Embedded Computing Design with Resource Guide Fall 2018

FALL 2018 VOLUME 16 | 3 EMBEDDED-COMPUTING.COM

IOT INSIDER The end of embedded engineering as we know it PG 5 MUSINGS OF A MAKERPRO Striking out on your own PG 8

2018 RESOURCE GUIDE pG 34

Building Out

Blockchain for IoT & Embedded Systems

ATRENNE COMPUTING SOLUTIONS PG 41

VPX Lab Development Systems (clockwise) DT-XC AC Rackmount, COOL-CX 3U AC, RME13CC, RME9XC

PG 30

Development Kit Selector

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2018

INNOVATION AWARDS

Announcing

Product

Winners pG 32

AD LIST PAGE ADVERTISER 15

Acces I/O Products, Inc. – PCI Express Mini Card; mPCIe Embedded I/O Solutions 27 Advantech – Don't miss the IoT event of the decade!

7 Arm – The fastest route to silicon success 1 Atrenne Computing Solutions – VPXLab Development Systems 1 Digi-Key – Development Kit Selector 25 electronica 2018/Semicon Europa – Connecting everything – smart, safe & secure 13 embedded world – Exhibition & Conference... it’s a smarter world 16 Neousys Technology – Six cores – More power, unlimited possibilities 64 Portwell – Empowering the connected world 17 Sealevel – Push the edge 9 Vector – VME/VXS/cPCI chassis, backplanes & accessories 11 Virtium – Balance is everything 3 WinSystems – Empowering IIoT

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CONTENTS

Fall 2018 | Volume 16 | Number 3

FEATURES

22

12 Navigating the component shortage

By Graham Scott, Jabil 14 How to choose cool-running, high-power, scalable POL regulators

@embedded_comp

COVER In this issue, you'll find the Fall 2018 Resource Guide (pg. 34), our “Building Out Blockchain for IoT & Embedded Systems” feature (pg. 30), and the Embedded Computing Design Top Innovative Product Winners (pg. 32).

and save board space

By Afshin Odabaee, Analog Devices

20 CERT C, AUTOSAR double down on automotive safety and security

By Brandon Lewis, Editor-in-Chief

22 Testing safety-certifiable software

By John Mannarino, Mannarino Systems and Software 26 Software development life cycle stages: Getting started on a new idea

By Jon Murray, Embedded Computing Design Contributor 28 Eliminating buffer overflow vulnerabilities on the IoT

By Brandon Lewis, Editor-in-Chief 30 IoT’s quest for security and the blockchain promise

By Prasad Kandikonda, Multitech 32 Top INNOVATIVE PRODUCT WINNERS AND HONORABLE MENTIONS

opsy.st/ECDLinkedIn

SILICON WINNER: CEVA, Inc. – Neupro Ai Processor Family SOFTWARE WINNER: SparkCognition – Darwin STRATEGIES WINNER: Nordic Semiconductor – Nordic Thingy:52 IoT Sensor Kit HONORABLE MENTIONS: Texas Instruments – mmWave Radar Sensors Redpine Signals – RS14100 Wireless Secure MCU Zvelo – IoT Security Platform Mentor, A Siemens Business – Embedded IoT Framework Technologic Systems – TS-7553-V2 Lattice Semiconductor – Embedded Vision Development Kit

34 2018 RESOURCE GUIDE

WEB EXTRAS  Wireless Bluetooth control and programming for your next Arduino project

By Jeremy Cook https://bit.ly/2I90DTu

 Using software to find hardware bugs, Part 2

By Russ Klein, Mentor – A Siemens Business https://bit.ly/2xPoNh4

 Software development life cycle stages when getting started on a new idea

By Jon Murray https://bit.ly/2IawQdj

EVENTS  electronica November 13-16, 2018 Munich, Germany https://electronica.de/index.html

 DesignCon January 30-31, 2019 Santa Clara, CA https://designcon.com/

COLUMNS 5

IOT INSIDER

The end of embedded engineering as we know it

By Brandon Lewis, Editor-in-Chief

6

TRACKING TRENDS

In pursuit of “Easy IoT”

By Curt Schwaderer, Technology Editor

4

8

MUSINGS OF A MAKERPRO

Striking out on your own: Two years in

Published by:

By Jeremy S. Cook, Contributing Editor

10 AUTOMOTIVE ANALYSIS

MIPI World’s journey from mobile to automotive interfaces

By Majeed Ahmad, Automotive Contributor

Embedded Computing Design RESOURCE GUIDE | Fall 2018

2018 OpenSystems Media® © 2018 Embedded Computing Design All registered brands and trademarks within Embedded Computing Design magazine are the property of their respective owners.

ISSN: Print 1542-6408 Online: 1542-6459 enviroink.indd 1

10/1/08 10:44:38 AM

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IOT INSIDER

brandon.lewis@opensysmedia.com

The End of Embedded Engineering as We Know It

By Brandon Lewis, Editor-in-Chief I recently attended a press event where a dozen or so companies pitched their latest technologies. The presenting organizations ranged from semiconductor IP providers and component distributors to connector companies to design and manufacturing services firms. Although the spread was diverse, one thread tied many of the presentations together:

Industry’s response Whether or not you buy the premise that there is an engineering shortage, embedded systems are not going away. The discussion then becomes how to maximize the human resources at hand.

Here, the Arduino platform provides an interesting case study. The open source prototyping technology was originally intended to educate prospective engineers on the intricacies of embedded hardware development. According to Arduino CEO Fabio Violante, however, 50 percent of Arduino customers are classified as software developers and the company’s IDE was recently ranked as one of the ten most used software products in the world by a stack overflow developer survey.

A shortage of electronics engineers.

The engineering workforce: Shortage or shift?

Flex (formerly Flextronics) is an electronics integration and manufacturing services company that was present at the press event. Flex representatives indicated that they employ roughly 4,000 design engineers worldwide. But they also mentioned that it is becoming more and more difficult to acquire good technical talent, not just in the U.S., but in traditional engineering hotspots such as the Far East and Eastern Europe as well.

The U.S. Bureau of Labor Statistics estimates that the number of electrical and electronics engineers will grow by about 7 percent from 2016 to 2026, which is on par with other occupations. Of course, given the increase of electronic ­content in conventional and unconventional digital systems, average job growth may not suffice.

At the same time, the knowledge base required of a modern engineer has shifted. The IoT demands engineers with a jack-of-all-trades makeup, including technical proficiency in sensing, computing, connectivity, application software, and systems engineering.

The Bureau projects the number of software developers (already triple that of electronics engineers) to grow 24 percent through 2026, with the other disciplines struggling to keep pace. www.embedded-computing.com

“The reality is that the IoT is so big that no amount of engineers will be enough,” Violante says. “We’re looking to embrace more people coming from the software engineering world. There are orders of magnitude more developers there, and we can be more inclusive of them with tools and processes.”

Silicon Labs has taken this concept to the extreme. The company recently began a systematic rollout of its Gecko OS platform, which integrates embedded platform, connectivity, and development software for select Arm-based silicon products. The goal is to capture high-volume customers by providing a black box and command API that abstracts underlying complexity and accelerates time to market.

I, for one, don’t think the Gecko OS platform will work for most customers.

Engineering, by definition, is the act of tweaking portions of a design to yield better performance or product differentiation. Removing one component from this house of cards could bring the entire infrastructure crashing down, and no realistic amount of support will be able to save it.

On the other hand, if the Gecko OS is flexible enough to support slight variations in a few key consumer applications, it could tip the hourglass on embedded engineering as we know it.

Closing thoughts on consolidation Underscoring all of this is continued consolidation in the semiconductor industry. With the end of the road in sight for Moore’s law and the high cost of manufacturing at advanced process nodes, companies have turned to acquisition over innovation. Maybe artificial intelligence will require new classes of hardware that change this dynamic, but even so it seems that startups making meaningful advances will quickly be gobbled up by larger and larger players in a smaller and smaller industry. I don’t know.

Today, hardware engineering isn’t sexy. Software and applications are.

Perhaps software engineering becomes so saturated that the pendulum swings back to hardware innovation.

For now, beware the black box. In the long run it will impede progress for individuals and industry alike.

Embedded Computing Design RESOURCE GUIDE | Fall 2018

5

TRACKING TRENDS

curt.schwaderer@opensysmedia.com

In pursuit of “Easy IoT”

By Curt Schwaderer, Technology Editor Making IoT faster to deploy and easier to develop means different things to different people: Some think that more finished, preintegrated software and hardware make application development easier. Others believe that standards around security, component integration, and management are key. While all these things are important, an often-overlooked dimension of the problem involves developer education and attention to the IoT lifecycle. I spoke with Steve Carr, Global Head of Marketing for Premier Farnell and Newark element14, about their initiatives in these areas and to discuss a recent announcement involving a Symbisa, Hanhaa, and device integration with Excel.

“Newark element14 focuses on four key pillars – education and makers, research and development, prototype and test, and production and maintenance,” Steve said. “From these pillars, we’re going one step further by participating in the development of the talent of tomorrow.

Small startups in edge computing will eventually explode as the market matures. We want to help these innovators by making their new product introductions successful.”

Steve believes the next big step to push IoT forward is to focus on the edge and the new capabilities needed there. Steve mentioned that today’s IoT systems are largely interconnected VPNs; he believes that in true IoT environments, the VPNs will be replaced by neural networks distributed between the edge and cloud.

Steve talked at length about the concept of “Easy IoT”: “Users are looking for value from the data. How they get it becomes less important.

They don’t have the technical knowledge of how to get it, but they know what they want to do with it.”

Perhaps surprisingly, there is a huge segment of the market that wants to manipulate this data using Excel. “There are over 1.1 billion Excel instances being used globally right now,” Steve said. “It’s a very familiar platform. The ability to integrate sensors with Excel has enabled Excel users to perform data analysis and dashboards in a familiar environment while achieving achieve things never before possible with ­real-time sensor data.”

The sensor module, called Symbisa, comes from Hanhaa – a start-up company Newark element14 has been involved with from early on. The module consists of sensors capable of detecting and collecting environmental information including GPS location, orientation, temperature, light, and humidity. Such a high level of integration in one module may initially add to application cost, but the ease of integration more than pays for itself.

Another interesting item is the business model. The customer pays for the module, then pays per event being collected, which optimizes cost by only paying for events that are used. All the data collected can be read and stored in Excel. These secure tracking applications could also apply to pharmaceuticals, organ transport, and transportation.

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Embedded Computing Design RESOURCE GUIDE | Fall 2018

Adding the neural network piece sounds daunting, but Newark element14 is involved with this part of IoT as well: “There is a need to get more of the artificial intelligence and machine learning environments deployed and active.

Octonion’s IoT platform is launching in the September time frame and meets today’s and tomorrow’s clients’ requests for an end-to-end solution, from embedded layer to cloud-based services – enabling more power at the edge, but keeping things simple from a use-case perspective,” Steve mentioned.

From an implementation angle, the alliance between Newark element14 and the Hanhaa IoT/Excel platform Symbisa makes things very easy. You buy the modules that are ready to go out of the box. The preintegration with Excel 365 is already done and the sensors are provisioned to connect with the Hanhaa mobile platform. Hanhaa has a mobile license where you register the device, then as the device starts generating information, it goes through the Hanhaa platform where the information can be fed into dashboards and customized spreadsheets. The mobile platform also allows for collaboration through the 365 Office suite.

Newark element14 appears to be well positioned as IoT processing advances occur at the edge. Steve summed things up this way: “We at Newark element14 are great believers in being an enabler – embedded AI and neural networking at the edge is important and more needs to be done there to realize true IoT. Only then do you get automated, intelligent processing where exception cases are coming into the cloud that allows for additional decision making processes rather than the standard monitoring type of data and applications we largely see today. IoT can’t exist in its truest form until you have that nervous system running and that requires more AI to be embedded at the edge.” www.embedded-computing.com

MUSINGS OF A MAKERPRO

www.youtube.com/c/jeremyscook

Striking out on your own: Two years in

By Jeremy Cook, Engineering Consultant As outlined in a piece I wrote in 2016 (http://www.embedded-computing. com/embedded-computing-design/it-can-be-a-scary-world-out-there), early that year I had left a fairly stable engineering job at a medium-sized company to work for myself. While that post was hopefully entertaining and informative, the real question – “can I make this work?” – wouldn’t be answered for quite some time.

As of now, I’ve been able to make it work for well over two years, so I’d call that at least a small success. What are the big challenges if you’d like to make a go of it yourself as a Maker Pro, entrepreneur, tech journalist, or other profession?

Income: Good, but inconsistent While I won’t go into specifics, on average I’ve been able to make what I consider a reasonable living writing about technology as well as doing the occasional engineering/DIY project. The key here is average: Looking at my invoice spreadsheet for this year alone, what I’ve earned from month to month has varied by a factor of nearly two. This kind of inconsistency can be unnerving, but if you learn to live on the lower number, the good months can help pad your cash reserves, not make up for debt accrued in the previous period.

Exaggerating this effect is the fact that while I may have done XX dollars’ worth of work in month YY, customers tend to pay on different time schedules. Related to this, one can’t get too excited – and spend too much money – if your income looks amazing one month; the next may be comparatively lean.

Insurance: Available One thing that people seem to fear most about working for themselves is that they won’t be able to get insurance. Without getting into the politics of it, as an American you can pay for your own, likely subsidized, insurance via exchanges set up under the Affordable Care Act or via insurance providers. Whether your purchase will cover what you want with reasonable deductibles and premiums is another question.

Personally, my deductible is quite high, and I established a health savings account (HSA) to help offset this cost with its tax advantages. As with income, having cash on hand (HSA or otherwise) to help smooth out bumps in your entrepreneurial journey is quite helpful.

Loan qualification This year our family bought a house, after me being in business full time for nearly two years. With a good credit score and a healthy downpayment from the sale of my previous residence, I assumed this would not be a problem. Unfortunately, I was initially told that I needed two years of tax returns to qualify for a loan using my business income.

The good news is that since I had been generating business income as a side job for several years before officially becoming incorporated,

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Embedded Computing Design RESOURCE GUIDE | Fall 2018

another lending agent was able to use this fact to push the approval along. This would have never been an issue had I worked for an established company and is something one should look into. It also pays to get a second opinion, a common theme with the self-employed.

Routine: A necessary evil?

When one considers starting a company, the perception is that you can work at Starbucks, a beachside café, or wherever you can find Wi-Fi. This is true, and entrepreneurs are free to choose how many vacation days we take and how, when, and where we work.

The problem: If I don’t put the hours in, and do so efficiently, I don’t get paid.

Working at a coffee shop is a good – if occasional – change of pace, but it’s hard to beat the efficiency I get out of a dual-screen setup at my home office. For me, it works to get up reasonably early in the morning and work until around 4:30, then put in an hour or so after my kids go to bed. This keeps me putting in the needed time to keep things going.

While work never really ends when you’re in business for yourself, you do have some control over what you work on, and I often make fun projects with the hope that they will pay off either as a subject for an article, or simply as advertisement for Jeremy Cook Consulting.

Another neat benefit is that if you’re a really good “employee,” creating extraordinary value for your company and customers, you’re simply rewarded in direct proportion for the amount and type of work you do.

While I certainly work more hours than I did when with a larger company, it’s my choice. I could go to the beach for the rest of the day after writing this, but I probably won’t since there is always more to be done. Still, it feels good to know that I can! www.embedded-computing.com

AUTOMOTIVE ANALYSIS

MIPI World’s journey from mobile to automotive interfaces

By Majeed Ahmed, Automotive Contributor The Mobile Industry Processor Interface (MIPI) specifications for cameras and sensors have served billions of smartphones, and now they are eying the second-largest market for electronic components: the 90 million cars produced every year. The robust EMI [electromagnetic interference] performance protection and low power consumption ensured by the interface specifications ideally fit into automotive design requirements.

FIGURE 1 The MIPI part is shown on the bottom right (light green) in the block diagram of the EyeQ4 automotive chip.

Image: Mobileye.

In fact, as shown in Figure 1, MIPI’s Camera Serial Interface (CSI) specifications are already used in automotive camera applications spanning distances of less than three meters. Likewise, MIPI’s Display Serial Interface (DSI) specifications are a popular integration choice for cameras, displays, microphones, and accelerometers.

However, the emergence of advanced driver assistance systems (ADAS) and autonomous cars have led to increasing volumes of data from various automotive cameras and sensors. That, in turn, is driving the adoption of 64-bit processors for managing this vast amount of data in near-real-time settings.

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Embedded Computing Design RESOURCE GUIDE | Fall 2018

And this led to MIPI Alliance’s first foray into the automobile world – Automotive Birds of a Feather (BoF) Group – that began reviewing MIPI specifications with the intention of enhancing them for automotive designs with higher bandwidths and communication link lengths of longer than three meters.

The next logical step was MIPI Alliance’s quest to standardize interfaces between automotive subsystems such as ECUs and surround sensors, and it was manifested in the formation of Automotive Working Group (AWG). It brought in automotive OEMs and Tier 1 and Tier 2 suppliers; AWG was tasked to align interfaces for cameras, lidars, radars, displays, and more while consolidating the interface technology for the automotive ecosystem.

The formation of the MIPI AWG eventually culminated in the development of the MIPI A-PHY specification for optimizing wiring, cost, and weight requirements.

The physical layer specification – supporting distances of up to 15 meters – will facilitate high-speed data, control data, and optional power share on the same physical wiring. It is currently developing interfaces for 12 Gb/sec to 24 Gb/sec speeds, and it’s aiming at 48 Gb/sec bandwidth for displays and other automotive use cases.

The MIPI A-PHY links come in point-topoint topology and are asymmetric in nature. The first version of this interface specification – MIPI A-PHY v1.0 – will be available to developers in late 2019.

However, the MIPI A-PHY components are not expected to be in production vehicles before 2024.

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SILICON: COMPONENT SHORTAGE

Navigating the component shortage

By Graham Scott, Jabil

The only abundance seen lately in the electronic components market is the quantity of calendar pages marking how long the supply shortage has lasted. Now entering its second year, the shortage has no clear end in sight, as the market continues to navigate a perfect storm of high demand and short supply for electronic products.

A

t first glance, the constraints on this market would appear to be tied to recent headlines in the media about advances toward autonomous or connected vehicles, smart packaging, networked medical devices, and the latest smartphones. All of these headline trends are indeed having an influence on demand. However, the connection is not as direct as it would seem, and OEMs will benefit from a better understanding of the forces at play.

The shortages felt most keenly are for passive components, especially standard fare such as multilayer ceramic capacitors (MLCC), resistors, transistors, diodes, and even memory. Demand has not abated for the legacy components within these commodities and – in parallel to this – we continue to see suppliers turning their attention (and capacity) toward more lucrative opportunities emerging in automotive, industrial, smartphones, and the Internet of Things (IoT).

The market for IoT components, although comparatively smaller than those for automotive or smartphones, actually encompasses and overlaps several markets – including automotive connectivity, medical smart devices, and active packaging. The IoT segment is on track for explosive future growth, however: Gartner predicts the market for IoT electronics will grow by more than 100 percent to encompass over 20 ­billion devices within just two years, as sensors and connectivity are embedded in household appliances, packaging, medical devices, industrial equipment, and dozens of other current analog products.

12

Looking beyond connected automobiles, the overall transportation sector currently constitutes a larger market than IoT that is also on track for fast growth. Today’s conventional fuel-powered cars might carry 2,000 to 3,000 capacitors, although they are slowly ceding market share to electric vehicles that have up to 22,000 MLCCs onboard. As if this were not enough to get component suppliers’ attention, the automotive market also accepts higher price points for electronics, and its relative stability makes it a lower-risk bet on which to focus capacity.

Neither the IoT nor automotive markets can match the influence of smartphone manufacturers, however. Collectively, our current and future mobile devices still represent the most significant source of demand for passive components and memory products.

Approximately 1.5 billion smartphones – each containing roughly 1,000 capacitors – are manufactured each year, which translates into a trillion and a half MLCCs or roughly half the total global output for these devices. Market saturation for mobile phones will not slow this demand, as the trend toward miniaturized components continues to drive up their density in future models.

What can OEMs do?

These trends are better news for suppliers than for OEMs, especially OEMs that are slow to update their product designs to align with the more advanced components that suppliers wish to sell. The recovery, when it comes, will appear first among the electronics products that represent attractive investments to suppliers. Consequently, OEMs that evolve their product design to keep pace with suppliers’ technology road maps will position themselves to take advantage of this earlier recovery.

OEMs can also blunt the impact of component shortages by dedicating more time to building relationships in and beyond their supply network. In a climate like this, the name of the game for suppliers is allocation, wherein they allocate a percentage of their output to each customer. That means OEMs may only get a percentage of the demand they have for a specific product. It’s therefore critical to cultivate stronger and broader supplier relationships and to minimize reliance on single-sourced parts.

It is important to remember this too shall pass, though that is not a call to be complacent. The decisions made now may affect a company’s longevity. These types of supply shortages weed out vulnerable businesses and, though competitors are likely struggling to meet their production goals as well, the current crisis can represent an opportunity for OEMs who understand and correctly respond to the changing market.

Graham Scott is senior director of supply chain management at Jabil.

Jabil

www.jabil.com

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SILICON: POWER ELECTRONICS

How to choose cool-running, high-power, scalable POL regulators and save board space

By Afshin Odabaee, Analog Devices

The art of designing efficient and compact DC-to-DC converters is practiced by a select group of engineers with a deep understanding of the physics and supporting mathematics involved in conversion design, combined with a healthy dose of bench experience. A deep understanding of Bode plots, Maxwell’s equations, and concerns for poles and zeros figure into elegant DC-to-DC converter design.

Nevertheless, IC designers often avoid dealing with the dreaded topic of heat – a job that usually falls to the package engineer.

H

eat is a significant concern for point-of-load (POL) converters where space is tight among delicate ICs. A POL regulator generates heat because no voltage conversion is 100 percent efficient (yet).

How hot does the package become due to its construction, layout, and thermal impedance? Thermal impedance of the package not only raises temperature of the POL regulator, it also increases the temperature of the printed circuit board (PCB) and surrounding components, contributing to the complexity, size, and cost of the system’s heat-removal arrangements.

Heat mitigation for a DC-to-DC converter package on a PCB is achieved through two major strategies:

14

1. Distribute it through the PCB: If the converter IC is surface-mountable, the heat-conductive copper vias and layers in the PCB disperse the heat from the bottom of the package. If the thermal impedance of the package to the PCB is low enough, this is sufficient.

2. Add airflow: Cool airflow removes heat from the package (or more precisely, the heat is transferred to the cooler fast air molecules in contact with the surface of the package). Of course, there are methods of passive and active heat sinking, which, for simplicity of this discussion, are considered subsets of the second category.

When faced with rising component temperatures, the PCB designer can reach into the standard heat-mitigation toolbox for commonly used tools such as additional copper, heat sinks, bigger and faster fans, or simply more space – use more PCB real estate, increase the distance between components on the PCB, or thicken the PCB layers.

Any of these tools can be used on the PCB to maintain the system within safe temperature limits, but applying these remedies can diminish the end product’s ­competitive edge in the market. The product – let’s say a router – might require a larger case to accommodate necessary component separation on the PCB, or it may become relatively noisy as faster fans are added to increase airflow. This can render the end product inferior in a market where companies compete on the merits of compactness, computational power, data rates, efficiency, and cost.

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Don’t judge POL regulators by power density alone A number of market factors drive the need to improve thermal performance in electronic equipment. Most obvious, performance continuously improves even as products shrink in size. For instance, 28 nm to 20 nm and sub-20 nm digital devices burn power to deliver performance, as innovative equipment designers use these smaller processes for faster, tinier, quieter, and more efficient devices. The obvious conclusion from this trend is that POL regulators must increase in power density: (power)/ (volume) or (power)/(area).

›› Check the regulator’s thermal derating curves A well-documented and characterized POL regulator should have graphs specifying output current at various input voltages, output voltages, and airflow speeds. The data sheet should show the output current capability of the POL regulator under real-world operating conditions so you can judge the regulator by its thermal and load current abilities. Does it meet the requirement of your system’s typical and maximum ambient temperature and airflow speed?

Remember, output current derating relates to the thermal performance of the device. The two are closely related and equally important.

It is no surprise that power density is often cited in regulator literature as the headline specification. Impressive power densities make a regulator stand out, giving designers quotable specifications when choosing from the vast array of available regulators. A 40 watt/cm2 POL regulator must be better than a 30 watt/cm2 regulator.

Product designers want to squeeze higher power into tighter spaces; superlative power-density numbers appear at first blush to be the clear path to the fastest, smallest, quietest, and most efficient products, akin to comparing automobile performance using horsepower.

But how significant is power density in achieving a successful final design?

Actually, less than one might think.

A POL regulator must meet the requirements of its application. In choosing a POL regulator, one must assure its ability to do the job on the PCB, where the treatment of heat can make or break the application. The following recommended step-by-step selection process for a POL regulator makes the case for prioritizing thermal performance: ›› Ignore power density numbers Power density specifications ignore thermal derating, which has a significantly greater effect on the effective real-world power density. www.embedded-computing.com

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SILICON: POWER ELECTRONICS

›› Look at efficiency Yes, efficiency is not the first consideration. Efficiency results, when used exclusively, can present an inaccurate picture of the thermal characteristics of a DC-to-DC regulator. Of course, efficiency numbers are required to calculate input current and load current, input power consumption, power dissipation, and junction temperature. Efficiency values must be combined with output current derating and other thermal data related to the device and its package.

For example, a 98 percent efficient, DC-to-DC step-down converter is impressive; even better when it boasts a superior power density number.

Do you purchase it over a less efficient, less power-dense regulator? A savvy engineer should ask about the effect of that seemingly insignificant 2 percent efficiency loss. How does that power translate into the package temperature rise during operation? What is the junction temperature of a high-power-density, efficient regulator at 60 °C ambient with 200 LFM [linear feet per minute]

airflow? Look beyond the typical numbers that are listed at room temperature of 25 °C. What are the maximum and minimum values that are measured at the extremes: -40 °C, +85 °C, or +125 °C? At a high power density, does the package thermal impedance rise so high that the junction temperature shoots over the safe operating temperature?

How much derating does an impressively efficient, but expensive, regulator require? Do derated output current values curtail output power capability to the point that the additional cost of the device is no longer justified? ›› Consider the ease of cooling the POL regulator The package thermal impedance values provided in the data sheet are key to simulate and calculate the rise in the junction, ambient, and case temperatures of the device.

Because much of the heat in surfacemount packages flows from the bottom of the package to the PCB, layout guidance and discussions about thermal measurements must be articulated in the data sheet to minimize surprises during system prototyping.

A well-designed package should efficiently dissipate heat evenly throughout its surfaces, eliminating hot spots that degrade the reliability of a POL regulator. As described above, the PCB is responsible for absorbing and routing much of the heat from surface-mountable POL regulators. With the prevalence of forced airflow in today’s dense and complex systems, a cleverly designed POL regulator should also tap this free cooling opportunity to remove heat from heat-generating components such as MOSFETs and inductors.

Guiding heat to the top of the package and into the air A high-power switching POL regulator depends on an inductor or transformer to convert the input supply voltage to a regulated output voltage. In a nonisolated step-down POL regulator, the device uses an inductor. The inductor

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and accompanying switching elements, such as MOSFETs, produce heat during DC-to-DC conversion.

About a decade ago, new packaging advances allowed an entire DC-to-DC regulator circuit, including the magnetics, to be designed and fitted inside molded plastic, called modules or SiPs [systems in package], where much of the heat generated inside the molded plastic is routed to the PCB via the bottom of the package. Any conventional attempt to improve the heat removal capability of the package, such as attaching a heat sink to the top of the surface-mount package, contributes to a larger package.

sink is a flat surface exposed at the top of the package. This new intrapackaging heat sinking technique allows a device to be cooled quickly with airflow.

Go vertical: POL module regulator with stacked inductor as heat sink The size of an inductor in a POL regulator depends on voltage, switching frequency, current handling, and its construction. In a module approach where the DC-to-DC circuit, including the inductor, is overmolded and encapsulated in a plastic package and resembles an IC, the inductor dictates the thickness, volume, and weight of the package more than any other component. The inductor is also a significant source of heat.

Integrating the heat sink into the package helps to conduct heat from the MOSFETs and inductor to the top of the package, where it can be dissipated to air, a cold plate, or a passive heat sink. This technique is effective when relatively small, low current inductors easily fit inside the plastic mold compound of the package, but not so effective when POL regulators depend on larger and higher current inductors, where placement of the magnetics inside the package forces other circuit components to be farther apart, significantly expanding the PCB footprint of the package. To keep the footprint small while improving heat dissipation, the package engineers have developed another trick – vertical, stack, or 3D.

A few years ago, an innovative module Keep footprint small, increase power, and improve heat dissipation packaging technique was developed to A small PCB footprint, more power, and better thermal performance – all three are take advantage of available airflow to simultaneously possible with 3D packaging, a new method in construction of POL aid in cooling. In this package design, a regulators (Figure 1). The LTM4636 is a µModule regulator with on-board, DC-to-DC heat sink is integrated into the module regulator ICs, MOSFETs, supporting circuitry, and a large inductor to decrease output package and over molded. Inside the ripple and deliver load currents up to 40 A from 12 V input to precisely regulated package, the bottom of the heat sink is output voltages ranging from 0.6 V to 3.3 V. Four LTM4636 devices running in parallel directly connected to the MOSFETs and - IoT Design.pdf 1 3/20/18 9:50 AM share to provide 160 A of load current. The footprint of the package is can current inductors,SEA-18026 while the topside of the heat

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SILICON: POWER ELECTRONICS

only 16 mm × 16 mm. Another regulator in the family, the LTM4636-1, detects overtemperature and input/output overvoltage conditions and can trip an upstream power supply or circuit breaker to protect itself and its load.

Horsepower advocates can calculate the power density of the LTM4636 and safely tout its numbers as impressive – but as previously discussed, power density numbers tell an incomplete story. There are other significant benefits that this µModule regulator brings to the system designer’s toolbox: superior thermal performance resulting from impressive DC-to-DC conversion efficiency and an unparalleled ability to ­disperse heat.

Copper Clips Provide High Current Paths to Inductor While Elevating It Above the Substrate, Reducing Layout Area Required for the µModule Package

Inductor on Top of the Molded µModule Package Is Exposed to Airflow, Acting as a Heat Sink to Remove Heat from the Top

144 BGA Solder Balls with Banks Dedicated to GND, VIN, and VOUT; Collectively, These Solder Balls

Copper in Substrate Helps Lower Both Electrical and Thermal Impedance

FIGURE 1

A high-power POL regulator module uses 3D (vertical) packaging technology to elevate the inductor and expose it to airflow as a heat sink. The remaining DC-to-DC circuitry is assembled on the substrate under the inductor, minimizing required PCB area while improving thermal performance.

FIGURE 2 The LTM4636’s stacked inductor doubles as a heat sink to achieve impressive thermal performance in a complete POL solution with a small footprint.

Footprint of LTM4636 3D Designs Footprint of Non-3D Construction Equivalent Functionality (Inductor on Substrate) 1255 mm2 (Inductor on Top) 256 mm2

FIGURE 3 The modeled thermal behavior of LTM4636 shows heat is readily moved to the inductor package, which is exposed to airflow.

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Embedded Computing Design RESOURCE GUIDE | Fall 2018

To minimize the regulator’s footprint (16 mm × 16 mm BGA), the inductor is elevated and secured on two copper lead frame structures so that other circuit components (diodes, resistors, MOSFETs, capacitors, DC-to-DC ICs) can be soldered under it on the substrate. If the inductor is placed on the substrate, the µModule regulator can easily occupy more than 1225 mm2 of PCB, instead of a small 256 mm2 footprint (Figure 2).

Stacked inductor construction rewards system designers with a compact POL regulator with the additional benefit of superior thermal performance. The stacked inductor in the LTM4636 is not overmolded (encapsulated) with plastic, unlike the rest of the components. Instead, it is exposed directly to airflow. The shape of the inductor casing incorporates rounded corners for improved aerodynamics (minimal flow blockage).

Thermal performance and efficiency The LTM4636 is a 40 A capable µModule regulator benefiting from 3D packaging technology, or component-on-package (CoP), as shown in Figure 1. The body of the package is an overmolded 16 mm × 16 mm × 1.91 mm BGA package. With the inductor stacked on top of the molded section, the LTM4636’s total package height, from the bottom of BGA solder balls (144 of them) to the top of the inductor, is 7.16 mm.

In addition to dissipating heat from the top, the LTM4636 is designed to efficiently disperse heat from the bottom of the package to the PCB. It has 144 BGA solder balls with banks dedicated to GND, VIN, and VOUT where high current flows. Collectively, these solder balls act as a heat sink to the PCB. The LTM4636 is optimized to dissipate heat from both the top and bottom of the package, as shown in Figure 3.

Even operating with a significant conversion ratio, 12 V input/1 V output, and at a full load current of 40 A (40 W) and standard 200 LFM airflow, the LTM4636 package temperature rises only 40 °C over ambient temperature (25 °C to 26.5 °C).

Figure 4 shows the thermal image of the LTM4636 under these conditions. www.embedded-computing.com

Under test, at 200 LFM, the LTM4636 delivers an impressive full current of 40 A up to an 83 °C ambient temperature. Half-current, 20 A derating only occurs at an excessively high ambient temperature of 110 °C. This allows the LTM4636 to perform at high capacity as long as some airflow is available.

FIGURE 4 Thermal results of regulator at 40 Watts shows a temperature rise of only 40 °C.

The high conversion efficiency shown in Figure 5 is mainly a result of top performing MOSFETs and strong drivers of the LTM4636. For example, a 12 V input supply step-down DC-to-DC controller achieves: 100

140 W, scalable 4 A × 40 A µModule POL regulator with thermal balance One LTM4636 is rated for 40 A load current delivery. Two LTM4636s in current sharing mode (or parallel) can support 80 A, while four will support 160 A. Upscaling a power supply with parallel LTM4636s is easy; simply copy and paste the single-regulator footprint.

The current mode architecture of the LTM4636 enables precision current sharing among the 40 A blocks. Precise current sharing, in turn, produces a power supply that spreads the heat evenly between devices. Figure 6 shows a 160 A regulator with four µModules.

All devices with these specifications operate within a °C of each other, ensuring that no individual device is overloaded or overheated. This greatly simplifies heat mitigation.

No clock device is required for the LTM4636s to operate out-of-phase respective of each other – clocking and phase control is included. Multiphase operation reduces output and input ripple current, reducing the number of required input and output capacitors.

Conclusion Choosing a POL regulator for a densely populated system requires scrutiny beyond the voltage and amperage ratings of the device. Evaluation of its package’s thermal characteristics is essential, as it determines the cost of cooling, cost of the PCB, and final product size. Advances in 3D, also referred www.embedded-computing.com

VIN = 12 V

FIGURE 5 High DC-toDC conversion efficiency over a variety of output voltages.

95

90 Efficiency (%)

›› 5% for 12 V input to 3.3 V, 25 A ›› 93% for 12 V input to 1.8 V, 40 A ›› 88% for 12 V input to 1 V, 40 A

85

80

VOUT = 3.3 V, fSW = 750 kHz VOUT = 2.5 V, fSW = 650 kHz VOUT = 1.8 V, fSW = 600 kHz VOUT = 1.5 V, fSW = 550 kHz VOUT = 1.2 V, fSW = 400 kHz VOUT = 1 V, fSW = 350 kHz

75

70

0

5

10

15

20

25

30

35

40

Output Current (A)

FIGURE 6 Precision current sharing among four LTM4636s running in parallel, resulting in only a 40 °C rise in temperature for a 160 A application.

to as stacked, vertical, CoP allow high-power POL module regulators to fit a small PCB footprint, but, more importantly, enable efficient cooling. The LTM4636 is the first series of µModule regulators to benefit from this stacked packaging technology.

As a 40 A POL µModule regulator with a stacked inductor as a heat sink, it boasts 95 to 88 percent efficiency, with only a 40 °C rise at full load, occupying only 16 mm × 16 mm of PCB area.

Afshin Odabaee is the Analog Devices, Inc. (ADI) business development director for μModule power products and DC-to-DC controller ICs. He received his Bachelor of Science in electrical engineering with emphasis in analog from Santa Clara University in 1994. He has been working at ADI for 21 years, starting with op amps, references, and DC-to-DC regulators; he later was assigned to help start and support the μModule power products.

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SOFTWARE: SAFETY-CRITICAL SOFTWARE TESTING

CERT C, AUTOSAR double down on automotive safety and security

By Brandon Lewis, Editor-in-Chief

AUTOSAR [AUTomotive Open System Architecture] was developed in 2003 to address the explosion of automotive software, defining an open industry standard for electronic vehicle architectures. Over the years, AUTOSAR has evolved to meet emerging automotive use cases such as autonomous driving and vehicle-toeverything (V2X) connectivity, resulting in the creation of the AUTOSAR Adaptive Platform.

Although most safety-critical automotive software is still coded in the C language, the growing number and complexity of systems addressed by the AUTOSAR Adaptive Platform demand a transition to C++. While still fast, lightweight, and portable with a low level of abstraction, C++ supports object-oriented programming and other useful mechanisms for developing larger, more distributed systems.

Unfortunately, the last significant work in safety-critical C++ coding standards occurred roughly 10 years ago with the release of MISRA C++:2008. Not only has the C++ language progressed considerably since then with several new versions, the industry has also changed: Cybersecurity concerns, for instance, are now more real than ever before.

In response, AUTOSAR recently updated MISRA C++:2008 for its own purposes

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with the AUTOSAR C++14 coding guidelines. AUTOSAR C++14 maintains the rulesclassification approach of MISRA C++:2008, but also relies heavily on work from ISO/IEC standard 14882:2014 to modernize C++ implementations up to the ­language’s 2014 version.

In addition, AUTOSAR C++14 provides traceability to other C++ standards, such as the CERT C++ Secure Coding Standard.

Proactive automotive software security with CERT C++ CERT C++ – a product of Carnegie Mellon University’s Software Engineering Institute (SEI) – sets forth a catalog of living rules and recommendations for the secure and reliable implementation of C++ code. Where MISRA C++ and AUTOSAR C++ were developed primarily with an emphasis on safety, the CERT C++ guidelines focus on security, and do so in a proactive rather than reactive manner.

Because security standards like Common Weakness Enumeration (CWE) and Open Web Application Security Project (OWASP) are driven largely by their respective lists of pressing vulnerabilities, they are, by their very nature, addressing the symptoms of bad coding practices rather than the bad code itself.

CERT C++ and other SEI secure coding standards endeavor to minimize the creation of vulnerable code in the first place. This effort starts with a risk-assess­ment framework that provides a scoring rubric for code that does not comply with a given rule or

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severity of the guideline, the difficulty of exploiting such an item, and the cost of remediating it,” Hicken continues. “With this you get very granular prioritization that helps you focus on what is most important, rather than dealing with a deluge of static analysis violations.

FIGURE 1 The Software Engineering Institute’s CERT C++ Secure Coding Standard applies a level and priority to code that does not comply with its rules and recommendations.

FIGURE 2

“CERT is preventative. It focuses more on if you write your code this way, what can you prevent. It’s saying that code is a safer subset of C to produce more safe and reliable code,” he adds.

The AUTOSAR Adaptive Platform includes a range of software utilities and services in support of use cases such as the connected car and autonomous driving.

recommendation. Each CERT C++ rule or recommendation is assigned a priority based on Failure Mode, Effects, and Criticality Analysis (FMECA) defined in IEC 60812. If a section of code violates one of the CERT C++ rules or recommendations, its Severity, Likelihood, and Remediation Cost are scored on a scale of one to three. ›› Severity indicates the seriousness of the rule being ignored, with values ranging from Low (one) to High (three). ›› Likelihood indicates the probability of the violation leading to an exploitable vulnerability, with values ranging from Unlikely (one) to Likely (three). ›› Remediation Cost indicates the expense of bringing code into compliance with the rule, with values ranging from High (one) to Low (three).

The three values for a given violation are then multiplied, resulting in a Level 1 (score of 12 to 27), Level 2 (score of 6 to 9), or Level 3 (score of 1 to 4) flaw (Figure 1). These flaws can be detected automatically by static analysis tools with integrated unit testing such as Parasoft C/C++test.

“I like the SEI CERT secure coding standard for several reasons,” says Arthur Hicken, Chief Evangelist at Parasoft. “First, it’s much more focused on secure coding practices rather than just the symptoms – for example, always validating input is a secure coding practice, while SQL Injection is a symptom. CERT has analyzed which guidelines are most critical, can be analyzed soundly, and then separated into ‘rules’ that should be followed, as well as ‘recommendations’ that are less critical and/or less capable of sound analysis. This helps quickly trim static analysis findings to the most critical.

“In addition, CERT has created a risk-assessment framework that helps further prioritize the static analysis findings for particular guidelines, taking into account the inherent www.embedded-computing.com

The latest release of Parasoft C/C++test integrates a security dashboard for SEI CERT C compliance, which provides visualization and mapping of violations and their respective recommendations, as well as drilldown capabilities into specific issues (Figure 2). The ISO 26262-compliant version of Parasoft C/C++test also includes support for the AUTOSAR C++14 standard and integration with additional compilers and IDEs such as Texas Instruments’ Code Composer Studio.

Automotive software success hinges on safe and secure By now, we’re all aware that modern high-end vehicles are driven by roughly 100 million lines of code. That’s more than Facebook, the Large Hadron Collider, and even a Boeing 787. As cars become more autonomous and connected, the amount of software in them will only increase.

Coding guidelines such as AUTOSAR C++14 bring safe C++ coding practices into the modern era to support emerging automotive applications, such as the various levels of autonomous driving. With these advanced capabilities, however, come additional security requirements. A development mindset that considers both safety and security will be critical to the auto industry’s continued progression.

“It’s a lot easier to secure bug-free software than buggy software,” Hicken says.

“80 percent of security vulnerabilities are also quality issues. CERT is such a powerful tool because it treats the engineering problems, not their results.”

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SOFTWARE: SAFETY-CRITICAL SOFTWARE TESTING

Testing safetycertifiable software

By John Mannarino, Mannarino Systems and Software

Given its complexity and the critical applications for which it is designed, embedded avionics software must undergo a rigorous approval and testing process before it can be approved as airworthy.

T

he complexity of aerospace software makes it impossible to exhaustively – or even simply – test it and declare it safe for operation onboard an aircraft that will operate in domestic airspace. Instead, commercial avionics software must go through a well-defined development process, focused on design assurance, which includes a rigorous test regimen.

The development assurance process is defined by guidance material (RTCA/ DO-178 and SAE ARP4761/4754 documents) that has been approved by certification authorities. Working groups composed of many of the leading aerospace companies, research branches, universities, specialty groups, and industry stakeholders work toward consensusbased guidance material to define and evolve the necessary safety standards.

When considering what goes on an

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aircraft, it’s important to understand that individual electronics components do not receive safety certification. Only engines, propellers, and the aircraft itself are actually certified aeronautical products. Software is approved for a given installation for a piece of hardware as part of a certification program; if approved, the software is considered ready for installation on a product that will be certified.

In the case of a mission computer, to receive approval from the FAA, the electronics hardware must generally be designed and approved to the DO-254 (Design Assurance Guidance for Airborne Electronic Hardware) standard and to RTCA/ DO-160 (Environmental Conditions and Test Procedures for Airborne Equipment).

The software that runs on the mission computer must be designed and approved to DO-178C (Software Considerations in Airborne Systems and Equipment Certification).

For embedded systems, these documents are key for system designers who evaluate the hardware components, operating systems, and applications that they will use in their safety-certifiable systems.

One of the first steps to getting software approved as safety-certifiable is establishing an understanding of its criticality. A safety analysis of the software is performed through the cooperation of the software, systems, and safety development teams that identifies what function the software performs and ascertains the consequences of anomalous behavior of the software. The result is a determination of the Design Assurance Level (DAL) for the software item. For example, software for a singleboard computer (SBC) designed for use in a flight control computer (Table 1) must

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be developed to DAL A, the highest level of criticality, due to the consequences of unintended behavior of the software. Similarly, software for a video capture and processing card providing the graphics in a primary flight display system would normally need to be demonstrably certifiable to DAL A. Generally, determining the appropriate DAL for an electronics system is the responsibility of safety engineers, who examine the functionality of the aircraft and its system and subsystems. While it would be an easy choice to require that all software meets the highest, or DAL A, level, it is not always desirable to specify the highest-level software in every use case. That’s because the cost of development and testing rises as the criticality level of the system rises. Basically, a precise safety analysis will justify a specific DAL level for the software needed for that system design, that aircraft, and the required functions.

Promulgating standards SAE International is a global association responsible for developing engineering standards for a variety of industries. Its Aerospace Recommended Practice (ARP) guidelines play a critical role in the aircraft design and safety-certification process. One of SAE’s most prominent sets of standards is ARP4754A, which details Guidelines for Development of Civil Aircraft and Systems. While SAE ARP4754 is the top-level guidance standard in the industry for systems engineering, the safety processes and engineering used in aerospace are defined in SAE ARP4761. This document provides complete guidance for safety engineers: for example, on how to perform a functional hazardous assessment, how to perform a preliminary and final systems safety assessments, and a Failure Modes, Effects and Criticality Analysis (FMECA).

ARP4754, on the other hand, in conjunction with ARP4761, assists systems engineers in the architecting of a system and the allocation of functions to specific software and hardware items. Whatever an OEM applicant submits to the certification authority must be backed up by a safety analysis. The certification authorities have the prerogative to review any of the system’s technical data and then assess whether they agree with the DAL level determinations made by the OEM. In the event they don’t agree with the DAL designation, they may make the OEM provide further justification or raise the DAL for that application. The process is not subjective. The OEM presents scientific and quantitative data about the software’s functionality and the consequences of its failure to the certification authority and also takes into account industry precedents.

For any avionics system, each of the engineering domains – systems, software, and programmable hardware – is responsible for ensuring that the system is fully verified

and tested. For the systems side of the application, engineers must perform requirements-based testing to ensure that all of the specified system functions and requirements are fully verified. The same applies for software and hardware domains. Thorough testing of each of these domains requires very particular knowledge of the system and item designs.

DO-178C safety-certifiable software must undergo a rigorous process that generates a significant amount of data (also referred to as software lifecycle data). One component of that data is the actual executable code that will run on the system. Supporting data include plans, requirements, design, architecture, source code, test procedures, reports, and analysis. All of the data accompanying the executable software code is known as the data artifact package (or lifecycle data) for the particular software and hardware combination that comprises the application.

Historically, the hardware and software for a new safety-certifiable application was custom-built from the ground up, a process that could take years and millions of dollars to complete. Today, it is now possible to select commercial off-the-shelf (COTS) safety-certifiable hardware components, with the associated executable software and all of the software and hardware life cycle data needed to demonstrate to the certification authority that the software and hardware is indeed safe.

DESIGN ASSURANCE LEVELS (DALS) AND ACCEPTABLE PROBABILITIES OF FAILURE DAL

Danger Level

Probability of Failure

Systems Affected

A

Catastrophic: failure results in preventing the aircraft from continuing safely and/or landing

<1 in 10 /flight hour

Flight control computers, fly by wire, full authority digital engine control, flight displays, air data systems

B

Hazardous: failure results in serious or fatal injuries to the aircraft occupants

<1 in 10-7/flight hour

Autopilot, autothrottle, ice protection, standby flight displays, instrument landing system, landing gear control

C

Major: failure results in discomfort or injuries to the occupants

<1 in 10-5/flight hour

Navigation systems (such as GPS), yaw damper, environmental control systems

D

Minor: failure results in causing some inconvenience to the occupant

<1 in 10-3/flight hour

Flight data recorder, data inquisition system, cabin lighting

E

No effect

n/a

In-flight entertainment

TABLE 1

-9

Design Assurance Levels (DALs) give guidance on the criticality of the software or systems being tested.

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SOFTWARE: SAFETY-CRITICAL SOFTWARE TESTING

Familiarity with the testing required for safety-certifiable applications is an important skillset. That’s because testing can be a fairly significant portion of the certification process, ranging from 30 to 40 percent of the overall cost, depending on the system’s DAL level.

The software developer may choose to conduct all the testing, or testing can be outsourced. It can be cost-effective to engage an outside firm with the required test and certification experience. Mannarino Systems & Software has considerable experience with the entire software ­approval/certification­ process and in guiding customers through such programs and tests.

The testing process for DO-178C (Figure 1) software will always involve a level of hardware integration, since software cannot be verified on its own.

Software must be approved on the target hardware. Depending on the application, system-level testing will be required; verification at software level, AEH level (i.e., programmable hardware), and potentially at a system level may be performed if the customer needs that type of support.

Who is testing?

A smaller firm such as Mannarino can often perform all of the required testing, or a subset of the testing, for software, programmable hardware, and some system programs, depending on the customer’s needs. For safety-certifiable software programs, it is possible for some outside firms to handle the complete program, from planning to approval.

Provided with the system specification, these firms can develop and collect all

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SOFTWARE LOW-LEVEL REQUIREMENTS

SYSTEM TEST ENVIRONMENT

TEST

ARP48754 RTCA/DO-178

SW TEST ENVIRONMENT

VERIFICATION TEST

VERIFICATION TEST

INTE G RA TION

SOFTWARE HIGH-LEVEL REQUIREMENTS

VERIFICATION

SW LLR TEST ENVIRONMENT

TES T

SYSTEMS LEVEL REQUIREMENTS

N ESIG ION/D INIT DEF

It’s not unusual for customers to be surprised at the cost of the process of developing DO-254 hardware and DO-178C software. What’s more, learning the process iteratively, as certification audits are failed, can be even more costly. While a system developer’s engineering group may have the necessary skills to develop the executable code, it’s rare that they will have experience with the safety certification process. Certification experience is essential for successfully executing efficient software certification programs. If that expertise is not available internally, outside firms can provide it.

SOFTWARE CODE

FIGURE 1

Verification testing process diagram.

the life cycle data, including the executable code, all the test procedures, and all the results generated from testing.

In addition, some firms are actually able to provide software/hardware c­ ertification/ approval services. Mannarino, for example, is a Design Assurance Organization under Transport Canada, the first service provider worldwide to receive the delegation for both DO-178 software and DO-254 hardware. With such a designation authority, a firm can actually approve software and hardware on the behalf of the certification authority.

There is a growing trend for offshoring some of the test work. Low-level testing houses, which may offer competitive hourly rates, may not be able to deliver the quality of work required to satisfy the rigorous DO-178B process. It can also take additional time and work to get an offshore testing provider up to speed.

Today, customers are seeking more turnkey solutions and support for their safety-­ certifiable applications. Through the use of COTS hardware and an experienced outside software development and testing services supplier, customers can costeffectively speed the deployment of their hardware and low-level software. An ­outside expert with experience in avionics system integration, safety analysis, systems engineering, operating system software, and board support package software can offload the customer, enabling them to focus their valuable resources on the development of their application software.

Consider a system developer with a requirement for a Full Authority Digital Engine Control (FADEC) software with programmable DO-254 hardware. The system integrator can either attempt to build the hardware or obtain safety-certifiable modules from an external supplier. An example is Curtiss-Wright’s Power Architecture-based VPX3-152 3U OpenVPX SBC module designed to meet DO-254 DAL A requirements.

If the COTS vendor and software supplier work in concert, they can provide the system developer with a complete safety-certifiable DO-254 hardware and DO-178C operating system and board support package, along with the needed data artifact package. In addition, a company like Mannarino can provide guidance through hurdles of the DO-178 & DO-254 approval processes. The customer is then free to put their energies into developing the application software that is their unique added value.

John Mannarino is president and founder of Mannarino Systems and Software (St. Laurent, Québec, Canada).

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Connecting Global Competence

November 13–16, 2018

Connecting everything – smart, safe & secure Trade fair • 17 halls • Full range of technologies,

products and solutions

Conferences & forums • 4 conferences • 16 forums • New TechTalk for engineers

and developers

Talent meets Industry • electronica Experience

with live demonstrations • e-ffwd: the start-up platform

powered by Elektor • electronica Careers

co-located event

SOFTWARE: SAFETY-CRITICAL SOFTWARE TESTING

Software development life cycle stages: Getting started on a new idea

By Jon Murray, Embedded Computing Design Contributor

When you work in the software industry, you’re likely aware of how open, flexible, and innovative the market is. Unfortunately, with this flexibility comes intense competition, which means that coming out on top requires constantly tapping into new ideas. If the concept is new to you, however, just where do you begin? What are the software development life cycle stages when getting started on a new idea?

I

t’s perhaps important to understand first the kind of impact the software industry has on the entire market in order to remember the enormity of how a successful app can penetrate the landscape. Remember, the global IT market today has a whopping $3.8 trillion in value, with more than 25 percent of the revenue located in the U.S. In fact, there are actually more than 100,000 IT and software services companies in the U.S., with the e-commerce market alone valuing $341 billion in the country.

Imagine the kind of reach a successful app can have in this kind of market, which sort of explains why the entire global market has been going haywire on the production of better apps.

Software development: Building on a new idea With the above in mind, it’s important to understand that forming a concrete

26

strategy out of your base idea is key to successful execution, especially on software, plus having a dedicated development team. After all, one wrong mishap can ruin all your plans. Here’s how to develop a software out of a single idea.

Planning your software means coming up with a concrete idea: When you have an idea you want to formulate into an app, it’s not enough to “just wing it.” You need to actually plan to have the idea come to life. Brainstorm on the concept itself and try to gather requirements and aspects of a product you want to present in the future. What exactly do you want to achieve with this product? What problems does it solve? What issues might occur during development, and how do you plan to solve these woes?

Planning involves making sure your idea is concrete enough to build a design upon, something you can come back to when you need to ground yourselves to reality.

Feasibility analysis rechecks your assets: After having a concrete plan, it’s time to analyze just how feasible the idea is based on your current resources and loadout.

Try to assess the kind of workflow you’re having and divide the creation process into small tasks, so project managers, designers, and testers can evaluate their duties. In turn, they can assess what problems they might encounter during the development process. Problems that need resolution may range from reliability and functioning to time and cost.

Software design puts your app into perspective: Now that you’ve divided your crew into teams, the software design puts a “face to the name,” if you will. Designs you

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SOFTWARE: SAFETY-CRITICAL SOFTWARE TESTING

make for the app should be clear and creative; they should include a database design and data structure. This essentially allows everyone to have a clear overview of how the app is theoretically supposed to work.

Programming constructs the app from the ground up: Programming is perhaps the most difficult and important aspect of creating software, as everything rests on how everyone gets to code their tasks. Programmers are often hired for this role and they try to put “life” into the software design.

Implementation and integration checks if the software functions at a bare minimum: Software often has a lot of programs in it, which means they need to work perfectly for the software to function even on a minimal basis. Team leaders should check whether the software runs the way it should, and if there are bugs for testers to catch and assess.

Software testing irons out the kinks of the software: After coding, testers will be hard at work making sure the app works as normal and that bugs are reported for immediate fixing. This at least ensures that actual release to the market will have the software free of bugs and pesky things that can impede progress of enjoying the app’s intended purpose.

Installation, maintenance, and release of the app to the public: When testing is done, the app can be officially be released to clients to be installed in their devices. Your group should have an infrastructure ready to receive complaints and bug reports, with a means through which to communicate answers to queries and to provide regular updates.

www.embedded-computing.com

The takeaway: Software development with new ideas can work When you have a new idea for a great application, you’re going to be excited in pulling it off with your team. Before you get all hyped up, however, make sure you’ve read the above tips on software development life cycle stages, as there’s more to app development than just creating the app itself. If you want a truly efficient means of making your idea prosper, you should also account for the various challenges and predicaments you might face along the way, among the many other steps.

Jon Murray loves his gadgets as much as he has a passion for writing, and as such he took it upon himself to make sure his pieces are understandable by his readers. As a contributor for sites such as Inetics, Jon shows his love for software development and creation through his works. He loves tinkering with his gadgets or doing a little coding when he’s not writing.

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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STRATEGIES: EMBEDDED SECURITY

Eliminating buffer overflow vulnerabilities on the IoT

By Brandon Lewis, Editor-in-Chief

Buffer overflows have been the most commonly exploited vulnerability in network-borne attacks over the last 30 years. This isn’t surprising, given how buffers are created.

Here is an example in C: Step 1. Programmer uses the malloc() function and defines the amount of buffer memory (32 bits, for example)

Once in charge of the control flow, a control-flow hijacker can modify pointers and reuse existing code, while also potentially replacing code. Command of the control flow also permits attackers to modify pointers for use in indirect calls, jumps, and function returns that leave a valid graph to conceal their actions from defenders.

(Figure 1.)

Step 2. A pointer is returned that indicates the beginning of the buffer within memory

Such threats remain a challenge despite dynamic address space layout randomization (ASLR) mechanisms and stack canaries used to detect and prevent buffer overflows before code execution occurs.

Step 3. Programmer uses the pointer (only) as a reference whenever they need to read from or write to that buffer

Security: Software or silicon?

ASLR and stack canaries are software-based buffer overflow protection mechanisms that do make exploiting buffer overflows more difficult for attackers. ASLR, for instance, dynamically repositions memory areas so that a hacker effectively has to guess the address spaces of target components like base executables, libraries, and stack and heap memory. Unfortunately, recent vulnerabilities such as Spectre and Meltdown leak information from CPU branch predictors, which limits the effectiveness of ASLR for obvious reasons.

With the pointer in hand, it’s very easy for a programmer to forget the actual amount of memory that was allocated to a given buffer. Compilers use metadata to allocate the appropriate buffer size during assembly, but this metadata is typically discarded at build time to reduce footprint.

If data being transferred within or between programs subsequently overruns the buffer size that was originally defined, that data overwrites adjacent memory.

This can lead to memory-access errors or crashes, as well as security vulnerabilities.

Buffer overflows and vulnerability exploitation Hackers can use stack buffer overflows to replace executables with malicious code, which allows them to exploit system resources like heap memory or the call stack itself. Control-flow hijacking, for example, takes advantage of stack buffer overflows to redirect code execution to a location other than what would be used in normal operation.

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Stack canaries, on the other hand, insert small integers just before the return pointer in memory. These integers are checked to ensure that they have not changed before a routine can use the corresponding return pointer. Still, it is possible for hackers to read the canary and simply overwrite it and the subsequent buffer without incident if they make sure to include the correct canary value. In addition, while canaries protect control data from being changed, they don’t protect the pointers or any other data.

Of course, another challenge with software-based security solutions is that they are highly susceptible to bugs. It is estimated that 15 to 50 bugs exist for every 1,000 lines of code, meaning that the more software is present in a solution, the greater the number of vulnerabilities.

When addressing the disease rather than the symptoms of buffer overflows, a more robust method is to implement security in silicon – while stack buffer overflow exploitations are designed to manipulate software programs, addressing the root cause of such attacks begins with realizing that the processor is unable to determine whether a given program is executing properly.

Outside of mitigating the impact of software bugs, silicon can’t be altered remotely.

But a processor or piece of silicon IP must be programmed to recognize, at runtime, whether an instruction attempting to write to memory or peripherals is performing a legal or illegal operation.

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STRATEGIES: EMBEDDED SECURITY

IT IS ESTIMATED THAT 15 TO 50 BUGS EXIST

FIGURE 1 Control-flow hijacking is a common attack that leverages buffer overflows to commandeer the system stack.

FOR EVERY 1,000 LINES OF CODE, MEANING THAT THE MORE SOFTWARE IS PRESENT IN A SOLUTION, THE GREATER

SOFTWARE

THE NUMBER OF

SoC Host Processor

VULNERABILITIES. CoreGuard Policy Enforcer

Dover Microsystems has developed such a technology, called CoreGuard.

Silicon security at runtime CoreGuard is a piece of silicon IP that can be integrated with RISC processor architectures to identify invalid instructions at runtime. Delivered as RTL, the solution can be either optimized for various power and area requirements, or modified to support custom processor extensions.

As shown in Figure 2, the CoreGuard architecture includes a hardware interlock that controls all communication between the host processor and rest of the system. The hardware interlock funnels these communications into a Policy Enforcer.

Separately, CoreGuard uses updateable security rules called micropolicies, which are simple governing policies created in a high-level, proprietary language. These rules are installed in a secure, inaccessible region of memory isolated from other operating system or application code. CoreGuard also reserves a small memory allocation here for application metadata usually discarded by the compiler, which is used to generate unique identifiers for all data and instructions in a system. These components load at system boot time.

When an instruction attempts to execute at runtime, the CoreGuard Policy www.embedded-computing.com

Memory

FIGURE 2

Dover Microsystem’s CoreGuard security IP uses micropolicies and a hardware interlock to identify and block invalid instructions before they execute.

Execution core or host processor running in privileged mode cross-references the instruction’s metadata against the defined micropolicies. The hardware interlock ensures that the processor outputs only valid instructions to memory or peripherals, thereby preventing invalid code from executing completely. The application is informed of the policy violation with something akin to a divide-by-zero error, and the user is notified.

All that is required for integration with a host processor is support for instruction trace outputs, stall inputs, a nonmaskable interrupt (NMI) input, and interrupt outputs. For non-chip designers, Dover Microsystems recently announced that its CoreGuard technology is being designed into certain NXP processors.

Eliminating classes of attacks In the case of buffer overflows, the benefits of a technology like CoreGuard are obvious. Buffer sizes captured as part of the oft-discarded compiler metadata can be incorporated to limit an attacker’s ability to manipulate the system stack from across the network. Going a step further, the same principles can be applied to control-flow hijacking in general because returns from various points in memory can be restricted before they take place.

In practice, this real-time awareness also creates a new playing field for the security industry. By being able to identify errors or attacks before damage occurs, users can elect to dynamically reallocate memory, switch to a separate, safer program, or log events while continuing to run the same program. How to proceed is completely dependent upon the needs of the application or business case.

Have we seen the end of zero-day vulnerabilities? Only time will tell, but it appears we’re on the right path.

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STRATEGIES: EMBEDDED SECURITY

IoT’s quest for security and the blockchain promise

By Prasad Kandikonda, Multitech Internet of Things (IoT) security and privacy remain a major challenge, mainly due to the massive scale and distributed nature of IoT networks. Although blockchain technology garners headlines as a possible security solution, it is leaving many still scratching their heads. Because it evolved to solve problems in the financial industry, the technology itself seems very beneficial for addressing industries where many third parties exchange information, trust is involved, and an immutable ledger needs to be maintained.

A

dopting blockchain technology – even as it becomes more common – is far from straightforward. Not only are there different flavors of the technology, there are public and private options and close attention must be paid to existing data parameters. Ultimately, IoT customers need to consider multiple implementation challenges before opting into its ultimate promise of privacy.

Blockchain and IoT devices Blockchain is an evolution of crypto and database technologies to solve real-world problems created by double accounting; the process also eliminates many intermediaries involved in settling transactions and the time it takes to do them. Although blockchain-based approaches provide decentralized security and privacy, they often involve significant energy, delay, and computational overhead that is not always suitable for most resource-constrained IoT devices.

IoT devices can range from small sensors being used in residences to giant machines such as those being used by GE and Boeing. In all of these cases, one very important consideration is the life cycle tracking of the IoT device. Blockchain could undoubtedly be a very useful technology in solving this problem.

Blockchain versus distributed database Blockchain and distributed databases are comparable: They connect differ­ent third-party entities and allow for exchange

30

of data in a consistent way. Many of the features being positioned as unique to blockchain can also be accomplished with distributed database technologies. For example, a smart contract, which is becoming a useful extension (such as Ethereum and HyperLedger), can easily be accomplished by doing stored procedures, which is a feature of many database technologies. Likewise, the append-only feature can be accomplished in a database using strict permissions and actions, while executing a block of transactions can be done by combining a group of actions into an atomic entity. It looks like many of the same things claimed as blockchain features can be done by distributed databases.

Which prompts the question: What does blockchain bring to the table?

The first thing blockchain contributes is the elimination of the middleman or entity responsible for maintaining all the distributed databases, their data integrity, software updates, etc. With blockchain, there is no need for this intermediate entity. Every peer in the node becomes an owner, responsible for maintaining a copy of the database and completely freeing them up from intermediacy.

The second big benefit is availability. With blockchain, the network is no longer dependent on any one node. Since the same data is maintained by all the peers, any peer can go down and come back without affecting the overall functionality of the network. In contrast, in a distributed database, if a node with critical information goes down, your network goes down. You can include additional redundancy and use SHARDing and other techniques with the conventional databases, but the overall cost of the design goes up.

Different flavors of blockchain Various blockchain networks are on the market. As of 2017, according to an independent research firm, there were at least 1,500 companies building blockchain networks, with a total of $519 million invested by different venture capital funds. It all started with Bitcoin, followed by Ethereum, MultiChain, OpenChain, HyperLedger, and many more.

At a very high level, there are two types of blockchains, known as public and private, also referred to as permissionless and permissioned, respectively. Bitcoin and Ethereum are public, which means anyone can join the network and participate in transactions. With private blockchains, users must be authorized and authenticated before joining the network.

The other big difference is blockchains that allow smart contracts versus those that do not allow any program to be executed. For example, Bitcoin does not allow

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Multitech

www.multitech.com

TWITTER

@multitechsys

LinkedIn

www.linkedin.com/company/multi-tech-systems/

STRATEGIES: EMBEDDED SECURITY

smart contracts, whereas they are possible with Ethereum.

From a technology perspective, the other main difference comes in terms of what type of consensus algorithm is being used for validating the blocks of transactions, or how they are hashed and keyed into the blockchain. The most popular of the algorithms are proof of work (used by Bitcoin), proof of stake (used by Ethereum), and delegated Byzantine Fault Tolerance (dBFT), used by HyperLedger. Other algorithms include proof of activity, proof of burn, proof of elapsed time, and proof of capacity.

The technologies also differ in terms of which ones allow mining and provide incentives to the peer nodes in terms of cryptocoins as opposed to those that do not allow mining allowed. Most of the public networks award some kind of cryptotokens to the peers, whereas ­private ones do not.

Some of the newer technologies coming into the market are focused on speed and time of execution. In such cases, instead of waiting to create a block of transactions to insert into a blockchain, they create a single chain between peers participating in a dialogue and insert the transactions into this chain. Several examples are OpenChain and MultiChain.

Decision is ultimately based on data In the world of IoT, the type of network and the bandwidth available and the processing power of the end device drive the choice of data parameters. In constrained devices, which have very little memory and processing power, all data is sent upstream. At the edge, if there is a smarter gateway, there could be some screening and processing by adding business intelligence before pushing actionable data to the cloud. This option is becoming the preferred one as IoT customers want to conserve bandwidth and operate on lower data plans.

It is primarily going to be a question of investment in the edge device versus www.embedded-computing.com

size and cost of data plan and data storage. If it’s a high-end device, most of the processing can be done at the edge to conserve the bandwidth and space. On the other hand, in some cases it may not be possible to do anything, as it is legally required to store everything originating from an IoT device. If it is critical data, everything may need to be tracked if some kind of auditing needs to be done at a later time. However, for applications like monitoring the temperature of a solar panel or the humidity of a farm field, tracking may not be a big deal.

The big question: How does blockchain fit into the world of IoT? It may not be ­possible to add each end node of an IoT network into the blockchain. However, all the end nodes that go through an edge gateway can make the gateway participate in validation/authentication using blockchain techniques before transferring any kind of data into the network. The edge gateways and the capable end nodes can be enabled using blockchain for key applications like authentication/validation, certificate rotation, and validation, serving to verify firmware levels and security patches and also decommissioning if deemed as rogue devices. There must be a high level of coordination and interoperability between various entities participating in the blockchain network to successfully deploy a solution.

Understanding the challenges Before jumping on the blockchain train, users must consider several points: ›› Since the technology is still in its early stages, there is a general lack of full understanding on what it can and cannot do, which may call for some education. ›› Many vendors provide blockchain solutions, but not all are interoperable.

This creates disparate systems. ›› All parties that are part of this solution need to agree and adhere to a common platform for a successful rollout. ›› Since blockchain technology crosses many boundaries, keeping legal entities satisfied at each entry and exit point could be very challenging. Regulatory compliance is key here. ›› Since blockchain technology eliminates and removes the control for third-party intermediaries, it will be hard to overcome the vested interest of incumbent agencies. ›› In some of the public blockchain implementations, the response time for hashing and inserting a block into the chain can take a few seconds to a few minutes, with no guarantee of time or delay. ›› A lack of developers and consulting resources that can help easily implement blockchain solutions. ›› Finally, there is also a dark connotation that blockchain and cryptocurrency are associated with illegal, under-the-table kind of dealings. This myth needs to be dispelled before the technology can be largely accepted and become mainstream.

Prasad Kandikonda began his 26 years with MultiTech by founding the company’s India software division in Bangalore in 1990. Since then, he has held progressive responsibility including unified communications, innovation, and ultimately software across the MultiTech product line covering everything from legacy product to the latest in communications technology. Before joining MultiTech, Prasad was a systems engineer at Wipro. He holds multiple degrees, including a masters in technical engineering from the Indian Institute of Technology at Kanpur and as well as an FTGMP in Management from the Indian Institute of Management in Bangalore.

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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2018

INNOVATION AWARDS

TOP INNOVATIVE PRODUCT WINNERS Each year the Embedded Computing Design editorial team reviews dozens of products submitted for the annual Most Innovative Product Awards. These awards are granted to the three silicon, software, and system solutions the judges deem as having the greatest potential influence on the IoT and electronics engineering communities based on their design excellence, relative performance, and market impact.

SILICON WINNER

CEVA, INC.

NEUPRO AI PROCESSOR FAMILY For the second year in a row CEVA, Inc. has taken home a Most Innovative Product Award, only this time for its NeuPro AI Processor Family. The NeuPro portfolio contains four specialized AI processors that deliver between 2 and 12 Tera-Operations Per Second (TOPS) for various inferencing use cases.

More importantly, however, NeuPro devices are built on a unique hardware- and software-based parallel processing architecture that provides performance improvements over existing DSPs, CPUs, and GPUs in AI edge processing. Such architectures are likely the beginning of a new category of processors dedicated solely to neural network computation.

8- and 16-bit resolution support, greater than 90 percent MAC utilization, and efficient power consumption thanks to reduced DDR bandwidth round out the product highlights.

www.ceva-dsp.com/product/ceva-neupro

SOFTWARE WINNER

SPARKCOGNITION DARWIN MACHINE LEARNING PLATFORM

The highest-scoring product during the judging phase, SparkCognition’s Darwin provides the perfect platform for engineers with domain expertise to transfer their knowledge into working neural network models.

Darwin abstracts the intricacies of data science by providing embedded and IoT engineers a machine learning development environment that doesn’t require any specialized programming. The platform automatically selects the most appropriate modeling architecture and training techniques based on the user’s application, and proceeds to compare thousands of potential algorithms before identifying a solution that is the most accurate, performant, and efficient.

By more or less replicating the mind of a data scientist, Darwin is able to add context around the solutions it generates and subsequent predictions, making AI more accessible to more engineers.

www.sparkcognition.com/product/darwin 32

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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TOP INNOVATIVE PRODUCT WINNERS

2018

INNOVATION AWARDS

SYSTEMS WINNER

NORDIC SEMICONDUCTOR THINGY:52 IOT SENSOR KIT

The Thingy:52 from Nordic Semiconductor could be a barometer for the future of electronics engineering.

Based on Nordic’s nRF52840 Bluetooth 5 SoC with an integrated 32-bit Arm Cortex-M4F MCU and an advanced Bluetooth Low Energy (BLE) stack, the Thingy:52 also includes six on-board environmental sensors, a 9-axis accelerometer/gyroscope/compass, and an 8-bit audio speaker.

Still, the most significant features of the Thingy:52 are in software. A cloud connection is available to an If This, Then That (IFTTT) engine that makes IoT prototyping extremely simple, while an off-the-shelf smartphone application allows novice users to program the hardware right out of the box. For better or worse, this may be the path to the next “killer app” as more and more developers look for ways to abstract away embedded hardware subsystems.

www.nordicsemi.com/eng/Products/Nordic-Thingy-52

HONORABLE MENTIONS: SILICON TEXAS INSTRUMENTS

REDPINE SIGNALS

mmWave Radar Sensors

RS14100 Wireless Secure MCU

http://bit.ly/TImmWaveRadarSensors

http://bit.ly/RedpineSignalsRS14100

HONORABLE MENTIONS: SOFTWARE ZVELO

EMBEDDED IOT FRAMEWORK

IoT Security Platform

Embedded IoT Framework

http://bit.ly/zveloIoTSecurity

http://bit.ly/MentorEmbeddedIoTFramework

HONORABLE MENTIONS: SYSTEMS TECHNOLOGIC SYSTEMS

LATTICE SEMICONDUCTOR

TS-7553-V2

Embedded Vision Development Kit

http://bit.ly/Technologic7553-V2

http://bit.ly/LatticeEmbeddedVisionKit

www.embedded-computing.com

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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Embedded Computing Design Resource Guide

2018 Resource Guide AI & MACHINE LEARNING

INDUSTRIAL Continued

Crystal Group, Inc.

35

Technologic Systems

51

Vector Electronics & Technology, Inc.

52

AUTOMOTIVE

Crystal Group, Inc.

38

Avnet 53

DEV TOOLS & OSS

Crystal Group

54

Lauterbach Inc.

35, 36, 37

Quantum Leaps

36

NETWORKING

WITTENSTEIN High Integrity Systems

38

Avnet Integrated, Inc.

55

Crystal Group, Inc.

57

EMBEDDED HARDWARE

Microchip Technology, Inc.

56

Annapolis Micro Systems, Inc.

40

PROCESSING: OTHER

HARDWARE

Microchip Technology, Inc.

58

Annapolis Micro Systems, Inc.

39

Atrenne Integrated Solutions

41

SECURITY

Crystal Group, Inc.

42

Crystal Group, Inc.

Dolphin Interconnect Solutions

43

Timesys 57

Opal Kelly

44

wolfSSL 59

Siborg Systems

42

60

STORAGE

INDUSTRIAL

Annapolis Micro Systems, Inc.

60

Acces I/O Products

45

Apacer Technology Inc.

62

ADL Embedded Solutions Inc.

46

Crystal Group, Inc.

62

Avnet Integrated, Inc.

47

Virtium LLC

61

congatec inc

48

Crystal Group, Inc.

46

WIRELESS

Intermas, Inc.

49

Redpine Signals Inc.

Opal Kelly

34

IOT

63

50, 51

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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RACE0161 Autonomous Driving Computer The Crystal Group RACE0161 Rugged Computer combines impressive compute power, data-handling capabilities, and storage capacity in a compact, rugged solution capable of withstanding harsh environmental conditions, including potholes, collisions, and extreme temperatures that are likely to cause traditional systems to fail. Specifically designed for unmanned and autonomous driving vehicles, this turnkey solution is ideal for both military and commercial/industrial applications. embedded-computing.com/p374767

Crystal Group, Inc.



www.crystalrugged.com

FEATURES ĄĄ

12VDC input power

ĄĄ

Light weight aluminum construction – 30-40 lbs.

ĄĄ

Up to 2 TB DDR4 of memory

ĄĄ

Liquid cooled to maximize compute density

ĄĄ

Versatility with two (2) removable 15mm drives or three (3) removable 9.5mm 2.5" drives

ĄĄ

Expandable with six (6) slots

ĄĄ

Intel® Xeon® Scalable Processors

info@crystalrugged.com

 800-378-1636

 www.linkedin.com/company/crystal-group/

 @CrystalGroup Dev Tools and OSs

TRACE32 Multi Core Debugger for TriCore Aurix Lauterbach TriCore debug support at a glance: For more than 15 years Lauterbach has been supporting the latest TriCore microcontrollers. Our tool chain offers: • Single and multi core debugging for up to 6 TriCore cores • Debugging of all auxiliary controllers such as GTM, SCR, HSM and PCP • Multi core tracing via MCDS on-chip trace or via high-speed serial AGBT interface The Lauterbach Debugger for TriCore provides high-speed access to the target application via the JTAG or DAP protocol. Debug features range from simple Step/Go/Break up to AutoSAR OS-aware debugging. High speed flas programming performance of up to 340kB/sec on TriCore devices and intuitive access to all peripheral modules is included.

Lauterbach’s TRACE32 debugger allows concurrent debugging of all TriCore cores.

• Cores can be started and stopped synchronously.

• The state of all cores can be displayed side by side.

• All cores can be controlled by a single script.

Lauterbach, Inc.

www.lauterbach.com www.embedded-computing.com

FEATURES ĄĄ Debugging of all auxiliary controllers: PCP, GTM, HSM and SCR ĄĄ Debug Access via JTAG and DAP ĄĄ AGBT High-speed serial trace for Emulation Devices ĄĄ On-chip trace for Emulation Devices ĄĄ Debug and trace through Reset ĄĄ Multicore debugging and tracing ĄĄ Cache analysis embedded-computing.com/p374253

info_us@lauterbach.com  508-303-6812 www.lauterbach.com/pro/pro_tc3xx_aurix_as_alt1.php?chip=TC399XE%20A-STEP 

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Embedded Computing Design Resource Guide

AI & Machine Learning

Embedded Computing Design Resource Guide

Dev Tools and OSs

Lauterbach Debugger for RH850 Lauterbach RH850 debug support at a glance: The Lauterbach Debugger for RH850 provides high-speed access to the target processor via the JTAG/LPD4/LPD1 interface. Debugging features range from simple Step/Go/Break to multi core debugging. Customers value the performance of high speed flash programming and intuitive access to all of the peripheral modules.

TRACE32 allows concurrent debugging of all RH850 cores.

• The cores can be started and stopped synchronously.

• The state of all cores can be displayed side by side.

• All cores can be controlled by a single script.

All RH850 emulation devices include a Nexus trace module which enables multi core tracing of program flow and data transactions. Depending on the device, trace data is routed to one of the following destinations: • An on-chip trace buffer (typically 32KB) • An off-chip parallel Nexus port for program flow and data tracing • A high bandwidth off-chip Aurora Nexus port for extensive data tracing The off-chip trace solutions can store up to 4GB of trace data and also provide the ability to stream the data to the host for long-term tracing, thus enabling effortless performance profiling and qualification (e.g. code coverage).

Lauterbach, Inc.

www.lauterbach.com

FEATURES ĄĄ AMP and SMP debugging for RH850, GTM and ICU-M cores ĄĄ Multicore tracing ĄĄ On-chip and off-chip trace support ĄĄ Statistical performance analysis ĄĄ Non intrusive trace based performance analysis ĄĄ Full support for all on-chip breakpoints and trigger features ĄĄ AUTOSAR debugging embedded-computing.com/p374254

 info_us@lauterbach.com  508-303-6812 www.lauterbach.com/pro/pro_r7f701325_alt1.php?chip=R7F701334A

Dev Tools and OSs

State Machines and Tools The embedded software industry is in the midst of a major revolution. Tremendous amount of new development lays ahead.

This new software needs an actual architecture that is inherently safer, better structured, and easier to understand than the usual shared-state concurrency and blocking based on a traditional RTOS. Modern Embedded Software Quantum Leaps‘ QP™ real-time frameworks and a comprehensive suite of tools provide such a modern, reusable, event-driven architecture based on active objects (actors), hierarchical state machines (UML statecharts), graphical modeling and automatic code generation. While others only talk about these modern techniques, we actually offer battle-tested software that has been chosen by hundreds of companies around the world to build electronic products ranging from implantable medical devices to complex weapon systems.

Quantum Leaps, LLC

www.state-machine.com

36



FEATURES ĄĄ Modern, event-driven QP™ real-time frameworks based on

active objects (actors) and hierarchical state machines

ĄĄ Free, graphical QM™ modeling tool for designing UML statecharts

and automatic code generation based on QP™ frameworks ĄĄ Selection of built-in real-time kernels for standalone operation on ARM Cortex-M and other MCUs ĄĄ Ported to traditional RTOS/OS, such as ThreadX, FreeRTOS, embOS, uC/OS, as well as Linux and Windows ĄĄ Powerful QP/Spy™ software tracing system for live monitoring, testing and debugging ĄĄ QUTest™ unit testing harness with support for Python and Tcl scripting ĄĄ MISRA-C (QP/C) and MISRA-C++ (QP/C++) compliant

miro@quantum-leaps.com

 www.linkedin.com/company/quantum-leaps

Embedded Computing Design RESOURCE GUIDE | Fall 2018

embedded-computing.com/p374788

 919-360-5668

www.embedded-computing.com

TRACE32 JTAG/ETM Debugger for ARMv8 Lauterbach ARMv8 support at a glance: More than 17 years of experience in ARM debugging enable Lauterbach to provide best-in-class debug and trace tools for ARMv8 based systems: • Multicore debugging and tracing for any mix of ARM and DSP cores • Support for all CoreSight components to debug and trace an entire SoC • Powerful code coverage and run-time analysis of functions and tasks • OS-aware debugging of kernel, libraries, tasks of all commonly used OSs Lauterbach debug tools for ARMv8 help developers throughout the whole development process, from the early pre-silicon phase by debugging on an instruction set simulator or a virtual prototype over board bring-up to quality and maintenance work on the final product.

FEATURES ĄĄ

Full support for all CoreSight components

ĄĄ

Full architectural debug support

ĄĄ

Support for 64-bit instruction set and 32-bit instruction sets ARM and THUMB

Debugger features range from simple step/go/break, programming of on-chip-flash, external NAND, eMMC, parallel and serial NOR flash devices, support for NEON and VFP units, to OS-aware debug and trace concepts for 32-bit and 64-bit multicore systems.

ĄĄ

32-bit and 64-bit peripherals displayed on logical level

ĄĄ

Support for 32-bit and 64-bit MMU formats

TRACE32 debuggers support simultaneous debugging and tracing of homogeneous multicore and multiprocessors systems with one debug tool.

ĄĄ

Ready-to-run FLASH programming scripts

ĄĄ

Multicore debugging

ĄĄ

On-chip trace support (ETB, ETF, ETR)

ĄĄ

Off-chip trace tools (ETMv4)

Start/Stop synchronization of all cores and a time-correlated display of code execution and data r/w information provides the developer with a global view of the system's state and the interplay of the cores.

ĄĄ

Auto-adaption of all display windows to AArch32/ AArch64 mode

AMP debugging with DSPs, GPUs and other accelerator cores

About our Products

Our Company Philosophy • • • •

ĄĄ

High-tech company with long-term experience Technical know-how at the highest level Worldwide presence Time to market

• • • • •

Everything from a single source Open system Open user interface for everything Long-term investment through modularity and compatibility The full array of architectures supported

embedded-computing.com/p374252

Lauterbach, Inc.

www.lauterbach.com www.embedded-computing.com

info_us@lauterbach.com  508-303-6812 www.lauterbach.com/pro/pro_zynq-ultrascale_alt1.php?chip=ZYNQ-ULTRASCALE+



Embedded Computing Design RESOURCE GUIDE | Fall 2018

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Embedded Computing Design Resource Guide

Dev Tools and OSs

Embedded Computing Design Resource Guide

Dev Tools and OSs

SAFERTOS® SAFERTOS® is a pre-certified, pre-emptive, safety critical Real-Time Operating System (RTOS) that delivers determinism and robustness to embedded systems, whilst using minimum resources.

SAFERTOS is delivered for a specific processor/compiler combination. By following the clear, concise instructions within the Safety Manual, the integrity of SAFERTOS can be preserved whilst it’s installed and integrated into a development environment. This removes the need for retesting on the target hardware, and certification as part of a product becomes very straightforward.

FEATURES ĄĄ Pre-certified to IEC 61508 SIL3 and ISO 26262 ASILD by TÜV SÜD ĄĄ Supplied as source code with a full Design Assurance Pack

SAFERTOS includes features supporting the development of safety critical products such as Task Isolation and Separation functionality, and intrinsic self-verification routines. With an imperceptible boot time, SAFERTOS is an ideal choice in systems that need to protect users and equipment from hazards quickly after a power on or brown out event.

ĄĄ Intrinsic self-verification routines

SAFERTOS supports IEC 62304 Class C and FDA 510(K) submissions for medical devices, IEC 61508 SIL 3 for industrial devices, ISO 26262 ASIL D for automotive and EN50128 SIL 4 for rail. SAFERTOS is available pre-certified

by TÜV SÜD.

ĄĄ Supports wide range of popular microprocessors, and all popular

WITTENSTEIN high integrity systems



ĄĄ MPU support as standard ĄĄ Migration path from FreeRTOS ĄĄ MISRA C compliant

development tools

embedded-computing.com/p373531

Sales@HighIntegritySystems.com

 WITTENSTEIN high integrity systems

www.HighIntegritySystems.com

 +44 1275 395 600



@WITTENSTEIN_HIS

Automotive

RACE0161 Autonomous Driving Computer The Crystal Group RACE0161 Rugged Computer combines impressive compute power, data-handling capabilities, and storage capacity in a compact, rugged solution capable of withstanding harsh environmental conditions, including potholes, collisions, and extreme temperatures that are likely to cause traditional systems to fail. Specifically designed for unmanned and autonomous driving vehicles, this turnkey solution is ideal for both military and commercial/industrial applications. embedded-computing.com/p374767

Crystal Group, Inc.

www.crystalrugged.com

38





FEATURES ĄĄ

12VDC input power

ĄĄ

Light weight aluminum construction – 30-40 lbs.

ĄĄ

Up to 2 TB DDR4 of memory

ĄĄ

Liquid cooled to maximize compute density

ĄĄ

Versatility with two (2) removable 15mm drives or three (3) removable 9.5mm 2.5" drives

ĄĄ

Expandable with six (6) slots

ĄĄ

Intel® Xeon® Scalable Processors

info@crystalrugged.com  800-378-1636 www.linkedin.com/company/crystal-group/

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @CrystalGroup

www.embedded-computing.com

WILD FMC+ GM60 ADC & DAC with RFSoC The WILD FMC+ GM60 ADC & DAC is the industry’s first COTS Mezzanine to feature the new Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology (ZU25DR, ZU27DR, or ZU28DR).

This breakthrough RFSoC combines FPGA processing and A/D and D/A Converters in a single chip, giving the GM60 card remarkable density and performance.

For maximum performance, pair one or two GM60 with an Annapolis WILDSTAR 3U OpenVPX Baseboard (1X) or 6U OpenVPX Baseboard (2X) or PCIe Baseboard (1X). Annapolis WILDSTAR Baseboards utilize up to three high-performance FPGAs, in addition to the GM60 Mezzanine’s RFSoC. Also designed for standalone use, the GM60 is ideal for applications limited by Size, Weight, Power, and Cost (SWaP-C). This WILD FMC+ card operates within a tight envelope; it is slimmer than a 3U OpenVPX board, with about 45% less depth.

GM60 shown mounted to 3U Baseboard with blindmate RF out the backplane (VITA 67.3)

FEATURES ĄĄ

ĄĄ

ĄĄ

ĄĄ

ĄĄ

ADC • Channels: 4 • Max Sample Rate: 4.0 GSps • Resolution: 12 bit DAC • Channels: 4 • Max Sample Rate: 6.4 GSps • Resolution: 14 bit I/O Connectors (optional 50Ω SSMC or VITA 67) • Four analog outputs • Four analog inputs • One clock input • One trigger input Mechanical and Environmental • Integrated heat sink and EMI/crosstalk shields • Air- or conduction-cooled Clock Synchronization • Software-selectable external clock input or onboard PLL clock • All ADCs and DACs across multiple mezzanine cards easily synchronized MADE IN

The standalone GM60, shown with a lower channel count configuration

U. S. A. embedded-computing.com/p374654

Annapolis Micro Systems, Inc.

www.annapmicro.com/products/wild-fmc-gm60-adc-dac/ www.embedded-computing.com

 wfinfo@annapmicro.com  410-841-2514

Embedded Computing Design RESOURCE GUIDE | Fall 2018

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Hardware

Embedded Computing Design Resource Guide

Embedded Hardware

WILDSTAR UltraKVP ZP for PCIe combines an MPSoC with 1 or 2 UltraScale or UltraScale+ FPGAs

WILDSTAR™ FPGA Board for PCIe – WBPXUW The WILDSTAR UltraKVP ZP combines the latest Xilinx Kintex UltraScale or Virtex UltraScale+ FPGAs with a powerful quadcore Zynq UltraScale+ MPSoC. This PCIe Baseboard is designed to tackle the most challenging data processing applications.

High Density I/O WILD FMC+ (WFMC+™) next generation I/O site supports 32 HSS and 100 LVDS I/O for higher density ADC and DAC solutions.

WFMC+ also supports card stacking, for maximum performance per slot.

Secure In addition to high performance, the Zynq+ is Xilinx’s most secure solution – it has multiple levels of hardware and software security.

Rugged & Reliable Annapolis FPGA boards are field-proven to perform at the highest levels in challenging environments.

Proven EcoSystem WILDSTAR boards are all part of the WILD100 EcoSystem™, an interoperable portfolio of rugged high-performance OpenVPX and PCIe COTS boards and systems.

Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.

MADE IN

U. S. A.

Annapolis Micro Systems, Inc.

www.annapmicro.com/product-category/fpga-boards-2/

40

Embedded Computing Design RESOURCE GUIDE | Fall 2018

FEATURES ĄĄ General Features

• Up to two Xilinx® Kintex® UltraScale™ XCKU115 or Virtex® UltraScale+™ XCVU5P / XCVU9P / XCVU13P FPGAs – Up to 24,576 DSP Slices per board – Up to 7,560,000 logic cells per board – Hard 8x PCIe Gen3 endpoint for DMA and register access – FPGAs programmable from attached flash or Annapolis-provided software API • IOPE DDR4 DRAM ports on all FPGAs running up to 2400 MT/s • Xilinx Zynq® UltraScale+ MPSoC Motherboard Controller XCZU3EG • PLX PCI Express Gen3 Switch • System management

ĄĄApplication Development

• Full Board Support Package for fast and easy application development • Develop in Open Project Builder™ GUI environment or create VHDL and use HDL environment • Board control and status monitoring can be local (stand-alone), remote (via Ethernet), or hybrid (both local and remote)

ĄĄ Front Panel I/O

• Wild FMC+ (WFMC+) next generation I/O site – Accepts standard FMC and FMC+ cards (complies to FMC+ specification) – Supports stacking (2 I/O cards per site) – Up to 32 High Speed Serial and 100 LVDS pairs connections to FPGA

ĄĄ Mechanical and Environmental

• • • •

10.5” length for wider chassis compatibility Does not require a “Full Length” slot Integrated heat sink and board stiffener External +12V power connector mil-embedded.com/p000000  wfinfo@annapmicro.com  410-841-2514

www.embedded-computing.com

Atrenne is your lab development chassis partner and offers everything you need when the time comes to design a fully ruggedized, deployable chassis.

VPX Lab Development Systems Atrenne provides the industry’s widest array of desktop, tower, open frame, and ATR lab development systems for usage in the lab environment. Chassis are available that support both 3U and 6U module form factors, and both air and forced-air conduction cooling methodologies. Atrenne offers lab chassis in a range of slot counts, power supply configurations, orientations and backplane topologies. The horizontally oriented DT-CC and DT-XC chassis provide over 300W per slot in a desktop or rackmountable enclosure. From the small 849-S145 (2-slot, 3U, 200W) to the large RME13XC (6U, 16-slots, 3300W), and many options in-between, Atrenne can provide a development platform that will support the success of your program development.

Atrenne’s lab development offerings include: • 849-S145 – Desktop, 3U, 2-slot, Air • COOL-CC3 – Desktop, 3U, 6-slot, Conduction • COOL-XC3 – Desktop, 3U, 6-slot, Air • COOL-CC6 – Desktop, 6U, 6-slot, Conduction • COOL-XC6 – Desktop, 6U, 6-slot, Air • 585-9U – Rackmount, 6U, 8-slot, Air • 708/728 – 3U-9U, Rackmount, 6U, 5-12 slots • DT-CC – Horizontal, 6U, 6-slot, High Power, Conduction • DT-XC – Horizontal, 6U, 6-slot, High Power, Air • RME13CC – 13U, Desk/Rackmount, 6U, 16-slot, Conduction • RME13XC – 13U, Desk/Rackmount, 6U, 16-slot, Air • RME9CC – 9U, Desk/Rackmount, 3U, 12-slot, Conduction • RME9XC – 9U, Desk/Rackmount, 3U, 12-slot, Air • 522 – Open Frame, 3U/6U, 10-slot • OF-SMART3 – Open Frame, 3U, 6-slot • OF-SMART6 – Open Frame, 6U, 6-slot

Transmission rates start at 3.125 Gbaud with many 3U and 6U backplanes that operate at 10 Gbaud using the standard VPX connector. These new Gen-3, 10 Gbaud backplanes enable the utilization

www.atrenne.com/system/lab-development-systems www.embedded-computing.com

Atrenne also offers ¾ ATR chassis that are as comfortable in the lab as they are deployed in the field. The D2D series has been designed to bridge the transition from development to demonstration to deployment with upgradable and expandable internal components. During the deployment phase, power supplies, fans, IO and the backplane is upgradable to rugged components, enhancing the ruggedness of the chassis.

FEATURES

Atrenne also offers the industry’s widest selection of VPX backplanes including pass-through backplanes which can be configured to meet an application-specific interconnect specification with VPX compatible cabling. Off-the-shelf backplanes support central switched, distributed, daisy chained, partial mesh, full mesh, and pass-through topologies.

Atrenne, a Celestica Company

of high-speed serial interconnects including 40 Gb Ethernet, PCI Express Gen 3, Infiniband QDR and FDR10 and USB 3.1 in a VPX system.

ĄĄ

3U and 6U Modules, Air and Conduction Cooled

ĄĄ

VPX, OpenVPX, VME64x, Hybrid

ĄĄ

Tower, Desktop, Open Frame, Rackmount, Horizontal and ATR

ĄĄ

3rd-Party Agnostic

ĄĄ

25+ Standard VPX Backplanes

ĄĄ

10 Gbaud, Gen-3 Signaling for 40Gb Ethernet, PCIe V3 and more

ĄĄ

2-16 Slots

ĄĄ

Wide Range of Power Supplies from 200W to 3750W

ĄĄ

110 VAC, ATX, 200 VAC, Upgradable

ĄĄ

+5V and +12V-Centric Power Supplies

ĄĄ

Custom Variants and Integration embedded-computing.com/p373693

sales@atrenne.com  800.926.8722  @AtrenneOfficial  www.linkedin.com/company/atrenne-integrated-solutions 

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Hardware

RE1813 RUGGED EMBEDDED COMPUTER The RE1813 Rugged Embedded Computer is a high-performance, small form factor computer designed for a variety of mobile uses in industrial and military applications.

A military version of Crystal Group’s RE1813 Rugged Embedded Computer has been chosen to provide enhanced mission capability for an international Airborne Warning and Control System to equip E-767 aircraft with state-of-the-art computing capability. Common installations of the RE1813 include crew workstations on airborne applications where optimization of size, weight, and power is critical.

This new embedded design is configurable for mobile applications requiring either AC or DC power supplies and where high performance is required with non-server functionality. To help guard sensitive data-at-rest, the RE1813 encryption-based cybersecurity protection features the Intel processor, chipset, and Trusted Platform Module.

Operating system support includes Windows 10®, Redhat® 6.5/6.6, Windows Server® 2016, and VMWare®.

Crystal Group, Inc.



www.crystalrugged.com

FEATURES Lightweight aluminum construction – 10 lbs. (4.5 kg) ĄĄ Tray or wall mounted ĄĄ Large thermostatically controlled fans for quiet operation ĄĄ MS 3476L12 military circular power connector ĄĄ Up to three (3) 2.5" SSD removable drives ĄĄ Xeon D or Skylake CPU motherboard options ĄĄ Modular power supply for multiple input options ĄĄ One PCIe x16 expansion slot ĄĄ Ultra-rugged and compact for extreme ambient conditions ĄĄ

embedded-computing.com/p374778

info@crystalrugged.com

 800-378-1636

 www.linkedin.com/company/crystal-group/

 @CrystalGroup Hardware

LCR-Reader-MP LCR-Reader-MP (Multipurpose) offers users an unprecedented number of features, a record high 0.1% basic accuracy/measurement range and up to 100 kHz test frequency. It is the latest model in the LCR-Reader digital multimeter family.

The device can measure inductance in nH and capacitance in pF range.

High test signal frequency furnishes a very high resolution of 0.001 pF and 0.1 nH. LCR-Reader-MP also provides the highest available measurement ranges: 5 mΩ to 20 MΩ, 1 pF to 680 mF, and 5 nH to 100 H. It measures AC/DC Voltage and Current and can be used as a low frequency Oscilloscope to display waveforms at different nodes on an active circuit board. In addition to all that, it can measure frequency, pulse duration, duty cycle and count pulses. Besides that, it can be used as a Signal Generator up to 400 KHz with sine, rectangle and triangular waveforms.

The set includes a shielded two-wire probe connector allowing the use of LCR-Reader-MP as a low frequency Kelvin probe station for active board debugging. Finally, it can test Diode/LED and continuity.

A budget model LCR-Reader LCR-R1 with a reduced functionality is also available.

All devices are supplied with a NIST traceable Calibration Certificate.

Siborg Systems Inc

www.LCR-Reader.com

42



info@siborg.ca

FEATURES ĄĄ

Automatic L-C-R, ESR and Diode/LED measurement, Continuity test

ĄĄ

Basic accuracy 0.1%

ĄĄ

AC/DC Voltage/Current measurement

ĄĄ

Oscilloscope Voltage waveform display for up to 100 kHz

ĄĄ ĄĄ

Measurement of Frequency, Pulse period, Duty Cycle up to 400 kHz Signal Generator: Sine, Rectangle, Triangle up to 100 kHz embedded-computing.com/p374691

 1-877-623-7576

 www.linkedin.com/company/siborg-systems-inc/

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @LCR_Reader www.embedded-computing.com

MXS824 24 Gen3 PCIe Switch The MXS824 is Dolphin's fourth generation PCIe switch product and enables users the ability to create a scalable PCIe fabric solution using standard PCIe copper or fiber cables. PCIe solutions running over back planes can now easily be enabled to run over external cables.

Larger PCIe configurations can be realized by interconnecting multiple MXS824 switches. By loading the appropriate firmware, the MXS824 supports both transparent and non transparent bridging (NTB) use cases for clustering and I/O expansion applications.

The MXS824 is the high-end switching component in Dolphin’s new PCI Express Gen3 product family. This 24 port 1U cluster switch delivers 32 GT/s of non-blocking bandwidth per port at ultra low latency. Up to 4 ports can be combined into a single x16 / 128 GT/s port if higher bandwidth is required. Each connection is fully compliant with PCI Express Gen1, Gen2 and Gen3 I/O specifications.

Applications that do not need PCIe x16 speed can alternatively use the 8 port x16 PCIe Gen3 IXS600 switch.

PCIe IO Expansion The MXS824 switch used in combination with the MXH832 or the PXH832 will support standard IO expansion, connecting one server to many PCIe Devices or PCIe Expansion chassis. Additional configurations supporting multiple hosts and switch partitioning, fail-over configurations will be supported in the future. Management and configuration of the PCIe fabric will be done through the Ethernet port.

PCIe Clustering/Networking For host to host communication, the MXS824 can be combined with Dolphin’s PXH830 or MXH830 Host Adapters. Operating in Non Transparent Bridging mode, Dolphin has solved the strict power on requirements normally associated with PCI Express. Hosts, cables, and the switch can be hot-swapped and power cycled in any order,

providing real plug and play as normally expected from networking components.

The MXS824 supports Dolphin’s extensive PCI Express Software libraries to create a powerful and reliable communication solution for applications that benefit from an ultra-low latency, high performance cluster interconnect. Dolphin’s PCI Express Software enables standard and embedded Linux, Windows, RTX and VxWorks network applications to benefit from PCI Express performance without modification.

This comprehensive solution is ideal for real-time, technical and high performance computing, cloud computing, and enterprise business applications.

Reflective Memory The MXS824 supports large reflective memory configurations and multiple multicast groups. Customers using older reflective memory solutions from Dolphin will have en easy migration to the new platform.

FEATURES ĄĄ 24 PCI Express Gen3 x4 ports ĄĄ Gen3 8.0 GT/S per lane ĄĄ NTB or Transparent use ĄĄ SFF-8644 Connectors ĄĄ 32 GT/s per port ĄĄ PCIe 3.0 or MiniSAS-HD cables ĄĄ Copper and Fiber-optic cables ĄĄ 19 Inch 1U rack mountable ĄĄ Redundant Fans ĄĄ Ethernet based management and monitoring

embedded-computing.com/p374772

Dolphin Interconnect Solutions www.dolphinics.com

www.embedded-computing.com



paraison@dolphinics.com  214-960-9066

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Hardware

SYZYGY® Product Family Introduced in 2017, Opal Kelly’s SYZYGY® Specification defines an FPGA-agnostic peripheral interconnect standard that fits between low-performance, low-cost Digilent™ Pmod and high-performance, high-cost, high pin count FMC (VITA 57.1). The compromise enables low-cost systems with high performance peripherals in a compact form factor.

Applications include: • Data acquisition • Software-defined radio • Video input and output

• Machine vision • Advanced sensing • Robotics

SYZYGY Carriers

SYZYGY Features Standard and Transceiver-capable peripherals ĄĄ High-quality, low-cost cable options ĄĄ Compact 40-pin (standard) or 60-pin (transceiver) connectors ĄĄ Pin count optimized to economize FPGA I/O for multiple single-purpose peripherals ĄĄ +5v and +3.3v system voltages standard ĄĄ SmartVIO for programmable I/O voltages ĄĄ

Several carrier boards and peripheral modules are available in the growing ecosystem of the standard.

SYZYGY Peripherals

The Opal Kelly Brain-1 is an open-source hardware design with a Xilinx Zynq ARM+FPGA, 1 GiB DDR3, Gb ethernet, USB OTG, 3x SYZYGY standard and 1x SYZYGY transceiver ports. Introduced to encourage and support the adoption of the SYZYGY standard, schematics and reference sources are available through open source repositories.

SZG-ADC-LT2264 – Dual 40 MSPS, 12-bit ADC optimized for digital communications, software-defined radio, and medical imaging applications.

SZG-DAC-AD9116 – Dual 125 MSPS, 12-bit DAC for software-defined radio and direct digital synthesis.

SZG-SENSOR – Multi-sensor module with environmental, motion, light, and global position sensors.

SZG-CAMERA – High performance 3.4 Mpixel color CMOS sensor at up to 215 frames-per-second for machine vision, robotics, and digital imaging.

SZG-DUALSFP – Dual SFP+ cage supporting highperformance fiber and wired networking and communications.

The XEM7320 is a FrontPanel-enabled SuperSpeed USB 3.0 system integration module with a Xilinx Artix-7 FPGA, 1 GiB DDR3, 2x SYZYGY standard ports, and 1x SYZYGY transceiver port. The XEM7320 is fully supported by the FrontPanel SDK for fast and easy high-speed communication with a host PC or embedded system.

More information about the SYZYGY standard may be found at http://syzygyfpga.io.

Opal Kelly Incorporated

www.opalkelly.com

44



sales@opalkelly.com

embedded-computing.com/p374720

 217-391-3724

 www.linkedin.com/company/opal-kelly-incorporated

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @opalkelly

www.embedded-computing.com

mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232/422/485 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming.

The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out.

The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

ACCES I/O Products, Inc. www.accesio.com



FEATURES ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port mPCIe RS232/422/485 serial communication cards ĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signals

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RX

ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication rates as high as 3Mbps – 12MHz with ĄĄ ĄĄ ĄĄ ĄĄ

custom crystal Custom baud rates easily configured ±15kV ESD protection on all signal pins 9-bit data mode fully supported Supports CTS and RTS handshaking

embedded-computing.com/p372557

contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

 858-550-9559 twitter.com/accesio



Industrial

USB3-104-HUB – Rugged, Industrial Grade, 4-Port USB 3.1 Hub Designed for the harshest environments, this small industrial/military grade 4-port USB 3.1 hub features extended temperature operation (-40°C to +85°C), locking USB and power connections, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104-sized and can easily be installed in new or existing PC/104-based systems as well. The USB3-104-HUB makes it easy to add USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Security, Embedded OEM, Laboratory, Kiosk, Military/Mission Critical, Government, and Transportation/Automotive.

This versatile four-port hub can be bus powered or self (externally) powered. You may choose from two power inputs (power jack and terminal block) to provide a full 900mA source at 5V on each of the downstream ports. Additionally, a wide-input power option exists to accept from 7VDC to 28VDC. All type A and type B USB connections feature a locking, high-retention design.

ACCES I/O Products, Inc. www.accesio.com

www.embedded-computing.com



FEATURES ĄĄ Rugged, industrialized, four-port USB 3.1 hub ĄĄ USB 3.1 Gen 1 with data transfers up to 5Gbps (USB 2.0 and 1.1 compatible) ĄĄ Extended temperature (-40°C to +85°C) for industrial/military grade applications ĄĄ Locking upstream, downstream, and power connectors prevent accidental disconnects ĄĄ SuperSpeed (5Gbps), Hi-speed (480Mbps), Full-speed (12Mbps), and Low-speed (1.5Mbps) transfers supported ĄĄ Supports bus-powered and self-powered modes, accessible via DC power input jack or screw terminals ĄĄ LED for power, and per-port RGB LEDs to indicate overcurrent fault, High-Speed, and SuperSpeed ĄĄ Wide input external power option accepts from 7-28VDC ĄĄ OEM version (board only) features PC/104 module size and mounting compatibility

contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

embedded-computing.com/p374114

 858-550-9559 twitter.com/accesio



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Embedded Computing Design Resource Guide

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Embedded Computing Design Resource Guide

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ADLE3800SEC Intel® E3800 Series Edge-Connect SBC Measuring just 75mm x 75mm, the ADLE3800SEC is an embedded SBC specially optimized for Size, Weight, and Power (SWAP) applications. Based on the E3800 series Intel Atom™ SoC, this tiny board delivers maximum performance in the smallest possible size. It features a quad-core processor with up to 2MB onboard cache, and an integrated Intel HD Graphics engine with support for DirectX 11, Open GL 4.0, and full HD video playback.

About EdgE-ConnECt ArChitECturE: Via the backside board-edge

connector, additional I/O is easily accessible using standard and customerspecific breakout boards. Easy expansion helps reduce cabling, integration time, and system size while increasing quality and overall MTBF. Easily connect to sensors, cameras, and storage with a full range of onboard I/O: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie, and SATA. The Intel HD Graphics engine supports video output in either HDMI or Display Port format.

An onboard M.2 socket allows users to install the fastest Solid State storage solutions on the market. Extended Temperature Ratings and hard-mounted Edge-Connect design make the ADLE3800SEC ideal for industrial embedded applications.

AppliCAtions: UUAV, UUV Unmanned Systems, Industrial Control

Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing.

ADL Embedded Solutions, Inc.



FEATURES Small Size (75mm x 75mm) 4GB soldered DRAM (DDR3-1333 MHz) ĄĄ Low-power Atom® processor (8W TDP) ĄĄ Quad-Core/Dual-Core Versions Available ĄĄ M.2 Storage Socket Onboard ĄĄ Expansion Connector ĄĄ Extended Temperature Available ĄĄ ĄĄ

embedded-computing.com/p374784

sales@adl-usa.com

 858-490-0597 x115

 www.linkedin.com/company/adl-embedded-solutions

www.adl-usa.com

 @ADLEmbedded Industrial

RE1012 RUGGED EMBEDDED COMPUTER Crystal Group RE1012 Rugged Embedded Computer packs serverclass performance in a compact, rugged embedded computer that thrives where other systems would fail due to weather, shock, mold, dust, etc.

A pint-sized powerhouse, the high-performance RE1012 combines a six-core Intel Xeon® D-1528 processor, up to 128GB of ECC DDR4 RAM, two internal 2.5-inch SATA solid-state drive (SSD) bays and one internal m.2 SSD bay, and flexible I/O in a rugged package measuring just 2.4 x 16 x 11 inches and weighing 7.5 pounds (3.4 kg).

Its innovative fan-less design employs passively cooled heat-pipe technology and has no moving parts, reducing noise and maintenance.

The RE1012 can be panel or rack mounted and comes with a variety of power options for AC and DC inputs.

Crystal Group, Inc.

www.crystalrugged.com

46





FEATURES ĄĄ

Compact construction – 2.4"H x 16" x 11" footprint

ĄĄ

Panel or rack mounting options

ĄĄ

Six (6) core Xeon D-1528 CPU

ĄĄ

Dual 2.5 SSD hard drives

ĄĄ

ĄĄ

Billet construction from milled and strain hardened 6061-T6511 structural aircraft aluminum IEEE 1613 and IEC 61850-3 certification ready embedded-computing.com/p374763

info@crystalrugged.com  800-378-1636 www.linkedin.com/company/crystal-group/

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @CrystalGroup

www.embedded-computing.com

MSC C6B-CFLH COM Express Module with 8th Generation Intel® Core™ Processor The COM Express module (MSC C6B-CFLH) features Intel Core-i7, Core-i5, Core-i3 and Xeon® processors which equates to more processing power for target applications like medical, gaming, in-broadcasting, and also in-media production equipment, video surveillance, traffic enforcement, and for toll collect systems. Based on the 8th generation Intel® CoreTM processors, codenamed “Coffee Lake”, Intel’s latest generation introduces six core processors and delivers considerably higher computing and graphics performance at a similar power dissipation level as the previous 7th generation. Compute and graphics intensive applications can greatly benefit from the increased performance on COM Express basic form factor. The open industry standard COM Express supports customers to easily migrating their applications from former implementations to the latest processor generation.

The MSC C6B-CFLH offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.1/2.0 interfaces complete the compact and powerful module.

With choices of six and quad-core processor options, the board is well positioned to address challenging performance demands. Besides an extensive set of interfaces and features, the MSC C6B-CFLH offers hardware based security compliant to the requirements of TCG (Trusted Computing Group).

The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.4, DisplayPort 1.2, HDMI 1.4 and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

FEATURES ĄĄ

Intel® Core™ i7-8850H (six-core, 2.6/4.3GHz, 45/35W cTDP)

ĄĄ

Intel® Core™ i5-8400H (quad-core, 2.5/4.2GHz, 45/35W cTDP)

ĄĄ

Intel Core™ i3-8100H (quad-core, 3.0GHz, 45W/35 cTDP)

ĄĄ

Intel® Xeon® E-2176M (six-core, 2.7/4.4GHz, 45/35W cTDP)

ĄĄ

Intel® UHD Graphics

ĄĄ

Intel® chipsets QM370 or CM246

ĄĄ

Up to 32GB DDR4-2666 SDRAM, dual channel (ECC optionally supported on models with Xeon E-2176M and Core i3-8100H)

ĄĄ

Four SATA 6Gb/s mass storage interfaces

ĄĄ

Three DisplayPort/HDMI/DVI interfaces

ĄĄ

Embedded DisplayPort / LVDS (24 Bit, dual channel) interface

ĄĄ

Triple independent display support

ĄĄ

DirectX 12, OpenGL 4.5, OpenCL 2.x

ĄĄ

Resolution up to 4096 x 2304

ĄĄ

Eight PCI Express™ x1 lanes, configurable up to x4, Intel® Rapid Storage Technology support

ĄĄ

PEG configurable as 1x16 or 2x8 or 1x8 + 2x4

ĄĄ

Four USB 3.1/2.0 and four USB 2.0 interfaces

ĄĄ

Trusted Platform Module

ĄĄ

UEFI Firmware

www.msc-technologies.eu/products-solutions/products/boards/com-express-type-6/msc-c6b-cflh.html embedded-computing.com/p374631

Avnet Inc.

www.msc-technologies.eu www.embedded-computing.com





info@avnet-integrated.eu www.linkedin.com/company/avnet/

 +49 7249 910 0 twitter.com/Avnet



Embedded Computing Design RESOURCE GUIDE | Fall 2018

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Embedded Computing Design Resource Guide

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Embedded Computing Design Resource Guide

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FEATURES ĄĄ Latest Intel® Atom™, Celeron® and Pentium® processors based

on the highly optimized new 14nm micro-architecture.

ĄĄ All form factors host the high-performance Intel® Gen9 graphics

New industrial family Introducing low-power Intel® Atom™, Celeron® and Pentium® processors (Codename Apollo Lake) on six different form factors: Mini-ITX motherboards and Pico-ITX single board computers as well as COM Express Compact, COM Express Mini, Qseven and SMARC 2.0 Computer-onModules. What makes this processor so attractive for design-in on so many different form factors?

A quick overview The new low-power processors from Intel® offer significantly higher performance at lower power consumption with massively improved graphics capabilities. Designers across the broad spectrum of embedded markets will find essential value in the improved performance-per-watt at a power envelope of only 6 to 12 watt. Additionally, new graphics capabilities are fueled by the powerful Intel® Gen 9 graphics engine, which was previously only available at the high-end level of Intel® Core™ processors. Extended temperature support, accommodating ambient temperatures ranging from -40° C to +85° C, as well as comprehensive real-time capabilities rounds out the feature set. All this makes the new low-power processor generation very attractive, blending performance, price and embedded longevity.

which provides up to 18 execution units and supports up to 4k decode and encode capabilities for HEVC4, H.264, VP8, SVC and MVC.

ĄĄ Support up to three 4K displays with resolutions up to

4096 x 2160 @ 60 Hz.

ĄĄ The 14 nm BGA (Ball Grid Array) package now has 1296 pins,

or 10% more as compared to the 1170 pins of its predecessors.

As a result, the new processors’ BGA options have a 10% larger footprint, measuring 31x24 mm or 744 mm² compared to earlier processors measuring 25 x 27 mm or 675 mm².

ĄĄ The battery life is expected to last approximately 15% longer over

earlier processor generations.

ĄĄ Industrial-grade temperature variants available. ĄĄ According to the demands in the embedded markets, these

processor families also offer long-term availability of 7 years.

Which form factor fits best?

The broad spectrum of possible applications calls for a corresponding array of dedicated OEM system designs. This is congatec’s strongest value proposition, offering OEMs every advantage in simplifying the use of new Intel® Atom™, Celeron® and Pentium® processor technology – from six different standard form factors on boards and modules, to original design and manufacturing (ODM) services for PCBs and OEM system designs.

Mini ITX and Pico ITX With Mini ITX and Pico ITX boards, engineers have a range of attractive options – including long-term available, industrial-grade motherboards and single board computers that fit perfectly into any standard system design that doesn’t require a dedicated PCB for a customized feature set. These boards are application-ready for immediate use, however if you are facing any BSP or driver challenges, congatec’s personal support is there to help. IoT engineers can also capitalize on the support of SIM cards offered by congatec’s Mini ITX motherboards. The Pico-ITX option offers excellent flexibility with a wide range of interfaces in a very small footprint.

Computer-on-Modules For applications that require a dedicated carrier board for customized interfaces, engineers can choose a preferred module from congatec’s broad portfolio of COM Express, Qseven and SMARC 2.0 Computer-on-Modules. Optionally, congatec also provides dedicated carrier board designs for these modules. congatec is open to any type of design cooperation, and engineers are completely free to decide whether carrier board design is the OEM’s core competence or whether resources are better used by outsourcing.

embedded-computing.com/p374035

congatec



www.congatec.us

48



sales-us@congatec.com www.linkedin.com/company/congatec-ag

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 858-457-2600 twitter.com/congatecAG



www.embedded-computing.com

Subrack InterProtect® – Maximum protection up to IP66

FEATURES

Intermas develops electronic enclosure systems:

ĄĄ InterProtect® – protection up to IP66 by ingenious and unique construc-

Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

ĄĄ InterProtect® is well suited for tough environments such as tropical

tion with sealing that strictly complies to all 19 inch system dimensions.

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years of experience.

ĄĄ ĄĄ ĄĄ ĄĄ

embedded-computing.com/p374031 ĄĄ

regions where humidity gets up to 100% or in deserts with sandstorms.

For use in railways, defense, and naval applications as well as all other applications requiring special protection of electronics.

Robust shock and vibration resistance in accordance with railway and military standards up to 20g/200 ms.

Heat generation can be dissipated through integrated heat sinks in the top and bottom modules.

Standard subrack has an overall depth of 295.4 mm and is designed for PCB depths 160, 220 and 240 mm and typical 19 inch width (84 HP).

Special widths can be produced easily.

Subrack is hermetically sealed with a special conductive silicone sealing.

Therefore, an optimal EMV/ESD-protection is provided.

Go to

www.Intermas-US.com for our new catalog.

InterShell IP – Maximum protection for your electronics with IP65 enclosure

FEATURES

With the InterShell IP, Intermas expands its small casing series for euroboard formats and customer-specific electronics applications.

The casing is not only suited as tabletop housing for measuring and testing devices or as small casing for other applications. Also, the robustness and tightness serves as a perfect solution for portable outdoor applications. The design with specific conductible silicone sealings ensures an optimal EMV-protection.

Both types are available in the nominal depths of 150, 200 and 250 mm. In addition to optimal functionality, the development of the casings was done by giving highest importance to a cost-efficient design with a maximum degree of flexibility. The sophisticated basic structure consists of an aluminum extruded sheath which is used in type 1 as upper- and lower-part respectfully in type 2 (3U, 42HP) as side panel. By using plugged-in side panels as top/bottom cover plates, the standard dimensions of the casing can easily and economically be adapted to customer-specific dimensions.

Intermas US, LLC

www.Intermas-US.com www.embedded-computing.com

ĄĄ InterShell IP is a new aluminum housing enclosure with ingress

protection up to IP65.

ĄĄ Small case series for euroboard formats and customer-specific

electronics applications.

ĄĄ Robustness and tightness serves as a perfect solution for portable

outdoor applications.

ĄĄ Well suited as tabletop housing for measuring- and testing devices or

other applications.

ĄĄ Designed with specific conductible silicone sealings ensures an optimal

EMV-protection.

ĄĄ Color options are unlimited and customer-specific print is possible. ĄĄ Multiple accessories like handles, wall-or bottom-fastening angles,

and stands with or without tip-up hinged feet are available.

ĄĄ InterShell IP is available in two standard dimensions (h/w/d) as well

as customized formats: • 81.8 H x 145 W x D [mm] • 145 H x 229.2 W x D [mm] (3U, 42HP) • Nominal depths (D) of 150, 200, and 250 mm

embedded-computing.com/p374031  intermas@intermas-us.com  1-800-811-0236

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XEM7305 The XEM7305 is a compact, lightweight, low-power, costoptimized FPGA integration module featuring the Xilinx Spartan-7 FPGA, 512 MiByte DDR3, and SuperSpeed USB 3.0 interface with Opal Kelly’s FrontPanel SDK. With ample logic resources, 108 user I/O, and two 80-pin Samtec connectors for high-performance peripheral connectivity, this module is well-suited to applications such as data acquisition, machine vision, industrial control, and custom test equipment.

Celebrating over 10 years of USB FPGA connectivity, Opal Kelly’s Front-Panel SDK fully supports the XEM7305 for real-world transfer rates in excess of 340 MiB/s. FrontPanel includes a multi-platform (Windows, Mac, Linux) API, binary firmware for the on-board Cypress FX3 USB controller, and atomic HDL modules to integrate into your design. FrontPanel is the industry’s most full-featured, high performance, turnkey solution for professional grade USB connectivity.

Opal Kelly Incorporated www.opalkelly.com



FEATURES ĄĄ Xilinx Spartan-7 (A50 density) ĄĄ 512 MiByte DDR3 SDRAM, 16-MiB serial flash ĄĄ 108 user I/O including 3 MRCC and 1 XADC pair ĄĄ Self-powered by external DC source ĄĄ Low-jitter 200 MHz clock oscillator ĄĄ Two 80-pin 0.8mm Samtec board-to-board connectors (BSE-040) ĄĄ Small form-factor (smaller than a credit card) at

64mm x 42mm x 6.15mm (2.52" x 1.65" x 0.24") ĄĄ Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java embedded-computing.com/p374787

sales@opalkelly.com

 217-391-3724

 www.linkedin.com/company/opal-kelly-incorporated

 @opalkelly Industrial

XEM7310 Reduce time and effort on product development by integrating the XEM7310 into your next design. A production-ready module with a highly-capable Xilinx Artix-7 FPGA, 1 GiByte DDR3 SDRAM, and SuperSpeed USB3.0 host interface utilizing Opal Kelly’s FrontPanel SDK, the XEM7310 offers a small form factor for easy integration with your product. With ample logic resources, 126 user I/O, and two 80-pin Samtec connectors for high-performance peripheral connectivity, this module is well-suited to applications including ASIC/hardware-based simulation and verification, image capture and processing, cryptography, data security, and bioinformatics.

Celebrating over 10 years of USB FPGA connectivity, Opal Kelly’s Front-Panel SDK fully supports the XEM7310 for real-world transfer rates in excess of 340 MiB/s. FrontPanel includes a multi-platform (Windows, Mac, Linux) API, binary firmware for the on-board Cypress FX3 USB controller, and atomic HDL modules to integrate into your design. FrontPanel is the industry’s most full-featured, highperformance, turnkey solution for professional grade USB connectivity.

Opal Kelly Incorporated www.opalkelly.com

50



FEATURES ĄĄ Xilinx Artix-7 (A75 and A200 densities available) ĄĄ 1-GiByte DDR3 SDRAM, 2x 16-MiB serial flash ĄĄ 126 user I/O including 4 MRCC pairs, 4 SRCC pairs, and 1 XADC pair ĄĄ Self-powered by external DC source ĄĄ Low-jitter 200 MHz clock oscillator ĄĄ Two 80-pin 0.8mm Samtec board-to-board connectors (BSE-040) ĄĄ Small form-factor (smaller than a credit card) at 75mm x 50mm x

15.8mm (2.95" x 1.97" x 0.62") ĄĄ Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java

sales@opalkelly.com

embedded-computing.com/p374291

 217-391-3724

 www.linkedin.com/company/opal-kelly-incorporated

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @opalkelly

www.embedded-computing.com

XEM7360 The XEM7360 Kintex-7 based FPGA module offers a turnkey SuperSpeed USB 3.0 host interface using Opal Kelly's FrontPanel SDK. System integrators can build fully-operational prototype and production designs quickly by integrating this device into their product. Manufacturers of high-speed devices such as JESD-204B data acquisition devices can launch fully-functional evaluation systems without the costly design and maintenance of an evaluation platform.

With ample logic resources, the Kintex-7 is well-suited to signal processing, image processing, and other logic-heavy acceleration tasks.

Memory-hungry applications enjoy access to 2 GiB of on-board DDR3 memory with a 32-bit wide data bus.

Celebrating over 10 years of USB FPGA connectivity, Opal Kelly’s FrontPanel SDK fully supports the XEM7360 for real-world transfer rates in excess of 340 MiB/s. FrontPanel includes a multi-platform (Windows, Mac, Linux) API, binary firmware for the on-board Cypress FX3 USB controller, and atomic HDL modules to integrate into your design. FrontPanel is the industry's most full-featured, high-performance, turnkey solution for professional grade USB connectivity.

Opal Kelly Incorporated



FEATURES ĄĄ Xilinx Kintex-7 XC7K160T or XC7K410T ĄĄ 2 GiB DDR3, 2x 16 MiB serial flash ĄĄ Two Samtec QSH-090 expansion connectors ĄĄ Up to 193 user I/O + 8 Gigabit Transceivers ĄĄ Low-jitter 200 MHz and 100 MHz clock oscillators ĄĄ Integrated voltage, current, and temperature monitoring ĄĄ Small form-factor: 100mm x 70mm x 19.65mm embedded-computing.com/p373664

sales@opalkelly.com

 217-391-3724

 www.linkedin.com/company/opal-kelly-incorporated

www.opalkelly.com

 @opalkelly Industrial

TS-7553-V2 Industrial IoT Gateway This versatile embedded single board computer hits on all the main points for a low power, cost effective, Internet-of-Things (IoT) capable, and ready-to-deploy OEM board with an emphasis on data integrity.

Not only does the TS-7553-V2 have flexible connectivity options like cellular modem, XBee, WiFi, and Bluetooth, it also has eMMC flash configurable as pSLC or MLC and on-board power reserve via optional TS-SILO technology. The TS-SILO option provides up to 30 seconds of backup power when the power goes out, ensuring opportunity to run your shutdown scripts to avoid data corruption. The eMMC flash configured in a pseudo-SLC mode provides maximum flash data storage reliability.

Each component on the TS-7800-V2 has been carefully chosen to ensure reliable operation in the field. Data is reliably stored in the onboard eMMC flash, configurable as pSLC for further reliability or MLC for more capacity. The fanless design of the TS-7800-V2 paired with the low cost enclosure is able to withstand high vibration, high debris, and a wide temperature range of -40 °C to 85 °C.

Technologic Systems

www.embeddedARM.com www.embedded-computing.com



FEATURES ĄĄ

NXP i.MX6UL 528MHz or 696MHz ARM Cortex-A7 CPU

ĄĄ

512 MB DDR3 RAM

ĄĄ

4 GB MLC eMMC Flash

ĄĄ

Wireless and Bluetooth Module

ĄĄ

XBee Interface (can support NimbeLink cell modem and XBee)

ĄĄ

RS-485, RS-232 and CAN Interfaces

sales@embeddedARM.com

 www.linkedin.com/company/556283/

embedded-computing.com/p374424

 480-837-5200 @ts_embedded



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Embedded Computing Design Resource Guide

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Embedded Computing Design Resource Guide

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A FINE TECHNOLOGY GROUP

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

FEATURES ĄĄ

Made in the USA

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor.

Embedded power supplies are available up to 1,200 watts.

ĄĄ

Most rack accessories ship from stock

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

ĄĄ

Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ

System monitoring option (CMM)

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

ĄĄ

AC or DC power input

ĄĄ

Power options up to 1,200 watts

ĄĄ

Modified ‘standards’ and customization are our specialty

For more detailed product information,

VISIT OUR NEW WEBSITE!

please visit www.vectorelect.com

WWW.VECTORELECT.COM

or call 1-800-423-5659 and discuss your application with a Vector representative.

Made in the USA Since 1947

embedded-computing.com/p371649

Vector Electronics & Technology, Inc. www.vectorelect.com

52

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 inquire@vectorelect.com  800-423-5659

www.embedded-computing.com

MSC SM2S-IMX8M MSC SM2S-IMX8M module with NXP™ i.MX8M ARM® Cortex™-A53 The new MSC SM2S-IMX8M module features NXP’s i.MX8M processors offering dual- and quad-core ARM Cortex-A53 compute performance at low power consumption and excellent graphics performance combined with a high degree of functional integration.

Built with best in class audio, voice and video processing

FEATURES ĄĄ

sors is ideally suited for Media IOT and industrial applica-

Dual or Quad core NXP i.MX8M ARM Cortex-A53 Applications Processor up to 1.5GHz

ĄĄ

ARM Cortex-M4 Real Time Processor at 266MHz

tions such as Video, Voice and Audio for Connected Devices,

ĄĄ

Vivante GC7000Lite 3D Graphics Processor

Smart Home as well as HMI, Voice and Vision for harsh

ĄĄ

4Kp60 HEVC/H.265, H.264 and VP9 Video Codec (not supported by 8MQuadLite)

ĄĄ

Up to 4GB LPDDR4 SDRAM

technology, the NXP i.MX8M Family of Applications Proces-

environments.

MSC SM2S-IMX8M offers dual-core or quad-core ARM

ĄĄ

Cortex-A53 processors in combination with ARM Cortex-M4

Up to 64GB eMMC Flash

ĄĄ

real time processor and Vivante GC7000Lite 3D Graphics

Dual-channel LVDS / MIPI-DSI (optional)

ĄĄ

HDMI 2.0 / DisplayPort interface (optional)

GPU. It provides fast LPDDR4 memory, up to 64GB eMMC

ĄĄ

Dual Independent Display support

Flash memory, Gigabit Ethernet, PCI Express, USB 3.0, an

ĄĄ

Dual MIPI CSI-2 Camera Interface

on-board Wireless Module as well as an extensive set of

ĄĄ

2x PCI Express x1 Gen. 2

interfaces for embedded applications.

ĄĄ

2x USB 3.0 Host interface

The module is compliant with the new SMARC™ 2.0 stan-

ĄĄ

2x USB 2.0 Host interface

ĄĄ

1x USB 2.0 Host/Device interface

ĄĄ

Gigabit Ethernet

ĄĄ

Wireless Module (optional)

ĄĄ

2x CAN interface (optional)

ĄĄ

I2S Audio, UART, SPI, I2C

dard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX8M module, MSC provides a development platform and a starter kit. Support for Linux is available (Android support on request).

www.msc-technologies.eu/products-solutions/products/boards/smarc/msc-sm2s-imx8m.html embedded-computing.com/p374633

Avnet Inc.

www.msc-technologies.eu www.embedded-computing.com





info@avnet-integrated.eu www.linkedin.com/company/avnet/

 +49 7249 910 0 twitter.com/Avnet



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Embedded Computing Design Resource Guide

IoT

Embedded Computing Design Resource Guide

IoT

RE1401 NUC RUGGED EMBEDDED COMPUTER Crystal Group’s RE1401 Rugged NUC (Next Unit of Computing) brings desktop performance and military-grade durability to an ultra-compact device weighing only 2 lbs. With flexibility to scale up based on productivity needs, the RE1401 is a perfect fit for IoT applications – especially in mobile environments. The RE1401 NUC is optimized for applications where a traditional desktop would not fit or survive, and to allow for maximum integration flexibility.

Based on Intel’s 5th or 6th gen i5/i7 motherboards and boasts a rugged, all-aluminum chassis. The system utilizes standard USB 2.0 and 3.0 ports, a 3.5mm headset jack, one or two mini-display ports and HDMI 2.0 or mini HDMI. Compatible with Windows® 7/8.1/10, Server 2012 R2®, Ubuntu®, Fedora®, and Open SUSE®.

FEATURES ĄĄ

Compact aluminum construction – 4.8" x 6.3" x 1.9"

ĄĄ

Ultra-lightweight – 2.0 lbs.

ĄĄ

Billet construction from milled and strain hardened 6061T651 structural aircraft aluminum

ĄĄ

Tabletop or tray mounting

ĄĄ

5th or 6th Generation Core i5®/i7® CPU options

ĄĄ

Single removable SSD and single fixed SSD, removable SD card slot embedded-computing.com/p374779

Crystal Group, Inc.

www.crystalrugged.com



info@crystalrugged.com

 800-378-1636

 www.linkedin.com/company/crystal-group/

 @CrystalGroup

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Fast Track to Proof Your Sensor Concept in 30 Days

By Advantech A working sensor can take months, if not years, to develop. This white paper examines the critical design aspects of sensor development, including mechanical, algorithmic, RF technology, interface, and more. Learn how developers can get their design concepts on the fast track to proof and manufacture.

http://www.embedded-computing.com/ white-paper-library/fast-track-to-proof-your-sensor-concept-in-30-day

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Check out our white papers at www.embedded-computing.com/ white-paper-library www.embedded-computing.com

MSC C7B-DV COM Express™ Type 7 Module with Intel Atom™ C3000 Series Server Processors ®

The MSC C7B-DV COM Express™ Type 7 module is equipped with the powerful new Intel® Atom™ C3000 series server processors (formerly called Denverton) and is especially designed for applications where large amounts of data are processed and transferred with high bandwidths.

Such applications include edge servers, content servers, autonomous driving, Wi-Fi routers in public transportation and image or video processing systems in industry and healthcare. For use in harsh environmental conditions, individual modules are also specified for the industrial temperature range from -40°C to +85°C. Certain variants of the computeron-module will be available for at least fifteen years from product launch.

The products are designed according to the COM Express Type 7 specification which allows up to four extremely fast 10Gb Ethernet interfaces.

The modules can be equipped with seven different Intel® Atom™ server processors, offering broad scalability of between four and sixteen processor cores. Relatively inexpensive entry-level models are also available. Via two 260-pin SO-DIMM sockets, the module can be equipped with fast DDR4-2400 SDRAMs with a maximum capacity of 48 GB, optionally with Error Correction Code (ECC). The integrated Infineon Trusted Platform Module TPM 2.0 provides additional security for critical network installations or protection against tampering and product piracy.

Up to five Ethernet interfaces, four with 10Gb and one with 1Gb transfer rate, provide highest network bandwidth. The up to 22 PCI Express™ (PCIe) lanes enable flexible system expansions and the connection of fast SSD memory. In addition, there are two SATA 6Gb/s interfaces, three USB 3.0/2.0 ports, eight USB 2.0 and two serial high-speed connections.

To evaluate the MSC C7B-DV family of server modules, MSC Technologies supplies a matching Type 7 ATX form factor carrier board and a comprehensive starter kit. In addition to numerous interfaces and PCIe slots, the carrier board can optionally be provided with a Board Management Controller (BMC) that supports out-of-band management.

FEATURES ĄĄ

Intel® Atom® C3958 16C, 20HSIO, 4x 10G, 31W TDP

ĄĄ

Intel® Atom® C3858 12C, 20HSIO, 4x 10G, 25W TDP

ĄĄ

Intel® Atom® C3758 8C, 20HSIO, 4x 10G, 25W TDP

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Intel® Atom® C3558 4C, 12HSIO, 2x 10G, 16W TDP

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Intel® Atom® C3538 4C, 12HSIO, 2x 10G, 15W TDP

ĄĄ

ĄĄ

Intel® Atom® C3808 12C, 20HSIO, 4x 10G, 24W TDP, ext. temp Intel® Atom® C3708 8C, 20HSIO, 4x 10G, 17W TDP, ext. temp

ĄĄ

Up to 48GB DDR4-2400 SDRAM (ECC optional)

ĄĄ

Up to four 10GbE and one 1GbE interfaces

ĄĄ

Up to 22 PCI Express™ lanes (with optional PCIe switch)

ĄĄ

Up to three USB 3.0 and four USB 2.0 interfaces

ĄĄ

Trusted Platform Module

ĄĄ

UEFI Firmware

ĄĄ

Extended temperature variants

www.msc-technologies.eu/products-solutions/products/boards/com-express-type-7/com-express-type-7-overview.html embedded-computing.com/p374632

Avnet Inc.

www.msc-technologies.eu www.embedded-computing.com





info@avnet-integrated.eu www.linkedin.com/company/avnet/

 +49 7249 910 0 twitter.com/Avnet



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Embedded Computing Design Resource Guide

Networking

Smart Solutions to Accelerate Design As technology has evolved, more and more devices demand intelligent systems. Microchip has been on the forefront of this evolution, providing you total system solutions for smart, connected and secure designs.

These designs can leverage everything from our smart processors, intelligent analog, certified wired and wireless connectivity and state-of-the-art security solutions along with ready-to-use software and tools, partnerships with the largest cloud computing companies and world-class support. This complete offering makes the development of smart, connected and secure systems easy, getting you to production faster and speeding up your revenue stream.

FEATURES ĄĄ

ĄĄ

ĄĄ

ĄĄ

ĄĄ

Easily find the right level of intelligence for your design with our broad portfolio of 8-, 16- and 32-bit MCUs, DSCs and MPUs Flexible peripherals and functions let you efficiently create differentiated designs that set you apart from your competition Accelerate design time with our intuitive development environments, complete reference designs, free software libraries and automatic code generation tools Adding connectivity is easy as our MCUs and MPUs are designed to be compatible with our wired and wireless devices Improve mobility, convenience and enhanced user experiences with wireless connectivity solutions

embedded-computing.com/p374755

Microchip Technology Inc. www.microchip.com/Smart

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Contact Microchip: www.microchip.com/distributors/SalesHome.aspx www.linkedin.com/company/microchip-technology



Embedded Computing Design RESOURCE GUIDE | Fall 2018

 480-792-7200

 @MicrochipTech

www.embedded-computing.com

RUGGED NETWORK SWITCHES Crystal Group rugged switches offer NIAP certified IP-security modules for network encryption. Based on the Ruckus ICX series, Crystal Group rugged switches provide scalable, edge switch technology with enterprise class functionality and mil-spec environmental performance.

All Crystal Group products are manufactured in NIST compliant U.S.-based facilities with end-to-end U.S. supply chain of custody. embedded-computing.com/p374766

Crystal Group, Inc.



www.crystalrugged.com

FEATURES Light weight construction from billet strain, hardened aluminum ĄĄ Easy mounting in EIA-310 19" rack, Delrin glides, or fixed mount ĄĄ 24 Copper, 48 Copper and 48 SFP port designs in 9.75" or 15.5" chassis ĄĄ Modular upgrade capability ĄĄ Layer 2+ and Layer 3 capable ĄĄ Designed for MIL-STD-461 EMC compliance ĄĄ

info@crystalrugged.com

 800-378-1636

 @CrystalGroup

 www.linkedin.com/company/crystal-group/

Security A complete end-to-end security solution for your entire device lifecycle

Secure by Design

Timesys TRST Product Protection Solutions Secure by design + Stay secure = Your best defense against security threats.

Timesys TRST (Threat Resistance Security Technology) Product Protection Solutions offer complete end-to-end embedded system security enabling you to bring more secure devices and other products to market faster.

Now you can address security early in the design of your products and more efficiently manage and maintain your device’s security posture throughout its lifecycle.

• Reduce time-to-market delays – Through our TRST Secure by Design services, security is baked in at the outset of your development, enabling you to cut the time, rework, and cost overruns that often come with deploying security too late in design.

• Minimize the chance of your software being compromised – Our TRST Stay Secure offering helps you to cut through the vulnerability storm and identify, analyze and respond to known security issues in the quickest time possible.

• Establish and maintain the strongest security posture for your embedded systems – Our Timesys TRST Product Protection Solutions are easily adaptable, so you can tailor a solution that best fits your customers’ unique security requirements. embedded-computing.com/p374781

Timesys

www.timesys.com www.embedded-computing.com



sales@timesys.com

Stay Secure

Secure Boot Data at rest security Data in motion security

Threat identified

Data in use security Software / OTA update

Product development

Product maintenance 2-10+ years

6-24 months

FEATURES

Threat mitigated

Release to market

ĄĄ Secure Boot/Chain of Trust – Establish software authenticity from the bootloader to user applications ĄĄ Device Encryption and Secure Key Storage – Protect IP and sensitive user information by encrypting data/software ĄĄ OTA Software Updates – Update/deploy software security, and deny unauthorized software installs ĄĄ Security Auditing and Device Hardening – Determine potential threats your system might encounter and what should be secured to reduce your product’s attack surface, decrease risk of compromise, and minimize breach impacts ĄĄ Security Vulnerability Monitoring and Notification – Eliminate the time spent monitoring CVEs, identifying vulnerabilities relative to your software, and assessing their risks ĄĄ Update/Patch Management – Selectively apply updates and security patches into your software, and remain in control of what gets updated ĄĄ BSP Lifecycle Maintenance – Cut long-term maintenance costs associated with keeping your product line updated and secure by up to 60%

 +1.866.392.4897

 www.linkedin.com/company/timesys-corporation/

ĄĄĄĄĄ www.youtube.com/timesys @timesys



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Processing: Other

World-Class Analog Solutions

FEATURES

Microchip’s success story wouldn’t be complete without including our analog solutions. Our history as a leading solution supplier providing comprehensive design support and a broad product portfolio doesn’t only include our microcontroller products.

We also offer high-performance, easy-to-implement linear, mixed-signal, power management, thermal and interface products. When combined, Microchip’s extensive portfolio can be used in numerous applications with various performance requirements.

You will have the power, flexibility and confidence to choose the right solution for your design, regardless of design constraints. Take advantage of our experience and complete system solutions to save time and simplify your design effort.

ĄĄ

ĄĄ

ĄĄ

Created with digital designers in mind, Microchip’s portfolios of mixed-signal, linear, interface and power products are designed to be easy to work with, regardless of experience Extensive analog portfolio offers solutions for any level of complexity Easily assemble all the components needed for your application with our wide variety of analog solutions which can be used alongside our microcontrollers, timers, connectivity devices and more.

embedded-computing.com/p374756

Microchip Technology Inc.

www.microchip.com/Real-Analog

58

Contact Microchip: www.microchip.com/distributors/SalesHome.aspx  480-792-7200 www.linkedin.com/company/microchip-technology @MicrochipTech



Embedded Computing Design RESOURCE GUIDE | Fall 2018



www.embedded-computing.com

wolfSSL Embedded TLS Library wolfSSL focuses on providing lightweight and embedded security

solutions with an emphasis on speed, size, portability, features and standards compliance. Dual-licensed to cater to a diversity of users ranging from hobbyists to the user with commercial needs, we are happy to help our customers and community in any way we can.

Our products are open-source, giving customers the freedom to look under the hood. Our wolfSSL embedded TLS library is the first commercial release of TLS 1.3 in the world. wolfSSL is the best-tested crypto, the #1 TLS in IoT and the first embedded TLS 1.3 implementation with TPM 2.0, MQTT, FIPS 140 certification and hardware crypto acceleration. All products are backed by 24/7 support.

wolfMQTT The wolfMQTT library is a client implementation of the MQTT protocol written in C for embedded use. It supports SSL/TLS via the wolfSSL library. It was built from the ground up to be multiplatform, space conscious and extensible. It supports all Packet Types, all Quality of Service (QoS) and supports SSL/TLS using the wolfSSL library. This implementation is based on the MQTT v3.1.1 specification and now also supports MQTT 5.0.

wolfSSH

wolfSSL TLS 1.3 wolfSSL is a lightweight SSL/TLS library written in ANSI C and targeted for embedded, RTOS and resource-constrained environments. It is commonly used in standard operating environments as well because of its royalty-free pricing and excellent crossplatform support. wolfSSL supports industry standards up to the current TLS 1.3 and DTLS 1.2 levels, is up to 20 times smaller than OpenSSL, and offers progressive ciphers such as ChaCha20, Curve25519, NTRU, Blake2b, and SHA-3 (Keccak). User benchmarking and feedback reports dramatically better performance when using wolfSSL over OpenSSL. DTLS 1.3 is in the works!

FEATURES ĄĄ

TLS versions 1.0, 1.1, 1.2, and 1.3 (client and server)

ĄĄ

DTLS 1.0, 1.2 support (client and server)

ĄĄ

The wolfSSH library is a lightweight SSHv2 client and server library written in ANSI C and targeted for embedded, RTOS, resourceconstrained and IoT environments. wolfSSH supports SCP and SFTP and can act as a server for copying files with SCP, or like a client or server for SFTP connections, giving you the ability to copy new firmware or configuration files to your embedded device with the ease of a file copy. wolfSSL supports the industry standard SSH v2 and offers progressive ciphers such as Poly1305, ChaCha20, NTRU, and SHA-3.

ĄĄ

wolfCrypt FIPS

ĄĄ

The wolfCrypt module is FIPS 140-2 Level 1 validated, with certificate #2425. Federal departments and agencies using cryptographic security systems to protect sensitive information are required to implement FIPS 140-2 cryptographic modules. The FIPS 140-2 standard specifies the security requirements for cryptographic modules.

wolfSSL INC

www.wolfssl.com www.embedded-computing.com



info@wolfSSL.com

Minimum footprint size of 20-100 kB, depending on build options and operating environment Runtime memory usage between 1-36 kB (depending on I/O buffer sizes, public key algorithm, and key size)

ĄĄ

OpenSSL compatibility layer

ĄĄ

TPM 2.0 & PKCS11

ĄĄ

OCSP, OCSP Stapling, and CRL support

ĄĄ

ĄĄ

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Hash Functions: MD2, MD4, MD5, SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, BLAKE2b, RIPEMD-160, Poly1305 Block, Stream, and Authenticated Ciphers: AES (CBC, CTR, GCM, CCM, GMAC, CMAC), Camellia, DES, 3DES, IDEA, ARC4, RABBIT, HC-128, ChaCha20 Public Key Algorithms: RSA, DSS, DH, EDH, ECDH-ECDSA, ECDHE-ECDSA, ECDH-RSA, ECDHE-RSA, NTRU Password-based Key Derivation: HMAC, PBKDF2, PKCS#5 embedded-computing.com/p374780

 www.linkedin.com/company/wolfssl/

 425-245-8247

 https://twitter.com/wolfSSL

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Embedded Computing Design Resource Guide

Security

RSS116 JBOD RUGGED STORAGE SYSTEM The Crystal Group RSS116 Rugged JBOD Storage System is the world’s first rugged FIPS 140-2 compliant, NIAP certified data-at-rest storage device.

Providing high storage capacity in a small package for harsh and scarcely maintained environments, the RSS116 has a 21" deep all-aluminum 1U chassis with up to 16x 3.2TB of high reliability SSD storage. Equipped with redundant power input, power supplies, and data paths for maximum reliability. embedded-computing.com/p374764

Crystal Group, Inc.

www.crystalrugged.com



FEATURES All aluminum construction – less than 20 lbs. ĄĄ Easily installed on Crystal glides or fixed mounted ĄĄ Rugged 1U, rack mounted 21" depth ĄĄ Versatility with sixteen (16) SSD media canister ĄĄ Options for front or rear I/O ĄĄ Redundant power input, power supplies, and data paths for maximum reliability ĄĄ Offers maximum airflow with five (5) high speed, high volume, low noise fans ĄĄ

info@crystalrugged.com

 800-378-1636

 @CrystalGroup

 www.linkedin.com/company/crystal-group/

Storage WILD Storage G2 for 6U OpenVPX – WB6SN0

Data Storage Solution Offers Highest Density When storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market. Available in 6U and 3U form factors, the WILD Data Storage Solution features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot: the MADE IN “Storage Canister” and the “Storage Carrier” that plugs into the VPX backU. S. A. plane and holds the disk canister.

Annapolis Micro Systems, Inc.

www.annapmicro.com/product-category/storage-boards/

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FEATURES ĄĄ 3U boards feature 16 TB storage depth and 5-7 GB/s bandwidth ĄĄ 6U boards feature 32 TB storage depth and 10-14 GB/s

bandwidth

ĄĄ Backplane I/O using PCIe or 40Gb Ethernet ĄĄ Scalable depth and bandwidth using multiple Storage Cards ĄĄ Hot swappable Canister with 10,000 insertion cycles & hot

swappable Carrier (exclusive to WILD EcoSystem)

ĄĄ 6U/3U OpenVPX (VITA 65) compliant, 1" VITA 48.1 spacing ĄĄ Air- or conduction-cooled ĄĄ Proactive thermal management embedded-computing.com/p372950

wfinfo@annapmicro.com  410-841-2514 

www.embedded-computing.com

®

Solid State Storage and Memory

Solid State Storage and Memory for Industrial IoT Virtium manufactures solid state storage and memory for the world’s top industrial embedded OEM customers. Our mission is to develop the most reliable storage and memory solutions with the greatest performance, consistency and longest product availability.

SSD Storage Includes: M.2, 2.5", 1.8", Slim SATA, mSATA, CFast, eUSB, Key, PATA CF and SD. Classes include: MLC (1X), iMLC (7X) and SLC (30X) – where X = number of entire drive-writes-per-day for the 3/5-year warranty period.

Industry Solutions include: Communications, Networking, Energy, Transportation, Industrial Automation, Medical, Smart Cities and Video/Signage.

All SSD’s include Virtium‘s Intelligent Storage Platform – which features:

Features • Broad product portfolio from latest technology to legacy designs • Twenty years refined U.S. production and 100% testing • A+ quality – backed by verified yield, on-time delivery and field-defects-per-million reports • Extreme durability, iTemp -40º to 85º C • Intelligent, secure IIoT edge storage solutions • Longest product life cycles with cross-reference support for end-of-life competitive products • Leading innovator in small-form-factor, high-capacity, high-density, high-reliability designs • Worldwide Sales, FAE support and industry distribution

vtView®: Monitor/maintain SSDs, estimate SSD life, predict maintenance, over-the-air updates, make SSD quals faster and easier – includes open source API. vtGuard®: Power-loss protection, power management and I-Temp support. vtSecure™: Military-grade secure erase, optional TCG Opal 2.0 for SATA and PCIe, and optional keypad or other authentication for external USB devices. vtEdge™: Data filtering, pruning, and analytics functions, road-map for PCIe, USB and Ethernet, and data storage optimization.

Memory Products Include: All DDR, DIMM, SODIMM, Mini-DIMM, Standard and VLP/ULP. Features server-grade, monolithic components, best-in-class designs, and conformal coating/under-filled heat sink options.

embedded-computing.com/p374789

Virtium

www.virtium.com www.embedded-computing.com





sales@virtium.com www.linkedin.com/company/virtium

 949-888-2444 @virtium



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Storage

SATA Module The Apacer 7-Pin SATA Disk Module is a super-mini industrial SSD module. It features Apacer’s MultiPowerPath technology, which supplies power to the host via a conventional cable or through a cable-less design using a pin7 or state-of-the-art 7+2 pin connector. With three different methods for supplying power, the SATA module offers developers maximum flexibility when it comes to board design. The device adopts the latest page mapping file translation layer, thermal throttling, and write protect function, making it a powerful yet compact storage solution.

Upon request, it can be equipped with Apacer’s CoreAnalyzer analysis software, allowing users to quantify the actual workload and accurately evaluate the life cycle of host applications.

FEATURES ĄĄ

Multi-PowerPath technology

ĄĄ

Hardware write protect (optional)

ĄĄ

Compliant with MIL-STD-810G

ĄĄ

Thermal throttling technology (optional)

ĄĄ

Global wear-leveling and block management

ĄĄ

Built-in ATA Secure Erase and S.M.A.R.T. functions

ĄĄ

CoreAnalyzer analysis software optimizes system operation embedded-computing.com/p372850

APACER

 408-518-8699

http://industrial.apacer.com/en-ww



ssdsales@apacerus.com

Storage

RSS116 JBOD RUGGED STORAGE SYSTEM The Crystal Group RSS116 Rugged JBOD Storage System is the world’s first rugged FIPS 140-2 compliant, NIAP certified data-at-rest storage device.

Providing high storage capacity in a small package for harsh and scarcely maintained environments, the RSS116 has a 21" deep all-aluminum 1U chassis with up to 16x 3.2TB of high reliability SSD storage. Equipped with redundant power input, power supplies, and data paths for maximum reliability. embedded-computing.com/p374764

Crystal Group, Inc.

www.crystalrugged.com

62





FEATURES All aluminum construction – less than 20 lbs. ĄĄ Easily installed on Crystal glides or fixed mounted ĄĄ Rugged 1U, rack mounted 21" depth ĄĄ Versatility with sixteen (16) SSD media canister ĄĄ Options for front or rear I/O ĄĄ Redundant power input, power supplies, and data paths for maximum reliability ĄĄ Offers maximum airflow with five (5) high speed, high volume, low noise fans ĄĄ

info@crystalrugged.com  800-378-1636 www.linkedin.com/company/crystal-group/

Embedded Computing Design RESOURCE GUIDE | Fall 2018

 @CrystalGroup

www.embedded-computing.com

RS9116 Connectivity Product Family Redpine Signals RS9116 family of SoCs and modules provides a comprehensive multi-protocol wireless connectivity solution including 802.11 a/b/g/n (2.4 GHz and 5 GHz), 802.11j, dual-mode Bluetooth® 5 and 802.15.4 (capable of running Thread or ZigBee®).

Solution Highlights:

FEATURES ĄĄ Compliant to single-spatial stream IEEE 802.11 a/b/g/n, 802.11j (hosted mode) with dual band (2.4 and 5 GHz) support and 20 MHz and 40 MHz channel bandwidths ĄĄ Hosted mode (n-LinkTM) and Embedded mode (WiSeConnectTM) support: Wi-Fi stack, TCP/IP Stack, IP module, Bluetooth stack and ZigBee PRO stack reside on host processor or RS9116 depending on mode ĄĄ High speed Wi-Fi (up to 100 Mbps) IEEE 802.11 a/b/g/n, 802.11j (hosted mode) with dual band (2.4 and 5 GHz) support ĄĄ High speed (up to 3 Mbps) dual-mode Bluetooth 5 with transmit power up to +20 dBm1 power and receive sensitivity as low as -104 dBm1 ĄĄ Support for IEEE 802.15.4, 2.4 GHz transmit power up to +20 dBm1 receive sensitivity of -102 dBm1 ĄĄ Ultra-low power wake-up receiver with secure wakeup pattern to prevent battery drain attack ĄĄ Support for Client mode, Access point mode, Wi-Fi Direct, Concurrent client

• Co-existence of multiple wireless protocols managed by an internal protocol arbitration manager • Ultra-low power consumption with multiple power modes to reduce the system energy consumption • Multiple levels of security including FIPS 140-2 and PUF (Physically Unclonable Function) to create a highly secure system • Fully integrated and wireless certified modules with multiple sizes as small as 4.63 mm x 7.90 mm • Multiple software architectures (hosted and embedded) and host interfaces (SDIO, USB, SPI, UART) for easy integration with different processor families and operating systems • Footprint compatible single band and dual band modules as well as hosted and embedded modules for easy migration within the product family • Leading edge RF performance providing long range and higher throughputs

Redpine Signals, Inc.

www.redpinesignals.com



embedded-computing.com/p374796

sales@redpinesignals.com

 redpine-signals

 +1-408-748-3385 @redpinenews



Wireless

RS14100 Wireless Secure MCU Redpine Signals RS14100 WiSeMCU™ family of SoCs and modules are the industry's first Wireless Secure MCU family with a comprehensive multi-protocol wireless sub-system, an integrated ultra-low-power microcontroller, advanced security, high performance mixed-signal peripherals and integrated power-management.

FEATURES

Solution Highlights:

ĄĄ ARM Cortex-M4 core with up to 180 MHz with integrated FPU, MPU and NVIC

• Efficient on-chip application processor based on ARM® Cortex®-M4F with up to 180 MHz performance, up to 4 MB dedicated flash • Co-existence of multiple wireless protocols including 802.11a/b/g/n (2.4 GHz and 5 GHz), dual-mode Bluetooth® 5 and 802.15.4 (capable of running Thread or ZigBee®) • Ultra-low power consumption with multiple power modes to reduce the system energy consumption • Multiple levels of security including PUF (Physically Unclonable Function), Crypto HW accelerators, Secure Bootloader and Secure Zone to create a highly secure system • Fully integrated and wireless certified modules with multiple sizes as small as 4.63 mm x 7.90 mm • Integrated networking and wireless stacks for ease of integration • Leading edge RF performance providing long range and higher throughputs • Unique peripherals like ULP sub-system, voice activity detection (VAD) and up to 8 capacitive touch sensor inputs

Redpine Signals, Inc.

www.redpinesignals.com

www.embedded-computing.com



ĄĄ Up to 4 MB integrated Quad-SPI flash with inline AES engine and XIP and up to 400 KB SRAM ĄĄ High speed Wi-Fi (up to 40 Mbps) IEEE 802.11 a/b/g/n, 802.11j with dual band (2.4 and 5 GHz) support ĄĄ High speed (up to 3 Mbps) dual-mode Bluetooth 5 with transmit power up to +20 dBm1 power and receive sensitivity as low as -104 dBm1 ĄĄ BT profile support1 for SPP, A2DP, AVRCP, HFP, PBAP, IAP, GAP, SDP, L2CAP, RFCOMM, GATT, IAP1, IAP2 ĄĄ Support for IEEE 802.15.4, 2.4 GHz transmit power up to +20 dBm1 and receive sensitivity of -102 dBm1 ĄĄ Supported profiles: Zigbee Light Link (ZLL), Home Automation (HA) and Smart Energy (SEP)

sales@redpinesignals.com

 redpine-signals

embedded-computing.com/p374618

 +1-408-748-3385 @redpinenews



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Wireless

Empowering the Connected World Boosting IoT Designs from Edge to Cloud ▪ Scalable module, IoT gateway, network appliance ▪ Energy-efficient embedded solution ▪ Industrial operating temperature ▪ Extended product longevity ▪ High reliability

Enable Your Design Today www.portwell.com info@portwell.com 1-877-278-8899

ISO 9001, ISO 13485, ISO 14001, TL 9000