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PC/104
Consortium
By Stephen St. Amant, PC/104 Consortium President
Predictions: Spring 2020 The thing about predictions, particularly in tech, is that when you’re wrong, you can lose a lot of money, and you can look foolish while you’re at it. In 2007, the then-CEO of Microsoft, Steve Ballmer, laughed at Apple’s newly-announced iPhone. “Five hundred dollars?! Fully subsidized with a plan? … That is the most expensive phone in the world, and it doesn’t appeal to business customers because it doesn’t have a keyboard, which makes it not a very good email machine.” He walked the statement back a bit by saying the iPhone might sell very well. And of course, that’s exactly what happened. Today, it’s easy to see Ballmer’s error about the iPhone. But things weren’t so clear in 2007. While we can’t predict the future exactly, we can certainly see trends. We can look at the markets, we can understand the industries, and we can learn from the past. Every day, we make assertions, and we bank on them. As designers and manufacturers, we choose technologies, we select components, we decide what to buy, when to buy it, and how much. We do our best to protect against obsolescence issues and platformmigration headaches. We don’t predict the future, but we can anticipate it. So what does the future hold for PC104? Time will tell, but here are some opinions based on what we’ve seen, what we’re planning, and what we expect. As more computational requirements are pushed to the edges of applications, further from servers and closer to sensors and points of data collection, we’ll see a continued trend toward box-level solutions. PC104 systems will continue to thrive in this arena because of their small footprint, proven ruggedness, and strong size-to-performance ratio. The sweet spot that PC104 fills will continue to be an important area driving overall efficiency. Because of its proven reliability, PC104 is often selected as a preferred form factor for projects that require long life cycles, and for projects where repair and replacement are significant logistical challenges. This will continue to be the case. Remote areas will still require reliable embedded systems. Atop turbines, on top of the water and far below, in the air and in space – PC104 serves these applications well, and it will continue to do so. Of course, PC104 also meets the needs of many other applications where accessing the hardware is relatively easy. Transportation, security, industrial, infrastructure, www.smallformfactors.com
defense, research: All of these areas have been (and will continue to be) places where PC104 excels.
The PC104 systems you see in development today will still be in procurement channels five and even 10 years from now. And because of its proven track record, we’ll see more organizations recommending – and even specifying – use of systems based on PC104. PC104 has shown itself to have staying power in the market. This is one of the reasons engineers confidently choose PC104 for projects that take months or years to develop. They’re designing in not just “embedded” but “PC104 embedded” to protect against obsolescence, set up for comprehensive migration to new components and technologies, and ensure that what’s in development today will be available two years from now when programs reach production phases and forward to five years from now when they require legacy support. The PC104 systems you see in development today will still be in procurement channels five and even 10 years from now. And because of its proven track record, we’ll see more organizations recommending – and even specifying – use of systems based on PC104. As technology advances, so does the need for embedded systems to meet new connectivity speeds. PC104 leaders are working together to address these upcoming needs. In the near future, we’ll see the release of new specifications that meet next-gen speeds while offering a clear path forward for what exists today. Technology is more accessible than ever. The maker movement, on-demand short-run production, and open-source designs have burst open a world of possibility. It’s changed the way we think about technology. Knowledge-sharing and cooperation between companies is trending. It’s no different with PC104: As we develop our newest PC104 specifications – just as we have with all of our previous specs – we’ll see exciting contributions from our member companies; companies that continue to lean forward making bold predictions and anticipating the future needs of the industries they serve. PC/104 and Small Form Factors Resource Guide
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w w w. s m a l l f o r m f a c t o r s .c o m w w w. p c10 4 o n l i n e.c o m
ON THE COVER: The PC/104 & Small Form Factors 202 Resource Guide showcases relevant products for designers in the areas of COMs/SOMs, hardware and peripherals, IoT, SBCs and boards, and systems.
Volume 24 • Number 1
FEATURES
COLUMNS
5 BLOG
PC/104 Consortium
Why is long-term availability important?
By Stephen St. Amant, PC/104 Consortium President
Predictions: Spring 2020
By George Hilliard, WinSystems
6 ROUNDTABLE DISCUSSION PC/104 always a factor at Embedded World
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A roundtable discussion with Roy Keeler, Senior Product and Business Development Manager, Aerospace & Defense, ADLINK Technology and Vice President of Branding for the PC/104 Consortium; Flemming Christensen, Managing Director, Sundance Microprocessor Technology; George T. Hilliard, Technical Sales Director, WinSystems; and JC Ramirez, Vice President of Engineering and Business Development at ADL Embedded Solutions
10 PC/104 CONSORTIUM PC/104 Consortium information
RESOURCE GUIDE
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COMs and SoMs Hardware and Peripherals IoT SBCs and Boards Systems
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BLOG
Why is long-term availability important? By George Hilliard
Megatrends such as the Internet of Things, robotics, and the latest industrial innovations are escalating demand for electronic components. Inadequate raw materials and manufacturer capacity are also adding to the shortfall. As a result, OEMs are looking for ways to extend the life of their existing products by either performing workarounds or making bigger purchases of necessary components. This phenomenon makes long-term availability a tougher task for those OEMs. However, the demand from customers for long-term availability remains unchanged. This is especially problematic for the military, medical, and industrial sectors, where a product life of seven to 10 years is the standard.
One way to overcome the problem of long-term product availability is by working with a vendor whose single-board computers have a history of long product life cycles.
Figure 1 The WinSystems PX1-C415 is a PC/104 form factor SBC designed with an Intel Atom E3900 CPU. The longterm availability of the processor enabled the maker and hence the user to enjoy an extended SBC life span.
could hunt for alternative parts vendors, but the process will be costly and lead to further delays. Plan B would be to incorporate available parts into the new design. However, the redesigned product needs to undergo the certification process again before deployment. Some industrial applications put strict standards on emissions and ruggedness; the testing process could delay product introduction for months or more. And at any point in the testing process, failures could lead to more costly redesign, retesting and delays. One way to overcome the problem of long-term product availability is by working with a vendor whose single-board computers have a history of long product life cycles. Consistent and robust product support from the vendor is also a must. In addition, the vendor should practice flexible design-based manufacturing, which will enable technology upgrades and product improvements with minimal impact on form, fit, function, and redesign costs.
How to maintain long-term availability? We know that product design, development, and testing for industrial-grade products can be time-consuming and expensive.
Settling in for the long haul One product that satisfies long-term availability expectations is the WinSystems PX1-C415 SBC. It features dual- or quad-core Intel Atom E3900 processors (formerly known as Apollo Lake-I). Intel Atom processors are known for delivering more computing performance, faster I/O, and higher-resolution graphics than previous industrial CPUs. As microprocessors boast an availability of 15 years, the PXI-C415 SBC can offer that same life span. (Figure 1.)
Following the design phase, the products must be certified to meet the requirements of the specific application. Due to this potentially arduous process, these products are expected to be in operation for longer than conventional commercial products.
Due to its large feature set – including compatibility with the most popular operating systems – the PX1-C415 provides a well-supported platform for a broad spectrum of embedded industrial IoT applications. Its rugged design and extended functionality in extreme temperatures (-40 °C to +85 °C) further enhance its functionality. The inclusion of a PCIe/104 OneBank, an interface that enables I/O expansion, yields a good deal of flexibility in the PX1-C415 design. Lastly, the PX1-C415 has customizable security features providing a sophisticated cryptographic and security capability.
Dealing with accelerated product obsolescence will likely be costly for the industrial equipment manufacturer. They
George Hilliard is Sales and Marketing Manager for WinSystems.
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WinSystems · www.winsystems.com PC/104 and Small Form Factors Resource Guide
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APPLICATION TRENDS ROUNDTABLE DISCUSSION
Stephen St. Amant, President of the PC/104 Consortium, leads a discussion for visitors to the OpenSystems Media booth at the 2019 Embedded World Conference & Exhibition. In photo (L to R): Stephen St. Amant; Roy Keeler of ADLINK Technology (and also VP of Branding for the PC/104 Consortium); Jonathan Miller, President of Diamond Systems Corp.; Dr. Paul A.T. Haris, Chairman and CEO of RTD Embedded Technologies; and George Hilliard, WinSystems. Photo courtesy OpenSystems Media.
PC/104 always a factor at Embedded World The Embedded World Conference & Exhibition – by far the largest embedded event in the world – is coming up in February 2020 in Nuremberg, Germany. Last year’s event brought together 1,117 exhibitors from 42 countries, exhibiting to 31,000 visitors from 84 countries. PC/104 technology has been a key part of the growth of the Embedded World show and the growth of embedded technology overall. The roundtable below consists of representatives of PC/104 Consortium members, all of whom will be attending and exhibiting at this year’s event. The panelists discuss why PC/104 suppliers find Embedded World important, growth areas for PC/104 technology, and their take on where the PC/104 standard is headed in the future. Our panelists are Roy Keeler, Senior Product and Business Development Manager, Aerospace & Defense, ADLINK Technology and Vice President of Branding for the PC/104 Consortium; Flemming Christensen, Managing Director, Sundance Microprocessor Technology; George T. Hilliard, Technical Sales Director, WinSystems; and JC Ramirez, Vice President of Engineering and Business Development at ADL Embedded Solutions. 6 y
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PC/104 & SMALL FORM FACTORS: PC/104 products have always been showcased at Embedded World. Why is this such an important show for the PC/104 community?
FLEMMING CHRISTENSEN Sundance Microprocessor Technology Managing Director
KEELER: PC/104 is one of the original embedded computing form factors first standardized by the PC/104 Consortium in 1992, then adding PCI to the specification in 1997 and PCIe in 2008. The staying power of the standard with the ability to incorporate new technologies is one of the reasons that PC/104 is still relevant after 28 years! This year, 15 PC/104 Consortium member companies announced their intent to exhibit at the 2020 Embedded World. I believe it is fair to say that PC/104 was instrumental in fueling the growth of the embedded community as well as of the Embedded World Exposition & Conference. So when you ask why it is important that PC/104 be showcased at Embedded World, the answer is simple: To perform outreach promoting a technology that stands the test of time to the current generation of design engineers. CHRISTENSEN: Embedded World was elected as the PC/104 Consortium’s location for annual meetings, as it was in the middle of the world, that is in terms of U.S. companies going east and Asian companies going west. It made sense!
GEORGE HILLIARD WinSystems
Technical Sales Director
RAMIREZ: Probably the biggest reason is the lack of similar embedded shows in the U.S. The Embedded World organizers have been very receptive to the military/ industrial embedded computing community by dedicating a hall entirely for PC/104 and competing form factors. That being said, Embedded World doesn’t do much for lead generation in the U.S., but it does provide a good venue for PC/104 competitors
THE ROY KEELER
ADLINK Technology Senior Product and Business Development Manager, Aerospace & Defense and Vice President of Branding for the PC/104 Consortium
The McHale Report, by mil-embedded.com Editorial Director John McHale, covers technology and procurement trends in the defense electronics community.
JC RAMIREZ
ADL Embedded Solutions Vice President of Engineering and Business Development
www.smallformfactors.com
ARCHIVED MCHALE REPORTS AVAILABLE AT: WWW.MIL-EMBEDDED.COM/MCHALE-REPORT PC/104 and Small Form Factors Resource Guide
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ROUNDTABLE DISCUSSION to meet, collaborate, and introduce new products. The U.S. could certainly benefit from having a similar show in the States.
attends each year. It allows the different PC/104 suppliers to discuss specificatio updates and marketing collaboration as they continue building the ecosystem.
HILLIARD: As the general embedded trade shows declined several years ago and became more vertical or supplierspecific in the U.S., Embedded World became the focal point for embedded system design in one location. Subsequently, the PC/104 Consortium moved its annual board meetings to Embedded World and has maintained that, since most of the Executive Board
Embedded World also provides a forum to participate with other PC/104 suppliers on discussion panels, meet with clients, and consider new potential partners. PC/104 & SMALL FORM FACTORS: Is the European market the largest growth area for PC/104? If not, what geographic area is? Asia? The U.S.?
KEELER: The U.S. market is still the largest consumer of PC/104 products worldwide and will probably continue to be so in the near future. The European market is steady, but I would not describe it as being in a growth mode. However, there is plenty of opportunity for PC/104 growth in the Asia-Pacific market where PC/104’s size, relatively low cost, simple interface, and inherent ruggedness are highly desired qualities. CHRISTENSEN: Sundance has not seen any growth the last 12 months for conventional PC/104 systems. Actually, it’s seen a decline as the integration of more features on SoC [system-on-chip] means that more I/O functions are found on the main CPU board. The simpler and cheaper COM concept is preferred and for easy I/O, then M.2 and MiniPCIe are much cheaper. The PC/104 Consortium has not released anything new for the past five-plus years, in terms of higher performance. The “need for speed” will never go away, so Sundance is working on a stackable replacement for the current Samtec Q2 connector to allow systems to be built that can handle Gen 4 and Gen 5 CPUs, to match leading-edge CPU, GPU, and FPGA technology. HILLIARD: For WinSystems, we feel the largest growth potential is in the U.S.; however, we may not have the best perspective to answer the question. Though we certainly ship PC/104 products throughout the world and continue to build our presence in Europe and beyond, our marketing and sales force are primary focused on the U.S. market. We continue to see a trend for clients that prefer or require U.S.-made products, especially in government and the transportation industry. With that being said, we still view Europe as a growth area for PC/104, though it is not being driven by country-of-origin requirements like our U.S. base. RAMIREZ: From ADL’s perspective, the U.S. is still the largest growth market for PC/104. We have a large installed base … especially in the military/defense space … that is comfortable with the standard and happy to continue with it. European and Asian embedded engineers
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are not as form-factor-centric and [U.S.] engineers tend to be … in our opinion.
of suppliers/customers to make an open standard of a “blade” enclosure concept to allow expansion of a stack of boards easier for OEMs.
PC/104 & SMALL FORM FACTORS: Predict the future for PC/104. Where will we see PC/104 products used the most in five, even 10 years from now? Industrial? Military? Other?
HILLIARD: The overall size and ruggedness of PC/104 will continue to be a viable solution for military COTS [commercial off-the-shelf], heavy transportation, and other critical vertical markets requiring reliable rugged embedded solutions. It is expected that the use of PCIe/104 Type 1 and Type 2 modules will extend in the future as use cases for artificial intelligence and machine learning continue their dominance. Ultimately, this will help drive the next generation of PC/104 specifications.
KEELER: If I had a crystal ball … I’d see PC/104 usage evenly split between industrial and military applications with common requirements for rugged smallform-factor systems that fit into a specific SWaP [size, weight, and power] envelope that requires a large I/O count and a low-power processor such as an Atom, Rockchip, Jetson, or Arm. These smallform-factor tactical-edge processing subsystems will account for a large number of future PC/104 use cases. With respect to the PC/104 standard, the consortium plans to start the process of soliciting industry input for the next-gen PC/104 standard in 2020, with a targeted 2021 release date. Stand by.
RAMIREZ: In short … PC/104 has worked ably and reliably in [the military] space for almost 25 years. Military engineers are big advocates of proven technologies and only grudging adopters of new and alternative solutions. As long as PC/104 continues to evolve to meet the processing and I/O needs of military applications, PC/104 will continue to do well in this space.
CHRISTENSEN: In terms of longevity, nothing compares to the form factor of PC/104 for embedded solutions. In 10 years, the incumbents will still be selling PC/104 solutions and I am 99.9% sure that Sundance will still build modules with the Q2 connector for the PC/104 OneBank specifications. In terms of where the new growth will come, then that’s harder to predict. The obvious target is to gain traction in the smaller form factor of embedded military systems that use OpenVPX today. The backplane is such a limited factor in terms of size and cost. The form factor of PC/104 with better and faster (Samtec/ Molex Searay has been chosen) connector system will be important for that to happen. Sundance sees potential here with a single SBC CPU as a host and then a number of I/O boards for ultrahigh processing and interfacing, either with GPUs and/or FPGAs. The days of 10-plus PC/104 boards in a single system have [passed], but a solution with a single SBC and a single I/O to start with that can expanded would be an attractive alternative to COM standards with limited to no expansion potential. We are working with a number www.smallformfactors.com
Big Performance
in a Small Form Factor The ComSys-536x family of rugged COTS computing systems are scalable solutions that address the needs of mission-critical applications. The modular, open standards design allows a choice of processors with super-flexible, tailored I/O configurations. The sturdy, lightweight aluminum enclosure provides fanless, conduction cooling with maximum protection from the harshest elements including high levels of water and particle ingress.
With you at every stage! Elma Electronic Inc.
elma.com PC/104 and Small Form Factors Resource Guide
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COMs and SOMs PC/104 CONSORTIUM
History of the PC/104 Consortium The PC/104 Consortium was established in February 1992 by 12 companies with a common vision of adapting desktop computer technology for embedded applications. This consortium has had a tremendous, positive effect on the embedded computer marketplace. The initial release of the PC/104 specification in March of 1992 was an open design offering the power and flexibility of an IBM compatible personal computer in a size ideally suited for embedding. Simple and elegant in design, while small but rugged in performance, PC/104 technology bridged the successes of the past with the promises of future innovations. The ISA bus of the original IBM PC –– as established by the IEEE P996 specification – is still fully supported today by PC/104 technology over two decades after it was created. When demand for a faster, higher-bandwidth bus emerged, the PC/104 Consortium once again followed the desktop PC by adding a PCI bus to the ISA bus. Following on, PC/104-Plus was introduced in February of 1997. By keeping the ISA bus and adding the PCI bus, this specification became an addition to the technology rather than a replacement of any existing technology.
When desktop PCs stopped using the ISA bus, the PC/104 Consortium was ready with PCI-104 technology. The concept of PCI with no ISA was introduced in the original PC/104-Plus specification and was subsequently formally recognized with its own specification in November 2003. Once again, the PC/104 Consortium followed the desktop PC while keeping the legacy specifications intact. This growth pattern underscores the PC/104 Consortium’s desire to support the legacy technology while developing new solutions for the future. Longevity is a requirement for embedded systems and remains one of the hallmarks of PC/104 technology. This aspect is proven time and again by the number of PC/104, PC/104-Plus, and PCI-104 products on the market today, as well as by the number of PC/104 sites on other form-factor boards. To learn more about PC/104 Consortium organization and membership, please visit www.pc104.org or email the organization at info@pc104.org.
PC/104 Consortium Founding Members
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Ampro
DMS Systems
Real Time Devices
Automation Instruments
Enclosure Technologies
Reflection Technology
BG Technologies
IOTech Inc.
Voice Connection
Diamond Systems
Quantum Software Systems
Xecom
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PC/104 Consortium Members at Embedded World February 25-26, 2020
| Nuremberg, Germany
| www.embedded-world.de/en
PC/104 CONSORTIUM MEMBER
BOOTH NUMBER
AAEON Technology Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-350 ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-554 ADLINK Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-540 Axiomtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-456 bplus GmBH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 4/4-303 Connect Tech. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-430 Diamond Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-350 ept Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-311 Fastwel Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall1/1-406 iBASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-140 OpenSystems Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 5/5-341 PEAK System Technik . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-483 Samtec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 4A/4A-259 Sealevel Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-201 Versa Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-257 WinSystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-244 Listings as of 12/10/19; subject to change
PC/104 Consortium 2020 Member Directory AAEON Technology Inc. www.aaeon.com
ept Inc. www.ept.de
Red Wave Labs Ltd. www.redwavelabs.com
ADL Embedded Solutions www.adl-usa.com
EVOC Intelligent Technology www.evoc.com
RTD Embedded Technologies www.rtd.com
ADLINK Technology www.adlinktech.com
Fastwel Corp. www.fastwel.com
Samtec www.samtec.com
Advanced Micro Peripherals www.ampltd.com
General Standards Corp. www.generalstandards.com
SBS Science & Technology www.sbs.cn
Alpha Project Co. www.apnet.co.jp
Hivertec www.hivertec.com
Sealevel Systems www.sealevel.com
Apex Embedded Systems apexembeddedsystems.com
iBASE www.ibase.com/tw
Sundance Multiprocessor Technology www.sundance.com
bplus GmBH www.b-plus.com/en.home.html
MicroMax Computer Intelligence www.micromax.com
Tri M Technologies www.tri-m.com
Connect Tech www.connecttech.com
MPL AG www.mpl.ch
Umezawa Musen Denki http://www.umezawa.co.jp
Diamond Systems www.diamondsystems.com
PEAK System Technik www.peak-system.com
Unicorp www.unicorpinc.com
Douglas Electronics www.douglas.com
PC/104 and Small Form Factors www.smallformfactors.mil-embedded.com
Versa Logic www.versalogic.com
Dynamic Engineering www.dyneng.com/pc104.html
RAF Electronic Hardware www.rafhdwe.com
WinSystems www.winsystems.com
Listings as of 12/10/19; subject to change www.smallformfactors.com
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COMs and SoMs
FEATURES The new conga-TC370 COM Express Type 6 modules, the conga-JC370 embedded 3.5 inch SBCs, and the conga-IC370 Thin Mini-ITX motherboards all feature:
Faster Innovation and time to market
Ą The latest Intel® Core™ i7, Core™ i5, Core™ i3 and Celeron
With three optimized form factors for designers to choose from, congatec delivers a simpler, efficient way to harness the benefits of 8th Gen Intel® Core™ U-series processors for IoT. These products draw from congatec’s deep expertise in embedded and industrial design to offer an enriched feature set, along with long product availability, hardware and software customization, and value-added design support. As a result, OEMs and ODMs can build high-performing solutions with less development time and cost.
Ą The memory is designed to match the demands of consolidating
embedded processors with a long-term availability of 10+ years. multi OS applications on a single platform: Two DDR4 SODIMM sockets with up to 2400 MT/s are available for a total of up to 64GB.
Ą USB 3.1 Gen2 with transfer rates of 10 Gbps is supported
natively, which makes it possible to transfer even uncompressed UHD video from a USB camera or any other vision sensor.
Ą Supports a total of 3 independent 60Hz UHD displays with up
Performance at the edge Specially designed for embedded use conditions in which space and power are limited, 8th Gen Intel Core U-series processors provide high performance for edge devices with up to four cores. This enables a wide range of designs at 15W TDP, configurable down to 12.5W.
to 4096x2304 pixels as well as 1x Gigabit Ethernet (1x with TSN support).
Ą The new boards and modules offer all this and many more
interfaces with an economical 15W TDP that is scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in Turbo Boost mode).
congatec products based on these processors deliver high-quality visual, audio, and compute capabilities with integrated graphics and high-definition media support.
• Ensure exceptional graphics performance while helping lower BOM costs with integrated Gen 9.5 Intel® Graphics with up to 24 execution units.
• Deliver on rising expectations for video
performance with 4K/UHD content support, plus accelerated 4K hardware media codecs. Designs can support up to three displays.
• Develop media and video applications
with the Intel® Media SDK, which provides tools and an API enabling hardware acceleration for fast video transcoding, image processing, and media workflows.
• Create better audio experiences with enhanced speech and audio
quality from microphones, voice activation and wake from standby, and enhanced playback with Intel® Smart Sound Technology and Intel’s programmable quad-core audio DSP, designed for low power consumption.
congatec products based on 8th Gen Intel Core U-series processors also help bring artificial intelligence (AI) to more places. With high processing and integrated graphics performance, combined with the optimized Intel® Distribution of OpenVINO™ toolkit, these processors improve inference capabilities like facial recognition, license plate recognition, people counting, and fast and accurate anomaly detection on manufacturing lines.
www.congatec.us
congatec
www.congatec.us 12 ❙
Spring 2020
sales-us@congatec.com www.linkedin.com/company/congatec
PC/104 and Small Form Factors Resource Guide
858-457-2600 twitter.com/congatecAG
www.smallformfactors.com
SSD Module - SV250-7LP2 Apacer SV250-7LP2 (SATA Disk Module) is a super-mini industrial SSD module, utilizing 3D NAND for higher capacity up to 240 GB and provides more power efficiency than 2D NAND. Designed in SATA 6.0 Gb/s interface, SV250-7LP2 can deliver outstanding performance up to 560 MB/s in reading and 510 MB/s in writing, highly suitable to serve as operating system boot drive or storage media of important data. SV250-7LP2 features Apacer Multi-PowerPath technology that provides three methods to supply power to the host either via a conventional cable or cable-less design via pin7 or state-of-art 7+2 pin connector, which in turn offers developers maximum flexibility when it comes to board design. Moreover, the device adopts the latest page mapping file translation layer and thermal throttling function, making it a powerful yet compact solution for space-limited design. Regarding reliability, SV250-7LP2 is implemented with LDPC (Low Density Parity Check) ECC engine to extend SSD endurance and increase data reliability while reading raw data inside a flash chip. https://industrial.apacer.com/en-ww/SSD-SATA-PATA/SSD-Module
APACER MEMORY AMERICA INC.
FEATURES Ą Ą Ą Ą
Support TCG Opal 2.0/AES 256-bit encryption Low-Density Parity-Check (LDPC) Code Ą SMART Read Refresh™ Flash Translation Layer: Page Mapping Ą ATA Secure Erase Power Failure Management Ą DataRAID™
408-518-8699
https://industrial.apacer.com/en-ww
ssdsales@apacerus.com
Hardware and Peripherals
PCAN-PC/104 FEATURES:
Ą Form factor PC/104
Ą Multiple PC/104 cards can be operated in parallel (interrupt sharing) Ą 14 port and 8 interrupt addresses are available for configuration
using jumpers
Ą 1 or 2 High-speed CAN channels (ISO 11898-2) Ą Bit rates from 5 kbit/s up to 1 Mbit/s
Ą Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B
(29-bit ID) Ą Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 303-1) Ą NXP SJA1000 CAN controller, 16 MHz clock frequency Ą NXP PCA82C251 CAN transceiver Ą 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g., for external bus converter Ą Optionally available with galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Ą Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-1 www.smallformfactors.com
CAN Interface for PC/104 The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
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PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PCAN-PC/104-Plus FEATURES:
Form factor PC/104 Use of the 120-pin connection for the PCI bus Up to four cards can be used in one system 1 or 2 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Ą Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 303-1) Ą NXP SJA1000 CAN controller, 16 MHz clock frequency Ą NXP PCA82C251 CAN transceiver Ą 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g., for external bus converter Ą Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Ą Optionally available with galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Ą PC/104-ISA stack-through connector Ą Ą Ą Ą Ą Ą
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-2
CAN Interface for PC/104-Plus The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
Hardware and Peripherals
PCAN-PC/104-Plus Quad FEATURES:
Form factor PC/104 Use of the 120-pin connection for the PCI bus Up to four cards can be used in one system 4 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Ą Connection to CAN bus through D-Sub slot brackets, 9-pin (in accordance with CiA® 303-1) Ą FPGA implementation of the CAN controller (SJA1000 compatible) Ą NXP PCA82C251 CAN transceiver Ą Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Ą 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g., for external bus converter Ą Extended operating temperature range from -40 to 85 °C -40 to 185 °F) Ą Optionally available: PC/104-ISA stack-through connector Ą Ą Ą Ą Ą Ą
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-3 14 ❙
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PC/104 and Small Form Factors Resource Guide
Four-Channel CAN Interface for PC/104-Plus The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
www.smallformfactors.com
PCAN-PCI/104-Express FEATURES:
PCI/104-Express card, 1 lane (x1) Form factor PC/104 Up to four cards can be used in one system 1 or 2 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Ą Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 303-1) Ą FPGA implementation of the CAN controller (SJA1000 compatible) Ą NXP PCA82C251 CAN transceiver Ą Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Ą Supplied only via the 5 V line Ą 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g., for external bus converter Ą Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Ą Optionally available: PCI-104 stack-through connector Ą Ą Ą Ą Ą Ą
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-4
CAN Interface for PCI/104-Express The PCAN-PCI/104-Express card enables the connection of one or two CAN buses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
Hardware and Peripherals
PCAN-PCI/104-Express FD FEATURES:
PCI/104-Express card, 1 lane (x1) Form factor PC/104 Up to four cards can be used in one system 1, 2, or 4 High-speed CAN channels (ISO 11898-2) Complies with CAN specifications 2.0 A/B and FD (ISO and Non-ISO) CAN FD bit rates for the data field (64 bytes max.) from 20 kbit/s up to 12 Mbit/s Ą CAN bit rates from 20 kbit/s up to 1 Mbit/s Ą Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 303-1) Ą FPGA implementation of the CAN FD controller Ą Microchip CAN transceiver MCP2558FD Ą Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Ą CAN termination and 5-Volt supply to the CAN connection can be activated through a solder jumper Ą Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Ą Optionally available: PCI-104 stack-through connector Ą Ą Ą Ą Ą Ą
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-5 www.smallformfactors.com
CAN FD Interface for PCI/104-Express
The PCAN-PCI/104-Express FD allows the connection of PCI/104Express systems to CAN and CAN FD buses. Up to four cards can be stacked together. The CAN bus is connected via 9-pin D-Sub connectors to the supplied slot brackets. There is a galvanic isolation between the computer and the CAN side up to 500 Volts. The card is available as a single, dual, or four-channel version. The monitor software PCAN-View and the programming interface PCAN-Basic are included in the scope of supply and support the new standard CAN FD.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
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PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
High-Speed M.2 Carrier RTD’s new M.2 SSD storage solution leverages the PCIe/104 Type 2 connector to provide NVMe and SATA connections to the host CPU. Single (SSD24100HR) or dual socket (SSD24200HR) ordering options are available, with the dual M.2 option being particularly attractive to SWaP-sensitive applications which were formerly limited to 2.5" storage solutions. Sequential writes up to 1,405 MB/sec with Apacer’s NVMe M.2 SSD modules make the SSD24x00HR a perfect high-speed storage solution for RTD’s new 25 MSPS data acquisition module.
FEATURES Ą High speed SSD storage Ą Up to two M.2 sockets in the socket 3 configuration (M key) support Ą
Like all of RTD’s single board computers and peripheral modules, this M.2 carrier is designed and manufactured by RTD engineers in State College, Pennsylvania. Ruggedized enclosure options are available.
Ą
www.rtd.com
Ą
RTD Embedded Technologies, Inc. www.rtd.com
Ą
SATA and PCI Express SSDs SATA SSDs supported through AHCI with theoretical transfer rates up to 6 Gbit/s per SATA link (SATA revision 3.1) PCI Express SSDs supported through NVMe (Non-Volatile Memory Express) with theoretical transfer rates up to 985 MB/s per PCIe lane (PCIe revision 3.0) Transfer rates are device dependent and may be limited by the host cpuModule’s SATA controller Uses PCIe x4 links and SATA links from the host PCIe Type 2 cpuModule
sales@rtd.com
814-234-8087
IoT
Managed Scalable GigE Switch The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports. Eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides features for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH. www.rtd.com
RTD Embedded Technologies, Inc. www.rtdstacknet.com 16 ❙
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PC/104 and Small Form Factors Resource Guide
FEATURES Ą -40 to +85°C operation, passively cooled Ą PCIe/104 stackable bus structure Ą Eight 1000/100/10 Mbps Ethernet ports plus one host port and one
stacking switch expansion port
Ą Onboard tri-color LED for each Ethernet Port Ą RJ-45 jacks or 10-pin right-angle headers Ą Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet
processing • Support for all major Enterprise switching features such as VLANs, Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interface Ą Onboard PCI Express Ethernet Controller for interface to host cpuModule Ą USB Device Port for Serial Console command-line interface Ą Passive heat sink included • Available in stackable, rugged enclosures
sales@rtd.com
814-234-8087
www.smallformfactors.com
RTD Off-the-Shelf Mission Computer RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, mSATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integrity of the environmental seal.
RTD Embedded Technologies, Inc.
FEATURES Ą -40 to +85°C standard operating temperature Ą Designed for high ingress protection in harsh environments Ą Milled aluminum enclosure with integrated heat sinks and
heat fins
Ą Rugged Intel and AMD-based Single Board Computers Ą High-performance, synchronized power supply Ą mSATA card carrier and optional 2.5" removable drive Ą Designed to include an additional PCIe/104, PCI/104-Express
or PCI-104 peripheral module without increasing overall enclosure size
www.rtd.com
www.rtdstacknet.com/iot
sales@rtd.com
814-234-8087
SBCs and Boards
Industrial Single Board Computers ADL Embedded Solutions, Inc. offers a wide EDGE-CONNECT variety of embedded Single Board Computers 75mm x 75mm (SBCs) from the latest Intel® Core i7 to low-power Atom processors and come in many form factors including: ultrasmall 75mm x 75mm Edge-Connect SBC, PC/104 and 3.5" SBCs. Our design team has many years of experience designing Intel-based SBCs for wide-temperature industrial and military environments. Design capabilities include not only SBC board design, but also BIOS development and support, BIOS API, power management microcontrollers and firmware, wide temperature power supply design, test hardware, software and more. Custom SBC design services are also available for any processor chipset already in portfolio regardless of form factor.
ADL Embedded Solutions Inc. www.adl-usa.com www.smallformfactors.com
PC/104 95mm x 96mm
3.5" SBC 102mm x 147mm
EDGE-CONNECT 120mm x 120mm
FEATURES Ą Ą Ą Ą Ą Ą Ą
Ultra-small, compact sizes Industrial-grade Up to 15-year availability Wide operating temperature -40C to 75C ISO9001 manufacturing facilities Direct development and support of revision-controlled BIOS Full lifetime management including last time buy and extended lifetime support services www.adl-usa.com/products/embedded-sbcs/
sales@adl-usa.com 855-727-4200 @ADLEmbedded www.linkedin.com/company/adl-embedded-solutions
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IoT
PC/104 and Small Form Factors Resource Guide
SBCs and Boards
Intel Atom E3800-based SBC
The CMX34BT is an advanced PC/104 single board computer and controller with a PCIe/104 stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. The CMX34BTseries CPUs are available in quad-core, dual-core, and single -core configurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel DDR3 SDRAM and a 32GB industrial-grade surface-mount SATA flash drive. www.rtd.com
RTD Embedded Technologies, Inc. www.rtd.com/atom
FEATURES Ą PCIe/104 stackable bus structure Ą Available in modular, rugged enclosures and eBuild systems Ą Intel Atom E3800 Series Processor
Ą Ą Ą
Ą Ą
• Clock Speed: 1.33 GHz, 1.46 GHz, and 1.91 GHz options • Max. Core Temperature: 110°C 4GB Single-Channel DDR3 SDRAM (Surface-Mounted) 32GB Surface-mounted industrial-grade SATA flash drive 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 9 USB ports, Dual Gigabit Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/O -40 to +85°C standard operating temperature Thermal-optimized passive heat sink included sales@rtd.com
814-234-8087
Systems
PC/104 Rugged Chassis Systems The ADLMES9200 is a successor to ADL’s popular ADLMES8200 rugged chassis system. Design improvements include lower weight, lower cost, quick and reliable IP67 integration as well as rugged features including MIL-STD 810G shock and vibration and MIL-STD 461F/704F/1275D compliance capability. Our ADLMES9200 rugged chassis systems are ideal for SWaPconstrained military/defense applications for mobile, tactical, airborne and ground vehicles. Designed to survive MIL-STD 810 rugged environments, the ADLMES9200 can suit the needs of a broad range of rugged uses from the ground up.
APPLICATIONS: Military/Defense Ground Vehicles, Mission/Payload Computers, SWAP-constrained Embedded Systems for Mobile, Tactical, Airborne and Vehicle applications, Rugged industrial Oil and Gas, Mining and Construction and Commercial Unmanned Vehicles.
FEATURES Ą Ą Ą Ą Ą Ą Ą
Two Size Profiles Available IP7-rated EMC-Compliance Gasket Kit Passive Fanless and High-Power Conductive-Cooled Designs Space for 3x or 5x PC/104 Cards Uni-body design SWaP-Optimized for Size, Weight, or Power Constrained Applications Custom Solutions Available www.adl-usa.com/systems/rugged-systems/
ADL Embedded Solutions Inc. www.adl-usa.com 18 ❙
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PC/104 and Small Form Factors Resource Guide
sales@adl-usa.com 855-727-4200 @ADLEmbedded www.linkedin.com/company/adl-embedded-solutions
www.smallformfactors.com
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Connecting the global sensor ecosystem with emerging technologies and IoT for the manufacturing, automotive and transportation industries. World-class mutli-track congress and company networking areas for the sensor supply chain
300 Delegates
50+ Speakers
7500 Meetings
900 Exhibitors*
45,000+ Visitors*
Companies confirmed to participate include...
SPEAK • SPONSOR • EXHIBIT • ATTEND * Expected numbers of total participatesa at automatica and The Sensor Show † Standard congress delegate ticket price 799 EUROS
thesensorshow.com
+44 (0)1273 805366
20foPr free admission 2erw e-code You
Nürnberg, Germany
February 25 – 27, 2020
DISCOVER INNOVATIONS Over 1,000 companies and more than 30,000 visitors from 84 countries – this is where the embedded community comes together. Don’t miss out! Get your free ticket today!
Your e-code for free admission: 2ew20P
embedded-world.de/voucher @embedded_world
#ew20 #futurestartshere
Exhibition organizer
Media partners
r
.de / vouche
-world embedded
NürnbergMesse GmbH T +49 9 11 86 06-49 12 visitorservice@nuernbergmesse.de Conference organizer Fachmedium der Automatisierungstechnik
WEKA FACHMEDIEN GmbH T +49 89 2 55 56-13 49 info@embedded-world.eu