intel’s very latest server technology.
FEATURES Ą
Ą
Dual or Quad Intel® Scalable Xeon® processors with up to 28 cores (2.50 GHz) and Turbo Boost (3.80 GHz); 38.5 MB of Smart L3 Cache (server-class processors: Platinum and Gold) Air- and conduction-cooled (sealed) versions with commercial (COTS) connectors or mil-circular 38999 connectors for ultimate reliability
Ą
3x UPI (10.4 GT/s) interconnects for HPEC, SMP, NUMA architecture
Ą
Up to 1 TB DDR4 ECC memory (8 DIMMs) per CPU
Ą
Up to 10 PCIe Gen 3 add-in cards (4x in 1U and 10x in 2U; factory-installed)
Ą
Optional 20-port segregated Ethernet switch in TITAN-2U
Ą
Optional 20 port 10GbE switch in TITAN-2U
Ą
AI version > 400 TFLOPs supports up to 4x Nvidia V100 GPGPUs in 2U
Ą
Encryption and security via Intel® AES-NI encryption and Trusted Platform Module 2.0 (TPM)
Ą Ą
Dual-redundant MIL-STD-1275 500 W power supplies (single/three phase; 60-400 Hz 110/220 VAC; 28 VDC), 2x PSU’s in 1U; 4x PSU’s in 2U Optional MIL-STD-704F power supplies with 50 ms hold-up http://www.gms4sbc.com/titan
General Micro Systems, Inc. www.gms4sbc.com
www.militaryembedded.com
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
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“SMARTVIEW” SD12/SD17/SD24 The SmartView™ series rugged all-in-one 12", 17" and 24" Smart Panel PCs that integrate the most rugged, crisp displays with Intel’s latest seventh-generation Kaby Lake E3 Xeon® processor resulting in the thinnest, most powerful and robust smart display system on the market today. SmartView™ is designed to provide the highest level of workstation performance possible in a fully ruggedized, conductioncooled, fully sealed system with an ultra-bright display and Night Vision Imaging System (NVIS). This system architecture simplifies applications where a full-featured computer with a rugged display is needed to deliver the best possible stand-alone-system, per dollar and per watt, while utilizing rugged interconnects to provide a fully sealed smart display system that is less than 2.1-inches thick. SmartView™ is equipped with the latest Intel® Kaby Lake-H workstation processor with Hyper-Threading (also called Intel® Xeon® E3-15xxM v6) for a total of up to four physical cores (eight logical cores) operating up to 3.0GHz and using Intel’s Turbo Boost 2.0 up to 4.0GHz. To harvest this incredible CPU performance, the CPU is coupled with up to 64 GB of DDR4 RAM organized in two banks with ECC support (2-bit error detection and 1-bit error correction). These Kaby Lake Xeon® E3 cores coupled with SmartView’s I/O can be used to create multiple
virtual machines (VMs) allowing a single SmartView™ system to replace up to 8 separate single-processor systems. The I/O subsystem is designed to support a wide array of standard and custom I/O functions. Standard configuration supports two 1 Gigabit Ethernet ports or an optional two 10Gigabit Ethernet (copper) ports with TCP/IP Offloading Engine (TOE), one USB 3.0 and one USB 2.0 port (two are optional, but lose Audio), two COM ports with RS232/422/485 options, eight buffered digital I/O lines (optional), audio in/out for headset use and DVI output from the CPU or DVI input from an external source, which can be displayed on the SmartView™ screen (bezel key selectable). Utilizing the two SAM™ sites, additional I/O functions are optionally provided, such as quad video capture, CANbus, MIL-STD-1553, Wi-Fi, Bluetooth, FireWire, GPS and many other I/O. SmartView™ also offers the most secure storage subsystem possible. It supports up to 32MB BIOS Flash with hardware-write protect and secure erase. The onboard fixed mSATA boot device and removable nDrive™ SSD provides optional hardware write-protect, ATA Secure Erase and encryption functions. SmartView™ displays can optionally support FIPS-140-2 and FIPS-197 encryption standards for ultra-secure data storage.
FEATURES Ą
Ą Ą
3.0GHz Intel® Xeon® E3 (Kaby Lake, 7th Generation Core™) processor with 4 cores and Turbo Boost 2.0 up to 4.0GHz; 8MB of Smart Cache (E3-15xxM V6) Up to 64GB of DDR4 memory with ECC Intel® HD Graphics P630 with GT2, 8-bit VP9 8-bit CODEC, 10-bit HEVC (H.265) CODEC
Ą
12"/17"/24" 16:9 aspect ratio (1920x1080 native) HD 1080p
Ą
Full daylight viewable screen greater than 800 nits (typ.)
Ą
Optional Night Vision Imaging System (NVIS) compatible to MIL-STD-3009
Ą
Optional ultra-rugged “boot-kick” glass for a virtually unbreakable screen
Ą
Resistive touchscreen with glove and/or stylus operation with EMI shielding
Ą
Bezel keys for Power, Blackout, Zeroize, Brightness, NVIS, Video Source, and “Shift”
Ą
Operates over -20°C to +80°C (no heater) or over -40°C to +80°C (with optional heater)
Ą
MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD-461F, up to IP66 compliant http://www.gms4sbc.com/smartview
General Micro Systems, Inc. www.gms4sbc.com 78 September 2020
jmalaney@gms4sbc.com
800-307-4863
www.linkedin.com/company/general-micro-systems
MILITARY EMBEDDED SYSTEMS Resource Guide
@gms4sbc www.militaryembedded.com
A One-Stop Source for MIL-STD-1553 Components Holt has been supplying MIL-STD-1553 ICs to the military and aerospace industries since 2001 and is a one-stop source for all MIL-STD-1553 components. In addition to Holt’s proprietary products, Holt offers drop-in replacements for existing competitor industry standard solutions, providing customers with a cost effective alternative, reducing lead times and mitigating future product obsolescence issues. Holt is the recipient of numerous supplier awards and coupled with its unparalleled technical support and customer service, Holt stands out as the number one choice for MIL-STD-1553 components. Holt’s products cover the entire gamut of MIL-STD-1553 functionality, including protocol ICs, IP cores, transceivers and transformers. Holt specializes in mixed signal IC design, integrating both digital protocol and analog transceiver functions on a single IC. Select products also integrate MIL-STD-1553 transformers, transceivers and protocol in a single package, providing customers with the highest level of integration necessary to minimize size, weight, power and cost (SWaP-C).
FEATURES Ą IP Core Family: HI-6300 Ą Protocol, RAM, dual transceivers and dual transformers in a single Ą Ą Ą Ą
15mm x 15mm package: HI-2130 TM Protocol ICs with integrated transceivers: HI-6130 and MAMBA Error-correcting code (ECC) RAM or RAM parity with BIST Unparalleled free technical support including plug-and-play reference designs and software Drop-in replacements for existing competitor industry-standard solutions DO-254 Design Assurance Level A Compliant options
www.holtic.com/AD2020SeptA-MilEmbeddedRG-Mil1553.html
Ą
Holt Integrated Circuits
+1 949-859-8800
www.holtic.com
sales@holtic.com
www.linkedin.com/company/holt-integrated-circuits
www.twitter.com/holtic (@holtic) Embedded Hardware
IC-INT-VMEc– 6U VME Intel® Xeon® D-15xx SBC The IC-INT-VMEc is a high-performance and low-power Single Board Computer for 6U VME systems. With up to 8 cores, the on-board Intel® Xeon® D-1519/1539 supports high-performance & high-throughput processing for critical computing applications. The IC-INT-VMEc is offered in many variants which include up to 32 GB DDR4 with ECC, a scalable and secured SATA NAND SSD, two M.2 connectors for extra SSD, two PMC/XMC slots, GPIOs, USB & serial interfaces, VGA or DVI interface. In addition, this VITA 31.1-compliant embedded computing board provides four Gigabit Ethernet ports (two on the front panel and two on the backplane) and the VME64x backplane interface is supported by an FPGA running field-proven VME IP which was developed and is supported by Interface Concept.
FEATURES Ą 6U VME Ą Intel® Xeon® processor D-15xx
Finally, the IC-INT-VMEc is delivered with an optimized UEFI Boot Loader and a Linux BSP (VxWorks® can be made available on request). This VME board is available in standard, extended, rugged air-cooled and conduction-cooled grades.
Ą Up to 32 GB DDR4 with ECC Ą One VGA or DVI Ą Two PMC/XMC slots
www.interfaceconcept.com
Interface Concept
www.interfaceconcept.com www.militaryembedded.com
info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept
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LoC-600 Conduction Cooled Chassis with Liquid Assist Part of our line of liquid cooled enclosures, the LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX VITA 48.2 conduction cooled systems. High speed defense applications demand leading edge thermal solutions to manage hot, power hungry board payloads. The LoC-600 employs a liquid over conduction cooled design concept that dramatically increases cooling capacity compared with conduction only chassis. The chassis provides liquid cooling assist to readily available and proven VITA 48.2 conduction cooled board sets with total dissipated power of up to 600W. Coolant is channeled through dual chassis side walls and across the card edges in a liquid-flow-by manner that draws excess heat away from hot module components. The design maintains safe card edge temperatures while operating in ambient temperatures as high as 85°C. Quick disconnect inlet and outlet points accept a variety of fluid options including 50/50 propylene glycol and water which prevents fluid freeze for low input temperatures that maximizes heat removal. The chassis is designed to meet a variety of MIL-STD-810, MILSTD-461, and MIL-S-901D standards for reliable operation in tough environments in mission critical applications. Direct connect backplane and I/O panel ensures optimal signal integrity, eliminates cabling, improves shock and vibration performance and simplifies maintenance procedures. The lightweight aluminum alloy chassis is sealed to provide ingress and EMI protection.
FEATURES Ą Cooling for up to 600W of total dissipated power Ą Side cold plate fluid channels envelope the payload for
maximum heat dissipation
Ą 6 slot backplanes, including up to 2 power supply slots Ą Designed for readily available VITA 48.2 conduction cooled
modules Ą Designed to meet MIL-STD-810, MILSTD-461, and MIL-S-901D DoD standards Ą Custom backplane topologies supporting your payload module profiles Ą VPX and SOSA-aligned slot profiles Ą Rugged bolt together construction Ą Tested at 55°C and 85°C ambient temperatures Ą Compact lightweight design for SWaP sensitive applications Ą Custom I/O panel with MIL-STD 38999 options for high speed signals
LCR has designed over 45 custom backplanes which include VPX and SOSA-aligned slot profiles in combinations supporting high speed signal applications. The LoC-600 has room for 6 x 3U VPX module slots including 1 or 2 power slots for VITA 62 pluggable power supplies. Work with our design team to develop the backplane for your application. The compact and highly efficient design of the LoC-600 is intended for space constrained installations in a wide range of ground combat vehicles. Leading edge VPX payloads can address applications including electronic warfare, signal intelligence, radar, high speed graphics, video and sensor processing, mission computing systems, weapons control systems, communications platforms and a wide array of additional C4ISR applications. Standard and custom I/O panels may support high speed connectivity with high density MIL-STD 38999 circular connectors, high speed 10GbE 38999 Hercules connectors and rugged SMA connectors for RF and optical I/O.
LCR Embedded Systems
www.lcrembeddedsystems.com 80 September 2020
www.lcrembeddedsystems.com LCR Embedded Systems – Serving critical defense programs for over 30 years
sales@lcrembedded.com 215-760-9909 www.linkedin.com/company/lcr-embedded-systems-inc-
MILITARY EMBEDDED SYSTEMS Resource Guide
@LCREmbedded
www.militaryembedded.com
M+ Secure Cryptographic Modules Memkor® M+ Secure© Cryptographic Modules are rugged PCIe and SATA FIPS 140-2 compliant solid state devices. Shown are 2.5" SATA, U.2 PCIe/NVMe, and M.2 SATA module form factors currently on the NIST Modules In Process List for the full validation. The NIST FIPS 140-2 standard validates the implementation of security functions that include critical security components such as key generation and management, encryption engine, user role/identity based authentication, and physical security. It also includes strict configuration management of the cryptographic module hardware and software. M+ Secure architecture is used now across all Memkor standard and non-standard hand-held and fixed solid state form factors. All modules are now FIPS 197 validated and truly FIPS 140-2 compliant. Shown, as an example, is Flexible Ruggedized External Drive (FRED) – interfaced through a 38999 connector, highly ruggedized and sealed SATA or USB Flash Drive.
Memkor, Inc.
www.memkor.com
FEATURES Ą FIPS 140-2 AES-256 XTS Cryptographic Modules Ą 2.5"/U.2/M.2 PCIe/NVMe and SATA interfaces Ą Up to 4TB FIPS 140-2 and up to 24TB FIPS 197 validated modules Ą Rugged for -40C to 85C and up to 30 G RMS operation Ą HiVibe© 20,000 insertion 2.5" SATA connector option Ą Hardware and Software Write Protect and Data Elimination options Ą End-to-end user data protection, operation monitoring and reporting
sales@memkor.com
602.424.6246
Embedded Hardware
Rugged Embedded Computers up to 9th Gen. i7 and Xeon Server The PIP Family, CEC, and MXCS Server are powerful, highly integrated, robust and fanless embedded computer solutions. Selection of the components are purely made on the subject for long-term availability and low power consumption. The systems can be expanded in a very modular way and represent a unique solution for today's demanding and flexible defense requirements. The products are designed to operate under extreme and normal conditions without the need of fans. MPL solutions are engineered and manufactured in Switzerland to meet MIL STD-810 as well as other MIL standards. The systems include features like wide DC input, reverse polarity and more. Additional GPGPU, GPS, WLAN, CAN, 1553, ARINC, Sound, and UPS modules are available.
MPL AG Switzerland www.mpl.ch
www.militaryembedded.com
FEATURES Ą Ą Ą Ą Ą Ą Ą
Soldered CPU Ethernet (up to 10Gbit), USB (3.1/2.0), Serial ports… PCIe, XMC, mPCIe, PCIe/104, MXM, m.2 expansion Extreme low power consumption Compliance: e.g. DO-160G, MIL-STD-461, -704, -1275 Availability 10+ years (repair 20+ years) Optional -40°C to 85°C environment temperature
T h i n k L o n g - Te r m
info@mpl.ch
www.linkedin.com/companies/mpl-ag
–
Think MPL
+41 56 483 34 34 http://twitter.com/mpl_ag
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Embedded Ethernet Switches MilSource is the proud US distributor of Techaya Ethernet switches. Techaya’s complete line of Embedded Ethernet Switches are purposebuilt, from PCB up, to meet the extreme environmental, quality and SWAP-C requirements of UAV, robotics, electronic warfare and other mobile military platforms. Whether you need managed or unmanaged Ethernet, we have solutions that provide from 8-52 ports of Ethernet connectivity for the simplest application running Fast Ethernet to the most complex environment supporting video and other applications that require speeds up to 10 Gigs. Every product includes: 1) 2) 3) 4)
Ą 8, 14, 24, 28 & 36 1G and up to 4 x 10G ports available Ą Shock and vibration tolerant Ą MILSTD-810F/G/GM when housed in an appropriate enclosure
Rapid prototyping: Each board-level solution has a corresponding development breakout-board to enable rapid prototyping.
www.militaryethernet.com
Ą Ultra-compact Ą Layer 2+ or and Layer 3 Switches and routers
Ground-up rugged componentry Conformal coating Passive cooling so no moving parts Board-to-board connectors
MilSource
FEATURES
Ą -45 to +75º C operating range
info@milsource.us
www.linkedin.com/company/milsource
www.militaryethernet.com 310-694-9930 twitter.com/Mil_Ethernet
Embedded Hardware
Pre-packaged Ethernet Switches With the best combination of size, weight, power and cost in the industry, Techaya’s complete line of pre-packaged solutions are ideal for mobile Ethernet-equipped platforms such as electronic warfare pods, unmanned and manned, airborne, ground and underwater vehicles Choose from a selection of both unmanaged and managed solutions supporting Layer 2+ features with speeds from Fast Ethernet to 10 Gigabits per second. Designed for extreme environments, all our solutions are designed with passive cooling, flexible power (even PoE solutions), and ruggedized housing with sealed connectors to ensure performance, when exposed to shock and vibration, fluid contamination (water, oils, humidity, etc), corrosion, and direct sun exposure.
www.militaryethernet.com 82 September 2020
Ą Ultra-compact
Ą Layer 2+ Managed or Unmanaged Ethernet
Ą 8, 14, 24, 28 1G and up to 4 10G ports available
Ą MIL-STD-810F/G/M, MIL-STD-461E, MIL-STD-1275, MIL-STD-704A,
IP67/68
Ą -45 to +85º C operating range Ą Wide range of power options
Ą Quick availability and turn around
www.militaryethernet.com
MilSource
FEATURES
info@milsource.us
www.linkedin.com/company/milsource
MILITARY EMBEDDED SYSTEMS Resource Guide
310-694-9930 twitter.com/Mil_Ethernet
www.militaryembedded.com
Miniature Rugged Nano-D Connectors Omnetics’ Nano-D connectors serve mainly in military and aerospace applications. These devices and the modern chip technology that makes them possible impact circuit board designs as well as connector and cable selections. They are fueling the demand for miniaturization at lower voltages and current levels. Our Nano-D connectors serve design engineers well in this new era. Nano-D connectors are designed to perform at military specification levels for high reliability and to remain working in both portable applications and extreme environments. Most Nano-D connectors evolved rather directly from the older Micro-D connectors and follow similar specifications. Smaller Nano-D connector designs often use a 17,200ksi beryllium copper spring-pin-tosolid-socket design to ensure signal integrity during use. Portable high-speed digital signal processing devices are expanding the demand for small, lightweight cable and connectors. Nano-D connectors are especially well suited for these ruggedized, environmentally sensitive applications. When specified, cable, signal-speed capability, and formats are designed to match the ultra-small Nano-D connectors. Designs include IEEE 1394 fire-wire cable and extend to USB 3.1 format sand CAT 6a wiring. Many of these formats support a wide range of new designs, ranging from circuitry used in small military unmanned vehicles to soldier-worn equipment.
Omnetics Connector Corporation www.omnetics.com
FEATURES Small size Light weight Ą Extreme durability Ą Meets and exceeds MIL-DTL-32129 Ą -55ºC to 125ºC (200ºC with HTE) Ą 1 AMP per contact Ą
Proudly engineered and built in USA
Ą
www.omnetics.com
sales@omnetics.com +1 763-572-0656 @Omnetics www.linkedin.com/company/omnetics-connector-corporation/
Embedded Hardware
Latest Innovations for OpenVPX, SOSA, & SpaceVPX Pixus offers a wealth of creative solutions for your OpenVPX, SOSA/HOST, and SpaceVPX needs. Our high-performance backplanes are available in a wide range of VITA 65 and SOSA profiles, with various configurations of VITA 66 (optical) and/or VITA 67 (RF) slot options. The 1U - 4U SlimBox OpenVPX chassis line provides a compact and versatile platform for 3U, 6U and 3U/6U hybrid system requirements. The dual depth open frame enclosure supports standard 160mm OpenVPX boards and 220mm SpaceVPX boards in the same chassis. Both card guides types are available for air-cooled and conduction-cooled boards in each depth. Our Rugged Rackmount OpenVPX chassis line is designed for the harsh environments to meet MIL STD 810, MIL STD 461, & more.
Contact Pixus to discuss your application today!
FEATURES Ą Rugged and commercial designs in various sizes & configurations Ą Backplane design expertise to 100GbE speeds, RT3 connector Ą 1U – 4U SlimBox OpenVPX for compact and versatile 3U, 6U, and 3U/6U
hybrid needs Ą Rugged rackmount and ATR enclosures for advanced OpenVPX/SOSA requirements Ą Dual depth VITA 78 SpaceVPX open frame development enclosure Ą OpenVPX Chassis Managers & specialty OpenVPX products
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
Pixus Technologies
www.pixustechnologies.com www.militaryembedded.com
info@pixustechnologies.com
www.pixustechnologies.com 519-885-5775
MILITARY EMBEDDED SYSTEMS Resource Guide
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XEM8350 The XEM8350 Kintex UltraScale based FPGA module offers a turnkey dual Super-Speed USB 3.0 host interface using Opal Kelly’s FrontPanel SDK. System integrators can build fully-operational prototype and production designs quickly by integrating this device into their product. Manufacturers of high-speed devices such as JESD-204B data acquisition devices can launch fully-functional evaluation systems without the costly design and maintenance of an evaluation platform. As an industry first, the XEM8350 features two fully-independent SuperSpeed USB 3.0 ports for high-bandwidth applications requiring duplex operation or over 650 MB/s bandwidth. The FrontPanel SDK includes a multi-platform API (Windows, macOS, and Linux) and very low logic utilization on the FPGA.
FEATURES Ą Dual SuperSpeed USB 3.0 ports for high-bandwidth data transfer Ą Xilinx Kintex UltraScale XCKU060 or XCKU115
Memory-hungry applications enjoy access to 4 GiB of on-board DDR4 memory with a 64-bit wide data bus and ECC.
Ą 4 GB DDR4 SDRAM with (64-bit with ECC)
Typical applications include ultra high-performance data acquisition such as: • Remote Sensing • LIDAR and RADAR • Photonics • Video / Image Capture • Advanced Metrology • Software-Defined Radio (SDR) • Data Ingestion Acceleration • 5G Systems
Ą 28 multi-gigabit transceivers
Opal Kelly Incorporated www.opalkelly.com
Ą Over 330 I/O pins on three Samtec QTH connectors Ą Small form-factor: 145mm x 85mm Ą On-board programmable oscillator
https://opalkelly.com/products/xem8350/
sales@opalkelly.com
opal-kelly-incorporated
217-391-3724
@opalkelly
Embedded Hardware
XEM7360 The XEM7360 Kintex-7 based FPGA module offers a turnkey SuperSpeed USB 3.0 host interface using Opal Kelly's FrontPanel SDK. System integrators can build fully-operational prototype and production designs quickly by integrating this device into their product. Manufacturers of high-speed devices such as JESD-204B data acquisition devices can launch fully-functional evaluation systems without the costly design and maintenance of an evaluation platform. With ample logic resources, the Kintex-7 is well-suited for signal processing, image processing, and other logic-heavy acceleration tasks. Memory-hungry applications enjoy access to 2 GiB of on-board DDR3 memory with a 32-bit wide data bus. Celebrating over 10 years of USB FPGA connectivity, Opal Kelly’s FrontPanel SDK fully supports the XEM7360 for real-world transfer rates in excess of 340 MiB/s. FrontPanel includes a multi-platform (Windows, Mac, Linux) API, binary firmware for the on-board Cypress FX3 USB controller, and atomic HDL modules to integrate into your design. FrontPanel is the industry's most full-featured, high-performance, turnkey solution for professional-grade USB connectivity.
Opal Kelly Incorporated www.opalkelly.com 84 September 2020
FEATURES Xilinx Kintex-7 XC7K160T or XC7K410T Ą 2 GiB DDR3, 2x 16 MiB serial flash Ą Two Samtec QSH-090 expansion connectors Ą Up to 193 user I/O + 8 Gigabit Transceivers Ą Low-jitter 200 MHz and 100 MHz clock oscillators Ą Integrated voltage, current, and temperature monitoring Ą Small form-factor: 100mm x 70mm x 19.65mm Ą
https://opalkelly.com/products/xem7360/
sales@opalkelly.com
opal-kelly-incorporated
MILITARY EMBEDDED SYSTEMS Resource Guide
217-391-3724
@opalkelly
www.militaryembedded.com
Model 6001 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Module The Quartz Model 6001 is a high-performance Quartz eXpress Module (QuartzXM) based on the Xilinx Zynq UltraScale+ RFSoC FPGA. The RFSoC FPGA integrates eight RF-class A/D and D/A converters into the Zynq’s multiprocessor architecture, creating a multichannel data conversion and processing solution on a single chip. The Model 6001 has been designed to bring RFSoC performance to a wide range of different applications by offering the FPGA in a small system on module solution measuring only 2.5 by 4 inches. In addition to the RFSoC FPGA, the 6001 includes all of the support circuitry needed to maximize the performance of the RFSoC. The 6001 is available on standard form factor carriers. The Pentek Model 5950 delivers the 6001 as a 3U OpenVPX Commercial Off The Shelf (COTS) board available in air cooled and fulled rugged and conduction cooled versions. In many applications, the 3U VPX standard form factor carrier can provide a final, deployable turn-key solution. In situations where only a custom form factor will satisfy the application requirements, Pentek supports the 6001 with a design kit for users to engineer and build their own custom carrier. As a complete and tested module, the QuartzXM encapsulates bestin-class electrical and mechanical design, eliminating some of the most challenging aspects of embedded circuit design and allowing the user to focus on the application specific carrier design.
Extendable IP Design For applications that require specialized functions, users can install their own custom IP for data processing. The Pentek Navigator FPGA Design Kits (FDK) include the board’s entire FPGA design as a block diagram that can be edited in Xilinx’s Vivado IP Integrator. In addition to the IP Integrator block diagrams, all source code and complete IP core documentation is included. Developers can integrate their own IP along with the Pentek factory-installed functions or use the Navigator kit to completely replace the Pentek IP with their own. The Navigator Board Support Package (BSP), the companion product to the Navigator FDK, provides a complete C-callable library for control of the 6001’s hardware and IP. The Navigator FDK and BSP libraries mirror each other where each IP function is controlled by a matching software function, simplifying the job of keeping IP and software development synchronized. The Navigator BSP includes support for Xilinx’s PetaLinux running on the ARM Cortex-A53 processors. When running under PetaLinux, the Navigator BSP libraries enable complete control of the 6001 either from applications running locally on the ARMs, or using the Navigator API, control and command from remote system computers.
FEATURES
Ą
Unique QuartzXM eXpress Module enables deployment in custom form factors Measures only 2.5 by 4 inches Supports Xilinx Zynq UltraScale+ RFSoC FPGAs 16 GB of DDR4 SDRAM LVDS connections to the Zynq UltraScale+ FPGA for custom I/O GTY connections for gigabit serial communication Ruggedized and conduction-cooled versions available Includes a complete suite of IP functions and example applications
Ą
SOSA™ aligned with Pentek’s Model 5550 3U VPX Board
Ą
Ą Ą Ą Ą Ą Ą
www.pentek.com/go/6001rg
Pentek
www.pentek.com www.militaryembedded.com
sales@pentek.com
www.linkedin.com/company/pentek
201-818-5900
@pentekinc
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PHALANX II NAS File Server The Phalanx II is a rugged Small Form Factor (SFF) Network Attached Storage (NAS) File Server, specifically tailored for the avionics, military and rugged industrial market. The system offers the best utilization of Size, Weight and Power (SWaP) and adherence to Commercial Off the Shelf (COTS) standards in the industry. Utilizing two military grade solid state disk storage devices (fixed or removable), the Phalanx II will support a variety of network-based file systems that allow for multiple hosts to store and share information. Network connections are provided through four load balanced Gigabit Ethernet ports, and can support optional dual optical 10 Gigabit Ethernet ports for low EMI susceptibility. Management is via a convenient web based GUI or CLI. System and storage health and performance monitoring capabilities include SMART, SNMP (read-only), and Email notification. The optional dual removable storage bay is available for ready access to the storage media, allowing for fast data availability for ground station analysis, and quick mission turnaround and declassification.
Phoenix International www.phenxint.com
FEATURES Ą CPU: Intel Core i7-6822EQ
Phoenix International is an AS9100D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.
Ą FIPS 140-2 Validated AES 256 Encryption Ą Two SSDs (fixed or removable) up to 16TB ea, 32TB total Ą Network Services: NFS (V3/V4), SBM/CIFS, FTP, TFTP, RSYNC, SSH Ą Temp: -40°C to +71°C (Op.), -40°C to +85°C (Non-Op.) Ą MIL-STD-810F, MIL-STD-461F,
MIL-STD-704F/1275D Ą Weight: < 6lb with fixed SSDs
Made in the USa
www.phenxint.com/portfolio/phalanx-ii/
info@phenxint.com
714-283-4800
www.linkedin.com/company/phoenix-int-systems Embedded Hardware
VP1-250-eSSDC The VP1-250-eSSDC is a Conduction Cooled (VITA 48) Open VPX NVMe Solid State Disk storage module that delivers extremely high performance via a single fat pipe (PCIe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. NVMe is an industry standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. The NVMe protocol was established in collaboration by server industry leaders to standardize a scalable PCIe interface, making it easier for designers to unlock the full potential of PCIe. NVME provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed – both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems. Phoenix International is an AS9100D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.
Phoenix International www.phenxint.com 86 September 2020
FEATURES Ą Storage Capacity to 8TB Ą Sequential 128KB read: 1.2GB/sec, write: 1.2KB/sec Ą Operational Altitude to 80,000 Feet Ą Operational Temperature from -40 degrees to +85 degrees C Ą Streamlined protocol with efficient queuing mechanism to scale
with multi-core CPUs
Ą Optional AES 256/FIPS140-2 Encryption Ą Also Available in Air Cooled Configurations
Made in the USa
www.phenxint.com/portfolio/rugged-open-vpx-nvme-ssd-module/
info@phenxint.com
714-283-4800
www.linkedin.com/company/phoenix-int-systems
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
RTD Off-the-Shelf Mission Computer RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, mSATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integrity of the environmental seal.
RTD Embedded Technologies, Inc.
FEATURES Ą -40 to +85°C standard operating temperature
Ą Designed for high ingress protection in harsh environments Ą Milled aluminum enclosure with integrated heat sinks and
heat fins
Ą Rugged Intel and AMD-based Single Board Computers Ą High-performance, synchronized power supply
Ą mSATA card carrier and optional 2.5" removable drive
Ą Designed to include an additional PCIe/104, PCI/104-Express
or PCI-104 peripheral module without increasing overall enclosure size
www.rtd.com
www.rtdstacknet.com/iot
sales@rtd.com
814-234-8087
Embedded Hardware
Managed Scalable GigE Switch The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports. Eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides features for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH. www.rtd.com
RTD Embedded Technologies, Inc. www.rtdstacknet.com www.militaryembedded.com
FEATURES Ą -40 to +85°C operation, passively cooled Ą PCIe/104 stackable bus structure Ą Eight 1000/100/10 Mbps Ethernet ports plus one host port and one
stacking switch expansion port
Ą Onboard tri-color LED for each Ethernet Port Ą RJ-45 jacks or 10-pin right-angle headers Ą Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet
processing • Support for all major Enterprise switching features such as VLANs, Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interface Ą Onboard PCI Express Ethernet Controller for interface to host cpuModule Ą USB Device Port for Serial Console command-line interface Ą Passive heat sink included • Available in stackable, rugged enclosures
sales@rtd.com
814-234-8087
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Embedded Hardware
Military Embedded Systems Resource Guide
Embedded Hardware Intel Atom E3800-based SBC RTD’s Intel Atom E3800-based single board computers are available in PCIe/104 and PCI/104-Epress. These CPUs are exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. Available in quad-core, dual-core, and single-core configurations. Stackable buses allow users to add peripheral modules above and below the CPU. TPM 2.0 support and ECC memory available. All models include 4GB surface-mount single-channel DDR3 SDRAM and a 32GB industrial-grade surface-mount SATA flash drive. Thermal-optimized passive heat sink included.
FEATURES Ą PCIe/104 and PCI/104-Express stackable bus structures Ą Available in modular, rugged enclosures and eBuild systems Ą Intel Atom E3800 Series Processor, Clock Speed: 1.33 GHz, 1.46 GHz, and
1.91 GHz options, Max. Core Temperature: 110°C
Ą 4GB Single-Channel DDR3 SDRAM with ECC (Surface-Mounted) Ą 32GB Surface-mounted industrial-grade SATA flash drive Ą 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 9 USB ports, Dual Gigabit
Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/O, TPM encryption Ą -40 to +85°C standard operating temperature www.rtd.com
RTD Embedded Technologies, Inc. www.rtd.com/atom
sales@rtd.com
814-234-8087
Embedded Hardware Dual 10 Gbit/s Copper Ethernet RTD’s LAN24550 is a dual 10 Gbit/s Copper Ethernet Module utilizing Intel’s X550 10 GbE controller. The X550-AT2 Ethernet controller is a second-generation 10GBASE-T controller with integrated MAC and PHY. It provides backward compatibility with existing 1000BASE-T, simplifying the migration to 10 GbE, and provides iSCSI, FCoE, virtualization, and Flexible Port Partitioning (FPP). 10 Gigabit – using stacked switch configurations – can introduce an increased use of redundancy as Active-Active LACP port teaming. Multiple ports grouped into one logical link improves speed and availability.
FEATURES Ą PCIe/104 and PCI/104-Express stackable bus structures Ą Intel X550 10 Gigabit Ethernet Controller Ą 2 Independent 10 Gb/s Twisted Pair Ethernet Connections
with Integrated MAC and PHY
Ą RJ-45 connectors with integrated magnetics and
Link/Activity indicator LEDs
Ą 10/1 GbE data rate per port: support for vision systems,
network and server virtualization, and LAN and SAN flexibility Ą -20 to +70°C standard operating temperature
www.rtd.com
RTD Embedded Technologies, Inc. www.rtd.com 88 September 2020
sales@rtd.com
MILITARY EMBEDDED SYSTEMS Resource Guide
814-234-8087
www.militaryembedded.com
Dual 10 Gbit/s Fiber Ethernet RTD’s LAN24710 is a dual 10Gbit/s Fiber Ethernet module utilizing Intel’s X710 GigE controller. Fiber connectivity is provided by standard SFP+ modules allowing the board to be used with various standards including 10GBASE-SR, 10GBASE-LR, and SFP+ Direct Attach Cable. The X710-BM2 Ethernet controller is ideal for emerging cloud network networking markets. X710 strengths include networking performance, energy efficiency and automation (including resource provisioning and monitoring and workload balancing) and sophisticated packet header parsing.
FEATURES Ą PCIe/104 and PCI/104-Express stackable bus structures Ą Intel X710 10 Gigabit Ethernet Controller Ą 2 Independent 10 Gb/s Fiber Ethernet Connections Ą SFP+ module sockets to support 10GBASE-SR,
10GBASE-LR SFP+, and Direct Attach Cable
Ą 10/1 GbE data rate per port: support for vision systems,
network and server virtualization, and LAN and SAN flexibility Ą -40 to +85°C standard operating temperature (Note: operating temperature may be limited by any installed SFP modules)
www.rtd.com
RTD Embedded Technologies, Inc.
www.rtd.com
sales@rtd.com
814-234-8087
Embedded Hardware
XPedite7683 XPedite7683 is a secure, high-performance, 3U OpenVPX™, single board computer based on the Intel® Xeon® D-1500 family of processors. Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4-2133 ECC SDRAM, and XMC support, the XPedite7683 is an optimal choice for computationally heavy applications requiring maximum data and information protection. XPedite7683 integrates SecureCOTS™ technology with a Microsemi SmartFusion®2 security SoC for hosting custom functions to protect data from being modified or observed, and provides an ideal solution when stringent security capabilities are required. The Microsemi SmartFusion®2 can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through GPIO directly connected to the VPX backplane. Circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork provide additional protection to the physical hardware. XPedite7683 maximizes network performance with two 10 Gigabit Ethernet interfaces and two Gigabit Ethernet interfaces. It accommodates up to 32 GB of DDR42133 ECC SDRAM in two channels and up to 256 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 through the backplane connectors. The XPedite7683 provides additional expansion capabilities with an integrated XMC site, which includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.
Extreme Engineering Solutions (X-ES) www.xes-inc.com www.militaryembedded.com
FEATURES Ą Supports Intel® Xeon® D-1500 family processors (formerly
Broadwell-DE)
Ą Up to 16 Xeon®-class cores in a single, power-efficient SoC
Ą Ą Ą Ą Ą
sales@xes-inc.com
package. 4-, 8-, or 12-core SKUs available with native extended temperature support. Up to 32 GB of DDR4-2133 ECC SDRAM in two channels Ruggedized Enhanced Design Implementation (REDI) per VITA 48 Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi SmartFusion®2 SoC with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash Two 10 Gigabit Ethernet ports and two Gigabit Ethernet ports, four SATA ports, and two USB 2.0 ports www.xes-inc.com/products/sbcs/xpedite7683/
608-833-1155
www.linkedin.com/company/extreme-engineering-solutions MILITARY EMBEDDED SYSTEMS Resource Guide
@XES_INC
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Military Embedded Systems Resource Guide
Embedded Hardware
A FINE TECHNOLOGY GROUP
cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry. Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options. Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.
Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots. All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.
FEATURES Ą
Most rack accessories ship from stock
Ą
Modified ‘standards’ and customization are our specialty
Ą
Card sizes from 3U x 160mm to 9U x 400mm
Ą
System monitoring option (CMM)
Ą
AC or DC power input
Ą
Power options up to 1,200 watts
Made in the USA Since 1947
For more detailed product information, please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.
Vector Electronics & Technology, Inc. www.vectorelect.com 90 September 2020
inquire@vectorelect.com
MILITARY EMBEDDED SYSTEMS Resource Guide
800-423-5659
www.militaryembedded.com
Your answer to make it smaller, lighter and faster – the ZM3 Mission Computer offers full computing capability in a small, rugged package. This lightweight powerhouse packs in a 16-Core, Intel® Xeon D™ processor, three PCIe expansion slots, up to two removable NVMe storage drives and double-wide COTS high-end graphics cards making it the most compute dense, rugged computing solution on the market. IDEAL FOR AIRBORNE ISR APPLICATIONS Weighing less than 10 lbs., the ZM3 Mission Computer was designed specifically to minimize size, weight and power for airborne ISR applications and meets full DO-160 compliance for airborne environments. COM EXPRESS TYPE 7 BASED SYSTEM ARCHITECTURE The ZM3 utilizes the COM Express Type 7 architecture to create a versatile system that can be configured to fit application requirements. Com Express Type 7 supports up to four 10GbE interfaces and enables 32 PCI Express lanes to support NVMe storage and multiple lanes for PCIe expansion cards. NVME BASED TRANZPAK 1 REMOVABLE STORAGE Further reducing weight, the ZM3 can house up to two TranzPak 1 rugged storage drives (up to 4TB), which utilize the latest NVMe technology to provide storage read/ write speeds up to 3x faster than SATA and only weigh 10oz. each.
FEATURES Ą Compact size: 4.6" W x 5.6" H x 14" D Ą Lightweight aluminum construction, weighing less than 10 lbs. Ą 450W, 18-36V DC power input with EMI filter Ą Up to 16 core, 1.3ghz+ Intel® Xeon® processor Ą Flexible PCI expansion options: up to 3 PCIe cards Ą High performance NVMe based storage Ą Configurable dual serial ports supporting RS422 or RS232
ZMicro, Inc.
https://zmicro.com/zm3
sales@zmicro.com
www.linkedin.com/company/zmicro
858-831-7000 @zmicrosystems
Embedded Software
TRACE32 Integration for Wind River Workbench The Lauterbach TRACE32 Debugger now also operates as a TCF agent. This makes it possible to use the Wind River Workbench or the Eclipse debugger as an IDE and a TRACE32 debugger as a debugging back-end tool. The Target Communication Framework (TCF) was developed by the Eclipse Foundation as a protocol framework with the goal of defining a uniform debugging communication protocol between an IDE and a target system. TCF defines a series of standard services. At the same time, the framework is open for the definition of proprietary services. After the TRACE32 software is started as a TCF agent, it provides its services to the Wind River Workbench or the Eclipse debugger via TCP/IP. Using its TCF services, the TRACE32 debugger can now provide an open communication interface for debugging with Eclipse or the WindRiver Workbench for all processor architectures and compilers supported by TRACE32.
Lauterbach, Inc.
www.lauterbach.com www.militaryembedded.com
FEATURES Ą TRACE32 operates as TCF agent Ą Support for various launch mechanisms Ą Support for all debug relevant TCF services Ą Synchronized debugging between TRACE32 and TCF C/C++ Debugger
in Wind River Workbenchd
Ą Support for multiple projects (multicore) Ą Applicable for all processor architectures supported by TRACE32 Ą Based on Target Communication Framework (TCF)
info_us@lauterbach.com www.lauterbach.com/intwindriver.html
508-303-6812
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ZM3 Mission Computer
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Embedded Software
Lauterbach Debugger for Intel x86/x64 Skylake/Kabylake Lauterbach TRACE32 Debugger for Intel x86/x64: In January of this year, Lauterbach introduced the new CombiProbe Whisker MIPI60-Cv2. The TRACE32 CombiProbe and TRACE32 QuadProbe now offer the same debug features for the Converged Intel® MIPI60 connector: • Standard JTAG, Intel® debug hooks with Pmode, and I2C bus • Merged debug ports (two JTAG chains) • Intel® Survivability features (threshold, slew rate, ...) However, these debug tools have different areas of application. The TRACE32 QuadProbe, which is expressly designed for server processors, is a dedicated debug tool that enables SMP debugging of hundreds of threads on targets with up to four debug connectors. The TRACE32 CombiProbe with the MIPI60-Cv2 Whisker, designed for client as well as mobile device processors, can capture and evaluate system trace data in addition to its enhanced debugging features. Trace capabilities include support of one 4-bit and one 8-bit trace port with nominal bandwidth. The TRACE32 CombiProbe with the DCI OOB Whisker is specially designed for debugging and tracing of form factor devices without debug connectors. If the chip contains a DCI Manager, the target and the debugger can exchange debug and trace messages directly via the USB3 interface. The DCI protocol used to exchange messages supports standard JTAG and Intel® debug hooks as well as trace messages for recording system trace information.
Lauterbach, Inc.
www.lauterbach.com 92 September 2020
FEATURES Ą
Ą Ą
Ą
Ą
CombiProbe MIPI60-Cv2 provides debug and system trace capability Support for standard JTAG, debug HOOKs and I2C bus Support for merged debug ports (two JTAG chains per debug connector) Support for survivability features (threshold, slew rate, etc.) Support for system trace port with up to 8 trace data channels
Ą
128 MByte of trace memory
Ą
SMP debugging (including hyperthreading)
Ą
AMP debugging with other architectures
Ą
BIOS/UEFI debugging with tailor-made GUI for all UEFI phases
Ą
Linux- and Windows-aware debugging
Ą
Hypervisor debugging
info_us@lauterbach.com 508-303-6812 www.lauterbach.com/pro/pro_core_alt01.php?chip=CORE-I3/I5/I7/I9-9THGEN
MILITARY EMBEDDED SYSTEMS Resource Guide
www.militaryembedded.com
Hypervisor Debugging with Lauterbach TRACE32 Debugger Lauterbach provides support for seamless debugging of hypervisor-based systems. The introduction of the unique Lauterbach Machine ID allows the debugger to identify any virtual machine in the system. This gives the debugger full visibility of the context of all active and inactive virtual machines and provides a supporting framework to load OS specific awarenesses for each virtual machine. The most important objective of the TRACE32 hypervisor-awareness is a seamless debugging of the overall system. This means that when the system has stopped at a breakpoint, one can check and change the current state of every single process, all VMs, plus the current state of the hypervisor and of the real hardware platform. The TRACE32 hypervisor-awareness provides the debugger with all of the hypervisor’s information running on the hardware platform. After the OS-awareness is loaded for each guest/VM the debugger can display an overview of the overall system. TRACE32 assigns each VM a number, the machine ID (mid column). The machine ID is a unique identifier that is used by TRACE32 and appears as an address extension; a concept already familiar to TRACE32 users. The Global Task List represents the heart of the TRACE32 hypervisor-aware debugging. It lists all tasks/processes/threads of the guest OSes and the hypervisor. TRACE32 can visualize the context of any task in its GUI. Just double-click to on the task name. The TRACE32 CORE List window displays in detail what is currently running on the individual cores of an SMP system. The TRACE32 GUI visualizes the context of the current core/task by a double-click on the task name in the TRACE32 Global Task List. TRACE32 allows the visualisation of any task, even if its VM is currently not active. Since Lauterbach has systematically extended the well known concepts for OS-aware debugging to hypervisor debugging, it will be easy for TRACE32 users to get started with just a little practice.
Lauterbach, Inc.
www.lauterbach.com
FEATURES Ą Seamless debugging of the total system in stop-mode Ą Hypervisor-awareness as a loadable debug extension is provided
by Lauterbach Ą Machine ID allows the user to uniquely identify any virtual machine in the system Ą Machine ID provides full visibility of context of active and inactive virtual machines Ą OS-awareness can be loaded for each virtual machine
info_us@lauterbach.com www.lauterbach.com/hypervisor.html
508-303-6812
Power Supplies
PSC-6238 800 Watt 3U OpenVPX Conduction Cooled Power Supply The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade. Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.
Dawn VME Products www.dawnvme.com www.militaryembedded.com
FEATURES True 6 Channel supply provides full OpenVPX support Ą Wedge lock conduction cooled module Ą Up to 800 Watts power output with 1 inch pitch form factor Ą Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control Ą Factory programmable power sequencing of all voltage rails Ą Shutdown control for each power rail Ą Over Voltage, Over Current and Over Temp protection Ą
www.dawnvme.com sales@dawnvme.com 800-258-DAWN (3296)
•
510-657-4444
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Hardware
6E10 features up to 26 40/100Gb Ethernet ports
100GbE VPX Switches are SOSA™-Aligned WILDSTAR™ 6E10 (6U) and 3E10 (3U) are next-generation 100GbE Switches that deliver up to 6.4 Tb/s of switching between backplane slots of multiple channels of 100G Ethernet. They have front panel I/O to connect to external data sources, and 6E10 has optional VITA 66.5 optical backplane connectivity. Both are VITA 65-compliant, and align with the SOSA Standard. These rugged high-performance Switches are readily integrated into any SOSA-aligned VPX system, or deployed within Annapolis’ proven WILD100™ EcoSystem. Also available: For InfiniBand support, see WILDSTAR 6B10 6U OpenVPX InfiniBand Switch.
FEATURES Ą Switching
• • • •
Supports 1/10/25/40/100 GbE 6.4 Tb/s of switching capability Industry-leading, true cut-through latency Separate Data and Control Plane Switches
Ą I/O
• Optional 40/100GbE optical interfaces to Front Panel • Optional 40/100GbE optical interfaces to VITA 66 (6E10)
Ą FPGAs
• 2 Xilinx® Zynq® UltraScale+™ MPSoCs
Ą General
• • • • •
Multiple levels of hardware and software security Supports new SOSA/VITA 65 switch profile Air, conduction, air-flow-through, or liquid cooled Hot swappable with air-cooled variants Full BSP included with every order
Ą What Can 100GbE Switches Do for You?
If you require high-performance switching for advanced HPC, ISR, or multi-function EW applications, these turnkey switches with dense, flexible I/O are for you. Contact us today to request a block diagram and additional specifications. MADE IN
In January, the 6E10 Switch ran in an Air Force chassis at TSOA-ID, the first public demonstration of a SOSA-aligned 100GbE switch.
U. S. A.
www.annapmicro.com
Annapolis Micro Systems, Inc.
www.annapmicro.com/product-category/switch-boards/ 94 September 2020
MILITARY EMBEDDED SYSTEMS Resource Guide
wfinfo@annapmicro.com 410-841-2514
www.militaryembedded.com
GM60/61/62/63 Integrates Xilinx Gen 3 RFSoC The WILD FMC+ GM60/61/62/63 ADC & DAC is the industry’s first COTS product to feature the Gen 1 or Gen 3 Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology (ZU27DR, ZU28DR, or ZU47DR) in a FMC+ form factor. This breakthrough RFSoC combines FPGA processing and A/D and D/A Converters in a single chip, giving these cards remarkable density and performance. For maximum performance, pair one RFSoC Card with an Annapolis WILDSTAR 3U OpenVPX or PCIe Baseboard, or pair two Cards with a 6U OpenVPX Baseboard. Annapolis WILDSTAR Baseboards utilize up to four high-performance FPGAs, in addition to the Card’s RFSoC. Also designed for standalone use, the Card is ideal for applications limited by Size, Weight, Power, and Cost (SWaP-C). This small package option is readily-deployed in UAVs, backpacks, handheld devices, and custom-integrated applications.
GM60 shown mounted to 3U Baseboard with blindmate RF out the backplane (VITA 67.3)
FEATURES Part #
ADC/DAC Channels
Max Sample Rate (MSps)
Resolution
GM60
4/4
4,000/6,400
12/14
GM61
2/8
5,000/10,000
14/14
GM62
8/2
5,000/10,000
14/14
4/4
5,000/10,000
14/14
GM63 FEATURES Ą
I/O Connectors
• Optional 50Ω SSMC or VITA 67 • Deliver superior analog performance Ą
Mechanical and Environmental
• Integrated heat sink and EMI/crosstalk shields • Air- or conduction-cooled Ą
Comprehensive and Flexible BSP • • • •
Ą
GM60/61/62/63 integrates Gen 1 or Gen 3 Xilinx RFSoCs
Utilize VHDL or CoreFire Next Application Design Suite Software and firmware full examples Manipulate existing IP and add your own Latest Vivado (2019.1) support
Clock Synchronization
• Software-selectable external clock input or onboard PLL clock MADE IN • All ADCs and DACs across multiple mezzanine cards easily synchronized U. S. A. www.annapmicro.com
Annapolis Micro Systems, Inc.
www.annapmicro.com/rfsoc-products/ www.militaryembedded.com
wfinfo@annapmicro.com
410-841-2514
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OpenVPX
Military Embedded Systems Resource Guide
Power Supplies
M4054 SERIES DC/DC Power Supplies VPX VITA 62 Solutions For over 40 years, Milpower Source has been designing and manufacturing exceptional military power supplies, which can be rapidly tailored for our customers’ unique requirements. Our solutions set the standard for thermal, EMI and shock/vibe management, are compliant with MIL-Standards and are field-proven in the most demanding application environments. WHY CHOOSE MILVPX?
• • • • • • • •
Configurable Power Solutions
FEATURES Ą
VITA 62 & SOSA Aligned
Ą
VITA 46.11 System management
Ą
Feature Rich & Cyber Secure
Ą
Input: 18 to 48VDC
Ą
Output up to 800W
Ą
Efficiency up to 87%
Ą
Ruggedized Mechanical Design VITA and SOSA-aligned Solutions
Ą
Discrete Components High Efficiency and Full Output at Full Load (No Games and No Derating)
Operating Temperature: –55°C to +85°C Designed to meet MIL-STD-461, MIL-STD-704, MIL-STD-810, and MIL-STD-1275
Operates Through Transients Wide Input and Operating Temperature Ranges Outputs can be configured to customer’s needs
https://milpower.com/products/dc-dc-power-supplies/m4054
Milpower Source
https://milpower.com/ 96 September 2020
sales@milpower.com
www.linkedin.com/company/10604170/admin/
MILITARY EMBEDDED SYSTEMS Resource Guide
603-267-8865
www.militaryembedded.com
RTM-9265 & 9380 Rear Transition Modules Universal 6U or 3U VPX Rear Transition Module. 06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector.
RTM-9265
FEATURES: Ą Universal 6U or 3U VPX Rear Transition Module. Ą 06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector. Ą Then Daughter cards are used to breakout individual signal lines. Ą The 06-1019341 Daughter card is for slow signals- uses 2mm headers or direct wire solder connections. Ą The 06-1019342 Daughter card is for fast signals – using Samtec differential pair coax cables. Ą These cables can be loaded for each row of the VPX connector. Ą The two large DB50 connectors have 50 pins each for slow signal break out. Ą The DB50s can be removed to have fast signals exit via Samtec cables. Ą Can be customized by Dawn for your specific connectors if needed (as long as they are available in panel mount version).
RTM-9380
www.dawnvme.com
sales@dawnvme.com 800-258-DAWN (3296)
Dawn VME Products www.dawnvme.com
•
510-657-4444
Signal Processing IC-FEP-VPX3f – VITA 66.5 compliant 3U VPX Kintex® UltraScale™ FPGA board Based on the Xilinx Kintex® UltraScale™ technology, this high-speed 3U VPX FPGA board is designed for the signal-processing-intensive applications of high-performance embedded computing (HPEC) systems. The IC-FEP-VPX3f board is VITA 66.5 compliant and enhances VPX capabilities by offering 12 full-duplex optical lanes on the board’s backplane connectors. The board integrates a user-programmable Xilinx Kintex® UltraScale™ FPGA (KU060, KU85 or KU115), 8GB of 64-bit wide DDR4, two 128 MB of QSPI Flash for bit streams storage, one 128 MB of QSPI Flash for user data storage and one Xilinx Artix®-7 transceiver optimized FPGA.
FEATURES Ą 3U VPX – VITA 66.5 Ą 1*Kintex® UltraScale™ FPGA Ą 2* DDR4 banks (up to 4GB each) Ą 1*Artix-7 control node Ą 1*FMC+ site (VITA 57.4)
The IC-FEP-VPX3f is delivered with host drivers and an example design including hardware IP Resources (VHDL code) that can be used to implement PCI Express Gen2/Gen3 links, 10 Gigabit Ethernet ports (XAUI, 10GBase-KR) and Xilinx Aurora. The board is compatible with the Xilinx development tools (Vivado, platform cable) and supports a VITA 57.4 compliant FMC+ slot. The board is available in standard, air-cooled and conduction-cooled grades (85°C). www.interfaceconcept.com
Interface Concept
www.interfaceconcept.com www.militaryembedded.com
info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept
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Signal Processing
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Space Electronics and Services
POGEE
SEMICONDUCTOR Apogee Semiconductor provides products and technologies for space and other extreme environments. We develop radiation-hardened IC design processes and tools and use those tools to develop state-of-the-art ICs. Our TalRad™ process design kit enables affordable, quick-turn rad-hard IC design and is available for licensing. Our family of rad-hard ICs provide a superior alternative to up-screening COTS devices at a fraction of the cost of traditional radiation hardened ICs. Our products and services are targeted towards enabling small-satellites and large constellations that require high performance, a small form factor and radiation resilience at a lower cost.
AP54RHC Rad-Hard Logic Family
Ą 1.65 VDC to 5.5 VDC operation Ą Extended operating temperature range (-55 °C to +125 °C) Ą Proprietary cold-sparing capability with zero static power penalty
Our AP54RHC rad-tolerant family is tailored for 30krad (Si) LEO satellite constellations. The AP54RHC family includes:
• A wide-voltage level shifter • A 3-input majority voter
Product Highlights: AP54RHC504/5 wide-voltage level shifter
• A single supply transceiver • A variety of 7400 series logic functions
Ą Built-in triple redundancy for enhanced reliability Ą Internal power-on reset (POR) circuitry ensures reliable power up and
power down responses during hot plug and cold sparing operations
Ą Tri-state output drivers
All our rad-hard products are built with cold-sparing and triple-redundancy providing maximum reliability and area savings. A 300krad (Si) version utilizing our TalRad™ rad-hard process is coming soon!
Ą Class 2 ESD protection (4000 V HBM, 500 V CDM)
Apogee Semiconductor
Ą TID resilience of 30 krad (Si) Ą SEL resilient up to LET of 80 MeV-cm2 /mg
sales@apogeesemi.com
972-559-4660
www.linkedin.com/company/apogeesemi/
www.apogeesemi.com
Space Electronics and Services
Radiation Test Solutions, Inc. (RTS) specializes in analyzing and testing semiconductor devices and materials for their ability to perform in harsh radiation environments, whether natural or manmade. Along with critical spacecraft analysis and radiation tolerance characterization, we offer versatile and comprehensive electrical, optical, or thermal solutions that enable predictable product performance in our customer’s target environment. RTS has the most experienced staff, set of capabilities and specialized test equipment within the industry and has obtained DLA lab suitability for all MIL-STD 883 and 750 radiation test methods. No job is too small or too big. Rent our sources or RTS can provide complete turnkey solutions. Ą Aerospace Radiation Effects Testing
• Single event effects (SEE – SEB, SEGR, SEFI) • Total ionizing dose (TID & ELDRS) • Displacement damage dose
• Analyze analog circuits and high-speed digital circuits to find electrical, optical or thermal solutions to enable products to perform in the harsh radiation environment of space.
Ą Aerospace Electronic Design Consulting
• RTS partners with aerospace companies and government contractors to design functioning electronic prototypes targeted to survive in space.
• 100+ years of combined industry experience, our aerospace electronics
Ą Satellite Electrical System Analysis
• Prevent component failure and circuit design issues.
Component and/or system analysis to understand and mitigate long-term parametric degradation, destructive effects, and non-destructive effects on materials, electronics, and optics.
engineers consult with your team to refine concepts and validate designs through rigorous testing procedures. RTS merges the skills of system radiation effects engineers from aerospace firms with expertise honed by decades of radiation effects testing and aerospace circuit design analysis.
The Difference Experience Makes
Radiation Test Solutions, Inc.
www.RadiationTestSolutions.com 98 September 2020
https://www.radiationtestsolutions.com/military
MILITARY EMBEDDED SYSTEMS Resource Guide
719-531-0800
www.militaryembedded.com
ISL70005SEH: Rad Hard Dual Output POL Regulator Renesas’ Intersil ISL70005SEH is a radiation hardened dual output Point-of-Load (POL) regulator combining the high efficiency of a synchronous buck regulator with the low noise of a Low Dropout (LDO) regulator. They are suited for systems with 3.3V or 5V power buses and can support continuous output load currents of 3A for the buck regulator and ±1A for the LDO. The buck regulator uses a voltage mode control architecture and switches at a resistor adjustable frequency of 100kHz to 1MHz. Externally adjustable loop compensation allows for an optimum balance between stability and output dynamic performance. The internal synchronous power switches are optimized for high efficiency and excellent thermal performance. The LDO is completely configurable independent of the switching regulator. It uses NMOS pass devices and separate chip bias voltage (L_VCC) to drive its gate, enabling the LDO to operate with a very low voltage at the L_VIN input. The LDO can sink and source up to 1A continuously, making it an ideal choice to power DDR memory. The ISL70005SEH is available in a space saving 28 Ld ceramic dual flat-pack package or in die form. It is specified to operate across a temperature range of TA = -55°C to +125°C.
FEATURES Ą
Dual output regulator: Sync buck and LDO
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Independent EN, SS, and PG indicators
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±1% reference voltage
Ą
1A current sourcing/sinking capability on LDO
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External clock synchronization: 100kHz to 1MHz
Ą
Ą
Full military temperature range operation • TA = -55°C to +125°C • TJ = -55°C to +150°C
Ą
Ą
Radiation acceptance testing • HDR (50-300rad(Si)/s): 100krad(Si) • LDR (0.01rad(Si)/s): 75krad(Si) SEE hardness (see test report) • No SEB or SEL at LET 86.4MeV • cm2/mg • SET at LET 86.4MeV • cm2/mg <±3% ΔVOUT • No SEFI at LET 43MeV • cm2/mg Electrically screened to DLA SMD 5962-19209
www.renesas.com/products/isl70005seh
Renesas Electronics
www.renesas.com www.militaryembedded.com
https://en-support.renesas.com
www.linkedin.com/company/renesas/
321-724-7000
@RenesasGlobal
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Space Electronics and Services
FPGA Repair & Rework – Column Attachment Services CGA Column Grid Array TopLine® repairs and restores your valuable FPGA components to usable condition by replacing bent and damaged solder columns with fresh solder columns made in USA. Recover your sunk costs by refreshing damaged heritage components and spares parts. TopLine provides turnkey column attachment service. TopLine manufactures Pb80/Sn20 copper wrap solder columns as well as traditional Pb90/Sn10 columns. Even FPGA devices which are soldered to boards can be refreshed to like-new condition.
FEATURES
Daisy Chain CCGA packages for engineering development, profiling and practice.
Pb80/Sn20 Copper Wrap Solder Column Pb90/Sn10 plain solder columns Ą NASA Micro-Coil Springs Ą Turnkey CCGA column attachment services Ą Columns and attachment tool kits produced in USA Ą Xilinx, Actel, Microsemi, Aeroflex, BAE, Honeywell, IBM, Atmel, others Ą See 2-minute Video how solder columns are attached
TopLine Corporation
Column sizes are available to fit every FPGA and ASIC device. We also remove solder balls from BGA devices and replace with solder columns. Solder columns are more reliable than solder balls. Columns absorb stress caused by temperature changes due to differences in the Coefficient of Thermal Expansion (CTE) of large ceramic devices.
www.CCGA.tv
Ą Ą
info@TopLine.tv
800-776-9888
Test & Measurement
Ellisys Bluetooth® Tracker™ Ultra-Portable Bluetooth Low Energy and Wi-Fi Protocol Analyzer The pocket-sized (7.5 x 7.5 x 1.7 cm), bus-powered Bluetooth Tracker supports concurrent capture and analysis of Bluetooth Low Energy and Wi-Fi communications, as well as a wide variety of wired interfaces, including logic signals, host controller interface (HCI) protocols (UART and SPI), Audio I2S, and WCI-2, all visualized over the widely adopted Ellisys software suite. With its innovative reconfigurable radio, the Ellisys sniffer can be updated by software to support changes in the specification, without any change to the hardware, and even without any interaction from the user. The Tracker comes with free lifetime software updates, so all customers can benefit from these great additions free-of-charge! The Ellisys Bluetooth Tracker sniffer supports one-click concurrent capture of Bluetooth Low Energy, Wi-Fi 1x1 802.11 a/b/g/n, 2.4 GHz Spectrum, UART HCI and SPI HCI (2 ports), logic signals, and Wireless Coexistence Interface 2 (WCI-2).
Ellisys
www.ellisys.com 100 September 2020
FEATURES Ą All-in-One: Concurrent capture of Bluetooth Low Energy, Wi-Fi 1x1, raw
spectrum, HCI and logic, all synchronized to sub-microsecond precision
Ą Wideband Capture: Rock-solid capture of all Bluetooth Low Energy
channels
Ą Reprogrammable Digital Radio: Support for new specifications with a
simple software update, without hardware changes
Ą Wi-Fi: Debug your Wi-Fi a/b/g/n and Bluetooth Low Energy connections
simultaneously, as well as coexistence
Ą Raw 2.4 GHz Spectrum Capture: Characterize the wireless environment
and visualize interferences
Ą Professional Software: Use the acclaimed, widely adopted and highly
flexible Ellisys multi-protocol analysis software
Ą Logic Analysis: Visualize digital signals such as GPIOs, interrupts, debug
ports, etc. Concurrently and perfectly synchronized with your Bluetooth Low Energy and Wi-Fi traffic.
sales.usa@ellisys.com
www.linkedin.com/company/Ellisys
MILITARY EMBEDDED SYSTEMS Resource Guide
866-724-9185
@Ellisys1
www.militaryembedded.com
Ellisys Bluetooth® Vanguard™ Advanced Wireless Protocol Analysis System The most advanced, most comprehensive Bluetooth protocol analyzer ever made. Building on a legacy of innovation, the Bluetooth Vanguard All-In-One Wireless Protocol Analysis System delivers new advances designed to ease the increasingly complex tasks of Bluetooth developers. With its revolutionary wideband Digital Radio and integrated Allin-One hardware approach, Ellisys has changed the way Bluetooth protocol capture and analysis is done, by radically overcoming the drawbacks of legacy approaches. The Ellisys wideband capture approach robustly records any packet, at any time, from any neighboring piconet, with zero-configuration and without being intrusive. Vanguard provides synchronized capture and analysis of BR/EDR, Bluetooth Low Energy, Wi-Fi 802.11 a/b/g/n/ac (3x3), WPAN 802.15.4 (all 16 2.4 GHz channels), raw 2.4 GHz RF spectrum analysis, HCI (USB, UART, SPI), generic SPI/UART/I2C/SWD communications, WCI-2, logic signals, and Audio I2S.
Ellisys
www.ellisys.com
FEATURES Ą All-in-One: Fully hardware-integrated, time-synchronized, and truly
Ą Ą Ą
Ą Ą
one-click concurrent capture of BR/EDR, Bluetooth Low Energy, Wi-Fi, WPAN (IEEE 802.15.4), raw RF spectrum, HCI, logic/GPIO, generic I2C, UART, SWD, and SPI, Audio I2S, and WCI-2 Bluetooth Wideband Capture: Easy and rock-solid capture of any traffic on all channels Wi-Fi 802.11 a/b/g/n/ac (3x3) Capture: Extremely accurate and perfectly synchronized Wi-Fi capture accelerated by Ellisys hardware WPAN 802.15.4 Wideband Capture: Concurrent capture of all 16 WPAN 2.4 GHz channels for an unmatched coexistence analysis capability Connection / Power Flexibility: Connect, control, and power the system locally or remotely via networkable GbE or USB 3.1 over Type-C™ Mesh Support: Includes full support for Bluetooth Mesh
sales.usa@ellisys.com
www.linkedin.com/company/Ellisys
866-724-9185
@Ellisys1
Test & Measurement
Ellisys Bluetooth® Explorer™ All-in-One Dual-Mode Bluetooth Protocol Analysis System
Industry’s First All-In-One Wideband BR/EDR and Low Energy sniffer with concurrent capture of Wi-Fi 2x2 802.11 a/b/g/n, 2.4 GHz spectrum, HCI (USB, UART, SPI), WCI-2, logic signals, generic I2C/UART/SPI/SWD, and Audio I2S. With its revolutionary wideband Digital Radio, the Bluetooth Explorer lifts protocol capture and analysis to new heights, radically overcoming the drawbacks of legacy approaches to Bluetooth sniffing. The Ellisys all-in-one wideband sniffer robustly records any packet, at any time, from any neighboring piconet, with zeroconfiguration and without being intrusive. The Bluetooth Explorer can uniquely be updated by software to support changes in the specification, without any change to the hardware, and even without any interaction from the user.
Ellisys
www.ellisys.com www.militaryembedded.com
FEATURES Ą All-in-One: Concurrent capture of BR/EDR, Low Energy, Wi-Fi,
Ą Ą Ą Ą Ą Ą
spectrum, HCI, logic, UART, SPI, I2C, SWD, Audio I2S, and WCI-2, all synchronized to nanoseconds precision Bluetooth Wideband Capture: Easy and rock-solid capture of any traffic, including discovery/connection traffic and SSP pairing Reprogrammable Digital Radio: Support for new specifications without hardware changes Multi-Piconet Support: See multiple piconets and scatternets, without limitations All Protocols and Profiles: Best-of-breed protocol decoding Integrated Audio Analysis: Listen to captured audio over-the-air, including HCI audio and I2S, within the software Spectrum Display: Characterize the wireless environment and visualize coexistence issues
sales.usa@ellisys.com
www.linkedin.com/company/Ellisys
866-724-9185
@Ellisys1
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CONNECTING WITH MIL EMBEDDED
By Editorial Staff
GIVING BACK | PODCAST | WHITE PAPER | BLOG | VIDEO | SOCIAL MEDIA | WEBCAST
GIVING BACK
Catch A Lift Each issue, the editorial staff of Military Embedded Systems will highlight a different charitable organization that benefits the military, veterans, and their families. We are honored to cover the technology that protects those who protect us every day. To back that up, our parent company – OpenSystems Media – will make a donation to every group we showcase on this page. This issue we are highlighting Catch A Lift Fund (CAL), a national nonprofit organization that was established with the aim of helping post-9/11 combat-wounded veterans regain and maintain their mental and physical well-being through access to gym memberships, in-home gym equipment, personalized fitness and nutrition programs, and a peer-support network. CAL was founded in 2010 in memory of Army Cpl. Chris Coffland, by his family and friends; Coffland was killed in Afghanistan in 2009 while serving as an intelligence officer. CAL’s mission – according to information from the organization – is rooted in Coffland’s lifelong belief that through fitness, one can reach their highest potential both mentally and physically. CAL enables the returned veterans to choose where and when to work out, offers options for coaching and accountability, provides mentors for those who want them, and strives to meet each veteran’s unique fitness needs. Since its founding, Catch A Lift has provided 8,500 fitness programs to more than 6,700 veterans and caregivers. The CAL recipients receive gym memberships, in-home gym equipment, personalized fitness and nutrition programs, and a peer-support network. Among the CAL programs are the Women’s Fitness Initiative, an opportunity for female wounded veterans to explore healing and growth through physical fitness; a program that enables gym owners and personal trainers to become involved in rehabilitation and fundraising; and individual benefit evenings aimed at boosting awareness and membership. Moreover, veterans who become part of CAL can also become certified to help train other veterans. For additional information on Catch A Lift fund, please visit https://catchaliftfund.org/.
WHITE PAPER
WEBCAST
FACE Technical Standard, Solving Portability and Affordability Challenges in Avionics
Understanding Key Real-Time Spectrum Analyzer Specifications
Sponsored by CoreAVI, Lynx Software Technologies, and Twin Oaks Computing
Spectrum analyzers are the fundamental instrument used by RF engineers to measure individual signals across a defined frequency band. They capture and display wanted and unwanted signals, enabling a range of measurements including power, frequency, modulation, and distortion. There are several different types of spectrum analyzer system architectures.
Currently, about 70% to 90% of aircraft avionics capability is implemented in software, a level that is both unaffordable and unsustainable. To help with this problem, the Future Airborne Capability Environment (FACE) Technical Standard was developed to reduce cost and time to fielding of avionics systems through reuse of software APIs. In this webcast, several industry experts discuss how FACE tackles these issues, how FACE addresses the challenges of multicore challenge, how the standard deals with safety-certification mandates, and other subjects. Watch this webcast: https://bit.ly/3grHFXT Watch more webcasts: https://militaryembedded.com/webcasts
By Anritsu
This white paper reviews the architecture of real-time spectrum analyzers (RTSA), swept-tuned spectrum analyzers, and vector signal analyzers. Each of these has relative merits and compromises, all of which are discussed. Advances in technology and design have enabled the creation of the first high-performance real-time handheld spectrum analyzer with a 110 MHz analysis bandwidth and a 100% probability of intercept duration of 2.06 μs. Together with the variable persistence density display and spectrogram, this spectrum analyzer is suited to meet challenges in analyzing dynamic RF signal events and detecting transient interferers, and unwanted hidden signals. Read the white paper: https://bit.ly/31pnBB3 Read more white papers: https://militaryembedded.com/whitepapers
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Who better to integrate ADI parts than ADI? Our integrated microwave assembly (IMA) solutions build on ADIâ&#x20AC;&#x2122;s high performance semiconductor portfolio while enabling:
Reduced size, weight, and power
Complete system from signal to power
Alleviation of obsolescence issues
Integrate with confidence at analog.com/IMA
Breakthrough Performance…
Weight No More!
Wideband RF Signal Recorders
Rugged ½ ATR Built for SWaP
Designed for harsh environments and weighing only 18 pounds, the new Talon RTX SFF series captures real-time RF bandwidths of a gigahertz or more. Complete with a removable QuickPac™ drive pack holding terabytes of data, these units offer flexible I/O options and sustained real-time recording rates up to 4 GB/sec! The RTX SFF series is the latest in our COTS Talon recording systems that deliver the industry’s highest levels of performance in the harshest, space-constrained environments. You’ll get high dynamic range, exceptional recording speeds and ample storage capacity for extended missions—all in this compact solution. • Sealed, rugged, ½ ATR chassis for MIL-STD 810 and 461 • Multi-channel recording, A/Ds from 200 MS/s to 6.4 GS/s
Model RTX 2589 with removable QuickPac drive
• Easily removable 61 TB SSD QuickPac drive pack • Ideal for UAVs, military vehicles, aircraft pods and more • Operating temperature from -40°C to +60°C • sFPDP and Ethernet models available
Download the FREE Development Tactics & Techniques for SFF Recorders White Paper www.pentek.com/go/messff
All this plus FREE lifetime applications support! Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2019 Pentek, Inc. Pentek, Talon and QuickPac are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.