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March - April 2022 Snapdragon® Automotive Platforms to Provide High Performance Compute Power and Capabilities to STLA Brain and STLA SmartCockpit Technology Platforms Beginning in 2024 Multi-Year Agreement to be Deployed Across 14 Iconic Stellantis Brands, Delivering Rich In-Vehicle Experiences to Millions of Vehicles, Starting with Maserati
Stellantis and Qualcomm Collaborate to Power New Vehicle Platforms with Snapdragon Digital Chassis Solutions PARIS, AMSTERDAM – Stellan s N.V. and Qualcomm Technologies, Inc. today announced a mul -year technology collabora on to u lize the latest Snapdragon® Digital Chassis advancements to deliver intelligent, customizable, and immersive in-vehicle experiences to millions of vehicles across Stellan s’ 14 iconic automo ve brands beginning in 2024. Leveraging the Snapdragon® Cockpit Pla orms and 5G capabili es for telema cs systems, Stellan s will have the capability to meet customers’ evolving expecta ons for personalized and cu ng-edge experiences that are con nually upgradeable. This agreement will facilitate Stellan s’ plan to merge all so ware domains into High Performance Computers, leveraging the high-performance, low-power Snapdragon Automo ve Pla orms across all major vehicle domains as well as contribute to securing Stellan s’ supply chain on strategic components. “Our technology collabora on with Qualcomm Technologies is another example of how we are iden fying industry leaders to work alongside our passionate and talented internal teams as we transform our vehicles through a so ware-defined approach. This will ul mately be er meet the needs of our customers’ lifestyles through safe, personalized, and alwaysconnected features,” said Carlos Tavares, Stellan s CEO. “Qualcomm Technologies’ broad experience in automo ve and scale as a semiconductor leader will enable us to ver cally integrate key elements of our new pla orms and more closely manage the complete electronics supply chain to provide access to the best technologies, enable the fulfillment of Stellan s’ volume poten al and achieve our Dare Forward 2030 ambi on.” “Qualcomm is honored to expand our work with Stellan s to redefine vehicles in the 21st century by bringing Snapdragon Digital Chassis solu ons to their future vehicles,” said Cris ano Amon, President and CEO, Qualcomm Incorporated. “By crea ng open, scalable, and comprehensive automo ve pla orms that encompass semiconductors, systems, so ware, and services, we are empowering Stellan s, as well as the broader automo ve ecosystem, to lead the transforma on to the digital era of automobiles.” Taking the driver-vehicle rela onship to the next level, Stellan s will use next-genera on Snapdragon Cockpit Pla orms to power the in-car communica on and infotainment systems for STLA SmartCockpit, which is being designed and engineered together with Amazon and Foxconn. Snapdragon Cockpit Pla orms are not only engineered to deliver high-defini on graphics to touch and voice-controlled cockpit console, but to also deliver a fully immersive in-cabin experience, enabling premium audio and crystal-clear voice communica ons throughout the vehicle’s cabin. Continued on Page 67
Mopar Masters Guild Magazine
