VITA Technologies Summer 15 Resource Guide

p. 6 Editor’s Foreword VPX eyes new frontiers

p. 18 Hall of Fame VITA technology 2015 inductees

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These six products join the over 135 standard and customized VME and VPX products shown on Orbit’s web portal at www.vmevpx.com. They are among the most advanced such components available today. All 6U System Health Monitors feature a unique, proprietary feature-rich GUI; Ethernet, USB and/or RS 232 interfaces; set-up; data logging; field upgradable firmware; and data password protection.

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Open VPX is a trademark of VITA. VPXtra is a trademark of Behlman.

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SUMMER 2015 | VOLUME 33 | NUMBER 2

@VitaTechnology

On the cover This issue of VITA Technologies explores how the newly ratified VITA 78 SpaceVPX Systems specification is opening new possibilities for the critical embedded computing industry. Also in this issue, the 2015 Resource Guide highlights technologies based on VITA standards, including rugged boards, systems, and related components, such as the 985023ANANWF1 for Meritec’s Hercules HDR 10Gb/s Interconnect System size 23 right angle to right angle with test head. Also featured on the cover: Annapolis Micro Systems’ Wild40 Seven Slot OpenVPX 3U Chassis and Mercury Computer Systems’ OpenVPX Ensemble.

DEPARTMENTS SpaceVPX: Ready to launch »» p. 12

By Jerry Gipper, Editorial Director

6 Editor’s Foreword

Jerry Gipper

VPX eyes new frontiers

8 Defining Standards

Jerry Gipper

AUVSI: Unmanned systems at the crossroads

10 VITA Standards Update

Jerry Gipper

VITA Standards Organization activity updates

26 Primetime Choices VITA Technology Hall of Fame 2015 Inductees »» p. 18

By Jerry Gipper, Editorial Director

29 Resource Guide Advertiser Index 3 2 23 7 20 9 55 6 5 21

Product teardown: Maximizing functionality through dual-node processing »» p. 24

By Jerry Gipper, Editorial Director

2 56 17 28 11

Annapolis Micro Systems, Inc. – WILDSTAR OpenVPX Ecosystem Behlman Electronics – Higher 6U power Creative Electronic Systems – Optimizing SWaP is our passion Dawn VME Products, Inc. – Rugged, Reliable and Ready Elma Electronic – Reduce, Save, Improve Excalibur Systems, Inc. – mil-1553.com GE Intelligent Platforms, Inc. – Rugged Capability Without Compromise Highland Technology, Inc. – Continuing our long term commitment to VME Interface Concept – Build your own VPX system LCR Embedded Systems – Rugged Systems Engineered for Your Application Orbit Electronics Group and Orbit Power Group – Higher 6U power; higher 6U health

monitoring performance

Pentek, Inc. – Got Tough Software Radio Design Challenges VadaTech Inc. – Pssst ... Can you keep a secret?

Vector Electronics & Technology, Inc. – VME/VXS/cPCI Chassis, Backplanes & Accessories VEROTEC Electronics Packaging – Verotec Integrated Packaging

All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2015 OpenSystems Media © 2015 VITA Technologies enviroink.indd 1

4 | VITA Technologies Resource Guide Summer 2015

10/1/08 10:44:38 AM

www.vita-technologies.com

VITA Technologies Editorial/Production Staff Jerry Gipper, Editorial Director jerry.gipper@opensystemsmedia.com Jennifer Hesse, Managing Editor jhesse@opensystemsmedia.com

Steph Sweet, Creative Director ssweet@opensystemsmedia.com

Sales Group Regional Sales Managers Barbara Quinlan, Southwest bquinlan@opensystemsmedia.com (480) 236-8818 Denis Seger, Southern California dseger@opensystemsmedia.com (760) 518-5222 Sydele Starr, Northern California sstarr@opensystemsmedia.com (775) 299-4148 Europe Sales James Rhoades-Brown james.rhoadesbrown@husonmedia.com

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Corporate Patrick Hopper, Publisher phopper@opensystemsmedia.com Rosemary Kristoff, President rkristoff@opensystemsmedia.com John McHale, Executive Vice President jmchale@opensystemsmedia.com Rich Nass, Executive Vice President rnass@opensystemsmedia.com Wayne Kristoff, CTO

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VITA Technologies Resource Guide Summer 2015 |

5

Editor’s Foreword

By Jerry Gipper, Editorial Director @VitaTechnology

jgipper@opensystemsmedia.com

VPX eyes new frontiers On my way home from the March VSO meeting held in Melbourne, Florida, and hosted by the Harris Corporation, I took some time to stop by the Kennedy Space Center. VITA Technical Director Jing Kwok and I boarded the bus to tour around the space center for the afternoon. I have taken this tour two previous times, first in 2000 and most recently in January 2012 as part of the Embedded Tech Trends media tour. In 2000, when I went with my family, the center was bustling with activity, wrapping up the day with the nighttime launch of the Opportunity Mars rover.

During my 2012 tour, the space center was quiet. The shuttle program had recently Highland Technology shut down, and they were in the process of relocating the shuttles to their permanent VITAinSummer insert resting places museumsIssue around the country. There was still launch activity, but the 04/01/15 energy level was down, and SpaceX renovations were in the early stages.

NOTE: KEYLINE DOES NOT PRINT Fast-forward to March 2015 and you can easily see the changes. The energy is back!

Pads 39ATRIM and 39B of shuttle fame are in varying stages of rebuilding. 39A is nearly as shown done, and 39B is ready for the new launch frame to be installed. NASA has been

busy issuing contracts for services to further study, rehabilitate, modernize, and develop new and existing civil infrastructure and facilities at Kennedy Space Center, Cape Canaveral Air Force Station in Florida, Vandenberg Air Force Base in California, and other NASA assets, including launch or landing sites worldwide.

We stopped by the new Atlantis shuttle display at the Kennedy Space Center.

This was my first up-close encounter with a shuttle, having only seen it from afar sitting on its 747 carrier at Edwards Air Force Base in 1982. It is an amazing, must-see exhibit.

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6 | VITA Technologies Resource Guide Summer 2015

www.vita-technologies.com

“WITH COMMERCIAL SPACE TRAVEL RAMPING UP AND THE SPACEVPX SYSTEMS SPECIFICATION NOW PUBLISHED, WE MAY SOON GET A CHANCE TO SEE VPX IN ACTION ON AN

What is even more exciting is the fact that other segments of the defense industry are looking at a VPX base platform for their mobile applications. VITA’s newest sponsor member, the Communications-Electronics Research, Development and Engineering Center, more commonly known as CERDEC, is interested in developing specifications for a converged architecture during the FY14-17 timeframe. This promises to be innovative times for VPX applications.

Also in this edition of VITA Technologies is the announcement of the latest round of inductees into the VITA Technologies Hall of Fame. Read how these innovators and technologies are contributing to the success of our industry. Be sure to submit your own nominees for consideration in 2016.

Jerry Gipper jgipper@opensystemsmedia.com

UPCOMING MISSION.”

We had the chance to talk to a docent working the shuttle display. While examining the Canadarm we wondered about the extension that was mounted to the cargo bay. The docent explained that NASA had added the extension after the Columbia explosion so that the shuttle could undergo an extensive Flight Day 2 self-inspection of the external tiles and heat shields. This led to a discussion on the whole incident with our guide who was on the team assigned to gather data for the report.

If you like space travel, this report makes for great reading. The level of detail in the report is amazing, especially if you like space science. You will learn a lot about the incident and how NASA works in general. For more information, see www.nasa.gov/columbia/home/CAIB_ Vol1.html.

This all brings me back to one of our features in this issue, SpaceVPX: Ready to launch. While Jing and I were admiring Atlantis, we started discussing what a SpaceVPX system might look like and what it might do on space missions. With commercial space travel ramping up and the SpaceVPX Systems specification now published, we may soon get a chance to see VPX in action on an upcoming mission. Read the feature to get a better understanding of what has been accomplished. We are already making plans to return to the Kennedy Space Center after the March 2016 VSO meeting. www.vita-technologies.com

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(510) 657-4444 dawnvme.com VITA Technologies Resource Guide Summer 2015 |

7

Defining Standards

By Jerry Gipper

AUVSI: Unmanned systems at the crossroads I attended the Association for U­nmanned Vehicle Systems International (AUVSI) Unmanned Systems 2015 show in Atlanta in May. It was my first visit to this event, which is much heralded by VITA members. From what I could tell, I came to the conference at an inflection point for the industry of unmanned vehicle systems.

AUVSI is an international nonprofit organization dedicated to promoting and supporting the unmanned systems and robotics industry. For most of the 40-plus-year history of this organization, the driving market was military applications of unmanned vehicles, primarily because it was one of the few industries that had both the need and resources to spearhead the development that was possible with available electronics technology. But now all of that has changed, with electronics becoming so ubiquitous and inexpensive, a whole new wave of capabilities has emerged.

The members of AUVSI recognized and acknowledged this shift by renaming the event XPONENTIAL. In a press release at the show, AUVSI stated, “We are at an exciting inflection point today, where advancements in technology are allowing us to build upon our noble heritage of protecting citizens around the world. XPONENTIAL captures the potential of this industry, and defines our commitment to you – now and into the future.

Serving as the intersection for commercial and defense applications, and advancing all domains collectively, XPONENTIAL is committed to serving as your ultimate industry brand experience.”

I ran into a longtime associate, David French of GE Intelligent Platforms, who acknowledged the changing atmosphere at this year’s event. In a post on the GE website (www.geautomation.com/blog/auvsi-day-3-sparking-unmanned-evolution), he commented that, “It is remarkable to see the unmanned systems market shift from what had traditionally been the purview of the military to a fast and growing commercial must-have capability. Commercial unmanned system suppliers and technology providers at this year’s AUVSI event now represent probably 80 percent to 90 percent of the show floor real estate.”

He also pointed out that the demonstrated applications were varied but tended to revolve around agribusiness, critical infrastructure inspection, news surveillance, search and rescue, entertainment, basic science, and other applications. The majority of platforms displayed were unmanned aerial systems (UAS), and the overwhelming form factors were relatively small UAS platforms.

AUVSI is excited about the future for unmanned systems of all types, announcing that the market is poised for explosive growth. The industry and regulators have opened unprecedented dialogue. Speakers at the opening keynote agreed that there is a potentially huge market for unmanned aircraft, and they are able to fly and accomplish more than what was possible just a few months ago.

While the industry is mobilizing to explore the seemingly endless possibilities ­available, many obvious challenges still exist. The Federal Aviation Association (FAA) has been developing rules for the operation and certification of small, unmanned ­aircraft systems. According to the FAA, “this rulemaking would adopt specific rules for the operation of small unmanned aircraft systems in the National Airspace System. These changes would address the classification of small unmanned aircraft, certification of their pilots and visual observers, registration, approval of operations,

8 | VITA Technologies Resource Guide Summer 2015

and operational limits in order to increase the safety and efficiency of the National Airspace System.”

Agencies in countries around the world are frantically addressing the issues of unmanned vehicles of all types. After recent intrusions by drones, police departments are studying technology to detect and capture drones. For example, the Tokyo police department has plans to study whether it is possible to capture suspicious drones using police drones carrying nets. Other agencies are studying the use of security cameras that detect the heat of drone batteries and motors, and are employing technologies for identifying flight sounds, even looking at a method of blocking drone radio control by jamming signals.

Some states are studying or passing legislation giving landowners the right to shoot down drones, though this is not a realistic option due to technical difficulty and safety concerns.

What does this mean for VITA technology suppliers? First, the demand for unmanned vehicles of any type is just beginning and will remain significant long into the future, requiring a strategy rethink for many companies. Second, given that size, weight, and power (SWaP) sensitivity is critical to success, small form factors are a must. Third, devices must be as autonomous as possible with onboard intelligence and sensing to make them as safe as possible, demanding more processing and better sensor performance. And finally, although the defense market remains a major player, it is starting to take a secondary role to commercial applications that have less stringent demands on reliability and performance, leading to reconsideration of target markets for some suppliers. To me, this indicates that there is still much work to be done in the creation of standards for critical embedded systems. www.vita-technologies.com

VITA Standards Update

By Jerry Gipper jgipper@opensystemsmedia.com

VITA Standards Organization activity updates The Harris Corporation hosted the March VITA Standards Organization (VSO) meeting in Melbourne, Florida. After an especially harsh winter in the Northeast, several attendees arrived early and stayed for the weekend. Many were reluctant to return to the snow still on the ground. More than 40 people were in attendance to participate in status updates and several working group discussions. This update is based on the results of that meeting.

Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (www.vita.com) for details on upcoming VSO meetings.

ANSI accreditation

VITA 17.1: Front Panel Data Port (FPDP)

Accredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, the VSO provides its members with the ability to develop and promote open technology standards. The VSO meets every two months to address embedded bus and board industry standards issues.

Objective: This standard defines a multi-drop synchronous parallel non-addressable bus connection between multiple boards in a single chassis. Extension specifications define protocols for specific use cases.

VSO study and working group activities Standards within the VSO may be initiated through the formation of a study group and developed by a working group.

A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members.

Status: ANSI/VITA 17.1 was opened up for minor edits and has completed the process for re-accreditation. A VITA 17.3 working group was formed recently to incorporate the Interlaken protocol for packet transfers scaling from 10 Gbps to 100 Gbps.

ANSI/VITA 42.0: XMC Switched Mezzanine Card Base Specification Objective: This standard defines a PMC form factor with open standard switch fabric interconnects.

Work in progress Several working groups have current project work underway; the following roundup summarizes those projects.

E-CAST Keeping it cool: Solving military electronics thermal management challenges Presented by Kontron This presentation focuses on the principle techniques for thermal management, their relative efficiencies, and examples of real world solutions. Some rules of thumb will be presented that can be used by the non-expert for estimating maximum system temperatures under various conditions.

GO TO E-CAST: ECAST.OPENSYSTEMSMEDIA.COM/550

10 | VITA Technologies Resource Guide Summer 2015

Status: Currently being modified to allow the use of solder ball XMC connectors.

VITA 46.11: System Management on VPX Objective: This standard defines a system management architecture for VPX systems.

Status: Currently in “VITA Draft Standard for Trial Use” status. The specification was approved for submission for ANSI accreditation.

ANSI/VITA 49.x: VITA Radio Transport (VRT) Objective: The VITA Radio Transport (VRT) standard defines a transport-layer protocol designed to promote interoperability between radio frequency receivers and signal processing equipment in a wide range of applications. The VRT protocol provides a variety of formatting options allowing the transport layer to be optimized for each application. The ANSI/VITA 49.1 VITA Radio Link Layer (VRL) standard specifies an optional encapsulation protocol for VITA 49.0 (VRT) packets.

Status: The working group has completed revisions to VITA 49.0 and VITA 49.1; both were approved to be submitted for ANSI accreditation. The VITA 49a working group has completed a document for control packet and spectrum analyzer packet specifications and has voted to submit for ANSI accreditation. www.vita-technologies.com

VITA 57.4: FMC Objective: The goal of this project is to develop a next-­ generation specification calling for a new set of connectors to support higher-speed serial interfaces.

Status: The working group has reviewed connector options and is working on a draft specification.

ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX architectural framework specification is a living document that is continuously being updated with new profile information and corrections.

Status: The working group is currently receiving input on new profiles for the next edition. A proposal was presented to enable the working group to incorporate profiles into the specification faster and more effectively.

VITA 66: Optical Interconnect on VPX – Half Width MT Objective: The VITA 66 base standard defines physical features of a stand-alone compliant blind mate Optical Interconnect for use in VPX systems. This standard defines a Half Width MT style contact variant.

Status: The working group has submitted VITA 66.4 for ANSI balloting, the final step to an approved specification.

VITA 67.3: VPX: Coaxial Interconnect, 6U, Four Position SMPM Configuration Objective: This specification details the configuration and interconnect within the structure of VITA 67.0, enabling a 6U VPX interface containing multi-position blind mate analog connectors with up to four SMPM contacts.

Status: The working group has begun work on the draft specification.

family and the commercial infrastructure that supports these standards.

Status: Approved by ANSI and posted to the VITA store for purchase.

VITA 79-Embedded Photonics Objective: This working group is chartered with developing a standard based on work done by the JEDEC 13.6 subcommittee for photonics. This is the first step in preparing a series of projects to address using optical backplane technology in the future.

Status: The working group is currently working on developing an environmental qualification document that encompasses complimentary features from various U.S. and European standards.

Participating in these working groups is a great way to influence the direction of the next generations of technology important to the critical embedded computing industry. Contact VITA if you are interested in participating in any of these working groups, and for details on upcoming VSO meetings.

Copies of all specifications reaching ANSI recognition are available from the VITA website. For a more complete list of VITA specs and their status, go to www.vita.com/Specifications.

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VITA 68: VPX: Compliance Channel Objective: This standard defines a VPX compliance channel including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This allows backplane developers to design a backplane that supports required Bit Error Rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane.

Status: The working group has developed a simulated model and is now collecting actual performance data to help refine the models when the specification goes to “Trial Use” status.

Shielded and unshielded front panels and modules

Card cages 3U to 9U

VITA 78-NGSIS: SpaceVPX Systems Objective: This document describes an open standard for creating high-performance, fault-tolerant, interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-availability applications. Such systems will support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards www.vita-technologies.com

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11

MAIN FEATURE

SpaceVPX: Ready to launch

By Jerry Gipper

The Sentinel-1 satellite carries advanced radar instrumentation that provides allweather, day-and-night images of Earth’s surface. Photo courtesy of the European Space Agency (ESA)/ATG medialab.

In April, VITA announced that VITA 78 SpaceVPX Systems had reached ANSI recognition as ANSI/VITA 78.00-2015.

The working group dedicated to the development of VITA 78 completed the VITA and ANSI processes, reaching full recognition under guidance of the VITA Standards Organization (VSO). What is this new specification? What does it mean for the critical embedded computing industry? Let’s take a look at how this specification originated.

More than three years ago, a group of industry and government representatives focused on providing high-­ performance and highly efficient critical embedded computing solutions for customer needs launched the effort to define the Next-Generation Space Interconnect Standard (NGSIS). The initiative aimed to leverage existing commercial open standards to provide cost savings across the life cycle of space programs.

VITA 78 SpaceVPX was initiated to change the paradigm by which the space community conducted its acquisition of new technologies and systems.

VITA 78 adopted OpenVPX (VITA 65) as its baseline architectural framework to develop an enhanced set of module and backplane specifications based upon existing commercial standards with added features required for the space community and its applications. It also focused on increasing interoperability

and compatibility between manufacturers and integrators, while simultaneously boosting affordability through the use of standard sets of hardware.

Driving factors Before VITA 78, the industry was struggling with how to move forward with certain embedded computing platform issues that had presented challenges for many years.

Industry leaders asked themselves, “Is it cost-effective to continue using legacy space electronics?” Systems had been developed and deployed in space via the same methods for many years; why not just keep doing it the same way?

Several factors posed concerns to the architects of these complex systems: ›› Legacy space systems were often point solutions, designed for very specific missions with no real intention of meeting additional goals of other existing programs. ›› Reuse was not a priority because of precise mission design goals. The platforms could not be readily reconfigured for new or changing missions. ›› Systems did not have the full range of redundancy options (dual-string, M-of-N, etc.) built in as part of the overall architecture. As a consequence of this failure to engineer redundancy and resiliency initially, the provider was forced to add these features in a piece-by-piece fashion. ›› Internal interfaces were often proprietary and application-specific, leading to additional costs and development time. Commercially and commonly available interfaces often were not considered due to concerns about reliability or availability.

12 | VITA Technologies Resource Guide Summer 2015

www.vita-technologies.com

›› Modules were not designed to interoperate at either the hardware or software level.

Silos of technology that prevented programs from sharing platforms, mission requirements, and schedules were different enough that no one wanted to take the time to look into where components might be used in the future.

Many if not all of these factors were tolerated given the alternatives. Development schedules were set with systems that agencies expected to be delivered mission-capable and on time. In the background, pressure was mounting to reduce overall cost through reduction in development and acquisition. Deployed experiments with inexpensive computing elements were starting to have successes. Cost reductions and time-tomarket pressures were relentless.

Enter VPX The VPX concept was proposed in 2003.

It was originally intended to be a small form factor blade using the current switch serial fabric interconnects. Even at the launch, the forefathers were not sure where the efforts were going to lead.

Even more improvements and enhancements emerged as systems were deployed, with the most recent example being work nearing completion on system management (VITA 46.11) and a modular power supply standard (VITA 62).

Slowly, to use a space themed cliché, “the stars were starting to align.” VPX had been evolving with improvements to the overall framework, system management, interoperability, and functionality. In the background were industries ready to take advantage of this alignment. Visionaries working on space and other critical embedded systems needing a high degree of fault tolerance saw what VPX had to offer. The small size made it a great choice for size, weight, and power (SWaP)-limited platforms. The topology flexibility meant that they could conceive a configuration that more closely met their application goals.

Fault-tolerant configurations were possible with various mesh topologies that enabled various types of redundancy either with dual strings and multiple levels of backup components. The open systems/open markets approach of VITA members meant that new efforts would be embraced that leveraged the best that VPX and VITA had to offer.

Goals and attributes The SpaceVPX effort was initiated to develop an enhanced set of backplane specifications that were based upon existing commercial standards with added features required for space applications. Another objective was to expand interoperability and compatibility between manufacturers and integrators, while also increasing affordability through the use of standard sets of hardware.

The developmental goal of SpaceVPX Systems was to achieve an acceptable level of fault tolerance while maintaining reasonable compatibility with the OpenVPX architectural framework and VPX components, including connector pin assignments. For the purposes of fault tolerance, a module was defined to be the minimum redundancy element.

The major fault-tolerance attributes for the target high-reliability applications included:

The specification was extremely open, leaving room for nearly any existing or future switch serial fabric to be implemented as an interconnect structure.

This meant that numerous configurations were possible, which quickly led the implementers to launch the OpenVPX effort to develop an architectural framework that could help provide topology guidance to system architects.

The nearly infinite number of configuration combinations, while attractive to a system architect who was not sure of the best topology for their needs, was dragging down the board and system supply chain that could not determine the moving sweet spot of configurations. No one supplier was big enough to drive an industry-wide accepted set of configurations, and no demand-side user wanted to step up and drive the industry. The OpenVPX architectural framework provided the much-needed configuration focus. www.vita-technologies.com

›› Dual-redundant power distribution (bussed), where each distribution is supplied from an independent power source ›› Dual-redundant utility plane signal distribution (point-to-point cross-strapped), where each distribution is supplied from an independent system controller to a module that selects between the A and B system controllers for distribution to each of the slots controlled by the module ›› Card-level serial management ›› Card-level reset control ›› Card-level power control ›› Dual-redundant data planes ›› Dual-redundant control planes ›› Fault-tolerant utility plane selection (bussed) ›› Power-feed profile with unique keying ›› Timing/synchronization/clocks, matched length, low-skew differential timing As a result of analyzing these factors, the VITA 78 Working Group successfully ­executed the focus of the SpaceVPX effort and composed a specification to fulfill its purpose.

What is SpaceVPX? ANSI/VITA 78 defines an open standard for creating high-performance, fault-tolerant, interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-availability applications. Such systems support a wide variety of use cases and potential markets across the aerospace and terrestrial communities. The standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.

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MAIN FEATURE

Typical use case and essential elements Figure 1 captures the essence of a SpaceVPX system. Each box represents one module function. The main data flow in most space systems is shown by the blue boxes, typically implemented as payload modules. Any of the four functions can be combined into a specific payload implementation. The properties of this use case follow the circled letters in the figure.

A) Data enters the system through a data in module. The next four letters represent potential data transfers between the main payload functions within a SpaceVPX system.

I

A

›

F

Primary

Power Module

Data In Module

Processing Module

Storage Module

Data Out Module

Controller Module

Control Switch Module

Data Sync Module

G

SpaceUM Module

SpaceUM Module

SpaceUM Module

Data Sync Module

Controller Module

Data Out Module

Storage Module

Processing Module

Data In Module

B

Control Switch Module

C

Power Module

›› Address not only interoperability, as OpenVPX does, but also space application needs that are not a part of OpenVPX. ›› Define payload, switch, controller, and backplane module profiles to meet space application needs. ›› Add features to the utility plane for fault tolerance: – P oint-to-point not bussed to tolerate faults: A failure of a module does not affect the entire system. The meshed network of modules provides multiple strings to eliminate path failures. The system also can be scaled with redundant modules to the degree necessary to gain acceptable fault tolerance for the mission at hand.

– S pace Utility Management (SpaceUM) module provides a dual-redundant source for utility plane implementations. ›› Define use of SpaceWire for the control plane instead of Ethernet, the preferred choice for OpenVPX. SpaceWire is a standard for high-speed links and networks for use onboard spacecraft (www.spacewire.esa.int/content/ Home/HomeIntro.php). ›› Promote standard components, interoperability, accelerated development, and deployment for the space market.

E

D

SpaceUM Module

SpaceVPX bridges VPX standards to the space market by accomplishing the following purposes:

H

Redundant

Figure 1 | SpaceVPX system use case

B) Data from the data in module can be transmitted to the processing module.

Processed data from the processing module can be stored in the storage module. Data from the storage module can be routed to the data out module.

C) The processor module can access data from the storage module.

D) Data from the data in module can be routed directly to the storage module.

Data from the processing module can be routed directly to the data out module.

E) Data from the data in module can be routed directly to the data out module.

F) Data routed to the data out module can then be transmitted out of the system.

G) For fault tolerance, there is at least one spare of each function. These redundant payloads have the same data routing as the primary payloads so that errors will not reduce capabilities. Though not shown, more than one of each function type can be present, and M-of-N sparing (minimum 1 of 2) can be implemented for any payload type.

H) Redundant external inputs and outputs are available to and from the SpaceVPX system. These are typically cross-strapped between redundant elements.

I) Cross-strapping is available between the primary and redundant payload groups so that any one payload can fail and the remaining payloads can operate with sufficient interconnect for any combination of primary and redundant elements.

Fault tolerance The SpaceUM module facilitates the fault-tolerance capability in SpaceVPX. A traditional VPX system controller controls utility plane signal distribution to all the logic modules. As shown in Figure 2, each system controller routes identical copies of utility plane signals (for example, resets, reference clocks, and so on) to each active SpaceUM module.

Since each SpaceUM module supports the utility plane selection of up to two (3U) or eight (6U) logic modules, a SpaceVPX system supports up to four SpaceUM modules. The SpaceUM modules then select which set of utility plane signals to route to each logic module. The default OpenVPX routing of these utility plane signals are via busses, which introduce single-point failures between the modules. Fault tolerance is enhanced with the separate radial distribution of the selected utility plane signals to each module. The SpaceUM module is unique to SpaceVPX. Utility plane power connections are also routed through the SpaceUM modules in a SpaceVPX system. The utility plane power connections consist of at least dual power modules to provide power to the SpaceVPX system. The SpaceUM modules individually select and separately route the resulting module power selection for each logic module. The A/B selection can be internal (autonomous) or external.

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C

A

E

C

A

E

Primary

›

B

Power Module

Data In Module

Processing Module

Storage Module

Data Out Module

Controller Module

Control Switch Module

Data Sync Module

SpaceUM Module

SpaceUM Module

SpaceUM Module

SpaceUM Module

Data Sync Module

Control Switch Module

Controller Module

Data Out Module

Storage Module

Processing Module

Data In Module

Power Module

D

Redundant

Figure 2 | SpaceVPX system use case showing system controller and utility plane connections

Fault tolerance is provided by fault containment between redundant sections of each SpaceUM module. OpenVPX supports a single power mode for each plug-in logic module. SpaceVPX maintains this by moving the power selection into the SpaceUM module.

As shown Figure 2, the system controller manages the utility plane signals in a SpaceVPX system.

A) SYS_CON* and SYS_CONP* provide a fault-tolerant selection for plug-in modules that could be system controllers.

B) Controller modules distribute copies of the system control and reference clocks to each active SpaceUM module.

C) SpaceUM modules use the system controller select signals (either external or internally generated) to select which set of system control and reference clocks to distribute to logic modules.

D) SpaceVPX supports switching of up to 32 6U logic modules using up to four SpaceUM modules, each handling eight logic modules. In this figure, only two SpaceUM modules are needed to support the 14 logic modules. If more than two logic modules were added to this system, the third SpaceUM would be required for the 17th through 24th module, and the fourth SpaceUM would be required for the 25th through 32nd modules. A 3U SpaceUM module supports only two logic modules. Since the SpaceUM modules are simply extensions of the controller, payload, and power modules, no redundancy is required.

E) The SpaceUM module distributes the utility signals to all other logic modules including payloads, data switches, and control switches.

Benefits to customers and vendors Performance SpaceVPX provides significantly higher data rates and topology configurability supported by NGSIS through a standard engineered product compared to traditional space interconnect architectures such as MIL-STD-1553, SpaceWire, serial RapidIO, and CompactPCI. The standard also allows implementers to trade off redundancy for performance in accordance with their specific system needs.

Flexibility Based on the highly configurable Modular Open System Approach (MOSA) architecture, SpaceVPX supports both common 3U and 6U form factors with a wide range of modules and configuration options to allow mission-specific customization.

Affordability Leveraging and extending existing modern standards provides a significant pay down of technical debt compared to more traditional approaches for space systems www.vita-technologies.com

development (and other recent space standards efforts) based on custom and proprietary architectures. The maturity of the base standards significantly reduces the cost, risk, and schedule for the non-recurring engineering efforts associated with the development of custom modules.

Furthermore, designers have the capacity to leverage existing reference designs and intellectual property components in custom implementations. The approach potentially enables the use of ruggedized commercial off-the-shelf modules in future space systems with appropriate environments, resulting in a corresponding reduction in development costs and schedules.

Interoperability The a priori definition of the interface specifications contained in the standard offers several interoperability benefits. This breaks down the traditional stovepipe and associated challenges of interface management by providing a well-defined common interface that allows for conformance verification without a complete system.

Additional potential benefits include: ›› Specific design profiles upon which vendors can base their designs and integrators can specify as requirements. ›› Reduced integration issues resulting in faster development and deployment time. ›› Higher board volumes that produce economies of scale. ›› Higher velocity of technology upgrades. ›› Support for higher backplane signaling speeds as technology matures.

Addressing market needs These benefits demonstrate how SpaceVPX addresses the aforementioned driving factors propelling the development of an open standard for backplanes and modules used in space applications.

Systems were originally tightly coupled with proprietary integration schemes, and changes were costly and involved high risk. Open system architecture

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MAIN FEATURE guidelines and the SpaceVPX standard deliver a loose coupling between hardware and software, making changes easier at a much lower risk. Systems can now be designed for change. Table 1 compares some of the significant differences between the VPX and SpaceVPX specifications.

Hardware reuse was less attractive because system cost was dominated by non-recurring engineering costs that were much greater than the hardware.

A SpaceVPX open architecture strategy drives these costs down because system integration is much easier and entails lower risk.

Prime contractors had a central role for the life of the system, which limited design and mission flexibility. Sole sourcing also stifled competition, keeping costs high. An open architects/open markets approach provides more solutions to choose from a competitive supplier base.

A large and robust ecosystem of suppliers and users ensures that the technology moves forward with the best of the best capabilities. SpaceVPX brings traditional make versus buy advantages to what was previously a closed

community (other industries embraced the buy decision years ago).

compared to the SpaceVPX base standard that results in a smaller SWaP-C footprint for deployment.

SpaceVPX current status The ratification of VITA 78 SpaceVPX Systems was a huge milestone for the working group members. Now begins the work of building an ecosystem of suppliers and users. Multiple VPX vendors have shown interest in supplying products based on the SpaceVPX specification. Though public announcements have yet to be made, rumors are circulating that prototype products could be available as early as Q3 or Q4 of 2015.

Demand is very active. Multiple large programs are developing SpaceVPX strategies. Multiple NASA centers have evaluations underway for adoption of both 6U and 3U formats. The European Space Agency (ESA) has shown interest, as well as multiple tier I and tier II vendors.

Additional work is still needed with SpaceVPX. The VITA 78 Working Group has already started work on SpaceVPX Lite, which defines a lightweight implementation with significant advantages in SWaP-C for 3U module systems.

It is “lightweight” with respect to the reduced scope of requirements

Systems developers often implement 3U modules when confronted with driving SWaP-C constraints. The SpaceVPX base standard implementation for 3U results in a much larger ratio of support modules to payload modules than for a 6U implementation. The SpaceVPX Lite specification defines a reduced support module to payload module ratio by removing some base standard features while retaining critical requirements necessary to deploy a single-point ­ failure-tolerant system.

SpaceVPX Lite has the following differences with SpaceVPX: ›› SYSRESET*, AUX_CLK±, and REF_ CLK± are driven from redundant controller modules directly to payload modules. ›› SpaceVPX defined REF_CLK1± and REF_CLK2± pins on payload modules are used as secondary AUX_CLK± and REF_CLK±, respectively. OpenVPX Maskable Reset* on payload modules are used as secondary SYSRESET*.

VPX

VPX with VITA 46.11

SpaceVPX 6U

SpaceVPX 3U

Clocks generation

2 bussed

2 bussed

4 radial

2 radial

Clocks receipt

2 inputs

2 inputs

4 inputs

4 inputs

4 pins bussed

4 pins – either bussed or radial

4 pins radial

4 pins radial

SM I/F receipt

4 pins

4 pins – IPMC single or dual port

4 pins IPMC or DAP single port

4 pins IPMC or DAP single port

SM I/F extensions

none

none

reset, status for recovery

reset, status for recovery

Power switching

on/off on card under SM control

on/off on card under SM control

on/off on card under SM control

on/off on card under SM control

A/B and on/off on SpaceUM under SM control

A/B and on/off on SpaceUM under SM control

SM I/F generation

Power supplies

Logic module system

›

VITA 62

VITA 62

VITA 62 A&B or MOD6-PSC-10T-12.7.1 A&B

VITA 62 A&B

SM interface

SM interface

SM interface

SM interface

1 PS 2 controller

1 PS 2 controller

2 PS 2 controller

2 PS 2 controller

6 logic

6 logic

6 logic 1 SpaceUM

6 logic 4 SpaceUM

9 slots Limited fault tolerant

9 slots Limited fault tolerant

11 slots Full fault tolerant

14 slots Full fault tolerant SM = System Manager

Table 1 | Key differences between VPX and SpaceVPX specifications

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›› Redundant controller modules provide eight sets of two new userdefined differential pairs that can be driven to each of eight payload modules. These can be defined as controls to switch in redundant power sources, additional clocks, or specific application-defined signals. ›› Power supply on/off, primary/ secondary controls are not defined in SpaceVPX Lite. ›› Radially distributed system management is not defined in SpaceVPX Lite. ›› SpaceVPX Lite does not define a SpaceUM module, but it does support the use of a similar power-only module and system management bus communication with the system controller module using the SpaceVPX Direct Access Protocol or VITA 46.11 System Management.

A SpaceVPX Lite-compliant system meets the basic requirements of providing radial and redundant OpenVPX utility signals SYSRESET*, AUX_CLK±, and REF_CLK± to achieve single fault tolerance. Implementation of single fault-tolerant power distribution to the modules is deferred to the user to define, but the standard does provide radially distributed user-defined signals to enable redundant power control.

These signals can be used with new or high TRL existing power distribution modules and/or sources.

A standard for building open platforms “We are pleased that SpaceVPX Systems has received VITA/ANSI recognition,” said Patrick Collier, senior electrical research engineer, Space Communications Program, AFRL Space Vehicles and VITA 78 Working Group chair. “We were able to pull together the minds of engineers from companies around the world that have a vested interest in developing this specification for the space industry.”

Other application segments are looking at this model to determine the best steps forward. Rugged ground vehicles have many of the same requirements, yet they have unique needs. VPX and the VITA process are just the technology and support system that the industry needs to develop variations of their own. www.vita-technologies.com

The openness of VPX originally scared people, but in reality, it is providing a proven alternative for custom solutions. Mass customization is the use of well-defined modules, either hardware or software, that enables a system architect to develop an integrated platform that is both unique and commercial. A modular mass-customization strategy combines the best of an open-modular approach with the ability to tune the architecture to meet a wide variety of very specific or custom needs – all while being cost-effective.

We all look forward to attending the first launch of a space system based on SpaceVPX systems!

Copies of the specification are available for purchase at the VITA Online Shop (http://shop.vita.com/).

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SPECIAL FEATURE

Eike Waltz Kim Clohessy

VITA Technology Hall of Fame 2015 Inductees Kim Clohessy Kim Clohessy was a founding vice president of Dy 4 Systems in Ottawa, where he was recruited from Bell Northern Research. Dy 4 Systems, which was formed in 1979, specialized in the design and manufacture of high-end VMEbus open architecture computer systems for the aerospace and defense industry.

Kim helped Dy 4 Systems grow successfully before leaving in 1992 to move to Scottsdale, Arizona, as a consultant for Ottawa-based Object Technologies and as vice president of Embedded Systems at IBM. In 2000 he transferred to Perth, Australia, where he soon resigned from IBM to form a new company.

During the early 1990s, Kim did much of the heavy lifting in terms of editing the work being done on the second generation of the VMEbus specification. He was an avid sailor and diver who enjoyed sailing and racing on the Swan River and the Indian Ocean.

Kim passed away in 2006 at 52 years of age, after a short battle with melanoma.

Key contributions ›› 1990: Kim joined Doug Patterson as Mil-Spec Study Group co-chair. ›› 1991: VME64 (1014 Rev. D) was introduced and submitted to IEEE, raising the theoretical bus speed from 40 MBps to 80 MBps. The IEEE granted project authorization request (PAR) for P1014R (revisions to the VMEbus specification). Kim co-chaired the activity with Ray Alderman, technical director of VITA. ›› 1992: Additional enhancements to VMEbus (A40/D32, Locked Cycles, Rescinding DTACK*, Autoslot-ID, Auto System Controller, and enhanced DIN connector mechanicals) required more work to complete this document. The VITA Technical Committee suspended work with the IEEE and sought accreditation as a standards developer organization (SDO) with the American National Standards Institute. The IEEE subsequently withdrew the original IEEE PAR P1014R. The VITA Technical Committee returned to using the public domain VMEbus C.1 specification as its base-level document, to which it added new enhancements.

Kim carried out the tremendous undertaking of the document editing with assistance from Frank Hom, who created the mechanical drawings, and with exceptional contributions by each chapter editor.

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Eike Waltz Eike Waltz was a familiar face at VITA Technical Committee meetings in the early days. He was passionate about the mechanical aspects of VMEbus and served as the driving influence in many of the decisions made to guide the development of the mechanical specifications for VMEbus.

Eike received special recognition for his extensive contribution to the mechanical chapter (Chapter 7), which was incorporated into Revision C, ANSI/IEEE Std 1014-1987, and ANSI/VITA 1-1994 (S2011).

Eike was a technical sales manager at Schroff, an English company headquartered in Warwick, Rhode Island. He was a representative of the British Standards Institute committee on IEC 48D from 1976 to 1983.

He also was a member of the IEEE P1014 (VMEbus) committee, as well as a coordinator for the central IEEE mechanical (IEC 297-3/3A) specification. Eike was instrumental in evangelizing VMEbus at the beginning of the standard’s development.

Key contributions ›› 1984: Eike directed VMEbus mechanical design effort and documentation.

Tom Hall Tom Hall spent numerous years in the VMEbus COTS industry selling and marketing military-spec VMEbus computer products to leading defense contractors and government departments throughout the world. He was a leading force in the development of technologies and major market segments while working at Plessey Microsystems, Radstone Technology, PEP Modular Computers, and Thales Computers.

Tom was responsible for the operation and major sales of Radstone Technology’s military products division. He also was president and CEO of PEP Modular Computers in Pittsburgh, where he was responsible for restructuring the German-based company’s U.S. operation. Tom later became the president and CEO of Thales Computers in Raleigh, North Carolina, a supplier of PowerPC and Pentium-based VME computing hardware, software, and system solutions.

Key contributions ›› 1985: Tom promoted DIN connectors for defense applications. ›› Started and shepherded the 1101.2 IEEE specification (conduction cooling) while working at Radstone Technology. ›› 1997 to 2000: Member of VITA Board of Directors representing PEP Modular Computers.

PCI Mezzanine Cards In the mid-1990s the embedded computing industry became entrenched in a heated debate over mezzanine card standards for 3U and 6U boards. At one point, 22 different proposals were on the table, not to mention at least as many more proprietary options. S-bus, advocated by Sun Microsystems, was gaining traction.

That all changed when a handful of industry-leading companies placed their bet on the emerging efforts led by Force Computers and Digital Equipment Corporation to marry S-bus mechanicals with the PCI bus.

In 1994 a number of companies joined together to launch the “We Agree … It’s PMC!” campaign, including Concurrent Technologies, Digital Equipment Corporation, Force Computers, Heurikon, Intel, Interphase, Mercury Computer Systems, Molex, Motorola Computer Group, Newbridge Microsystems, Schroff, Themis Computer, and Vigra.

Architectures supporting PMC included VMEbus, VME64, Futurebus+, Multibus I, and Multibus II. A PCI Mezzanine Card or PMC is a printed circuit board manufactured to the IEEE P1386.1 standard (chaired by VITA Technologies Hall of Famer Wayne Fischer). This standard combines the electrical characteristics of the PCI bus with the mechanical www.vita-technologies.com

›

Figure 1 | The PMC standard unites the electrical characteristics of the PCI bus with the mechanical dimensions of the CMC format and defines the connector pins to be used for specific PCI signals.

dimensions of the Common Mezzanine Card or CMC format (IEEE 1386 standard, see Figure 1).

A PMC can have up to four 64-pin bus connectors. The first two (P1 and P2) are used for 32-bit PCI signals; a third (P3) is needed for 64-bit PCI signals. An additional bus connector (P4) can be used for non-specified I/O signals. In addition, arbitrary connectors can be supplied on the front panel or bezel.

The PMC standard defines which connector pins are used for which PCI signals. It also defines the optional 64 P4 connector pins for use of arbitrary I/O signals.

Carrier cards that accept PMCs are usually made in the Eurocard format, which includes single-, double-, and tripleheight VMEbus cards, CompactPCI cards, and more recently, VPX cards.

One PMC fits on a standard 3U carrier

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SPECIAL FEATURE card, while 6U models (typical for VMEbus cards) can carry up to two PMCs. Lowprofile motherboards also can take advantage of the PMC architecture.

The PMC specification evolved into Processor PMC (PrPMC), which added extensions so the PMC could act as a bus master, making it possible for it to be the host processor card in a system.

Key milestones ›› 1994: PMC (IEEE P1386.1) emerged out of efforts led by Force Computers and Digital Equipment Corporation to combine S-bus mechanicals with the PCI bus. ›› 1994: DEC demonstrates PMC on an Alpha VME board. ›› 2000: PMC P4 (ANSI/VITA 35) provides pin assignments for PMC P4 connector to VME P0 and P2 connectors.

›› 2001: Conduction-Cooled PMC (ANSI/VITA 20) – Defines the mechanical requirements for compliance with conduction-cooled PMC modules. ›› 2003: PrPMC (ANSI/VITA 32) – Incorporates a set of extensions to the PMC standard, which creates a new class of PrPMC cards. ›› 2003: PCI-X for PMC and PrPMC (ANSI/VITA 39) – Integrates the PCI-X bus capability from PCI bus to PMC-based products. ›› 2008: XMC: Switched Mezzanine Card base specification was introduced, bringing switch fabric interconnection to mezzanine cards for 3U and 6U.

VME64 VMEbus started on its path to significant performance improvements while still remaining backwards compatible with legacy systems with the introduction of the VME64 concept. In 1989, John Peters of Performance Technologies developed the initial concept of VME64: multiplexing address and data lines (A64/ D64) on the VMEbus. The concept was demonstrated the same year and submitted to the VITA Technical Committee in 1990 as a performance enhancement to the VMEbus specification.

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Key milestones ›› 1989: John Peters and Bill Mahussen (Performance Technologies) developed the use of 64-bit multiplexed block transfer (MBLT) cycles and presented the VME64 concept to the VITA Technical Committee. ›› 1990: Newbridge Microsystems released DARF 64 VME64 silicon. ›› 1990: Performance Technology won the BUSCON Product of the Year award for VME64. ›› 1991: VME64 (1014 Rev. D) was introduced and submitted to IEEE, raising the theoretical bus speed from 40 MBps to 80 MBps. The IEEE granted project authorization request (PAR) for P1014R (revisions to the VMEbus specification).

Kim co-chaired the activity with Ray Alderman, technical director of VITA. www.vita-technologies.com

“VMEBUS STARTED ON ITS PATH TO SIGNIFICANT PERFORMANCE IMPROVEMENTS WHILE STILL REMAINING BACKWARDS COMPATIBLE WITH LEGACY SYSTEMS WITH THE INTRODUCTION OF THE VME64 CONCEPT.”

›› 1992: Additional enhancements proposed to the VME64 specification were placed in VITA subcommittee: the VME64 Extensions Document. Two other activities began in late 1992: (1) VMEbus Board-Level Live Insertion specifications (BLLI), and (2) VMEbus System-Level Live Insertion with fault tolerance (VSLI). ›› 1992: Newbridge Microsystems marketed the SCV64 single-chip VME64 interface. ›› 1993: VITA subcommittees completed VME64. ›› 1994: VERO Electronics offered a VME64 backplane. ›› 1994: VME64 (ANSI/VITA 1) became the first VITA specification to receive ANSI approval. It defines the main body of the VMEbus specification and includes both 32- and 64-bit usage models. ›› 1996: IP I/O Mapping to VME64x (ANSI/VITA 4.1) was approved, defining the pin assignments from IP modules to the VME64x P0 and P2 connectors. ›› 1997: VME64 Extensions (ANSI/VITA 1.1) was approved as an extension to the VME64 specification, including the 160-pin connector, geographical addressing, and added power pins. ›› 1997: VME64x 9U x 400 mm Format (ANSI/VITA 1.3) – Defines a 9U x 400 mm board layout for use within the VMEbus framework.

›› 1998: VMEbus International Physics Association (VIPA, which includes CERN, Fermilab, and labs in Japan) rolled out VME64 Extensions for Physics (ANSI/ VITA 23), which defines a series of recommended practices for the use of VMEbus in the physics community. ›› 2000: Keying for ConductionCooled VME64x (ANSI/VITA 1.6) was approved for VMEbus technology. ›› 2003: Gigabit Ethernet on VME64x Backplanes (ANSI/VITA 31.1) – Defines a pin assignment and interconnection methodology for implementing a 10/100/1000BASE-T Ethernet switched network on a VME64x backplane.

2eSST – ANSI/VITA 1.5-2003 (R2009) This specification is an extension of the ANSI/VITA 1-1994, VME64, and ANSI/ VITA 1.1-1997, VME64x specifications. It defines a transfer protocol based upon source-synchronous concepts that permits the VMEbus to operate at rates

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SPECIAL FEATURE to at least 320 MBps. As technology improves, this rate can be extended to higher levels. The 2eSST specification emerged out of the MBLT and 2eVME concepts that extended the performance of VMEbus data transfers. Figure 2 compares the VME64 and 2eSST standards.

Thales Computers designed the Alma2e bridge supporting the 2eSST protocol in 2002. Tundra Semiconductor, working with Motorola, brought the Tsi148 PCI/Xto-VME2eSST bridge to market in 2004, making the 2eSST protocol available to the entire industry. Concepts exist to enhance VME2eSST that could increase performance to more than 1 GBps. The 2eSST protocol requires low skew between signals and monotonic rising and falling edges on the signals. To meet these requirements, limited length backplanes, special backplane topologies, and/or enhanced transceivers are required. The specification calls for enhanced bus transceivers with controlled rise and fall times, tightly defined thresholds, low part to part skew, and low-voltage transistor-transistor logic (LVTTL) levels. During the development of this standard, specific transceivers were developed to meet these requirements.

As a source-synchronous protocol, the performance of 2eSST is determined not by the propagation delay from source to destination, but by skew – the variation in propagation delay through the drivers, backplane, and receivers. As

VME64 Protocol 1

Master: Data Master: Strobe Slave: Acknowledge

2eSST Protocol Sender: Data

1

2

3

4

5

6

7

8

Sender: Strobe

›

Figure 2 | This iconic image illustrates a comparison of the VME64 and 2eSST standards.

the skew decreases, system bandwidth can increase. In theory, a source-synchronous protocol is virtually unlimited in its potential transfer rate. This standard provides for transfer rates of 160, 267, and 320 MBps with a 21-slot backplane. New transfer rates can be defined as the technology improves.

In developing the 2eSST protocol, several important objectives were considered: ›› Maximize performance: Performance was the driving impetus for this new protocol. To meet this objective, the protocol was designed to ensure that all devices involved in the transfer would operate as fast as possible. ›› Minimize complexity: The 2eSST protocol was designed to minimize the amount of logic that would be required to implement the protocol. ›› Minimize application limits: The 2eSST protocol can be used in 3U, 6U, and 9U environments. ›› Maintain compatibility: The 2eSST protocol was designed to be compatible with legacy VMEbus products.

Key milestones ›› 1996: 2eVME protocol was proposed for VMEbus, allowing data transfers on both clock edges, thus doubling the VMEbus bandwidth. ›› 2003: 2eSST (ANSI/VITA 1.5) – Defines VME protocol that allows data transfers up to 320 MBps.

Official nomination process The VITA Standards Organization has developed a simple nomination and selection process that is loosely based on the NFL Hall of Fame process.

Any “fan” may nominate any qualified individual, team of individuals, company, product, or technology to the VITA Technologies Hall of Fame via the nomination form on the Hall of Fame website. The only restriction is that the nominee must have made a significant impact on the critical and intelligent embedded computing industry.

This is a great way for the industry to show our appreciation for the contributions that have made this industry such a success. Be sure to submit your nominations now for consideration in the class of 2016.

Links ›› Main page: http://opensystemsmedia.com/hall-of-fame/vita-technologies ›› Nomination guidelines and nomination form: http://opensystemsmedia.com/hall-of-fame/vita-technologies/ nomination-guidelines

22 | VITA Technologies Resource Guide Summer 2015

www.vita-technologies.com

Optimizing SWaP is our passion.

MEET A BRAND NEW CES AT CES-SWAP.COM

THE SWISS RUGGED COMPUTERS COMPANY HAS A NEW LOOK! We design and manufacture rugged embedded computers engineered to meet the most demanding performance requirements with optimal Size, Weight and Power (SWaP) considerations.

CES-SWAP.COM

TECHNOLOGY FEATURE

Product teardown: Maximizing functionality through dual-node processing

By Jerry Gipper Aerospace and defense applications must support higher-bandwidth sensor input, more complex intersystem communications, and greater security for certain operations and related custom algorithms, all while contending with budget and schedule pressures. In addition to these broad challenges, application areas such as mission computing face the added difficulty of designing systems that meet restrictive size, weight, and power (SWaP) constraints. Increasing function density within a current space envelope is a common way of addressing these challenges.

Curtiss-Wright offers a VPX SBC – the VPX6-195 – that presents some interesting solutions to enabling today’s complex applications. One major characteristic about the VPX6-195 that makes it stand out from other boards is its dual-node SBC architecture. The dual processing nodes are completely independent of each other, helping address SWaP constraints and performance challenges in ways that are not possible with a traditional single-node SBC. In essence, the VPX6-195 is two independent processor nodes in a single 6U slot package.

How is this done?

Curtiss-Wright designed the VPX6-195 right from the start to operate as two nodes. It has two Freescale T2080 quadcore 64-bit CPUs. Each processor has its own independent memory and I/O subsystems with backplane access. The

VPX6-195 supports a rich I/O complement per processing node, which includes two GbE ports (one 1000BASE-BX and one 1000BASE-T), four serial channels, discrete and differential digital I/O, USB 2.0 ports, and an XMC site.

THE DUAL PROCESSING NODES ARE COMPLETELY INDEPENDENT OF EACH OTHER, HELPING ADDRESS SWAP CONSTRAINTS AND PERFORMANCE CHALLENGES IN WAYS THAT ARE NOT POSSIBLE WITH A TRADITIONAL SINGLE-NODE SBC.

Where the board starts to be distinctive is with the addition of a dedicated Xilinx Kintex FPGA and XMC slot to each node. The standard product comes equipped with a Kintex K70T FPGA, but can also be ordered with a larger Kintex K325T FPGA. The only common elements are system-level functions including intelligent platform management interface (IPMI), real-time clock (RTC), and temperature sensors.

The VPX6-195 provides four 10GBASE-BX4 ports for the VPX data plane fabric, two ports from each processing node to the VPX P1 connector. The processing nodes are also connected by two 10GBASE-KR ports for internode communication. For red/ black (unencrypted/encrypted) applications, this can be disconnected.

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www.vita-technologies.com

Each processing node has a PCI Express (PCIe) connection to the expansion plane on the VPX P2 connector. Depending on the variant, the expansion plane connection can either be a four PCIe Gen2 port, two x4 Gen2 ports, or a single x8 PCIe Gen2 port.

SBC 1 FPGA

VPX6-195 XMC

SBC 1

Processor

FPGA

To cost-effectively address a diverse range of military/aerospace applications, the VPX6-195 is available in a range of ruggedization levels, both airand conduction-cooled. All versions are functionally identical, with air-cooled versions available in Curtiss-Wright ruggedization Levels 0 and 100, and conduction-cooled versions in Levels 200 and 300 with line replacement module (LRM) covers.

Since each node on the VPX6-195 is independent of its mate, each can run a different operating system and applications. The card is supported by a suite of U-Boot, real-time operating system (RTOS) BSPs, communication libraries, and signal processing libraries. Throw on a hypervisor-enabled OS, and you can start to see some interesting ways to split the system.

Applications SWaP-C optimization The dual-node architecture means that two slots can be consolidated into one (see Figure 1). The impact on size is a reduction in card slots from two to one, with a possible reduction in mezzanine slots from four to two if the previous boards had mezzanine capability. Weight per slot is immediately reduced by 50 percent. Power dissipation is approximately the same, assuming the power on the SBCs being replaced is the same as a single node on the 195, but a higher performance/ watt can be assumed. At the slot level, a VPX6-195 has power requirements as low as 80 W. System robustness has potential for improvement by reducing modules; however, it may remain nearly unchanged if the gained space is utilized. The cost impact is variable and dependent on the specific costs of boards that are being replaced and the utilization of the added capability of the FPGAs. www.vita-technologies.com

FPGA

XMC

SBC 1

Processor

FPGA

SBC 2

XMC Processor

XMC Processor

›

Figure 1 | Transformation from two slots to one slot

Red/black processing Secure separation of red/black processing elements within a computing system is increasingly important for both commercial and defense system applications. Recent systems have taken advantage of hypervisor OS software to isolate systems, but with the VPX6-195, two truly independent hardware systems can also occupy the same VPX slot ­– the most secure and easiest to validate.

On the VPX6-195 any link between the two nodes can be disconnected by assembly population option, configuring the 195 as two independent SBCs on a single card.

Curtiss-Wright has included other protections to ensure trusted computing and secure boot. Each node’s FPGA has space for customer specific security functionality. The T2080 processor supports Freescale’s Secure Boot architecture, with the ability to boot encrypted images so external key storage is not needed.

Mission computer applications Many applications place the highest priority on processing performance. With the two Freescale T2080 quad-core 64-bit CPUs, the user gets the performance of the processors plus that of the Kintex FPGAs. Mission-specific IP can be loaded into the FPGAs to add functionality or offload application-specific processing.

ISR applications Intelligence, surveillance, and reconnaissance (ISR) applications are specific cases that often need intense processing performance and complex I/O processing. The Xilinx Kintex FPGA comes in two sizes – the largest possible – to meet the most demanding ISR applications.

Advancements expand possibilities Technology has evolved to enable configurations that were simply not possible a few years ago. Putting the functionality of a single processing node in a single 6U slot was a major challenge 10 years ago. Today you can put two on a single-slot 6U board and still have plenty of space for custom functionality in a large FPGA. Processor performance, FPGA density and performance, high-speed serialized I/O, and great strides in power utilization continue to make it possible to do the impossible.

Curtiss-Wright has posted a white paper titled “Enabling Complex Applications with a Dual Node Single Board Computer” with more details on using the VPX6-195 (see www.cwcdefense.com/products/single-board-computers/6u-ppc-sbc/ vpx6-195.html).

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PRIMETIME CHOICES

Deployment in scalable subsystems right to the tactical edge Taking the server on 3U VPX a step further, Mercury Systems is adding a Xilinx FPGA. The rugged OpenVPX Ensemble LDS3506 processing module integrates an Intel Xeon processor D system-on-chip (SoC) with Xilinx’s UltraScale FPGA in a size, weight, and power (SWaP)-constrained 3U package. This dense union of best available commercial item general processing and FPGA resources produces a highly versatile, affordable, and interoperable building block for embedded, high-performance computing applications with additional low-latency, refresh, and mission capabilities.

The Ensemble LDS3506 leverages Mercury’s fourth generation of highly SWaP-efficient packaging technology to securely deliver the Intel Xeon processor D product family for reliable deployment in scalable subsystems right to the tactical edge. The Ensemble LDS3506 is a dense, powerful combination of general server-class and low-latency front-end FPGA processing in an open systems architecture module.

“With over 256 peak GFLOPS of general processing power from the Intel processor alone, the Ensemble LDS3506 represents a disruptive force in the 3U embedded market space,” said Ian Dunn, VP of Mercury Systems’ Embedded Products group. “It is the unique combination of this latest Intel technology combined with the low-latency and versatile FPGA resources that delivers a potent compute solution for multidimensional SWaP-constrained applications, particularly those that are sensitive to performance and latency, such as electronic warfare (EW), electro-optical/infrared (EO/IR), image intelligence (IMINT), and other mission or sensor processing applications.”

Mercury Systems, Inc. • www.mrcy.com • www.vita-technologies.com/p372704

High-performance DSP and FPGA board for harsh environments DSP, ARM, and FPGA all on one board! The VPX-D16A4-PCIE from CommAgility is a rugged, high-performance DSP- and FPGA-based module in the 3U OpenVPX form factor. The module is ideal for electronic warfare (EW), software radio, imaging, or radar applications that require very high signal processing performance in the robust VPX form factor for deployment in harsh environments.

The VPX-D16A4-PCIE is based on a Texas Instruments (TI) TCI6638K2K KeyStone-based system-on-chip (SoC) and a TMS320C6678 SoC, which between the two chips contain 16 C66x DSP cores and four ARM Cortex-A15 cores, as well as baseband and networking accelerators. The two SoCs are closely coupled with TI’s HyperLink bus as well as Gigabit Ethernet. Each device has its own 2 GB DDR3 memory bank. The VPX-D16A4-PCIE includes a 10 Gbaud 2x PCI Express interface to the VPX backplane for each of the two onboard SoCs. For additional I/O or coprocessing, the main DSP is connected via PCI Express and the AIF2 CPRI interface to a Xilinx Kintex-7 K325T FPGA, which also has Gigabit Ethernet and its own backplane MGT connections. The FPGA has multiple LVDS, GPIO, and serial connections to the P2 connector to enable interfacing to an RTM with specialized I/O such as multichannel RF or high-speed ADC/DAC interfaces.

CommAgility • www.commagility.com • www.vita-technologies.com/p372606

Server-class processing on 3U VPX Processor technology advances have made it possible to put server-class processing power into a 3U VPX module that is designed for size, weight, and power (SWaP)-constrained applications. The XPedite7670 3U OpenVPX REDI SBC and its 6U VPX companion, the XCalibur4640, from Extreme Engineering Solutions are both based on the Intel Xeon D processor family. A rich feature set as well as native extended temperature support in the processor eliminate the need for advanced individual unit screening and provide enhanced reliability in extreme environments.

The XPedite7670 maximizes network performance and connectivity with two 10 Gigabit Ethernet interfaces and four Gigabit Ethernet interfaces. Local storage of up to 64 GB of SLC NAND flash allows an operating system and application to be installed directly onto the XPedite7670.

The XCalibur4640 extends functionality to the 6U VPX form factor. System memory capacity increases to 16 GB of DDR3-1600 ECC SDRAM and local storage increases to 128 GB of SLC NAND flash. Two additional 10 Gigabit Ethernet interfaces provide a total of four interfaces to the backplane. Sixteen lanes of PCI Express 3.0 routed to the backplane can be configured to support multiple peripherals.

Four SATA 6 Gbps ports on the backplane allow for storage expansion in the system. Two XMC/PMC sites, each with a dedicated x8 PCI Express 3.0 link, enable additional expansion options.

Extreme Engineering Solutions, Inc. (X-ES) • www.xes-inc.com • www.vita-technologies.com/p372624 & www.vita-technologies.com/p372737

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PRIMETIME CHOICES

Enable huge swaths of bandwidth to be scanned for signals of interest Signal processing is all about signals and bandwidth. The CHAMP-WB OpenVPX board family, a rugged VPX board set from Curtiss-Wright Controls Defense Solutions, raises the product’s sampling rate from 12.5 GSps to 25 GSps. The CHAMP-WB can be configured as a single-channel (25 GSps) or dual-channel (two 12.5 GSps) ADC engine to address the most demanding wide-spectrum communications applications.

These board sets enable direct RF sampling of bandwidths up to 15 GHz using open architecture COTS modules. The board sets speed and simplify the design of very high-performance wideband signals intelligence (SIGINT), electronic warfare (EW), and satellite communications (SATCOM) applications for deployed platforms such as manned and unmanned aircraft, ground vehicles, ships, and base stations.

The ultra-high sampling rates enable huge swaths of bandwidth to be scanned for signals of interest. In dual-channel mode, the CHAMP-WB A25G eliminates the need for a second CHAMP-WB to provide a second independent channel. Curtiss-Wright and Tektronix Component Solutions jointly developed the ADC and DAC modules on the CHAMP-WB board. The ADC module hosts two multichip modules (MCMs), each of which contains an ADC and dual demultiplexer (DEMUX) silicon.

Curtiss-Wright Controls Defense Solutions • www.curtisswrightds.com • www.vita-technologies.com/p370959

VNX bringing a solution to SWaP challenges Size does matter, and smaller is a good thing in applications that are challenged with available space for electronics. The ROCK-3210 is the first member of the ROCK-3 family of rugged VNX mission computers from Creative Electronic Systems (CES). Based on VPX technologies, VNX is a small form factor standard for conduction-cooled modules.

The base VNX 2+1 system consists of a chassis supporting two double-wide 19 mm and one single-wide 12.5 mm VNX modules. One 19 mm site hosts an SBC, initially an AMD G-Series system-on-chip (SoC) quad-core processor with two independent GPUs. The second 19 mm site can host an SBC, image processor, or video conversion module.

The 12.5 mm site is configured to hold either an inertial measurement unit (IMU) with GPS and optional selective availability anti-spoofing module (SAASM) capability, or a dual Mini PCI Express I/O carrier with a variety of mezzanine modules for data bus, discrete, and analog I/O functions including MIL-STD-1553, CAN, and ARINC 429. An I/O transition panel supports MIL connectors for power and I/O connectivity. A rear transition panel supports mSATA storage, as well as optional external high-speed optical interfaces. Internal to the chassis, all modules are conduction cooled. External chassis options include convection, conduction, and forced-air conduction cooling, as well as various mounting features.

Creative Electronic Systems SA (CES) • www.ces-swap.com • www.vita-technologies.com/p372738

Tiny footprint makes big impact Small form factors are opening new doors to many applications. One of the newest form factors on the market is the VITA 75 rugged small form factor. The military-grade HPERC-IBR-H Series of rugged systems for mission and payload computing from ADLINK leverages the company’s extensive experience in small and rugged computing modules.

The highly integrated, compact, VITA 75-compliant HPERC-IBR-H Series is almost 30 percent smaller than similar products on the market. The HPERC-IBR-H Series meets size, weight, and power (SWaP) requirements for modern military applications, with a focus on sensor data display, command, and control for mission computing in military ground or naval vehicles and mass image acquisition and processing for payload computing in UAVs. “The HPERC-IBR-H Series offers intense capabilities in a compact form factor, leveraging high-performance graphics capabilities and a wealth of I/O support for camera and vehicle data buses,” said Yong Luo, general manager of ADLINK’s Embedded Computing Product Segment. “This tightly integrated solution offers equivalent or better performance than competitive systems in a smaller footprint, with space requirements being a critical component of any successful in-vehicle military applications.”

ADLINK • www.adlinktech.com • www.vita-technologies.com/p372741 www.vita-technologies.com

VITA Technologies Resource Guide Summer 2015 |

27

2015 RESOURCE GUIDE INDEX Company

Category Page

Company

Category Page

ADLINK Technology, Inc.

Small Form Factor

41

LCR Embedded Systems

VPX

50

Aitech Defense Systems

VME/VPX

49

Mercury Systems

OpenVPX

38

Alphi Technology Corporation

PMC/XMC

42

Meritec

FMC 29

Annapolis Micro Systems, Inc.

OpenVPX

30

Meritec

OpenVPX 39

Annapolis Micro Systems, Inc.

OpenVPX

31

Meritec

PMC/XMC 42

Annapolis Micro Systems, Inc.

OpenVPX

32

Meritec

VME 47

Annapolis Micro Systems, Inc.

OpenVPX

33

Meritec

VPX 51

Annapolis Micro Systems, Inc.

OpenVPX

34

North Atlantic Industries

VPX

51

Annapolis Micro Systems, Inc.

OpenVPX

35

Orbit Electronics Group and Orbit Power Group

OpenVPX

39

Annapolis Micro Systems, Inc.

OpenVPX

36

Orbit Electronics Group and Orbit Power Group

VPX

52

Annapolis Micro Systems, Inc.

OpenVPX

37

Orion Technologies Inc.

VPX

52

Artesyn Embedded Technologies

VME

45

Parsec/Sundance Multiprocessor Technology

OpenVPX

40

Artesyn Embedded Technologies

VME

46

Pixus Technologies

Systems

45

Dawn VME Products, Inc.

OpenVPX

38

Pixus Technologies

VPX

53

Dawn VME Products, Inc.

VPX

50

Schroff Pentair

OpenVPX

40

Highland Technology, Inc.

VME

46

Schroff Pentair

OpenVPX

41

Innovative Integration

Systems

43

TE Connectivity

VPX

54

Innovative Integration

Systems

44

Themis Computer

VPX

53

Intermas, Inc.

VME

47

Vector Electronics & Technology, Inc.

VME

48

Compression-Docking Connector Meritec has always been a leader in providing innovative solutions to a customer's specific interconnection problems. By combining our unique blend of engineering talents along with our manufacturing processing capabilities, we have designed and built custom interconnect products that are now being designed in as standard products at a number of OEMs. Because we are a vertically integrated company, our time from design to fabrication to market is measured in weeks, not months. If you have a problem with an interconnection requirement (cable or connectors) contact us today.

Visit our newly-designed website http://www.meritec.com for your Direct Connection to the Xtreme High-Speed Xperts!

FEATURES ĄĄ Ideal for rugged PC and tablet applications ĄĄ Robust way to connect portable devices, mobile-internet devices to

charging stations

ĄĄ Compression-contact design provides spring-loaded force and

rated travel

ĄĄ High-mating cycle life, low-insertion force ĄĄ Capable of operating RF & differential signals ĄĄ Excellent electrical-signal performance vita.opensystemsmedia.com/p372748

Meritec

www.meritec.com www.vita-technologies.com

www.facebook.com/pages/Meritec/142140812492429

 www.linkedin.com/company/meritec-inc.

 888-MERITEC (637-4832)  info@meritec.com

VITA Technologies Resource Guide Summer 2015 |

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VITA Technologies Resource Guide

FMC

VITA Technologies Resource Guide

OpenVPX

Wild40 Seven Slot OpenVPX 3U Chassis The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPXcompatible chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear Transition Modules (RTMs). Plug-in Module slot spacing is 1″VITA 48.1.

This chassis is equipped with a very high performance backplane

FEATURES

which is capable of Serial I/O signaling at rates up to 10Gbps on

ĄĄ

6U High with Front Mounted OpenVPX Card Cage

is connected to adjacent slots with one Fat Pipe connection. The

ĄĄ

7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support

Expansion Plane is a 3 slot star with two Fat Pipes connecting

ĄĄ

1534 Watt Power Supply

slots.

ĄĄ

the Data and Expansion Planes. The Data Plane of the backplane

The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures

ĄĄ

and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet

ĄĄ

Radial clocking for AUXCLK and REFCLK with chassis input SMAs Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and SLT3-PAY-2F4F2U-14.2.11 Switch Profile: SLT3-SWH-2F24U-14.4.3 or SLT3-SWH-2F4T16U-14.4.11

interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support.

vita.opensystemsmedia.com/p372672

Annapolis Micro Systems, Inc. www.annapmicro.com

30 | VITA Technologies Resource Guide Summer 2015

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

Wild40 12-Slot OpenVPX 6U Chassis 11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling compromising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.

The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″VITA 48.1.

The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots.

In addition to the Primary Backplane there is also an option for a Secondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors.

These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs. The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed.

The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

FEATURES ĄĄ ĄĄ

ĄĄ

10U High with Front Mounted OpenVPX Card Cage Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards

ĄĄ

Up to 3200 Watt Power Supply

ĄĄ

Backplane Profile: BKP6-CEN12-11.2.X

ĄĄ

Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1

ĄĄ

Switch Profile: SLT6-SWH-16U20F-10.4.2

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support. vita.opensystemsmedia.com/p372673

Annapolis Micro Systems, Inc. www.annapmicro.com www.vita-technologies.com

 wfinfo@annapmicro.com  410-841-2514

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OpenVPX

VITA Technologies Resource Guide

OpenVPX

WILD Data Storage Solution When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write bandwidth. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.

The Storage Carrier/Canister is specifically designed to support 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).

To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system.

Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design.

Sensors can be accessed with a chassis manager (ChMC).

New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.

FEATURES ĄĄ General Features

• 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Backplane I/O

• Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of 20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4

ĄĄ System Management

• Client/Server Interface for WILDSTAR FPGA Boards and Linux and Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control and Data Plane Connections

ĄĄ Physical Features

• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling vita.opensystemsmedia.com/p372456

Annapolis Micro Systems, Inc. www.annapmicro.com

32 | VITA Technologies Resource Guide Summer 2015

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

WILDSTAR 7 for OpenVPX 3U The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board.

These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There are two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up to 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

FEATURES ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth ĄĄ Backplane I/O • 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth • Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols • External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK

– Allows points-to-point, very high quality backplane connections to payload cards – Allows 10MHz clock and trigger from backplane to synchronize and clock compatible ADC/DAC mezzanine cards without front panel connections needed – Allows 1000s of analog channels across many backplanes/chassis to be synchronized via backplane

ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth • Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGA ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O vita.opensystemsmedia.com/p372457

Annapolis Micro Systems, Inc. www.annapmicro.com www.vita-technologies.com

 wfinfo@annapmicro.com  410-841-2514

VITA Technologies Resource Guide Summer 2015 |

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WILDSTAR 7 Conduction Cooled for OpenVPX 6U WILDSTAR 7 Conduction Cooled for OpenVPX 6U boards provide up to two Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs, up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth. Up to 1.9 million logic cells and 3.3 million multiplier bits per board. Air or Conduction Cooled.

These FPGA boards include two Xilinx Virtex 7 FPGAs with 64 High Speed Serial connections performing up to 13.1 Gbps. The IO Processing Element (IOPE) FPGA has a choice of QDRII+ SRAM or DDR3 DRAM. The DRAM option has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz while the SRAM option has two 72-bit QDRII+ SRAM interfaces clocked up to 500 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up to 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to four WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for six QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application requirements. It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

FEATURES ĄĄ One or Two XILINX VIRTEX 7 FPGAS • VX690T or VX980T • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth • PCIe Gen3 8x from each FPGA to on-board PCIe switch ĄĄ Backplane I/O • 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth • 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 24 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth • 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe Switch ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O vita.opensystemsmedia.com/p372742

Annapolis Micro Systems, Inc. www.annapmicro.com

34 | VITA Technologies Resource Guide Summer 2015

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

WILDSTAR A5 for OpenVPX 6U WILDSTAR A5 for OpenVPX 6U boards provide up to three Altera Stratix® V FPGAs per board with choice of GX parts up to 5SGXAB or GS parts up to 5SGSD8, up to 96 MB of QDRII+ SRAM for 59 GB/s of SRAM bandwidth and up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth.

Up to 2.8 million logic elements and 4.3 million multiplier bits per board.

Air Cooled Only.

These FPGA boards include 3 Altera Stratix V FPGAs with 48 High Speed Serial connections performing up to 14.1 Gbps. On each Compute Processing Element (CPE) FPGA there is six 72-bit QDRII+ SRAM interfaces clocked up to 550 MHz. The IO Processing Element (IOPE) FPGA has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to 4 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 6 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs.

Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application requirements. It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

FEATURES ĄĄ One, Two or Three ALTERA STRATIX® V FPGAS • Up to three Altera Stratix® V FPGA Processing Elements: 5SGSD6, 5SGSD8, 5SGXA7, 5SGXA9, 5SGXAB • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth • Up to 96 MB of QDRII+ SRAM for 48 GB/s of SRAM bandwidth • PCIe Gen3 8x from each FPGA to on-board PCIe switch ĄĄ Backplane I/O • 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth • Up to 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 32 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 56.4 Gbps each for 42.3 GB/s of Full Duplex Bandwidth • 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe Switch ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • SignalTap Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O vita.opensystemsmedia.com/p372743

Annapolis Micro Systems, Inc. www.annapmicro.com www.vita-technologies.com

 wfinfo@annapmicro.com  410-841-2514

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OpenVPX

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OpenVPX

WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card This ultra low latency Dual 1.5GSps ADC/DAC card is specifically designed for DRFM applications with 24ns latency from SMA to SMA. The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card was designed from the ground up for latency sensitive DRFM applications. The Board Support Interface, which is available in VHDL or CoreFire Application Design Suite, was also designed from the beginning to be suited for DRFM applications. This interface provides a Digital Bypass Mode to achieve the lowest possible latency and a Fabric Space Mode to allow the user to do additional processing and manipulation of the ADC data before returning it out the DAC. The Fabric Space Mode adds only 14ns of latency. The Board Support Interface also includes a built-in Bypass Delay which can be controlled to be from 0 to 62 ADC sample clock periods. This allows the user to “walk” the latency out from the minimum Digital Bypass Mode latency to slightly beyond the Fabric Space Latency, providing for a smooth latency transition between the two modes.

The CoreFire Next Design Suite, Annapolis’ FPGA Design Tool, allows the user to design a 24ns latency DRFM-optimized application in minutes.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card is shipped with a custom heatsink which enables proper cooling of the ADC. An on-board temperature monitor is also supplied which allows for real-time monitoring of the ADC’s internal die temperature.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card provides high fidelity and high speed analog-to-digital conversion along with a rugged design. This card is compatible with WILDSTAR 7 and WILDSTAR A5 mainboards.

FEATURES ĄĄ General Features

• Dual Channel ADCs and DACs running at up to 1500MSps each at 12-bits • Ultra Low latency from ADC SMA input to DAC SMA output • Digital Bypass Mode (SMA-to-SMA): < 24ns • Fabric Space Mode (SMA-to-SMA): < 39ns • Digital Bypass Mode has built-in run-time adjustable delay providing additional delay from 0ns up to 62 Sclk periods • Capability to have four ADC channels and four DAC channels in one 6U OpenVPX slot when plugged into WILDSTAR OpenVPX FPGA cards • Support for WILDSTAR 7 (Xilinx Virtex™-7) and WILDSTAR A5 (Altera Stratix® V) PCIe and OpenVPX mainboards • Firmware and Software Board Support Interface provided in CoreFire Next and VHDL source

ĄĄ ADC and DAC and Performance

• Sample Rate: 300 – 1500MHz • ADC and DAC Resolution: 12 bits

ĄĄ SMA I/O

• • • • • • •

Two Analog Inputs Two Analog Outputs One High Precision Trigger Input One External Clock Input Mechanical and Environmental Integrated Heatsink and EMI / Crosstalk Shields Commercial and Industrial Temperatures Available

ĄĄ Mechanical and Environmental

• Integrated Heatsink and EMI/Crosstalk Shields • Commercial and Industrial Temperatures Available

ĄĄ Clock Synchronization

• Software-selectable external clock input or onboard clock • All ADCs on a mezzanine card are synchronized to the same sample • All ADCs across multiple mezzanine cards can be synchronized to the same sample using • WILDSTAR Clock Distribution Boards • Provides capability to configure 40+ ADC and DAC channels in one COTS Annapolis 19" OpenVPX Chassis vita.opensystemsmedia.com/p372675

Annapolis Micro Systems, Inc. www.annapmicro.com

36 | VITA Technologies Resource Guide Summer 2015

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

WILDSTAR G2 Dual 1.6/2.7/4.0GSps 12-Bit ADC Mezzanine Card The Dual 4.0/2.7/1.6 GSps 12-Bit A/D Mezzanine Card provides high fidelity and high speed analog-to-digital conversion along with a rugged design. The Dual 4.0/2.7/1.6 GSps 12-Bit A/D Mezzanine Card is shipped with a custom heatsink which enables proper cooling of the ADCs. An on-board temperature monitor is also supplied which allows for real-time monitoring of the ADC’s internal die temperatures.

FEATURES ĄĄ Provides two channels of synchronized high bandwidth, high

performance ADC channels.

ĄĄ ADCs have built-in DDC/NCO/Decimation features which reduces

FPGA resources

ĄĄ Maximum Sample Rate up to: 1.6, 2.7 or 4.0GSps ĄĄ Minimum Sample Rate: 1.0GSps ĄĄ ADC Resolution: 12 bits ĄĄ Eight High-Speed JESD204B Serial Data Lanes per ADC ĄĄ Six 50Ω SMA Front Panel Connectors

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support.

• • • •

Two Analog Inputs High Precision Trigger Input Differential Clock Input (can be driven single ended) Optional PLL 10MHz Reference Input

ĄĄ Software selectable Clock Source:

• External clock provided on Clock Input SMAs • Optional Internal Fixed Frequency Ultra Low Phase Noise VCO/PLL with Software selectable 10MHz source: – Internal 10MHz source sourced by on board 10MHz source – External 10MHz source provided on Reference Input SMA

ĄĄ Analog Input Options

• Low Band (offers best dynamic performance in the First Nyquist Zone) • Mid Band (offers best dynamic performance in the Second Nyquist Zone) • High Band (offers widest bandwidth)

ĄĄ High Precision Trigger Input Manufacturing Options:

• 1.65V LVPECL • 2.5V LVPECL • 3.3V LVPECL

ĄĄ Integrated Heatsink/Shield ĄĄ On-Board Temperature Sensors for ADCs vita.opensystemsmedia.com/p372744

Annapolis Micro Systems, Inc. www.annapmicro.com www.vita-technologies.com

 wfinfo@annapmicro.com  410-841-2514

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VITA Technologies Resource Guide

OpenVPX

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OpenVPX

Fabric Mapping Modules Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM microoverlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements.

Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase.

Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes.

FEATURES ĄĄ Off-the-shelf backplanes can be quickly customized to mission

requirements

ĄĄ Optimize the communication topology between slots within a system’s

backplane

ĄĄ Customize inter-slot communications to meet unique system

requirements

ĄĄ Improve signal integrity between system cards beyond requirements of

PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards

ĄĄ Directly connect PCI Express or SerialRapid I/O to multiple cards or

cards and switches

ĄĄ Link SATA from a CPU card to a Solid State Drive (SSD) carrier ĄĄ Enable XMC cards to talk to other XMC cards or other I/O like

PCI Express links

ĄĄ Facilitate rear backplane I/O connections and low profile connector

interface systems when normal transition modules do not fit the system application envelope

vita.opensystemsmedia.com/p372452  sales@dawnvme.com  510-657-4444

Dawn VME Products www.dawnvme.com

OpenVPX

LDS3506 Mercury’s OpenVPX™ Ensemble® LDS3506 processing module seamlessly integrates Intel’s Xeon® D-series processor (formerly codenamed “Broadwell DE”) with Xilinx’s UltraScale™ FPGA in a SWaP-constrained 3U package. This dense union of best available commercial-item general processing and FPGA resources produces a highly versatile, affordable and interoperable building block for embedded, high-performance compute applications with additional low-latency, refresh and mission capabilities.

The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload Engine Technology (POET™) to give each module the ability to refresh its mission capability, provide information assurance abilities, or even refresh or upgrade its switch fabric itself without affecting any hardware.

FEATURES ĄĄ 3U OpenVPX™ compliant VITA 65/46/48 (VPX-REDI) module ĄĄ 8-core Broadwell DE Intel® Xeon® D family server-class processor ĄĄ Xilinx® UltraScale™ FPGA with dual x4 PCIe data plane and Ethernet

control plane

ĄĄ 256 GFLOPS peak processing power in a single slot ĄĄ Dual 10 Gigabit Ethernet interfaces for sensor I/O or inter-processor

communication

ĄĄ x8 PCIe expansion plane for additional I/O or offload ĄĄ Mercury MultiCore Plus® software infrastructure support vita.opensystemsmedia.com/p372704

Mercury Systems

www.mrcy.com/LDS3506

38 | VITA Technologies Resource Guide Summer 2015

 866-627-6951 www.linkedin.com/company/mercury-systems





twitter.com/mrcy

www.vita-technologies.com

HERCULES® 10 Gbs Ruggedized COTS High-Density Interconnect System

FEATURES

Meritec’s Hercules Multi-Protocol Interconnect System provides cost-effective reliability, density and speed necessary to support C51SR for battlefield-ready critical command. Embedded in the rugged MIL-DTL-38999L Series III circular shell, Hercules is both a durable and high-bandwidth interconnect system suitable for Mil/Aero/Marine and harsh environment commercial/industrial applications not previously accommodated by Industry standard interconnects. The rapid emergence of high-speed switched serial-fabric backplanes in the ruggedembedded computer market has created a need for a connector system capable of supporting serial I/O at full bandwidth between platforms. Hercules supports throughput-link speeds demonstrated in excess of 10 Gbs per lane. Hercules is currently the VITA 76 Draft Standard and, while readily accepted over five (5) years as a proven high-speed copper interconnect, establishing the viability of Hercules as an active optic-connector platform rounds out the V-76 Standards for both copper and optic cabling consideration. Follow the link for interactive flipbook and technical data – http://meritec.com/wp-content/flipbooks/hercules/

ĄĄ Up to 145 total contacts with 44 differential pairs in a #23 circular shell ĄĄ Rugged light-weight aluminum MIL-38999 Series III Size 9, 13, 17 & 23 threaded-coupling circular shells. ĄĄ Shell plating: CAD and PTFE plating standard, others available special order ĄĄ Keying: “N” (standard) “A”, “B”, “C”, “D” ĄĄ Available as Plug-Cable Assemblies and Jam-Nut or Flange-Mount Receptacles for Solder Tail, Press-Fit or Pigtail ĄĄ Jacket types available LSZH, PVC, FEP & Halar Expando ĄĄ Cable types available in 24, 26, 28, 30 AWG, high bandwidth, Custom lengths built to order ĄĄ Supports data rates in excess of 10 Gbs & differential-pair signaling w/low-skew pairs & shielding for EMI/RFI protection ĄĄ Compatible with the following protocols: SAS/USB/PCIexpress/Serial I/O/Ethernet/SATA as well as InfiniBand ĄĄ Matched impedance design of 100 Ohm ĄĄ Fully electrically tested interconnect systems, made In The USA

Visit our newly-designed website http://www.meritec.com for your Direct Connection to the Xtreme High-Speed Xperts!

vita.opensystemsmedia.com/p372489

www.facebook.com/pages/Meritec/142140812492429

Meritec

www.meritec.com

 www.linkedin.com/company/meritec-inc.

 888-MERITEC (637-4832)  info@meritec.com

OpenVPX

VPXtra™ Power Supplies (6U and 3U) Setting new higher power standards.

Behlman broke through the 6U VPX power ceiling with their 1000-Watt DC-DC VPXtra™ Power Supply. Today Behlman also offers a 700-Watt, multiple-output, DC-DC VPXtra™ 6U Power Supply, and a 1500-Watt AC-DC VPXtra™ 6U Power Supply. Behlman also provides a 550-Watt DC-DC VPXtra™ 3U Power Supply, and a wide range of VME power supplies used in airborne, ground mobile, naval and industrial applications.

FEATURES ĄĄ OpenVPX VITA compliant ĄĄ Wide input range ĄĄ High power DC output

Behlman also manufactures a broad line of modified standard, custom and COTS power supplies (frequency converters, inverters, AC, DC-DC, AC-DC, DC-AC, and UPS).

ĄĄ Efficiency of 90% typical at full load

Behlman Electronics is an ISO 9000:2008 company.

ĄĄ Behlman is a Subsidiary of Orbit International (www.orbitintl.com)

ĄĄ Conduction cooled at card edge ĄĄ Conformal coating on PWB

and the basis of the Power Group.

VME-VPX Held to a Higher Standard.

vita.opensystemsmedia.com/p372755

Behlman Electronics www.behlman.com

www.vita-technologies.com

sales@behlman.com  +1 631 435-0410 

VITA Technologies Resource Guide Summer 2015 |

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VITA Technologies Resource Guide

OpenVPX

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OpenVPX

Stratix®V FPGA Module with DSP and FMC for demanding computation and I/O applications.

FEATURES

VF360

ĄĄ Stratix V GX and GS FPGA variants

The VF360 is a 3U OpenVPX module that leverages on Altera Stratix V FPGA and Texas Instruments KeyStone Multicore DSP technology to provide an ultra-high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as Radar, Networking, SIGINT, EW, SDR and Video. ®

The VF360 acts as an FMC carrier to provide a modular solution that accommodates a wide range of I/O requirements. The VF360 eliminates the requirement for a OpenVPX-SBC Host Controller, as replaced by the KeyStone DSP that will run Linux and provide Ethernet connectivity.

Both air-cooled and conduction cooled versions, for rugged applications, are available.

ĄĄ TI KeyStone Multicore C667x family of DSP’s ĄĄ 4GB DDR3 plus 32MB QDRll+ ĄĄ High pin count VITA 57 FMC site ĄĄ OpenVPX MOD3-PAY-3F2U-16.2.12-2 module profile ĄĄ FPGA configurable User I/O on P2 ĄĄ BSP for Windows and Linux ĄĄ FPGA firmware reference design ĄĄ FM500 (FMC) and VR300 (RTM) companion modules vita.opensystemsmedia.com/p372757

Sundance Multiprocessor Technology Ltd www.sundance.com/vpx



Flemming.C@sundance.com

 +44 1494 793167

 uk.linkedin.com/pub/flemming-christensen/0/987/649/en  @OneCrazyDane

OpenVPX

Express Programs Express Programs: When product is needed fast Need systems, subracks, cases or front panels quickly for prototyping or small projects? Express service provides rapid delivery turnarounds for solutions engineered to meet your design requirements – in a matter of days.

FEATURES

Systems Express

• ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available • Shipped in as few as 15 days

Subrack & Cases Express

ĄĄ Conform to specifications ĄĄ Standard and customized solutions available ĄĄ Local and global design and product support

• EuropacPRO subrack kits, parts and accessories • RatiopacPRO case kits, parts and accessories • Delivered in as few as 15 days

ĄĄ Drawings and models available ĄĄ Part and quantity restrictions may apply vita.opensystemsmedia.com/p367481

Schroff

http://www.pentairprotect.com

40 | VITA Technologies Resource Guide Summer 2015

AskSchroff@pentair.com  1-800-525-4682 

www.vita-technologies.com

System Configurator VME, VME64X AND VPX SYSTEMS CONFIGURED TO YOUR SPECIFICATION Pentair is an active participant on the VITA standards board and has one of the broadest offering of VITA products in the industry ranging from specialized VITA hardware to sophisticated systems that incorporate cooling, power supply and system management capabilities.

All our products meet or exceed VITA standards.

Configure a system chassis to your specific needs in a few simple steps using the online Schroff Systems Configuration from Pentair.

Reach out to the experts today and request a quote on a product tailored to your specific requirements!

FEATURES Configure Online: ĄĄ Configure system chassis products to your specific needs ĄĄ Select from hundreds of options ĄĄ Add notes and specifications for your custom needs ĄĄ Engage Schroff’s expert chassis design and manufacturing

capabilities

vita.opensystemsmedia.com/p372759

Schroff

http://www.pentairprotect.com

 AskSchroff@pentair.com  1-800-525-4682

Small Form Factor

HPERC-IBR-H Series Extreme Rugged System ADLINK’s HPERC-IBR-H Series is a tightly integrated military grade system offering advanced performance in a compact footprint.

Certified for MIL-STD-810G and IP67, the HPERC-IBR-H is a SWaPefficient system that provides high performance graphics capabilities and a wealth of I/O support for cameras and vehicle data busses required for mission and payload computing platforms.

The HPERC-IBR-H Series is a follow-on to ADLINK’s HPERC-IBR-M Series and features two models, the HPERC-IBR-HC coldplate mount system and the HPERC-IBR-HH finned-convection systems. At just 63.5mm x 150mm x 203mm, the compact system is almost 30% smaller than other leading competitive products.

FEATURES ĄĄ SWaP-efficient, sealed SFF system ĄĄ Dual- or quad-core Intel® Core™ i7 processor ĄĄ VITA 75 mount with passive cooling ĄĄ Soldered DDR3L-1333 8GB – Up to 16GB RAM ĄĄ Quad Gigabit Ethernet ĄĄ Available GPGPU on 16-lane 3rd generation PCI Express ĄĄ Triple display (DP/HDMI/DVI) support ĄĄ Extreme Rugged™ operating temperature: -40°C to +85°C vita.opensystemsmedia.com/p372741

ADLINK

www.adlinktech.com/Extreme-Rugged-System/ www.vita-technologies.com

angela.torres@adlinktech.com  408-360-0200 

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OpenVPX

VITA Technologies Resource Guide

PMC/XMC

XMC-1553 DUAL UTMC 1553 SUMMIT CONTROLLER PROGRAMMABLE BC, RT AND BM MODES The ALPHI XMC-1553 is a conduction cooled XMC (VITA-42) board. It uses the UTMC/AEROFLEX communication device as its 1553 bus controller, remote terminal, or BUS monitor terminal. Each single controller has a dual redundant channel with built in transceivers and external transformers for channels A and B. Each channel can be configured for Short Stub and Long Stub. Two independent memory blocks of 128KB RAM for each 1553 channel. Each 1553 can be configured for internal or external clock for its time tag clock. The board is supported in Windows™, Linux™ and VxWorks™. This is a perfect solution for a wide array of 1553 Communication applications such as: • • • •

Industrial and Military Test equipment supporting evaluation, simulation Monitoring and analysis Operational equipment such as avionics, space satellite systems, aircraft onboard systems • Commercial systems, and many others

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

◆ VITA 42 compliant ◆ 1x Lane PCI Express ◆ Aeroflex SUMMIT MIL-STD-1553 ◆ 2 Channels Dual Redundant ◆ Long/Short stub

TECHNICAL SPECS ĄĄ ◆ Conduction Cooled ĄĄ ◆ Single wide XMC 2.92” x 5.87” ĄĄ ◆ Industrial Temperature: -40°C to +85°C

APPLICATION AREAS ĄĄ Satellite, Avionics and Ground vehicle VITA.opensystemsmedia.com/p372455

 Support@Alphitech.com  480-838-2428

ALPHI Technology Corporation www.Alphitech.com

PMC/XMC

PCI Express 100-Ohm and 85-Ohm Card-Edge Connectors Pictured in gray box: 25° 5V/32-Bit Connector, 5V/64-Bit Right-Angle, 5V/32-Bit Right-Angle, and 2x25 Right-Angle Card-Edge Connector.

All Meritec PCI connector footprints are identical to the vertical mount versions for joint compatibility in the PCB design.

The Right-Angle Through-Hole Mount PCIe connectors (shown at the top right) solve the space problem in applications where a card-edge connector is needed and where low clearance above PCB prohibits use of vertical configurations.

Visit our newly-designed website http://www.meritec.com for your Direct Connection to the Xtreme High-Speed Xperts!

FEATURES ĄĄ Parallel daughter-card mating for low-profile applications ĄĄ Plastic cover protects connectors from dust and debris, and supports connector for hybrid soldering applications requiring convection/IR heating ĄĄ Compliant board-locating posts ĄĄ Card-slot heights 5.84mm to 11.17mm for 85 ohm, meets PCIe 3.0 Specification ĄĄ Card-slot heights 5.84mm to 16.68mm for 100 ohm, meets PCIe 2.1 Specification ĄĄ Insert molded using liquid-crystal polymer for stability in hybrid board applications involving surface-mount components requiring convection or IR heating ĄĄ Offers PCB design flexibility ĄĄ Designed to mate with .062"-thick daughter card vita.opensystemsmedia.com/p372750

Meritec

www.meritec.com

www.facebook.com/pages/Meritec/142140812492429

 www.linkedin.com/company/meritec-inc.

42 | VITA Technologies Resource Guide Summer 2015

 888-MERITEC (637-4832)  info@meritec.com

www.vita-technologies.com

Digital Receiver Instrumentation Series The Digital Receiver is a turnkey solution providing an integrated data logger, digital down conversion (DDC), and a spectrum analyzer (FFT) in a compact system. The solution consists of three parts: An FPGA-based analog digitizer module and a PC-based host controller plus an optional firmware development kit to allow customization.

A development kit is available to support creation of advanced custom firmware by logic developers. Netlist versions of the IP cores used to build the Digital Receiver are provided, so developers can integrate with their own custom cores to create an enhanced receiver design.

Existing Innovative XMC module owners need only purchase the software/firmware to achieve full Digital Receiver functionality.

Download data sheets and pricing now!

FEATURES V61x Series (Air Cooling) ĄĄ Dual XMC I/O Module Sites ĄĄ Xilinx Virtex-6 SX475T-2 FPGA ĄĄ Intel i7 Quad Core, 16GB RAM, SSD

K70x Series (Conduction Cooling) ĄĄ Dual FMC I/O Module Sites ĄĄ Xilinx Kintex-7 XC7K410T-2 FPGA ĄĄ Intel i7 Quad Core, 16GB RAM, SSD vita.opensystemsmedia.com/p372747  sales@innovative-dsp.com  805-383-8994

Innovative Integration

www.innovative-dsp.com/products.php?product=DIG-RX-Overview

Systems

ePC-Duo The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need.

Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes.

Up to 4 HDD for data logging.

Uniquely customizable – Dual XMC sites for I/O, user-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.

Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN). Optional, stand-alone, autonomous operation with GPS or network-synchronized sampling.

Rugged – SSD boot drive support in a compact, rugged 250x195mm footprint that is ready for embedded operation.

8-36V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.

Download data sheets and pricing now!

Innovative Integration

www.innovative-dsp.com/products.php?product=ePC-Duo www.vita-technologies.com

FEATURES ĄĄ Combines an industry-standard COM Express CPU module with dual XMC I/O modules in a compact, stand alone design ĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" D ĄĄ Stand-alone operation: Able to operate diskless and headless ĄĄ Windows, Linux and RTOS support ĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to industrial control modules. ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory** ĄĄ Integrated timing and triggering support for I/O includes optional GPS, IEEE-1588 or IRIG-disciplined clock ĄĄ Supports Innovative X3, X5, and X6 I/O module features for private data channels, triggering and timing features ĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, HD audio ĄĄ System expansion supported with dual 10 GbE ethernet links ĄĄ FPGA for custom I/O and interfaces **Data rate dependent on the COM Express module capabilities.

vita.opensystemsmedia.com/p372450  sales@innovative-dsp.com  805-383-8994

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Systems

VITA Technologies Resource Guide

Systems

ePC-K7 The ePC-K7 is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance FMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-K7 reduces time-to-market while providing the performance you need.

Distributed Data Acquisition – Put the ePC-K7 at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 HDD for data logging.

Uniquely customizable – Dual FMC I/O module sites – add anything from RF receivers to industrial control modules. User-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.

Remote or Local Operation – Continuous data streaming up to 1000MB/s or 2 x Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPS-synchronized sampling.

Rugged – SSD boot drive support in a compact, rugged 8x11" footprint that is ready for embedded operation.

8-36V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.

FEATURES ĄĄ Combines an industry-standard COM Express CPU module with dual FMC I/O modules in a compact, stand alone design ĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAs ĄĄ Small form factor: 5" H x 8" W x 11" D ĄĄ Conduction cooled design: Fins or cold-plate ĄĄ Stand-alone operation: Able to operate headless, booting from SSD ĄĄ Windows, Linux OS support ĄĄ Dual VITA 57 FMC I/O module sites. Add anything from RF receivers to industrial control modules. ĄĄ I/O sites (VITA 42.3) deliver >3000MB/s to CPU memory ĄĄ Integrated timing and triggering support for IO includes GPS, IEEE1588 or IRIG-disciplined clock ĄĄ Supports Innovative and third-party FMC modules for private data channels, triggering and timing features ĄĄ USB3.0 x6, Gb Ethernet x2, SATA x4, DisplayPort, Touch Screen ĄĄ Up to 4 SSD or HDD (2.5 in) AC or DC operation

Download data sheets and pricing now!

vita.opensystemsmedia.com/p371726  sales@innovative-dsp.com  805-383-8994

Innovative Integration

www.innovative-dsp.com/products.php?product=ePC-K7

Systems

mini-K7 The mini-K7 is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance FMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the mini-K7 reduces time-to-market while providing the performance you need.

Distributed Data Acquisition – Put the mini-K7 at the data source and reduce system errors and complexity. Optional GPS or IEEE1588-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 SSD for data logging.

Uniquely customizable – Dual FMC sites for I/O, user-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.

Remote or Local Operation – Continuous data streaming up to 3200 MB/s to SSD or Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPSsynchronized sampling.

Rugged – SSD boot drive support in a compact, rugged footprint that is ready for embedded operation.

9-18V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.

Download data sheets and pricing now!

Innovative Integration

www.innovative-dsp.com/products.php?product=Mini-K7

44 | VITA Technologies Resource Guide Summer 2015

FEATURES ĄĄ Combines an industry-standard COM Express CPU module with a single FMC I/O module in an extremely compact, stand alone design ĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAs ĄĄ Small form factor: 4" H x 7" W x 10" D ĄĄ Conduction cooled design: Fins or cold-plate ĄĄ Stand-alone operation: Able to operate headless, booting from SSD ĄĄ Windows, Linux OS support; RTOS availability ĄĄ Single VITA 57 FMC I/O module site. Add anything from RF receivers to industrial control modules. ĄĄ Integrated timing and triggering support for I/O includes GPS or IEEE1588-disciplined clock ĄĄ Supports Innovative and third-party FMC modules for private data channels, triggering and timing features ĄĄ 4 USB ports, 1Gb Ethernet, SATA (up to 4), DisplayPort Touch Screen ĄĄ Up to 2 SSD (1.8 in); AC or DC operation vita.opensystemsmedia.com/p372228

sales@innovative-dsp.com  805-383-8994 

www.vita-technologies.com

FEATURES ATCA & MicroTCA Systems Pixus Technologies’ ATCA® shelves and backplanes support a wide range of applications in telecom, LTE, enterprise, military/aerospace, and HPC environments. All shelves are designed to meet NEBS. Pixus provides 3U, 5U, 6U, 8U, and 13U ATCA shelves with AC and DC power options. Full redundancy is provided with dual shelf managers, dual or quad cooling units, dual Hubs, and dual power modules. Pixus 40GBASE-40KR4 backplanes are monolithic with a high level of signal integrity in dual star, full mesh, or replicated mesh.

Pixus Technologies’ MicroTCA® chassis and systems are based on the PICMG® MicroTCA.0 R1.0 specification. With support for AC and DC input power, the 19" rackmount mTCA systems support a range of applications at the edge of the network in telecom, industrial, and military environments. Applications include network appliances, deep packet inspection, surveillance, protocol conversion, and SIGINT.

PXS1340 13U ATCA Shelf ĄĄ 40GBASE-KR4 Dual-Star or Full-Mesh 14-Slot Backplane ĄĄ Front-to-Rear airflow supporting over 270W/Slot cooling performance ĄĄ Full redundancy with dual ShMCs, Hubs and, PEM and squad CUs PXS0640 Slot Saver 6U ATCA Shelf ĄĄ 40GBASE-KR4 Dual-Star, Full-Mesh 6-Slot Backplane ĄĄ Integration of Hubs with ShMCs adds 2 node slots PXS1PXS0108 1U MicroTCA® Chassis ĄĄ Low cost MicroTCA platform ĄĄ Active backplane removes the need for expensive Power Entry Modules (PEMs) ĄĄ Side-to-side push-pull cooling removes the need for expensive Cooling Units (CUs) ĄĄ Supports up to 6 mid-height AMCs and 2 MCHs PXS0309 3U ATCA Hybrid Chassis with 8 AMCs ĄĄ 19" rackmount 3U ATCA Hybrid AMC Chassis ĄĄ 1 ATCA slot and 8 mid-size AMC slots vita.opensystemsmedia.com/p372778

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

 sales@pixustechnologies.com  519-885-5775

Pixus Technologies

www.pixustechnologies.com

VME

MVME2500 Series Artesyn’s MVME2500 Series makes a perfect migration path for older generation MVME3100, MVME4100, MVME5100 and MVME5110.

On-board memory includes up to 2GB DDR3 memory and 512KB non-volatile MRAM. The MVME2502 variant has 8GB soldered eMMC solid state memory for additional rugged, non-volatile storage.

Connectivity includes Gigabit Ethernet, USB 2, serial ports, SATA port and either one or two PMC/XMC sites with the MVME2500 and MVME2502 respectively. A hard drive mounting kit is available for Serial ATA or solid state hard drives. Extended temperature, rugged variants and conformal coating are available. The MVME2500 Series is ideal for automation, medical, and military applications such as railway control, semiconductor processing, test and measurement, image processing, and radar/sonar.

FEATURES ĄĄ VME SBC with Freescale QorIQ P2010 or P2020 processor ĄĄ Processor delivers an impressive performance-to-power ratio with

single- or dual-core frequencies up to 1.2 GHz at less than 8W

ĄĄ Up to 2GB DDR3 and 512KB non-volatile MRAM ĄĄ Connectivity includes Gigabit Ethernet, USB 2, serial, SATA ĄĄ Single PMC/XMC site on MVME2500 variant ĄĄ MVME2502 variant has 8GB soldered eMMC and two PMC/XMC sites ĄĄ Conformal coating available ĄĄ Optional rear transition module ĄĄ Optional hard drive mounting kit vita.opensystemsmedia.com/p372745

Artesyn Embedded Technologies www.artesyn.com/computing www.vita-technologies.com



computingsales@artesyn.com

 linkedin.com/company/artesyn

 +1 (888) 412-7832 twitter.com/artesynembedded



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Systems

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VME

MVME8100 Series MVME8100 Series is a high performance 6U VME/VXS SBC: The MVME8100 features the Freescale QorIQ P5020 processor with up to 8GB DDR3-1333MHz ECC memory, 512K NVRAM, and 8GB eMMC NAND Flash; while the more MVME8110 variant features the Freescale QorIQ P5010 processor supporting up to 4GB high speed DDR3-1200 MHz ECC memory, 512KB MRAM, and 8GB eMMC NAND Flash, for more cost-sensitive applications.

The MVME8100 Series is offered in commercial and fully rugged variants for extreme environments with extended shock, vibration, temperatures and conduction cooling. It is designed for a range of high end industrial control such as SPE and photo lithography and C4ISR, including radar/sonar. It will provide technology insertion to prolong current programs while providing more computing performance and data throughput. Supported operating systems include Linux, Wind River VxWorks, and Green Hills INTEGRITY.

FEATURES ĄĄ VME/VXS SBC with Freescale QorIQ P5020/P5010 ĄĄ MVME8100: Up to 8GB DDR3-1333MHz ECC Memory, 512KB NVRAM ĄĄ MVME8110: Up to 4GB high speed DDR3-1200 MHz ECC memory,

512KB MRAM

ĄĄ Embedded NAND Flash (8GB eMMC) ĄĄ Extended temperature and conduction cooled variants ĄĄ Conformal coating available vita.opensystemsmedia.com/p372746

Artesyn Embedded Technologies www.artesyn.com/computing



computingsales@artesyn.com

 linkedin.com/company/artesyn

 +1 (888) 412-7832 twitter.com/artesynembedded



VME

V120 VME PCI Express Crate Controller The V120 is a VME bus master usable as a crate slot 1 arbiter or as a secondary controller. Standard PCI Express cable driver boards allow any PC to drive one or two V120s over PCI Express cable assemblies up to 7 meters long.

Designed for long-term availability, the V120 contains no proprietary VME chips. Clean, simple architecture means no jumpers and no setup needed for basic VME I/O. The V120 is supported by Highland’s free open source Linux driver and library.

VME module registers are directly mapped into PC address space. The V120 provides 8192 remapping registers, each controlling a 16 kbyte PC-to-VME translation page with flexible timing and endian controls.

DMA and VME64 support are optional.

Ethernet and USB ports provide additional ways to access VME and V120 intervals. Bus cycle analysis, power supply and temperature monitoring are standard. The V120 is 100% software compatible with the VXI format V124.

FEATURES ĄĄ PC memory-mapped VME Crate Controller in single-wide 6U format ĄĄ Cabled PCIe connects to PC over up to 7 meter PCI Express cable ĄĄ Provides 8192 16kB VME mapping pages; individual page descriptors support address mapping/modifiers, speed options, dynamic endian swapping ĄĄ Includes concurrent Ethernet and USB ports ĄĄ Diagnostics: power supply and temperature ĄĄ Reads back DTACK speed, address/data, and errors for any transaction ĄĄ Front panel LEDs and bus signal scope monitors are provided ĄĄ Optional DMA and VME64 support ĄĄ No proprietary VME chips: designed for long-term availability ĄĄ Clean, simple architecture: no jumpers and no setup needed for basic VME I/O vita.opensystemsmedia.com/p372487

Highland Technology, Inc.

www.highlandtechnology.com/DSS/V120DS.shtml

46 | VITA Technologies Resource Guide Summer 2015

info@highlandtechnology.com  415-551-1700 

www.vita-technologies.com

Intermas – InterRail Intermas develops electronic enclosure systems: Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

FEATURES ĄĄ InterRail® products meet tough physical demands and vibration

proofs used for railway engineering, traffic engineering, and power station engineering.

ĄĄ 19" subracks and housings with flexible internal layout.

Go to

ĄĄ EMI- and RFI-shielded protection using stable stainless steel

contact springs ensuring permanent and reliable bonding.

www.Intermas-US.com

ĄĄ Connectors and wiring accessories.

for our new catalog.

ĄĄ Customization available. vita.opensystemsmedia.com/p372664

Intermas US LLC

www.Intermas-US.com

 intermas@intermas-us.com  800-811-0236

VME

2mm High-Performance Metric (HPM) Cable Assemblies Meritec HPM cable assemblies are a modular solution for highperformance backplane interconnect requirements. They are designed to mate and work reliably with standard 2mm connector shrouds. The interlocking stackable wafers match the popular IEC-61076-4-101 types A, B, and C housings, as well as the popular B22 shroud utilized for rP2/rP5 CompactPCI I/O applications. The shroud system is well suited for rugged applications due to its unique retention system. B, the cable assembly will lock tightly in place. This finished system securely retains the cable connector against the strain of a cable bundle. The self-latching action of the design is particularly convenient for hard-to-reach locations.

Visit our newly-designed website http://www.meritec.com for your Direct Connection to the Xtreme High-Speed Xperts!

FEATURES ĄĄ Compatible with: Framatome Millipac 1, Berg Metral, Cannon Tempus,

Ceco FX-1, Amp Z-Pack FB, Other IEC 1076-4-102, Compliant Backplane Connectors

ĄĄ 2mm x 2mm Spacing ĄĄ 4 Contacts per row, Polarized, Shielded, Stackable Wafers ĄĄ Individual Wafers can be Stacked up to 25 ĄĄ Second end Terminations include BNCs, SMAs, D-Subs, 38999,

Circulars, RJ45, Sata/E-Sata, USB and more …

vita.opensystemsmedia.com/p372749

Meritec

www.meritec.com www.vita-technologies.com

www.facebook.com/pages/Meritec/142140812492429

 www.linkedin.com/company/meritec-inc.

 888-MERITEC (637-4832)  info@meritec.com

VITA Technologies Resource Guide Summer 2015 |

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VME

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VME

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor.

Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

For more detailed product information,

FEATURES ĄĄ

Made in the USA

ĄĄ

Most rack accessories ship from stock

ĄĄ

Modified ‘standards’ and customization are our specialty

ĄĄ

Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ

System monitoring option (CMM)

ĄĄ

AC or DC power input

ĄĄ

Power options up to 1,200 watts

please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.

vita.opensystemsmedia.com/p371649

Vector Electronics & Technology, Inc. www.vectorelect.com

48 | VITA Technologies Resource Guide Summer 2015

 inquire@vectorelect.com  800-423-5659

www.vita-technologies.com

Freescale T4-based Single-slot 6U VME/VPX SBCs Aitech Defense Systems Inc. has enhanced the C111 and C112, two of its Freescale T4-based single-slot 6U SBCs to include the new, low power, multi-core, multi-processor T4080 QorIQ with AltiVec technology.

The T4080 processor significantly enhances computing performance and optimizes energy efficiency for lower power, high-end, floating point computing applications. Like the 12-core T4240 and 8-core T4160 also available on the SBCs, the 4-core T4080 QorIQ processor features on-chip high speed L1 and L2 caches as well as an integrated bus, a high speed memory switch fabric and I/O controllers.

The Aitech C111/C112 family fully supports Freescale’s Trust Architecture 2.0. The entire T4xxx series of QorIQ processors provides secure boot and debug, tamper detection, volatile hash key storage, alternate image and image revocation functionality in addition to secure virtualization and hardware support for hypervisors. These features address key issues in providing a highly secure processing environment for sensitive data security and supervisory control typically found in manned and unmanned air and ground vehicles.

With their exceptional resistance to thermal shock and mechanical shock and vibration, the 6U VME C111 and 6U VPX C112 SBCs are ideal for use in high-end commercial, rugged industrial and defense applications where board performance and costs can be uniquely tailored to the application.

The new SBCs are equipped with two PMC/XMC sites to support PCI/PCIe for high-speed functions and to expand board functionality.

Available in either conduction- and air-cooled versions, the boards can be used in a diverse set of applications, limited only by the imagination of the software developers.

Ideal for legacy VMEbus applications, the C111 supports backplane pin-out compatibility with previous generations of Aitech PowerPC SBCs – including the popular Aitech C102 dual processor SBC – eliminating costly system backplane changes.

The C111’s variety of standard I/O interfaces includes four Gigabit Ethernet ports as well as a SATA 2.0 port, dual USB 2.0 ports and two optional, dual-redundant MIL-STD-1553 interface ports, multi-protocol serial ports and multiple discrete I/O lines to enable maximum data storage, inter-system communications and other on-board accommodations.

The C112 supports VPX (VITA 46.0) and OpenVPX (VITA 65) platforms and offers the same I/O as the C111, only more, including up to six Gigabit Ethernet ports and multiple backplane switch fabric options.

The C111 and C112 each provide 4 GB of high speed DDR3 SDRAM divided into two separate memory channels for efficient processor-to-memory or memory-to-memory message passing and data transfers. Additional memory resources include 256 MB of NOR flash memory, up to 16 GB of Flash disk mass storage and 512 kB of NVRAM (MRAM).

FEATURES C111 Technical Features: ĄĄ ĄĄ ĄĄ ĄĄ

6U VME64x single-slot SBC Low-power Freescale QorIQ multicore SoC processor (T4080) with Altivec 4 GB high speed DDR3 SDRAM with ECC Multiple I/O interfaces: four Gb E; two USB 2.0, one SATA 2.0, 10 serial ports and 16 discrete I/O lines

C112 Technical Features: ĄĄ ĄĄ ĄĄ ĄĄ

ĄĄ

6U VPX single-slot SBC (VITA 46.0 & VITA 65) Low-power Freescale QorIQ multicore SoC processor (T4080) with Altivec 4 GB high speed DDR3 SDRAM with ECC Multiple I/O interfaces: six Gb E; two dual-redundant MIL-STD-1553B, two USB 2.0, one SATA 2.0, 10 serial ports and 16 discrete I/O lines Multiple switch fabric options – PCIe, 10G, SRIO

vita.opensystemsmedia.com/p371908

Aitech Defense Systems, Inc. www.rugged.com

www.vita-technologies.com





sales@rugged.com https://www.linkedin.com/company/Aitech

 888-Aitech-8 http://twitter.com/AitechDefense



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Universal AC Input VITA 62 3U Power Supply Dawn VME Products PSC-6236 universal AC input VITA 62 compliant 3U power supply for air or conduction cooled OpenVPX systems. True 6 channel supply with up to 400 watts output. Mission critical wide temperature range at high power. Input 85 VAC to 264 VAC, 47 Hz to 400 Hz. Can be special ordered to support high current single channel applications. Embedded RuSH™ technology actively monitors voltage, current and temperature, and provides protective control. Ruggedized – VITA 47 compliant. Rugged, Reliable and Ready. Current share compatible with additional PSC-6236 units.

FEATURES ĄĄ Universal AC input VITA 62 3U 400W AC/DC power supply with full

OpenVPX support

ĄĄ Air cooled, bulkhead conduction cooled and reverse side wedge lock

conduction cooled models

ĄĄ AC input: Single phase 85 VAC to 264 VAC, 47 Hz to 400 Hz ĄĄ DC output PO1: +12V/16.7A, PO2: +5V/40A, PO3: +3.3V/30A,

Can be special ordered to support high current single channel applications.

Applications: Dawn’s PSC-6236 supports virtually any mission critical application where universal AC input VITA 62 compliant 6 channel power output with precision monitoring and control is required. Dawn offers application-specific VITA 62 compliant power supply design, manufacturing and production through modifications to its PSC-6236 platform, and can incorporate requirements into a customized power management solution for prototyping and development.

+3.3V_Aux/4A, +12V_Aux/4A, -12V _Aux /3A

ĄĄ High power mission critical wide temperature range up to -40 °C to

+85 °C at the thermal interface

ĄĄ Microprocessor technology actively monitors voltage, current and

temperature, and provides protective control

ĄĄ Over voltage, over current and over temperature protection ĄĄ I2C status and control user and IPMB interface vita.opensystemsmedia.com/p372468  sales@dawnvme.com  510-657-4444

Dawn VME Products www.dawnvme.com

VPX

6U Universal Chassis/Backplane Assembly The LCR-ES 6U Universal Chassis/Backplane Assembly provides our customers with an ideal, customizable solution for open-standards application development. Able to support 6U VPX, VME, cPCI, or custom backplanes, it provides between 2 and 21 slots depending on the specific standard.

FEATURES

The three managed tubeaxial fans provide over 500 CFM with a low-noise profile, and the Assembly can support two AC/DC power supplies with universal AC inputs and a wide variety of DC outputs to meet your specific needs. Power supplies include health monitoring of voltage, current, and temperature with local and remote status available.

ĄĄ 19" rackmount or bench-top, IEEE 1101.10 compliant,

lightweight aluminum frame

ĄĄ Forced-air convection, bottom-to-top cooling ĄĄ 4 x 120mmx120mmx25mm fans, 171 CFM each ĄĄ 85/264VAC, 1 or 3 phase, 47-440 Hz ĄĄ Optional DC input, up to 24 custom outputs ĄĄ Optional input connectors, fuses or circuit breakers vita.opensystemsmedia.com/p372777

LCR Embedded Systems

www.lcrembeddedsystems.com

50 | VITA Technologies Resource Guide Summer 2015

sales@lcrembedded.com  1-800-747-5972 

www.vita-technologies.com

VPX PLUS™ Design | Test | Deploy Meritec’s VPX PLUS™ is today’s most versatile VPX MULTIGIG RT compatible cabling system, allowing users to access and expand upon the traditional VPX backplane. When bringing out VITA 46 and Open VPX I/O, developers can utilize eSATA, Display Port, USB, Serial Rapid I/O, InfiniBand, Ethernet, Meritec’s HERCULES® and other MIL-38999 connectors. Meritec’s VPX Plus System, along with its I/O capabilities, is designed for full bandwidth testing and can be adapted for deployment.

The standard VPX cabling terminology applies to Meritec’s VPX Plus cabling system. Fat pipes, thin pipes, ultra-thin pipes are all available in multiple lengths as COTS products; and thanks to Meritec’s unique stacking of wafers, up to eight (8) wafers can be stacked to achieve final results, thus creating a wide variety of development options. Your link to The Xtreme High-Speed Xperts – http://meritec.com/wp-content/flipbooks/vpx-plus/

Visit our newly-designed website http://www.meritec.com for your Direct Connection to the Xtreme High-Speed Xperts!

FEATURES ĄĄ The Meritec VPX Plus is a cost effective and flexible alternative to expensive rear-transition modules. ĄĄ VPX Plus has less electrical losses than both backplane and rear-transition module circuitry. ĄĄ Provides a connection method allowing backplane circuit rerouting with small electrical losses and low investment. ĄĄ Adds functionality and flexibility to any system ĄĄ 6U and 3U housing kits allow you to maintain complete control from test to deployment. ĄĄ Deployment rails, supplied with capped screws, enhance the ruggedness and security of the system when deployed into real-world environments ĄĄ COTS and standard pricing ĄĄ Made In The USA vita.opensystemsmedia.com/p372490

Meritec

www.meritec.com

www.facebook.com/pages/Meritec/142140812492429

 www.linkedin.com/company/meritec-inc.

 888-MERITEC (637-4832)  info@meritec.com

VPX

6U VPX – 700 Watt AC/DC Power Supply NAI’s VPX56-6 power supply supports VITA 46.0 and VITA 65 systems with an off-the-shelf solution. The 700-Watt AC/DC power supply plugs directly into a standard 6U VPX chassis with a VITA 62 power supply slot (1.0” slot).

FEATURES ĄĄ Ideal for rugged 6U VPX power applications

The conduction-cooled VPX56-6 accepts both a 3Ø AC or +270Vdc input compliant with the input transients of MIL-STD-704F. It provides six outputs and I/O per the VITA 62 standard.

ĄĄ Standard VPX-compatible connectors and I/O per VITA 62

The COTS power supply is specifically designed with NAVMAT component derating for rugged defense and industrial applications. It is also designed to meet the many harsh environmental requirements of military applications.

ĄĄ Operates at full load through the entire -40°C to +85°C

ĄĄ Supports VITA 46.0 and VITA 65 systems ĄĄ Integrated EMI filtering per MIL-STD-461F ĄĄ Input transient protection per MIL-STD-704F

ĄĄ ĄĄ ĄĄ ĄĄ

temperature range Remote error sensing BIT User programmable Current share is available

Made in the USA Certified Small Business

vita.opensystemsmedia.com/p372753

North Atlantic Industries, Inc.

www.naii.com/700-Watt-AC-DC-Power-Supply-6U-VPX/P279 www.vita-technologies.com

www.naii.com  631-567-1100 

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VME-VPX System Health Monitors Stand-off and 6U System Health Monitors with RTMs: VME and VPX 6U System Health Monitors from the Orbit Electronics Group are among the most advanced such components available today.

A companion rear transition module is available for extended I/O. The HMC-A has 20 analog sensors (4 onboard and 16 external), plus 8 digital sensors. Voltage monitoring accepts 8 inputs: +3.3 VDC, +5 VDC, +12 VDC, and -12 VDC, plus four user-defined positive voltages from 0 VDC to +28 VDC. Also available in 3U form factor with highly customizable GUI.

VME-VPX Held to a Higher Standard.

FEATURES ĄĄ Unique, proprietary Graphical User Interface (GUI) that enables

system designers to quickly and easily establish a broad range of operating parameters.

ĄĄ Ethernet; USB and/or RS 232 interfaces; set-up; data logging; field

upgradable firmware; and data password protection.

ĄĄ Stand-alone form factor sizes are 80 x 120 mm and 51 x 51 mm

(see complete specs at www.vmevpx.com).

ĄĄ ICS is a Subsidiary of Orbit International (www.orbitintl.com) and a

member of the Orbit Electronics Group.

vita.opensystemsmedia.com/p372756  info@vmevpx.com  +1 866 319-8085

Integrated Combat Systems www.vmevpx.com

VPX

3U VPX 4th Generation Intel i7 Single Board Computer – VPX7664 Orion Technologies introduces its new small form-factor rugged computer. Drawing its processing power from a new 4th generation Intel Haswell processor, our 3U VPX design makes it ideal for high performance small form factor applications.

Orion Technologies has taken advantage of the significant speed increase of PCIe 3.0 by offering three PCIe 3.0 fatpipes. Along with two 10G Ethernet ports (auto negotiate 10G/1G/100M) we offer one of the highest performance processors on the market. Our configurable "personality module" allows for maximum flexibility and configuration options. With I/O expansion and an XMC site this high performance processor is ideal for multiple applications.

We can couple this with one of our high speed backplanes which are capable of supporting PCIe 3.0 at full speed, making our solution one of the highest performance systems available in the market.

FEATURES ĄĄ Multi-Core 4th Generation Intel® CoreTM i7 ĄĄ Up to 16GB of soldered DDR3 SDRAM with ECC and Up to 64GB of

on-board NAND Flash

ĄĄ Trusted Platform Module ĄĄ One 8-lane PCIe 3.0 XMC slot (Vita 42.3) ĄĄ Three 4-lane PCIe v3.0 ports on VPX P1 (Vita 46.4) ĄĄ Two 10GbE Base-T ports (auto negotiate 10G/1G/100M) ĄĄ Anti-Tamper features available vita.opensystemsmedia.com/p372700

Orion Technologies

www.oriontechnologies.com

 sales@oriontechnologies.com

 twitter.com/OrionEmbedded  www.facebook.com/OrionTechnologies  www.linkedin.com/company/orion-technologies-llc  407-476-2120

52 | VITA Technologies Resource Guide Summer 2015

www.vita-technologies.com

VPX & OpenVPX Systems and Backplanes Pixus Technologies provides VPX and OpenVPX packaging solutions for a range of military and aerospace applications.

The Pixus VPX packaging solutions include subracks, enclosures, backplanes, chassis, and integrated system platforms. In addition, Pixus provides components and accessories such as fans, power supplies, card guides, guide rails, front panels, filler panels, and handles.

VPX systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal technologies. VPX chassis and systems can be modified to meet customer requirements without NRE.

FEATURES VPX & OpenVPX ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX and OpenVPX backplanes ĄĄ Complies with VITA 46, VITA 48, VITA 65, VITA 1, VITA 1.1,

IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11

VME & VME64x ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME and VME64x backplanes ĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11 vita.opensystemsmedia.com/p372779

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

 sales@pixustechnologies.com  519-885-5775

Pixus Technologies

www.pixustechnologies.com

VPX

Themis High-Density Servers Suited for computing environments where server Size, Weight, and Power (SWAP) is important, Themis RES High Density (HD) servers are designed for virtualization, ISR, Big Data Analytics, radar processing, image processing, large Hadoop clusters, and a multitude of applications that require high-compute density and low latency access to large-data storage. RES HD Servers double compute density, enable a 50% savings in rack space, and reduce system weight by nearly 50% with per server weights as low as seven pounds.

Available in a 2RU (four bay) or 3RU (six bay) chassis, RES-HD servers provide maximum system configuration flexibility and functionality with processor, storage, high-speed switch, and system management module options. Combining leading-edge components that include Intel® Xeon® E5-2600 v3 Series processors and SuperMicro motherboards, RES servers feature expansion slots, extensive high-speed front or rear I/O, storage, and enhanced reliability options.

FEATURES ĄĄ SWAP-C Ready ĄĄ 2RU or 3RU Chassis Options ĄĄ Intel® Xeon® E5-2660 v3 Series processors, and Supermicro

X9DRT-IBFF motherboards

ĄĄ Supports up to three 56 Gb/sec Infiniband (IB) or 40 Gb Ethernet ports

to provide industry leading I/O bandwidth

ĄĄ Maximum system configuration and expansion flexibility with processor, ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

storage, high-speed switch, and system management modules options Enhanced reliability for shock, vibration, and extended temperature 0° C to 55° C operating temperature range 8% to 90% operating humidity (non-condensing) Operating vibration: 4.76 Grms, 5Hz to 2000Hz (SSD) MIL-STD 810F, EN60000, CE Mark

vita.opensystemsmedia.com/p372688

Themis Computer

www.themis.com/hd www.vita-technologies.com



www.themis.com/headquartersandsales

 linkedin.com/company/17952

 510-252-0870

 twitter.com/Themis_Computer

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te.com/VPX Rugged to the Core TE Connectivity’s (TE) Fortis Zd, Mezalok and MULTIGIG RT 2-R connectors provide extreme ruggedness and reliability in harsh environments.

Fortis Zd

Fortis Zd Connector • Modular, backplane connector systems • 10 Gb/s+ • 4-point contact redundancy • Ruggedized for harsh environments

Mezalok Connector

Mezalok

• 5 GHz+ • 500 mating cycles • 4-point contact redundancy • Available in 60, 114 and 320 positions and stack heights options 10, 12, 15 and 18 mm

Multigig RT 2-R

MULTIGIG RT 2-R Connector • Quad-redundant contact system • Rugged survivability – High level shock and vibration beyond VITA 47 • Backward compatibility to VITA 46 connector system • “Pinless” interface tested to 10,000 mating/unmating cycles

vita.opensystemsmedia.com/p372780

TE Connectivity Ltd. te.com/VPX

54 | VITA Technologies Resource Guide Summer 2015

 1-800-522-6752

www.vita-technologies.com

RUGGED CAPABILITY WITHOUT COMPROMISE.

You need embedded solutions that work where you work. Brilliant enough to exceed your performance expectations. Rugged enough to take a beating in the process. Now you can have it all â&#x20AC;Ś from a team that knows how to make things work smarter and tougher.

GE Rugged.

Embedded brilliance.

gedefense.com

Got Tough Software Radio Design Challenges?

Unleash The New Virtex-7 Onyx Boards!

Pentek’s Onyx® Virtex-7 FPGA boards deliver unprecedented levels of performance in wideband communications, SIGINT, radar and beamforming. These high-speed, multichannel modules include: • A/D sampling rates from 10 MHz to 3.6 GHz • D/A sampling rates up to 1.25 GHz • Multi-bandwidth DUCs & DDCs • Gen3 PCIe with peak speeds to 8 GB/sec • 4 GB SDRAM for capture & delay • Intelligent chaining DMA engines • Multichannel, multiboard synchronization ® Board Support Libraries • ReadyFlow ® Design Kit & Installed IP • GateFlow FPGA ® • GateXpress FPGA - PCIe configuration manager • OpenVPX, AMC, XMC, PCIe, cPCI, rugged, conduction cooled • Pre-configured development system for PCIe • Complete documentation & lifetime support

With more than twice the resources of previous Virtex generations plus advanced power reduction techniques, the Virtex-7 family delivers the industry’s most advanced FPGA technology.

Call 201-818-5900 or go to www.pentek.com/go/vitaonyx for your FREE online Putting FPGAs to Work in Software Radio Handbook and Onyx product catalog.

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 • Phone: 201.818.5900 • Fax: 201.818.5904 • e-mail:info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2013 Pentek, Inc. Pentek, Onyx, ReadyFlow, GateFlow & GateXpress are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.