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VO LU M E 11 • N U M BER 1 2015 RESOU RCE GU I DE
COLUMNS 4 Foreword Thinking
RESOURCE GUIDE 3 24 25 37 40 41 40 43 43
Five keys to securing the IIoT data pipe
By Brandon Lewis, Assistant Managing Editor
5 Industrial Insights
Industrial Internet of Things – How much will manufacturing devices be networked?
By Alex Hong, IHS
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COVER The 2015 Industrial Embedded Systems Resource Guide surveys industry as they power up the Industrial Internet. Find building blocks for your next Industrial Internet deployment, such as Critical Link’s MitySOM-5CSx Altera Cyclone V SoC-based SOM, in product profiles beginning on page 24. Image of Sheringham Shoal Offshore Wind Farm courtesy Harald Pettersen/Statoil.
2015 OpenSystems Media ® © 2015 Industrial Embedded Systems All registered brands and trademarks in Industrial Embedded Systems are property of their respective owners. ISSN: P rint 1932-2488 Online 1932-2496
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Industrial Embedded Systems
Human Interface Industrial Hardware Industrial Internet/IoT Industrial Software Industrial Storage Industrial Systems Sensors and Control Small Form Factor Modules
FEATURES
Industrial Internet
6
I ndustrial Internet Consortium: Purpose and membership By Stephen Mellor, Industrial Internet Consortium
8 1 2
The rise of Industrial/Enterprise IoT Interview with Steve Jennis, PrismTech
Protocol gateways make IoT efficient, accurate, and low cost By Cindy Hollenbeck, SoftPLC Corporation
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PROFILE INDEX
Sensors
1 6
Sensor processing platforms add performance, cut SWaP for the Industrial Internet Interview with Rubin Dhillon, GE Intelligent Platforms
Industrial Software
1 8
Safety-certified software shrinks to new lows on multicore SoCs By Brandon Lewis, Assistant Managing Editor
Industrial Hardware
22
Best practices in meeting oil and gas data acquisition needs By Maria Hansson, Kontron www.industrial-embedded.com
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PROFILE INDEX
Brandon Lewis, Assistant Managing Editor blewis@opensystemsmedia.com
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thinking
By Brandon Lewis, Assistant Managing Editor
Five keys to securing the IIoT data pipe Industry is realizing the missed opportunities that have resulted from squandered connections between machine data and analytics in those conventional configurations, and have begun pushing for designs that leverage the Internet and the cloud more heavily. Obviously, opening these networks to the broader Internet comes with inherent security risks, and further complicates the ongoing tradeoff developers must make between performance, reliability, and security. In response, companies are turning to the data distribution service (DDS), a middleware standard governed by the Object Management Group (OMG) that provides a scalable, secure data pipe for Industrial Internet systems. While the DDS standard itself was originally developed by Real-Time Innovations (RTI) and Thales Group in 2001 and approved by the OMG in 2003, vendors of the middleware recently realized the need for more comprehensive definitions of the security model and service plugin interface (SPI) architecture in the standard, and subsequently began work on the DDS Security Specification (DDS-SECURITY) in 2014. After successfully demonstrating interoperability of DDS-SECURITY at OMG meetings in March, David Barnett, VP of Products and Markets at RTI, agreed to walk me through the five key tenets of the spec: 1. Authentication – In the DDS-SECURITY spec, authentication is used to verify that every device or user participating in a distributed system is who he, she, or it attests to be. The DDS Authentication SPI provides faculties for performing mutual authentication between participants so that “shared secrets” can be established, and sets the table for Access Control. 2. Access Control – Access Control may be the most critical security component of Industrial Internet/IIoT systems, as it defines who can publish or subscribe to a certain type of data or metadata across a DDS network. DDS provides very fine-grained access control, and includes a “discovery” feature that enables applications to be written in such a way that when new sensors are added to a network they can automatically be identified without any additional coding required. The Access Control SPI also gives developers control over the kinds of data/metadata those applications have visibility into, which combined with discovery is key to building and deploying scalable distributed networks. 3. Cryptographic – The Cryptographic SPI, in other words encryption, ensures that data moving across DDS networks in private. However, unlike typical forms of encryption,
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“The flexibility of the DDS domain-specific modeling paradigm is one of the elements of the middleware that set it apart from other low-level messaging standards ...” the elegance of cryptography in DDS is that it allows developers to choose what data needs to be encrypted and what doesn’t. The ability to select only certain data for encryption is important for the resource and bandwidth constraints of industrial systems and networks. For those messages that are not encrypted, the DDS Security Specification also includes provisions for secure digital signatures so that senders can be authenticated without the overhead of encryption itself, which helps protect systems that may be vulnerable to spoofing or man-in-the-middle attacks. 4. Logging – Logging supports auditing of all security-related events on a distributed network. This gives administrators the ability to monitor any attempts to break into the system, including instances when the content of a message doesn’t match its signature, usually an evidence of a man-in-the-middle attack. 5. Tagging – Finally, tagging is a feature that allows developers to inject metadata into a message that designates the content’s security level. As an extension of access control, this makes it possible for sensor data from a wind turbine, for example, to be classified by “confidential” or “unrestricted” so that the appropriate data can be mad available only to specific participants in large distributed networks. RTI provides these DDS-SECURITY SPIs in their out-of-the-box Connext product that uses standard algorithms for encryption and public key infrastructure (PKI) for authentication, and also implements a plug-in approach for organizations that already have already policies and practices in place, or that need to meet the certification requirements of a particular industry. The flexibility of the DDS domain-specific modeling paradigm is one of the elements of the middleware that set it apart from other low-level messaging standards such as MQTT and CoAP, and a major enabler of the five keys to a secure IIoT data pipe. OMG members expect to approve the DDS-SECURITY specification by the end of the year. IES www.industrial-embedded.com
Industrial
Insights By Alex Hong, Analyst, Industrial Automation, IHS
Industrial Internet of Things – How much will manufacturing devices be networked? The concepts of Industry 4.0 proposed by Germany, the Smart Manufacturing Leadership Coalition in the United States, and Made in China 2025 and “Internet Plus” in China are national strategic initiatives to enhance the penetration of networks in the manufacturing industry. Although they have different names, the philosophy behind them is almost exactly the same – integrate networking technologies into manufacturing processes. Technologies and strategies that previously have not been associated with the manufacturing industry are now being advanced, such as customization, shortened delivery times, real-time data analysis, cybersecurity, Big Data, and so on. All of these concepts are part of the convergence of networking and manufacturing. This is what we call the Industrial Internet of Things (IIoT). The IIoT is changing manufacturing from an “old-fashioned” and “conservative” industry to one that is more interactive and in line with the consumer experience. However, the past few years have shown this process to be quite slow, as business owners have applied network technologies to their manufacturing centers cautiously to ensure minimal disruption of the manufacturing process. Even in the networked applications deployed today, proprietary network technology and traditional architectures as fieldbus remain the rule rather than the exception. A recent IHS report on the Internet of Things shows that while the manufacturing industry is currently comprised of an installed base of 23.8 billion industrial automation devices, networked applications are still not prevalent (Table 1). Currently, only 9.1 percent of discrete process and automation elements are connected to a network, which is below www.industrial-embedded.com
Installed Base – Consumer CPE Percent Connected Installed Base – Enterprise CPE Percent Connected Installed Base – Mobile Handsets Percent Connected Installed Base – Industrial Automation Percent Connected New Shipments – Industrial Automation Percent Connected
2013
2015
2019
CAGR ’13-’19
508,192
599,866
765,602
7.1
70.3
72.4
80.6
1,158,885
1,317,992
1,522,995
61.1
68.7
87.0
6,949,396
8,013,115
9,144,474
40.5
45.1
60.8
23,760,519
37,494,480
56,494,044
9.1
13.3
21.7
5,298,296
5,925,095
7,060,258
19.0
20.7
24.1
4.7 4.7 15.5 4.9
Table 1 | Currently only 9.1 percent of automation devices are networked, but deployments of Internet-enabled manufacturing devices will grow at a 24.1 percent CAGR through 2019. Source: IHS Technology.
average when compared to other sectors of the electronics industry, some of which approach nearly 50 percent connectivity (enterprise and consumer). In this regard, the potential for deploying networks in industrial automation environments is still large and unrealized. However, this situation is changing. Forecasts project that for new installations, the percentage of networkenabled industrial automation devices will far exceed the average for those already in operation, with the compound annual growth rate (CAGR) of such deployments increasing from 19.0 percent in the base year of 2013 to 24.1 percent in 2019 in Industry 4.0 and smart manufacturing environments. An example of this change is the increased use of Industrial Ethernet (IE) in programmable logic controllers (PLCs), which are a key component of automation systems. Over the last few years, embedded networking features have largely been restricted to mid- and large-sized PLCs, but recently more and
more compact PLCs are being integrated with IE technology as plant operators realize the importance of improving the productivity of their factories. This also illustrates the proliferation of networking technology at the control level of manufacturing centers rather than solely at a supervisory level in the monitoring office. With PLC and other connected applications gaining traction at the control level in manufacturing environments, networking technologies will subsequently see wider adoption in the world of industrial automation and control. This will lead to more open environments in the manufacturing center, and an opportunity to capitalize on the untapped potential of networking technologies for the IIoT. IES Alex Hong is Senior Analyst, Discrete Process and Automation in the Industrial and Medical Technology Group at IHS Technology. IHS Technology technology.ihs.com alex.hong@ihs.com
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Industrial Internet Industrial Internet Consortium: Purpose and membership By Stephen Mellor, Industrial Internet Consortium
industrial internet
This is the first of in a series of articles describing the Industrial Internet Consortium (IIC). The first entry
CONSORTIUM
describes the goals, membership, and a broad outline of its work. The Industrial Internet Consortium was founded on March 27, 2014 by AT&T, Cisco, GE, IBM and Intel. Its mission is “to accelerate growth of the Industrial Internet by coordinating ecosystem initiatives to connect and integrate objects with people, processes, and data using common architectures, interoperability, and open standards that lead to transformational business outcomes.” The rationale behind the Consortium is cooperation and collaboration. The founding companies discovered they had to solve similar technical problems with different partners repeatedly, with the danger that the problems would be solved in incompatible ways. Rework increases costs and the likelihood that similar technologies will be incompatible, even when developed by the same company. This was both ineffective and inefficient. To scale the Industrial Internet so it can be widely utilized and adopted, there must be an ecosystem to enable innovation across multiple companies and technologies. This innovation often springs from small companies who need partners. These companies can ill afford the time and money required to trek to every potential partner, open the doors, find the right people, establish relationships, and then commence lengthy negotiations. They’d go out of business. They need a forum to meet the right companies, and some templates for how to construct agreements that are beneficial to all parties.
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Moreover, the Industrial Internet is a “blue ocean” market, full of opportunity and bereft of competition. Why quibble over tidbits near the shore? Why not grow new markets in collaboration with partners, each taking a share of a larger pie in “coopetition”? As of May 1st, IIC membership totals 163 companies, representing public and private organizations across the world including large global leaders, startup companies, system integrators, research institutions, universities, government institutions, and market researchers. In Figure 1, the small slice includes founders and individuals. Many of the large companies, and certainly the founders, are global. They may have headquarters in the U.S., Japan, or South Korea, but their reach is worldwide (Figure 2). Nearly half the membership comprises small companies. This is a result of a deliberate decision to price small-company membership at an affordable level to encourage smaller companies to join and so support the goal of encouraging an ecosystem for innovation. Initiatives IIC Ecosystem The IIC has three main initiatives, as illustrated in Figure 3. The first element, the IIC Ecosystem, brings companies together to advance innovation, create ideas, insights, and best practices, and to provide thought leadership. The Industrial Internet has started to
Industrial Embedded Systems
Member Organizations
Nonprofit, 32
Large, 46
Small, 78
Figure 1 | The Industrial Internet Consortium is comprised of public and private entities, from startups to market leaders, from non-profit organizations to government institutions.
Member Organizations Australia, 1
Asia, 27 North America, 103 Europe, 30
South America, 2
Figure 2 | The Industrial Internet Consortium is a global organization that encourages innovation and ecosystem advancement by supporting smaller companies. www.industrial-embedded.com
transform the industry through new processes and connected products and services. One goal of the IIC is to create awareness of the innovation happening today, and to champion innovation in connected intelligent machines and processes to external audiences with a look at what is to come.
“... we can’t predict what it
The IIC Ecosystem Companies joining together to advance innovation, create ideas, insights and best practices, and to provide thought leadership
Technology & Security Provide interoperability, security and privacy by producing requirements for standards in open architectures
Testbeds Innovation to drive new products, processes, and services
will be a few decades from now, but we do know that to grow [the Industrial Internet] must have an open architecture that is secure and private, with interoperable parts.”
Sample Ecosystem activities include teaming with the World Economic Forum on its January 2015 report, “Industrial Internet of Things: Unleashing the Potential of Connected Products & Services” [1]; keynotes and talks at more than 20 conferences in North America, Europe, and Asia; published case studies from IIC members; opening a global digital conversation on specific IoT topics; and more. Technology & Security The second initiative is Technology and Security. This provides interoperability, security, and privacy by producing requirements for standards in open architectures. Note that the IIC produces requirements for standards, not the standards themselves. The IIC is not a standards organization. Rather, it hopes to use its depth (from applications to chips) and breadth (across much of the industrial space), and a spirit of collaboration and cooperation, to bring together and harmonize global standards activities to avoid market fragmentation and grow that market! www.industrial-embedded.com
Figure 3 | The three main initiatives of the Industrial Internet Consortium are identified as the IIC Ecosystem, Technology & Security, and Testbeds.
When Sir Tim Berners Lee invented the Universal Resource Locator he could not have imagined what the Internet would become over the next 30 years, and that innovation continues today. So it is with the Industrial Internet – we can’t predict what it will be a few decades from now, but we do know that to grow it must have an open architecture that is secure and private, with interoperable parts (or, in English, parts that work together). Testbeds The third and final initiative is Testbeds. We can write requirements, blog entries, standards, and presentations laden with bullets till the cows come home. But does it work? To find out, we have to build something and put it through its paces. The IIC facilitates Testbeds by bringing companies together to build these facilities. Then, by executing real code and moving real machinery, we can determine whether the architecture really is open, interoperable, secure, and private. And iterate. Testbeds require funding. So, in addition to bringing companies together to fund them, the IIC has several initiatives to build relationships with academia and global government agencies to build public-private initiatives. To learn more about the Industrial Internet Consortium or find out how to become a member, visit www.iiconsortium.org. IES References: [1] World Economic Forum. “Industrial Internet of Things: Unleashing the potential of connected products and services.” http://www.weforum.org/reports/industrial-internetthings-unleashing-potential-connected-products-and-services.
Stephen Mellor is Chief Technical Officer for the Industrial Internet Consortium.
Industrial Internet Consortium www.iiconsortium.org
@IIConsortium
www.linkedin.com/groups/Industrial-Internet-Consortium-5189581
www.facebook.com/IIConsortium
www.youtube.com/user/IIConsortium Industrial Embedded Systems
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Industrial Internet The rise of Industrial/Enterprise IoT Interview with Steve Jennis, PrismTech As the IoT hype peaks, the time has come for marketing to become implementation, for promise to become fulfillment. However, not all variants of the IoT are created equal, and this interview with Steve Jennis, Senior Vice President, PrismTech, reveals how the Industrial/Enterprise IoT differs from consumer-oriented versions of the IoT, as well as the requirement for an Industrial IoT data connectivity architecture and projections for when the major industry players will make the IIoT a reality for big business. What’s the difference between the IoT and the Industrial IoT? JENNIS: It’s a question of market segmentation and I think many people are still trying to work it out to be honest. Let’s start by looking at all the contributory parts. You’ve got the consumer world, the world of Adidas and Nike, where large manufacturers are selling connected products to the consumer. That’s one flavor of the IoT. Then you’ve got the home automation market with Google Nest and Apple and those guys, which is not quite the consumer market of Nike and Adidas because it’s really looking at establishing a foothold in the family home and selling all sorts of connected devices in a plugged-together systems environment. So it’s consumer, but it’s more systems-led than product-led. Then another flavor is what you might call the traditional M2M space, with applications like fleet management and vending machine monitoring that are more business than consumer, but are still what I’d call tactical rather than strategic – point solutions that are very often silos of data and lacking some of the vendor support or robustness that major enterprises are looking for.
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And then you’ve got the enterprise, and I include Industrial IoT in Enterprise IoT. As the operational technology (OT) and information technology (IT) worlds converge, they start to become indistinguishable from each other in the sense that enterprises want end-to-end systems, enterprise-wide data sharing, and to be able to extract new insights – or business value – from data wherever it makes sense, whether it’s at the system edge device, or in a gateway, or in the cloud, or even in an inter-company supply chain where you abstract above an individual enterprise. [The inter-company supply chain] is one of the thrusts of Germany’s Industry 4.0 initiative, where they’re not looking at just factory automation, but inter-factory automation – to integrate the supply chain from raw materials generation, whether in a mine or an oil refinery or any other raw material production, right through to the new connected car sitting in your driveway. So you’ve got what I call Enterprise IoT, and I think that’s a thrilling place to be right now for several reasons. Firstly, it’s clearly going to be the biggest market. Secondly, it’s also the most demanding market because of all the data sharing requirements for the optimization and coordination of edge devices – like the “brilliant machines” GE talks about that stream terabytes of data – as well as the analysis of Big Data in the cloud for trend analysis, preventative maintenance, or failure prediction, or locally for fine-tune control, fault analysis, etc. Whether the data delivery requirements are in microseconds, milliseconds, or seconds, the system has to cope. So there is lots of technical innovation and opportunity for new players. Thirdly, it is a “hot” market with lots of press coverage and investment activity. Enterprise IoT is also where IT and OT organizations have to interface. So it’s forcing the OT guys to get familiar with things like tablets and cloud services and using the Internet for communications rather than proprietary in-house LANs, and it’s forcing the IT guys to understand how their company actually makes money – what they make, how they make it, how they deliver it, what suppliers they have to work with to do that,
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and so on. The IT guys are coming out of their computer rooms and away from their Oracle databases and SAP configurations, and they’re having to get their shoes “dirty” on the shop floor. In summary, the consumer and tactical space is the IoT sandpit right now where people are checking out self-contained applications, seeing what pays off, what works, what makes money, and what doesn’t – toe-in-the-water stuff. But if we’re really going to move towards the digital enterprise, that requires much more than tactical IoT implementations or single-purpose consumer products. What’s required is an end-to-end strategy for the enterprise that makes data – whether it’s operational data or corporate data – available on demand for control and analysis and fine-tuning and insights and feedback and new services, wherever that value add needs to be. The big Enterprise IoT market is just over the horizon, but it will not take off until the trusted vendors to that enterprise market have viable IIoT solutions. How does DDS help facilitate the IT/OT integration? JENNIS: The way we look at it is that, inevitably, in any scenario, you’re going to have multiple protocols in your system. It’s never going to be a single-protocol solution in an enterprise environment. The reality is that most Enterprise IoT systems will have elements of brownfield or legacy subsystems, and you will have to extract data from or deliver data to those subsystems, which could be running on anything from a proprietary protocol to an out-dated standard, for example. So you have to have some way of bridging to and from those subsystems. That’s the first thing. You’ve got to have access to the data and be able to deliver, so you need good gateway technology. Secondly, for a corporate data connectivity platform you need to satisfy a number of requirements, so you’re going to have to have a high quality of service (QoS) data delivery backbone that is not in any way constraining the potential of the system. So it’s a bit like telecoms backhaul, where you have to be able to support a lot of calls and you don’t know what peak demand is going to be or what people are going www.industrial-embedded.com
to be streaming to their cell phones, but you’ve got to be able to deliver the data and you’ve got to be up and ready to do that 99.9999 percent of the time. Regardless of what the system needs, you’ve got to be able to deliver the data.
easily bridge to other protocols. What’s it going to be for the enterprise IoT? We think DDS has a great shot at being the protocol of choice because of its comprehensive QoS and proven capability in mission-critical systems.
So the data connectivity backbone protocol has to be able to do many things in terms of QoS over and above just moving data around. When you start looking at candidate protocols for this sort of enterprise-wide backbone, you start to discount many pretty quickly. Anything that’s proprietary is going to be out the window straight away because nobody today is going to tie their whole corporate infrastructure to one particular vendor. The days of being 100 percent single-vendor are gone – users want openness, they want standards, and they even want open source in some cases.
Already a lot of the lightweight protocols touted for the IoT today are showing their limitations – particularly for edge computing, where low-latency peer-to-peer interoperability is essential (in addition to device to cloud). There are a number of influential papers that have been published recently from experts in markets such as smart energy/smart grid that basically say DDS is essential because it’s the only protocol that has the suite of QoS required for a backbone data connectivity platform in critical systems.
So, you discount all the proprietary protocols – and that rules out a lot of the traditional industrial/OT protocols, by the way. Then you have to discount the lightweight protocols that don’t have the QoS for an enterprise backbone like MQTT or CoAP. These support very few QoS – MQTT supports three – and don’t support sophisticated data-centric features such as content-based filtering, traffic optimization for bandwidth constraints, dynamic discovery, and the many other QoS that are needed for the high performance, efficiency, fault tolerance, and reliable recovery required in an enterprise system; all the clever stuff that needs to be supported in a backbone so that you can manipulate the data in multiple dimensions – in terms of latency, in terms of determinism, in terms of routing, bandwidth efficiency, security, and so on. In addition, you need a protocol that can be implemented in resource-constrained edge devices, the cloud, and everything in between. So if you’re going to go with an enterprise strategy you need a backbone protocol that’s going to be able to support everything you need to do in the future, so you need to choose one that isn’t specific to a particular vertical market or a particular tactical application. You need an enterprise-grade data connectivity solution, and one that can
PrismTech’s Vortex platform utilizes the DDS protocol to provide 23 QoS that support it being used as an enterprise data connectivity platform. It also includes the Vortex Gateway, which utilizes Apache Camel bridging technology to provide support for integration of legacy or new subsystems into the Enterprise IoT environment, with specific connectors for DDS and over 80 other protocols. We’re not shy about telling people that they can choose any protocol they’d like, but to be aware that it might be the weakest link in their chain. If you have extremely high-performance hardware and software running at the edge and you’ve got unlimited, affordable resources in the cloud, you also need the right data-connectivity platform to make the best use of all that computing power or it could be like trying to drive a Ferrari down a road full of potholes; great data, but poor delivery infrastructure. It doesn’t really matter if you have “brilliant machines” at the edge and incredible Big Data analytics in the cloud if you can’t move the data in a reliable and timely way to take advantage of it in real time. You’d really be wasting a lot of your investment in the “Things” and the cloud services without the right dataconnectivity glue between them. A lot of the IoT buzz is about deviceto-cloud, but seems to ignore deviceto-device. Maybe this is because many vendors are selling cloud services, and
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Industrial Internet when you’re in the cloud everything at ground level only looks like a simple data source. But if you don’t really care about anything except what data goes up to the cloud then you’re missing a key price of the puzzle, for instance your requirements for edge computing are conveniently ignored. However, when you talk to forwardlooking enterprises or an advanced OEM, they need to do their computing wherever it generates value in the system. Not just in the device, not just in the cloud, but in the device, in the cloud, in the gateway, and anywhere between where new value can be generated. Anywhere that you can extract value from the data you need to be capable of control and/or analytics, and if you’re going to have an enterprise-wide strategy you need to have this distributed computing paradigm and you need to have the IoT tools and infrastructure to support it. That’s when experts arrive at DDS, because DDS, with its heritage as a real-time distributed computing protocol, handles really demanding performance at the edge as well as in the cloud.
DDS is a protocol that’s already cracked the problem at the edge and has now been extended to the cloud. It’s much easier to do that than to start in the cloud and then try to solve edge problems because you just don’t have the low-latency capability you require. If your protocol has been designed to support applications that have one-second updates, you’re a million times away from handling microsecond computing. But if you start at microseconds and crack that problem, doing one-second updates is easy. You just take a break. What we’re finding is that people look at a cloud-based approach, and that’s all well and good until they get out to the sharp end of the spear where you need to integrate machines that are operating in real time and require data analytics at the edge. People are getting to realize now that both are required: Cisco has recognized this with Fog Computing; Intel has recognized this with their background in industrial automation and realtime systems such as their Wind River franchise; and the IBMs and Microsofts are beginning to realize it as they begin to face IT/OT integration challenges. When are we going to see the Industrial/Enterprise IoT living up to all the hype? JENNIS: We have a strange situation today in that we have an extremely exciting market that everyone now pretty much agrees is going to be massive, but you don’t see the major players really coming in yet with full force. You might argue that IBM has had their Smarter Planet initiative around for several years, and that’s true, and there’s a lot of talk about the IoT from people like Cisco in terms of the Internet of Everything and Fog Computing. But I’m not aware that they have yet delivered complete Enterprise IoT solutions. And when you look at the traditional M2M vendors, whether you’re talking about Xively or SeeControl or Digi International or Eurotech, they’re all relatively small companies primarily focused on tactical applications. But I fully expect that in the next 12-18 months we’re going to see the big IT guys coming to market with much
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more complete platform solutions and really energize the enterprise space to move aggressively forward to exploit the IIoT. They are going to do very well in that market because, basically, very large organizations like to do business with very large organizations. You’re not going to provide a strategic IoT platform to a major global enterprise if you’re a smaller vendor. Most major enterprises will want to be partnered with an Intel or a Cisco or an IBM or a Microsoft for their IoT infrastructure. The same applies to many of the large OEMs (with maybe the obvious exception being GE, which is doing it all themselves at the moment and marketing the heck out of it and positioning themselves as the dominant player, but that doesn’t come free – they claim over 1,000 software engineers are working on Industrial Internet technologies and deployments[1]). The majority of large enterprises and OEMs are not going to build platforms themselves or go to smaller vendors, they’re going to turn around to their trusted large vendors and say, “you’re our enterprise platform provider, where’s your IIoT platform?” The big users and OEMs, the guys who spend seven or eight figures a year on their IT infrastructure and applications and knitting it all together, those with thousands of employees in hundreds of countries, they’re waiting for their major vendors to come to market with Enterprise IoT solutions, and I think 2015 is going to be the year that starts to happen. The big IT vendors will select and assemble the component parts into comprehensive IIoT platforms and get their acts together over the next year, and then you’re going to start seeing the fight over billions of IoT dollars globally. We’ll also see Asian and European players getting seriously into the game as well, such as some of the German OEMs who are as advanced as anyone in the IIoT market. So when the major vendors eventually come to market with their soup-to-nuts enterprise IoT platforms, with software functionality that does everything you need so you can just build your analytical apps, share data system-wide, and deploy within weeks – and, by the way, also interface with every other part of your enterprise so you can liberate data as and when you’re ready and manage security because you can partition the www.industrial-embedded.com
data – there will be all sorts of IIoT options available to you as an enterprise customer. And, at that point, enterprise executives will say, “If my vendor has this IIoT platform for me I better be doing something with it since the board of directors has asked for my plan to exploit the IoT in the last four board meetings.” IES References: [1] The Harvard Business Review. “HBR on GE’s Revolutionary Evolution.” https://www.gesoftware.com/blog/hbr-ge%E2%80%99s-revolutionary-evolution.
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Industrial Internet Protocol gateways make IoT efficient, accurate, and low cost By Cindy Hollenbeck, SoftPLC Corporation Having complete and current data about any process can result in better decision making. One of the primary benefits of the Internet of Things (IoT), sometimes called the Industrial Internet, is that companies can make improvements in production processes, end products, and logistics that reduce costs and energy usage. By capturing and centralizing information from all the pieces/parts of production and doing so in a timely, automatic, non-intrusive Image courtesy Siemens AG, Munich/Berlin.
manner, analytics programs can find places for these improvements. Whether it be a factory, a processing plant, or a remote stand-alone location such as a well site, a typical manufacturing operation contains a mixed bag of sensors, instruments, PLCs, drives, RFID/barcode readers, energy management systems, and other intelligent devices that don’t all communicate on the same network. Over time, sensors and automation are purchased from multiple OEMs, who in turn purchase equipment from multiple vendors, and these purchases occur at different points in time and stages in the development of automation technology. Companies merge and move equipment between plants, and upgrades to equipment are made at staggered intervals for many reasons including funding, scheduling downtime, changes to the end product, or breakdowns and obsolescence of parts. Additionally, more and more sensors are being added to equipment new and old so that more data can be gathered for analytics applications. For example, an
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engine oil sensor can provide information so that maintenance can be scheduled based on need and optimal performance instead of a “suggested maintenance interval.” Automation replaces manual processes to improve efficiency, and this allows more information to be easily tied into the data collection process. Does all this “stuff” just natively communicate to each other or in the same “ language?” Of course not! Different media (serial, Ethernet, wireless, and proprietary networks, for example) and even different protocols on the same media are common. Even as industrial control products have embraced open architectures and standards, there are still a lot of options available. Sensor and equipment vendors select which communication methods to support based on a variety of factors, including cost, complexity, and in some cases, a desire to protect intellectual property (IP). Different parts of the world embrace different standards. So how can a manufacturer who wants to optimize their process get the data from the machines to a central database most effectively? Gateways are the answer. A gateway, sometimes referred to as a protocol converter, is a device that can communicate on multiple networks, passing the information from one to another. Using a mix of gateways, it’s possible to connect all the diverse equipment in a facility to a common network, and from there to a data acquisition system and/or database. As shown in Figures 1, 2, and 5, gateways can transfer data over multiple communication media options. Gateways can be dedicated hardware, or the function can be embedded in the firmware or software of an intelligent device such as a programmable logic controller (PLC), human-machine interface (HMI), or computer. Examples are shown in Figure 2. Embedded into most gateway products are the hardware interface and low-level protocol details of their supported protocols. Configuring the gateway for a specific
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Figure 1 | Depicted here is a dedicated two-protocol hardwired gateway. 2a
WirelessHART
2b
application is normally accomplished through a simple mapping process, which identifies the source/target addresses for each protocol as well as network-specific information such as baud rates, node addresses, and so on.
2c
Gateway products that pass data from one communication protocol to another are available from dozens of vendors, and you can find a dual-protocol gateway to convert between almost any two protocols. Many PLCs today include both Ethernet and serial interfaces (and/ or support added protocols via communication modules), and thus could potentially be used for protocol gateway functions. Most modern HMI products have multiple ports (for example, serial, Ethernet, and USB) and support more than one driver simultaneously, and therefore can be used as a gateway for the most popular industrial protocols.
ModbusTCP
Figure 2a and 2b and 2c | Gateway functionality can embedded in hardware such as a dedicated WirelessHART to Modbus TCP gateway (Figure 2a), or implemented in the software or firmware of intelligent devices like a multi-protocol PLC that supports ASCII, remote I/O, and EtherNet/IP, and DeviceNet (Figure 2b), or HMI supporting Modbus, Modbus TCP, and a TCP/IEthernet/IP local area network (LAN) (Figure 2c). www.industrial-embedded.com
Figure 3 | SoftPLC Corporation’s Smart Gateway includes a 4-port managed Ethernet router and six serial ports that can be configured for protocols ranging from ASCII, Modbus/Modbus TCP, DFI, CAN/J1939, and others.
Some gateway products are even more flexible. They include a host of hardware interfaces with user-selectable I/O drivers so a single product can serve a wide variety of communication needs. One example is SoftPLC Corporation’s Smart Gateway, which has an embedded 4-port managed Ethernet router and six serial ports, each of which can be configured for different protocols such as ASCII, Modbus, DF1, CAN/ J1939, Modbus TCP, and many others (Figure 3). SoftPLC Gateways also provide hardware options to add support
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Industrial Internet for a wide variety of fieldbus networks (for example DH+, Profibus, DeviceNet) and remote access (for example wireless, cell modem). In fact, SoftPLC Gateways can support up to 16 networks simultaneously with no data limits. Appropriate use and selection of gateways provides connectivity to all devices, whether they are single sensors or controllers with thousands of data values. Gateways can make the IoT a practical reality. IES
Distributed assets data acquisition A company that provides chemicals used at oil well pumping sites was able to improve delivery logistics, which reduced their customer’s downtime while reducing fuel and labor costs. At each well site, level sensors were added to chemical tanks, and a gateway was used at each site to log the tank levels and send them over cellular/satellite connections to a virtual private network (VPN) in the cloud. A logistics application used this data to optimize truck driver routes. To reduce communication costs, where wells were clustered together, a local mesh network connected multiple sensor gateways to a master gateway, which connected to the Internet cloud (Figure 4).
Cindy Hollenbeck is Vice President of SoftPLC Corporation. For over 34 years she has been actively involved in PLC and industrial communications hardware and software specifications and marketing, with a career starting at Rockwell Automation and continuing as one of the founders of SoftPLC Corporation.
SoftPLC Corporation www.softplc.com info@softplc.com
Figure 4 | A mesh of gateways at multi-well cluster communicate with a master gateway that connects to the cloud via cellular network. Cloud data is then forwarded on to a logistics application at headquarters.
Multi-vendor automotive parts line An automotive manufacturer needed to upgrade an outer body parts stamping/forming machine due to new OSHA safety regulations and the desire to enhance performance. The original machine controls consisted of an Allen-Bradley PLC-5/80 connected via an obsolete Ethernet sidecar module to an obsolete Mitsubishi PLC Ethernet interface module. It was decided that replacing the PLC-5 was beyond the scope of this upgrade. The new design required the addition of a number of Siemens safety PLCs, providing a non-obsolete Ethernet connection to the Mitsubishi PLC and implementing a high-speed serial interface to an upgraded OmniLink press controller. To tie all the equipment together seamlessly at the high data transmission speed required, protocol gateways were required (Figure 5). Many of the gateway products evaluated supported only two protocols at a time, which would require multiple gateways on the machine. Instead, they used a single SoftPLC Smart Gateway, which provides the following in a single module: ›› Modbus TCP to/from the Mitsubishi PLC ›› Profibus to/from the Siemens safety PLCs ›› Modbus serial to/from the press controller for low-priority data ›› Custom serial protocol from the press controller for the high-speed data ›› Allen-Bradley remote I/O (RIO) slave to the PLC-5 ›› Modbus TCP to/from the HMI, which is tied into the plant manufacturing execution system (MES)
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Figure 5 | Gateway connections to stamping line equipment. www.industrial-embedded.com
#EmbeddedTechCon
TechCon
®
June 8-10, 2015 Moscone Center San Francisco, CA
Co-located with the Design Automation Conference Embedded TechCon®, designed to educate today’s design engineers in the most critical embedded products and technologies, will be held at the Moscone Center in San Francisco, Calif., on June 8-10, 2015. The live event extends OpenSystems Media’s current online educational program, Embedded University. The classes, which will be taught by leading industry experts, cover key embedded topics like IoT, automotive, and security, while drawing from the industry’s roots with sessions on firmware development, debugging, and open-source hardware and software.
Classes, speakers, schedules, and more at :
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Sensors Sensor processing platforms add performance, cut SWaP for the Industrial Internet Interview with Rubin Dhillon, GE Intelligent Platforms
As the Industrial Internet demands more out of resource-constrained industrial data acquisition systems, sensor processing platforms are required to add performance while reducing size, weight, and power (SWaP). Rubin Dhillon, Marketing Director of the Embedded Systems division at GE Intelligent Platforms discusses his company’s approach to developing “brilliant machines,” and how off-the-shelf hardware is enabling these sensor platforms for the Industrial Internet. For GE, where do sensors fit into the Industrial Internet? DHILLON: The fundamental building block of the Internet of Things (IoT)/Industrial Internet is, of course, the communications infrastructure. Attached to that are increasingly smart, brilliant machines with substantial data acquisition, processing, and storage capability built into them. For the Industrial Internet and for the Connected Battlefield, those very smart machines need to be incredibly rugged, able to operate in the harshest, most challenging environments. Sensors are a critical element within the IoT, Industrial Internet, and Connected Battlefield because they acquire the data necessary to effect huge improvements in efficiency and reliability – with minimal human intervention. GE has a long history of dealing with sensor-acquired data through our work with the military – radar, sonar, video, and so on. We’re now finding that that expertise and experience plays out well in the Industrial Internet space. Given the resource constraints of industrial devices, what innovation is occurring at the sensor level to realize the full potential of the Industrial Internet? DHILLON: The key here is that the proliferation of sensors is producing a fire hose of data, and that situation is exacerbated by the resolution of the data that is being captured. Video sensors, for example, now commonly acquire and transmit high-definition data rather than standard definition, with huge implications for the numbers of pixels being captured, processed, transmitted, and stored. That in turn has huge implications for both processing power and network bandwidth. The trick, of course, is to be able to process that data in real time and extract only the meaningful data to deliver to the network. Here, GE believes that one answer is GPGPU technology – using the graphics processors designed for high-end video gaming and so on, and leveraging their hugely parallel architectures to process vast amounts of data at incredible speeds. We’re working closely with NVIDIA, and an outcome of that relationship has been products like the recently announced rugged mCOM10-K1, which is based on NVIDIA’s Tegra K1
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Industrial Embedded Systems
“... the proliferation of sensors is producing a fire hose of data, and that situation is exacerbated by the resolution of the data that is being captured.”
technology (Figure 1). That’s an incredibly appropriate solution for Industrial Internet applications. First, it’s based on the COM Express architecture, which means that it is very small and can be deployed in very tight spaces. Second, it delivers 326 GFLOPS of processing power. And third, it consumes less than 10 watts of power, meaning that it can be used in environments where power availability is at a premium. We’re also working very closely with AMD, as a result of which we’ve just announced the bCOM6-L1700 (Figure 2). That also is a COM Express architecture product, featuring AMD’s latest SoC technology, and, like the mCOM10-K1, it is small, rugged, and consumes minimal power.
Figure 1 | The mCOM10-K1 is a COM Express-based sensor processing platform that leverages the NVIDIA Tegra K1 SoC to deliver 326 GFLOPS of processing performance. www.industrial-embedded.com
the proven ability to find the signal in the noise. SmartSignal from GE is that proven solution, with over ten years of proven experience across a broad range of asset-intensive industries. What predictions do you have for the IoT? DHILLON: For many companies and organizations, the Industrial Internet is already a functioning reality – it’s real, it’s here, it’s today. Many people don’t realize how much progress it’s already made. There’s no doubt in our minds at GE that the Industrial Internet will become pervasive across all industries, and the day is not too far in the future when we’ll wonder how industry ever managed without it. IES Rubin Dhillon is Marketing Director, Embedded Systems at GE Intelligent Platforms. Figure 2 | The bCOM6L1700 is another rugged COM Express module, and is based on AMD R-series APUs for power-efficient sensor processing.
It’s going to be devices of that level of processing performance, ruggedness, size, and power consumption that we’ll see increasingly drive the Industrial Internet because of their ability to help make sense of the huge amounts of data that sensors are capable of collecting. What other trends do you see arising in Industrial Internet sensor networks, and how is GE addressing them? DHILLON: As I noted previously, if we’re to avoid dragging the communications network to a halt with the sheer burden of sensor-acquired data, that data needs to be processed locally in the machine attached to the network. That has important implications not just for processing power, but for size, weight, and power – so-called SWaP. That processing power has to be built into small spaces in harsh environments that are subject to extremes of temperature, shock, vibration, contaminant ingress, and so on. That means it also has to be rugged. That’s a real strength for GE. It’s what our customers know and value us for. The other key area where the Industrial Internet can make a real, valuable difference is in improving efficiency, asset utilization, reliability, and availability. It’s one thing to have all those machines generating huge amounts of sensor-derived data about themselves – but what to do with all that data? GE is investing hugely in software, especially the software that will drive the Industrial Internet by making everything hang together in a way that will deliver benefits to businesses. An example of that, and a rapidly growing business for GE, is our predictive analytics business. We at GE believe that the basis for real transformation here lies in the shift from reacting to equipment failures or current condition indicators to becoming truly predictive and proactive. Answers about the future health of equipment or locomotives or whatever are already there in data that is being collected from sensors onboard those platforms today. It’s a matter of leveraging an analytics solution with www.industrial-embedded.com
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E-CAST IoT and M2M safety and security Presented by Echelon, Freescale, GrammaTech, and RTI The proliferation of connected devices coupled with network infrastructure advances have ushered in a new era of communication and machine-to-machine (M2M) automation in all industries. These advances bring significant risk – attacks on systems have become “purpose-built” – targeting specific machines in order to access unauthorized information or cause system failures. IoT and M2M systems require a combination of silicon and software solutions designed to mitigate these purpose-built attacks. Join us as silicon and software security experts come together to discuss M2M and IoT security requirements and threat identification and mitigation options using silicon and/ or software approaches. October 21, 2015 GO TO E-CAST: ECAST.OPENSYSTEMSMEDIA.COM/549
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Industrial Software Safety-certified software shrinks to new lows on multicore SoCs By Brandon Lewis, Asst. Managing Editor Rather than the discrete, single-function platforms of the past, today’s industrial systems are built around multicore processors that are increasingly packing performance into compute equipment. Now, software developers are taking advantage of these multicore architectures with RTOS and hypervisor solutions that enable multifunction, safety-certifiable industrial systems that still retain their deterministic nature. Industrial systems aren’t what they used to be. Trends in mobile technology and touch screen GUIs inspired by the consumer market have steadily broken down traditional notions of the industrial embedded system, with new designs continually looking to exploit features and functionality rooted in the bring your own device (BYOD) and Industrial IoT (IIoT) movements. However, while following suit with macro trends in the electronics industry allows for differentiation in an otherwise sluggish industrial market, integrating new technologies into resource-constrained machines that have historically relied on closed control loops also invites a range of challenges for developers, principally in the areas of performance, security, and software footprint. But now, given consistent advances in multicore processor technology over the last decade, embedded software vendors are rolling out safety-certifiable solutions that promote platform differentiation and meet the requirements of demanding industrial settings. “Six or seven years ago it was all PowerPC, but what’s happened is that we’ve gone
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into a multicore world and you’ve started seeing ARM work it’s way into this market,” says Warren Kurisu, Director of Product Management, Runtime Solutions at Mentor Graphics (www.mentor.com). “We went from homogenous multicore to heterogeneous multicore, and now you’re starting to see soft-core FPGAs work into the multicore architectures. “With the convergence of heterogeneous SoC architectures, customers are asking how they can leverage heterogeneous systems architectures (HSAs) to enable differentiation and downstream CAPEX and OPEX,” Kurisu continues. “So, ‘How do we leverage multicore to get the power savings, reduced BOM costs, and all of that?’ With this comes a complex problem – how do I manage them across different cores, manage them across different channels, etc.? Our solution allows you to bring multiple different operating environments on a single architecture.” Kurisu refers to the company’s Mentor Embedded multi-platform solution, a software stack for the industrial automation market based on an IEC 61508-certifiable version of the Nucleus RTOS that includes multicore support, Mentor Embedded Linux with integrated industrial protocols, the Sourcery CodeBench and Analyzer, and Qt graphics, among other features (Figure 1). Yet, the key to this and other emerging industrial software products is advanced hypervisor technology, which facilitates the separation of critical functions and allows manufacturers to realize the benefits of consolidation on the factory floor. The safety-certified hypervisor As mentioned, hypervisors in today’s industrial automation devices are often used to separate an OS running safety- and mission-critical applications (such as motor control) on one processor core from an OS running another application (such as the user interface) on a different core. Thanks to the advent of multicore and hypervisor
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technology, these virtual machines (VMs) can operate nearly independently of each other as if they were the only OS or application running on a chip. Recently, however, traditional hypervisor models have begun to reveal performance and certification limitations for the developer of safety-critical systems. The reason for this is that typically when consolidating a system onto a single SoC platform, hypervisors share system resources wherein a memory scan is bitmapped from one OS to the other. While the performance bottleneck and complexity of this architecture is acceptable for certain applications, for others it is not, and this model also requires that custom drivers be developed for certain types of resource sharing (such as I/O devices, network connections, and file systems); each time a custom driver is developed for a particular system, or an OS or application is modified, these systems must be retested and recertified. To mitigate these development challenges for industrial embedded systems engineers, QNX Software Systems has announced the Hypervisor 1.0, an IEC 61508-compliant hypervisor that looks to eliminate the performance losses and certification headaches associated with custom drivers by circumventing them altogether. According to Chris Ault, Senior Product Manager at QNX (www.qnx.com), rather than utilizing low-level drivers, the type 1 hypervisor facilitates higher level commands between VMs so that certain system components can be shared between OSs while keeping them securely partitioned.
he continues (Figure 2). “Yes, the GPU and device driver need to be owned by the safety-critical OS, but we have tools in place so that the non-safety OS cannot impact the OS resources. “This is embedded virtualization versus IT virtualization because the real-time nature of access to the hardware is so important,” Ault says. “So rather than a broad suite of emulators or device drivers without traction in the field, we’re binding hardware to the VM and also leveraging assets that are already present in the OS to reduce testing when using these types of devices.” In addition, the QNX Hypervisor 1.0 includes support for QNX Neutrino and Linuxand Android-based OSs, and pairs especially well with those that support a built-in scheduler for adaptive partitioning, Ault says. Through adaptive partitions systems architects are able to specify the amount of resources that are made available for particular tasks, providing a mechanism by which safety-critical designers can manage platform resources without having to develop custom resource management schemes (Figure 3, page 20).
Figure 1 | The IEC 61508 SIL3-certifiable Mentor Embedded multi-platform solution provides support for both heterogeneous and homogeneous multicore SoCs, as well as integrated runtime tools that enable legacy code reuse.
“The job of the hypervisor is to run the image right after board startup, and there’s a flat text file that describes what machines need to be created, what memory ranges need to be applied to each VM, and so on,” says Ault. “Then each VM reads its own subconfiguration VM file and says what resources it needs. “On the surface this looks like what competitors are doing with a client/ server relationship, but instead of using a shared device driver, we’re marshalling the high-level commands from one VM to another so that the performance, simplicity of the device driver, and simplicity of the architecture are improved,” www.industrial-embedded.com
Figure 2 | They QNX Hypervisor 1.0 allows common resources and components to be shared across VMs while remaining securely partitioned and certified. Industrial Embedded Systems
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Industrial Software Multiple levels of criticality As use of the aforementioned technologies has enabled the development of higher end, more feature-rich industrial embedded systems, another software paradigm that has persisted for decades – the microkernel OS – is now being paired with multicore and virtualization to meet the needs of the broader industrial market. For devices in most automation and control environments where software footprint and resource constraints are top of mind, microkernel OSs are now being paired with fuller RTOS solutions to provide scalability across the full spectrum of industrial devices, from small sensor systems to full-blown, feature-rich designs. For instance, Wind River recently announced a microkernel profile for its VxWorks OS that eases certification efforts because of its small code base, and is an efficient option for both single-core systems or platforms built
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Figure 3 | Adaptive partitioning allows the OS to allocate system resources by function, ensuring that critical application consistently receive the processor bandwidth necessary to carry out specific tasks.
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and match depending on what kind of solution you’re working on.”
Figure 4 | The Wind River Microkernel Profile for VxWorks is an extremely small footprint (10 KB – 20 KB) OS for resource constrained systems.
on a big core/little core processor paradigm, says Prashant Dubal, Director of Product Management at Wind River (www.windriver.com).
Utilizing virtualization with VxWorks as previously mentioned also allows engineers to take advantage of time and space partitioning to reach IEC 61508 certification so that certified and uncertified applications can execute securely on the same system; one OS instance could be running uncertified Linux applications while another is certified up to safety integrity level (SIL) 3 to give developers maximum design flexibility.
Safety-certified software for advancing in the IIoT As features and connectivity are continually added to keep pace with the advances of the IIoT, the embedded industry must continue to innovate software that will serve as the basis of secure and efficient industrial devices. By taking advantage of the possibilities now afforded by multicore silicon, embedded software vendors are already laying that foundation for safety-critical systems. IES
“Where in the past you might use MCUs, today it has become plausible to apply multicore SoCs even in lower end devices,” Dubal says. “We are seeing a trend in the industrial market where they are moving from 16-bit MCUs to 32-bit MCUs, and also some processes that have an memory management unit (MMU). Part of the reason this is happening is consolidation and the price point of processors with an MMU, so things are evolving and people are trying to take advantage.”
“The other combination is that you could run two instances of VxWorks and do multiple criticialities,” Dubal says. “If you need certification, there’s a safety profile on top that enables quick certification to IEC 61508 for the microkernel, then the three play together to form a solution within the VxWorks family. To complete the spectrum, if you go to a very highend CPU, now you can take advantage of virtualization on VxWorks and run multiple OSs or instances of OSs on top of it. So you scale from a microkernel alone to a microkernel and VxWorks, then multiple instances of VxWorks. The beauty of all of these profiles is that they all work with each other, so you can mix www.industrial-embedded.com
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“Either you could run VxWorks in a multicore or unicore symmetric multiprocessing (SMP) situation, but then there’s also a small processor core where you can run a microkernel core,” he continues (Figure 4). “The two then work together, with the micokernel core running power management. It can go all the way down to 2 KB to do something very specific on a sensor, but normally it’s around 10 KB to 20 KB.
No one in embedded computing offers as many products and services as Elma. Our packaging, thermal and I/O interface expertise, plus years of expert embedded subsystem designs gives our customers a serious advantage. We are an extension of your team -- we fill in where you need us most, and we’re there every step of the way. Find out why Elma is truly Your Solution Partner.
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Industrial Hardware Best practices in meeting oil and gas data acquisition needs By Maria Hansson, Kontron Service providers must carefully evaluate available computing options to find the optimal intelligent system. Similar to other industrial markets, oil and gas operations are realizing the powerful results of harnessing data to improve processes, make moreinformed business decisions, and manage safety, maintenance, and costs. The information that can be collected and managed from the broad range of disparate sources is growing at such a fast pace, many service providers see the need to upgrade their data acquisition capabilities. With almost every aspect of industrial oil and gas operations being digitized, embedded computing solutions play a significant role in advancing and streamlining oil and gas data acquisition. Using the computing performance and features available in today’s systems enables offshore operations to keep pace in a world where data collection and analysis never stops. This industry calls for computing solutions to be “rugged by design,” comprised completely of components that have demonstrated reliability in order to meet mandated uptime goals, regardless of the environment. Previously, computing challenges were met with proprietary systems. Oil and gas service providers also struggled to compensate for systems that often lacked the level of ruggedized reliability essential for this harsh environment. Today, computing solutions manufacturers offer systems that promise to reduce both operating and maintenance costs, and deliver robust technologies that ensure long-term system performance. However, to find the right solution necessitates that important considerations, which can maximize and differentiate their offerings based on performance, value, and reliability, are taken into account. Oil and gas system developers are evaluating every aspect
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of system design and deployment where they must consider everything from manufacturer support, lead times, and features that maintain long-term system viability. Key trends affecting data acquisition technology Previously inaccessible and unconventional sources of oil and gas present a new set of challenges for offshore service companies. Computing solutions must step up to meet more demanding data acquisition requirements from emerging growth areas in challenging environments. These solutions must also provide the high-performance computing resources that ensure state-of-the-art connectivity for the complex labyrinth of exploration, equipment management, control, and analysis applications currently in operation. Therefore, it is wise to seek out decidedly experienced suppliers that have an understanding of the safety certifications and global support needs unique to offshore providers. Along with highly integrated computing solutions that can help streamline processes by delivering optimized performance and connectivity, these systems must also meet the growing dependency on automated applications that can remotely monitor an increasing variety of equipment deployed at drilling sites; data collection and analysis are crucial to a rig acting as a small, self-contained city that operates nonstop. There are also 24/7 uptime requirements to contend with. While avoiding downtime is an ongoing need in most embedded applications, it is critical to maintain maximum and sustained operations in offshore installations. Downtime due to system failure affects overall production, which can significantly impact costs that can run in the hundreds of thousands of dollars daily. Because offshore drill sites are inherently remote, they add to operational complexity and compound potential losses considering the extended time and resources that required to get a system up and running after failure. Consequently, data acquisition computing solutions must stand up to the rigors of shock and vibration, temperature, dust, and other environmental conditions common to offshore installations.
Industrial Embedded Systems
www.industrial-embedded.com
Best practices also must include a spectrum of design features such as delivering the highest mean time between failure (MTBF), experience with ruggedized enclosures, and thermal management, as well as worldwide technical support. Evaluating industrial computing systems Rugged performance: Oil and gas settings are unlike any other kind of work environment on earth. Attention to shock and vibration and atmospheric contaminants such as dust, water, and corrosion are vital concerns. Best practices in specifying data acquisition systems need to address these types of environmental demands with features and capabilities specifically tuned to oil and gas requirements, such as removable dust filters that eliminate the impact of dirt entering the system. Cable tie-downs and hold-down brackets for expansion cards brace computing systems against shock and vibration; shock-mounted drive bays add stiffness in the chassis design, protecting systems during transport and while operating on or near the source of heavy vibrations. When evaluating industrial computing systems, reliable extended life and guaranteed long-term availability of components must be supported for performance over continued offshore deployments. The most desirable systems are revision controlled for ease of in-field maintenance. For example, Kontron’s KISS Oil & Gas 2U, a rugged rackmount computer, is based on Kontron’s extensive experience delivering deployable computing solutions such as its KTQ77/Flex motherboard. Components are sourced consistently from the same manufacturer, maintaining performance and features even when there may be years between system deployments (Figure 1). Assembling compared to developing technology The quality and reliability of computing solutions are obviously a result of the components, materials, processes, and development expertise that go into the design and manufacture of the product. Many data acquisition suppliers www.industrial-embedded.com
assemble third-party components to build their products rather than actually owning the core computing technology. Developers of technology provide unique value for oil and gas operators, giving them more product life control and the ability to integrate the technologies necessary to minimize downtime. With an oil and gas system actually developed by the supplier, customers benefit from strategic partnerships that assure access to the latest processors, chipsets, and memory. Technology developers typically provide additional customization capabilities based on standards methodologies to enable faster and more cost-effective custom design options. Furthermore, developers are able to fully manage the bill of materials (BoMs), along with revision control and long-term availability so that performance and features can be controlled even over course of long durations between system deployments. Global technical support: The complexity of data acquisition may require extended service, training, and technical support to match uptime goals. Embedded computing suppliers must readily provide a global service organization to more easily facilitate local technical support, as well as more difficult maintenance or upgrades. Unfortunately, many of today’s oil and gas computing suppliers are either large firms with a single hub, or smaller regional firms without a global organization. Therefore, it should be an important criterion that system support is available in the region where the system is deployed. Enhancing productivity and growth potential: Providing the increased ability to collect and analyze data, new computing technology is enabling drilling in regions once considered undrillable. At the same time, oil exploration and extraction processes generate tremendous amounts of data. As new devices track a wider array of performance information related to reserves and equipment, industry analysts such as oilprice.com are predicting a doubling of oil and gas data within just two years[1].
Figure 1 | Kontron’s KISS Oil and Gas 2U rackmount server is optimized for high MTBF, and based on the Kontron KTQ77/Flex motherboard that integrates the 3rd Generation Intel Core processor. The data acquisition platform offers extended temperature and efficient cooling, as well as rugged by design features that enable it to be used in harsh offshore environments.
Managing such large amounts of data requires sourcing technologies already proven to handle the workload. These solutions must provide connectivity to the critical equipment at drilling sites across the globe, and enable remote access to data from the drill site. Used for applications such as gathering sensor data and the monitoring of an exhaustive variety of instrumentation, exploration, and wellhead equipment, these systems are expected to strengthen productivity. By connecting field staff with industry experts, oil producers can make better critical decisions based on easily accessible, real-time data. This ability to access real-time data increases safety operations, for example, by means of ultra-reliable sensors and monitors that are capable of shutting down systems at the first sign of trouble. The near future will see more sophisticated smart monitors, predicting failures and providing solutions that execute automatically in advance of p roblems. Data acquisition solutions are designed to help producers find and maintain new and untapped resources to realize anticipated growth potential. According to industry analyst oilprice. com, subsea technology developers forecast spending to increase as much as five times (to $130 billion annually) by 2020, where some of this budget will need to be made in data analytics and computing support[2]. Employing advanced data acquisition computing technology provides the data processing, storage, and connectivity to move massive amounts of data, for example, in high-definition seismic
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enable oil and gas service providers to achieve leadership by sourcing computing systems optimized for oil and gas environments.
Business intelligence from valuable data assets Oil producers are seeing the value of data collection and analysis gained from high-performance and robust technology solutions. Knowledgeable embedded computing providers can be indispensable engineering resources – from full control of the motherboard and technology revision control to enabling faster, longer, and more reliable data acquisition system deployments. These same suppliers can also lend a hand in maximizing essential operational uptime through global technical support teams. These important considerations also
References:
Oil and gas exploration and production has always been complex, but today’s competitive landscape dictates even greater attention to computing performance. By capturing sophisticated data for field use and analysis, selecting the right data acquisition system helps take advantage of the growing use of sensors and networks. Ultimately, more intelligent systems will make an important difference in oil production worldwide by connecting decision makers with critical data and improving the safety and productivity of drilling operations. IES [1] OilPrice.com. “The Most Lucrative Investment in American History.” http://oilprice.com/ Energy/Energy-General/5-Trends-that-are-Set-to-Transform-the-Energy-Sector.html
Maria Hansson works as a Product Manager for the Medical & Industrial Business Unit at Kontron. She holds a Master of Science in Engineering from Lund University, Sweden. Kontron www.kontron.com • maria.hansson@kontron.com @Kontron www.linkedin.com/company/164627 www.facebook.com/kontron https://plus.google.com/+kontron/posts
www.youtube.com/channel/UCXkp_1gJbG0Um1vzdowlqww
Human Interface
PPC-E4+ – ARM Panel PC Designed and Manufactured in the USA by EMAC, the PPC-E4+ is an ultra compact Embedded Panel PC that comes ready to run with EMAC OE Linux installed on Flash. The dimensions of the PPC-E4+ are 4.8" by 3.0", about the same as that of popular touch cell phones. The PPC-E4+ is small enough to fit in a 2U rack enclosure. Everything works out of the box, allowing you to concentrate on your application rather than building and configuring device drivers. EMAC can even be contracted to develop your application. Pricing starts at $375 for Qty 1.
FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
4.3" WQVGA 480 x 272 TFT LCD Analog Resistive Touchscreen ARM9 400Mhz Fanless Processor Up to 1 GB Flash & 256 MB RAM 10/100 Base-T Ethernet 3 RS232 & 1 RS232/422/485 Port 1 USB 2.0 (High Speed) Host port 1 USB 2.0 (High Speed) OTG port 2 Micro SD Flash Card Sockets SPI & I2C, 4 ADC, Audio Beeper Battery Backed Real Time Clock Operating Voltage: 5V DC or 8 to 35V DC Optional Power Over Ethernet (POE) Optional Audio with Line-in/out industrial.embedded-computing.com/p372771
EMAC, Inc.
www.emacinc.com/products/panel_pcs_and_lcds 24 / 2015 Resource Guide
Industrial Embedded Systems
info@emacinc.com
618-529-4525
www.linkedin.com/company/emac-inc-
www.industrial-embedded.com
CC10S Multi-display Controller Board MEN Micro now offers the robust CC10S, a multi-display controller board based on a Freescale ARM i.MX 6 Series processor. Providing full HD resolution to LCD TFT panel PCs from 7 to 15 inches, the CC10S combines powerful graphics and a compact form factor that make the board ideal for driver desk displays or in-seat infotainment in trains or public buses as well as for medical devices and HMIs in automotive applications. The CC10S module is widely scalable from low-end to high-end graphics requirements, depending on an application’s needs. Its Cortex-A9 architecture supports different types of the i.MX 6Solo, 6DualLite, 6Dual and 6Quad processor families. The board provides dual-channel LVDS with a maximum resolution of 1920 x 1200 pixels, regardless of whether the controller module employs a single-, dual-core or a quad-core processor. Onboard memory of up to 4 GB DDR3 SDRAM and a soldered eMMC provide ample storage for video data and Linux or VxWorks operating systems. Although it employs a compact design, the CC10S is a multi-stream-capable HD video engine that delivers up to 1080p60 decode, 1080p30 encode and 3D video playback in HD and enables the control of two independent screens. The CC10S offers a wide range of interfaces required for a typical panel PC, including one Gigabit Ethernet interface (1000BASE-T), two USB 2.0 ports, and two UARTs for flexible RS232, RS422 or RS485 configuration supporting up to 4 Mbit/s.
FEATURES ĄĄ For LCD TFT panels from 7" to 15", full HD ĄĄ Dual-channel LVDS or two single channels, with two independent screen ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
contents Freescale ARM i.MX 6 Series Multi-stream-capable HD video engine, OpenCL support Maximum resolution 1920 x 1200 pixels Up to 4 GB DDR3 SDRAM, eMMC multimedia card Ports: One Gigabit Ethernet, two USB 2.0, one UART-to-USB Two UART or CAN bus interfaces -40°C to +85°C operating temperature
industrial.embedded-computing.com/p372775
MEN Micro Inc.
Stephen.Cunha@menmicro.com
215-542-9575
www.linkedin.com/company/men-micro-inc- twitter.com/MENMicro
www.menmicro.com
Industrial Hardware
mPCIe-COM Family PCI Express Mini Cards ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource. Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits. The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.
FEATURES ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port serial communication cards with optional DB9M connectivity ĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port stored in EEPROM ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX and RX ĄĄ Port-by-port field selectable termination for RS-422/485 applications ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232 up to 921.6 kbps) ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supported ĄĄ RS-232 only and RS-422/485 versions available industrial.embedded-computing.com/p372691
ACCES I/O Products, Inc. www.accesio.com
www.industrial-embedded.com
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
1-858-550-9559 twitter.com/accesio
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mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming. The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out. The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.
FEATURES ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port mPCIe RS232 serial communication cards ĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation
port-to-port on ALL signals
ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each
TX and RX
ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication speeds up to 1 Mbps simultaneously ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ 9-bit data mode fully supported ĄĄ Supports CTS and RTS handshaking industrial.embedded-computing.com/p372557
ACCES I/O Products, Inc. www.accesio.com
contactus@accesio.com
linkedin.com/company/acces-i-o-products-inc.
1-858-550-9559 twitter.com/accesio
Industrial Hardware
PC5070 Acnodes announces the release of the PC5070, a compact multi-touch Panel PC. Based on the Intel Celeron N2807 1.58GHz Dual Core processor, this new industrial panel PC boasts a powerful 7-inch flat panel LCD that incorporates a 1024 x 600 resolutions, 500-nit high brightness, projected capacitive touch screen with multi-touch function. The PC5070 comes standard with one on board DDR3 SO-DIMM socket with 2GB system memory and one 30GB mSATA SSD along with dual Ethernet, two COM ports, two USB ports, and an audio (Line-out) port to accommodate a wide range of connectivity requirements. The PC5070 has built-in 802.11a/b/g/n/ac wireless LAN to facilitate access to wireless networks. Acnodes has also kept in mind the industrial aspect of the Panel PC. The PC5070 adopts a rugged IP65 rated front bezel and its touch screen monitor supports anti-scratch design that can resist up to 6H to ensure operation stability. This rugged panel computer has an operating temperature range of 32°F to 122°F (0°C to +50°C). Furthermore, this new panel pc system supports wide voltage power input from 9V to 30VDC, with external AC power adapter, to meet the requirements of unstable electricity environments. In addition to panel mounting, the PC5070 is available for wall, rack, stand and v-stand mounting. Flexible mounting options enable the PC5070 to smoothly blend into any working environment, ideal for small-size operator interface application, such as factory HMI, home automation terminal and digital signage.
FEATURES ĄĄ IP65 rated flat front bezel ĄĄ 7 inch 1024 x 600 TFT LCD monitor ĄĄ Projected capacitive multi-touch screen ĄĄ Celeron N2807 Dual Core 1.58GHz embedded computer ĄĄ 500-nits high brightness LCD panel ĄĄ -20ºC to 50ºC wide range working temperature ĄĄ 9~30V DC power input with external AC power adapter industrial.embedded-computing.com/p372765
Acnodes Corporation
www.acnodes.com/pc5070.htm 26 / 2015 Resource Guide
sales@acnodes.com
909-597-7588 twitter.com/acnodescorp
www.linkedin.com/company/acnodes-corporation
Industrial Embedded Systems
www.industrial-embedded.com
Ai-VM163S and Ai-VM111S 6U VME SBCs Aitech Defense Systems Inc. is bringing its expertise in rugged, high performance embedded boards and systems to the industrial market. The new industrial line-up includes two 6U VME SBCs, one based on the Intel Haswell processor and one that is Freescale QorIQ-based. Aitech’s new rugged, industrial SBCs offer a wide range of memory storage options and I/O, making them ideal for a variety of embedded commercial, industrial and Naval applications. Operating temperature for the boards is up to -20°C to +60°C. The Ai-VM163S, with an Intel 4th gen Core i7 quad core processor running at 2.4 GHz, is a high-performance board with 32 GB of onboard SATA flash to efficiently process video and graphics. Geared more for real-time control system applications, the Ai-VM111S incorporates Freescale’s newest QorlQ T4 quad core, dual-threaded, Altivec-enabled T4080 processer with a speed of up to 1.5 GHz. It includes 128 MB of NOR Flash for mass data and code storage operations. For higher reliability, the two boards each provide ECC-protected SDRAM memory and come with two standard mezzanine slots, one PMC and one XMC. The addition of these two mezzanine sites offers added design flexibility as well as onboard resources to ensure reliable, real-time operation. To support real-time process control, the boards also include eight counters/timers, a multi-function watchdog timer, temperature sensors and a real-time clock with on-board power back-up. Supported software for both includes VxWorks and Linux, with the Ai-VM163S supporting Windows and the Ai-VM111S supporting INTEGRITY, as well. The 6U VME SBCs are air-cooled per IEEE 1101.10-1996.
FEATURES Ai-VM163S Key Technical Features: i7-4700EQ 4th Gen Intel® Core™ i7 • Quad-Core Dual-Thread @ 2.4 GHz • HD Graphics 4600 ĄĄ 8 GB DDR3L with ECC ĄĄ 32 GB On-Board Flash Disk ĄĄ 1 PMC Slot + 1 XMC Slot ĄĄ WDT, IPMI, RTC, Temp. Sensors ĄĄ Versatile Board I/O • USB • Discrete • SATA • RGBHV Out • Serial • HDMI/DVI Out • GbE ĄĄ Windows®, VxWorks®, Linux® Support ĄĄ Air-Cooled VME Board ĄĄ
Ai-VM111S Key Technical Features:
T4080 QorIQ™ SoC Processor • Quad e6500 Dual-Thread Cores @ 1.5 GHz • Altivec Unit ĄĄ 4 GB DDR3L with ECC ĄĄ 128 MB NOR Flash ĄĄ 1 PMC Slot + 1 XMC Slot ĄĄ WDT, ETR, RTC, Temp. Sensors ĄĄ Versatile Board I/O • USB • Serial • SATA • Discrete • GbE ĄĄ VxWorks®, Linux®, INTEGRITY® Support ĄĄ Air-Cooled VME Board ĄĄ
industrial.embedded-computing.com/p372768
Aitech Defense Systems, Inc. www.rugged.com
www.industrial-embedded.com
sales@rugged.com https://www.linkedin.com/company/Aitech
888-Aitech-8 http://twitter.com/AitechDefense
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Wild40 4-Slot OpenVPX 6U Chassis The Wild40 Four Slot OpenVPX 6U Chassis is an OpenVPXcompatible chassis capable of accepting up to four 6U tall by 160mm OpenVPX Front Plug-in Modules (FPMs) and up to four 6U tall by 80mm Rear Transition Modules (RTMs). Plug-in Module slot spacing is 1 except for Slot 4 which can accept Modules that are 2″ wide. The Wild40 Four Slot OpenVPX 6U Chassis is equipped with a very
FEATURES
high performance backplane which is capable of Serial I/O signal-
ĄĄ
ing at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged as a mesh between the four slots. The Expansion Plane is a chain connecting adjacent slots. The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set
ĄĄ
4U High with Front Mounted Horizontal OpenVPX Card Cage 4 Slot OpenVPX High Speed Mesh Backplane with RTM Support
ĄĄ
1184 Watt Power Supply
ĄĄ
Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1
ĄĄ
Backplane Profile: BKP6-DIS04-11.2.22-n
fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces. The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.
Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed. We offer training and exceptional special application development support, as well as more conventional support.
industrial.embedded-computing.com/p372766
Annapolis Micro Systems, Inc. www.annapmicro.com 28 / 2015 Resource Guide
Industrial Embedded Systems
wfinfo@annapmicro.com 410-841-2514
www.industrial-embedded.com
Wild40 Seven Slot OpenVPX 3U Chassis The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPXcompatible chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear Transition Modules (RTMs). Plug-in Module slot spacing is 1″. This chassis is equipped with a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data and Expansion Planes. The Data Plane of the backplane is connected to adjacent slots with one Fat Pipe connection. The Expansion Plane is a 3 slot star with two Fat Pipes connecting slots.
FEATURES ĄĄ
6U High with Front Mounted OpenVPX Card Cage
ĄĄ
7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support
ĄĄ
1534 Watt Power Supply
ĄĄ
The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures
ĄĄ
and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet
ĄĄ
Radial clocking for AUXCLK and REFCLK with chassis input SMAs Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and SLT3-PAY-2F4F2U-14.2.11 Switch Profile: SLT3-SWH-2F24U-14.4.3 or SLT3-SWH-2F4T16U-14.4.11
interfaces. The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.
Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed. We offer training and exceptional special application development support, as well as more conventional support.
industrial.embedded-computing.com/p372672
Annapolis Micro Systems, Inc. www.annapmicro.com
www.industrial-embedded.com
wfinfo@annapmicro.com 410-841-2514
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Wild40 12-Slot OpenVPX 6U Chassis 11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling compromising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane. The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″ VITA 48.1. The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots. In addition to the Primary Backplane there is also an option for a Secondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors. These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs. The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces. The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.
FEATURES ĄĄ ĄĄ
ĄĄ
10U High with Front Mounted OpenVPX Card Cage Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards
ĄĄ
Up to 3200 Watt Power Supply
ĄĄ
Backplane Profile: BKP6-CEN12-11.2.X
ĄĄ
Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1
ĄĄ
Switch Profile: SLT6-SWH-16U20F-10.4.2
Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed. We offer training and exceptional special application development support, as well as more conventional support. industrial.embedded-computing.com/p372673
Annapolis Micro Systems, Inc. www.annapmicro.com 30 / 2015 Resource Guide
Industrial Embedded Systems
wfinfo@annapmicro.com 410-841-2514
www.industrial-embedded.com
WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch The WILD OpenVPX 14Gbit Switch Card supports 1GbE, XAUI, 10GbE, 40GbE, 56GbE, and SDR/DDR/QDR/FDR Infiniband. It has dual 1/10GbE SFP+ front panel control plane uplinks and eight front panel data plane QSFPs. It supports up to 20 1GbE backplane control plane connections and 20 XAUI/40GbE/Infiniband data plane connections. The WILD OpenVPX 14Gbit Switch Card is extremely versatile since it is capable of switching both Infiniband (SDR, DDR, QDR, FDR) and Ethernet (1Gb, 10Gb, 40Gb, 56Gb) traffic with up to 4 Tb/s of nonblocking switching capacity. The WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch also supports chassis management and can act as a Chassis Manager (ChMC). The 1Gb Ethernet control plane supports up to 20 backplane ports and two front panel SFP+ which can run at 1GbE or 10GbE. The data and control planes are located on different virtual networks to ensure best performance on each. Basic configuration is streamlined where all required features are selected by DIP switches. A front panel USB serial port allows configuration of management Ethernet interfaces if needed (DHCP is the default configuration). Software updates, if needed, are completed via a simple web interface which can also be disabled via USB serial console. Front panel status LEDs show the status of every switch port (link/activity) as well as overall status and health of the WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch. The front panel RJ45 10/100/1000 BASE-T Ethernet port is used for switch management and is connected directly to the on-board PowerPC. There is also an optional “in band” Ethernet connection from the PowerPC to the control plane. Note that not all switch configurations support the “in-band” management connection.
FEATURES ĄĄ MultiProtocol Switch
• 1/10/40/56 Gb Ethernet and SDR/DDR/QDR/FDR Infiniband • Up to Four Tb/s Non-Blocking Switching Capacity with up to Eight Switch Partitions
ĄĄ Backplane & Front panel I/O
• Backplane Ports: Twenty High Speed Four Lane Data Plane Connections, Sixteen 1Gb Ethernet Lanes • Front Panel Ports: Eight QSFP+, Two SFP+, RJ45 Management Port, USB UART, Status LEDs • Each Backplane and Front Panel Port can be Configured for either Infiniband or Ethernet • Infiniband and IP Routing • Ethernet Gateways
ĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Mechanical and Environmental
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Slot Profile: SLT6-SWH-16U20F-10.4.2-n • Integrated Heat Sink and Board Stiffener
industrial.embedded-computing.com/p372674
Annapolis Micro Systems, Inc. www.annapmicro.com
www.industrial-embedded.com
wfinfo@annapmicro.com 410-841-2514
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Industrial Hardware
WILDSTAR 7 Conduction Cooled for OpenVPX 6U WILDSTAR 7 Conduction Cooled for OpenVPX 6U boards provide up to two Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs, up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth. Up to 1.9 million logic cells and 3.3 million multiplier bits per board. Air or Conduction Cooled. These FPGA boards include two Xilinx Virtex 7 FPGAs with 64 High Speed Serial connections performing up to 13.1 Gbps. The IO Processing Element (IOPE) FPGA has a choice of QDRII+ SRAM or DDR3 DRAM. The DRAM option has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz while the SRAM option has two 72-bit QDRII+ SRAM interfaces clocked up to 500 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASEKR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER). If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to four WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for six QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site). WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board. Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
FEATURES ĄĄ One or Two XILINX VIRTEX 7 FPGAS • VX690T or VX980T • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth • PCIe Gen3 8x from each FPGA to on-board PCIe switch ĄĄ Backplane I/O • 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth • 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 24 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth • 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe Switch ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O industrial.embedded-computing.com/p372742
Annapolis Micro Systems, Inc. www.annapmicro.com 32 / 2015 Resource Guide
Industrial Embedded Systems
wfinfo@annapmicro.com 410-841-2514
www.industrial-embedded.com
WILDSTAR 7 for OpenVPX 3U The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board. These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER). If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site). WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board. Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
FEATURES ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth ĄĄ Backplane I/O • 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth • Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols • External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK
– Allows points-to-point, very high quality backplane connections to payload cards – Allows 10MHz clock and trigger from backplane to synchronize and clock compatible ADC/DAC mezzanine cards without front panel connections needed – Allows 1000s of analog channels across many backplanes/chassis to be synchronized via backplane
ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth • Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and userdesigned protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGA ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O industrial.embedded-computing.com/p372457
Annapolis Micro Systems, Inc. www.annapmicro.com
www.industrial-embedded.com
wfinfo@annapmicro.com 410-841-2514
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WILDSTAR A5 for OpenVPX 6U WILDSTAR A5 for OpenVPX 6U boards provide up to three Altera Stratix® V FPGAs per board with choice of GX parts up to 5SGXAB or GS parts up to 5SGSD8, up to 96 MB of QDRII+ SRAM for 59 GB/s of SRAM bandwidth and up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth. Up to 2.8 million logic elements and 4.3 million multiplier bits per board. Air Cooled Only. These FPGA boards include 3 Altera Stratix V FPGAs with 48 High Speed Serial connections performing up to 14.1 Gbps. On each Compute Processing Element (CPE) FPGA there is six 72-bit QDRII+ SRAM interfaces clocked up to 550 MHz. The IO Processing Element (IOPE) FPGA has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER). If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to 4 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 6 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site). WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board. Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
FEATURES ĄĄ One, Two or Three ALTERA STRATIX® V FPGAS • Up to three Altera Stratix® V FPGA Processing Elements: 5SGSD6, 5SGSD8, 5SGXA7, 5SGXA9, 5SGXAB • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth • Up to 96 MB of QDRII+ SRAM for 48 GB/s of SRAM bandwidth • PCIe Gen3 8x from each FPGA to on-board PCIe switch ĄĄ Backplane I/O • 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth • Up to 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 32 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 56.4 Gbps each for 42.3 GB/s of Full Duplex Bandwidth • 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe Switch ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • SignalTap Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O industrial.embedded-computing.com/p372743
Annapolis Micro Systems, Inc. www.annapmicro.com 34 / 2015 Resource Guide
Industrial Embedded Systems
wfinfo@annapmicro.com 410-841-2514
www.industrial-embedded.com
MitySOM-5CSx: Altera Cyclone V SoC-based SOM The MitySOM-5CSx combines the Altera Cyclone V SoC, memory subsystems and onboard power supplies into a highly-configurable, small form-factor System on Module (SOM). All products in the MitySOM-5CSx family are pin-for-pin compatible, allowing development teams room to grow and the flexibility to quickly and cost-effectively meet customers’ ever-changing needs. The MitySOM-5CSx family offers a wide range of processing densities, speed grades, and temperature options at competitive costs. Critical Link designed the SOM family with rigorous industrial, medical, and defense applications in mind, ensuring long-term production and professional support for our customers. Standard SOMs and development kits are available today from numerous major distributors. If a standard variant does not meet your specification, contact Critical Link to discuss developing a custom solution.
MitySOM-5CSx features a Hard Processor System (HPS) providing up to 4,000 MIPS at speeds of up to 925MHz per core and is combined with a NEON coprocessor with double-precision FPU. The MitySOM-5CSx combines a Cyclone V with up to 2GB of DDR3 CPU/FPGA RAM with ECC, 512MB of dedicated DDR3 FPGA RAM (optional) and up to 48MB of QSPI NOR Flash creating a highbandwidth system for embedded applications. The ARM architecture supports several high level operating systems, including Embedded Linux, Micrium uC/OS, Android, QNX, and Windows Embedded Compact. By combining six 3.125Gbps transceivers, one PCIe hard core, up to 133 user I/O, and dual Gigabit Ethernet interfaces, the system can simultaneously acquire and efficiently process large amounts of data. industrial.embedded-computing.com/p372770
Critical Link
info@criticallink.com
315-425-4045
www.linkedin.com/company/critical-link-llc
www.criticallink.com/product/mitysom-5csx/
twitter.com/Critical_Link
Industrial Hardware
Intermas – InterRail Intermas develops electronic enclosure systems: Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection. Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.
FEATURES ĄĄ InterRail® products meet tough physical demands and vibration
proofs used for railway engineering, traffic engineering, and power station engineering.
ĄĄ 19" subracks and housings with flexible internal layout.
Go to www.Intermas-US.com for our new catalog.
ĄĄ EMI- and RFI-shielded protection using stable stainless steel
contact springs ensuring permanent and reliable bonding.
ĄĄ Connectors and wiring accessories. ĄĄ Customization available. industrial.embedded-computing.com/p372664
Intermas US LLC
www.Intermas-US.com www.industrial-embedded.com
intermas@intermas-us.com 800-811-0236
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SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® processor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability. Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.
FEATURES ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 Processors ĄĄ Fanless -40° to +85°C operational temperature ĄĄ Powered by PoE or +10-50VDC Input ĄĄ 10/100/1000 Ethernet with IEEE-1588™ ĄĄ USB 2.0 and USB On-The-Go Ports ĄĄ FlexCAN and RS-232/422/485 Serial Ports ĄĄ 24 GPIO tolerant up to 30VDC ĄĄ Mini-PCIe and IO60 (I2C, SPI, TTL, and PWM) expansion industrial.embedded-computing.com/p372204
WinSystems
www.winsystems.com
info@winsystems.com
817-274-7553
www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc Industrial Hardware
SBC35-CC405 – Industrial Small Form Factor Computers The SBC35-CC405 series of small form factor computers utilizes the Intel® Atom™ E3800 family of processors in a standard 3.5-inch SBC format. The COM Express based solution includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels, USB 3.0, and +10 to +50V DC input.
FEATURES ĄĄ Multi-Core Intel® Atom™ E3800 Processors
Engineered for rugged applications, the low-profile thermal solution creates a sturdy base that protects the PCB assembly, provides convenient mounting, and enables fanless extended temperature operation.
ĄĄ Up to two independent displays (VGA, LVDS and DisplayPort)
Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.
ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)
ĄĄ Two Ethernet Controllers with IEEE 1588 time stamping ĄĄ Two RS-232/422/485 Serial ports ĄĄ Bus Expansion (Two MiniPCIe and IO60) ĄĄ Bootable SATA, CFAST, and mSATA ĄĄ Wide range 10 to 50V DC input ĄĄ Fanless -40° to +85°C operational temperature industrial.embedded-computing.com/p372206
WinSystems
www.winsystems.com 36 / 2015 Resource Guide
info@winsystems.com
817-274-7553
www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc Industrial Embedded Systems
www.industrial-embedded.com
SYS-405 – Rugged Industrial Computers The SYS-405 series of industrial computers utilizes the Intel® Atom™ E3800 family of processors in a tough aluminum enclosure. The solutions includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels (RS-232/485/422), four USB, audio, and +10 to +50V DC input. The rigid enclosure base is engineered for rugged applications and provides the thermal solution for the processor. The 5052 aluminum alloy enclosure protects the PCB assembly and includes access to the CFAST connector. Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.
FEATURES ĄĄ Multi-Core Intel® Atom™ E3800 Processors ĄĄ Up to two independent displays (VGA and DisplayPort) ĄĄ Two Ethernet Controllers with IEEE 1588 time stamping ĄĄ Two RS-232/422/485 Serial ports ĄĄ Internal Bus Expansion (Two MiniPCIe and IO60) ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0) ĄĄ Bootable SATA, CFAST, and mSATA ĄĄ Wide range 10 to 50V DC input ĄĄ Fanless -40° to +85°C operational temperature industrial.embedded-computing.com/p372202
WinSystems
www.winsystems.com
info@winsystems.com
817-274-7553
www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc Industrial Internet/IoT
MXE-200/200i Intel® Atom™ Processor-based IoT Gateway Platform ADLINK’s MXE-200/200i ultra-compact fanless embedded platform, based on Intel® Atom™ SoC E3845/E3826 processors, delivers proven versatile connectivity and seamless interconnection for guaranteed interoperability between systems. The MXE-200/200i’s hardy aluminum housing withstands industrial grade certified EMI/EMS (EN 61000-6-4, 61000-6-2) for proven rugged construction, assuring operability under harsh conditions. The intelligent gateway features shock tolerance up to 100 G and an extended operating temperature range of up to -20°C to 70°C (optional). Meeting a wide variety of specific industrial needs, the MXE-200/200i combines controller and gateway functions in one unit, significantly reducing installation/wiring and device costs. The MXE-200 delivers maximum performance with quad-core Intel Atom Processors, and the MXE-200i adds pre-verified IoT functionality to embedded control capability, with full Intel® IoT Gateway platform support.
FEATURES ĄĄ Intel® Atom™ SoC processor E3845/3826 ĄĄ Industrial grade EMI/EMS certified (EN61000-6-4,61000-6-2) ĄĄ Built-in ADLINK SEMA Cloud solution ĄĄ Versatile and reliable I/O maximizes industrial connectivity ĄĄ Rugged design for -20°C to 70°C fanless operation (w/ industrial
grade SD/mSATA) ĄĄ Full support for Intel® IoT Gateway platform, with pre-loaded Wind River® IDP XT 2.0 (MXE-200i only) ĄĄ Extremely compact: 120 (W) x 100 (D) x 55 (H) mm ĄĄ Optional DIN-Rail/Wall mounting industrial.embedded-computing.com/p372767
ADLINK
www.adlinktech.com • http://bit.ly/1F50yMg www.industrial-embedded.com
angela.torres@adlinktech.com 408-360-4360
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Matrix-513, Intelligent IoT Gateway Artila’s Matrix-513 is designed for applications of remote device management which require a reliable wired and wireless communications and low power but powerful computing platform. Matrix-513 comes with two miniPCIe slots which can accept COTS Wireless LAN, Bluetooth, GPS and cellular 3G miniPCIe cards. The dual independent 10/100Mbps Ethernet ports of Matrix-513 provide a flexible and reliable wired communication, and the four RS-232/422/485 serial ports are ready for connecting to the serial devices. In addition, Matrix-513 is equipped with two isolated digital inputs and one relay output which can be used for device status monitoring and alarm.
FEATURES ĄĄ Linux 2.6.38 computing platform with file system ĄĄ ATMEL 400MHz ARM9 AT91SAM9G45 CPU
Matrix-513 is powered by 400MHz ATMEL AT91SAM9G45 ARM9 SoC and 128MB DDR2 SDRAM and 256MB NAND Flash. A 2MB DataFlash is used as backup file system and it provides users an easy way to perform system update or recovery at the service site.
ĄĄ 128MB DDR2 SDRAM and 256MB NAND Flash
Applications: Building Automation, Energy Management, Factory Automation, Intelligent Traffic System, Web-based Remote I/O, etc.
ĄĄ 1 x half size miniPCIe socket inside (USB signal)
ĄĄ 2 x 10/100Mbps Ethernet ports ĄĄ 2 x high-speed USB hosts, up to 480Mbps ĄĄ 1 x full size miniPCIe socket inside (USB signal) ĄĄ 4 x RS-232/422/485 serial ports industrial.embedded-computing.com/p372769
Artila Electronics Co., Ltd. www.artila.com
sales@artila.com +886-2-8667-2340
Industrial Internet/IoT
SoM-9G25M – Low Power Consumption EMAC, inc. introduces the SoM-9G25M; a versatile System on Module (SoM) targeting applications that require low power, low cost, and embedded longevity. Designed and Manufactured in the USA, the SoM-9G25M is the ideal choice for Industrial IoT solutions. This module has a temperature range of -40 to +85C, onboard DDR2 RAM, Serial Data Flash, optional NAND, GPIO, Serial Ports, SDIO, Ethernet, A/D, SPI, I2C, PWM, USB Host & Device Ports and I2S Audio Line In/Out Ports. The SoM-9G25M is designed to plug into a carrier board that contains all the connectors and any additional I/O required for the application. This approach allows the you or EMAC to design a custom carrier board that meets the I/O, dimensional, and connector requirements without having to worry about the processor, memory, and standard I/O functionality. With the System on Module approach, a semi-custom hardware platform can be developed in as little as a month. In addition to the option of the developing a custom carrier board, one can be purchased off-the-shelf. The recommended off-the-shelf Carrier Board for the SoM-9G25M is the SoM-150ES. The SoM approach provides the flexibility of a fully customized product at a greatly reduced cost. Quantity 1 price for the SoM-9G25 is $99.
FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
Atmel ARM9 AT91SAM9X25 400Mhz Processor Up to 128MB of DDR2 RAM Up to 64MB of Serial Data Flash Up to 512MB of NAND Flash SD/MMC Flash Card Interface 6 Serial ports (3 with handshake) & SDIO Port Ethernet, A/D, SPI, I2C, PWM, GPIO High Speed USB 2.0 Host & Device ports I2S Audio Line In/Out Ports EMAC OE5 Linux 5 Channel, 10-bit Analog-to-Digital converter Typical power requirement less than 1 Watt Small, 144 pin SODIMM form factor (2.66" x 1.5") industrial.embedded-computing.com/p372772
EMAC, Inc.
www.emacinc.com/products/system_on_module 38 / 2015 Resource Guide
Industrial Embedded Systems
info@emacinc.com
618-529-4525
www.linkedin.com/company/emac-inc-
www.industrial-embedded.com
Tachyon 100G Tachyon® 100G laminates and prepregs for printed circuit board fabrication are engineered to reduce insertion loss on high-speed digital line cards and backplane designs. These materials offer a complete line of laminates and prepregs with spread-glass weaves to minimize micro-Dk effects of glass fabrics and to mitigate minimize differential signal skew. Tachyon 100G laminates and prepregs enable high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers that are required to transmit 100GbE at data rates in excess of 25 Gb/s per channel. The materials minimize skew, which limits the bandwidth of these links, adds data-dependent jitter, and limits the possibility of equalizing links to compensate for high-frequency skin effect and dielectric losses. Tachyon 100G materials provide a thermosetting matrix that exhibits dielectric performance on par with PTFE, thermal performance exceeding most high-reliability resin systems, and processing similar to standard FR-4-type products. The lamination cycle for Tachyon 100G offers a 50% increase in press productivity. Tachyon 100G also does not require plasma desmearing. Fabricators can use a wet desmear process instead which provides a major reduction in throughput and cycle time. Tachyon 100G is also HDI friendly and can be processed as a hybrid with other Isola products. These attributes reduce the total cost of manufacturing of a printed circuit board and enables a broader range of PCB fabricators (versus specialized board shops) to process the materials and enter markets that may have been previously unattainable due to manufacturing and cost limitations.
FEATURES ĄĄ Dk: 3.02 | Df: 0.0021 | Tg: 200°C | Td: 380°C ĄĄ Engineered to improve insertion loss on the most demanding high speed
digital designs
ĄĄ Tachyon 100G is recommended for 100 Gbps backplane & line card
applications
ĄĄ Optimized constructions to improve CAF & lead-free assembly performance ĄĄ Complete line of laminates & prepregs with spread glass weaves to
minimize micro-Dk effects of glass fabrics & to mitigate skew
ĄĄ HDI design friendly ĄĄ Can be used in hybrid builds as prepregs & laminates because of the
low-cure lamination cycle
industrial.embedded-computing.com/p372722
Isola
www.isola-group.com/products/tachyon-100g/
tachyon@isola-group.com
800-537-7656
www.linkedin.com/company/isola-group twitter.com/IsolaGroup Industrial Internet/IoT
PPM-N409 – Dual PC/104-Plus Ethernet with SFP Interface The PPM-N409-2 PC/104-Plus Dual Ethernet module features Small Form Factor Pluggable (SFP) transceivers, controlled by dual Intel® I210 Ethernet Controllers, bringing the latest in technology to your legacy design. Both module housings are compatible with the large variety of SFP transceivers that range from optical single mode, optical dual mode, and GbE twisted pair copper. The small form factor and negligible heat signature of the PPM-N409-2 makes it ideal for installation in confined spaces. Combined with its exceptional range of operational temperatures, low physical profile, and rugged design, the PPM-N409-2 can be deployed in even the most demanding environments. Give your systems the advantage of compact design, low power consumption, and high precision time synchronization of the PPM-N409-2 Ethernet controller from WinSystems. Custom design options are available upon request.
FEATURES ĄĄ Intel® I210 Ethernet Controllers ĄĄ Two Fully Independent Ethernet Connections ĄĄ Small Form Factor Pluggable (SFP) Interface ĄĄ Accepts the Wide Range of SFP Ethernet Modules ĄĄ Fanless -40° to +85°C operational temperature ĄĄ PC/104-Plus Form Factor ĄĄ IEEE 1588 Precision Time Synchronization over Ethernet ĄĄ Robust Communication over Long Distances ĄĄ Supports Linux, Windows, and DOS Operating Systems industrial.embedded-computing.com/p372686
WinSystems
www.winsystems.com www.industrial-embedded.com
info@winsystems.com
817-274-7553
www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc Industrial Embedded Systems
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Industrial Software
SAFEXchange™: Secure Multi-processor Communications SAFEXchange™ allows you to securely share safety critical data between multiple processors and cores across any black channel communication systems. A fusion of a Data Distribution Service and an integrity layer, SAFEXchange maintains flexibility and isolation between Producers and Consumers of data by protecting the data shared rather than the communication channel itself. This allows SAFEXchange to be used in conjunction with black channel communication mediums. • SAFEXchange is ideal for use in projects working across multiple cores and processors, or in any situation where data integrity must be protected. • SAFEXchange is supplied as an add-on component for all RTOS products supplied by WITTENSTEIN high integrity systems. Visit www.highintegritysystems.com to find out more.
FEATURES ĄĄ SAFEXchange has been certified to IEC 61508, ISO 26262, and
IEC 61784-3 by TÜV SÜD. It guards against Incorrect Addressing, Corruption, Delay, Repetition, Incorrect Sequence, Loss and Masquerade of messages.
ĄĄ SAFEXchange is based on a Producer and Consumer model, where
Producers publish data onto the network and Consumers can register to access the data. Consumers are not aware of how or where the data is produced - the only information they share is the unique identifier for the stream of data items.
ĄĄ New Producers and Consumers can be added to the system without
affecting the safety case, providing the bandwidth of the black channel is adequate.
industrial.embedded-computing.com/p372775
WITTENSTEIN high integrity systems www.highintegritysystems.com
info@highintegritysystems.com
+44 1275 395 600
WITTENSTEIN high integrity systems
@WITTENSTEIN_HIS
Industrial Systems
ePC-Duo The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need. Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Uniquely customizable – Dual XMC sites for I/O, user-programmable Xilinx FPGA for I/O interfaces, triggering and timing control, USB ports. Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN). Download data sheets now!
FEATURES ĄĄ Combines an industry-standard COM Express CPU with dual XMC I/O modules ĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" D ĄĄ Stand-alone operation: Able to operate diskless and headless ĄĄ Windows, Linux and RTOS support ĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to industrial control modules. Features for private data channels, triggering and synchronous timing ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory** ĄĄ Integrated timing and triggering support for I/O includes optional GPS, IEEE-1588 or IRIG-disciplined clock ĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, optional LCD display ĄĄ Network communication supported with dual 10 GbE ethernet links **Data rate dependent on the COM Express module capabilities.
industrial.embedded-computing.com/p372773
Innovative Integration
www.innovative-dsp.com/products.php?product=ePC-Duo
40 / 2015 Resource Guide
Industrial Embedded Systems
sales@innovative-dsp.com 805-383-8994
www.industrial-embedded.com
WILD Data Storage Solution When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write bandwidth. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication). The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister. The Storage Carrier/Canister is specifically designed to support 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates). To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design. Sensors can be accessed with a chassis manager (ChMC). New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.
FEATURES ĄĄ General Features
• 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Backplane I/O
• Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of 20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4
ĄĄ System Management
• Client/Server Interface for WILDSTAR FPGA Boards and Linux and Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control and Data Plane Connections
ĄĄ Physical Features
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling industrial.embedded-computing.com/p372456
Annapolis Micro Systems, Inc. www.annapmicro.com
www.industrial-embedded.com
wfinfo@annapmicro.com 410-841-2514
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Industrial Storage
www.atpinc.com ATP DRAM and NAND Flash Products ATP DRAM Products ATP DRAM Modules are designed for high-performance, mission-critical applications such as Industrial PC and Networking/Telecom, where high levels of technical support, operating consistency, and wide operating temperature ranges are required. Built with high quality IC components and 100% tested, the ATP DRAM module family includes a full spectrum of form factors including VLP, ULP, UDIMM, RDIMM, SODIMM, and MINI-DIMM, as well as multiple generations of DRAM technologies. ATP has a long history of providing long-term support and addressing specific requirements of OEM customers.
FEATURES
The new ATP Manufacturing, Testing and Validation facility offers enhanced manufacturing quality and TDBI/ATE testing capabilities on all DRAM product lines.
ĄĄ
ATP DRAM Products ĄĄ
JEDEC compliant Extensive support on DDR4,DDR3, DDR2, DDR1, and PC133 SDRAM generation memory modules
ATP Industrial Grade NAND Flash Products
ĄĄ
Industrial Grade temperature range (-40°C to 85°C)
Flash Product Line Summary: Memory Cards (microSD/SD), Embedded Modules (SATA, USB, eUSB), and HDD Replacement SSD (2.5" SATAII/III).
ĄĄ
Conformal coating for environmentally rugged applications
ATP Industrial Grade NAND Flash Products are designed for high-performance, mission-critical applications such as Automotive, Healthcare, Networking/Telecom, Military, etc, where high levels of durability, operating consistency, and wide operating temperature ranges are required. All ATP Industrial Grade NAND Flash products implement ECC and wear-leveling algorithms to maximize NAND Flash component utilization and long-term data integrity. The product line is also built using SLC (Single Level Cell)-type NAND Flash components, which are specified to at least 20 times greater the rating for program/ erase cycles (lifetime) compared to commercial and consumer level MLC-type NAND Flash.
ĄĄ
ATP is a true manufacturer with over twenty years of experience in the production of NAND Flash memory solutions and DRAM memory modules. ATP offers in-house design, testing and product tuning, as well as extensive supply chain support with controlled/fixed BOMs and long product life cycles.
ĄĄ
Long-term supply chain commitment upon module qualification ATP patented TDBI System – the next generation test during burn-in
Industrial-Grade Flash Products ĄĄ ĄĄ ĄĄ
SLC NAND Flash Components ATP patented PowerProtector Technology – Data integrity during a sudden power down SMART Life Monitor Technology – Flash health status feedback to host
ĄĄ
Integrated Secure Erase Technology
ĄĄ
Industrial Grade temperature range (-40°C to 85°C)
ĄĄ
Supply chain road maps by BOM upon product qualification
ĄĄ
Onboard AES Encryption (SSD Products)
New SATA III Products • 2.5" SSD SII Pro • 2.5" SSD MV • M.2 2260/2242
• CFast • mSATA • SlimSATA
industrial.embedded-computing.com/p9911833
ATP Electronics
sales@atpinc.com 408-732-5000
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www.industrial-embedded.com
ePC-Duo The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need. Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Uniquely customizable – Dual XMC sites for I/O, user-programmable Xilinx FPGA for I/O interfaces, triggering and timing control, USB ports. Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN). Download data sheets now!
FEATURES ĄĄ Combines an industry-standard COM Express CPU with dual XMC I/O modules ĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" D ĄĄ Stand-alone operation: Able to operate diskless and headless ĄĄ Windows, Linux and RTOS support ĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to industrial control modules. Features for private data channels, triggering and synchronous timing ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory** ĄĄ Integrated timing and triggering support for I/O includes optional GPS, IEEE-1588 or IRIG-disciplined clock ĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, optional LCD display ĄĄ Network communication supported with dual 10 GbE ethernet links **Data rate dependent on the COM Express module capabilities.
industrial.embedded-computing.com/p372773
sales@innovative-dsp.com 805-383-8994
Innovative Integration
www.innovative-dsp.com/products.php?product=ePC-Duo
Small Form Factor Modules
X6-1000 X6-1000M integrates high-speed digitizing and signal generation with signal processing on a PMC/XMC IO module for demanding DSP applications. The tight coupling of the digitizing to the Virtex6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing. The PCI Express system interface sustains transfer rates over 2 GB/s for data recording and integration as part of a high performance realtime system. The X6-1000M features two, 12-bit 1 GSPS A/Ds and two 1 GSPS 16-bit DACs. Analog input bandwidth of over 2 GHz supports wideband applications and undersampling. The DACs have features for interpolation and coarse mixing for upconversion. The sample clock is from either a low-jitter PLL or external input. Download data sheets now!
FEATURES Two 1 GSPS, 16-bit DAC channels and Two 1 GSPS, 12-bit A/D channels +/-0.5V, AC or DC -Coupled, 50 ohm, SSMC inputs and outputs Xilinx Virtex-6 SX315T/SX475T or LX240T 4 Banks of 1GB DRAM (4 GB total) Ultra-low jitter programmable clock Arbitrary Waveform Generation Memory Controller for DACs Gen2 x8 PCI Express providing 2 GB/s sustained transfer rates PCI 32-bit, 66 MHz with P4 to Host card PMC/XMC Module (75x150 mm) 20-25W typical Conduction Cooling per VITA 20 Ruggedization Levels for Wide Temperature Operation ĄĄ Adapters for VPX, Compact PCI, desktop PCI and cabled PCI Express system ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
industrial.embedded-computing.com/p372774
Innovative Integration
www.innovative-dsp.com/products.php?product=X6-1000M www.industrial-embedded.com
sales@innovative-dsp.com 805-383-8994
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Sensors and Control