@military_cots www.MilitaryEmbedded.com September 2022 | Volume 18 | Number 6 John McHale Print lives! 9 Technology Update Safer battlefield: Use sensors and ML 10 Mil Tech Trends AI drives changes in T&M for radar, EW 32 Industry Spotlight Managing legacy-parts supply chain 46 P 20 MOSA AND JADC2 DRIVING INNOVATION IN MILITARY APPLICATIONSVETRONICS IoT, AI, and the future battlefield By Adam Fish, Ditto RESOURCE GUIDE 2022 P 52 P 16
Problems,Complex Simple Solution For mission critical applications, Analog Devices delivers proven, beamforming technology with trusted reliability when and where you need it most—from the unknown vastness of space to the unrelenting theater of war. FormOptimizedFactor Enhance Speed to Market Low Power, Minimal Heat Dissipation Find your solution at analog.com/phasedarray
: 631-435-0410: sales@behlman.com : www.behlman.com 3 phase. 3U.1 choice. When the mission calls for a 3-phase 3U power supply that can stand up to the most rugged environments, the military chooses VPXtra 704™ from Behlman – the only VPX solution of its kind built to operate seamlessly from MIL-STD-704F power for mission-critical airborne, shipboard, ground and mobile applications. > 3-phase AC or 270V DC input; high-power DC output > Available holdup cards store 700W of DC power for up to 80 msec > Overvoltage, short circuit, over-current and thermal protection > Provides full output performance during both normal and abnormal transients The Power Solutions Provider THE MILITARY FLIES HIGH WITH VPXtra 704™ Developed in Alignment with the VITA and SOSA™ Technical Standards
Photo by Army Staff Sgt. Malcolm Cohens-Ashley. REPORT: Vetronics for manned and unmanned ground vehicles MOSA and JADC2 driving innovation in military
COLUMNS Editor’s Perspective 9 Print lives! By John McHale Technology Update 10 Using sensors and ML to prevent warfighter injury By Lisa Daigle Mil Tech Insider 11 DAS or NAS? Making the right data-storage decision for deployed systems By Steven Petric THE LATEST Defense Tech Wire 12 By Dan Taylor Guest Blog 50 Five steps to take when securing your data with multi-factor authentication By Chris Kruell, Director of Marketing, CDSG Connecting with Mil Embedded 98 By Mil Embedded Staff 4 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com All registered brands and trademarks within Military Embedded Systems magazine are the property of their respective owners. © 2022 OpenSystems Media © 2022 Military Embedded Systems ISSN: Print 1557-3222
ON THE COVER: Going forward, Army ground and air platforms will need to be more interoperable on the battlefield as part of the joint force and Joint All-Domain Command and Control (JADC2) strategies are implemented. Pictured: A U.S. Army Bradley fighting vehicle moving into position as UH-60 Black Hawks conduct a flyover during an air assault demonstration at Mihail Kogalniceanu, Romania.
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vetronics applications By John McHale, Editorial Director 20 IoT, AI, and the future battlefield By Adam Fish, Ditto 26 Leveraging SDR for counter-UAS applications By John Orlando, Epiq Solutions MIL TECH TRENDS: Test & measurement trends 32 AI driving major changes in DoD test and measurement for radar/EW By Dan Taylor, Technology Editor 36 Field-to-lab testing assures high-quality communications in challenging environments By Steve Douglas, Spirent INDUSTRY SPOTLIGHT: Managing supply chain, obsolescence, and counterfeit parts 40 Securing the software supply chain by modernizing legacy systems By Bob Stevens, GitLab Federal 46 Playing catch-up: How defense and aerospace can improve the component procurement of DMSMS products By Frank Cavallaro, A2 Global Electronics Published by: www.militaryembedded.com September 2022 Volume 18 | Number 6 TABLE OF CONTENTS WEB RESOURCES Subscribe to the magazine or E-letter Live industry news | Submit new http://submit.opensystemsmedia.comWHITEhttps://militaryembedded.com/whitepapersWHITEhttp://submit.opensystemsmedia.comproductsPAPERS–Read:PAPERS–Submit: 3226 PG 52 RESOURCE GUIDE To unsubscribe, email your name, address, and subscription number as it appears on the label to: subscriptions@opensysmedia.com
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PAGE ADVERTISER/AD TITLE 2 Analog Devices, Inc. –Complex problems, simple solution 43 Association Of Old Crows –59th AOC International Symposium & Convention 39 Atrenne – When failure is not an option … 3 Behlman Electronics, Inc. –3 Phase. 3U. 1 Choice. 5 Cobham Advanced Electronic Solutions (CAES) – Space grade qualification 45 Data Device Corporation – Your solution provider for connectivity/power/control 19 Dawn VME Products – Fill your tank. Run up to three supplies in parallel. 27 Elma Electronic –Enabling the warfighter with OpenVPX 7 Galleon Embedded Computing LLC –Rugged. Secure. Powerful. + Dual Layer Certified 22 GMS – X9 Spider – the world's smallest battlefield mission system 8 Herrick Technology Labs – High performance SOSA aligned solutions 49 LCR Embedded Systems, Inc. –Integrated solutions that advance the mission 100 Mercury Systems, Inc. – Breakthrough performance. Weight no more 38 Phoenix International –Phalanx II: The ultimate NAS 41 PICO Electronics Inc – DC-DC converters, transformers & inductors 35 Pixus Technologies – SOSA aligned OpenVPX chassis with advanced cooling 31 Samtec – Interconnect solutions 30 State of the Art, Inc. – Mission critical? Choose State of the Art resistors. 38 Verotec – Commercial and rugged system components 23 Wolf Advanced Technology –3U-VPX blade servers & sensor processors 24 Wolf Advanced Technology –SOSA aligned 25 Wolf Advanced Technology –New SOSA aligned product development
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Speaking of supply chain, be sure to check out our articles dealing with the electronics and semiconductor supply chain: "Securing the software supply chain by modernizing legacy systems" on page 40 by GitLab Federal's Bob Stevens; and "Playing catch-up: How defense and aerospace can improve the component procurement of DMSMS products" on page 46 by Frank Cavallaro of A2 Global Electronics. Anyway, please enjoy reading this, our largest print product of the MES year.
As one VP of aerospace and defense for a large semiconductor company told me: “Some of my colleagues think our military group is crazy for doing print advertising, but our customers at the primes still read it. The copies are on their desk when we Whilevisit.”these are anecdotal examples, the page counts of our publications don’t lie. Interestingly, when the pandemic hit, I had colleagues tell me that I’d better prepare for the decline in print, as folks won’t be in the office as often. Well, those who design weapons systems for military applications were still going into their offices, and print didn’t decline. Last year, those same folks told me to prepare for print to go down as people returned to trade shows. Didn’t happen, plus we added two new print brands.
By John McHale, Editorial Director John.McHale@opensysmedia.com
Walking antiquarian book fairs is a pleasure for me; my wife, however, doesn’t share my love for that particular hobby, as she says these shows attract a lot of people like me “who really like books a bit too much.”
At those reopened trade shows, the hundreds of magazines we shipped to the venues were gone from the bins in a day. The agendas at the conferences were printed too. Verdict: Postpandemic trade-show attendees still want print.
Yes, many publications have gone out of business by insisting on staying print-only and eschewing digital, mostly because digital offers more variety and often costs less to produce. But there’s no lack of demand for print magazines and books.
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Hmm, lots to unpack there, but let’s stick to the paper-and-ink angle. Even if they’re not print-obsessed like me, my nephew, and the attendees of those book shows, people still want print magazines, especially in the military world.
Demand remains very strong in the defense electronics commu nity, as we continue to get subscriptions from engineers at prime contractors, third-party suppliers, and government agencies.
EDITOR’S PERSPECTIVE Welcome to our 2022 September Resource Guide, which for the tenth year in a row is 100 pages or more. This feat fol lows on the heels of our July/August MES issue of 48 pages plus the 76-page SOSA Special Edition. We also added a new print brand this year, mailing with our April/May issue – the FACE Special Edition. Thanks as always to our loyal readers and advertisers for their support. And a special thanks to our editorial staff and contributing authors for providing content that keeps people turning our pages. Despite the many reports of its demise, print publishing is far from dead. I say this not just as a subtle brag about our publica tion, but because I’m passionate about print publishing. I love digital too, as it is the future of our business and offers so many possibilities for our audience and advertisers. But print – and please excuse the cliché – is something tangible you can hold in your hand. Yes, many publications have gone out of business by insisting on staying print-only and eschewing digital, mostly because digital offers more variety and often costs less to produce. But there’s no lack of demand for print magazines and books.
The demand is strong, as Technavio reports in its “Global Marketing Magazine Publishing Market 2022-2026,” stating that “people still preferring to read printed magazines are driving the segment growth.” Yes, in fact, the print segment is growing; the report notes, however, that growth is tethered by paper supply shortages and the ever-increasing cost of cir culating print magazines – in other words, postage. But the demand is still there.
Sure, you can say “But you’re over 50”: Nope – these shows had plenty of young engineers grabbing our magazines. More proof: I have a nephew, a sophomore in college, who likes to read the Wall Street Journal every day in print, not online. He tells me his friends still like printed books too, so it’s not just a genetic quirk. Me, I’m an admitted bibliophile. I love the smell of freshly printed copy. To say I get frustrated when I see people bend or rip their books is an understatement. My nephew does too … so maybe that part’s a genetic quirk.
Remember that paper shortage we mentioned? Could be that part of the reason for the shortage is that people still want print products!
Print lives!
Vignos and his team are drawing on other studies undertaken at APL to produce computational models of the human body, as well as a compilation of data that correlates injuries with the environments in which they occur. As for the actual physical data-gathering from the exerted individuals. Vignos says that his team is still trying to identify the optimal sensor suite, one that could gather the necessary data without proving too cum bersome for soldiers who may be carrying heavy equipment or must maneuver in difficult conditions.
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During 2021, the team created an algorithm that can identify fatigue in simple binary terms: tired or not tired. This year’s effort – as the team collects data during exertion tests – is attempting to create a numerical score that can be used to quantify fatigue with more precision. (Figure 1.)
Data from the U.S. Army Public Health Center reveal that MSK injuries among active-duty soldiers cause over 10 million limited-duty days (LDD) each year and account for more than 70% of the medically nondeployable population. MSK injuries and their follow-on effects are a leading cause for medical dis ability and discharge from service.
TECHNOLOGY UPDATE Using sensors and ML to prevent warfighter injury
Photo: Johns Hopkins APL/Ed Whitman.
The APL, a scientific and engineering research and develop ment division of Johns Hopkins University, has served as a tech nical resource since World War II for the U.S. Department of Defense (DoD), NASA, and other government agencies. Over that time, the lab has developed numerous systems and tech nologies in the areas of air and missile defense, naval warfare, cybersecurity, and space. The work currently being done on bodily injury and fatigue is aligned with APL’s portfolio focused on predictive health and human-performance modeling.
Biomechanical engineer Mike Vignos, an instructor at Johns Hopkins, is leading the project – now in its second year – to create ML algorithms that use data collected by people wearing sensors to reliably identify and quantify the severity of physical fatigue.
“Right now we’re still in the ‘over-sensorized’ phase, since we’re in the laboratory where we can afford to put five or six different sensors on people. But in the field there won’t be a scenario where that’s a realistic option,” Vignos says. “We’re still working out what that sweet spot is, that minimally viable sensor setup of ideally one or maybe two wearable sensors that will allow us to assess fatigue without contributing to the problem we’re trying to solve. We’re also exploring the option of doing this completely with remote sensing, which would be ideal because it removes the need for warfighters to wear sensors.”
By Lisa Daigle, Assistant Managing Editor
A team of researchers at the Johns Hopkins Applied Physics Laboratory (APL – Laurel, Maryland) is developing a system to monitor physical fatigue and possible injury in soldiers in nearreal time using body-worn sensors and machine learning (ML) Suchalgorithms.adata-driven
system, say the scientists, could prevent musculoskeletal (MSK) and other bodily injuries. Physical fatigue – a natural consequence of performing strenuous activity, particularly under heavy and irregular loads and often under less-than-optimal conditions – is often the first sign that these injuries might occur later.
Figure 1 | Team member Bryndan Lindsey (right) records qualitative data during pilot tests of the sensor suite. In the background, an avatar can be seen that is designed to replicate the real-time movement of the test subject.
The long-term goal: To predict the risk of MSK injury in near-real time and identify those at high risk for injury before they get hurt. One of the most significant challenges to creating such ML algorithms is acquiring the data to train them. While previous research has seen an association between fatigue and MSK injury, this relationship has not been quantified, due in part to the fact that recreating harsh conditions and injuries in a labora tory is infeasible, even dangerous.
Biomedical engineer Kathleen Perrino, who manages an APL research portfolio dedicated to predictive health, says she believes that injury prevention informed by a fatigue score could take a number of forms. “Once we’re armed with an objective score for physical fatigue, there are a variety of ways we could apply it to improve the health of our warfighters,” Perrino explains. “We might change the armor that they wear, or the way their gear is distributed across their bodies. We might combine the score with knowledge about how a person’s genetic pre dispositions affect their biomechanics, and so individualize how people are trained and equipped. There are any number of ways it could be applied, which is exciting, as well as challenging.”
“Our goal is to create a score that is generalizable across all these drivers of physical fatigue and that enables us to reliably predict and prevent MSK injuries that might otherwise take sol diers out of the line of duty,” Vignos says.
Network booting can also reduce SWaP [size, weight, and power] concerns since multiple DAS devices can be replaced with a single NAS device. That said, using a single NAS device for network booting may slightly increase total startup time for the system compared to booting with multiple, dedicated DAS devices. A local DAS device delivers the OS and APP more quickly since only one client must be serviced, while the NAS device must service all the network boot clients.
Figure 1 | Shown: the XMC-554C 3U OpenVPX storage card, an example of a rugged DAS solution; in addition, the DTS1 Data Transport System DAS is a turnkey rugged network file server.
Steven Petric is Senior Product Manager, Data Storage, for Curtiss-Wright’s Defense Solutions Division. Curtiss-Wright Defense Solutions • https://www.curtisswrightds.com/
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DAS or NAS?
Making the right data-storage decision for deployed systems
By Steven Petric
An industry perspective from Curtiss-Wright Defense Solutions kept separate and access requirements will be different for each level. DAS offers the simplest approach for keeping data levels separate, because a DAS device is attached to only one SBC. If an Ethernet network is required, the simplest approach for dealing with multiple classification levels is to create physically separate networks (or enclaves) for each data level. Each enclave will require a separate NAS that services its own network with no connection between them. If information flow between enclaves is desired, a cross-domain solution is required to ensure the appropriate data flow and access standards.
Using a NAS device can simplify software upgrades for users. Prior to each mission the current OS [operating system] and APP [application program] for each client can be loaded to the network via a removable data cartridge. If the OS or APP requires updating or upgrading, the new software versions can be distributed to all clients on the network upon booting, without having to remove the client or the NAS from the platform. An additional benefit of a NAS-based network boot approach is that the OS and APP data can be protected with encryption, such as National Security Agency (NSA)-approved CsFC two-layer encryption.
MIL TECH INSIDER For many years, military-system designers relied solely on direct attached storage (DAS) devices when they needed to deploy data storage on military platforms. These devices are embedded within or directly attached to the computers, such as single-board computers (SBC) on a platform. When a DAS device is used, only the specific SBC it’s attached to can access the stored data-at-rest (DAR). With Ethernet becoming commonplace on modern platforms, network attached storage (NAS) devices (also known as network file servers [NFS]) have emerged as an important alternative for deployed data storage. With NAS, stored DAR can be made available to any client devices on the Ethernet network. NAS and DAS are often used in combination to meet all program, platform, and application requirements. However, in those cases where it makes sense to use only a DAS or a NAS device, it’s useful to understand how they differ. Due to the relative simplicity of a DAS, it can be much easier to deploy than a NAS device. Since a DAS device is installed within a computer, or attaches directly to it, broader connectivity requirements are mitigated. However, each DAS device on the platform must be individually deployed, upgraded, and maintained, which can increase total cost of owner ship (TCO). A NAS device, in contrast, must be connected to the Ethernet net work on a platform, which can initially increase deployment complexity and cost. While NAS devices are typically more expensive to purchase and deploy than DAS devices, they do provide more capabilities, such as centralized data storage, that can offset the time and cost required to purchase, upgrade, and maintain multiple storage devices. Consider the use of data-storage devices on larger platforms where the stored data may be classified at different levels – top secret, secret, or sensitive but unclassified. These different data levels will need to be
If data transport, rather than data transfer, is required, a DAS device that supports removable data cartridges such as an RMC [removable memory cartridge] card will be preferable. After the mission, the collected data can be transported back to the base station for more thorough analysis. A DAS device would not work for such an application, since it is not readily removable.
A DAS device offers simplified integration compared to a NAS, since it can be installed directly onto an SBC. The DAS device requires no separate power supply, housing, or structure other than a printed circuit board and possible conduction-cooled frame.
NEWS | TRENDS | D o D SPENDS | CONTRACTS | TECHNOLOGY UPDATES 12 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The U.S. Army tasked General Dynamics and Lockheed Martin to develop ground-based extended-range electronic warfare (EW) concepts for the first phase of a project called Terrestrial Layer System – Echelons Above Brigade, a planned Army system for integrating signals intelligence (SIGINT), EW, and cyber capabilities for large-scale combat operations. Under the terms of this initial $15 million request, the companies will submit designs, undergo a system review, and participate in a software demo.
Army asks for EW concepts from General Dynamics, Lockheed Martin
DEFENSE TECH WIRE
Figure 2 | Shown is a rendering of the special-mission variant of the Overture supersonic specialmission aircraft for the U.S. military and allies. Image courtesy Northrop Grumman.
The Army says that it is requesting $29.6 million in research and development funds in 2023 plus $85.7 million for the pro gram in future years, which would go towards continued pro totyping and integration. No official decision has been made regarding which platform or vehicle the EW system will be mounted on, but the Army says that possibly under consideration is the Family of Medium Tactical Vehicles (FMTV).
By Dan Taylor, Technology Editor
Figure 1 | The new Army EW system would possibly be mounted on the Family of Medium Tactical Vehicles (FMTV A2 vehicle shown). Image courtesy Oshkosh. Comms platform for nuclear bombers and missiles delivered to U.S. Air Force Raytheon Intelligence & Space delivered the initial operating capability (IOC) for a new communications platform to be used by nuclear bomber, missile, and support aircraft crews, the company said in a statement. The Global Aircrew Strategic Network Terminal (Global ASNT) system is intended to provide communications for these crews in austere environments, enabling improved joint con nectivity on the battlefield. Global ASNT aims to provide secure data sharing as part of a future command and control network connecting battlespaces across the sea, air, space, cyber, and electromagnetic domains. In April 2022, Raytheon announced it had completed installation of the first Global ASNT terminal system, and there would be three additional base installs, with the intent to produce and field 90 terminals by the end of 2023. Supersonic aircraft to be built by Northrop Grumman and Boom Supersonic Northrop Grumman and aviation designer Boom Supersonic (Denver, Colorado) agreed to collaborate on a new supersonic aircraft aimed at enabling quick-reaction aviation capabilities for the U.S. military and its allies. The companies’ agreement to propose special mission variants of Boom’s “Overture” supersonic aircraft was finalized at the recent Farnborough (U.K.) International Air Show. Such a specialized aircraft could be used by mil itaries to deliver medical supplies, provide for emergency medical evacuation, patrol vast areas faster than conventional aircraft, and coordinate other aircraft and ground assets in a variety of scenarios. According to a statement from Northrop Grumman, the initial Overture aircraft will be in production for commercial use in 2024, start flight tests in 2026, and begin carrying pas sengers in 2029.
One factor driving the market growth may be the need to keep aircraft flying longer, the study authors report, along with technical improvements and the rising need for aircraft built for specific tasks. Major players in this space who are also heavily involved in the defense industry include Honeywell International, Raytheon, Textron, and GE Aviation.
The VAULT platform is built to enable Air Force personnel to use cloud-based tools to work with data; an Air Force state ment details that users can directly upload data, transfer it, or schedule recurring data refreshes, moves intended to populate the VAULT platform with timely information available for enterprise use.
Aerospace parts market to exceed $1.39 trillion by 2030: report
The U.S. Air Force selected seven companies for the $762 mil lion Visible Accessible Understandable Linked Trusted (VAULT) data platform contract, the U.S. Department of Defense (DoD) announced. The companies will compete over the next five years for task orders that include developing algorithmic solutions, advising on data preparation and architecture, and conducting data analytics using machine learning/artificial intel ligence (ML/AI).
Figure 3 | Air Force personnel use digital tools while participating in a land-based exercise. Photo courtesy U.S. Air Force/Tech. Sgt. Joshua J. Garcia.
The global aerospace parts manufacturing market will blow past the $1 trillion mark this decade, surging 46% between 2022 and 2030, according to a new report by research firm The Brainy Insights. The report predicts that the market will grow from $952.4 bil lion in 2021 to $1.39 trillion in 2030, at a compound annual growth rate (CAGR) of 4.3%.
Lockheed Martin delivers laser weapon system to U.S. Navy Lockheed Martin delivered a multimission laser weapon system to the U.S. Navy that is intended to provide directed energy capability to certain ships, the company announced in a statement. Lockheed provided the 60+ kW-class high-energy laser with integrated optical-dazzler and surveillance (HELIOS), which will be integrated into existing ships and provide a laser weapon system as an element of a layered defense architecture, according to the company’s state ment about the project. Earlier this year, the laser completed range testing at Wallops Island in Virginia. It will be installed on the Flight IIA Arleigh Burke-class destroyer USS Preble (DDG-88). The laser reportedly will be inte grated with the ship’s Aegis Combat System and will replace its Mk15 Close-In Weapon System. Besides close-in defense, HELIOS is designed to “dazzle” or confuse and damage the sensors on unmanned aerial systems, and it can also be used for surveillance.
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The HII work will serve vital network connectivity and interoperability between Air Force major commands. Image courtesy Huntington Ingalls Industries.
The Air Force chose the seven companies out of 27 offers received, with those chosen being SAIC, Tyco Government Solutions, Deloitte Consulting, International Information Associ ates, Novetta, Octo Consulting, and Credence Management Solutions.
Advanced data platform contract from U.S. Air Force won by 7 companies
Figure 4 |
USAF secures warfighter-training network contract with HII
The Mission Technologies division of shipbuilder Huntington Ingalls Industries (HII) won a $79 million Mobility Air Force Distributed Mission Operations (MAF DMO) task order under the U.S. Air Force’s Training Systems Acquisition III contract. Under the terms of the contract – which runs for a base period and five one-year options – HII is tasked with deliv ering its live, virtual, and constructive (LVC) capabilities, including network engineering, cybersecurity, standards development, and logistics in support of Air Mobility Command’s MAF DMO operations enabling persistent, distributed training of aircrews worldwide. HII will operate and maintain the Distributed Training Center and associated network to support global aircrew training systems, acting as vital network connectivity and interoperability between Air Force major commands.
Work on Phase 1 of Space-BACN will take place over 14 months, concluding with a preliminary design review and a fully defined interface between system components.
Figure 6 | An artist’s rendering shows the Next Generation Interceptor (NGI) in flight. Image courtesy Lockheed Martin.
DEFENSE WIRE D SPENDS CONTRACTS UPDATES UAS for military use will reach $34.34 billion by 2031, report predicts The global market for unmanned aerial systems (UASs) used for military purposes, which generated $11.60 billion in 2021, is expected to total $34.34 billion by 2031, experiencing a combined annual growth rate (CAGR) of 11.7% during that period, according to a new market study from Allied Market Research. The study authors found that key to growth in the military UAS market in the next decade will be an upsurge in countries' military spending, additional demand for improved surveillance solutions, and across-theboard modernization of defense capabilities. The study also reveals that a major factor that could hamper growth in some areas is the high cost of military UAS equipment. Based on application, the intelligence, surveillance, reconnaissance, and target-acquisition segment contributed to the largest mili tary UAS market share in 2021, accounting for more than two-fifths of the global market, and the study found that this segment will continue to maintain its topmost market share to 2031. The study authors also predict that the delivery and transportation segment is estimated to grow at the highest CAGR of 13.3% during the study period.
Figure 5 | Graphic of proposed Space-BACN constellation courtesy DARPA. Ballistic missile interceptor tested to validate radio communications Lockheed Martin validated prototype communications radio technology for the Next Generation Interceptor (NGI) during a recent test, the company announced in a statement. The NGI, which is designed to intercept intercontinental ballistic missile threats, tested the NGI’s facility in receiving and sharing data from the ground and throughout the mission across large dis tances at a high rate of speed through harsh environments. The prototype testing achieved a milestone in those areas, the company said. The NGI fleet will be part of the Northrop Grumman Ground-based Midcourse Defense (GMD) Weapon System (GWS), which is intended to defend against intermediate and intercontinental ballistic missile attacks. The Missile Defense Agency awarded Northrop Grumman a $3.3 billion contract to supply the GWS. The GMD system is designed to intercept incoming warheads in space during the mid course phase of their flight.
TECH
DARPA intends that selected performers will then participate in an 18-month Phase 2 to develop engineering design units of their proposed optical terminal components and other teams will continue to work on their government/commercial interface and ensure that it works in challenging and dynamic scenarios.
DARPA project aims to create “internet” of LEO satellites
NEWS | TRENDS | D o
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The Defense Advanced Research Projects Agency (DARPA) chose 11 teams for the first phase of its Space-Based Adaptive Communications Node (Space-BACN) program, which intends to build a low-cost, reconfigurable optical communications terminal that adapts to most optical inter satellite link standards, creating what the agency dubs an “internet” of low-Earth-orbit (LEO) satellites. Currently used military/government and commercial/civil satellite constellations are unable to communicate.
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The LUSV concept builds on work pertaining to medium- and large-scale USVs that the Office of Naval Research (ONR) and the Defense Advanced Research Projects Agency (DARPA) began a number of years ago. Navy offi cials say that the LUSV will operate in semi-autonomous or full-remote mode for such activities as resupply missions and personnel transport.
GEO-6 is the final satellite in the SBIRS program series, as the craft joins the Space Force's currently operating constellation of missile-warning satellites. SBIRS will be followed by the Next Generation OPIR (Overhead Persistent Infrared) GEO System (NGG).
Unmanned surface ship project for U.S. Navy awards six contracts The U.S. Navy tasked six companies that specialize in autonomous marine vessels to come up with different concepts for a large unmanned surface vessel (LUSV) that would carry cargo, sensors, and weapons and travel the ocean in addition to the Navy’s manned surface force. According to an announcement from the Naval Sea Systems Command, contracts worth a total of $62.1 million were awarded to Austal USA, Bollinger Shipyards Lockport, Gibbs & Cox, Huntington Ingalls Inc., Lockheed Martin Rotary and Mission Systems, and Marinette Marine.
Figure 8 | Several F-35B Lightning II aircraft undergo maintenance while underway aboard the amphibious assault carrier USS Tripoli. U.S. Marine Corps photo.
U.S. Space Force launches SBIRS GEO-6 missile-warning satellite
The U.S. Space Force launched the Space Based Infrared System Geosynchronous Earth Orbit-6 (SBIRS GEO-6) satellite, which will provide mis sile warning capabilities to the U.S. military. The satellite – built by Lockheed Martin and Northrop Grumman and sent aloft by the United Launch Alliance – is equipped with scanning and staring infrared surveillance sensors to support missile warning, missile defense, battlespace awareness, and technical intelligence missions, according to a Northrop Grumman statement.
Figure 7 |
The U.S. Department of Defense (DoD) Innovate Beyond 5G (IB5G) Program launched several new projects with industry and academia to advance 5G-to-NextG wireless technologies. The first is Open6G, an industry-university cooperative effort that aims to jump-start 6G sys tems research on open radio access networks (Open RAN), focusing on Open RAN research and open source implementation of 5G protocol stack features to support emerging beyond/enhanced 5G applications. The project is managed by Northeastern University’s Kostas Research Institute. Another new effort: The Spectrum Exchange Security and Scalability project with Zylinium Research, under which the partners will study spectrum-sharing technologies. Also underway is the large-scale Massive Multi-Input/Multi-Output (MIMO) project, a collaboration with Nokia Bell Labs, which aims to estab lish Massive MIMO as a critical tool for the warfighter due to its ability to increase resiliency and throughput for wireless tactical communications. The project will explore key technology components that enable scaling MIMO technology across different bandwidths and defense use cases. www.militaryembedded.com
Flight-training upgrade for Marine Corps garners $40.84 million contract Flight-training company Veraxx Engineering won a contract worth $40.84 million with the U.S. Navy for the upgrade, inte gration, and fielding of a completed baseline version of the Marine Corps Tactical Environment (TEn), its simulated and semi-automated aviation training system. According to the terms of the contract, the four Marine Corps aircraft wings will get upgrades, along with complete integration of the TEn into Marine Corps aviation training systems and devices; the company will also address interoperability bridges. Much of the work under the contract will be performed in North Carolina and California; it is expected to be completed in January 2028. McLean, Virginia-based By Light Professional IT Services – a systems integrator focusing on training/simula tion and cyberspace operations for federal and commercial clients – acquired Veraxx Engineering in July 2022.
Shown: the DARPA and ONR medium-scale USV technology demonstration vessel, on which the Navy will base the LUSV. Image courtesy DARPA. DoD embarks on three 5G-plus projects
Photo by Army Staff Sgt. Malcolm Cohens-Ashley.
MOSA and JADC2 driving innovation in military vetronics applications
SPECIAL REPORT Vetronics for manned and unmanned ground vehicles 16 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Pictured: a U.S. Army Bradley fighting vehicle moving into position as UH-60 Black Hawks conduct a flyover during an air assault demonstration at Mihail Kogalniceanu, Romania.
Vetronics systems today are increasingly focused on C4ISR [command, control, communications, computers, intelligence, surveillance, and reconnaissance], interoperability with other battlefield elements, and the capability to be optionally unmanned if necessary. They are also more likely to be built on open architectures as the U.S. Department of Defense (DoD) continues the push toward a modular open systems approach (MOSA) in upgrades and new designs.
By John McHale, Editorial Director
Army ground and air platforms going forward will need to be more interoperable on the battlefield as part of the joint force and Joint All-Domain Command and Control (JADC2) strategies are implemented.
Vehicles will become a node on the interconnected battlefield or, as some call it, an Internet battlefield of things (IBoT), Curran says.
“As the war in Ukraine has demonstrated, just like wars did in Iraq and Kuwait, holding or reclaiming disputed land territory requires Army-like vehicles and personnel,” says Chris Ciufo, CTO with General Micro Systems (GMS – Rancho Cucamonga, California). “Even though you can (and should) bomb your adversary into submission, you need rugged vehicles, materiel, and soldiers and Marines on the ground. The market for vetronics, technologically and geopolitically, looks stronger than it’s ever been for GMS.”
Technology brings all of this into reality, right now.”
prolific tactical networks, both currently used and in development.”
Enabling all this innovation will be open architecture designs that can quickly integrate commercial hardware and software solutions.
C4ISR funding within the Army is strong and directly impacts ground vehicles: For the Army, Frost analysts put it at $9 billion for 2021 with funding trending at a similar pace in 2022, with $6 billion spent so far and with still more than a quarter left in the calendar year, Curran notes. Ciufo adds, “We see more RFQs/RFIs and more orders for programs than we can rea sonably keep up with. If anything, we are seeing an increase in vetronics demand as systems and sensors are more mobile, and as more advanced requirements – like AI [artificial intelligence] or on-the-battlefield processing – become the norm. We keep adding more capability into our products.”
Much of the technological investment for the Army is focusing on C4ISR, tactical communications-on-the-move comms, and JADC2. The latter is a huge driver across all platforms – land, sea, air, spectrum, and space, says Brad Curran, an industry analyst at Frost & Sullivan. Aspects of it will come from lots of different programs like exquisite satcom systems [the term used for large, highly sophisticated satellite systems often used for intelligence missions] to new air and ground platforms and especially missile defense, when it comes to tracking and countering hypersonic missiles, he adds.
For military ground platforms, the term “vetronics” no longer applies solely to vehicle controls, but how the vehicle electronics (vetronics) enable enhanced command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR); position, navi gation, and timing (PNT); electronic war fare (EW) capability; optional unmanned capability; and connection to a larger defense network. This connectivity fea ture is critical as the U.S. Department of Defense (DoD) continues to build its Joint All-Domain Command and Control (JADC2) strategy.
“With the U.S. government’s massive increases in social spending plus a continued recognition to fully fund the DoD, I expect that ‘best case’ next-gen programs like the Army’s NGCV [Next-Generation Combat Vehicle] may be less about entirely new plat forms than about adding much-needed capability to still-capable existing platforms,” Ciufo says. “The M2A3 Abrams is an awesome vehicle that’s perfectly equipped for modern land warfare, God forbid. Yet it could benefit from the ADAS [advanced driver assistance systems] capability you can buy on a new Toyota or GM pickup truck. Better inter-connectedness between airborne, dismounted, and mounted assets would improve the overall battlefield picture and allow tank commanders, for example, to even better position their crew for the current and soon-future [opposing force].
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Well-known ground platforms like the Army’s M1A2 Abrams tank, the Bradley Fighting Vehicle, and the Stryker Combat Vehicle will be connected to other platforms on the battlefield to better operate as a joint force. “JADC2 will overhaul military communica tions and enable U.S. armed forces to better handle the massive amount of information they collect and distribute every single day,” states Mark Hutchins, Executive Director, Protected Communications Systems, Raytheon Intelligence & Space, in his blog communicationsdatainitiativetectedstrategic-and-tactical-communications.https://militaryembedded.com/radar-ew/signal-processing/key-to-jadc2-converging-on“Thestrategic-to-tacticalconvergenceofprocommunicationsiskeytobolsteringJADC2andshouldbedeemedanurgenttoupgradedisparatelegacynetworks,gainresilienceattheedge,andachieveassurance.Theforward-deployedcantakeadvantageofresilientandjam-prooffromthestrategiccommunity,whilethestrategiccommunityusesthe
The three services – Air Force, Army, and Navy – mandated a modular open systems approach (MOSA) for all new technology platforms and upgrades, calling it a “Warfighting Imperative” in a 2019 joint memo. Examples of MOSA strategies that affect defense vetronics systems are VICTORY [Vehicular Integration for C4ISR/EW Interoperability], the Sensor Open Systems Architecture (SOSA) Technical Standard, and CMOSS [C5ISR/EW Modular Open Suite of Standards]. MOSA aims to embrace more commonality and open standards in an open architecture design to enable faster deployment of technology to the battlefield while maintaining lower life cycle costs.
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MOSA is mentioned in almost all programs, which means that providers of standardsbased electronics in the consortia will be relied upon, Curran says. The DoD “doesn’t want to be tied to proprietary gear” in the long run, he notes. The result: The primes and government will work more and more with commercial vendors, especially on the software side, Curran adds.
“For U.S. vetronics applications, [which] are almost exclusively U.S. Army vehi cles – current-gen with upgrades or future Army platforms, MOSA is a near-universal requirement since it’s driven top-down from the DoD; however, exceptions to this are frequently given because SWaP-C [size, weight, power, and cost] is still so important,” Ciufo says. “That is: Mandating a 1/2 ATR (short chassis) filled with expensive OpenVPX cards is rarely as efficient as adding a highly optimized 4x4 small-form-factor (SFF) system that tucks neatly under a seat or behind a Therecabinet.”are ways that SOSA and open standards can improve SWaP, Sealander says. “SOSA really lays the groundwork to take a step back from architecting a separate box for every function” from the radio to the fire control to the active protection system.
Widely used in commercial electronics such as laptops, external hard disks, docking stations and GPU expansion chassis, 40 Gbits/sec Thunderbolt technology added to any system makes that system interoperable with other systems by definition. Like all USB variants (including the latest USB4), you just plug in Thunderbolt technology and it works. (Figure 2.) “A small-form-factor system, a display, a sensor, a GPS POSNAV [position/navigation] system, or any equipment interconnected by Thunderbolt technology provides vendor independence for the Army as well as plug-and-play upgradeability,” he continues.
SPECIAL REPORT Vetronics for manned and unmanned ground vehicles 18 September 2022 MILITARY
MOSA is also more than just SOSA and CMOSS, as its a strategy and not a specific standard or specific technology.
“As a member of the Open Group and SOSA, we [at GMS] do believe in this tech nology, or we wouldn’t be investing in it,” he continues. “But we don’t believe that SOSA aligned OpenVPX boards and chassis are the only way to meet the MOSA mandate. Other standards might also meet the spirit of MOSA. The fact is: Mandating SOSA as the only MOSA approach once again locks the DoD into one particular technology to the exclusion of other technologies that might fit just as well or better.
Figure 1 | Curtiss-Wright’s CMOSS/SOSA Starter Kit is ideal for kick-starting the development of Ground Vehicle applications. It is pre-integrated with an SBC, a VICTORY Ethernet switch, and a timing module.
SWaP-C and MOSA
“MOSA is very, very real and from what I can see the Army is taking it very seriously” because the PEO GCS {Program Executive Office Ground Combat Systems) went through the trouble to create specific requirement documents to take what CMOSS laid down, what comes out of SOSA and narrows it specifically for their needs, says Jacob Sealander, Chief Architect for C5ISR systems for Curtiss-Wright Defense Solutions (Ashburn, Virginia). “SOSA is broad and has lots of options, so this was nec essary. For the Army it’s 100 percent [MOSA and] open standards, and the preference by and large for those driven by VITA and SOSA, so you see those requirements hard and fast." (Figure 1.)
“Also, commercial civilian technology evolves rapidly. Wouldn’t it be best to keep an open mind about how to use that technology instead of dictating that it can only be used on OpenVPX with SOSA profiles? That feels too constraining and not in the spirit of MOSA,” Ciufo adds. Ciufo goes on to point out that “MOSA does not specify a technology – it requires the use of open standards as well as the ability to provide P3I [preplanned product improvement] and some form of vendor neutrality. GMS believes an excellent solu tion to MOSA requirements is found with Intel/Apple’s Thunderbolt technology.
used. Thunderbolt technology provides at-the-panel vendor independence with interoperability.”
“Unplug one vendor’s system and plug in another vendor’s Thunderbolt-connected system. The size, weight, or shape of the system doesn’t matter and shouldn’t be dictated by a standard: If it solves the problem and meets the requirements, it can be EMBEDDED SYSTEMS with Resource Guide
“With SOSA you take computing capability and move data around the platform, enabling you to architect dif ferently, placing the computer where it fits and move data around seamlessly and with low enough latency that you don’t need purpose-built boxes,” he explains. “You can put whatever func tion you want anywhere in the vehicle. When this approach is embraced you MOSA’s influence on vetronics
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dawnvme.com Your Tank
“Another requirement that is significant but not new to the ground combat market, is for natural convection cooling,” he adds. “Due to reliability issues active cooling is not wanted. Enabling convection cooling still remains a huge challenge given the power densities of the solutions they are asking for. We continue to come up with new thermal-management solutions to meet this old, but very restrictive requirement.” MES have efficient reduced SWaP from classic systems, getting more capability in the same or less volume.”
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Embedded computing demands
“Increasingly, we’re seeing demands for server-like performance in what once might’ve been a ‘simple’ mission processor,” Ciufo says. “While the mission processor still handles main house keeping functions for the typical system –plus normal I/O like MIL-STD-1553, CANbus (in vetronics), serial ports, a couple of 1 Gbits/sec Ethernet ports and maybe one or two displays – there are new performance expectations. Sensors are higher resolution and/or provide more data, faster. There’s more emphasis on offloading the operator through the use of advanced analytics in the mis sion processor, as well as processing and interpreting in real time sensor data, like images. These performance func tions might’ve previously been done in a separate signal-processing box or VME card – now they get embedded in the mission processor under the term [AI] or ‘edge processing.’
systems and X9 Venom OpenVPX boards; we’ve added many more 10 Gbits/sec Ethernet ports plus two to four 100 Gbits/sec Ethernet ports to talk to sensors, other CPUs, or to provide inter-box communication. Eight core processors are common, with optional 20-core Intel Xeon D-2700 (Ice Lake) micro-server CPUs.” Network demands are also driving requirements, Sealander says. “[Ground vehicle] requirements are focusing on the vehicle backbone with time sensitive networking (TSN), for example. There is going to be a big push for TSN to get rid of MIL-STD-1553 and take advantage of all the TSN benefits that come from an all-Ethernet vehicle backbone such as resource sharing, network resiliency, etc.
The capabilities in demand – whether high-performance sensors or AI solutions or improved C4ISR – all put pressure on designers of embedded computers from the signal-processing functions to the ruggedization to the reduced size, weight, and power (SWaP) requirements.
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“For GMS, we are responding to the increased sensor and data load, plus the expectation for local and better processing in the mission processor, by adding fatter pipes, embedded GPGPUs, and offering microserver processors,” he continues. “We have multiple Thunderbolt 4 pipes on our X9 Spider small-form-factor (510) 657-4444
A major DoD initiative, JADC2 aims to collect data streams from thousands of battlefield vehicles, environmental sensors, and other intelligent devices across every military branch. AI and machine learning (ML) can then be used to deliver relevant information enabling quick decision-making at the front lines –even down to identifying military targets and recommending the optimal weapon to engage them.
Powered by artificial intelligence (AI), a massive military Internet of Things (IoT) promises a host of battlefield benefits in such areas as unmanned surveillance and targeting, situational awareness, soldier health monitoring, and other critical applications. However, major data and communications challenges must be overcome first.
IoT, AI, and the battlefieldfuture
Vetronics for manned and unmanned ground vehiclesSPECIAL REPORT 20 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Future conflicts will require critical decisions made within hours, minutes, or sec onds – not days – that entail analyzing an operating environment and issuing commands, according to a Congressional Research Service publication on the Joint All-Domain Command and Control (JADC2) initiative. One way the Department of Defense (DoD) aims to speed up and automate decision-making is through a massive military Internet of Things (IoT) and artificial intelligence (AI).
By Adam Fish
Military IoT includes many different “things” – everything from battlefield sen sors and weapons systems to tracking devices, communications equipment, wearables, drones, ships, planes, tanks, and even body sensors. Together they stream unprecedented volumes of real-time information to the battlefield.
IoT and AI will become an increasingly valuable strategy for accelerating and automating critical decision-making as the battlefield becomes more complex and unpredictable. Diagram provided by Ditto.
Each branch of the military has its IoTrelated initiatives. For the Air Force, IoT is an essential component of its evolving Advanced Battlefield Management System (ABMS). For the Army, it’s the Army Futures Command, and for the Navy, Project Overmatch. The overall goal of JADC2 is to tie all these initia tives together and make them work as a single force successfully on the battlefield. Big challenges ahead The success of this massive IoT initia tive depends of course on the ability to collect and store huge volumes of streaming data from thousands of “things” in real time. A much greater challenge, however, is actually making sense of all that information instantly and getting the results to warfighters fast enough that they can use it to their advan tage. The technical obstacles are formidable and include:
› Merging, integrating, and sharing huge volumes of streaming IoT data generated from devices residing in siloed military branches with scores of different data formats and communications networks. Ideally, the goal is a single data format and data store that can be processed rapidly.
› Airtight cyberattack prevention, detection, and remediation for all this data communications and storage.
Autonomous weapons systems: Human beings continue to be the principal battle field agents and drivers of success. However, autonomous surveillance and weapons systems such as military drones, smart missiles, and unmanned ground vehicles can conduct advanced battlefield surveillance, enhance battle intelligence, and even engage targets to preserve soldiers’ lives. They can also bring precision to the battle via AI and technologies such as facial recognition that can target enemy combatants more accurately than humans and avoid friendly fire and civilian casualties. Deciding on the division between human and autonomous decision-making will be one of the big moral and technical challenges linked to the success of autonomous systems.
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› Deciding on a common high-bandwidth, low-latency network to serve as the connective tissue between military IoT devices and edge and cloud processing and AI environments. There are numerous possibilities, including satellite and specialized proprietary military network solutions, but 5G is envisioned by many as the eventual connective-tissue solution.
Situational awareness: Situational awareness is critical for quick and effective deci sion-making on the battlefield. Not only is merging IoT with AI a way to enhance and automate situational awareness – including battleground layout, squad and enemy locations, assets, and objectives – it has the potential to provide that awareness faster than ever before without having to rely on centralized command and control.
Compelling military IoT use cases
› Resilient data storage, communications, synchronization, and processing at the network edge, even in remote locations or at times when there are no traditional communication capabilities such as 5G available, often for weeks. Battlefield personnel can’t be forced to rely on less-than-reliable distant cloud connections, plus critical data can’t be lost due to a connection or power lapse, even if it’s just for a few minutes.
The DoD is in the very early stages of planning and implementing JADC2 and IoT, with many of these decisions still to be made and only a few limited demonstrations of IoT’s potential to date. Assuming most of these IoT challenges can be met, the use cases for manned and unmanned applications are compelling and many. Following are several examples.
› Dividing data processing and storage intelligently between a massively scalable centralized environment such as the cloud when feasible, and fastperforming systems lying at the network edge. These solutions get systems much closer to the battlefield where data connections can deliver the fast network performance, low latency, and availability to enable quick decisions on the front lines.
Soldier-borne sensors and devices: Often called the Internet of battlefield things, a network of intelligence-gathering and biometric body sensors embedded in soldiers’ combat uniforms, helmets, weapons systems, and transports can convey valuable battlefield information together with soldier location, health stats, and mental state. This knowledge can be used to decide when to move soldiers out of the battlefield in the most adverse situations or administer medical aid proactively on a timely basis to reduce casualties.
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SOSA BLADE SERVERS Blade3U-VPXServers&SensorProcessors Powered by NVIDIA® Capture+1.905.852.1163wolf.ca/bladeConnectX®ARM,andXilinx®RuggedEmbeddedBoardsforDefenseandAerospaceVIDEO,RADAR&SENSOR:•Process•AI-Inference•Encode•Display SPECIAL REPORT www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 23
Figure 1 | Artificial intelligence (AI) can assist and automate IoT surveillance devices to lessen the warfighters’ physical and cognitive load. U.S. Army photo.
drones, sensors, and other devices to local edge database/AI/ML servers via 5G or another common fabric makes information available when the cloud is not accessible or too distant to deliver information quickly. When cloud connections are fea sible, IoT can take advantage of the cloud’s massive scalability and processing power. Even in remote situations where 5G is not available or cyberattacks render it infeasible, alternative available peer-to-peer networks such as WiFi, Bluetooth, or private propri etary communications solutions can synchronize distributed databases and provide the network and data resiliency needed on the battlefield. A solution is available for harnessing peer-to-peer connections and synchronizing data across them, then connecting and synchronizing data with local, regional, and cloud servers when they are Thereavailable.arenumerous other IoT use cases, such as supply-line vehicle monitoring, military-base security, preventive maintenance on the battlefield, and even inven tory management. As the battlefield becomes more complex and unpredictable, IoT and AI will become an increasingly valuable strategy for accelerating and automating critical decision-making, outthinking the enemy, and minimizing combat and civilian casualties.
Leveraging resilient connections and the power of network edge processing, unmanned systems and other IoT surveillance devices can share and merge data to deliver superior intelligence, surveillance, and reconnaissance (ISR) information directly to the front lines. The use of AI to assist and automate many surveillance functions can lighten the stress and cognitive load on soldiers on the battlefield. (Figure
MES Adam Fish is co-founder and CEO of Ditto, a cross-platform, real-time database that allows apps to sync with and without internet connectivity. He can be reached at adam@ditto.live or via Twitter at @Adam_Fish. Ditto https://www.ditto.live/
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Display and HPEC, SOSA™ Aligned Payload Profile VPX3U-RTX5000E-VO(WOLF-1348) NVIDIA RTX™ 5000, 9.5 TFLOPS peak, 384 Tensor Cores, video output This module with its integrated NVIDIA Turing GPU can be used to accelerate HPEC, AI and video processing tasks such as EW, ISR, synthetic vision, sensor fusion, and encoding, reducing cognitive overload at the tactical edge. The module can also be configured to be SOSA aligned for data processing only, with PCIe limited to x8 on VPX connector P1. With this configuration the following SOSA profiles can be supported: • SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11 • SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13 • SLT3-PAY-2F2U-14.2.3 Legacy Slot Profile HPC GPU, PCIe and Network Switch in one slot saving SOSA™ Switch Profile VPX3U-RTX5000E-SWITCH(WOLF-134S) NVIDIA Turing 9.5 TFLOPS peak, 8x 10GBASE-KR, 24x PCIe Gen4 Reduce slot count, simplify system architectures, and optimize the OpenCOTS system. The HPEC GPU adds the compute processing needed for the tactical edge while the PCIe and network capabilities address the fabric switching requirements of larger systems. This 3U VPX module includes a new Interface Control Document (ICD) that includes factory configurable options which can be used to maintain compliance with many Open COTS initiatives. By default the module has been designed to support SOSA switch slot profile: • SLT3-SWH-6F8U-14.4.15 Display and HPC, Converted Video, AV67.3 Coax for SDI and CVBS output, SOSA™ Aligned Payload Profile VPX3U-RTX5000E-COAX-CV(WOLF-1349) Integrate, demonstrate, deploy and upgrade sensor data processing efficiently with SOSA and AV67.3 coaxial connections. Tune power and PCIe topologies to reduce slot count and increase overall system efficiency. Deploy HPC and AI processing for EW, ISR and data processing. This 3U VPX module includes a new Interface Control Document (ICD) that includes factory configurable options which can be used to maintain compliance with many Open COTS initiatives. By default the module has been designed to support SOSA Payload slot profile: • NVIDIASLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11Turing,9.5TFLOPspeak,WOLFFGX video conversion, PCIe Gen4 switch HPC and Display Autonomous SBC NVIDIA Jetson AGX Xavier™ SBC or Payload Profile VPX3U-XAVIER-CX6-SBC(WOLF-12T0/12TZ) Xavier Industrial SoC, 1.4 TFLOPS, 20 TOPS, ARM64 8-core, ConnectX 100GbE This module provides the data processing capability needed for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. This autonomous module includes an NVIDIA Jetson AGX Xavier Industrial, an NVIDIA ConnectX-6 SmartNIC for fast and secure data transfer, and a WOLF FGX which provides support for non-native video formats such as SDI and analog. The SOSA profiles supported are: • SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 (SBC) • SLT3-PAY-SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11/14.6.13 (Payload) NVIDIA RTX A2000E with Video XMC-A2000E-VO(WOLF-3476)Outputs NVIDIA Ampere, 8.25 TFLOPS FP32 peak, video output support for DP, DVI, HDMI This XMC video output board includes an NVIDIA Ampere for processing, encoding, or AI inference. Rugged conduction cooled and air cooled models are available with support for front output on air cooled models. It supports hardware accelerated video encode and decode for H.264 and H.265. NVIDIA A2000E & WOLF FGX SDI, Analog, Other (WOLF-3470)XMC-A2000E-IO NVIDIA Ampere, 8.25 TFLOPS FP32 peak, WOLF FGX for capture and video conversion This versatile capture and process board includes both an advanced NVIDIA Ampere architecture GPU and WOLF’s Frame Grabber eXtreme (FGX). This board supports multiple I/O, including SDI, CVBS, RGsB, STANAG 3350 and other formats as required. wolf.ca/sosa | +1.905.852.1163 Rugged Embedded Boards for Defense and Aerospace VIDEO, RADAR & SENSOR: Capture • Process • AI-Inference • Encode • Display
wolf.ca/sosa | +1.905.852.1163 Rugged Embedded Boards for Defense and Aerospace VIDEO, RADAR & SENSOR: Capture • Process • AI-Inference • Encode • Display NEW SOSA ALIGNED PRODUCT DEVELOPMENT WOLF is accepting orders NOW for early access units Q1 2023 HPC with NVIDIA Ampere & VPX3U-A4500E-CX6(WOLF-144L)ConnectX-6 NVIDIA Ampere, 17.7 TFLOPS FP32 peak, 184 Tensor Cores, up to 100GbE This HPC product is ideal for data-heavy tasks such as sensor data processing and other C4ISR tasks. The embedded GPU provides advanced processing capabilities for HPC and artificial intelligence processing. The ConnectX-6 provides the Ethernet and PCIe connectivity needed to move large datasets securly and efficiently. • SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11 NVIDIA Ampere & WOLF FGX2 Video In/Out VPX3U-A4500E-FGX2-IO(WOLF-144D) NVIDIA Ampere, 17.7 TFLOPS FP32, Up to four 4K video, SDI, ARINC-818, DP WOLF’s 4K video capture and output board includes an NVIDIA Ampere GPU, which provides high performance video processing, and a WOLF FGX2 for video conversion to/from formats which are not native to the GPU, such as SDI, ARINC-818, or other formats as required. The module supports the SOSA Aligned legacy payload slot profile. NVIDIA Ampere & WOLF FGX SDI, Analog, Other VPX3U-A4500E-IO(WOLF-1440) NVIDIA Ampere, 17.7 TFLOPS FP32 peak, WOLF FGX for capture and video conversion This capture, process and display product includes an NVIDIA Ampere for video and data processing and a WOLF FGX for video capture and format conversion to non-native formats such as SDI, analog, and other formats as required. The product includes a PCIe Gen4 switch, and provides support for NVIDIA GPUDirect RDMA. The module can also be configured to be SOSA aligned with the following SOSA profiles supported: • SLT3-PAY-2F2U-14.2.3 Legacy Payload Slot Profile Display and HPC, SOSA™ Aligned and OpenVPX Payload Profile support VPX6U-A4500E-DUAL-VO(WOLF-2448) This dual GPU video ouptut and HPC board includes two high performance NVIDIA Ampere GPUs and a PCIe Gen4 switch. The embedded GPUs provide advanced processing capabilities for HPC and artificial intelligence processing for tasks such as sensor data processing, machine vision, and other C4ISR tasks or C5ISR tasks. The module can be configured to be SOSA aligned with the following SOSA profiles supported: • Payload Slot Profiles 10.6.3 and 10.6.4 • Legacy Payload Slot Profile Dual NVIDIA Ampere, 35 TFLOPs peak for HPC, video output support for DP, DVI, HDMI Autonomous Trusted Compute for HPC and AI (WOLF-24**) Dual NVIDIA Ampere, 35 TFLOPS FP32 peak, NVIDIA® BlueField®-3 DPU with ARM cores, Network and PCIe This 6U VPX includes two high performance NVIDIA Ampere GPUs and an advanced BlueField DPU-3. The DPU inlcudes an ARM CPU with 16 Hercules A78 Arm cores, 32 lanes of PCIe Gen5, and Ethernet connectivity with up to 400 GbE. The BlueField DPU also provides the advanced security and management features required for a trusted compute node. VPX6U-A4500E-DUAL-DPU3* * WOLF is seeking discussions with SOSA customers to finalize product configuration and features. SBC with NVIDIA Orin & VPX3U-ORIN-CX7-SBC(WOLF-14T0)ConnectX-7 NVIDIA® Jetson AGX Orin™, 5.3 TFLOPS FP32, 275 TOPS Int8, ARM64 12-core 2.2GHz, ConnectX up to 100 GbE This SBC provides the data processing capability needed for HPC tasks such as sensor data processing, machine vision, and other C5ISR tasks. This autonomous module includes an NVIDIA Jetson AGX Orin, an NVIDIA ConnectX-7 SmartNIC, and a WOLF FGX which provides support for non-native video formats such as SDI and analog. This module supports SOSA aligned SBC slot profiles. The default profile is: • SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
The unmanned aircraft system (UAS) market is expected to grow to more than $60 billion by 2025, and with each passing year the potential for threats due to these often hard-to-detect craft is only going to increase. Successful military-focused counter-UAS (c-UAS) solutions may neutralize these threats today, but these threats continue to evolve. Software-defined radio (SDR) will continue to play a key role in c-UAS solutions for the foreseeable future.
By John Orlando
U.S. Army Yuma Proving Ground has years of experience testing counter-UAS equipment, and for the past several years has also been home to a counter-UAS school that draws students from all branches of the military and from civilian law-enforcement agencies. Photo credit: U.S. Army/Mark Schauer.
SPECIAL REPORT
Leveraging SDR for counter-UAS applications
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Unmanned aircraft systems (also known as UASs or drones) are getting smaller and more sophisticated, not to men tion a lot more affordable for larger number of users. They are becoming faster with increased operational capa bilities and yet are easy to operate with minimal training required. Add to that their ability to access any area while under remote control and beyond lineof-sight and it is easy to see why UASs are becoming a preferred asset for both defense and commercial users. As with many other technology-enabling devices, the very benefits that make drones appealing also attract bad actors who would use them for wrongdoing. In the wrong hands, a UAS is an asymmetric threat because the cost and effort for an individual to deliver a large amount of destruction is low. Their ability to access areas that are oth erwise hard to reach, and to do so with relatively little risk of detection, have already been highlighted in a few highprofile security breaches: One notable one was an unauthorized landing on the White House lawn in 2015, which resulted in the Transportation Security Adminis tration (TSA) establishing a seven-mile “no-drone zone” around Washington; another was an assassination attempt on Iraqi Prime Minister Mustafa al-Kadhimi in November 2021, during which an explo sive-laden UAS attacked his Baghdad residence, while two others were shot down. The proliferation of and increase in complexity of UASs clearly results in a growing need for counter-UAS (c-UAS) technologies and approaches. There are multiple deployment sce narios that are critical when discussing the need for c-UAS, including airports where interference with aircraft could be catastrophic, prisons where drones can deliver contraband, and of course mili tary/defense facilities and battlegrounds where personnel are intent on force and civilian protection. Governments and municipalities have been working on how to respond, and federal regulations have been drafted to provide guidance on recreational operation of drones. In addition to “no-fly zones,” certain classes of drones must be registered with the FAA and carry different operating requirements depending on the class of drone. For example, Part 107 in the FAA’s Code of Federal Regulations, commonly referred to as the Small UAS Rule, outlines requirements for drones lighter than 55 pounds. This covers most hobbyists as well as many commercial applications. At the Department of Defense (DoD) level, there are more than a thousand indi vidual R&D programs targeting UAS applications. In 2019, the Secretary of the Army was designated as the DoD Executive Agent for Counter-Small Unmanned Aircraft Systems, which is charged with coordinating all c-UAS activities.
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The central challenge stated in the “U.S. Department of Defense Counter-Small Unmanned Aircraft Systems (C-sUAS) Strategy” states: “The exponential growth of sUAS creates new risks for the Department. Technology trends are dramatically transforming legitimate applications of sUAS while simultaneously making them elma.comElma Electronic Inc.
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SPECIAL REPORT Vetronics for manned and unmanned ground vehicles 28 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Today’s c-UAS solutions may leverage a variety of sensor inputs for detecting the presence of a UAS nearby, including audio, visual, and RF sensing. Both audio and visual sensing have a limited standoff distance for successful operation, which can limit usefulness; by the time a drone is visible or audible, it is already close enough to cause significant damage. Furthermore, there are typically limited options to defeat a UAS threat if only audio and visual means are considered.
Typical c-UAS solutions involve, at a minimum, a means to detect the presence of a UAS in an airspace of interest. Once detected, more advanced c-UAS solutions act to either disable or take control of the craft to limit the damage it can perform.
Leveraging RF to sense and/or defeat an impending UAS threat has significant advan tages: By design, most drones are wirelessly controlled by a remote operator typically located over several miles away from the drone’s location, as shown in Figure 1. There can be multiple RF data links in use between the controller and the UAS to deliver command/control messages, as well as the data feed from the craft (typically a video signal from the UAS to be displayed on the remote operator’s control terminal). These RF transmissions from both the UAS itself as well as the remote operator’s control terminal are of sufficient signal strength to enable operation over a range of several miles (or more) typically. Thus, it is also possible to perform detection and/or defeat of the UAS over a similar standoff distance, which is significantly further than what can be achieved with audio or visual sensing alone.
Manufacturers of UASs use a range of different RF frequencies and bandwidths to provide transmission of their command/control plus data feeds between the craft and the operator, including:
› ISM bands (typically 900 MHz, 2.4 GHz, and 5 GHz in the U.S.)
› 4G LTE cellular bands (600 MHz to 3.8 GHz)
Detecting UASs through RF sensing
› 5G NR [new radio] cellular bands (600 MHz to 3.8 GHz)
› Wi-Fi bands (2.4 GHz and 5 GHz)
› Other licensed RF spectrum between 100 MHz and 6 GHz increasingly capable weapons in the hands of state actors, non-state actors, and criminals. Small UAS may also pose hazards to DoD operations in the air, land, and maritime domains when con trolled by negligent or reckless opera tors. The Department must protect and defend personnel, facilities, and assets in an environment where increasing numbers of sUAS will share the skies with DoD aircraft, operate in the air space over DoD installations and be employed by our Nation’s adversaries.” By centralizing this activity, the DoD rec ognizes the importance of a uniform and rapid response to a very quickly evolving threat. Even as regulations overseeing the use of UASs continue to evolve, they cannot be relied on as a first line of defense against the potential damage that can be caused by drones. C-UAS solutions need to be developed and be ready to address both current and future airborne threats. For the rapidly evolving wireless threat landscape of c-UAS, software-defined radio (SDR) provides an ideal RF situa tional-awareness solution. The software in an SDR can be remotely reconfigured and upgraded, thus helping to futureproof the c-UAS solution. SDRs also often cover a wide RF frequency range, which is critical since different UAS manufacturers tend to use different RF frequencies. The Figure 1 | A diagram illustrates a typical UAS – c-UAS scenario.
benefits of SDRs for use in c-UAS are plentiful, but there are critical factors to keep in mind when selecting which SDR is appropriate for the task at hand.
www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 29
Key SDR features for c-UAS
Figure 2 | A diagram illustrates SDR’s function within a c-UAS scenario.
Leveraging SDR for c-UAS platforms When time-to-market and risk reduction are important factors, a COTS [com mercial off-the-shelf] SDR can be a sig nificant accelerator to bringing a c-UAS solution to the field that performs as expected (Figure 2). In general, there are
Defeating UASs with RF Once a UAS is detected and an appro priate alert is provided, the next question is whether action will be taken against the craft. For RF-based solutions, “defeat” or countermeasures can be as simple as RF jamming: By generating enough RF energy in the appropriate radio bands, the UAS can be rendered useless. Other actions apply more elegant techniques, such as emulating and overriding the commands being sent by the suspect craft’s remote operator, possibly inca pacitating the UAS by commanding it to land immediately. Note that transmitting RF signals, especially at the higher power levels that may be necessary for defeat operations, is typically governed by regulations that vary depending on the country where the system is deployed.
a number of different factors to consider when exploring the right SDR solution for c-UAS, especially when exploring c-UAS solutions that need to scale from small lowpower handheld c-UAS solutions all the way to fixed-site larger scale c-UAS solutions.
When evaluating SDR options for potential use in a c-UAS solution, it may not be immediately apparent which features are most important to ensure that the solu tion will be effective for both current and future UAS threats. The following section outlines key SDR characteristics that are important for a successful c-UAS opera tion. Of course, the efficacy of a final c-UAS solution is also highly dependent on the higher-level software that is performing the detection and/or defeat processing. Fundamentally, the capabilities of the SDR help set the functional foundation of the c-UAS solution.
Size, weight, and power (SWaP): The physical form factor of the c-UAS solution helps to provide an initial bounding box around the potential set of SDR solutions that could be viable. A handheld c-UAS solution that is battery-operated will focus on small physical size and low power consumption. Similarly, manpack c-UAS solutions that are intended to be carried by soldiers or patrol elements will place a premium on the final size and weight of the solution. For vehicle-mounted or static fixed-site solutions, power is typically abundant, with size and weight being significantly less of a concern. In general, with more power and size available for the solution, an increase in functionality and capability can be achieved. Ultimately, different deploy ment scenarios will require a different SDR solution, so this initial selection is critical to get right.
RF tuning range and frequency-hopping: As mentioned earlier, UASs may leverage a wide range of different RF frequencies for their command/control plus data links.
For a c-UAS solution to be capable of detecting the RF signatures from these craft, it must be capable of tuning to the same RF frequencies being used for the com mand/control plus data links. In general, most current UASs are using RF frequen cies that range between 600 MHz and 6 GHz. Thus, an SDR should be capable of receiving RF signals within these frequency bands for detection. If the object is defeat, the same SDR will need to be able to transmit RF signals in these same RF frequency bands. In some cases, these RF command/ control plus data links use frequencyhopping to quickly move from one RF fre quency to the next at a known cadence agreed upon between the drone and the remote operator’s control terminal. This structure helps minimize interference with other RF signals operating in the same unlicensed (or licensed) bands. The data-transport protocol that is used for the command/control plus data links also varies from one drone manufacturer to the next. Some manufacturers use the same low-cost Wi-Fi chipsets that support the standard 802.11 physical layer and protocol commonly found in commodity electronic equipment today. Others, such as DJI, use a propri etary physical layer and data transport protocol for their drones (Lightbridge or Lightbridge 2 in some systems, or OcuSync in other variants of their sys tems). A c-UAS solution leveraging RF needs to be able to accurately detect and identify the tell-tale RF signs of the various UAS command/control plus data links of a craft operating nearby.
RF transmit power: Scenarios where a UAS-defeat operation is anticipated will typically require an RF power amplifier to increase the transmit power coming from the SDR. The RF signal must be of sufficient strength to not only reach the UAS at a desired standoff distance, but in the case of either jamming or overriding the actual command/control signal coming from the remote opera tor’s terminal, power may need to be at a significantly higher level than the oper ator’s terminal. Most SDRs that include an RF transmitter emit an RF signal at a fairly low level, typically between 0 dBm and +10 dBm (1 mW and 10 mW, respectively). Thus, an external RF power amplifier is needed to boost this level to an appropriate level (typically in the range of 0.5W to 5W depending on the use SDRcase).modules appropriate for c-UAS are available today, enabling both the flexible RF hardware as well as the soft ware/FPGA [field-programmable gate array] interface layer needed to keep pace and future-proof c-UAS for tomor row’s airborne threats. MES
Multiple receivers: There are multiple deployment scenarios wherein having more than one RF receiver can help improve the performance of a c-UAS solution. In some use cases, leveraging multiple independently tunable RF receivers enables one RF receiver to focus on receiving/processing the RF signals from a detected UAS, while a second RF receiver sweeps through the RF spectrum looking for additional
Our chip resis tors were firs t launched into space in 19 7 7 as par t of the Voyager mission to Jupiter, Saturn, Uranus, and Neptune Since then our chips orbit the ear th on weather, communication, and government satellites. Our resis tors have been par t of missions to s tudy the Sun, Ear th, Mars, Jupiter, Pluto, inters tellar space, and other galaxies Space heritage? We live it daily Space Heritage State o f the A r t, Inc. R E SIS T I V E P RODUC T S Made he USA Mission Critical? Choose State of the Ar t resistors. SPECIAL REPORT Vetronics for manned and unmanned ground vehicles 30 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
threats. In addition, it is typically benefi cial to be able to ascertain the direction of origin of the RF signal being trans mitted from the UAS. The most common method to determine the angle of arrival of an RF signal is to use multiple RF receivers in a phase-coherent configura tion. With two or more RF receivers operating phase-coherently, a reason able estimate for direction of an RF signal emanating from a drone can be calculated. Expanding to four or more receivers can further improve the accu racy of this direction estimate.
Future UASs will almost certainly continue to expand the RF frequency bands being used, thus making detection more challenging. The ability to quickly scan through large ranges of RF spectrum to look for the telltale RF signatures of a UAS is critical. Similarly, for UASs that are employing fast frequency-hopping to rapidly move from one RF channel to the next, it is imperative that an SDR also be capable of either per forming the same frequency-hopping operation, or consuming the entire RF channel through which a UAS may be hopping for digital post-processing. This action enables the SDR to keep pace with the RF transmissions being sent by the drone.
John Orlando is CEO and co-founder of Epiq Solutions, an engineering company focused on delivering software-defined radio (SDR) products and turnkey RF sensing solutions. He is an author and presenter on all things SDR, most recently presenting at GRCon 2021 on “Breaking through the 6 GHz Barrier.” Epiq https://epiqsolutions.com/Solutions
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“On the sensor side, they use AI as a way to pull out threats from the chaos,” he continues. “They’re building systems that may automatically do something based on a learned behavior and adapt to a threat. It will realize, ‘Hey, I’m trying to sense something and I realize I’m being jammed. I can be cognitively aware of that attempt to deny access and I can change my waveform or some parameter of the radar to avoid someone messing with me.’”
MIL TECH TRENDS Test & measurement trends 32 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The top trends for radar and EW test and measurement systems are more advanced modes for antijamming, more adaptability in waveforms, and leveraging of AI solutions to produce more effective systems, says Haydn Nelson, principal solutions manager for radar, EW, wireless, and EO/IR test solutions at National Instruments (NI – Austin, Texas).
By Dan Taylor
Radar and electronic warfare (EW) are challenging applications for designers of test systems. The only constant seems to be change in technologies, tactics, and countermeasures. Industry players believe that artificial intelligence (AI) may hold the key to driving the effectiveness of radar and EW.
Cryptologic Technician 2nd Class Jonathan Morel uses a radar tracking system on the destroyer USS Michael Murphy (DDG 112) to track surface contacts. (U.S. Navy photo by Mass Communication Specialist 3rd Class Danny Kelley/Released.)
The Constant software evolution, open standards, and higher bandwidth are all key drivers of test and measurement designs in defense applications. Each also creates an environment where artificial intelligence (AI) techniques can enable improvements in performance that in turn enhance battlefield effectiveness.
AI driving major changes in DoD test and measurement for radar/EW
Growing opportunities in AI Chris Johnston, director of radar and EW solutions for Keysight Technologies (Santa Rosa, California), says he believes that the sheer volume of data collection in modern testing requires computerassisted analysis of raw data.
(Figure 1.)
Testing the effectiveness of that AI is easier said than done, however. One of the challenges testers run into is how to train an AI model with an unknown data set, since threats exist that are both known and “Algorithmicunknown.testing is a big challenge because of the complexity,” Nelson notes. “We’re seeing a lot more people trying to find ways to do that in the digital realm like with simulation, and then take a radar subsystem and hook it up to a digital environment emulator so you can do testing in the lab before you take it on the open-air range.”
Tim Fountain, radar and EW market segment manager at Rohde & Schwarz (Columbia, Maryland), notes that the testing community is “actually getting there” when it comes to AI, although challenges remain. “Now the challenge is everything has to be cognitive,” he says. “Take spectrum sensing: The systems need to be able to look at the spectrum and make decisions in real time about where they can operate given geopolitical boundaries and where adversaries are operating. On top of that, how do you actually create realistic envi ronments for these cognitive systems?
“And that’s been one of the challenges,” he continues. “Because in the majority of these situations, you have to create real Figure 1 | Keysight’s Z9500A simulation view for dynamic scenarios. (Illustration courtesy Keysight Technologies.)
www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 33
“It is not feasible to have engineers and analysts scrub terabytes of data to find patterns, signals of interest, or interfer ence,” Johnston says. “AI can play a major role in reducing big data down to some thing actionable. Also, when possible, having open architectures provides end users a way to include their algorithms into the test system, since much of the research is still proprietary research.”
environments that look like what the thing is going to see when it gets out there – like congestion. The challenge becomes, how do you create data sets that realistically model what systems are going to see such that we can train it?”
A key problem in those models and scenarios, however, are those unknown unknown threats, Fountain says. For example, if you want to test how a radar detects a certain type of missile, the problem is that you know the adversary will probably modify some of the oper ating parameters of the missile in an actual wartime situation so a radar has more trouble spotting it.
(Illustration courtesy Rohde & Schwarz.) MIL TECH TRENDS Test & measurement trends 34 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Software driving the industry Systems are becoming more softwaredriven than ever before, Nelson notes, meaning that radar systems will have the ability to change and adapt waveforms, frequencies, and modes depending on the threat. Open standards have made it easier to develop these types of soft ware for radar systems, he says.
“If I’m an engineer and I’m designing a new mode on a radar where I’m trying to train for a new threat in the threat space, I want to do that in software and do it quicker,” he explains. “I think that’s another reason why they’ve pushed for open standards: because they can quickly upgrade hardware as software evolves. ‘Oh, we’ve got to apply a larger model and our four-year-old processor NI’s Radar Target Generation Driver built on the vector signal transceiver. Rohde & Schwarz’s Integrated, Record, Analysis, Playback System (IRAPS).
Fountain likens a new algorithm to a baby that doesn’t understand much at first: “You need to train the baby through real-world examples – don’t do that, don’t touch that, eat this,” he says. “It’s a similar situation with these AI algorithms.”
“As a result, the system doesn’t fit a static library model,” he observes. “You can’t go out in the real world and cap ture these new modes because adver saries are not operating them in those modes absent a real conflict. But that’s the real challenge: You’ve got to predict how something is going to work without knowing how something is really going to work.” (Figure 3.)
(Illustration courtesy NI.) Figure 3 |
Digital testing Testing radar and EW equipment at an actual open-air range – such as Naval Air Weapons Station in China Lake, California – is a critical step for new technology to be accepted, since it is the only opportunity to test it against real-world systems and weapon stations, Nelson says. These are expensive tests, though, so there are very few opportunities and the test must be run in one specific weather scenario, one threat scenario, and one environment. That reality creates a problem for testers who want to understand how the system will perform in another part of the world against a potential adversary, often in challenging conditions, he explains. “You’re going to need to do some of that testing digitally,” Nelson points out. “There are a lot of threat emulators out there, so we see a lot of people looking to do more of that in the lab.” (Figure 2.) An ongoing challenge is that surrounding testing more technologies digitally and in the lab in realistic ways, such as conducting multiple layers of testing and trying out different environments. The ideal, Nelson says, is “being able to come up with digital models and then you can have a digital model of a certain threat scenario you can test over and over.”
Figure 2 |
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Darren McCarthy, aerospace and defense industry segment manager at Rohde & Schwarz (Columbia, Maryland), says that the commercial space is outspending the DoD 45-to-1 in satellite technology research, so the military has a lot of catching up to do in this area. The DoD and the defense industry will have to find some way to make use of the commercial 5G technology already available.
is going to run out of steam.’ The ben efit of open standards is we can do tech insertion.” All of that has to be mirrored on the test side, Nelson says: “You have to have a software-defined test system.”
5G’s future role Another area of interest is the challenge of adopting 5G technology for military applications. While 5G offers tantalizing opportunities to the military to pass information on the battlefield more effectively and with less expensive hard ware, it also carries security issues that testers will need to resolve before it can be widely adopted in the defense arena. “If you build anything that’s networked, it can be hacked,” Nelson says.
Keysight’s Johnston adds that software is key to the testing industry as it tries to find better ways to do modeling. “There is a rapidly growing need for digital test beds, so the software and firmware algorithms are testing in upto-date software development para digms – like continuous integration,” he says. “This requires that the test and measurement testbeds run as digital twins, so they are integrated and regres sion-tested many times in automated software loops. Ideally these same tests are migrated to full [hardware] test beds when the software is ready to test in actual deployments, particularly for con gested and contested environmental modeling in EW scenarios.”
He also says that he supports such ini tiatives as the Air Force Research Lab (AFRL) SDR competition. In last year’s challenge, a team of undergraduates from Worcester Polytechnic Institute (WPI – Worcester, Massachusetts) used a $1,200 radio to jam just one specific user, which exposed a surprising vulnerability in the 5G standard. “5G is great for commercial, but I think DoD [the U.S. Department of Defense] will have to have their own version of the standard,” he maintains. “They may reuse some of the terminal hardware, but for tactical applications it needs to be hardened.” Other complications arise from using 5G, he adds: “They use some bands that get really close to radar bands,” he observes. “As 5G goes global, how does that impact radar and sensor systems out there? When we fly this specific radar system off the coast and they have a 5G network, is it impacting our sensor systems?”
“There’s no longer going to be a 20-year program to put up a satellite,” McCarthy asserts. “[The military’s] going to use what’s up there and carve out a piece of the commercial network to utilize for themselves.” MES www.pixustechnologies.com
In civilian venues, dropped connections and garbled transmissions can be a source of frustration. On military smart bases, they can mean the differ ence between mission success or failure. No surprise then, that the U.S. Department of Defense (DoD) expects field-communications infrastruc tures to support clear audio transmission, high-performance video, and nonstop uncorrupted data communications. For those tasked with standing up these environments, however, meeting those expectations can be enor mously difficult.
Assuring reliable, high-performance communications within contested and often congested military environments poses unique challenges. New 5G performance-testing techniques can help overcome these hurdles, combining the flexibility of lab testing with real-world field data.
Field-to-lab testing assures environmentsincommunicationshigh-qualitychallenging
By Steve Douglas MIL
Smart bases, especially those in forward operating environments, present a long list of on-the-ground challenges to reliable, high-performance com munications. As these locations often have no existing fiber infrastructure, wireless communications – increasingly, 5G – becomes the default option.
TECH TRENDS Test & measurement trends 36 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
However, smart base environments tend to have highly contested and con gested airspaces. These venues are also typically characterized by signifi cant noise, fast-moving vehicles and aircraft, interference from geographical topography, and other factors that compromise reliability and quality.
› Dynamic spectrum-sharing (DSS): In urban and congested environments where the commercial market shares spectrum with military applications, spectral interference in shared frequency bands can create significant issues. Historically, however, it has been extremely difficult to evaluate the impact of DSS on military communications via field testing, especially in forward operating environments. A field-to-lab approach makes it possible to run real-world field data through a variety of DSS scenarios, with and without additional impairments, and identify needed adjustments before DSS is implemented.
› 5G FWA: 5G FWA is among the most effective ways to enable high-performance connectivity in the field. However, as the technology relies on a user’s line of sight, it can be among the most vulnerable to interference and signal degradation. Understanding exactly how the infrastructure will behave in its specific field environment is crucial to identifying issues, correcting them (such as by adjusting antenna placement), and measuring the effects of those corrections. This is also an area where running “what-if” scenarios modeled on potential future conditions can be beneficial. If the infrastructure interfaces with high-speed aircraft, for example, lab testing can emulate Doppler-effect influence on communications long before the network goes into production.
› Data, video, and voice quality: Traditional field testing can offer an accurate picture of how high-volume military communications perform in a given environment under the calm, relatively noise-free conditions that prevail when that environment is first created. It cannot, however, simulate the thousands of troops, vehicles, and constant motion that exist when a forward smart base is operating at full capacity – even though it is under those conditions that reliable communications are most essential. Field-to-lab testing can take real-world environmental data and test voice, video, and data communications against noisy, highly congested future conditions. Lab test beds can capture drive, flight, and walk testing, including measuring the impact of signal reflection and topographical interference. They can also augment baseline data to simulate motion of vehicles and aircraft at different speeds and vectors, and even the presence of thousands of troops. This sort of testing regimen
Field-to-lab evaluation draws on the stability and flexibility of lab testing 5G networks and technologies, but uses live feedback from the field environment to enable more accurate results. In this model, data is captured from the real-world smart base environ ment and imported to a lab testbed, where data logs are replayed to identify potential issues. Deployment teams then adjust the communications network and technologies and repeat the process iteratively. In this way, performance tests draw on the most accurate environmental data, while bringing to bear the full capabilities of a laboratory testbed to simulate the production environment at scale.
Inside field-to-lab performance evaluation
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By combining the best aspects of field and lab testing, military stakeholders can: 1. Establish a baseline for current performance to identify potential issues 2. Enable repeatability by iteratively testing for multiple factors against that baseline, in ways that are not possible with field testing alone 3. Improve accuracy by creating a lab-testing regime tuned specifically to the target environment 4. Test against field conditions not currently present by adding noise, congestion, movement, and other factors to baseline data
This mix of challenges makes testing of core technologies such as 5G fixed wire less access (FWA), spectrum sharing, and voice/video/data applications crit ical. Yet, those seeking to conduct real istic testing face a basic dilemma: The environment in which these technolo gies operate while a smart base is being stood up can be radically different from the conditions that will prevail once it is fully commissioned and operating at scale. Historically, field engineers have had few on-the-ground tools available to bridge this gap. Today, a new genera tion of “field-to-lab” testing techniques can enable more accurate, predictive evaluations.
5. Improve relevance and utility of testing by combining live capture of field data with 3D visualizations and creating practical resources to guide optimizations Testing in action Once a field-to-lab evaluation framework is in place, stakeholders can proactively test a broad range of smart base communications applications and infrastructure.
› Three-dimensional terrain: Topographical characteristics of a given base environment –forests, hills, valleys, and other features – can significantly impact communications. Field-to-lab testing enables testers to visualize captured field data overlaid onto 3D maps of the environment. In this way, they can more accurately translate test results to real-world optimizations, such as identifying exactly where antennas should be placed to achieve the best performance. (Figure 1.)
Enabling tomorrow’s smart bases These field-to-lab evaluation capabilities can dramatically expand the toolset avail able to DoD planners and other stake holders to ensure high-quality, highly reliable communication in locations where it is needed most. These capabili ties are now extensible to practically any environment, through trusted military and government technology partners.
› Speech intelligibility: Nowhere is clear verbal communication more essential than in forward operating environments, especially in scenarios when troops are under attack. Yet measuring audio performance under normal conditions cannot replicate the chaotic scenario of a live environment congested with vehicles, aircraft, and troops. Ensuring that individual words and phrases can be understood, even in noisy and contested environments, is essential – yet extremely difficult to achieve with traditional field approaches. Alternatively, field-to-lab test beds can evaluate baseline voice communications via rhyme testing. This emerging methodology algorithmically models human auditory systems and uses a rhyming profile of short words and phrases to test intelligibility. Testers can add artificial impairments and examine “what-if” scenarios to optimize infrastructure against a variety of potential future conditions.
can proactively reveal drops or degradations and help ensure clear, secure communications in congested environments.
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› Video performance: Smart bases use video in a variety of ways, including for both humans and machines. In addition to video calling, installations in forward- and rear-facing installations may share real-time video uplinks, monitor warehouses and supply transport logistics, and more. It is therefore essential to ensure that video communications are clear and free from pixelation and other degradations. Smart bases can employ field-to-lab evaluation frameworks to continuously monitor video streams and conduct automated testing for quality and reliability. These test beds replay realworld data captured from machine-related field environments to evaluate the performance of data transfers and identify sources of pixelation and other quality issues.
Note also that this model need not be restricted to standing up new infrastructure: By implementing field-to-lab evaluation as an automated, continuous testing framework, stakeholders can monitor smart base environments on an ongoing basis, diagnose new issues as they emerge, and measure the impact of planned technology changes before
Figure 1 | An Army signal-support specialist prepares a high-frequency radio system during a battalion field-training exercise at Fort Sill, Oklahoma. Commercially available 5G technology, due to its high frequency output and smaller size, enables easier integration of the systems on to Army platforms. Photo credit: U.S. Army/Sgt. Dustin Biven.) they are put into production. They can ensure that high-quality communication is always available for tomorrow’s smart military bases, even in the most chal lenging forward environments. MES Stephen Douglas heads organization,marketSpirent’sstrategyhelping to define market positioning, future growth opportunities, innovative solutions, and disruptive technologies. Stephen also leads Spirent’s strategic initiatives for 5G and future networks and represents Spirent on a number of industry and government advisory boards. He has more than 24 years of experience in telecommunications and has worked across the industry with service providers, network equipment manufacturers, and start-ups.
MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 39
Spirent • https://www.spirent.com/ www.militaryembedded.com
By Bob Stevens
Managing supply chain, obsolescence, and counterfeit parts
Although legacy systems are costly and vulnerable to malicious cyberattacks, it’s critical that government agencies within the U.S. Department of Defense (DoD) effectively and proactively bridge the gap between legacy and modern
Now more than ever, federal agencies within the U.S. Department of Defense (DoD) must develop software capabilities that are compatible with legacy technology while maintaining and meeting strict security needs that protect proprietary code and networks.
Securing the software supply chain by modernizing legacy systems
Spurred by guidance from NIST [National Institute of Standards and Technology] and actions outlined in President Biden’s Executive Order issued in May 2021, federal agencies are already starting to tackle software supply-chain security. While these guidelines are critical to success, agencies must rise to the challenge of proactively implementing new technologies and securing their software supply chains, instead of waiting to act. technological frameworks. A hard, reactionary pivot from legacy to modern systems can increase security risks and expose vulnerabilities.
As part of this transition, agencies should consider moving from prefab and DIY devel opment environments to more mature options. An open-source DevOps [the term for a set of practices that combines software development (Dev) and IT operations (Ops)]
INDUSTRY SPOTLIGHT 40 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The modernization undertaking is more complicated, ambitious, and sometimes even painful, as public-sector agencies have increased imperatives for security, compliance, and legal regulations, as well as acquisition laws and policies.
Pioneering new processes, technologies, and approaches can be especially chal lenging working within the time, money, and resource constraints of the public sector. Teams are often pressured to expand and enable capabilities out to the entire
Laying the foundation for a sustainable transition When undergoing a modernization process and implementing new security measures, organizations within the public sector must adjust for unique constraints and specifica tions unlike those experienced by commercial enterprises. Public sector organizations must go faster, meet compliance requirements, and demonstrate to auditors that they are delivering in accordance with any quotas or contracts.
Rather than wait for final guidance, CIOs within the public sector need to work toward solutions for implementing software supply-chain security to proactively defend their agencies. Such progress will enable IT and development teams within agencies to continue refining and adjusting their approach to meet best practices.
platform that enables continuous security scanning throughout the software develop ment life cycle (SDLC) can be a valuable alternative that streamlines transformation, reduces the number of handoffs, and connects efficiently to older and newer systems alike, making it more cost-effective and secure.
DC-DC www.picoelectronics.comTransformersConverters&Inductors PICO ELECTRONICS, Inc. 143 Sparks Ave., Pelham, New York 10803 Call Toll Free 800-431-1064 FAX 914-738-8225 E Mail: info@picoelectronics.com • Ultra Miniature Designs • MIL-PRF 27/MIL-PRF 21308 • DSCC Approved Manufacturing • MultiplexAudio/Pulse/Power/EMIModelsAvailable • For Critical Applications/Pico Modules, Over 50 Years’ Experience Transformers&Inductors • MIL/COTS/Industrial Models • ProgrammableRegulated/Isolated/AdjustableStandardModels • New High Input Voltages to 900VDC • AS9100C Facility/US Manufactured • Military Upgrades and Custom Modules 2V to 10,000 VDC Outputs 1-300 Watt Modules Surface Mount & Thru Hole DC-DC Converters For full characteristics of these and the entire PICO product line, see PICO’s Full line catalog on our NEW Website: A50_MilEmbSys_2_12x10.qxp_A45.qxd 7/11/22 www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 41
functional ecosystem of users, managing legal, regulatory, and compliance con trols for authorization while expediting software deployment. In order to ensure that security is woven in throughout the software supply chain, people, processes, and technolo gies need to work together to develop secure code that has been assessed by numerous security personnel, build open and transparent processes, and continu ously test code. With a DevOps platform, agencies can effectively protect software supply chains through end-to-end security that helps protect multiple fronts, including protection of internal code and external sources, while automatically enabling continuous software compli ance requirements. For example, agencies like the Navy that work with legacy shipboard sys tems still need the ability to update operating capabilities without straining existing legacy systems and smoothly transitioning between different software versions. Avoiding vendor lock
A complete DevSecOps platform, delivered as a single application, can serve as an integrated, out-of-the-box, modern software-development factory. This is the most efficient and easy-to-manage path for quickly building, testing, and delivering applica tions without needing to manage dozens of separate tools and custom integrations.
The primary concern experienced by government agencies when implementing a singular platform is referred to as vendor lock, which is when organizations are unable to transition from a single vendor, or introduce an additional solu tion, to prevent a single point of failure. Most agencies work hard to prevent vendor lock as it can create security risks for organizations. When seeking out a DevOps solution, agencies should ensure that the platform enables them to integrate specific tools that better suit their needs, thus eliminating any vendor lock and enabling organizations to use the tools that meet their needs for spe cific functions.
An integrated software factory can also provide a single source of truth for centralized, asynchronous collaboration, which can help teams meet compliance requirements.
› Documentation: Document and track code and libraries of each application through testing, validation, and deployment.
› Collaboration: Enable sharing and coordination across the entire software development team; facilitate documented, transparent peer reviews and approvals for code changes. Deliver feedback and insights from applications in production, allowing developers to detect issues and improve the application in real-time.
Implementing a software-factory model
An effective software factory has one interface, one user model, and one data model for the entire DevSecOps life cycle.
A DevOps platform facilitates real-time, centralized communication and collabora tion, which breaks down silos and eliminates sequential handoffs across development, operations, and security teams to deliver better and faster application delivery. Some crucial capabilities for a DevOps platform include measuring performance, contin uous integration/continuous delivery (CI/CD) pipeline posture, and built-in security.
To begin the modernization process, agencies must first assess their place on the DevOps maturity spectrum and understand the elements needed to speed up the deployment of missioncritical capabilities out into the field. Once the agency has an agreed-upon baseline, they can begin determining the best strategy for moving forward, starting with clearly defined goals and a process for measuring performance.
The factory’s end-to-end view of code quality enables better quality, more secure code, and faster delivery as well as fewer development delays and more on-time Areleases.software factory (Figure 1) for the public sector must meet the following requirements:
By implementing security scanners into the development process, agencies can scan every line of code as it is committed, thereby enabling developers to identify and remediate vulnerabilities before they are pushed. This process uplevels the shift-left methodology – addressing security continuously so that all products are created secure by design.
› Automation: Automate the steps required to take the application from development to deployment and delivery, as well as the CI development tasks completed for every code change, with automated testing and security scanning incorporated into the development process.
Figure 1 | The software factory streamlines software development and delivery while incorporating security and compliance throughout.
Managing supply chain, obsolescence, and counterfeit partsINDUSTRY SPOTLIGHT 42 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
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› Testing: Enable delivery teams to capture, discuss, prioritize, and define new requirements and use cases. Leverage containers, containerization, and the cloud, and support on-demand, dynamic test environments for testing by developers and teams. Software factory in military environments Using a few disparate tools, or attempt ing to connect outdated tech with emerging tools, can make it especially difficult to meet mission objectives in military environments. This approach can slow deployment timelines, create siloed teams, and generate technical obstacles to communication and col laboration. Additionally, projects devel oped without a secure platform from the start can miss cybersecurity vulnerabili ties, meaning that developers and secu rity analysts must then spend additional time repairing and recovering data, which adds to project costs. Since switching to GitLab’s single DevOps Platform, one military agency found increased cost-saving results and saved 100 years of programming time. Reducing and integrating the plethora of tools in its toolchain into a single plat form with built-in security and compli ance enabled the agency to minimize its software release times from the standard three to eight months to just one week. Envisioning the future Speed-to-mission is a key objective for agencies across the public sector but can seem at odds with the strict secu rity and compliance measures in place. Digital modernization is not as simple as employing a brand-new set of tools overnight; it is a process that evolves with the many bumps in the road of the continuous evolution of technology. The shift to a digital future requires careful handling of both legacy systems and emerging technologies. A single DevOps platform is an effective tool to bridge the gap between today’s technology and tomorrow’s advance ments, while still remaining secure. Perhaps the most fundamental step www.militaryembedded.com
Managing supply chain, obsolescence, and counterfeit partsINDUSTRY SPOTLIGHT
MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 45
MES Bob Stevens – a former U.S. airman – is the current Area Vice President of Public Sector at GitLab. With more than 25 years of experience in the industry, Bob Stevens leads the Public Sector team by helping agencies fundamentally change the way their Development, Security, and Ops teams collaborate.
GitLab Federal • https://about.gitlab.com/solutions/public-sector/
for leaders is to ensure that cultural mindsets and processes shift to align with new technologies. Executing and documenting process changes, communicating these changes to team members, and creating an environment that incentivizes support from personnel is critical. Technology restructuring must always be mirrored by a cul tural transformation, lest agencies experience wasted investments, dysfunction, and failure of long-term adoption.
The ongoing global chip shortage and difficult time sourcing components and raw materials has escalated a decades-long issue for the defense and aerospace industry. It has steadily been losing its purchasing leverage in the marketplace to other powerhouse industries, thus pushing the technological road maps of the component manufacturers. What events led up to this overarching issue and how can defense and aerospace more effectively source the parts they need in such a dynamic market? They are a very small fish in a very large pond, without many options in front of them to quickly source their legacy parts. Short-term, there are solutions available to maintain a market footing. Long-term, to avoid a critical point, defense must be willing to adapt its systems to the newest technology that will only grow in availability.
Playing catch-up:
By Frank Cavallaro
Managing supply chain, obsolescence, and counterfeit partsINDUSTRY SPOTLIGHT 46 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
How defense and aerospace can improve the component procurement of DMSMS products
The paradigm shift The move to COTS sourcing became a problem for defense and aerospace in the 1980s and 1990s as more industries began using semiconductors in their products. Most notably, personal computers boomed during this time and therefore complex technology was no longer siloed to government entities or large organizations –anyone could have access in their homes, and soon in the palm of their hands.
Since that changeover happened, defense and aerospace manufacturers have seen their market position consistently diminish as semiconductors touch nearly every part of modern life. The current semiconductor shortage is only exacerbating an existing problem, making even common and so-called available products seemingly unavailable.
The core problem
Defense and aerospace manufacturers originally sourced their components from specialty suppliers, with some companies even manufacturing them in-house. To reduce costs, they moved to com mercial off-the-shelf (COTS) sourcing, which in hindsight became a cost-saving win but created a difficult-to-manage supply-chain situation when seen in the longer term.
Defense systems run counterintuitive to the current technological market. Consumerdriven manufacturing develops products with the assumption that they will be replaced in two or three years, driving chip suppliers to abandon low-demand, older technology products at a faster pace. In contrast, defense manufacturers seek to prolong the life of their components, a situation driven mostly by their product road map, intense engineering efforts, and the support needed over the lifetime of a weapons system.
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Figure 1 | Demand for technologically advanced chips increased across the consumer and industrial markets, leaving legacy chips used in defense more difficult to produce and procure.
The results of this change were twofold: incredible profit potential for suppliers to cater to new markets and increased demand for chips for consumer-facing companies. This incited a paradigm shift for defense and aerospace – demand increased in the consumer market, and so did technological innovation. This innovation, frequently referred to as Moore’s Law, was progressing at a faster speed than the military and aerospace manufacturers needed or could accommodate in their product life cycles.
Maintain market foothold in the short term Add to this the high-reliability components needed by defense and aerospace, and the situation becomes more difficult to manage because there are not many substi tutes that can perform at the level and length of time that weapons systems require.
Chip production was evolving to accommodate new markets, making those legacy chips the defense and aerospace industries had traditionally relied on more difficult and expensive to produce and thus source. (Figure 1.)
Remember the golden era of defense and aerospace? Defense and aerospace were once a beacon of R&D and technological advancement as the main user of tech nology-leading semiconductors. Their systems evolved, albeit slowly, to accom modate new chip advancements, but the rate of change was so slow compared to today’s standards that it did not make substantial everyday impact, though defense’s technological efforts did pave the way for the use of semiconductors in everyday life as we know it now.
These factors create a problem known as diminishing manufacturing sources and material shortage (DMSMS). DMSMS endangers the life cycle support and viability of weapons systems or equipment when a specific component supplier designs out, or when their component is replaced with the next generation.
parts 48 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide
To assert a better position in the market, companies can make a number of moves:
Avoiding critical limits long-term
Cooling RemovingSystems:Heatfrom Embedded Electronics
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INDUSTRY SPOTLIGHT Managing
The current chip shortage has brought several potential solutions for all industries to the forefront, with onshoring chip pro duction gaining the most notoriety. The larger challenges of onshoring aside, this move would not necessarily relieve the pressure for those relying on legacy com ponents – namely, the defense market –as the new chip-fabrication plants and technology will focus on cutting-edge devices and not current or even legacy technology products. Defense industries will still be left struggling to source the components they need. Defense and aerospace must develop a strategy of quick decision-making using the best information they have at hand.
In instances where there is not a components shortage, inventory-sharing, or pooling components, is a viable option to ward of DMSMS and EOL [product end-of-life] constraints. Although capital-intensive and coordination-heavy, if managed well, it can be a reliable option.
A2 Global Electronics • https://a2globalelectronics.com
› Aftermarket goods: Genuine OEM goods and the aftermarket need not be seen as a last resort, especially in difficult times of inventory planning.
Sponsored by LCR Embedded Systems, nVent/Schroff, & Pixus
Modern military electronics systems often face the challenge of “getting the heat out.” Whether it’s a graphics processor, a general-purpose processor, or an FPGA, these crucial parts all bring unprecedented capability to radar, avionics, and electronic warfare applications but they also create headaches for design engineers who must craft unique ways to manage the excess thermals these devices generate. In this webcast, thermal-management experts detail methods for reducing heat and thermals in modern military electronic systems. (This is an archived webcast.) the webcast: https://bit.ly/3Rl1Rxm https://militaryembedded.com/webcasts/archive/
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MES Frank Cavallaro is CEO of A2 Global Electronics (A2), with nearly 30 years of experience in the electronic components distribution industry. Frank leads A2 as a global distributor of electronic components and supply-chain solutions that operates in North America, Europe, Japan, and Asia.
and
› Inventory-sharing: The benefit of a shift to COTS is that there are commonalities between defense manufacturers themselves as well as some consumer components. supply chain, obsolescence, counterfeit www.militaryembedded.com Systems
Technologies
While these solutions are viable in the short term, the defense and aerospace industries will be swimming upstream until their complex systems become compatible with cur rent technology platforms and road maps. Without concerted investment into updating its systems, the defense industry will be perpetually stuck in a scenario of its technology always being behind and will be unable to reap the benefits of multi-function chips or future inventory-sharing.
› Follow the data: Lead times are changing faster than ever, and supply-chain constraints make it difficult to plan more than weeks ahead. Quick decisions informed by up-to-date (and historically predictive) data will be key to understanding when and where to source.
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4. Multi-factor authentication methods: In addition to a username/password, MFA requires another form of authentication. One approach is to use a security dongle, such as a YubiKey, containing a license key or some other cryptographic protec tion mechanism that the user plugs into a device USB port. The U.S. Department of Defense (DoD), including civilian employees and contractor personnel, uses a smart card called the common access card (CAC), in which case the computer must be equipped with a physical card reader.
Five steps to take when securing your data with multi-factor authentication
The National Information Assurance Partnership (NIAP) is responsible for the U.S. implementation of the Common Criteria (CC), an international standard (ISO/IEC 15408) for IT product security certification. CC is a framework that forms the basis for a government-driven certification scheme required by federal agencies and critical infrastructure.
50 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
3. Employ pre-boot authentication: A designated security officer or administrator will define the user roles and identity management used to authenticate access to the SED. The password security that forms part of an OS is notoriously weak and subject to hacking, so the first level of authorization acquisition (AA) should occur prior to the booting of the OS, in which case it is known as pre-boot authentication (PBA).
A more robust PBA implementation will include MFA.
1. Understand the sensitivity of your data: First, note that not all data is sub ject to the same levels of protection. In the U.S., since all federal departments are part of the executive branch, the data-classification system is governed by executive order rather than by law. As of 2009, information may currently be classi fied at one of three levels: confidential, secret, and top secret. Subsequent executive orders may change these classifications and the levels of protection associated with each classification. 2. Use self-encrypting drives: Sensitive data needs to be encrypted, executive orders notwithstanding. Self-encrypting drives (SEDs) encrypt data as it’s written to the drive, which has a self-contained drive encryption key (DEK). The key and encryption process are transparent to users.
BLOG: SECURING
By Chris Kruell, Director of Marketing, CDSG
SEDs encrypt everything on the drive, which is called full-disk encryption (FDE), including operating system (OS), applications, and data. On-drive encryption is called hardware FDE (HWFDE) and uses an embedded encryption engine (EE), which should provide 256-bit AES encryption. An SED should adhere to the TCG Opal standard, a secure standard for managing encryption and decryption in the SED. SEDs are often certified to Federal Information Processing Standards (FIPS), developed by the National Institute of Standards and Technology (NIST). For example, a FIPS 140-2 L2 certification assures that the SED’s EE has been properly designed and secured; the L2 ensures that there is visible evidence of any attempt to physically tamper with the drive.
MFA combines two or more independent credentials: what the user knows (pass word, for example), what the user has (an authentication app, for example), and what the user is (biometric palm vein scan, for example). Since most MFA implementations use two factors, it’s often called two-factor authentication, or 2FA. There are five important considerations when protecting your data with MFA.
Each user should have an individually assigned password, which authorizes the SED to use its cryptographic key to unlock the data. The security officer should have the ability to add new users and revoke access to existing users. When a user’s access is revoked, that user won’t even be able to boot the OS.
President Biden’s “Executive Order on Improving the Nation’s Cybersecurity,” enacted on May 12, 2021, directs all branches of the federal government to improve their resilience to cybersecurity threats. This order directly calls out the need to secure data-at-rest (DAR) with encryption and multi-factor authentica tion MFA(MFA).requires a user to provide multiple pieces of evidence that combine to verify a user’s identity. Depending on the appli cation, MFA may be required at login or perhaps when trying to access an appli cation or even a particular folder or file.
Computer data exists in different states at different times: data in transit (information flowing through a network); data in use (active data that is being accessed and manipulated by a computer program); and dataat-rest, known as DAR, or data that is physically housed in a storage device like a solid-state drive. Many cybersecurity solutions focus on securing data in transit and data in use, but neglect securing DAR.
Other MFA methods include applications, often on smartphones, that provide a one-time code synced to the device or system asking for authentication. Also taking advantage SENSITIVE DATA
MILITARY SYSTEMS with Guide September 2022 51 of the ubiquity of smartphones is an SMS-based system that will include a one-time code in a text message. 5. Provide the ability to destroy the data: There are various scenarios in which it may be necessary to destroy any data stored on the SED. A benign case is when an organization decides to upgrade its computers and/or drives, transfer computers and/or drives within the organization, or dispose of or recycle the computers and/or drives outside the organization. A worst-case scenario is when an unauthorized entity gains control of the drive with the intent of accessing the data. Using standard operating system-based “delete” functions to remove files and folders is not sufficient because experi enced hackers can still retrieve some or all the data. SEDs that are used to store confidential data should support special hardware functions to perform secure erase (write zeroes into every area where data is stored on the drive) and crypto erase (wipe any cryptographic keys stored on the drive, thereby rendering any encrypted data stored on the drive unreadable and useless to a bad actor). To address the worst-case scenario, the organization’s designated security officer should have the ability to define erase procedures to be automatically initiated by the drive itself; for example, failing AA a specified number of times should cause the drive to self-erase. In the case of a SED equipped with appropriate PBA, any data stored on the disk will essentially be invisible until AA has taken place, thereby preventing bad actors from cloning the drive to circum vent the restricted number of permitted attempts at AA. To sum up … Some organizations mistakenly assume that employing MFA such as fingerprint scans or facial recognition after the OS has booted offers a high level of con fidence. However, once the OS has booted, any data on its drives is exposed to sophisticated hackers or potentially nation-state bad actors. The highest levels of confidence and security are achieved by using MFA as part of a PBA environment implemented using HWFDE realized on a FIPS + CC certi fied and validated SED. (Figure 1.) MES
CDSG (CRU Data Security Group) • https://cdsg.com/ https://militaryembedded.com/newsletters/the-mchale-report
Figure 1 | An example of a secure solid-state drive, part of the Citadel family of secure data storage. Photo courtesy CDSG. www.militaryembedded.com
Resource
CDSG director of marketing Chris Kruell leads the sphere of marketing activities, including corporate branding, corporate and marketing communications, product marketing, marketing programs, and marketing strategy. Chris previously was VP of marketing at ERP-Link and hardware startup Lightfleet. He was a marketing director at Sun Microsystems and held several marketing positions in the high-tech industry. Chris holds a BS degree from Cornell University and an MA degree from Hamline University.
The McHale by mil-embedded.comReport,Editorial DirectorJohn McHale, coverstechnologyandprocurement trendsin the defenseelectronics community. THE ARCHIVED MCHALE REPORTS AVAILABLE AT:
EMBEDDED
RESOURCE GUIDE AVIONICS AIM 53 ALPHI Technology 53 Alta Data Technologies LLC 54 Data Device Corporation . . . . . . . . . . . . . . . . . . . . . . 56 Lynx Software Technologies 55 COMMUNICATIONS Interface Concept 56 CYBERSECURITY Interface Concept 57 Lynx Software Technologies . . . . . . . . . . . . . . . . . . . 58 wolfSSL 57 EMBEDDED HARDWARE Advantech Embedded Group 59 Annapolis Micro Systems 60, 61 Apacer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Dawn VME Products 60 embeddedTS 63 Extreme Engineering Solutions (X-ES) 78 Holt Integrated Circuits 63 Galleon Embedded Computing LLC . . . . . . . . . . . . . . . . 64 GMS 65-70 Interface Concept 71 Mercury Systems, Inc 72 MPL AG Elektronik 71 New Wave Design & Verification . . . . . . . . . . . . . . . . . 73 Opal Kelly 74 Phoenix International 75 Pixus Technologies 75 SECO USA 76 WinSystems . . . . . . . . . . . . . . . . . . . . . . . . . . 77 EMBEDDED SOFTWARE Lauterbach, Inc 78-80 OPENVPX AZ-COM Inc 80 Annapolis Micro Systems 83-84 Atrenne 85 Elma Electronic 86 LCR Embedded Systems, Inc . . . . . . . . . . . . . . . . . . . . . 81 TE Connectivity 82 PC/104 RTD Embedded Technologies 86-88 POWER ELECTRONICS VPT 88 REAL-TIME OPERATING SYSTEMS AND TOOLS Lynx Software Technologies 89 RF & MICROWAVE Analog Devices, Inc 90 RUGGED COMPUTING AND DISPLAYS Elma Electronic 91 Kontron . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Phoenix International 91 RTD Embedded Technologies 93 Viewpoint Systems 93 Z Microsystems, Inc 94 SIGNAL PROCESSING Interface Concept 95 SPACE ELECTRONICS AND SERVICES Omnetics Connector Corp 96-97 Spirit Electronics 95 PROFILE INDEX 52 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Ą Supports MIL-STD-1553 A/B and MIL-STD-1760
Channels Avionics https://www.aim-online.com/products/amee1553-x/ AIM-USA,
M.2-1553-2 Two Channel Dual Redundant 1553 Controller Avionics http://www.alphitech.com/doc/DS-M.2-1553.pdf
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The new rugged embedded mini-PCIe MIL-STD-1553 card offers up to 2 Dual Redundant MIL-STD-1553 channels with 6 avionic discrete input and 2 avionic dis crete input/output signals to be monitored or generated. In addition 2 trigger inputs and 2 trigger outputs are provided. An onboard IRIG-B time decoder supports time tagging on all AMEE1553-x models and allows users to accurately synchronize modules to a common IRIG-B time source. The card is available with single function 1553 that support BC or Multi-RT per channel plus a concurrent bus monitor or full multi-function 1553 with concurrent operation of BC and Multi-RT plus a concur rent bus monitor. A 31-pin Screw Lock I/O Connector is on board for a secure con nection. The extended temperature range and low power dissipation make this card ideal for rugged flight applications with limited space due its minimal Size, Weight, and Power minus the Costs. Drivers for Windows, Linux and VxWorks Operating Systems are available for all processors including support for ARM. – Mini-PCIe Card with up to 2 MIL-STD-1553 LLC
Alphi Technology Corporation www.alphitech.com sales@alphitech.com 480-838-2428
The M.2-1553-2 in RT mode can filter on RT address, T/R, Subaddress. The M.2-1553-2 is offered in extended temperature. The board format is an M.2 30mm x 42mm.
The M.2-1553-2 Two-Channel Dual Redundant 1553 Controller uses the DDC Total AceXtreme®communication device as its 1553 bus con troller or remote terminal with concurrent bus monitor. The dual con troller has a dual redundant channel with built-in transceivers and transformer. The controller has the capability to emulate up to 31 RT addresses simultaneously.
AMEE1553-2
www.aim-online.com sales@aim-online.us 267-982-2600 www.linkedin.com/company/aim-usa-llc FEATURES Ą Ideal for Rugged Embedded Small Form Factor & Portable Lab Applications Ą BC / Multi-RT / MT MIL-STD-1553 modes Ą Transmit Inhibit Option for MT only Applications Ą SAE AS4111 / 4112 Qualified (RT Validation) Ą Program in Minutes with PBA.pro Automated Application C Code Generation SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 53
Alphi announces the first M.2 1553 card
Ą 2MB (64K x 36) RAM 48-bit/100ns Time Stamp IRIG-106 Chapter 10 MT Support
FEATURES Ą Two-Channel Dual redundant MIL-STD-1553 Controller Ą M.2 form factor (30mm x 42mm) with B and M Module Keys Ą BC or Multi-RT with Concurrent Bus Monitor
Also recently released are new products with Ethernet, USB 3, or Thunderbolt(tm) TBOLT converters in small, rugged candy-bar size devices, and a whole set of products with the entire 1553/ host interface built directly in-line to the cable (NLINE). Most interface cards and rugged Ethernet (ENET) devices have MIL810G shock/vibe/temp, 461 EMC test credentials and several have MIL-704 avionics and DO160 ARINC RX test support.
MIL-STD-1553 & ARINC Product Family
Ą Lab->Rugged USB, Thunderbolt, Real-Time
Products Ą Portable FPGA AltaCore Design – Reduced Parts Obsolescence Risk Ą Full SAE AS4111 5.2 RT Validation – No Risk Integration Ą 5 Year Warranty – Best In The Industry Alta Data Technologies, LLC www.altadt.com alta.sales@altadt.com 505-994-3111 Avionics https://www.altadt.com/products/ MIL-STD-1553 & ARINC Interface Cards, and Real-Time AppliancesSystemsEmbeddedMilitary GuideesourceR 54 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
FEATURES Ą Widest Selection of COTS 1553 and ARINC Interface Cards/Boards. Deployed on 1000s of Systems, and the Leader in Test & Simulation Applications (SILs, Labs Test, Manufacturing Test, Flight-Line) Ethernet (ENETs), In-Line (NLINE)
The Ethernet-based products have been designed to support DO-178 software requirements with the customers' qualified operating system. Alta has shipped over $175M of COTS interface cards and appli ances to support almost every major defense program, and all products include a 5-year warranty.
Alta has introduced a full new line of MIL-STD-1553 and ARINC-429 real-time, rugged appliances, and embedded inter face cards that expand their product portfolio of industryleading PCI Express, cPCI/PXI, PMC, and XMC cards. Recently released are their Mini PCI Express and mini Ethernet-based mezzanine boards (MEZ) for deployed or custom systems. These micro cards provide the same advanced features as their full-size PCI Express, XMC type cards with a greatly reduced footprint – almost to a chip-level. This includes Full Function capability to be the 1553 Bus Controller, Remote Terminal, or Bus Monitor simultaneously, and even includes Alta's unique A/D signal capture to record and model raw 1553 or ARINC sig nals for cyber sercurity monitoring, or bus configuration issues (such as bad transformers or terminators).
ENET products can even auto bridge 1553 and ARINC mes sages to real-time Ethernet without any programming. All Alta products are supported by an advanced ISO modeled software development kit (SDK or API) where the customer can develop on any platform, such as PCI Express, and move the exact same development or executable code to another Alta product, like an Ethernet ENET or USB based product. An application can even be "thrown" to any channel on multi-channel products to pro vide fail-over or testing capability.
Converters
LYNX MOSA.ic for Avionics is a development and integration platform founded on our lightweight hypervisor, LynxSecure. LynxSecure is a separation kernel developed according to DO178C DAL A standards and supports ARINC 653 architecture requirements. Embodying the DoD strategy of the Modular Open Systems Approach (MOSA) LYNX MOSA.ic is specifically designed for open flexibility, enabling real-time developers to efficiently realize their design goals on inherently complex hardware/software platforms. LYNX MOSA.ic is a software framework for building and integrating complex multicore safety- and security-critical systems using independent appli cation modules. Its elegant, modular architecture enables developers to reduce development cycles when creating, certi fying, and deploying robust platforms for manned and autono mous systems LYNX MOSA.ic for Avionics has an advanced architecture that can help lower the effort, cost, and risk of developing, certify ing, and maintaining safety-critical avionics applications on multicore processors. This is because it leverages multicore processors to simplify software stack com plexity while making rapid development and integration options possible. These capabilities make it possible to provide better application portability properties and overcome perfor mance thresholds. This solution reduces software stack dependencies and minimizes complexities between different applications by decomposing monoliths into highly modularized architectures. This helps give solu tion evaluators the ability to validate security and safety. These features reduce the time necessary to debug, unlock design options, improve real-time performance predictability, and increase the speed of system integra tion to meet deadlines. All these important features help to significantly reduce the cost that typically comes with implementing an avionics solution.The LYNX MOSA.ic for LYNX MOSA.ic for Avionics
Lynx Software Technologies www.lynx.com inside@lynx.com 408-206-5753 @ LynxSoftware www.linkedin.com/company/lynxsoftwaretechnologies/ Avionics www.lynx.com/products/lynx-mosaic-for-avionics-systems Avionics framework helps developers reduce development and certification costs with multicore processing and exceptional security. FEATURES Ą Fine-grained system control of hardware resources Ą System immutability Ą Key system functions decentralized and distributed Ą Suite of Built-in tests (BITs) on boot and while systems are operating to ensure system maintains a secure state Ą POSIX and FACE v 3.1 support Ą Reusable Software Component (RSC) certificate from the FAA for re-usability in DO-178B/C certification projects Ą LynxSecure has 20k lines of certifiable source code SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 55
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DDC's
applications
on ApplicationsMSD-V4. include: • -DevelopmentProduct&software development, simulations, system integration • Testing-Portable testers, flight testing, production & automated test stands • Troubleshooting-Flightlinediagnostics, system troubleshooting 1553 BusLink – USB to MIL-STD-1553 Adapter Avionics www.ddc-web.com/buslink Data Device Corporation www.ddc-web.com info@ddc-web.com 631-567-5600 @DataDeviceCorp www.linkedin.com/company/data-device-corporation SystemsEmbeddedMilitary GuideesourceR 56 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The ComEth4420e Ethernet switch has been designed in alignment with the SOSA™ Technical Standard and combines PCIe Gen3/4 and 10/40 Gbs Ethernet technologies. This switch is ideal for integrators willing to control high-speed data flows within a centralized architecture system including multiple Non-Transparent (NT) endpoints. It features one switching unit for a Control Plane and a second switching unit for a Data Plane. Its Control Plane is based on a high-performance Marvell packet processor which implements a fully managed L2/L3 Ethernet switch with IPv4/IPv6 routing capabilities. Its Data Plane is based on a Microchip PCIe Gen4 switch which supports flexible port bifurcation with no restrictions on configuring ports as either upstream or downstream or on mapping ports to NTBs. The ComEth4420e is compliant with the VITA 46.11 Chassis Management specification and includes an IPMI controller chip. It supports IEEE 1588 PTP (Precision Time Protocol) for precise network timing and includes protection for non-volatile memory (NVMRO). The switch is manageable via our network management application, named Switchware. Regarding Ethernet and PCIe, various combinations and modes are available. The ComEth4420e is compliant with VITA 65.0 SLT3-SWH6F8U-14.4.15 and VITA 65.0 SLT3-SWH-6F6U-14.4.1 standards. The ComEth4420a is available in air-cooled, rugged and conduction-cooled versions. form factor Low power – powered via USB MIL-STD-810G shock, vibration, altitude, humidity, rain, sand & dust 1553 BusLink USB adapter enables a dual redundant MIL-STD-1553 bus to be easily accessed from a USB connection from any small embedded system, laptop, or tablet computer. The BU-67111U1X0X is USB powered, and is based on DDC’s Total-AceXtreme® MIL-STD-1553 BC/RT/MT architecture, to provide a light weight, small size and reliable MIL-STD-1553 to USB interface. The adapter provides rugged levels of shock and vibration protection, along with a maximum operating temperature range of -20°C to +60°C. 1553 BusLink is ideal for lab or rugged and meets the specification for a MIL-STD-1553 adapter used
Ą Lightweight Ą
ComEth4420a – 3U VPX Dual-Plane Gen3/4 PCIe & 40 Gigabit Ethernet Switch Communications www.interfaceconcept.com INTERFACE CONCEPT www.interfaceconcept.com info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept FEATURES Ą Managed Layer 2+/3 switch Ą VITA 65.0 14.4.15/6F6U-14.4.1SLT3-SWH-6F8UĄ Up to 14 Eth. ports and up to 12 PCIe ports Ą 1000BASE-T1000BASE-KX/10GBASE-KR,(rear) Ą 10GBASE-T, QSFP+ (front) Ą Aligned with the SOSA™ Technical Standard FEATURES Ą Supports MIL-STD-1553A/B/C; BC/MT or Multi-RT/MT Ą Utilizes DDC’s AceXtreme® engine Ą USB 2.0 interface Ą Small
Support Ą wolfBoot – Secure
Ą TLS 1.3 and DTLS 1.3 The
FEATURES Ą wolfCrypt –
The CMVP has issued FIPS 140-2 Certificates #3389 and #2425 for the wolfCrypt Module developed by wolfSSL Inc. wolfSSL is on track to be one of the first crypto modules to be FIPS 140-3 validated. Used by every branch of US arms services – in everything from tanks and missile systems to aircraft and satellites. Providing secure communication for IoT, smart grid, connected home, automobiles, routers, applications, games, IP, mobile phones, the cloud, and more.
wolfSSL Embedded Crypto Library Cybersecurity https://www.wolfssl.com/products/wolfssl/ wolfSSL www.wolfssl.com facts@wolfssl.com (425) 245-8247 www.linkedin.com/company/wolfssl/ @wolfssl Embedded Crypto Engine Supports FIPS 140-2 or FIPS 140-3 Bare Metal Boot Loader IDPS IC-INT-VPX3k is a 3U VPX Single Board Computer based on the 11th Gen Intel Core Xeon® W series processor. This high-performance card is aimed at high-demanding edge-computing applications with severe, environmental and cybersecurity requirements. This board-level product leverages the latest Intel® 10nm Xeon® W series processor enhancements and provides a com plete set of high-speed interfaces to system integrators that face SWaP constraints. The on-board Tiger Lake-H processor runs at 2,1GHz, features 64G DDR4 at 3200MT/s and a large number of PCI Express Gen3 and Gen4 lanes ideal to connect peripherals requiring large bandwidth. It supports the well-proven Intel® Advanced Vector Extensions 512 (AVX-512) instruction and the security protection modules of the Slim Bootloader. The IC-INT-VPX3k leverages the Intel Xe graphics and display engine and provides 2 x 4K display interfaces. All these features make the IC-INT-VPX3k the ideal solution for integrators who are looking for a new generation of SBC combining performance, high-speed interfaces, controlled power and the latest video standards. This board is well-suited for customers designing mission computers and surveillance systems. Interface Concept provides BSPs for Linux® and VxWorks® (other RTOS on request). The IC-INTVPX3k is available in air-cooled and conduction cooled versions (compliant with VITA 47).
IC-INT-VPX3k - 3U VPX Intel® Xeon® W Single Board Computer Cybersecurity www.interfaceconcept.com Interface Concept www.interfaceconcept.com info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept FEATURES Ą 3U VPX Ą Intel® Xeon® W (Tiger Lake-H) Ą DDR4 with ECC up to 64GB Ą 2 * PCIe Planes Ą 2 x 4K display ports Ą Air-cooled and conduction-cooled versions SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 57
Ą RTCA DO 178C DAL A Ą Low resource use with
Ą wolfSentry – Embedded
Does your device or application need FIPS or DO-178 based TLS or Cryptography?
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The wolfSSL embedded TLS library is a lightweight, portable, C-language-based SSL/TLS library targeted at IoT, embedded, and RTOS environments primarily because of its size, speed, and feature set. It works seamlessly in desktop, enterprise, and cloud environments as well. wolfSSL supports industry standards up to the current TLS 1.3 and DTLS 1.3, is up to 20 times smaller than OpenSSL, offers a simple API, an OpenSSL compatibility layer, OCSP and CRL support, is backed by the robust wolfCrypt cryptography library, and much more.
LynxElement, is the industry’s first unikernel to be POSIX com patible and available for commercial use. Utilizing LYNX MOSA.ic’s software framework for building and integrating complex multi-core safety- or security-critical systems, Lynx has based its Unikernel product on its com mercially proven LynxOS-178 real-time operating system, to enable compatibility between the Unikernel and the standalone LynxOS-178 product. This allows customers to freely transport applications between each environment and is FACE and POSIX API LynxElementcompatible.runs on LynxSecure. Multiple unikernels can share a CPU core. All applications run in user mode. This is a major advantage when compared to operating systems that use ker nel mode. Kernel mode (also referred to as privileged mode) provides a program direct and unrestricted access to all system Softwareresources. in user mode is is not allowed to access system resources directly. The Lynx filesystem, LynxFS, is supported. It also includes a thread-based scheduler, more specifically a priority preemptive scheduler with POSIX semantics. Floating point is supported in the unikernel. The Lynx framework provides built-in security for the Unikernel, paving a solid path to security and safety certification in mission-critical applications and making it enterprise-ready. The initial focus of LynxElement is centered on security, and a common use case would be to run security components like IDS and VPNs. By using a data diode and filter, the Unikernel can enable a customer to replace a Linux virtual LynxElement Unikernel Lynx Software Technologies www.lynx.com inside@lynx.com 408-206-5753 @ LynxSoftware www.linkedin.com/company/lynxsoftwaretechnologies/ Cybersecurity https://www.lynx.com/products/lynxelement machine, to save memory space and drastically reduce the attack space while guaranteeing timing requirements and safety LynxElementcertifiability.isinitially offered for Intel and Arm architectures and will be offered as part of the LYNX MOSA.ic portfolio of products for a diverse set of mission-critical use cases.
FEATURES Ą Increased system density Ą Improved performance Ą Smaller memory footprint Ą Cost and project risk reductions for systems that need to be taken through certification standards such as DO-178C DAL A, ISO26262 and IEC61508 Ą Linux-based cross development that incorporates a GCC 11 compiler Ą C/C++ run-times are supported, with uClibC++ as the C++ run-time support Ą The networking stack for LynxElement supports two types of drivers: Drivers for physical devices (Serial, Ethernet) and virtual drivers for serial ports and Ethernet SystemsEmbeddedMilitary GuideesourceR 58 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
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correct function, TPM2.0 chip-on-board to pre vent cyber-threats, 8.5-20V wide range power input, and -40 to 85°C wide operating temperature. The NVMe SSD soldered down makes it more robust and anti-vibration when operating in a harsh environment. SOM-5883 COM Express® Basic Type 6 Module Embedded Hardware 974c2d6966b0som-5883/mod_79aa6b69-d64d-4542-878a-9b97accf-0a5b-4166-bf75-38159d579dec/https://www.advantech.com/products/ Advantech USA www.advantech.com militaryinfo@advantech.com 949-420-2500 www.linkedin.com/company/advantechusa @Advantech_USA FEATURES Ą COM Express R3.0 Basic Type 6 Module Ą 11th Gen. Intel® Xeon, and Core™ i7/i5/i3/Celeron™ Processors Ą Up to 128GB DDR4 3200MT/s with ECC support Ą Four independent displays with 3x DDI, eDP/LVDS or VGA.1 PCIe x16 Gen 4, 8 PCIe Gen 3, 4 USB 3.2 Gen 2, 2.5G LAN w/TSN, 2 SATA3 Ports Ą Supports Advantech iManager, Edge-AI Suite and WISE-DeviceOn Ą Operating Temp: Standard: 0 ~ 60 °C (32 ~ 140 °F), Extended: -40 ~ 85 °C (-40 ~ 185 °F) SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 59
TREK-60
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SOM-5883 is the first COM Express Type6 module to offer x16 PCIe Gen4, making its bandwidth double to 16GT/s that allows 31.5GB/s throughput. It features ECC memory for error
FEATURES Modular AI Platform for Scalable Surveillance and Fleet Management Equipped with DeviceOn/iService software for remote device management Scalable computing performance via CPU boards for specific application requirements Advanced video surveillance system with AI accelerator for video AI capabilities Modular design supports the latest RF communication technologies Rugged platform with automotive-grade shock and vibration tolerance, wide operating temperature and Easy pairing with second-generation TREK displays via a single-cable connection
Advantech’s rugged computing solution is designed for harsh environments with a wide operating temperature range (-30 ~ 70 °C/-22 ~ 158 °F), and is compliant with MIL-STD-810G and 5M3 specifications for vibra tion/shock resistance. When used in fleet management and surveillance, TREK-60 supports up to eight camera input channels and an integrated AI accelerator for scalable video stream edge inferencing. The RF exten sion module with an automotive-grade FAKRA connector provides GNSS, WLAN, Bluetooth, and WWAN capabilities for real-time communication, vehicle tracking, and data collection. The embedded dual CAN bus supports diverse vehicle protocols, including raw CAN, J1939, and OBD-II, for vehicle monitoring and diagnostics, while the intelligent vehicle power manage ment system supports ignition on/off/ delay and wake-up event control.
Embedded Hardware https://www.advantech.com/products/1-2jsj5t/trek-60/mod_8e7a0368-4476-4422-a8d4-c8981586dcfc Advantech USA www.advantech.com militaryinfo@advantech.com 949-420-2500 www.linkedin.com/company/advantechusa @Advantech_USA
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The VITA 46.11-aligned WILD™ VPX Chassis Managers/System on Module (WABGM0/2) enable critical control, maintenance, and security functions, were developed in alignment with SOSA Technical Standard 1.0, and offer commercial- off-the-shelf (COTS) availability. They are highly-integrated modules. They provide access to plug in card (PIC) JTAG and Maintenance ports, CLK1 usage via on-board Zynq FPGA, network functions, and some optional advanced security functions. For security, the Chassis Managers implement security signal interfaces and a Xilinx UltraScale+ Zynq MPSoC and latest Microsemi PolarFire FPGA, which can be end-user modified with the optional BSP. Chassis Manager/SoM Optimized for VITA 65/SOSA™ www.annapmicro.com/product-category/chassis-and-backplane-accessories/ Annapolis Micro Systems, Inc. www.annapmicro.com wfinfo@annapmicro.com 410-841-2514 control and access to Plug-In and Maintenance ports, CLK1 usage, network functions & optional advanced security functions on backplane, carrier
via 3U or 6U VPX plug-in
Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topolo gies. Newly patented FMM micro-overlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements.
Ą Off-the-shelf backplanes can be quickly customized to mission requirements Optimize the communication topology between slots within a system’s backplane Customize inter-slot communications to meet unique system requirements
Ą Link SATA from a CPU card to a Solid State Drive (SSD) carrier
Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advan tage when schedules are compressed by late system changes.
Ą Enable XMC cards to talk to other XMC cards or other I/O like PCI Express links Facilitate rear backplane I/O connections and low profile connector interface systems when normal transition modules do not fit the system application envelope
Module Ą FPGAs: Xilinx UltraScale+™ Zynq (ZU5EG or ZU11EG) & Microsemi PolarFire Ą Mounting: Directly on
Dawn VME Products www.dawnvme.com sales@dawnvme.com 800-258-DAWN (3296) • 510-657-4444
Ą
Card JTAG
FEATURES Ą Capability: Provides
Ą Applications: Chassis Manager/System
Ą Improve signal integrity between system cards beyond requirements of PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards Directly connect PCI Express or SerialRapid I/O to multiple cards or cards and switches
card, or cabled Ą Power: Only requires 3.3V Ą Optional BSP: For customizing Zynq PS & PL for security Ą Standards: VITA 46.11, SOSA 1.0 & MIL-STD-1553 Ą Availability: Commercial off-the-shelf MADE IN U. S. A. mountedShown to a 3U BackplaneVPXSystemsEmbeddedMilitary GuideesourceR 60 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase.
Ą
FEATURES
Ą
Embedded Hardware www.dawnvme.com
Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes. Fabric Mapping Modules
Ą
Embedded Hardware
Annapolis products are engineered and manufactured under one roof in the
engineering and manufacturing allows for more aggressive design,
better quality control and produc tion flexibility. 3U & 6U 100GbE FPGA Boards are SOSA™ Aligned Embedded Hardware Annapolis Micro Systems, Inc. www.annapmicro.com wfinfo@annapmicro.com 410-841-2514 MADE IN U. S. A. NUMBERPART FACTORFORM FPGAs ETHERNET100Gb ALIGNEDSOSA™- ADC/DAC WB6XB2 6U VPX US+ (2x) US+ MPSoC Yes Yes WFMC+ Mezz (2x) WB6XV2 6U VPX Versal Premium (2x) Yes Yes Next Gen Mezz (2x) WB3XV1 3U VPX Versal Premium Yes Yes Next Gen Mezz WB3AA1 3U VPX Agilex Yes Yes WFMC+ Mezz WB3XBP 3U VPX US+US+MPSoC Yes Yes WFMC+ Mezz WB3XB9 3U VPX US+ (up to 13P) US+ MPSoC Yes Yes WFMC+ Mezz WB3XR2 3U VPX US+ RFSoC (2x) Yes Yes Integrated www.annapmicro.com/product-category/fpga-boards-2/ WILDSTAR Boards integrate the latest FPGAs – Versal, Gen3 RFSoC, and Agilex WILDSTAR Boards are cooled via Air, Conduction, or Air-Flow-Through SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 61
High Performance These high-performance board integrate the latest Xilinx Versal and Ultra Scale+ FPGAs, MPSoCs, and/or Gen 3 RFSoCs. They enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. High-performance digitization is via Mezzanine Card(s) connected to FMC+ based I/O site(s), or included in the RFSoC. Gen 3 delivers 8 channels of ADC, 5.0+ GS/s, at 14 bit resolution, and 8 channels of DAC, 10.0+ GS/s, at 14 bit resolution. Our new DME1 Mezz Card delivers an impressive 64.0 GS/s, 10-bit ADC and DAC performance.
Rugged Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high performance air, conduc tion, or air-flow-through cooling for thermal control. All United States. This co-location of and
Ą General Features • Up to three Xilinx or Intel FPGAs • A Full Board Support Package for fast and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 and Linux support • Multiple levels of hardware and software security Ą Front Panel and/or Backplane I/O • Based on FMC+ • Available options: º Analog Devices MXFE: 2TX (12GSps)/4RX (6GSps) º Analog Devices MXFE: 1TX (12GSps)/8RX (4GSps) º Jariet Electra-MA: 2TX (64GSps)/2RX (64GSps) º Xilinx RFSoC: 2TX (5GSps)/8RX (5GSps) º Xilinx RFSoC: 4TX (5GSps)/4RX (5GSps) º Others covered under NDA Ą Mechanical and Environmental • Air, conduction, or AFT cooled: -55°C to +85°C Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable for air-cooled variants • RTM available for additional I/O Annapolis WILDSTAR™ Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100Gb Ethernet over copper on the VPX backplane. Blind mate opti cal and/or RF (VITA 66/67) is also available. All 100GbE boards are VITA 65-compliant and align with SOSA Technical Standard 1.0.
Designed & Manufactured in USA
Defense applications are mission-critical operations, requiring the most demanding, reliable and robust systems. Without protective technologies, defense applications can't survive hos tile environments where temperature, altitude and humidity conditions are punishing. Moreover, anti-vibration and shock resistance are vital system requirements, too. the and technologies ensure that
Apacer defense series SSDs combine
latest firmware, software,
to
defense solutions are perfectly customized and engineered to custom ers’ Apacer’srequirements.defense series has passed 8 US military standards tests including: • Shock: MIL-STD-202G / MIL-STD-883K • Vibration: MIL-STD-810G • Humidity: MIL-STD-810G Method 507.5 • High/Low Temperature: MIL-STD-810G Method 501.5 / MIL-STD-810G Method 502.5 • Thermal Shock: MIL-STD-810G Method 503.5 Procedure I-C • Altitude: MIL-STD-810G Method 500.6 • Salt Fog: MIL-STD-810G Method 509.5 • Radiation Test: MIL-STD-810G Method 505.5 Procedure 2 Defense Series SSD Apacer Memory America Inc. www.apacer.com ssdsales@apacerus.com 408-518-8699 Embedded Hardware https://industrial.apacer.com/en-ww/Application/Defense FEATURES Ą Available interface and form factor: NVMe PCIe 2280; SATA 2.5", 2280, mSATA Ą Data Integrity: DataRAID™ (in the event that data becomes corrupted, the parity data can be compared to the existing data and the corrupted data can be rebuilt), End-to-end Data Protection, Smart Read Refresh™ (to make sure that during read operations, when the read operation threshold is reached, the data is refreshed by re-writing it to a different block for subsequent use) Ą Security: ATA Secure Erase, Quick Erase, MIL Erase (NSA9-12), Instant Keychange, Destroy via SW command or HW connector pin/pin header, Write protect (via hardware switch/pin or software command), TCG Opal 2.0, FIPS 140-2 Ą Power Stability: DataDefender™ (combines both firmware and hardware mechanisms to ensure data integrity. Together, they allow more time for volatile data to be stored in the event of power loss.) Ą Longevity: SLC-liteX (Apacer's 3D NAND SLC-liteX technology breaks through the limitations of existing technology and provides high P/E cycles.) Ą Survivability: Conformal Coating, Nano Coating, Wide Temperature, Thermal Throttling, Sidefill, 30µ Gold Finger SystemsEmbeddedMilitary GuideesourceR 62 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
hardware
Embedded Hardware
Ą DO-254 Design Assurance Level A Compliant options
Holt has been supplying MIL-STD-1553 ICs to the military and aerospace industries since 2001 and is a one-stop source for all MIL-STD-1553 components. In addition to Holt’s proprietary products, Holt offers drop-in replacements for existing competitor industry standard solutions, pro viding customers with a cost effective alternative, reducing lead times and mitigating future product obsolescence issues. Holt is the recipient of numerous supplier awards and coupled with its unparalleled technical support and customer service, Holt stands out as the number one choice for MIL-STD-1553 components. Holt’s products cover the entire gamut of MIL-STD-1553 functionality, including protocol ICs, IP cores, transceivers and transformers. Holt specializes in mixed signal IC design, integrating both digital protocol and analog transceiver functions on a single IC. Select products also integrate MIL-STD-1553 transformers, transceivers and protocol in a single pack age, providing customers with the highest level of integration necessary to minimize size, weight, power and cost (SWaP-C).
A One-Stop Source for MIL-STD-1553 Components
Ą IP Core Family: HI-6300
Powered by the Marvell Armada 385 Dual Core 1.3 GHz Arm® Cortex®-A9based CPU, the embeddedTS TS-7800-V2 industrial Single Board Computer (SBC) stands out from the crowd with its high-performance components, con nectivity options, and an unbelievable feature set packaged into a small foot print in both size and power. It’s a general-purpose, low-power SBC ready to tackle demanding applications, including data acquisition, IoT, industrial auto mation, or any rugged deployment.
The guaranteed 10+ year lifecycle ensures a long-term deployment in the field, free from expensive replacements that come from short, disposable lifecycles, which are all too common. With the included heat sink, the fanless design of the TS-7800-V2 is able to withstand high vibration, and even with two CPU cores running at 1GHz and tasked to their max, the system can operate at a wide temperature range of -40 °C to 85 °C. TS-7800-V2 embeddedTS www.embeddedTS.com
Embedded Hardware https://www.embeddedts.com/products/TS-7800-V2
sales@embeddedTS.com 480-837-5200 @embeddedTS FEATURES Ą 1.3 GHz Dual Core CPU Ą 1 GB DDR3 RAM Ą 4 GB eMMC Flash Ą 20k LUT Cyclone FPGA (145 Various I/O Pins) Ą PC/104, USB 3.0, Gigabit Ethernet, ADC, GPIO and More SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 63
Ą Unparalleled free technical support including plug-and-play reference designs and software
Ą Protocol ICs with integrated transceivers: HI-6130 and MAMBATM
www.holtic.com/AD2021AugC-MilitaryEmbeddedSystemsResourceGuide-MilStd1553.html
Ą Protocol, RAM, dual transceivers and dual transformers in a single 15mm x 15mm package: HI-2130
Ą Drop-in replacements for existing competitor industry-standard solutions
Holt Integrated Circuits www.holtic.com sales@holtic.com +1 949-859-8800 www.twitter.com/holtic (@holtic) www.linkedin.com/company/holt-integrated-circuits
FEATURES
Ą Error-correcting code (ECC) RAM or RAM parity with BIST
HARDWARE ENCRYPTION: Ą Multi-channel SATA encryption Ą FIPS 140 validated Ą Separated main processor key handling Ą Symmetric AES-256 encryption SOFTWARE ENCRYPTION: Ą LUKS (Linux Unified Key Setup) for key exchange/authentication Ą Supports up to 8 users per drive Ą Independent from hardware encryption layer Ą Available system SSD encryption
The XSR & G1, Galleon's most versatile and sought-after rugged computing solutions, have achieved certification through the National Information Association Partnership on its hardware and software full-disk encryption. NIAP oversees the certifica tion of commercial information technology products for national security systems, and after an extensive evaluation through a NIAP-approved Common Criteria Testing Laboratory (CCTL), the XSR & G1 will carry Dual-Layer Encryption Certifications. This certification applies in all Common Criteria partner countries and will allow Galleon's customers to deploy the rugged XSR & G1 computing solutions quickly, effectively, and into harsh environments where classified data protection is required. Data security is a highly complex subject, and multiple options can secure Data at Rest for embedded systems. The best protection is typically found in a layered approach – using more than one mechanism to protect the data. Galleon Embedded Computing products are available with these mechanisms, either separately or as multiple layers of protection. Using multiple layers of encryption enhances the data XSR & G1 NIAP Certified Dual Layer Encryption Galleon Embedded Computing www.galleonec.com/ us_sales@galleonec.com 281-769-8211 @GalleonEmbedded www.linkedin.com/company/galleon-embedded-computing-as
FEATURES SystemsEmbeddedMilitary GuideesourceR 64 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Embedded Hardware https://galleonec.com/xsr-g1-niap-certified-dual-layer-encryption?pmc=mes-xsr-g1 security considerably, especially if the authentication connec tions are kept entirely independent. Multi-layer protection is the basis on which the US program for Commercial Solutions for Classified (CSfC) is based. Software Full Disk Encryption (SWFDE) uses the central processor for authentication, and Hardware Full Disk Encryption (HWFDE) uses a separate processor for authentication and loading the DEKs into inline crypto devices. Galleon will be listed as an approved component on the CSfC list for Full Disk Encryption, with dual layers, for its XSR and G1 products. The Commercial Solutions for Classified program (CSfC) is a US government program for approval of commercial products to be used in solutions protecting National Security Systems (NSS) data. Galleon's Certified Dual Layer Encryption for the XSR & G1 dem onstrates their commitment to providing best-in-class security features for their customers.
Ą Up to 64 GB of DDR4 memory with ECC Ą Up to 1 TB of fixed M.2 SSD (optional)
Ą Supports max Turbo Boost frequency of up to 4.0 GHz using Intel’s Turbo Boost Technology
Ą Up to 8 TB of removable 2.5" SSD with SATA III or NVMe interface (optional)
Ą 3.0 GHz Intel® Quad Core™ Kaby Lake E3 Processor (E3-1505Mv6)
The S1202-XVE “Peacock III” is an avionics-certified, thirdgeneration, ultra-rugged, small, lightweight workstation computer system with up to two GPU sites for MXM 3.0 graphics expansion or GPGPU artificial intelligence (AI) algorithm processing. It is a rugged system optimized for the lowest cost and weight in a fully sealed case, while providing the highest level of workstation performance possible in a fully ruggedized, conduction-cooled, sealed system, operating up to -40°C to +85°C (0°C to +55°C standard). This system is ideal as a mission computer or video processor, designed with the highest possible performance per dollar and per watt in a fully sealed system. Peacock III can also be equipped with an optional radiator that can cool the system with front to back air Peacockcooling.IIIsupports the Intel® Kaby Lake Intel® Core™ i7 (E3-1505Mv6) processor with Hyper-Threading for a total of 8 logical cores, each operating at 3.0 GHz with the ability to Turbo Boost up to 4.0 GHz. The CPU is coupled with up to 64 GB of RAM organized in two ECC banks. The S1202-XVE standard configuration supports three 1 GigE and two 10 GigE channels with a TCP/IP offloading engine (TOE), four USB 2.0 ports with power, four USB 3.0 ports, eight PEACOCK III S1202-XVE Mission and Video Processor
General Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems
Ą SSD drives support optional Encrypt/Secure Erase/ Write Protect Ą Size: 10.0" x 5.38" x 2.6" Weight: 7 lbs.
Ą Temperature: Operates up to extended temp -40°C to +85°C (Optional)
Peacock III also includes the most secure storage subsystem possi ble. The system supports M.2 as a boot device, removable 2.5" SATA or NVMe SSD, Trusted Platform Module (TPM) 2.0, Secure Erase/ Write Protect/Encryption SSDs and discrete triggers for Secure Erase and Write Protect with encryption up to FIPS-140-2 or CSfC drives. There are hard-wired status/Secure Erase signals used for total sys tem cyber security. An optional digital Hobbs meter can track oper ating hours.
buffered digital I/O lines, one DVI/HDMI and one RGB video port, and full HD audio with a 5 W audio amplifier and mic-in. Additional I/O functions include one PCIe-mini expansion site (GMS SAM™) for I/O such as GPS, video capture, CANbus, MIL-STD-1553, ARINC-429, or any PCIe-mini card.
FEATURES SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 65
https://www.gms4sbc.com/products/product-categories/systems/item/s1202-xve
Ą Removable drive secured behind EMI/IP-rated door
The graphics subsystem is provided by native Intel Graphics Process ing (IGP) plus a separate optional primary GPU. There is one HDMI/ DVI output plus one HD analog (VGA) output via IGP, plus dual 4K/ UHD outputs via the primary (optional) MXM. A second MXM 3.0 site provides additional graphics outputs or GPGU co-processing with up to 8.7 TFLOPS algorithm capability. Fully equipped, over 8 indepen dent video outputs are possible (based upon connector selection).
Embedded Hardware
Ą MIL-STD: MIL-STD 810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD 461E and IP66 compliant
Ą Up to two additional GPU or GPGPU processors for video, AI, ML, data mining or co-processing
Ą 1920 x 1080 HD resolution, 16:9 and daylight readable at >800 nits Ą Optional Night Vision Imaging System (NVIS) per
Ą GMS “boot kick” glass and 3- or 5-wire resistive touch screen (PCAP optional) Ą Multiple bezel button options, including IDEN, NVIS, Input, SecureDNA™ , power Ą Intel® Tiger Lake-H up to 8 cores (Intel® Xeon® W) with 64GB DDR4 ECC DRAM Ą 4x Thunderbolt™ 4 with DisplayPort and optional 100W power delivery Ą Thunderbolt™ 4 is available as Copper or GMS LightBolt™ Fiber cable with power delivery over 50m Ą Optional NVIDIA RTX5000 GPGPU (PCIe Gen4) or 3x additional TB4 and 2x M.2 Dual 100GigE Ethernet ports with fiber Ą Quad M.2 I/O sites to support Wi-Fi, MIL STD-1553, Cellular and GPS Ą Dual M.2 80mm for high performance SSD (x4 PCIe Gen4, x2 PCIe Gen3) Ą Embedded System Controller for power management Ą Shock, Temperature and Tamper sensors for safe operations Ą Operates on a single +24 VDC and over -30°C to +80°C (optional heater) FEATURES SystemsEmbeddedMilitary GuideesourceR 66 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
SmartView™ is equipped with the latest Intel® Tiger Lake-H Core i7 (Xeon W-11865MRE) workstation processor with Hyper-Threading for a total of up to eight physical cores (16 logical cores) operating at 2.6GHz or with Intel’s Turbo Boost up to 4.7GHz. To harvest this incredible CPU performance, the CPU is coupled with up to 64 GB of DDR4 RAM organized in two banks with ECC support (2-bit error “SMARTVIEW” SD12/SD17/SD24 Smart Displays With Mission Processor and Data Recorder
General Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems
http://www.gms4sbc.com/smartview detection and 1-bit error correction). These Tiger Lake-H Xeon W cores coupled with SmartView’s I/O can be used to create multiple virtual machines (VMs) allowing a single SmartView™ system to replace up to 16 separate single-processor systems. The I/O subsystem is designed to support a wide array of standard and custom I/O functions. Standard configuration supports up to four Thunderbolt™ 4 ports with USB4 and DisplayPort, dual 100GbE fiber ports, optional NVIDIA® RTX5000 GPGPU, four USB 3.1/3.0/2.0 and eight GPIO COM ports. Optional DVI In/Out supplements the Thunderbolt™ 4 DisplayPort output. There are four M.2 I/O sites for functions such as quad video capture, CANbus, MIL-STD-1553, Wi-Fi, Cellular, Bluetooth, GPS and many other I/O. SmartView™ also offers the fastest and most secure storage sub system possible, and it can function as a data recorder. It supports up to 32MB BIOS Flash with hardware-write protect and secure erase. The dual onboard M.2 sites support x4 NVMe SSDs that can be software RAID-ed, with optional hardware write-protect, Secure Erase and encryption functions. SmartView™ displays can optionally support FIPS-140-2, FIPS-197, or CSfC encryption standards for ultra-secure data storage. MIL-STD-3009
The SmartView™ series rugged all-in-one 12", 17" and 24" Smart Panel PCs integrate the most rugged, crisp displays with Intel’s lat est eleventh-generation Tiger Lake-H Core i7 processors resulting in the thinnest, most powerful and robust smart display systems on the market today. Providing a 1920 x 1080 HD display, mission computing/artificial intelligence (AI) functions, plus data recorder storage, SmartView™ is designed to provide the highest performance possible in a fully ruggedized, sealed conduction-cooled system with an ultra-bright display and Night Vision Imaging System (NVIS). This system architecture simplifies applications where a full-featured computer with a rugged display is needed to deliver the best pos sible stand-alone-system, per dollar and per watt, while utilizing rugged interconnects to provide a fully sealed smart display system that is less than 2.1-inches thick.
Embedded Hardware
connectors
Ą
General“TITAN”Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems
Embedded Hardware
two removable cartridges Ą
Ą Optional 20-port segregated Ethernet switch in TITAN-2U Optional 20 port 10GbE switch in TITAN-2U
FEATURES Ą Dual or Quad Intel® Scalable Xeon® processors with up to 28 cores (2.50 GHz) and Turbo Boost (3.80 GHz); 38.5 MB of Smart L3 Cache (server-class processors: Platinum and Gold) Ą
In shock- and vibration-resistant conduction-cooled versions, “TITAN” is equipped with military-style circular 38999 connectors for assured reliability. “TITAN” uses patented internal cold plates and thermal mitigation to protect against ingress and EMI, while external “plenum” air is used to cool the server. “TITAN” is also expandable from a 1U high, 2S dual-socket version to a 2U high, 4S (four socket) four-way symmetric multi-processing (SMP) 2U version with exceptionally high-performance interprocessor UPI connections. Alternatively, the dual socket server (2S) is available in 2U but adds additional storage (up to 18 SSDs total), additional PCIe slots (up to 10 total), and a segregated 20-port managed Ethernet switch. In either 1U or 2U variants, “TITAN” is an exceptionally rugged, densely packed, well-equipped rackmount server with Intel’s best server processor technology. Air- and conduction-cooled (optionally sealed) versions with commercial (COTS) or mil-circular 38999 for Up to 1 TB DDR4 ECC memory (8 DIMMs) per Up to 16x SSDs in Up to 10 PCIe Gen 3 add-in cards (4x in 1U and 10x in 2U; factory-installed)
CPU Ą
Additionally, “TITAN” is exceptionally rugged and designed for technology refresh and pre-planned product improvement (P3I) in long-life applications. Available in air-cooled and conductioncooled (fanless) versions, “TITAN” is like no other server on the market. Air-cooled versions feature internal fans or external racksupplied plenum cooling, and have either COTS or mil-circular (38999) connectors.
The rugged “TITAN” 1U and 2U servers are unique expandable standard rackmount servers using Intel’s second-generation Scal able Xeon® processors. Designed for high-reliability aerospace, defense, military and industrial applications, “TITAN” is set apart by extreme density and expandability with air- and conductioncooling (fanless) options. It includes more networking I/O, memory, PCIe card add-in options, and removable storage than found any where in a 1U or 2U rackmount server.
connectors
ultimate reliability Ą
Ą
“AI” version > 1200 TFLOPs supports up to 4x Nvidia A100 GPGPUs in 2U Ą “Audio” version accepts multi-channel intercom or RF audio plus PNT/GPS and data recording Ą “Video” version accepts 8x HD streams via 3G-SDI, NTSC/PAL or other NAB plus data recording Ą Encryption and security via Intel® AES-NI and Trusted Platform Module 2.0 (TPM) Ą Dual-redundant MIL-STD-1275 500 W power supplies (single/three phase; 60-400 Hz 110/220 VAC; 28 VDC); 2x PSU’s in 1U; 4x PSU’s in 2U Ą Optional MIL-STD-704F power supplies with 50 ms hold-up Ą Based on the avionics-qualified versions used by the US Navy for airborne surveillance SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 67
http://www.gms4sbc.com/titan
Ą Intel® Tiger Lake-H up to 8 cores (2.6GHz, 4.6GHz Turbo Boost) Ą 64GB DDR4 ECC DRAM via upgradeable SO DIMMs Ą 4x Thunderbolt™ 4 ports (40Gbps each) USB-C with optional fiber and 100W Power Delivery Ą x1 and x8 PCIe Gen 4 inter-connect fabric with optional fiber extender frees OpenVPX bus Ą Dual 100Gb Ethernet ports Ą Dual 100 GigE Base-KR to VPX (P2, VPX-HS only) Ą DisplayPort/DVI to VPX (P2) Ą 2x USB 3.2 Gen 1 (5 Gbps) via USB-C w/power for console and I/O Ą 1x GigE, 8x GPIO, 2x COM, 2x USB 2.0 to VPX (P2) Ą Dual SAM™ I/O add-in modules for MIL-1553, ARINC-429, NTDS, GPS, or legacy I/O Ą 4x M2280 M.2 I/O sites with front panel I/O (VPX-THS only) Ą Full size MXM for GPGPU, FPGA, or bus extension Ą Embedded System Controller for Control Plane / Intelligent Power Ą Operates on single 12 VDC supply from VPX backplane Ą X9 architecture architecture and modular boards allow upgradeable processor and OpenVPX pinout/profile changes Ą Available as single- or dual-slot air- or conduction-cooled modules FEATURES SystemsEmbeddedMilitary GuideesourceR 68 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
http://www.gms4sbc.com/x9venom
X9 VENOM OpenVPX Single-Board Systems General Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems
The X9 VENOM VPX-TS and VPX-THS conduction-cooled 3U OpenVPX single-board systems are the fastest, smallest, most dense, highest performance compute and I/O processors any where in the world. Based upon Intel’s® 11th Generation Tiger Lake H Core i7 4 - 8 core CPUs, they follow VITA 65 3U OpenVPX and IEEE 1102.2, and are developed in alignment with the SOSA™ Technical Standard. They scale up performance and I/O bandwidth, or scale out to other modules and chassis via quad 40Gbps Thunderbolt™ 4 ports, dual 100GbE, or PCIe Gen 4 (16Gbps). As a modular stack, each brings upgradeability, backplane profile independence, and between 255 - 455Gbps of interconnectivity to the very highest performing systems. Uniquely, the GMS X9 architecture on which VENOM boards are based frees designers from the limitations of the OpenVPX back plane while maintaining interoperability with DoD MOSA (modu lar open systems approach) requirements.
Embedded Hardware
X9 VENOM is available in two 3U OpenVPX versions, and each offers more I/O, processing, and add-on co-processing than is found on two 6U-sized boards (VME or OpenVPX). The 2-slot VENOM VPX-THS version uses dual 1-inch pitch slots for I/O, power and conduction cooling, and has over 455 Gbps of external bandwidth across 13 ports. The 1-slot (1-inch pitch) conduction cooled VENOM VPX-TS offers 11 ports and 255 Gbps of I/O bandwidth. Each version represents a complete computer sys tem, replacing two or more 6U modules. This is unheard of for 3U OpenVPX, which is complimented for its small size but then criticized for the lack of user I/O to the backplane. X9 VENOM 3U OpenVPX boards solve this I/O problem, freeing users to take advantage of 3U’s size, weight and power (SWaP) advantages without the limitations of having only P1/P2 I/O. Of course, both X9 VENOM versions use VITA 65 profiles and were developed in alignment with the SOSA™ Technical Standard.
The X9 VENOM VPX-DS Xeon D Ice Lake D2700 air- and conduction-cooled 3U OpenVPX single-board systems are the fastest, smallest, most dense, highest performance compute and I/O processors anywhere in the world. Based upon Intel’s® high core count (HCC) Xeon D2700 micro-server CPU (“Ice Lake D”) they follow VITA 65 3U OpenVPX and IEEE 1102.2, and are devel oped in alignment with the SOSA™ Technical Standard. They scale up performance and I/O bandwidth, or scale out to other modules and chassis via dual 40Gbps Thunderbolt™ 4 ports, dual 100GbE, dual 100Gb-KR, and PCIe Gen 4 (16Gbps). GMS X9 architecture found on VENOM VPX-DS breaks past 3U OpenVPX’s connector limitations by adding over 280 Gbps of front panel I/O bandwidth. Simultaneously, X9 VENOM VPX-DS maintains interoperability with DoD MOSA (modular open systems approach) requirements and is SOSA aligned at the connector profile(s).
Ideal for multi-processing and virtual machine workloads, X9 VENOM offers more I/O, processing, and add-on co-processing than is found on two 6U-sized boards (VME or OpenVPX). The 1-slot X9 VENOM VPX-DS (1” pitch) has over 480 Gbps of total bandwidth across 7 ports and represents a complete computer system that replaces two or more 6U modules using a combi nation of front panel and P0-P2 I/O. This is unheard of for 3U OpenVPX, which is complimented for its small size but then criti cized for the lack of user I/O to the backplane. X9 VENOM 3U OpenVPX boards solve this I/O problem, freeing users to take advantage of 3U’s size, weight and power (SWaP) advantages without the limitations of only P1/P2 I/O. Of course, X9 VENOM uses VITA 65 profiles and was developed in alignment with the SOSA™ Technical Standard.
X9 VENOM Xeon D Ice Lake D2700 General Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems Embedded Hardware http://www.gms4sbc.com/x9venom
Ą Intel® Xeon D2700 (Ice Lake D) HCC micro-server CPU up to 20 cores (max: 2.0GHz, 3.1GHz Turbo Boost) Ą 64GB DDR4 ECC DRAM via upgradeable SO DIMMs Ą 2x M.2 2280 SSD sites Ą 2x Thunderbolt™ 4 (40Gbps each) ports via USB-C with optional fiber and 100W Power Delivery Ą 2x DisplayPort over Thunderbolt™ 4 ports Ą x1 and x8 PCIe Gen 4 inter-connect fabric with optional fiber extender frees OpenVPX bus Ą Dual 100Gb Ethernet ports (front panel, fiber) Ą Dual 100GigE Base-KR to VPX (P2) Ą DisplayPort/DVI to VPX (P2) Ą 1x USB 3.2 Gen 1 (5 Gbps); optional 2x USB 3.2 Type C to front panel Ą 1x GigE, 8x GPIO, 2x COM, 2x USB 2.0 to VPX (P2) Ą Dual SAM™ I/O add-in modules for MIL-1553, ARINC-429, NTDS, cellular, GPS, or legacy I/O Ą BMC for management includes: UART, USB, IPMB plus 1GbE Service port Ą Embedded System Controller for Control Plane / Intelligent Power Ą Operates on single 12 VDC supply from VPX backplane Ą SPIDER architecture and modular boards allow upgradeable processor and OpenVPX pinout/profile changes Ą Available as air- or conduction-cooled modules FEATURES SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 69
www.gms4sbc.com/x9spider
Battlefield edge processing with the X9 Host means an entire com mand post’s worth of processing, connectivity and Artificial Intelligence (AI)/machine vision is available in an ultra-light, self-contained 1.2 pound small form factor chassis. Based on Intel’s latest in-production 11th generation Core™ i7 8-core CPU (Xeon W-11865MRE), a single X9 Host might have all the I/O needed: quad Thunderbolt™ 4 ports, dual 100GigE fat pipes (fiber), 4-head DisplayPort with USB4 (both built into Thunderbolt™ 4), dual M.2 SSD mass storage sites, quad M.2 I/O (1553, GPS, Wi-Fi, Cellular), plus USB, COM and GPIO. An optional full-size Type B MXM NVIDIA® RTX5000 GPGPU is avail able, or three more Thunderbolt™ 4 ports can be added with dual M.2 storage sites. The NVIDIA RTX5000 MX Quadro GPGPU “Touring” accelerator has over 3000 CUDA cores, real-time ray tracing, 89.2 Tensor TFLOPS for deep learning (Max Boost), 9.5 TFLOPS (FP32, SP), and 16GB of GPU memory. With Thunderbolt™ 4 ports and embedded USB4 available over Thunderbolt™ 4 technology, the X9 Host provides of up to 40Gbps inter connect between X9 modules or to high-rate sensors like 3rd-generation X9 Host and Distributed Computing Modules
Part of GMS’s X9 family of modular, scalable, distributed, rugged com puters and displays, X9 Host fits in the palm of the hand, is infinitely expandable and designed from the ground up for rugged use in either conduction- or air-cooled applications. All X9 modules and displays interlock together for cooling and mounting, and are passively cooled with no moving parts. Using GMS’s patented diamond-enhanced RuggedCool2™ technology, X9 Host can optionally operate from -40°C to +85°C and is sealed to IP66.
General Micro Systems, Inc. www.gms4sbc.com sales@gms4sbc.com 800-307-4863 @gms4sbc www.linkedin.com/company/general-micro-systems Hardware
FLIR, LIDAR, radar, 4K/8K HD cameras, and more. Thunderbolt™ 4 technol ogy can be copper or GMS patented LightBolt™ fiber for up to 50 meters. Power delivery up to 100W is available on both copper and LightBolt™ fiber to power other X9 modules or remote sensors. This over-cable/fiber power dramatically simplifies system architectures, cable routing, and alleviates the need for remote power to X9 modules, distant systems or sensors. Dual 100GigE fiber fat pipes provide reachback or 50m connec tivity between X9 systems or distant sensors and servers.
Embedded
FEATURES Ą Intel® Tiger-H up to 8 cores (Intel® Xeon® W) with 64GB DDR4 ECC DRAM Ą 4x Thunderbolt™ 4 with DisplayPort and 100W power delivery Ą Optional NVIDIA RTX5000 GPGPU (PCIe Gen4) or: 3x additional TB4 and 2x M.2 Ą Dual 100GigE Ethernet ports with Fiber Interface Ą Quad M.2 I/O sites to support Wi-Fi, MIL STD-1553, Cellular and GPS Ą Dual M.2 80mm for high performance SSD (x4 PCIe Gen4, x2 PCIe Gen3) Ą 4x DisplayPort HD video 3840 x 2160 UHD via Thunderbolt 4 ports Ą Three USB 2.0 ports, two COM serial ports, eight GPIO ports Ą Trusted Platform Module (TPM) 2.0 for secure boot operation Ą GMS SecureDNA™ panic support for system Zeroize Ą MIL-STD-1275-style power via regulated 24VDC input Ą GMS LightBolt™ connectors with Type-C copper inserts Ą Shock, Temperature and Tamper sensors for safe operations SystemsEmbeddedMilitary GuideesourceR 70 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The IC-ARM-VPX3a is a high-performance 3U VPX Single Board Computer based on the NXP ARM Cortex®-A72- based LX2160A Multicore Communications Processor, coupled with 32GB of DDR4-ECC memory. The LX2160A, being the highest performance member of the NXP Layerscape processor family, combines the low power of FinFET (Fin Field Effect Transistor) process technology, sixteen Arm® Cortex®-A72 cores up to 2.2GHz with data path acceleration for L2/3 packet processing, security offload, traffic management and supports up to 100 Gbit/s Ethernet. It has been designed in alignment with the SOSA™ (Sensor Open Systems Architecture) Technical Standard. The IC-ARM-VPX3a features a 25/100 Gigabit Ethernet Data Plane, a 4-lane PCI Express Gen2/3 Expansion Plane and a 10 Gigabit Ethernet Control Plane. With its hardware accelerator and its large caches, it provides outstanding computing performance together with powerful packet processing offload. Furthermore, the IC-ARM-VPX3a features various storage solutions including M.2 slot, eMMC, xSRAM, SATA3 interfaces, and USB ports. Interface Concept provides Board Support Packages for Linux® (IC SDK, others...) and VxWorks®. Other RTOS can be supported on request. Compliant with OpenVPX™ standard, the IC-INT-VPX3k is available in aircooled and conduction cooled versions (compliant with VITA 47 classes).
IC-ARM-VPX3a - 3U VPX LX2160A ARM-based Single Board Computer Embedded Hardware www.interfaceconcept.com Interface Concept www.interfaceconcept.com info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept FEATURES Ą 3U VPX Ą NXP LX2160A Arm® processor Ą 32GB of DDR4-ECC Ą VITA 65.0 Slot Profile 1F1F2U1TU1T1U1T-14.2.16SLT3-PAYĄ Aligned with the SOSA™ Technical Standard Ą 10, 25, 40 and 100 GbE interfaces Ą Air-cooled and conduction-cooled versions FEATURES Ą Soldered CPU Ą Ethernet (up to 10Gbit), USB (3.1/2.0), Serial ports… Ą PCIe, XMC, mPCIe, PCIe/104, MXM, m.2 expansion Ą Extreme low power consumption Ą Compliance: e.g. DO-160G, MIL-STD-461, -704, -1275 Ą Availability 10+ years (repair 20+ years) Ą Optional -40°C to 85°C environment temperature The PIP Family, CEC, and MXCS Server are powerful, highly integrated, robust and fanless embedded com puter solutions. Selection of the components are purely made on the subject for long-term availability and low power consumption. The systems can be expanded in a very modular way and represent a unique solution for today's demanding and flexible defense requirements. The products are designed to operate under extreme and normal conditions without the need of fans. MPL solutions are engineered and manufactured in Switzerland to meet MIL STD-810 as well as other MIL Thestandards.systems include features like wide DC input, reverse polarity and more. Additional GPGPU, GPS, WLAN, CAN, 1553, ARINC, Sound, and UPS modules are available. Rugged Embedded Computers up to 9th Gen. i7 and Xeon Server Embedded Hardware MPL AG Switzerland www.mpl.ch info@mpl.ch +41 56 483 34 34 www.linkedin.com/companies/mpl-ag www.twitter.com/mpl_ag Think Long-Term – Think MPL SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 71
Model 5585 8-Ch. 250 MHz A/D HBM SOSA Aligned 3U VPX Board
BOARD ARCHITECTURE
The 5585 features the VU37P Virtex UltraScale+ HBM. The FPGA’s 8 GB of on-chip HBM SDRAM supports memory bandwidth of up to 460 GB/s. This represents better than a 20X throughput increase over traditional, external DDR4 SDRAM. This increased performance addresses the ever-accelerating memory requirements of high bandwidth, high computation applications.
NAVIGATOR DESIGN SUITE For applications that require specialized functions, the Navigator Design Suite allows customers to fully utilize the processing power of the FPGA. It includes an FPGA design kit for integrat ing custom IP into the factory-shipped design, and a BSP for creating host applications for control of all hardware and FPGA IP-based functions.
The FPGA is a container for data-processing applications where each function exists as an IP module. Each member of the Jade family is delivered with factoryinstalled applications ideally matched to the board’s analog interfaces. The 5585 factory-installed functions include eight A/D acquisition IP modules for simplifying data capture and Eachtransfer.of the eight acquisition IP modules contains a powerful, programmable DDC IP core; a controller for all data clocking and synchronization functions; a test signal generator; and inter faces to PCIe, 10 and 40 GigE. An optional 8-lane optical inter face is also available and provides a dual 100 GigE interface with an IP core included with the Navigator FPGA Design Kit and installed by the user. These complete the factory-installed func tions and enable the 5585 to operate as a complete turnkey solution for many applications, thereby saving the cost and time of custom IP development.
FPGA
XILINX VIRTEX ULTRASCALE+ HBM FPGA
The Jade® Model 5585 SOSA aligned 3U OpenVPX board is an 8-channel, high-speed data converter with programmable DDCs. It is suitable for connection to HF or IF ports of a communications or radar system. Its built-in data capture feature offers an ideal turnkey solution as well as a platform for developing and deploy ing custom FPGA-processing IP. Ample data transfer bandwidth and flexibility are provided by a range of board interfaces including 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe with installation of Mercury or user-supplied IP. The Virtex® UltraScale+™ HBM’s on-chip high-bandwidth memory coupled with the FPGA’s logic and DSP density enable the 5585 to be a single-slot SOSA aligned 3U VPX data acquisition and processing powerhouse.
Additional resources include 9024 DSP slices, 2.8 million system logic cells and 32.7 Gb/s GTY gigabit serial transceivers.
FEATURES Ą Exceptional dynamic range and analog signal integrity Ą Features Xilinx Virtex UltraScale+ HBM FPGAs Ą Eight 250 MHz 16-bit A/Ds Ą 10 GigE Interface Ą 40 GigE Interface Ą Dual 100 GigE UDP interface Ą Optional VITA 67.3C optical interface for backplane gigabit serial communication Ą Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification) Ą Navigator® Design Suite for software and custom IP development Mercury www.mrcy.com Embedded Hardware https://www.pentek.com/go/mesbg5585 techsales@mrcy.com 201-818-5900 @mrcy https://www.linkedin.com/company/mercury-systems/ SystemsEmbeddedMilitary GuideesourceR 72 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The FPGA has access to all data and control paths, enabling factory-installed functions including data multiplexing, channel selection, data packing, gating, triggering and memory control.
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The V1161 is a proven high-bandwidth and low-latency performance leader in 10/25/40/50/ 100Gbs Ethernet applications. The V1161 includes hardware offloads for UDP, TCP, RoCE v2, DPDK, GPUDirect, NVMEoF, and many other protocol stacks. The combination of the Mellanox® MC-X5 device and the ACAP device for the first time allows for system designers to leverage the off-the-shelf world-class Ethernet performance while deploying unique data processing, AI/ML and security algorithms in the onboard ACAP device. This combination maximizes the effectiveness of the deployed algorithms while drastically reducing design efforts required to establish highbandwidth Ethernet, PCIe controllers, efficient DMA engines, or low overhead software drivers. interface-cards/pmc-xmc/v1161-programmable-https://newwavedv.com/products/fpga-100g-ethernet-xmc-acap-card/ https://newwavedv.com 952-224-9201 10/25/40/50/100Gbs Ethernet ports Rugged optical ports via MPO (female) on the front panel or VITA 66 optical backplane. Electrical I/O via Pn6 also available NVIDIA® Mellanox® ConnectX®-5 Network Interface Device Hardware offloads for UDP, TCP, RoCE v2, DPDK, +more Supports PCIe Gen4 x16, Gen4 x8, Gen3 x16, Gen3 x8 with on-board embedded PCIe Switch device Advanced APIs that support multi-core & multi-processor architec tures with a wide range of operating system software support Available in air- and conduction-cooled XMC form factors with conformal coating & carrier card options available
The V1160 is designed for high-bandwidth, low-latency interface applications requiring 10/25/40/50/100Gbs Ethernet. Targeted towards radar, signal intelligence, video, storage, and embedded communications, the XMC form fac tor and rugged design of the V1160 turns a VPX single board computer into a single-slot sensor processor. Featuring the NVIDIA® Mellanox® ConnectX®-5 network interface device, the V1160 is the proven performance leader in Ethernet applications. With hard ware offloads for UDP, TCP, RoCEv2, DPDK, and other protocol offloads, pay load data throughput and latency is unmatched in the V1160. Optical or electrical Ethernet interfaces are available, as well as front panel or backplane IO. Backplane electrical is provided via Pn6 and backplane optical is provided via VITA 66. The V1160 is built for rugged and harsh environments. Component selection, thermal design, and electrical design have been completed with the require ments of high-performance embedded computing at the forefront. This XMC is designed and tested to VITA 47 environmental standards and provides VITA 20 conduction cooling. Supporting temperature ranges from -40°C to +85°C, each V1160 delivers a reliable solution for rugged embedded needs. With the V1160, get a real time high-bandwidth network interface for next generation sensor, storage, and communications in a rugged and SWAP-C package.
V1160 Dual-Port 100G Rugged Ethernet XMC Card https://newwavedv.com/products/fpga-interface-cards/pmc-xmc/v1160-dual-port-100g-rugged-ethernet-xmc-card/ New Wave DV https://newwavedv.com info@newwavedv.com 952-224-9201 www.linkedin.com/company/new-wave-design-and-verification
FEATURES Ą Up to eight (8) 1G to 25G optical ports via MPO front panel I/O or VITA 66 optical backplane I/O. Electrical I/O via Pn6 also available. Xilinx® Versal® ACAP (FPGA) NVIDIA® Mellanox® ConnectX®-5 Network Interface Device Hardware offloads for UDP, TCP, RoCE v2, DPDK, GPUDirect, NVMEoF, +more Supports PCIe Gen4 x8 & Gen3 x8 Also availabe in 3U VPX form factor
This capability is critical as DoD moves towards Artificial Intelligence/Machine Learning in embed ded applications.
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The Versal™ ACAP is a fully software-programmable, heterogeneous compute platform that com bines Scalar Engines, Adaptable Engines, and Intelligent Engines to achieve dramatic performance improvements of up to 20X over today's fastest FPGA implementations and over 100X over today's fastest CPU implementations (https://docs.xilinx.com/v/u/en-US/wp505-versal-acap).
The V1161 is a next-generation high-performance embedded computing XMC featuring the Xilinx Versal™ Adaptive Compute Acceleration Platform (ACAP), the NVIDIA® Mellanox® ConnectX®-5 (MC-X5) network interface device, and rugged optical and electrical IO options. The V1161 provides for high-bandwidth sensor interface, network offload features leveraging best-in-class technology, plus heterogenous computing resources for on-board sensor processing. This is all provided in an XMC form factor, providing ease of integration onto existing single board computers.
www.linkedin.com/company/new-wave-design-and-verification FEATURES Ą Dual
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New Wave DV
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The V1161 is the first SOSA aligned XMC that provides the power of the Xilinx® Versal™ ACAP.
Embedded Hardware
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info@newwavedv.com
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V1161 Programmable 100G Rugged Ethernet XMC ACAP Card Embedded Hardware
applications enjoy
The Opal Kelly ECM1900 Edge Compute Module™ is a highly-integrated, highperformance, compact FPGA development module designed for data acqui sition, instrumentation, and analytics workloads including network-intensive applications. The module combines Xilinx’s Zynq UltraScale+ MPSoC with two independent 4 GiB ECC DDR4 banks, micro SD storage, a programmable clock generator, and a dual-core ARM CoreTex R5 embedded processing system in a single integrated design complete with a single-input power system.
as: XEM8350: Xilinx Kintex UltraScale FPGA Development Board Embedded Hardware https://opalkelly.com/products/xem8350/ • LIDAR and RADAR • Video / Image Capture • Software-Defined Radio (SDR) • 5G Systems • Remote Sensing • Photonics • Advanced Metrology • Data Ingestion Acceleration Opal Kelly Incorporated www.opalkelly.com sales@opalkelly.com 217-391-3724 www.linkedin.com/company/opal-kelly-incorporated twitter.com/opalkelly SystemsEmbeddedMilitary GuideesourceR 74 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Three high-density board-to-board connectors provide access to over 200 FPGA I/O, 48 CPU I/O, and 24 gigabit transceiver lanes supporting PCIe Gen 3, ethernet, JESD204, DisplayPort, and more. On-board high efficiency regulators support a single-input (+6V to +15V) power supply for easy application.
the
GiB
FPGA options include a GPU (-7EG) and video CODEC (-7EV). Applications include ultra high-end data acquisition, AI/ML data ingestion and inference, real-time data and video analytics, smart NIC edge applications, and onpremise machine vision processing.
features
The BRK1900 reference design (sold separately) enables rapid prototype development with four SYZYGY standard peripheral ports, two SYZYGY trans ceiver ports, two QSFP cages for network interfaces, and USB and ethernet interfaces.
The XEM8350 Kintex UltraScale based FPGA module offers a turnkey dual Super-Speed USB 3.0 host interface using Opal Kelly’s FrontPanel SDK. System integrators can build fully-operational prototype and production designs quickly by integrating this device into their product. Manufacturers of high-speed devices such as JESD-204B data acquisition devices can launch fully-functional evaluation systems without the costly design and maintenance of an evaluation platform. an industry first, the XEM8350 two fully-independent SuperSpeed USB 3.0 ports for high-bandwidth applications requiring operation or 650 MB/s bandwidth. The FrontPanel SDK includes a multi-platform API (Windows, and and very low logic utiliza tion on Memory-hungryFPGA. access to 4 of on-board DDR4 memory with a 64-bit wide data bus and ECC. applications include ultra high-performance data acquisition such
over
Linux)
FEATURES Ą Compact form factor (112mm x 83mm x 13.18mm) Ą Dual-Core ARM CoreTex R5 Ą 8 GiB DDR4 (4 GiB CPU + 4 GiB FPGA) Ą 248 I/O (200 FPGA + 48 CPU) Ą 24 Gigabit Transceivers (up to 16.3 Gb/s) Ą Micro-SD card slot Ą Programmable clock oscillator
duplex
macOS,
Typical
As
ECM1900: Xilinx Zynq UltraScale+ Edge Compute Module Embedded Hardware https://opalkelly.com/products/ecm1900/ Opal Kelly Incorporated www.opalkelly.com sales@opalkelly.com 217-391-3724 www.linkedin.com/company/opal-kelly-incorporated twitter.com/opalkelly FEATURES Ą Dual SuperSpeed USB 3.0 ports for high-bandwidth data transfer Ą Xilinx Kintex UltraScale XCKU060 or XCKU115 Ą 4 GB DDR4 SDRAM with (64-bit with ECC) Ą Over 330 I/O pins on three Samtec QTH connectors Ą 28 multi-gigabit transceivers Ą Small form-factor: 145mm x 85mm Ą On-board programmable oscillator
SOSA/HOST, and SpaceVPX needs. Our high-performance back planes are available in a wide range of VITA 65 and SOSA™ aligned profiles, with various configurations of VITA 66 (optical) and/or VITA 67 (RF) slot options. The 1U – 4U SlimBox OpenVPX chassis line provides a compact and versatile platform for 3U, 6U and 3U/6U hybrid system requirements. The dual depth open frame enclosure supports standard 160mm OpenVPX boards and 220mm SpaceVPX boards in the same chassis.
FEATURES
Air Cooled Configurations
Pixus offers a wealth of creative solutions for your OpenVPX, Both card guides types are available for air-cooled and conduction-cooled boards in each depth. Our Rugged Rackmount OpenVPX chassis line is designed for the harsh environ ments to meet MIL STD 810, MIL STD 461, & more. Contact Pixus to discuss your application today!
www.phenxint.com/portfolio/rugged-open-vpx-nvme-ssd-module/ Phoenix International www.phenxint.com info@phenxint.com www.linkedin.com/company/phoenix-int-systems Available in
Solid State Disk storage module that delivers extremely high performance via a single fat pipe (PCIe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. NVMe is an industry standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. The NVMe protocol was established in collaboration by server industry leaders to standardize a scalable PCIe interface, making it easier for designers to unlock the full potential of PCIe. NVME provides opportunities for increased data through put and reduced latency all while reducing the number of drives needed –both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems.
VP1-250-eSSDC
Latest Innovations for OpenVPX, SOSA™ , & SpaceVPX Embedded Hardware www.pixustechnologies.com Pixus Technologies www.pixustechnologies.com info@pixustechnologies.com 519-885-5775 @pixustech Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components FEATURES Ą Rugged and commercial designs in various sizes & configurations Ą Backplane design expertise to 100GbE speeds, RT3 connector Ą 1U – 4U SlimBox OpenVPX for compact and versatile 3U, 6U, and 3U/6U hybrid needs Ą Rugged rackmount and ATR enclosures for advanced OpenVPX/SOSA™ requirements Ą Dual depth VITA 78 SpaceVPX open frame development enclosure for both 3U and 6U versions. Supports 160mm and 220mm boards in the same chassis Ą SOSA aligned VPX chassis managers in mezzanine format that affix to the rear of the backplane without consuming a slot. Available now! SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 75
Made in the USa Ą Storage Capacity to 16TB Ą Sequential 128KB read: 1.2GB/sec, write: 1.2KB/sec Ą Operational Altitude to 80,000 Feet Ą Operational Temperature from -40 degrees to +85 degrees C Ą Streamlined protocol with efficient queuing mechanism to scale with multi-core CPUs Ą Optional AES 256/FIPS140-2 Encryption Ą Also
714-283-4800
Phoenix International is an AS9100D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.
The VP1-250-eSSDC is a Conduction Cooled (VITA 48) Open VPX NVMe
Embedded Hardware
SECO USA tablets are supported by customized operating systems which match hardware-level features and enhance security. ARM tablets feature Linux and Android, with source code available. Other operating systems, such as VxWorks real time operating system (RTOS), are possible.
Ą Modified COTS design to minimize development cost, schedule, and risk
FEATURES Ą Small-sized, low power COTS devices: variety of SOMs, SBCs, HMIs, and tablets compliant with widely used standards that reduce time to market
Using a SECO SOM or SBC platform – as well as HMIs, tablets, and other devices – as a starting point, SECO USA can modify validated schematics, circuit board artwork, and operating system source code to deliver a Modified COTS design. Modified COTS allows devel opment of use case and technical requirement specific products with minimized cost, time to market, and risk.
SECO single board computers (SBCs) are also compliant with popular standards – 3.5", Pico-ITX, and eNUC – and offer complete computer platforms that operate in harsh environments. All SECO COTS platforms feature leading edge processing technolo gies from NXP, Intel, Xilinx, Nvidia, or AMD. They also run various operating systems, including Linux, Android, Windows, and real time operating systems (RTOS) such as VxWorks.
Ą Operating systems for edge devices: Linux, Android, Windows, and RTOS such as VxWorks modified to match edge device hardware
SystemsEmbeddedMilitary GuideesourceR 76 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
SECO USA: Rugged Devices for Military Use SECO USA www.seco.com sales.us@seco.com +1 (240) 558-2014 www.linkedin.com/company/secousa/ twitter.com/secousa_
Ą US-based engineering and operations for direct support of North America clients
Ą Custom designed and manufactured low-power, rugged, high reliability electronic devices that fulfill unique and difficult use cases and requirements
Ą Support services for integration of SECO’s suite of embedded board, HMI, and IoT/AI system solutions into client products
SECO USA rugged tablets leverage SECO commercial off the shelf (COTS) embedded board circuitry to develop a customized embed ded computing platform optimized for tablet applications. A full range of standard tablet features – USB, Wi-Fi, Bluetooth, GPS,
Embedded Hardware
Rugged tablets and rugged device design
Leveraging SECO hardware knowhow, SECO USA offers a wide portfolio of Commercial Off-the-Shelf (COTS) embedded computers in standard system-on-module (SOM) form fac tors such as SMARC®, Qseven®, COM Express®, and COM-HPC®. SOMs offer reduced time-to-market, high integra tion flexibility, and a future upgrade path with no hardware redesign.
SECO USA designs, develops, qualifies, and manufactures rugged electronic systems across a broad range of industries, including military, medical, industrial, and transportation. With design pro cesses that uncover complete use cases and ensure compliance with a broad range of regulatory and industry specifications, result ing electronic devices meet the most demanding applications.
brightness and volume control – and specialized interfaces, such as Ether net, serial, CAN, and GPIO - are combined to provide a flexible platform for real world applications. Ergonomic but rugged enclosures provide militarytough tablet operation. Impact resistant sunlight readable displays and industrial rated components enable reliable operation through extended temperature, severe shock/vibration, drop, liquid submersion, and more.
SECO USA specializes in the design of embedded processor circuitry and the development of rugged high reli ability electronic devices, including rugged tablets, medical devices, and industrial equipment. SECO USA also provides US-based engineering and support services for all SECO products. COTS Boards and Modified COTS Design
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The COMeT10-3900 is an industrial COM Express®Type 10 Mini module with an Intel® Atom™ E3900 processor. This rugged, low-power industrial module was designed and manufactured in the USA and is fully compliant with PICMG COM Express Module specifications. The small form factor module is designed as a proces sor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements. This COM Express module is now in stock with many SKUs available for immediate shipment. COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations of COM Express modules providing a long project lifetime. Updating a COM Express module to improve performance or replace an end-of-life processor drastically improves your time to market when revis ing existing projects. The COMeT10-3900 supports Linux, Windows® 10, and other x86-compatible real-time operating systems.
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COM Express Type 10 Mini Module with E3900 Processor Embedded Hardware https ://www.winsystems.com/product/comet10-3900/ WINSYSTEMS www.winsystems.com sales@winsystems.com 817-274-7553 www.linkedin.com/company/winsystems-inc- @WinSystemsInc FEATURES Ą Intel Atom E3900 Processor, formally Apollo Lake-I Ą Up to 8GB LPDDR4 2400 MT/s System Memory Ą Intel Low Power Gen9 Graphics Engine Ą Full-HD and 3D Graphics acceleration Ą On-board Discrete TPM 2.0 Hardware Security Ą -40ºC to +85ºC Operating Temperature Range Ą Wide Range Power Input (4.75V – 20V DC) SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 77
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FEATURES PC/104 Small Form Factor with PCIe/104™ OneBank™ Intel Apollo Lake-I E3900 Processor (Dual- or Quad-core) Up to 8 GB Soldered LPDDR4 System Memory Dual Ethernet Multiple Displays Supported TPM 2.0 Hardware Security Enabled -40°C to +85°C Operating Temperature Range
WINSYSTEMS’ PX1-C441 is a rugged industrial PC/104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel Apollo Lake-I Dual-core or Quad-core SOC processors for process ing graphics. It includes up to 8 GB of soldered down LPDDR4 system memory and a non-removable eMMC device for solid-state storage of an operating system and applications. In addition, the board supports M.2 and SATA devices. Its small size, rugged design, and extended operational temperature make it a great fit for industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets.
PC/104 OneBank Intel® Apollo Lake-I SBC with Dual Enet Embedded Hardware https://www.winsystems.com/product/px1-c441/ WINSYSTEMS www.winsystems.com sales@winsystems.com 817-274-7553 www.linkedin.com/company/winsystems-inc- @WinSystemsInc
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Lauterbach, Inc. www.lauterbach.com info_us@lauterbach.com 508-303-6812 www.lauterbach.com/intwindriver.html
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The XPedite7870 integrates SecureCOTS™ technology with a Microsemi® PolarFire™ FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
FEATURES Ą
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TRACE32 Integration for Wind River Workbench
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The Target Communication Framework (TCF) was developed by the Eclipse Foundation as a protocol framework with the goal of defining a uniform debugging communication protocol between an IDE and a target system. TCF defines a series of standard services. At the same time, the framework is open for the definition of proprietary services. After the TRACE32 software is started as a TCF agent, it provides its services to the Wind River Workbench or the Eclipse debugger via UsingTCP/IP.its TCF services, the TRACE32 debugger can now provide an open communication interface for debugging with Eclipse or the WindRiver Workbench for all processor architectures and compilers supported by TRACE32.
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The XPedite7870 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-2700 series (formerly Ice Lake-D) of processors. The XPedite7870 is an optimal choice for computationally heavy applications requiring maximum data and information protection.
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The Lauterbach TRACE32 Debugger now also operates as a TCF agent. This makes it possible to use the Wind River Workbench or the Eclipse debugger as an IDE and a TRACE32 debugger as a debugging back-end tool.
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FEATURES TRACE32 operates as TCF agent Support for various launch mechanisms Support for all debug relevant TCF services Synchronized debugging between TRACE32 and TCF C/C++ Debugger in Wind River Workbenchd Support for multiple projects (multicore) Applicable for all processor architectures supported by TRACE32 Based on Target Communication Framework (TCF)
Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available. XPedite7870 Embedded Hardware https://www.xes-inc.com/products/sbcs/xpedite7870/ Extreme Engineering Solutions (X-ES) www.xes-inc.com sales@xes-inc.com 608-833-1155 www.linkedin.com/company/extreme-engineering-solutions/ Supports Intel® Xeon® D-2700 series (formerly Ice Lake-D) processors with up to 20 Xeon®-class cores SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ FPGA with 128 MB SPI flash 64 GB of DDR4 ECC SDRAM in four channels Two 40GBASE-KR4 Ethernet ports, one 10/100/1000BASE-T Ethernet port Two USB 2.0 ports, two RS-232/422/485 serial ports
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Embedded Software
The XPedite7870 provides incredible speed with two 40GBASE-KR4 and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors.
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Lauterbach Debugger for Intel x86/x64 Skylake/Kabylake FEATURES Ą CombiProbe MIPI60-Cv2 provides debug and system trace capability Ą Support for standard JTAG, debug HOOKs and I2C bus Ą Support for merged debug ports (two JTAG chains per debug connector) Ą Support for survivability features (threshold, slew rate, etc.) Ą Support for system trace port with up to 8 trace data channels Ą 128 MByte of trace memory Ą SMP debugging (including hyperthreading) Ą AMP debugging with other architectures Ą BIOS/UEFI debugging with tailor-made GUI for all UEFI phases Ą Linux- and Windows-aware debugging Ą Hypervisor debugging Lauterbach TRACE32 Debugger for Intel x86/x64: In January of this year, Lauterbach introduced the new CombiProbe Whisker MIPI60-Cv2. The TRACE32 CombiProbe and TRACE32 QuadProbe now offer the same debug features for the Converged Intel® MIPI60 connector: • Standard JTAG, Intel® debug hooks with Pmode, and I2C bus • Merged debug ports (two JTAG chains) • Intel® Survivability features (threshold, slew rate, ...) However, these debug tools have different areas of applica tion. The TRACE32 QuadProbe, which is expressly designed for server processors, is a dedicated debug tool that enables SMP debugging of hundreds of threads on targets with up to four debug connectors. The TRACE32 CombiProbe with the MIPI60-Cv2 Whisker, designed for client as well as mobile device processors, can capture and evaluate system trace data in addition to its enhanced debugging features. Trace capabilities include support of one 4-bit and one 8-bit trace port with nominal bandwidth. The TRACE32 CombiProbe with the DCI OOB Whisker is specially designed for debugging and tracing of form factor devices without debug connectors. If the chip contains a DCI Manager, the target and the debugger can exchange debug and trace messages directly via the USB3 interface. The DCI protocol used to exchange messages supports standard JTAG and Intel® debug hooks as well as trace messages for record ing system trace information. Lauterbach, Inc. www.lauterbach.com info_us@lauterbach.com 508-303-6812 www.lauterbach.com/pro/pro_core_alt01.php?chip=CORE-I3/I5/I7/I9-9THGEN Embedded Software SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 79
The TRACE32 hypervisor-awareness provides the debugger with all of the hypervisor’s information running on the hardware platform. After the OS-awareness is loaded for each guest/VM the debugger can display an overview of the overall system.
• 2 mm Headers allow for monitoring of currents and voltages on both P0 connectors and insertion of all P0 utility signals on both slots.
TRACE32 allows the visualisation of any task, even if its VM is currently not active. Since Lauterbach has systematically extended the well known concepts for OS-aware debug ging to hypervisor debugging, it will be easy for TRACE32 users to get started with just a little practice.
Ą Reset generation Ą Can be placed on any of four sides for access to inserted cards
FEATURES
Ą Seamless debugging of the total system in stop-mode
FEATURES
Ą SOSA / RF and Optical versions available Ą RT-2, RT-2R or Smith Hypertronic connector versions, Meritec shrouds
Ą Machine ID allows the user to uniquely identify any virtual machine in the system
• Reset signal can be routed between the cards or generated by push-button.
The TRACE32 CORE List window displays in detail what is currently running on the individual cores of an SMP system.
VPX 6U Dual Slot backplane with full access frame P/N VPX-22-06-25: test and development system for developing VPX 6U cards.
TRACE32 assigns each VM a number, the machine ID (mid column). The machine ID is a unique identifier that is used by TRACE32 and appears as an address extension; a concept already familiar to TRACE32 users.
The most important objective of the TRACE32 hypervisor-awareness is a seamless debug ging of the overall system. This means that when the system has stopped at a breakpoint, one can check and change the current state of every single process, all VMs, plus the current state of the hypervisor and of the real hardware platform.
• Small breadboard area allows to add custom circuitry.
Ą Current and Voltage monitoring for all powers – each slot
VXP-22-06-25
Ą Air Cooled or Conduction Cooled, optional cooling fans
• Open frame allows access to both sides of the cards for probing and monitoring.
Available options include Air-cooled and Conduction cooled mounting for front cards, RT-2, RT-2R or Smith Hypertronics connectors, Meritec shrouds for custom mapping between slots. Cooling fans are available for cards with high power consumption. Single slot and 3U versions are available. Visit www.az-com.com for additional information and related products.
Ą Monitoring and insertion of all P0 utility signals – each slot
OpenVPX https://www.az-com.com AZ-COM Inc. www.az-com.com sales@az-com.com 925-254-5400
The TRACE32 GUI visualizes the context of the current core/task by a double-click on the task name in the TRACE32 Global Task List.
Lauterbach provides support for seamless debugging of hypervisor-based systems. The introduction of the unique Lauterbach Machine ID allows the debugger to identify any virtual machine in the system. This gives the debugger full visibility of the context of all active and inactive virtual machines and provides a supporting framework to load OS specific aware nesses for each virtual machine.
The Global Task List represents the heart of the TRACE32 hypervisor-aware debugging. It lists all tasks/processes/threads of the guest OSes and the hypervisor. TRACE32 can visualize the context of any task in its GUI. Just double-click to on the task name.
Debugger Embedded Software
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Ą Machine ID provides full visibility of context of active and inactive virtual machines
Hypervisor Debugging with Lauterbach TRACE32 Lauterbach, Inc. www.lauterbach.com info_us@lauterbach.com 508-303-6812 www.lauterbach.com/hypervisor.html
Ą Hypervisor-awareness as a loadable debug extension is provided by Lauterbach
Ą OS-awareness can be loaded for each virtual machine
• Power can be connected via ATX power connector and / or 60 A lugs.
LCR Embedded Systems –Serving critical defense programs for over 35 years FEATURES Ą Intel Xeon D processor with 576GFLOPs performance Ą NVIDIA Pascal GP104 with 2560 CUDA cores and 8.7TFLOPs performance Ą Scalable Xilinx FPGA subsystem Ą Scalable tuner subsystem with VITA 49 IF packet compliance Ą 40Gigabit layer 2/3 Ethernet Switch for fiber or copper I/O Ą Removable SSD bay Ą Cooling for up to 575W of total power Ą Custom I/O panel with options for high-speed copper, optical or RF signals Ą Dual VITA 62 Power Supplies Ą SOSA alignment to the connector level Ą Conduction cooled VITA 48.2 chassis with air assist LCR Embedded Systems www.lcrembeddedsystems.com sales@lcrembedded.com 610-278-0840 ext244 @LCREmbedded https://www.linkedin.com/company/lcr-embedded-systems-incOpenVPX www.lcrembeddedsystems.com/ SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 81
Deployable CMOSS MOSA System for SOSA Aligned Payloads
The system leverages LCR’s 800 Series AoC3U-821 chassis for VITA 48.2 conduction cooled modules. It supports 8 payload and 2 VITA 62 PSU slots plus a removable solid state drive bay for high capacity mission data storage. LCR can integrate high perfor mance Intel Xeon processors and Nvidia GPGPUs, providing nearly 10TFLOPs of computational power to meet the high bandwidth signal I/O requirements in today’s mission critical deployments. Each FPGA sub-system has backplane Ethernet connections to a 40 GigE switch providing copper or optical I/O through customiz able 38999 connectors to the front panel. The FPGA sub-system has a full meshed 40GigEt capable network between each VPX card. The backplane supports both VITA67.c and VITA67.d aper tures and connectors with data plane and control plane connec tions to the 40GigE switch and has been optimized to distribute heat load to sensitive up/down converters. The system maintains SOSA alignment to the connector level for future tech refresh deployments. It is designed to accommodate best-in-class 3U VPX, CMOSS and SOSA aligned payloads to meet mission needs. As a standards based MOSA COTS product, the system enables future mission updates with minimal time to theater and reduced costs. The chassis reflects design practices in use across the LCR family of proven ATR chassis designed to meet aspects of MIL-STD-810, MILSTD-461, and MIL-S-901D. A hybrid cooling approach com bines 48.2 conduction cooling with a high CFM front to rear air cooling system that safely manages payload temperatures for up to 575W of aggregate power. Machined aluminum alloy 6061-T6, bolt together construction ensures unfailing operation in installa tions subject to extreme shock and vibration. EMI and ingress gasketing provides protection against electromagnetic interference as well as moisture and particulate contamination. Our experienced and engaging staff can provide payload integra tion that enables out of the box installation and testing of your application specific hardware and software.
This Deployable CMOSS MOSA System is an HPEC system for 3U SOSA aligned payloads intended for use in demanding RADAR, SIG-INT, EW and EA applications. The feature-rich solution may be used in land, air and sea based equipment where leading edge electronics addresses new and emerging threats in the 21st cen tury battlefield. The rugged design offers an ample I/O complement including multiple receiver and transmitter channels plus 1PPS and 10MHz Ref with a 10Gigabit Ethernet Fiber data interconnect making it an ideal C4ISR Modular Open Sensor System (CMOSS) for harsh environments.
TE’s strategic design includes a floating insert on the backplane side which contains both NanoRF contacts and optical MTs. This allows precise align ment of the RF contacts and MTs before engagement, enabling the high est density within a VPX slot. “The NanoRF optical hybrid module product line is the result of a close relationship between TE’s RF and fiber optic engi neering teams,” said Broadaway. “As bandwidth and den sity demands continue to increase, I anticipate even more innovative designs for our customers in the future.”
“The new NanoRF optical hybrid modules make it possible to meet the need for open systems architecture while providing increased bandwidth and RF signaling capacity for C5ISR systems,” said Eric Broadaway, prod uct manager for TE’s Aerospace, Defense and Marine division. “This new functionality offers the defense industry the flexibility, longevity and reli ability their aerospace and ground systems require.”
NanoRF Optical Hybrid Modules TE Connectivity www.te.com eric.broadaway@te.com 800-522-6752 www.linkedin.com/company/te-connectivity/ http://te.com/nanoRF-optical
The connector modules have a rated frequency of 85 GHz, a mechanical temperature range of -55°C to +125°C and are available in base-card and mezzanine edge mount or cable options.
Ą Available in base-card and mezzanine edge mount or cable options
Ą Rated frequency of 85 GHz, a mechanical temperature range of -55°C to +125°C
Ą Includes a floating insert on the backplane side which contains both NanoRF contacts and optical MTs
Ą Intermateability and interoperability among VPX suppliers is accomplished by multiple slot profiles and connector modules added to the VITA 65.0 and VITA 65.1 compliant backplanes and board-level profiles
FEATURES Ą Open systems architecture compliant, defined in the VITA 66.5 draft standard, planned for release in 2022
Ą Provide increased bandwidth and RF signaling capacity for C5ISR systems
@TEConnectivity OpenVPX
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TE Connectivity (TE)’s NanoRF optical hybrid modules has been created for the defense industries VPX-based embedded computing systems that require increased bandwidth and radio frequency (RF) signaling. The new hybrid modules feature high-density RF and optical connections within common connector module applications like radar, electronic warfare (EW) missile guidance and tactical communications, along with any other small footprint applications where high-frequency RF and optical signals are Thecritical.NanoRF optical hybrid module’s cable mechanical transfer (MT) and edge-mount transceivers provide additional modularity and options for implementation. Intermateability and interoperability among VPX sup pliers is accomplished by multiple slot profiles and connector modules added to the VITA 65.0 and VITA 65.1 compliant backplanes and boardlevel profiles. The NanoRF optical hybrid modules are being defined in the VITA 66.5 draft standard, planned for release in 2022.
Ą Feature high-density RF, optical connections within common connector module applications like radar, electronic warfare (EW) missile guidance, tactical communications and other small footprint applications where high-frequency RF and optical signals are critical
65-compliant, and align with the SOSA Standard. These rugged high-performance Switches are readily inte grated into any SOSA aligned VPX system, or deployed within Annapolis’ proven WILD100™ EcoSystem. Also available: For InfiniBand support, see WILDSTAR 6B10 6U OpenVPX InfiniBand Switch. FEATURES Ą Switching • Supports 1/10/25/40/100 GbE • 6.4 Tb/s of switching capability • Industry-leading, true cut-through latency • Separate Data and Control Plane Switches Ą I/O • Optional 40/100GbE optical interfaces to Front Panel • Optional 40/100GbE optical interfaces to VITA 66 (6E10) Ą FPGAs • 2 Xilinx® Zynq® UltraScale+™ MPSoCs Ą General • Multiple levels of hardware and software security • Supports new SOSA/VITA 65 switch profile • Air, conduction, air-flow-through, or liquid cooled • Hot swappable with air-cooled variants Ą Optional Board Support Package (BSP) • Enables user customization of Zynq+ design • Includes HDL reference design for HPEs and PetaLinux project including necessary software source • Includes Ubuntu Linux v18.04 file system and v5.4 kernel with required patches Ą What Can 100GbE Switches Do for You? If you require high-performance switching for advanced HPC, ISR, or multi-function EW applications, these turnkey switches with dense, flexible I/O are for you. 100GbE VPX Switches are SOSA™ Aligned OpenVPX www.annapmicro.com/product-category/switch-boards/ Annapolis Micro Systems, Inc. www.annapmicro.com/ wfinfo@annapmicro.com 410-841-2514 MADE IN U. S. A. 6E10 features up to 26 40/100Gb Ethernet ports 3E10 features up to 8 40/100Gb Ethernet ports or 32 1/10/25Gb Ethernet ports. Contact us today to request a block diagram and additional specifications. SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 83
Switches that deliver up to
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WILDSTAR 6E10 (6U) and 3E10 (3U) are next-generation 100GbE 6.4 Tb/s of backplane of channels of 100Gb Ethernet. They have front panel I/O to connect to sources, and 6E10 has optional VITA optical back plane connectivity. Both are VITA
switching between
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www.annapmicro.com/products/WS3A01-S1/ Annapolis Micro Systems www.annapmicro.com 410-841-2514 wfinfo@annapmicro.com OpenVPX MADE IN U. S. A. This next-generation 3U OpenVPX Benchtop Development Platform (WS3A01-S1) is both SOSA aligned and 100Gb Ethernet capable, and is designed from the ground up to economically speed development of EW applications that align with SOSA 1.0. The stock Kit includes a 3U Chassis, Backplane, Chassis Manager, FPGA Board with Gen 3 RFSoC Mezz Card, 100GbE Switch, SBC, VITA blocks, and MIL-DTL-38999 cable. Also Available: Larger & rugged versions > WILD100 14-Slot 3U OpenVPX Chassis – WC31E0 > WILD100 8-Slot 3U OpenVPX ATR – WC3A80 100GbE SOSA™ Aligned Development Kit For a virtual or in-person Demo, contact us. OVERALL SYSTEM FEATURES Ą Front-loading, air-cooled system with conduction-cooled boards Ą Seven 3U OpenVPX slots with SOSA aligned backplane profiles • One 14.6.11 Payload • Three 14.6.11 Empty Payload (for expansion) • One 14.2.16 I/O-intensive SBC • One 14.4.14 100GbE Switch • One VITA 62 Power Supply – 12V-Heavy Ą 25 Gbps Line Rates on Data and Expansion Planes • 25/40/100Gb Ethernet • SDR/DDR/QDR/EDR InfiniBand • Gen 3/4 PCI Express • Custom protocols up to 25Gbps per lane Ą VITA 66.5C and VITA 67.3C for payload slots Ą Four MIL-DTL-38999 SOSA aligned circular connectors with 19 RF connections Ą One MIL-DTL-38999 Cable Ą Multiple levels of hardware and software security CHASSIS MANAGER Ą SOSA aligned and VITA 46.11 compliant Ą Enables control, maintenance, and security functions Ą One Xilinx® Zynq® UltraScale+™ MPSoC (ZU5EG or ZU11EG) & Microsemi PolarFire Ą Supports MIL-STD-1553 100Gb ETHERNET SWITCH Ą 40/100Gb Ethernet Data Plane Switch • 6.4Tb/s switching capacity • Industry-leading, true cut through latency Ą 1/10/25/40/100Gb Ethernet Control Plane Switch • Layer-2 Wire-Speed Switching Engine Ą Two Xilinx Zynq UltraScale+ MPSoCs (XCZU5EG) FPGA PROCESSOR + RFSoC I/O CARD Ą One Xilinx Virtex® UltraScale+ FPGA (XCVU7P) Ą One Xilinx Zynq UltraScale+ MPSoC (XCZU7EV) Ą One Xilinx Zynq UltraScale+ Gen 3 RFSoC (ZU47DR) Ą ADC: 4 Channel, 5.0+GSps Sample Rate, 14 bit Resolution Ą DAC: 4 Channel, 10.0+GSps Sample Rate, 14 bit Resolution Ą Also Available: Swap in our DME1 Card, with 64.0 GSps, 10 bit ADC/DAC capability SINGLE BOARD COMPUTER (SBC) Ą Intel® Xeon® D-1559 Ą 32G DRAM Ą 60GB M.2 SSD/Linux – Standard APPLICATION DEVELOPMENT Ą Standard support delivered with all systems Ą Optional full Board Support Package • Enables customization of Zynq PS and PL for security • Provides fast and robust HDL-based environment SystemsEmbeddedMilitary GuideesourceR 84 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Atrenne, a Celestica company, offers a wide range of high-performance backplanes, with 6U, 3U and hybrid 3U/6U models available. Our Gen-4/5 OpenVPX backplanes are part of an innovative product family that enables end-to-end solutions for 64/100 Gigabit systems. Designed to the demanding signal integrity requirements of PCIe Gen4 and 100GbE (100GBASE-KR4), these high-performance Gen-4/5 backplanes offer the highest signal integrity in the industry and are typically used in air-cooled or conduction-cooled development chassis. Atrenne can also design application-specific configurations to meet your indi vidual requirements. High performance 25 Gbaud Gen-4/5 backplanes compatible with 100 GbE (100GBASE-KR4) and PCI Express® (PCIe) Gen-4 (16 Gbaud) on OpenVPX data plane and expansion plane fabrics with MEGTRON 6 – Ultra-low Loss, Highly
OpenVPX
Gen-4/5 Open VPX Backplane Series Atrenne, a Celestica company www.atrenne.com sales@atrenne.com 800-926-8722 www.linkedin.com/company/atrenne-integrated-solutions/ https://www.atrenne.com/products/gen-45-openvpx-backplanes
FEATURES Ą
Heat Resistant Circuit Board Materials Ą Refined VPX connector with smaller press-fit pins, the VITA 46 Multigig RT-3 is fully compatible and interoperable with the original VPX connectors, providing superior signal integrity performance Ą VITA 65 OpenVPX™ compliant backplanes Ą VITA 46/VITA 48 VPX REDI™-compliant with VITA 46.30 compliant RT3 connectors Ą VITA 46.10 RTM connectors Ą Provisions for mechanical stops to prevent misinsertion of payload cards Ą Stiffeners placed every other slot to ensure backplane rigidity Ą Optional rear transition connectors Ą Keying and alignment per VITA 65 and VITA 46 Ą Durability: mating and unmating for 200 cycles SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 85
Ą Built
FEATURES PCIe/104 and PCI/104-Express stackable bus structures
This 3U OpenVPX development platform provides all the slot profiles aligned with the Sensor Open Standards Architecture™ (SOSA) Technical Reference Standard 1.0 and CMOSS 1.1. It supports the latest profiles used to develop systems that follow the hardware requirements of both SOSA™ and CMOSS (C5ISR/EW Modular Open Suite of Standards). At the heart of the system is Elma’s 3U 12-slot OpenVPX backplane with 2 I/O intensive SBC slots, 7 primary payload slots, 1 radial clock, 2 switch and 2 VITA 62 power slots. The backplane features VITA 67.3 RF and optical I/O modules for high speed connectivity. Payload boards are available as part of the platform. Choose from a growing ecosystem of processor, network, PNT navigation and power supply mod ules designed to align with SOSA™ 1.0 and CMOSS. Streamline development efforts and shorten your time to deployment. Other configurations also avail able – browse the website for details.
RTD Embedded Technologies, Inc. www.rtd.com sales@rtd.com 814-234-8087
RTD’s LAN24550 is a dual 10 Gbit/s Copper Ethernet Module utilizing Intel’s X550 10 GbE controller. The X550-AT2 Ethernet controller is a second-generation 10GBASE-T controller with integrated MAC and PHY. It provides backward compatibility with existing 1000BASE-T, simplifying the migration to 10 GbE, and provides iSCSI, FCoE, virtualization, and Flexible Port Partitioning (FPP). 10 Gigabit – using stacked switch configurations – can introduce an increased use of redundancy as Active-Active LACP port teaming. Multiple ports grouped into one logical link improves speed and availability. Dual 10 Gbit/s Copper Ethernet PC/104 www.rtd.com
Intel X550 10 Gigabit Ethernet Controller 2 Independent 10 Gb/s Twisted Pair Ethernet Connections with Integrated MAC and PHY RJ-45 connectors with integrated magnetics and Link/Activity indicator LEDs 10/1 GbE data rate per port: support for vision systems, network and server virtualization, and LAN and SAN -20flexibilityto+70°C standard operating temperature
Development Platform for All SOSA™ 1.0 & CMOSS PIC Profiles OpenVPX https://bit.ly/12-SOSA-CMS-DP Elma Electronic www.elma.com sales@elma.com 510-656-3400
www.linkedin.com/company/elma-electronic @elma_electronic FEATURES Ą 12-slot 3U backplane offers all the latest profiles aligned to SOSA™ & CMOSS Ą Elma’s built-in VITA 46.11 Chassis Manager for intelligent system health monitoring Ą Mix & match slot guides for conduction- and/or air-cooled boards Ą Front panel on/off & reset switches, voltage LEDs; test points; NVMRO & Zeroize switches Ą Maintenance ports routed to connector on rear of backplane, brought out via breakout cable for board Ą Option for SOSA 12V power rails or legacy VS rails Ą Choose from a range of partner-tested Plug-In Cards (PICs) aligned with SOSA profiles SystemsEmbeddedMilitary GuideesourceR 86 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
RTD’s SYNC25104HR is a GPS disciplined oscillator (GPSDO) board which provides high accuracy frequency and time reference signals to PC104 systems and external devices. This board utilizes the u-blox LEA-M8F GPS receiver which locks the output signal of a low-noise, high-precision, oven-controlled crystal oscillator (OCXO) to the GNSS satellites. This product enables time synchronization between distrib uted systems and can be used for a variety of deployments including Time Difference of Arrival (TDOA) applications. Available in PCI/104Express and PCIe/104. Disciplined Oscillator/Timing-Board PC/104 rugged enclosures Intel Xeon E3-1500 Series Processors Ą 4 Cores, 8 Threads, and up to 4.0 GHz max turbo frequency Ą 16GB Dual-Channel DDR4 SDAM (surface-mounted)
Ą 60GB standard surface-mounted industrial-grade SATA flash drive Ą 5 added SATA Ports, 4 PCIe x4 Links, 8 PCIe x1 Links, Dual GigE, 4 Serial Ports, 5 USB 3.0 Ports, 2 USB 2.0 Ports, DisplayPort 1.2 with Audio, Advanced Digital I/O, TPM 2.0 Encryption. CMX34KB is an advanced PC/104 single board computer with a PCIe/104 stackable bus structure. As a part of RTD’s PCI Express offering, this CPU based on Intel’s 7th generation Xeon processor (formerly codenamed Kaby Lake) is exceptionally suited for intelligent systems requiring high performance in harsh thermal conditions. TPM 2.0 (Trusted Platform Module) included for hardware-based cryptography. The surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. The 60GB onboard industrial grade flash drive makes this CPU Windows 10 ready. SBC
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The
RTD Embedded Technologies, Inc. www.rtd.com sales@rtd.com 814-234-8087 www.linkedin.com/company/rtdembedded https://www.rtd.com/PC104/CM/CMX34KB/CMX34KB.htm PC/104 SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 87
Intel® Xeon High-Performance
www.rtd.com RTD Embedded Technologies, Inc. www.rtd.com sales@rtd.com 814-234-8087 FEATURES Ą -40 to +85°C operation, passively cooled Ą GPS/GNSS disciplined precise frequency (10MHz, or any frequency) and low phase noise clock signal generation based on uBlox M8F technology with OCXO Ą Concurrent reception of GPS/QZSS, GLONASS, BeiDou Ą Industry leading acquisition sensitivity and single-satellite timing Ą SBAS (WAAS, EGNOS) can be activated to reach 2.0 m position accuracy Ą Available in modular, rugged enclosures FEATURES Ą PCIe/104 stackable bus structure Ą Available in modular,
GPS
Ą 384-core
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VSC5-2800S Electronics VPT, Inc. www.vptpower.com jiuraduri@vptpower.com 425-353-3010 www.linkedin.com/company/vpt-inc-/ Undervoltage lockout Current limit protection / short circuit protection TOPS AI Performance NVIDIA Volta™ GPU with 48 Tensor Cores 6-core NVIDIA Carmel ARM®v8.2 64-bit CPU, 6MB L2 + 4MB L3 PCIe/104 Type 2 Bus Connector (down-stacking) I/O connections including DisplayPort, 2 MIPI CSI-2 Video Inputs, One Gigabit Ethernet, 2 USB 3.1 Type A, One Serial Port, One Serial
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@VPTnews FEATURES Ą Output Voltage +3.3 V, +5 V, +12 V, +15 V Ą Wide input voltage range: 15 V to 50 V plus 80 V transient Ą Continuous operation over full military temperature range of -55 °C to +100 °C with no power derating Ą Very low output noise Ą No use of optoisolators Ą
The VSC5-2800S Series are designed for smaller satellites in low earth orbits (LEO), launch vehicles, and NASA Class D missions where the balance of cost and guaranteed performance is critical.
FEATURES Ą 21
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Ą Stackable
Port or CAN Bus, 14 GPIO, M.2 E-key 3030 Socket (Wi-Fi, BT, NFC, GPS, GNSS, LoRa, NB-IoT), M.2 B-key 3042 Socket (WWAN/SSD), MicroSIM Card Socket, MicroSD Card Socket, Utility Port Ą Rugged packaging available The supercomputing performance of the NVIDIA Jetson Xavier NX meets the modular, stackable versatility of PC104 in this rugged solution. RTD has brought the Jetson Xavier NX to PC104 – the industry-proven, stackable small form factor. With a comprehensive set of on-board I/O and a PCIe/104 expansion bus, users can quickly prototype and deploy complete embedded systems using verified, off-the-shelf modules. PC104 NVIDIA Jetson Xavier NX RTD Embedded Technologies, Inc. www.rtd.com sales@rtd.com 814-234-8087 www.linkedin.com/company/rtdembedded https://www.rtd.com/nvidia/ PC/104 SystemsEmbeddedMilitary GuideesourceR 88 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Radiation tested to 42 MeV/mg/cm2 and guaranteed to 30 MeV/mg/cm2 for SEE and tested to 50 krad(Si) and guaranteed to 30 krad(Si) for TID in accor dance with VPT’s inhouse radiation hardness assurance (RHA) plan.
The VSC5-2800S Series is a commercial off the shelf DC-DC converter designed for the ‘New Space’ market. Performance is guaranteed through the use of radiation lot acceptance tested (RLAT) components. Our proprietary packaging creates a dual side heatsinking option with very low outgassing.
Power
Technologies
inside@lynx.com 408-206-5753 @ LynxSoftware www.linkedin.com/company/lynxsoftwaretechnologies/ Real-Time Operating Systems and Tools https://www.lynx.com/lynxos178 FEATURES Ą Partition management Ą Process management Ą Time management Ą Inter-partition communications (sampling ports and queuing ports) Ą Intra-partition communications (buffers, blackboards, sema-phores and events Ą Low risk – DO-178B/C level A reusable certification Ą Reduced cost – Elimination of man-years of certification effort Ą Open Standards Conformance – Ensures application portability, software reuse, interoperability Ą POSIX – POSIX.1 with POSIX 1.b, real-time extensions, and POSIX 1.c, threads extensions Ą ARINC 653-1 – Application EXecutive (APEX) Ą Certifiable Networking — Lynx Certifiable Stack comprehensive support for networking protocols SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 89
primary host for real-time POSIX and FACE™ applications within the LYNX MOSA.ic™ development and integration framework. LynxOS-178 native POSIX imple mentation satisfies the PSE 53/54 profiles for both dedicated and multi-purpose real-time as well as FACE™ applications. LynxOS-178 also now supports IPv6. Support for IPv6 will enable devices running on LynxOS-178 with advanced addressing and other enhancements such as improved security via support for IPsec as well as simplified packet pro cessing to be better equipped for performance.
LynxOS-178 has been deployed in certified com mercial and military avionics systems that have flown hundreds of millions of hours. LynxOS-178 RTOS Lynx Software www.lynx.com
LynxOS-178 is a native POSIX, hard real-time partitioning operating system developed and certified to FAA DO-178C DAL A safety standards. It is the only Commercial-offthe-Shelf (COTS) OS to be awarded a Reusable Software Component (RSC) certificate from the FAA for re-usability in DO-178C certification projects. As a COTS RTOS, LynxOS-178 supports x86, Arm, and PowerPC platforms. It is based on open standards and is designed specifically to fulfill the strin gent needs of multithread and multiprocess applications in safety-critical real-time systems, providing security and safety through strict, hardware-enforced isolation between real-time processes, applications, and the RTOS kernel ser vices and LynxOS-178drivers.isthe
The ADAR4002 is designed to provide flexible digital control through either a SPI interface or a Shift Register to allow daisy chaining mul tiple chips together. The ADAR4002 contains register memory for 32 TDU+DSA states. The memory combined with on-chip sequenc ers, allows a fast memory advance via the UPDATE pin. The ADAR4002 is available in a 2x3mm 14-lead LFCSP package and is specified from -40C to 85C. ADAR4002 Analog Devices Inc www.analog.com beamformer@analog.com (800) 262-5643 www.linkedin.com/company/Analog-Devices https://www.analog.com/en/products/adar4002.html#product-samplebuy
@ADI_News RF & Microwave
SystemsEmbeddedMilitary GuideesourceR 90 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
The ADAR4002 is a very low power broadband bi-directional single channel true time delay unit (TDU) and a digital step attenuator (DSA). The IC has 18.5 GHz of bandwidth over a frequency range of 0.5 to 19GHz with 50Ω input impedance at both RF ports. The TDU has two programmable maximum time delays, each with 7-bit control: Range 0 has a maximum delay of 508ps with a resolution of This4ps.range is used at lower frequencies and where the ADAR4002 has less loss and 360 deg of phase adjustment is required. Range 1 has a maximum delay of 254ps and a resolution of 2ps. This range has less loss compared to Range 0 and is useful at higher frequencies where increased time/phase resolution may be required. The DSA has 6-bit resolution with an attenuation range of 0 dB to 31.5dB and a step size of 0.5dB.
FEATURES Ą 0.5 GHz to 19 GHz frequency range Ą Programmable Attenuation: 31.5dB adjustment range and 6-bit resolution Ą Programmable Time Delay: 7-bit resolution Ą Programmable Maximum Time Delay • Range 0: 0ps to 508ps with 4ps standard resolution • Range 1: 0ps to 254ps with 2ps High resolution Ą Fully programmable via a 3-wire or 4-wire SPI interface Ą 14-bit Shift Register for daisy chaining and quick data load Ą Power Dissipation: 1 mW with 1.2V and 1.0V Dual Supplies Ą 14-pin 2x3mm LFCSP 0.5 to 19 GHz, Broadband Bi-Directional Single Channel True Time Delay Unit
Elma offers the most comprehensive range of convection, conduction and liquid cooled ATR and Small Form Factor (SFF) enclosures in the industry. They support fixed and mobile applications found in ground, sea and airborne environments. Our modular, open system platforms offer standardized, cost-effective solutions aligned with open architectures such as OpenVPX, SOSA™, CMOSS, cPCI Serial, COMe and others.
with Innovative I/O Rugged Computing and Displays https://www.elma.com/en/products/chassis-platforms/atr Elma Electronic www.elma.com sales@elma.com 510-656-3400 www.linkedin.com/company/elma-electronic @elma_electronic FEATURES Ą Meets ARINC 404A and ANSI/VITA 48.x or small form factor specs Ą Capacities for 2 to 15 slots 3U and/or 6U Plug-In Cards and boards Ą Fixed-mount or plug-in 28 VDC power supplies Ą Wide range of rugged MIL-38999 and circular connectors Ą MIL-grade components like sensors, line filters, switches, LEDs, fuses, etc. Ą Custom front I/O configurations to maximize use of front panel space SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 91
Rugged Computing and Displays
The RPC24-NAS houses two removable magazines with up to 12 SSDs each which can be quickly removed to off load data. The magazines can then be moved to separate locations and plugged into another RPC24 on any other network for further analysis. When used in conjunc tion with a network switch, the RPC24 can communicate with any other network enabled device to store and retrieve data. This eliminates the need for separate direct attached storage devices for each computer or workstation in a network centric environment.
The RPC24-NAS is a rugged, resilient all SSD storage array designed for high performance, high-capacity tactical edge data capture applications. Its rapidly removable SSD maga zines enable a full magazine to be swapped out for a fresh magazine to store and move data from emerging edge environments quickly and without any tools. The RPC24 targets Mobile (Air-Sea-Ground) and Fixed Expeditionary environments with its MIL-STD-810G and MIL-STD461F certified design.
Data security is a key component to any edge storage system and the RPC24-NAS addresses this with optional support for AES-256 hardware and file level encryption, FIPS140-2 valida tion and hardware and/or software triggered Secure Erase and Data Elimination.
FEATURES Ą Two each 12 drive (24 drives total) Removable Storage Magazines Ą Two GbE and two copper 10GbE networks ports standard. Copper and optical interfaces up to 100GbE available Ą 12Gb SAS JBOD Configuration with optional split bus Ą TCG Compliant and FIPS 140-2 Certified Encryption Ą Secure Erase/Data Elimination Ą MIL-STD-810G, and MIL-STD-461E Certified
RPC24-NAS Rugged All Flash Storage Array
The ATRs come in standard sizes of 1/4, 1/2, 3/4, 1 and 1 1/2 ATR formats per ARINC 404A & ARINC 600 specifications. Our SFF designs pack an even higher density for use in areas where space is a real concern. Their modular design allows for customization options, and the all-aluminum or composite designs optimize weight while maximizing cooling and payload I/O considerations. Remov able I/O panels al low for customization for exact application requirements and increased Inconfigurability.additiontorigorous thermal an environ mental testing, Elma’s rugged deployable enclo sures use electrostatic dust filters, honeycomb EMI filters, EMI gasketing and the latest in air, conduction and liquid-cooling techniques to ensure compliance to military standards require ments such as MIL-STD- 810, 167, 461, 704, 1275 and others. Rugged, Deployable ATRs & SFF Boxes
https://www.phenxint.com/phoenix-international-announces-high-capacity-edge-data-storage-solution/ Phoenix International www.phenxint.com
info@phenxint.com 714-283-4800 www.linkedin.com/company/phoenix-int-systems
Made in the USa
FEATURES Ą Dimensions: 13.0"W x 10.75"D x 4.5"H Ą Processor: COMe-bBL7, Xeon® D-1539 with 64GB of RAM, other processor configurations available upon request Ą GP/GPU: MXM GPU, RT1000, other GPU or VPU configurations available upon request Ą PCI Express / PCI support: 2x M.2 with x4 PCIe; 1x M.2 with x1 PCIe and USB 3.0; 2x mPCIe with x1 PCIe and USB 2 Ą Ethernet: 1x 10GBASE-T, 1x 2.5GBASE-T, 6x 1GBASE-T (L2+ Managed Ethernet Switch & PTP), 1x GBASE-T (direct to CPU) Ą USB: Front Panel: 2x USB 2, 2x USB 3.0 Ą Serial: Front Panel: 2x RS232 (tx/rx); 2x [RS232 (rx/tx/cts/rts) or RS485/422] Ą Special Features: GPS and 1 PPS input/output; 6x GPI, 4x GPO, 6 x GPIO; 4x CANBus (Option); Safety Processor (Option); IEEE 802.3-2012 Power-overEthernet (Option); 2x 2.5" removable Solid State Drive bays (SSDs sold separately) Ą Wireless Connectivity: (Option) Cellular (M.2) connectivity | WiFi (mPCIe) connectivity Ą Power Consumption: +28 VDC (+18 VDC to +36 VDC) power input; Power Consumption: up to 350W (configuration dependent) Ą Cooling: Passive air/conduction cooled. Auxiliary IP67 fan kit available as a build option Ą Operating System: Linux Ubuntu 20.04, LTS, 64-Bit (installed). Other operating systems available on demand The COBALT™ S1901 Mission Computing Platform features the latest in Intel high performance processor and is designed to meet the future needs of Defense computing platforms for AI, Deep Leaning and HPEC by providing multiple GPU or Accelerator card options. The compact S1901 is designed for various high speed I/O options such as 10GbE (copper, but fiber is an option), USB 2/3.0, ruggedized connectors for GPS and 1 PPS timing signals, and room for customization options such as Camera Interfaces. Stor age capacities are met using M.2 NVME slots, along with high capacity 2.5" SSD slots (fixed or removable). Standard options include WiFi and/or LTE cellular modem, and MIL-STD-1553, CANBus, auxiliary cooling fan assembly, and a safety processor module for autonomous vehicle applications. COBALT™ S1901 Kontron www.kontron.com sales@us.kontron.com 888-294-4558 www.linkedin.com/company/kontron-north-america @kontron Rugged Computing and Displays www.kontron.com/cobalt-s1901 Rugged High Performance Mission Computing Platform.SystemsEmbeddedMilitary GuideesourceR 92 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Ą Designed for high ingress protection in harsh environments
RTD Off-the-Shelf Mission Computer
FEATURES Ą -40 to +85°C standard operating temperature
Rugged Ground Vehicle Displays Rugged Computing and Displays www.viewpointproducts.com/ground-vehicle-displays Viewpoint Systems www.viewpointproducts.com sales@viewpointproducts.com 888-632-1322 www.linkedin.com/company/viewpoint-systems-llc/ FEATURES Ą Full HD (1920 x 1080) Resolution Ą High Contrast Ratios Ą Designed for High-Vibration Ą Ingress Protection: IP66 Ą MIL-STD-810G Environment Ą Wide Operating Temperature Range Ą Military-Grade Finish / Coatings SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 93
RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, mSATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acqui sition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking deliv ers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a water tight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integ rity of the environmental seal.
Ą High-performance, synchronized power supply Ą mSATA card carrier and optional 2.5" removable drive Designed to include an additional PCIe/104, PCI/104-Express or PCI-104 peripheral module without increasing overall enclosure size
Viewpoint’s series of rugged Ground Vehicle Displays were designed specifi cally for harsh, high-vibration environments. These displays offer full HD (1920 x 1080) resolution, high contrast ratios, ultra-wide viewing angles, and are designed to comply with MIL-STD test specifications. Viewpoint’s Ground Vehicle Display series are IP66-rated units optimized for SWaP. Available options include touchscreen (resistive or PCAP), programmable, multifunction bezel buttons, QUAD View functionality, and custom mounting or I/O configurations. Viewpoint also offers a comprehensive 2-year warranty on all products with options to extend coverage for up to 5 years in total. All Viewpoint products are designed and manufactured in the USA. Visit our website at www.viewpointproducts.com for more information or con tact us by email, at sales@viewpointproducts.com to request a datasheet or quote.
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Ą Rugged Intel and AMD-based Single Board Computers
Ą Milled aluminum enclosure with integrated heat sinks and heat fins
Rugged Computing and Displays www.rtd.com RTD Embedded Technologies, Inc. www.rtdstacknet.com/iot sales@rtd.com 814-234-8087
COMPUTING ABOVE ITS WEIGHT CLASS
REDUCE DOWNTIME WITH ABS
QUICKLY UPDATE THE E-LABEL DISPLAY
The ZX1C 18 sets a new standard with high performance computing in a SWAP optimized footprint, perfect for both airborne missions and on the ground in a portable rack mount case. Every aspect of the ZX1C 18 is designed to reduce weight without compromising performance or durability. Mul tiple PCIe expansion slots broaden system capabilities while NVMe based storage provide blazing fast read-write speeds. The carbon fiber lid and machined aluminum design results in a structur ally robust yet lightweight computing solution.
Rugged Computing and Displays
Lightweight Rugged Server
TranzPak 1e Rugged e-Label
PREPARED FOR BRUTAL ENVIRONMENTS
Storage Drive SystemsEmbeddedMilitary GuideesourceR 94 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
Weighing in less than 13.5 lbs. the ZX1C 18 provides massive performance typically found in sys tems nearly double in weight. Under the hood are the latest Intel® Xeon® Scalable processors paired with NVIDIA® RTX® GPGPUs to allow resource hungry applications to function at peak performance.
ZX1C 18
Select pre-defined templates or create your own layout with the easy-to-use interface which allows you to quickly edit and update the e-label display from your desktop computer.
Traditionally, an entire computer must be removed from the rack to simply replace the CMOS battery which can result in delays and even scrapped missions without warning. The ZX1C 18’s Active Battery System (ABS) eliminates this, by deploying a patent pending solution which enables a standard half-double-A battery to act as the CMOS battery and is replaceable via the front panel. Additionally, the ABS monitors the voltage of the battery and warns the user via an LED or over the front USB port when to be replaced, eliminating surprise failures.
FEATURES Ą Ultra short-depth 1U Server: 19”W x 1.7”H x 17.8”D Lightweight aluminum construction, weighing less than 13.5 lbs. Ą Up to 32TB NVMe based removable storage Ą Field-replaceable, front accessible CMOS battery Ą MIL-DTL-5015 Locking Power Connector Ą 3rd Gen Intel® Xeon® Scalable processors Ą Up to 2TB of DDR4 RAM Ą Flexible PCI expansion options: Up to 3 PCIe cards • Allows for NVIDIA® RTX® A6000 GPU Ą 750W Max, 18-36V power input with integrated EMI filter Ą System status notification and monitoring • Front LED indicators provide high level status, with more detailed statuses available via the front USB port Ą Fully nanocoated for maximum environmental protection against humidity and salt fog https://zmicro.com/ZMicro sales@zmicro.com 858-831-7000 www.linkedin.com/company/zmicro @zmicrosystems
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FREE UPGRADE – Mention the MES Resource Guide to your regional sales manager to receive a free upgrade to a TranzPak 1e on your next TranzPak 1 order!
The ZX1C 18 has been tested to a full suite of DO-160 environmental tests including shock, vibra tion, high and low temperatures, EMI/EMC, sand, dust, and humidity. In addition, the ZX1C 18 has been characterized to shock, vibration, and temperature levels even more extreme than the DO-160 specification to ensure it will perform reliably in the field and inspire confidence during critical missions.
The TranzPak 1e (TP1e) is an innovation to your removable hard-drive by integrating an e-paper dis play directly into the storage housing. The e-paper display provides a flexible canvas for you to better organize and track your data with custom labeling options.
info@spiritelectronics.com 952-224-9201 www.linkedin.com/company/spirit-electronics SpiritDisti
IC-FEP-VPX3f – VITA 66.5 compliant 3U VPX Kintex®
Space Electronics and Services
Thesystems.
UltraScale™ FPGA board Signal Processing https://www.interfaceconcept.com INTERFACE CONCEPT https://www.interfaceconcept.com info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept FEATURES 3U VPX – VITA 66.5 1*Kintex® UltraScale™ FPGA 2* DDR4 banks (up to 4GB each) 1*Artix-7 control node 1*FMC+ site (VITA 57.4) SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 95
Spirit Electronics www.spiritelectronics.com
www.spiritelectronics.com
Test and screening: environmental, electrical, wafer sorting and binning ASIC design with screened and qualified part delivery
Benefits of the vertically integrated services include cost and schedule reductions, reduced mate rial handling, robust quality oversight, consolidated documentation, stream lined processing and product care, custody and control. We offer unparalleled supply chain security in our industry. We also offer die and wafer nitrogen chamber storage.
One P.O., One Supplier Our line card is formulated to be synergistic. Spirit provides electronic components from multiple suppliers FPGA’s, logic, passives, memory, timing control, connectors and more – so customers can place one order and track one shipment instead of many. We are an authorized franchised distributor of every line we carry. We can take a product all the way from design, to foundry, to assembly and test, and deliver a space-qualified component to the customer for military or space applications. One of our strengths is ASIC’s which are becoming a solution to overcome the supply chain lead time extension and cost escalations. We also offer die and wafer nitrogen chamber storage.
Value-Added Components Tailored for the A&D Industry
FEATURES
Spirit Electronics is veteran owned, woman owned, HUBZone certified and is DLA Qualified for Commercial Lab Suitability for MIL-STD-883.
Spirit Electronics is changing the definition of distribution in Aerospace & Defense. Spirit’s valueadded services provide secure supply chain solutions that can greatly shrink lead times, reduce cost and simplify processes. Customers count on us to plan, procure, warehouse inventory, and deliver components that are prepped and ready for assembly the moment they arrive on site.
Our value-added services include: BOM SuppliermanagementManagedInventory (SMI)
Circuit Card Assembly including High Cu boards
Based on the Xilinx Kintex® UltraScale™ technology, this high-speed 3U VPX FPGA board is designed for the signal-processing-intensive applications of high-performance embedded computing (HPEC)
Automated BGA Reball Laser marking
IC-FEP-VPX3f board is VITA 66.5 compliant and enhances VPX capabilities by offering 12 full-duplex optical lanes on the board’s backplane connectors. The board integrates a user-programmable Xilinx Kintex® UltraScale™ FPGA (KU060, KU85 or KU115), 8GB of 64-bit wide DDR4, two 128 MB of QSPI Flash for bit streams storage, one 128 MB of QSPI Flash for user data storage and one Xilinx Artix®-7 transceiver optimized FPGA. The IC-FEP-VPX3f is delivered with host drivers and an example design including hardware IP Resources (VHDL code) that can be used to implement PCI Express Gen2/Gen3 links, 10 Gigabit Ethernet ports (XAUI, 10GBase-KR) and Xilinx Aurora. The board is compatible with the Xilinx development tools (Vivado, platform cable) and supports a VITA 57.4 compliant FMC+ slot. The board is available in standard, air-cooled and conductioncooled grades (85°C).
Omnetics' Low Profile Micro-D series offers designers a saving of roughly 30% in height, all the while assuring users the same perfor mance and reliability come to expect with previous MIL-DTL-83513 iterations. These connectors are ideal for critical, high-reliability industries, including aerospace, military, and medical. They are built to exceed the specifications of MIL-DTL-83513, while allowing designers the ability to squeeze more and more into less and less.
Low Profile Micro-D Connectors
Proudly engineered and built in USA HIGH RELIABILITY AND PERFORMANCE
FEATURES Ą Durability: > 2000 Mating Cycles min Ą Temperature: -55ºC to +125 ºC (200 ºC w/HTE) Ą Current rating: 3 Amps per contact per MIL-DTL-83513 Ą Voltage Rating (DWV): 600 VAC RMS Sea Level Ą Insulation Resistance: 5,000 Megohms @ 500 VDC Ą Shock: 50 g’s with no discontinuties > 1 microsecond Ą Vibration: 20 g’s with no discontinuties > 1 microsecond Ą Thermal Vacuum Outgassing: 1.0% max TML, 0.1% max CVCM - NASA SP-R-0022 Ą Contact Resistance: 26 milliohms (65 mV) max @ 2.5 Amps per MIL-DTL-83513 Ą Mating/Unmating Force: 3 oz. (.85g) typical per contact 96 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
REVOLUTIONNARY LOW PROFILE MICRO-D
The Low Profile Micro-D connector series offers proven military specification performance and reliability with reduced flange height and weight compared to standard Micro-D connectors.
Low-profile connector types enable designers to utilize boardstacking efforts. This allows for a fast design of each individual section of the instrumentation allowing for more components in a smaller form factor. Applications include hand-launched drones, portable robotic surveillance systems and cube satellites.
Space Electronics and Services
Markets all across the globe are focused on SWaP. In the defense world, designers are searching for newer componentry to usher in newer compact, smarter missile designs capable of protecting today’s modern warfighters. In the space world, the goal is simi lar: mass reduction! Companies such as NASA continue to focus on this requirement. Today, it is estimated to cost $10,000 to put a single pound of payload in Earth’s orbit. NASA's goal is to reduce the cost of getting to space to hundreds of dollars per pound within 25 years and tens of dollars per pound within 40 years. With this goal in mind, these newer SWaP options must not only be smaller than their incumbent, they too must survive and thrive in one of the harshest environments ever imagined.
Omnetics’ Low Profile Micro-D connectors offer the performance and reliability demanded by this industry niche and beyond. They are designed and manufactured using the identical pin to socket system, shell and insulator materials that pass MIL-DTL-83513. Pins are made of ruggedized BeCu copper alloy that insure con tinuous signal performance through 50 g's of shock and 20 g's of vibration. Their performance has been tested and certified from -55 degrees to +125 degrees centigrade. The low profile connec tor’s height is significantly reduced by 30% to less than .208” high with some designs.
SystemsEmbeddedMilitary GuideesourceR
FOCUS ON SWaP
Omnetics Connector Corporation www.omnetics.com +1 www.linkedin.com/company/omnetics-connector-corporation763-572-0656
APPLICATION-SPECIFIC
The Impressive Nano-D Connector Omnetics Connector Corporation www.omnetics.com sales@omnetics.com +1 763-572-0656 www.linkedin.com/company/omnetics-connector-corporation
Temperature:
NEW STANDARD Omnetics’ Nano-D connectors serve mainly in military and aerospace applications. These devices and the modern chip technology that makes them possible impact circuit board designs as well as connector and cable selections. They are fueling the demand for miniaturization at lower voltages and current levels. Our Nano-D connectors serve design engineers well in this new era.
Space Electronics and Services
+125 ºC
Nano-D connectors are designed to perform at military specifica tion levels for high reliability and to remain working in both portable applications and extreme environments. Most Nano-D connectors evolved rather directly from the older Micro-D connectors and fol low similar specifications. As speeds go up, the wavelength of each signal is shorter, and at lower voltages, vibration and circuit noise could confuse the signal. Nano-D connector resistance is kept as low as 12 to 15 milliohms with a capacitance of 2.0pf to 2.4pf, which is ideal for most circuits with low current flow and low voltage.
Proudly engineered and built in USA
HIGH RELIABILITY
Omnetics’ groundbreaking Flex Pin contact design pre-dates the advent of the MIL-DTL-32139 nano-miniature specification and today all MIL-DTL-32139 sockets mate properly with the Flex Pin. The one-piece unit is stamped from ASTM B194 beryllium copper (BeCu) to deliver high conductivity, low interference, and high resil iency. Its excellent spring properties enable it to withstand shock, vibration, and other rugged conditions and it easily passes mili tary specification requirements. Flex Pin contacts are plated with 50 micro-inches (1.27μm) of gold over 50 micro-inches (1.27μm) of nickel and are rated at 1 amp each. All pins are plated post-forming to verify a no raw edges surface. Our contacts are inspected by our quality assurance experts to guarantee perfection and performance. Durability: > 2000 Mating Cycles min -55ºC to (200
ºC w/HTE) Current rating: 1 Amp per contact Voltage Rating (DWV): 250 VAC RMS Sea Level Insulation Resistance: 5,000 Megohms @ 100 VDC Shock: 100 g’s discontinuity < 10 nanoseconds Vibration: 20 g’s discontinuity < 10 nanoseconds Thermal Vacuum Outgassing: 1.0% max TML, 0.1% VCM Contact Resistance: 87 milliohms (87 mV) max @ 1 Amp Mating/Unmating Force: 2.5 oz. (.71g) typical per contact SystemsEmbeddedMilitary GuideesourceR SystemsEmbeddedMilitary GuideesourceR www.militaryembedded.com MILITARY EMBEDDED SYSTEMS with Resource Guide September 2022 97
FEATURES
FLEX PIN DESIGN
Portable high-speed digital signal processing devices are expand ing the demand for small, lightweight cable and connectors. Nano-D connectors are especially well suited for these ruggedized, environ mentally sensitive applications. When specified, cable, signal-speed capability, and formats are designed to match the ultra-small NanoD connectors. Designs include IEEE 1394 fire-wire cable and extend to USB 3.1 formats and CAT 6a wiring. Many of these formats sup port a wide range of new designs, ranging from circuitry used in small military unmanned vehicles to soldier-worn equipment.
Sponsored by RTI
https://militaryembedded.com/webcasts/archive/webcasts:WEBCAST
Read this white paper: https://bit.ly/3AgvmJT Read more white
www.militaryembedded.com
JADC2 and Data-Centricity: Creating a Joint Posture of Deterrence
In this webcast, the current state of the JADC2 strategy from the public viewpoint of military leaders is discussed, along with a status update on global activities to create joint opera tional environments. Also detailed: the requirements for cre ating a data-centric framework for JADC2 that enables realtime data sharing and the rapid insertion of innovative tech nologies to maintain information and decision advantages to joint-force commanders. (This is an archived webcast.)
The U.S. Department of Defense (DoD) created the Joint AllDomain Command and Control (JADC2) JADC2 Strategy with the aim of unimpeded delivery of real-time situational aware ness data to joint-force commanders regardless of the military domain or defense supplier. Industry members must embrace the U.S. DoD Data Strategy, which calls for transforming the DoD into a data-centric organization that uses data at speed and scale for operational advantage and increased efficiency.
One major piece of OSC’s work is referrals to help connect the service member with additional resources, including those pertaining to counseling and mental health, employment and education, and housing and home renovations if needed. Through Operation Giving Back, veterans and their family members who wish to assist others in similar situations can work as paid interns for the organization to serve others like themselves. For additional information, please visit https://operationsecondchance.org/.
Each issue, the editorial staff of Military Embedded Systems will highlight a different charitable organization that benefits the military, veterans, and their families. We are honored to cover the technology that protects those who protect us every day. This issue, we are highlighting Operation Second Chance (OSC), a Maryland-based 501(c)(3) nonprofit that supports wounded, injured, and ill combat veterans and their families by identifying and supporting their immediate needs and requests, which often occur while the veteran is waiting for authorization for post-military benefits. Founder Cindy McGrew started the organization in 2005 after visiting friends who were being treated at Walter Reed Army Medical Center in Washington, D.C. following combat tours in OperationIraq.Second Chance’s work with recovering service members often begins as the wounded, injured, or ill person is tran sitioning out of an intensive care unit: OSC makes initial contact with the family and informs them of the types of assistance the organization can provide. Financial aid in the form of mortgage and rent payments, plus money for utilities, transportation costs, lodging, and other essential emergency costs can help the service member and family avoid losing a home or going into debt during a prolonged recovery period. It also coordinates retreats, sports events, hospital visits, and outings, which helps the veteran and family boost morale and help them transition back into civilian life, reconnect with family, and build a network of peers.
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CONNECTING WITH MIL EMBEDDED By Editorial Staff GIVING BACK | PODCAST | WHITE PAPER | BLOG | VIDEO | SOCIAL MEDIA | WEBCAST 98 September 2022 MILITARY EMBEDDED SYSTEMS with Resource Guide www.militaryembedded.com
GIVING BACK
Unlocking the Value of AI in Defense By Adlink AI [artificial intelligence] plays an increas ingly important role in the defense sector, where cost efficiency must be balanced against national security. In some cases, AI-powered defense solutions are designed from the ground up for maximum suit ability to a specific application. Alternatively, to save on devel opment time and costs, products may be based on established commercial designs that have been modified for military use.
In this white paper, learn about how AI-enabled solutions can help defense organizations improve their mission effec tiveness and decision-making through both military-specific and noncombat-focused applications. Moreover, read about how defense and intelligence organizations will need solution architectures robust enough to handle the ever-increasing and diverse workloads arising from data sources including machineto-machine and Internet of things.
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Military Embedded Systems focuses on embedded electronics – hardware and software – for military applications through technical coverage of all parts of the design process. The website, Resource Guide, e-mags, newsletters, podcasts, webcasts, and print editions provide insight on embedded tools and strategies including technology insertion, obsolescence management, standards adoption, and many other military-specific technical subjects. Coverage areas include the latest innovative products, technology, and market trends driving military embedded applications such as radar, electronic warfare, unmanned systems, cybersecurity, AI and machine learning, avionics, and more. Each issue is full of the information readers need to stay connected to the pulse of embedded technology in the military and aerospace industries.
