Development of Pulverized Palm Kernel Shells Based Particleboard

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International Journal of Material and Mechanical Engineering (IJMME) Volume 3 Issue 3, August 2014 DOI: 10.14355/ijmme.2014.0303.01

Development of Pulverized Palm Kernel Shells Based Particleboard R.S. Fono-Tamo*1, O.O. Idowu2, F.O. Koya2 Bells University of Technology, Ota, Nigeria

1

Obafemi Awolowo University, Ile-Ife, Nigeria

2

ftrromeo@gmail.com

*1

Abstract The study evaluated the performance characteristic of pulverised Palm Kernel Shell (PKS)-based particleboard. The pulverised palm kernel shell was compounded with other ingredients (such as adhesive, saw dust) in the composite development phase. Standard wood-based particleboard and pulverized PKS-wood based particleboard were produced following standard procedure. The particleboards were evaluated and compared with regards to their physical, mechanical and thermal properties. Furthermore, the properties and performance characteristics of the particleboards were compared with the recommended standard. The properties of the PKS-wood based and woodbased particleboards were: 2.557 and 5.654 MPa. And modulus of rupture was 4.093 and 2.454 MPa, modulus of elasticity; 0.50459 and 0.7524 MPa, stress at proportional limit; 5.74691 and 7.14242 J, work at maximum load; 0.72 and 0.54 g/cm3, air-dried density; 10.50 and 11.89 %, moisture content; 1.705 and 3.770 MPa, internal bond strength; 0.50 and 0.13 W/mK, thermal conductivity; and 10.25 and 11.75 %, thickness swelling. This work thus established that PKS may be combined with saw dust as base material in the manufacture of standard particleboards.

Keywords Composites; Particleboard; Palm Kernel Shell; Bending Strength

Introduction Particleboard is a panel product manufactured from compressed particles of wood or other ligno-cellulosic materials (that is, agricultural plant materials primarily in form of discrete molecules) and an adhesive (Nemli and Aydin, 2007). Particleboard has been found to have typical applications in furniture, cabinets, flooring, table, counter and desktops, office dividers, wall and ceiling, stair treads, home constructions, sliding doors, kitchen worktops, interior signs, bulletin boards, and other industrial products (Wang et al., 2008). The increasing demands for raw materials in wood composite industries have led researchers to investigate non-wood ligno cellulosic biomass utilization in composite manufacturing including

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particleboard (Guntekin and Karakus, 2008). Annual plant fiber and agricultural waste materials have become alternative raw materials for particleboard manufacturing, and there are already more than 30 plants that utilize renewable biomass in their productions around the world (Bektas et al., 2005).

Therefore, it seems that the number of plants using renewable biomass in the production will be more in the future. According to Nemli et al. (2009), alternative raw materials such as agricultural residues will play an important role in the particleboard industry in the future.

Studies on particleboard utilizing agricultural and wood residues include cotton stalks (Guler and Ozen, 2004), betel palm (Lin et al., 2008) and kenaf stalks (Kalaycioglu and Nemli, 2006) almond shells (Guru et al., 2006), kenaf core (Xu et al., 2004), vineyard pruning hazelnut husk (Copur et al., 2007), sunflower stalks (Bektas et al., 2005) eggplant stalks (Guntekin and Karakus., 2008), waste grass clippings (Nemli et al., 2009), peanut hull (Guler et al., 2008) and bagasse (Xu et al., 2009).

Palm Kernel Shell (PKS) is recovered as by-product in palm oil production. Large quantities of PKS are generated annually and only some fractions are used for fuel and other applications such as palliative for un-tarred road and in producing activated carbon. The unused PKS are dumped around the processing mill, constituting environmental and economic liability for the mill. Meanwhile, it has been found (Teo, 2006) that incorporation of PKS in the production of structural light weight concretes increased mechanical strength.

Akporhonor et al. (2007) reported that PKS did not change significantly in physical structure and weight, for appreciable time duration, when exposed to organic solvent. Pulverised palm kernel shell was also used in the manufacture of friction material for automotive application by Fono-Tamo (2009). These observations therefore, stimulated the interest in

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considering pulverised PKS for use as composite material in particleboard production.

Materials and Methods Raw Materials Preparation The raw materials used for the experimental particleboard are PKS, Top bond (general purpose white glue), and saw dust (SW). The saw dust was gotten from the saw mill at Opa, Ile-Ife and the top bond glue was from the market. The process of acquisition and characterization of physico-thermal properties of palm kernel shell for its suitability in particleboard manufacture is as established by FonoTamo and Koya (2013). Table 1 gives the value for various properties as determined.

TABLE 1: SUMMARY OF PHYSICO-THERMAL PROPERTIES OF THE PULVERIZED PALM KERNEL SHELL

Properties Bulk Density (kg/m³) Specific Gravity Thermal Conductivity (W/m.K) Specific Heat (kJ/kg.K) Phase Change (˚C ) Source: Fono-Tamo and Koya (2013)

PKS Particles Mean Value±SD 560±17.4 1.26±0.07 0.68±0.05 1.983±0.10 101.4

Formulations and Preparation of Particleboard The manufacturing of the PKS enhanced SW particleboard followed the same standard wood-based particleboards production. Both the wood-based and PKS-wood based particleboards were fabricated in this study for comparison analysis with equal proportion of PKS and saw dust in the PKS-wood based particleboard. The manufacturing of the particleboard followed the standard process as described by Maloney (1993).

1)

Particle Preparation

The pulverized PKS was classified before proceeding to further operations. It was recognized that fine particles will increase furnish surface area and thus increase the adhesive requirements; while, oversized particles will adversely affect the quality of the product, creating internal flaws in the particles.

2)

Drying

The moisture content of particles was critical during hot pressing operations, thus, proper drying method was carefully selected. The moisture content of the material depends on whether

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adhesive (white glue) is to be added dry or in the form of a solution or emulsion. The main methods used in drying particles include rotary, disc, and suspension drying. In this present work, the particles were sun dried to reduce their moisture contents.

3)

Resin and Wax Addition

After drying, the particles were mixed with top bond white glue. Based on the weight of emulsified top bond white glue and sundry weight of the particles, 4 15% range of white glue contents were used.

4)

Mat-forming

After the particles have been prepared, they were laid into an even and consistent mat pressed into a panel. This was accomplished in a batch mode which employs a tray on which a deckle frame was placed. Mat formation was induced by back and forth movement of the tray. After formation, the mat was pre-pressed prior to hot-pressing. Prepressing reduces the mat height and helps to consolidate the mat for pressing.

5)

Hot-pressing

After pre-pressing, the mats was hot-pressed into panels. Hot press temperature used was 180°C. Pressure used depends on a number of factors (i.e. size, shape and press time), but 2.9MPa was used for these experimental particleboards with press time of 5minutes. Upon entering the hot press, the mats that usually have moisture content of 10–15% was reduced to about 5–12% during pressing.

6)

Board Finishing

After hot pressing, the board was air-cooledand trimmed, to bring the board to the desired length and width, and to square the edges.

Quality Assessment of Experimental Particleboard The quality of the expected particleboard was determined on the basis of its bending strength, dimensional changes on contact with moisture, and some thermal and mechanical properties.

1)

Bending Strength

The bending strength of the product was measured based on the ASTM Standard Method D 1037 for static bending (Lehmann, 1973). The four strength properties obtained from this test were (a) modulus

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International Journal of Material and Mechanical Engineering (IJMME) Volume 3 Issue 3, August 2014

of rupture (b) modulus of elasticity (c) stress at proportional limit (d) work at maximum load. (a)

Modulus of rupture

In order to determine the load at rupture, samples of the particleboard (20×20×20mm) set up vertically on the rig were subjected to compressive test at a compressive rate of 2 mm/min using Universal Mechanical Testing Machine (Instron 3369) at the Centre for Energy Research and Development (CERD), Obafemi Awolowo University, Ile-Ife. The loads at rupture for each samples of the particleboard were determined by the machine in order to compute the modulus of rupture (MOR), using Equation 3.

MOR =

3× P × L 2×b× d 2

Where, MOR is the modulus of the maximum or breaking load of the specimen in m; b, the breadth in m and d is the thickness in meters.

(1) rupture in MPa; P, in N; L, the length average specimen average specimen

ρ= = MC

Wa (g/cm3) Va

Wa − W0 × 100 (%) V0

(3) (4)

Where, ρ is the air-dried density; MC is the moisture content; Wa is the air-dried weight of the sample; Va is the air-dried volume and W0 is the oven-dried weight of the sample.

3) Evaluation of Internal Bond Strength of the Particleboard According to ASTM D-1037-96 (Yang et al., 2005), the internal bond strength IB for each sample of the particleboard (20×20×20mm) was calculated using Equation 7.

IB =

Ps bl

(5)

(b) Modulus of elasticity

Where, IB is the internal bond strength in MPa; Ps

Samples of the particleboard (20 × 20 × 20mm) were set up vertically on the rig and were subjected to compressive test at a compressive rate of 2 mm/min using Universal Mechanical Testing Machine (Instron 3369). This was accomplished by measuring the bending deflection of the sample resulting from a known load or by measuring the load required to accomplish a given amount of deflection (Yang et al., 2005). The modulus of elasticity MOE of the specimen is therefore

is the breaking or rupture load in N; b is the breadth of the specimen in m and l is the length of the specimen in meters.

MOE =

Pp L3 4bd 3Yp

(2)

Where, MOE is the modulus of elasticity in MPa; Pp is the load at proportional limit in N; L is the length of specimen or span in m; b is the specimen breadth in m; d is the thickness of the specimen in m and Yp is the deflection corresponding to the load at proportional limit in meters.

2) Determination of Moisture and Dimensional Properties of Particleboard Samples of the fabricated particleboard (150×150×20 mm) were placed under room condition at ambient temperature (25oC) for one week and also in an oven set at 35oC for 2hours to oven-dried the

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particleboards and they were tested for their density and moisture content MC using the following formulae (Yang et al., 2005):

4) Determination of Thermal Conductivity of the Particleboard The fabricated particleboard samples were tested to estimate its thermal conductivity and combustion properties. The thermal conductivity of the samples of the particleboard were computed based on Fourier’s Law of heat transfer which was given (Karlekar and Desmond, 1982) as,

= k

∆Q L × ∆t A × ∆T

(6)

Where, k is the thermal conductivity in W/mK; ∆Q , the quantity of heat transfer in J, during the time ∆t in s; A is the surface area in m2; L is the thickness of the sample in m in a direction normal to A; ∆T is the temperature difference in K under the steady state conditions, assuming that heat transfer is only on the temperature gradient.

5) Evaluation of Thickness Swelling of the Particleboard Conditioned samples (150×150×20 mm in size) for the evaluation of thickness swelling were prepared

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according to ASTM standard D-1037-96. The thickness at the middle of test specimen was measured with a vernier caliper with an accuracy of ±0.001mm. Then, the test specimen was placed parallel with the water, and soaked respectively for 2 hours and 24 hours for measurement of the thickness. The thickness swelling rate was determined from Equation (7) and (8):

= TS 2

t 2 − t0 × 100 (%) t0

(7)

= TS 24

t24 − t0 × 100 (%) t0

(8)

Where, TS is the thickness swelling rate; t0 is the thickness at the middle of the test specimen before soaking in the water; t2 is the thickness at the

FIGURE 1: PULVERIZED PKS PARTICLES

middle of the test specimen after soaking into water for 2hours and t24 is the thickness at the middle of the test specimen after soaking into water for 24hours.

Results and Discussion Physical Properties The pulverized palm kernel shell was shown in Figure 3.1. A bulk density of 560 kg/m3 was obtained for the PKS compared to that of saw dust which was about 288kg/m3 (www.powderhandling.com). PKS particles exhibit a good bulk density. The high bulk density of PKS compared with that of the saw dust may be justified by the fibrous nature of saw dust while PKS was in solid powder granules. Compressibility of particles was very important here because this contributes to the general internal bond strength of the particleboard.

The evaluated specific gravity of 1.26 classifies PKS particles as light materials, even lighter than saw dust whose specific gravity was about 1.38 (www.engineeringToolBox.com). It is known that light weight materials are recommended in the manufacture of composite for particleboard (Bektas et al., 2005).

Thus, low specific gravity exhibited by the PKS particles made it an indicated material to be used as composite material for the particleboard. Table 2 summarized the physical properties of PKS particles as compared to those of saw dust. The fabricated particleboards are shown in Figure 2.

TABLE 2: PHYSICAL PROPERTIES OF PKS VERSUS SAW DUST

Test Bulk Density (Kg/m3) Specific Gravity

Saw Dust 288 1.38

PKS Particles 560 1.26

a)

b)

wood-based particleboard

pks-wood based particleboard

FIGURE 2: SAMPLES OF FABRICATED PARTICLEBOARD

Product Performance 1)

Bending Strength

The four strength properties obtained from this test

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(d) Work at maximum load

were (a) modulus of rupture (b) modulus of elasticity (c) stress at proportional limit (d) work at maximum load. The collective data for each samples of the particleboard obtained from using Universal Mechanical Testing Machine (Instron 3369) were also derived.

Modulus of rupture

The modulus of rupture (MOR) obtained for the wood-based particleboard was 5.654 MPa while that of the PKS-wood based particleboard was 2.557 MPa. Thus, the MOR of the particleboard produced from saw dust only was higher than the one containing both PKS and saw dust. This was as a result of the homogeneity of the material (i.e. the particleboard containing saw dust only) which ensured its plastic deformation and also the strength of the adhesive used. Nevertheless, according to recommendations of ASTM standard D-1037, wood-based particleboard having thickness between 13-22 mm exhibits appreciable MOR of 15 MPa. With phenol resin as a binder, PKS based particleboard will definitely fall within this range.

Sawdust 4 Compressive stress (MPa)

(a)

The work at maximum load obtained for woodbased particleboard was 7.14242 J while that of PKS-saw dust based particleboard was 5.74691 J. This depended on the duration, compressive rate and the compressive load applied when carrying out the experiment. For every time interval of 0.1s, a compressive rate of 2 mm/min was used to determined the work at the maximum load. Again, the uniformity of the material used for wood-based particleboard made its work at maximum load to be a bit higher than the PKS-saw dust based particleboard.

(c)

Stress at proportional limit

The stresses at proportional limit of each samples of the particleboard were 0.7524 MPa and 0.50459 MPa (i.e. saw dust-based and PKS-wood based particleboards, respectively). This showed that the saw dust based particleboard can sustain a higher maximum stress without departure from the linear proportionality of compressive stress and compressive strain than the PKS-wood based particleboard. However, this was as a result of the homogeneous nature of the saw dust material.

Figure 3 and Figure 4 showed details about the stress at proportional limit of the samples of the particleboard.

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2 Specimen # 1

1 0 -1 0.0

(b) Modulus of elasticity

0.1

0.2

0.3

0.4

0.5

0.6

Compressive strain (mm/mm)

FIGURE 3: THE COMPRESSIVE STRESS-COMPRESSIVE STRAIN CURVE OF WOOD (SAW DUST) BASED PARTICLEBOARD.

Sawdust+PKS 2.0 Compressive stress (MPa)

The calculated modulus of elasticity (MOE) for the wood-based particleboard was 2.454 MPa while that of the PKS-wood based particleboard was 4.093 MPa. It can be concluded here that the particleboard containing both PKS and saw dust was more elastic than the one containing saw dust only under static loading. This additional characteristic of the particleboard was as a result of the PKS added to the saw dust which increased its elastic properties. The MOE of PKS-wood based particleboard can be increased if standard adhesive (phenol resin) is used to produce the board.

3

1.5 1.0 Specimen # 1

0.5 0.0 -0.5 0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Compressive strain (mm/mm)

FIGURE 4: THE COMPRESSIVE STRESS-COMPRESSIVE STRAIN CURVE OF PKS-SAW DUST BASED PARTICLEBOARD.

2)

Density and Moisture Content

The calculated air-dried density of wood based (saw dust) particleboard was 0.54 g/cm3 while that of particleboard containing both the PKS and saw dust was 0.72 g/cm3. The particleboard containing PKS as composite was denser than the one with saw dust only and was more significantly affected by the concentration of the adhesive solution. This was that the dimension of the chips was small, irregular and anisotropic.

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The moisture content of 11.89% was obtained for wood-based particleboard while that of PKS-wood based particleboard was 10.5% on dry basis. The moisture contents of the samples of the particleboard were found to be in accordance with the recommended standard particleboard moisture content of 10-12% (ASTM D-1037). The PKS-wood based particleboard had lower moisture content when compared to the wood-based (saw dust) particleboard.

3)

Internal Bond Strength

The internal bond strength IB of wood-based particleboard obtained was 3.770 MPa while that of the PKS-wood based particleboard was 1.705 MPa. It was observed that the internal bond strength of wood-based particleboard was higher than that of the PKS-wood based particleboard. This was due to the homogeneous nature of saw dust material used to fabricate the wood-based particleboard and the binding strength of the adhesive used. This could be accounted for by the compressibility of saw dust material during fabrication, either at the cold press or at the hot press.

5)

Thickness Swelling

Result obtained showed that the values of thickness swelling (TS) of the fabricated samples of the particleboard were lower than standardized 12% reported by Yang et al. The thickness swelling of wood-based particleboard and PKS-wood based particleboard obtained after being soaked in water for 2hrs were 10.75% and 9%, respectively while their TS after being soaked in water for 24hrs were 11.75% and 10.25%, respectively. The swelling rate of particleboard containing PKS as composite was very low when compared with the wood-based particleboard because the PKS showed little or no significant swell percentage. This was an indication that PKS-wood based particleboard will perform better than the ordinary wood-based particleboard when exposed to moisture. The performance characteristics of the experimental particleboards are summarized in Table 5.

TABLE 4: SUMMARY OF THICKNESS SWELLING OF THE SAMPLES OF PARTICLEBOARD

Parameters

Wood-based

PKS-wood based

20

20

22.15

21.80

22.35

22.05

10.75 11.75

9.00 10.25

TABLE 3: SUMMARY OF DENSITY AND MOISTURE CONTENT OF THE SAMPLES OF PARTICLEBOARD

Parameters Length of the sample, (cm) Breadth of the sample, (cm) Thickness of the sample, (cm) Air-dried weight of the sample, Wa(g) Oven-dried weight of the sample, W0 (g) Air-dried volume, Va (cm3) Air-dried density,

(g/cm3)

Moisture content, MC (%)

4)

Woodbased 15 15 2 243.874 217.974 450

PKS-Woodbased 15 15 2 326 295 450

0.54

0.72

11.89

10.50

Thermal Conductivity

The evaluated thermal conductivity of the sample of wood-based particleboard was 0.13 W/mK while that of the PKS-wood based particleboard was 0.50 W/mK. This thermal conductivity test revealed that the wood-based particleboard offer more resistance to heat flow because of the small air pockets in them as well as the resistance of the wood itself to heat transfer is greater than the PKS-wood based particleboard. Moreover, the dimension of the PKS particles in the PKS-wood based particleboard is small, irregular and anisotropic in nature. This allowed the affinity between the particles (i.e. PKS and Saw dust) not to be much strong compared to the one that was fabricated from saw dust only, thereby allowing the heat transfer rate to be a bit higher than the wood-based particleboard.

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TS2 TS24

to: Thickness at the middle of the test specimen before soaking in the water, (mm),. t2: Thickness at the middle of the test specimen after soaking into water for 2hours, (mm),. t24: Thickness at the middle of the test specimen after soaking into water for 24hours (mm),. TS2: Thickness swelling at the middle of the test specimen after soaking into water for 2hrs,. (%) and TS24: Thickness swelling at the middle of the test specimen after soaking into water for 24hrs, (%).

TABLE 5: SUMMARY OF TESTS RESULTS ON PRODUCT PERFORMANCE CHARACTERISTICS

Tests Modulus of rupture, MOR (MPa) Modulus of Elasticity, MOE (MPa) Stress at proportional limit,

(MPa)

Woodbased 5.654 2.454

PKS-Wood based 2.557 4.093

0.7524

0.50459

Work at maximum load, (J) Air dried density, (g/cm3)

7.14242

5.74691

0.54

0.72

Moisture content, MC (%) Internal bond strength, IB (MPa) Thermal conductivity, k (W/mK) Thickness swelling, TS (%)

11.89 3.770 0.13 11.75

10.50 1.705 0.5 10.25

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Conclusions

Evaluating the properties of wood based fibre and

PKS particles were used as composite to fabricate the particleboards. The physical-mechanical and thermal properties of the developed particleboards were also evaluated. According to the results obtained, the PKSwood based particleboard has a modulus of rupture of 2.557MPa, modulus of elasticity of 4.093MPa, stress at proportional limit of 0.50459MPa, work at maximum load of 5.74691MPa, air-dried density of 0.72 g/cm3, moisture content of 10.50%, internal bond strength of 1.705MPa, thermal conductivity of 0.50 W/mK and thickness swelling of 10.25% . The results showed that the physical properties (air-dried density, moisture content and thickness swelling) of PKS-wood based particleboard were within the recommended standard.

And its mechanical properties (modulus of rupture, modulus of elasticity, stress at proportional limit, work at maximum load and internal bond strength), due to the binder used were bit lower than the recommended standard, but they were still reasonable when compared with the other sample of particleboard fabricated from saw dust only. The thermal conductivity of the PKS-wood based particleboard was higher than the wood-based particleboard because the PKS thermal conductivity is higher than that of the saw dust. The overall performance of the particleboard fabricated from PKS composite showed that the board has little expansion and reduced discolorations when compared with the one fabricated using saw dust only.

particleboard material. Methods D1037, Philadephia.

Further research on the development of PKS-wood based particleboard should be undertaken to complement the laboratory evaluation. The PKS hold a good promise to enhance the strength of the particleboard if properly combined with saw dust and it was hereby recommended to the particleboard manufacturing industries.

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