PICMG Systems & Technology with Resource Guide Fall 2019

President’s Corner

PG. 4

MicroTCA Workshop Report

PG. 5

Technology Focus

PG. 8

Celebrating 25 years of PICMG

COM Express in medical imaging @PICMG_Tech

SPRING 2019 VOLUME 23 NUMBER 1

Standards-based technology platforms for open innovation picmg-systems.com

@PICMG_Tech

On the cover The PICMG Systems & Technology 2019 Resource Guide covers the use of MTCA.4 in high-energy physics, COM Express in medical imaging, the 25th anniversary of the PICMG consortium, and more.

The Resource Guide also highlights some of the industry’s top products, in the categories of COM Express, CompactPCI, cPCI Serial Space, and Industrial Automation.

Leveraging COM Express for medical equipment design

By Patrick Lee, Arbor Technology

Technology Focus

8

President’s Corner | Jessica Isquith

4 6

Celebrating 25 years of PICMG

MicroTCA Workshop Report | Justin Moll

5

MicroTCA workshop at DESY – 2018

PICMG Consortium Members at Embedded World

Technology Focus

Next-generation backplane production technology

By Gary Routledge, Amphenol

Technology Focus

12

8

Leveraging COM Express for medical equipment design

By Patrick Lee, Arbor Technology

12

Next-generation backplane production technology

By Gary Routledge, Amphenol

Application Feature 16

High-energy physics: Controllers for X-ray laser accelerators

By Heiko Koerte and Vollrath Dirksen, N.A.T.

PICMG Consortium 20

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

2019 Resource Guide 24

IMAGE

COM Express cPCI Serial Space

CompactPCI Industrial Automation

Published by:

High-energy physics: Controllers for X-ray laser accelerators

By Heiko Koerte and Vollrath Dirksen, N.A.T.

Application Feature

2

16

® 2019 OpenSystems Media ®C ompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC, GEN4, and their logos are registered trademarks of PICMG. TM x TCA is a trademark of PICMG. © 2019 PICMG Systems & Technology All registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners.

| Spring 2019 | PICMG Systems & Technology Resource Guide

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COM Express Acromag, Inc. 24 Seco 24 Avnet Integrated 25 congatec 26 Eurotech 27 CompactPCI Vector Electronics & Technology, Inc.

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CompactPCI/cPCI Serial Space Acromag, Inc. Atrenne, A Celestica Company

29 29

Industrial Automation N.A.T. GmbH

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Spring 2019 | PICMG Systems & Technology Resource Guide |

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President’s Corner

Celebrating 25 years of PICMG

By Jessica Isquith, President of PICMG

Happy 25th Anniversary!

Welcome! PICMG is celebrating its 25th year with great momentum and many active committees. Since our founding, nine families of specifications and tens of thousands of successful collaborations have led to billions of dollars in products and solutions across a wide array of markets. We are poised to continue our efforts in solving embedded computing requirements through new and expanded open specifications.

New leadership team The new year brings two new entrants to the PICMG management team – Valerie Andrew and Dylan Lang – who join CTO Doug Sandy, VP of marketing Justin Moll, and me as officers. Valerie – in her role as PICMG secretary – brings to the team her years of leadership experience in the embedded computing industry. She currently has a senior marketing role at Elma and is an active participant in SOSA [Sensor Open Systems Architecture consortium] and VITA. Our new treasurer, Dylan, joins us from SAMTEC, where his primary focus is open standards. He is also the secretary of the COM-HPC technical subcommittee and leads efforts at several embedded computing consortia. These two new officers bring fresh ideas, expertise, and a shared commitment to open standards and the importance of collaboration.

Embedded World in our sights Embedded World is the largest annual event dedicated to the embedded computing industry. Last year’s event attracted more than 30,000 visitors and over 1,000 exhibitors; the 2019 numbers are expected to top last year’s. PICMG, as an international standards organization, finds this event to be one of the strongest forums for our members to meet. This year’s embedded world will facilitate many face-to-face meetings with members, potential members, and other consortia. Attendees are encouraged to visit PICMG at booth 3A-528, where we will showcase products from seventeen of our members. In addition, 40 PICMG members will have dedicated booths to show off their offerings.

Contributed articles This issue contains four member-contributed articles that address several key markets that use PICMG-based products, including medical systems, high-energy physics, and production automation.

NAT provides an excellent overview as to why MTCA.4 is the ideal standard for X-ray laser accelerator control systems (page 16). Arbor’s article on page 8 discusses the key factors medical equipment designers need to consider when solving application requirements, and how the agility and reliability of COM Express systems address these concerns. Amphenol provides a review of next-generation backplane production technology (page 12), while Justin Moll shares an overview (page 5) of the latest MicroTCA Workshop.

Key technical initiatives for 2019 In 2018, PICMG launched an important new project, COM-HPC. This new COM specification, led by Christian Eder of Congatec, is under development in a parallel track with existing COM Express efforts. The subcommittee will be developing a next-generation COM standard and the accompanying Carrier Design Guide. The

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| Spring 2019 | PICMG Systems & Technology Resource Guide

jess@picmg.org

COM-HPC specification is expected to support two different module sizes: one for high-performance computing, the other for embedded computing. Initial plans include the incorporation of a new high-speed connector able to support existing and future interfaces such as PCI Express Gen 4/5 and 100 Gb Ethernet.

The specification will target medium- to high-performance server-class processors. Eighteen PICMG member companies have joined the group, which is sponsored by Congatec, ADLINK, and Kontron.

In the summer of 2018, VITA and PICMG agreed to transfer Rugged COM Express to the PICMG organization in order to complete the specification. PICMG and VITA have a rich history of successful collaboration to meet industry needs. This specification will define a ruggedized version of PICMG COM.0 for harsh and mission-critical environments. The goal of the specification is to describe a 100 percent mechanical-compatible housing around a COM Express module.

The team is finalizing a solid aluminumframe design that protects the electronics against environmental influences such as moisture, dust, vibration, or EMC radiation, and operates in the extended temperature range of -40 °C to +85 °C. This effort is sponsored by MEN Micro, nVENT, and Elma.

Doug Sandy continues to lead our IIoT initiatives related to the sensor domain, which – until now – has suffered from a lack of standardization. We are moving forward with an aggressive program to advance IIoT: Our approach encourages a firewalled, secure network architecture that supports a variety of synchronization methods and a uniform data model that scales down to the sensor domain through binary encoding. Using wellestablished practices, the specifications www.picmg.mil-embedded.com

will provide plug-and-play interoperability at the sensor domain to the “last foot” of the IIoT network. In March 2018, we formed an alliance with DMTF in order to extend the Redfish management API to industrial applications. Specification work on both the postage-stamp form factor and the IIoT data model efforts will commence by Q2 of 2019.

In addition to these efforts, ongoing enhancements to MicroTCA and Compact PCI Serial are also expected in 2019.

Looking ahead I am confident that increased participation will lead to innovations which will meet our industry’s evolving needs.

Whether you are currently a member or planning to become one, I encourage you to contact us at info@picmg.org and let us know how we can work together.

MicroTCA Workshop Report

MicroTCA workshop at DESY – 2018

By Justin Moll, Vice President of Marketing at PICMG With Susanne Schuster, DESY The 7th MicroTCA Workshop for Industry and Research was held at DESY [Deutsches Elektronen-Synchrotron] in Hamburg, Germany on December 5 and 6, 2018. The workshop was attended by 190 participants from more than 20 research facilities and more than 30 companies from all over the world.

Before the workshop, several pre-workshops included tutorials on different topics for newcomers as well as specialists in MicroTCA, which were very well received by the participants.

The main workshop consisted of 43 talks: Many companies showcased their new products, while research facilities presented their experimental results. The presentations left the impression that MicroTCA applications in many organizations have finished the testing stage and have moved on to real implementation.

This year, four interesting keynotes were presented: Saeed Karamooz, CEO of Vadatech, informed attendees about the growing MicroTCA market; while Timo Korhonen, chief engineer at ESS [European Spallation Source], reported on the

justin@picmg.org current status of MTCA.4 installations at his facility. Physicist Adrian Mancuso, who leads scientists at the European XFEL, introduced the audience to serial crystallography at the EuXFEL and showed the initial results of the first year of operation. The last keynote was given

by Christian Ganninger, global product manager of nVent-Schroff, who addressed upcoming developments in the MicroTCA standard including the capability of 40 G and 100 G Ethernet, PCIe Gen 4 and 5, and the support of significant increased power.

The workshop also encompassed an industrial exhibition: Several MTCA manufacturers and developers presented their products and invited the participants of the workshop to participate in lively discussions.

Coffee breaks, lunch, and the workshop dinner on the ship MS Hanseatic offered lots of networking opportunities.

Please save the date for next year: The 8th MicroTCA Workshop for Industry and Research will take place December 4 and 5, 2019 in Hamburg.

All presentations from the 2018 workshop can be downloaded from https://mtcaws.desy.de/contributions.

www.picmg.mil-embedded.com

Spring 2019 | PICMG Systems & Technology Resource Guide |

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PICMG Consortium Members at Embedded World February 26 – 28 | Nuremberg, Germany www.embedded-world.de Company

Booth/Hall

Company

Booth/Hall

AAEON Technology, Inc.

1/1-350

Fraunhofer FOKUS

4/4-470

Acromag, Inc.

3/3-354

Hartmann Electronic GmbH

2/2-440

ADLINK Technology Inc.

1/1-540

HEITEC AG

1/1-340

Advantech Co., LTD

2/2-138

IBASE Technology Inc.

2/2-440

Analog Devices, Inc.

4A/4A-641

Intel Corporation

1/1-338

Arbor Technology Corp.

2/2-450

Kontron

1/1-478

Avalue Technology Inc.

3/3-549

MEN Mikro Elektronik GmbH

1/1-406

AXIOMTEK CO., LTD.

1/1-456

1/1-181

Concurrent Technologies PLC

1/1-519

Mitsubishi Electric TOKKI Systems Corporation

congatec AG

1/1-358

National Instruments

4/4-108

Connect Tech Inc.

1/1-430

nVent, Schroff GmbH

3/3-311

Data Modul AG

1/1-234

OpenSystems Media

3A/3A-528

DFI Inc.

1/1-521

Polyrack Electronic-Aufbausysteme GmbH

3/3-349

Ecrin Systems

2/2-449

Portwell, Inc.

2/2-340

EKF Elektronik GmbH

1/1-660

Qualcomm Incorporated

4A/4A-330

Elma Electronic Inc.

1/1-655

Samtec

4A/4A-240

ENGICAM srl

3/3-219

SECO SpA

1/1-330

ept GmbH

3/3-510

TQ-Systems GmbH

1/1-578

esd electronics gmbh

2/2-640

VersaLogic Corp.

3/3-257

Eurotech S.p.A.

3/3-529

Yamaichi Electronics

3/3-301

FASTWEL Group Co. Ltd.

1/1-512

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| Spring 2019 | PICMG Systems & Technology Resource Guide

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19foPr free admission 2erw e-code You

ucher

orld.de / vo

-w embedded

Nürnberg, Germany

February 26 – 28, 2019

TODAY, TOMORROW, AND BEYOND Your one-stop resource for the entire spectrum of embedded systems: discover more than 1,000 companies and get inspired by the latest trends and product developments, by renowned speakers and exciting shows.

Keep up to date:

embedded-world.de Media partners

Exhibition organizer NürnbergMesse GmbH T +49 9 11 86 06-49 12 Fachmedium der Automatisierungstechnik

F +49 9 11 86 06-49 13 visitorservice@nuernbergmesse.de Conference organizer WEKA FACHMEDIEN GmbH T +49 89 2 55 56-13 49 F +49 89 2 55 56-03 49 info@embedded-world.eu

Technology Focus

Leveraging COM Express for medical equipment design

By Patrick Lee Modern-day medical applications have a wide spectrum of needs, from the demanding computing requirements of optical imaging technologies – such as magnetic resonance imaging (MRI), optical coherence tomography (OCT), X-ray computed tomography (CT), computed axial tomography (CAT) scans, and 3D ultrasounds – to the compact form factor and low power consumption necessary for mobile diagnostic equipment.

As needs vary drastically from application to application, medical equipment designers can benefit from the scalable architecture and flexibility of Computer-onModule (COM) Express systems. With COM Express (COMe), equipment designers can directly deploy the COM onto their I/O boards as ready-made components. Since medical applications also deal with human life, the equipment deployed also requires the highest safety and reliability standards.

There are a number of key factors medical-equipment designers need to consider when developing solutions for a wide variety of application requirements – how do the agility and reliability of COM Express systems address these concerns?

Considerations for designing medical equipment Although patients may only see the scanners doctors use to capture diagnostic data, transforming detailed X-rays and images scanned from these complex imaging ­systems into actionable information to diagnose and treat patient illnesses requires substantial processing power. Of course, not all medical applications require the same level of computing performance. In fact, some equipment – such as endoscopes, computer-assisted surgical equipment, and other devices – are designed to be operated by a skilled physician and require portability over computing prowess. What factors

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should medical-equipment designers consider when developing solutions for such a wide range of applications?

All-in-one design versus ready-made embedded systems In the past, medical equipment designers would use custom-built all-in-one motherboards. Designers would choose a microprocessor or microcontroller chip, design the supporting circuitry around the chip, and add any specialized inputs and outputs (I/O) required by the particular application. An all-in-one design gave designers a great deal of control over exactly what features were included in the final design. Every part of the circuit in a fully customized design is there for a reason specific to the end www.picmg.mil-embedded.com

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Figure 1 | Optical-imaging technologies – which have helped doctors to diagnose innumerable conditions and save countless lives – have demanding computing requirements. (Image courtesy Arbor Technologies.)

COMe Module

COMe Module LVDS

LVDS

VGA

GPU

VGA

DVI

GPU

HDMI DP/eDP

Discrete GPU

x16 PCIe

Memory

Data Acquisition Modules

x8 PCIe

CPU

Memory

Memory

High Level Medical Imaging

› application. However, fully customized designs can take substantial time to get from the drawing board to the market.

COMe solutions, in contrast, provide a more modular alternative to traditional all-in-one motherboards. When choosing a COMe solution to integrate with their own I/O boards, equipment designers can increase the speed of product design and improve time-tomarket efficiency. Since COMe systems can easily integrate with 80 percent of I/O boards, equipment designers are free to focus on the I/O board design without having to worry about the x86 architecture of the chip. By selecting ready-made COMe and deploying it on a customized I/O board for a particular customer, medical equipment designers can focus on their core competency in designing the I/O board to fit the needs of target applications. By enabling equipment designers to add different www.picmg.mil-embedded.com

DP/eDP

CPU

PCH

SATA USB

DVI HDMI

Data Acquisition Modules

x8 PCIe

PCH

SATA USB

Mid to Entry Level Medical Imaging

Figure 2 | Systems suggested for high-level medical imaging (left) and mid- to entry-level medical imaging (right).

components to an I/O board to support additional functionality, COMe provides additional design flexibility.

Form factors and performance requirements for a range of applications Equipment designers also need to take form factor into consideration when designing for medical applications. Advancements in optical-imaging technologies have helped doctors to diagnose innumerable conditions and save countless lives. However, these technologies also have demanding – and growing – computing requirements. For complex imaging applications such as these, COM Express Basic & Compact modules offer highly scalable computing and graphics performance that enable equipment designers to create application-ready, widely usable product families. (Figure 1.)

If the application requires mobility over processing power, the small size and low energy consumption of COM Express Mini modules provide the perfect fit for nextgeneration ultra-compact portable medical devices. These devices require con­ siderably less processing power than large-scale MRI machines or other medical imaging technologies.

Consequently, medical equipment designers also need to match computing performance to the target medical application needs. Although entry-level CPUs are ­sufficient and help reduce power consumption for portable equipment, complex imaging technologies generally require high-end CPUs with greater processing power.

For example, producing high-quality images from MRI, OT, CT, and CAT scans for doctors to properly identify anomalies in their patients requires higher computing performance or even a discrete GPU to process massive amounts of data at high Spring 2019 | PICMG Systems & Technology Resource Guide |

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Technology Focus speeds. What’s more, doctors may even use a number of different medical diagnostic software and hardware that require additional processing capacity across heterogeneous platforms.

To address these concerns, medical designers may select COM Express systems that support Open Computing Language (OpenCL) or Open Graphics Library (OpenGL) platforms to provide performance enhancements for medical applications. As the names suggest, OpenCL and OpenGL are royalty-free standards that allow designers to develop parallel processing software that is compatible with CPUs, GPUs, digital signal processing (DSP) units, and field-programmable gate arrays (FPGAs) from many different manufacturers. Alternatively, designers may also choose to use a discrete GPU, such as Nvidia’s CUDA platform to achieve accelerated image processing.

(Figure 2.)

Join the PICMG IIoT Specification Effort Plug & Play Interoperability at the Sensor Domain

Be a part of the PICMG IIoT open specification effort to bring true plug-and-play interoperability to the “last foot” of the network. With our low-fee model, companies large and small can work with thought innovators on the leading edge of technology.

Join PICMG today!

www.picmg.org

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Critical medical concerns Since doctors rely on the devices and applications developed by medical equipment designers to diagnose and treat life-threatening illnesses, medical applications understandably have a unique demand for the highest product safety and reliability standards that comply with strict regulations. In particular, ISO-13485 dictates the global quality standards for designing and manufacturing medical devices and should be an expectation for any medical equipment designer to meet.

Besides compliance with medical regulatory requirements, equipment designers must also deliver uncompromised system reliability, expertise, and product longevity of typically seven years. After all, pieces of medical equipment are both instrumental tools that cannot be easily replaced as well as substantial financial investments for hospitals and clinics. Moreover, the long amount of time required to obtain approval for devices that operate in critical environments, especially those involving human lives, from the U.S. Food and Drug Administration and regulatory bodies in other jurisdictions necessitates aboveaverage device reliability.

Designing for medical applications Engineers designing equipment for use in medical applications must meet unique demands and needs of the medical sector. One of these is the ISO-13485 standard, which requires that products meet the requisite quality standards for medical devices used in critical environments involving human life.

Also important: Equipment that is ISO14971 certified to effectively ensure the safety of medical devices during the entire product lifecycle. In fact, the nine-part ISO-14971 standard is even more rigorous than the ISO-13485 standard, covering risk analysis, evaluation, control, management, and comprehen­sive procedures for reviewing and monitoring during production and post-production. Arbor’s medical-grade COMe modules offer longevity well beyond the industry standard, providing 10- or even 15-year life cycle support for selected modules. www.picmg.mil-embedded.com

Platform

Intel 2nd thru 7th generation core processors

AMD G-Series

AMD R-Series

Performance

Entry- to high-level computing

Optimized for power efficiency

Optimized for performance

... MEDICAL APPLICATIONS UNDERSTANDABLY HAVE A UNIQUE DEMAND FOR THE HIGHEST PRODUCT SAFETY AND RELIABILITY STANDARDS

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Table 1 | Platforms and their expected performance optimization.

THAT COMPLY WITH STRICT

Form Factor

Mini Type

Compact Type

Basic Type

REGULATIONS.

Size

84 by 55 mm

95 by 95 mm

125 by 95 mm

Available modules

EmNANO series

EmETXe series

EmETXe series

Complete computing requirements Arbor’s COM Express modules support Intel 2nd, 3rd, 4th, 5th, 6th, and 7th-generation core processors, as well as AMD’s G-series & R-series platforms. (Table 1.)

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Table 2 | Module form factors and sizes for deployment.

Selectable form factors Arbor modules are available in several form factors for agile deployment. (Table 2.)

Designing for peak medical efficiency, safety Medical equipment designers have a lot on their plate when it comes to developing lifesaving solutions for doctors and healthcare providers. COM Express modules offer an efficient and highly effective solution that addresses the key factors equipment designers need to consider when developing equipment for medical applications. Ready-made COM Express modules enable faster time to market while still offering sufficient flexibility for designers to customize I/O board designs for a broad spectrum of highly specialized applications, from optical imaging to portable diagnostics. Embedded COM systems are also available in multiple form factors and support a wide range of computing performance requirements. COM Express solutions must meet the rigorous regulatory requirements for medical devices, thereby ensuring uncompromised product reliability and safety. From highly portable medical equipment to advanced MRI, OT, CT, and CAT scan machines, COMe modules are agile enough for any I/O board used in cutting-edge medical applications.

Patrick Lee is Embedded Computer Division Director for Arbor Technology.

Arbor Technology www.arbor-technology.com www.picmg.mil-embedded.com

Proven COTS

Building Blocks

Elma’s small form factor line combines the latest CPUs with the application I/O you need. COTS building blocks enable reliable systems that perform in the toughest environments and offer high levels configurability.

With you at every stage!

Elma Electronic Inc.

elma.com

Spring 2019 | PICMG Systems & Technology Resource Guide |

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Technology Focus

Next-generation backplane production technology

By Gary Routledge

Next-generation data rates are placing higher demands on backplane design, assembly, and test. New production techniques are required to deal with these evolving data-rate realities.

A new generation of high-speed protocols are here, with the next generations already on the horizon. The exciting world of high speed has arrived; before we know it, today’s technology will be superseded.

The next generation of PCIe, Ethernet, and Infiniband, to name a few, will add more complexities to the signal channel.

We are seeing data rates increase exponentially. The “evolution of backplanes” has begun.

What is changing as backplanes evolve, and what are the challenges seen during this evolution? There are obvious upgrades required for the hardware and we must also gain new understanding of the high-speed channel, but we must also consider the production and test environment, which consists of connector technology, engineering knowledge, PCB materials and fabrication,

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simulation capabilities, automated production and assembly test, and productionlevel signal-integrity testing.

Signal integrity: Not the end of the road We all understand that connectors and PCB materials need upgrading, along with engineering knowledge and expertise, to design at high speeds. PCB fabrication is also a challenge due to backdrills, aspect ratios, copper roughness, tolerances, and impedance control.

Signal integrity is an essential discipline required to define the parameters of the channel for performance at high speed; as such, a huge amount of time and effort is spent on signal integrity, quite understandably. But what’s next, when the new generation of PICMG products are in production? Our 30 years of experience in backplane design and assembly tells us that the production of high-speed backplanes is as important as signal integrity to ensure that all the engineering work is not undone during the production phase of the backplane.

Higher data rates require smaller compliant pins and via holes. New connectors include compliant pins as short as 1.10 mm, pressed into a 0.37 mm plated hole. This size shrink puts the emphasis on ensuring these pins are assembled correctly and do not compromise the signal. (Figure 1.)

The assembly technology of yesterday will struggle to process the new generation of compliant pins because of the use of manual-press machines and limited test

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›

technologies. Designers need to have 100 percent confidence that all compliant pins are correctly positioned in the via hole. This is the challenge for the new production environment.

The importance of production and test The final stage of ensuring that the backplane will function and perform as designed is the production and test phase. Days, weeks, and months of engineering, signal-integrity simulations, PCB design, and post simulation are spent tuning the PCB design for optimal performance. Even so, months of engineering work can be quickly undone if the connector pin is not inserted into the PCB hole correctly.

With hundreds of pins in a connector pin field, how can we detect one bent pin if we cannot physically see it? A pin that is not inserted correctly can cause a system failure, which needs to be detected and fixed before the backplane leaves the production environment. (Figure 2.) www.picmg.mil-embedded.com

Figure 1 | Higher data rates require smaller compliant pins and via holes.

Bent pins and the signal The smallest variance in design and production can have the biggest impact on performance at high data rates. A production-induced fault, or bent pin, will have clear effects on the signal including, but not limited to, impedance drop, insertion loss, return loss, and mode conversion. (Figure 3.)

The effects of a bent pin are not only limited to the immediate effect on the signal. What happens over time if the bent pin is undetected? PICMGcompliant systems are often deployed in the harshest of environments. In these high-stakes environments there is the risk that a bad pin can, over time, cause damage to the connector and PCB due to shock and vibration. This situation can cause wear on the protective surface of the PCB and potentially short to another copper feature, or the pin could break away from the connector and become a floating object that could cause a short between two other compliant pins.

Enabling the evolution of technology Engineers, connector vendors, and PCB vendors have all stepped up and provided a path to higher data rates. The last link in the chain to ensuring that systems make the successful evolution into the next generation of products is the production environment. The

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Figure 2 | X-ray image of bent compliant pins.

investment and infrastructure must be in place to facilitate the production.

What equipment and processes do we need to be able to successfully assemble next generation backplanes? How do we process the backplane to ensure the integrity of the new generation of compliant pin? Unless you have visited a dedicated backplane production facility that is capable of producing backplanes up to 56G PAM4, then you might be surprised by the technologies involved.

These include light-assisted connector placement, prepress-compliant pin engagement, automatic connector press machines, automatic pin scan optical inspection, automatic 100 percent X-ray inspection and signal-integrity testing, automatic electrical test, hi-pot power testing, and quality assurance by onsite signal-integrity specialists. (Figure 4.)

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Technology Focus The use of automated press machines enables designers to program the machine to recognize anomalies during the press process. Each connector has a set profile and an expected force to correctly press the connector. If the recorded force during assembly differs from the profile, then the assembly is flagged and inspected for any potential bent pins.

through the production environment. This process often starts at the early stages of a project when signal-integrity simulation is complete and PCB layout begins:

Consider production from the very start In addition to the equipment, there is also the expertise and knowledge required to introduce a product into and

As an example, to avoid plating knee within the plated hole for the compliant pin, it is recommended that the drill process should always be from the press-fit side of the PCB to ensure clean entry of the compliant pin into the plated hole. Clear instructions must be given to the PCB fabricator to control the integrity of the plated hole. They do not know what the hole is used for or the data rate of the PCB.

›› ›› ›› ›› ›› ››

Design for Manufacture Design for Assembly Design for Test FAE product support.

Detailed and concise PCB manufacturing instructions.

PCB fabricator control – correct drill size and plating, the correct drilling processes, predrill and multipeck drilling, hole T/P, and backdrill stub control.

Figure 3A

Figure 3B

Figure 3C

Figure 3D

› 14

Figure 3 | Small variances, such as bent pins, will have large effects on performance at high data rates. | Spring 2019 | PICMG Systems & Technology Resource Guide

www.picmg.mil-embedded.com

Regular audits and spot checks should be performed with PCB vendors to ensure quality is maintained and will not adversely affect the signal.

There is a huge amount of expertise and knowledge required to process high-speed backplanes. We see identical comparisons to our experiences during the years of

evolution in the IT/datacom markets where data rates also increased exponentially. All the engineering and production expertise, equipment, and infrastructure invested to facilitate the IT/datacom evolution are now required to successfully produce PICMG-compliant backplanes and products.

Production and test are often the forgotten links in the chain to ensure signal integrity. Any chain is only as strong as the weakest link. Let’s not forget the importance of production – a vital link in the evolution of technology.

Gary Routledge is Engineering Manager, EMEA & APAC, for Amphenol Backplane and Systems Integration.

›

Figure 4 | 100 percent production-level signal-integrity testing on every signal can identify missing or incorrect backdrills in the PCB that are otherwise invisible. Such testing will identify and eliminate PCB fabrication faults that otherwise go undetected.

Amphenol www.amphenol-bsi.com

Verotec Integrated Packaging • Ph: 603.821.9921 • sales@verotec.us • www.verotec.us 19”DIPLOMAT AND VEROTEC CASES Stylish desktop cases for 19” systems

19” RACK CASES

Standard Veroshield EMC screened and IP sealed Eurocard mounting

INTEGRATED SYSTEMS

Horizontal and vertical board mounting 19” Rack Mount and Desktop Systems TecSYS ‘Ready to Run’ Development Systems

CARD CAGES AND COMPONENTS

DIN41494 and IEC60297 general purpose IEEE1101.10/11 for cPCI , VPX, VME64x, PXI etc.

MIL-STD-167 IEEE1101.10/11 for rugged applications

BACKPLANES AND EXTENDERS

VME, VME64x, VXI. OpenVPX, cPCI and PXI Custom Design Capability

PLUGGABLE PSU

THERMAL SOLUTIONS

Intelligent, ltered and standard 19” 1U fan trays

20 - 240W General Purpose 200 - 600W PICMG 2.11

Instrument Cases • Card Cages • Integrated Systems • 19” Fan Trays Backplanes and Extenders • Rack Cases • Pluggable PSU

TecServ + Modication Services

Continuing 50 years of excellence in functional and elegant electronic packaging

E L E C T R O N I C S PA C K A G I N G

Standard, modied and custom products and systems to meet specic requirements www.picmg.mil-embedded.com

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Application Feature

High-energy physics: Controllers for X-ray laser accelerators

By Heiko Koerte and Vollrath Dirksen

DESY (Deutsches Elektronen-Synchrotron) – one of the world’s leading particle-accelerator centers, conducting top-level international research into the fundamental relationships of matter – was tasked with finding a successor technology for its control and data-acquisition systems, which were based on VME and proprietary hardware, some of which was more than 30 years old. The main requirements: better signal quality, higher bandwidth, and support for several decades of operation, allowing for a phased migration in current installations.

The chosen technology also had to act as the platform for the new X-Ray Free-Electron Laser (XFEL) accelerator (www.xfel.eu); DESY is the main shareholder in the European XFEL, which will generate ultrashort X-ray flashes – 27,000 times per second – with a brilliance that is a billion times higher than that of the best conventional X-ray radiation sources.

The facility, the only one of its kind in the world, opens completely new research opportunities for scientists and industrial users. As the main shareholder, DESY plays a major part in the construction and operation of the facility.

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From the beginning, N.A.T. worked with DESY’s engineering team and the ecosystem of MicroTCA companies to enhance the MTCA.0 standard for the physics community’s additional requirement. The MTCA.4 standard allows users to build solutions – scaling from small to large high-performance systems – ranging from single-unit installations to large installations of more than 200 crates with a timing synchronization in the picosecond range.

Engineers conducted rigorous benchmarking of various technologies – such as AdvancedTCA, VXI, VPX, and MicroTCA. MicroTCA.4 technology, with up to 20 systems per project, was successfully tested in existing installations and a newer FLASH-II accelerator. The experiences and results exceeded DESY’s expectations, thereby paving the way for the installation at the European XFEL. Assembly of this facility was completed at the end of 2016. Starting in the summer of 2017, scientists from around the world were able to use two out of the six initial planned scientific instruments for the intermediate term. The accelerator is now operating at a temperature of -271 °C

| Spring 2019 | PICMG Systems & Technology Resource Guide

www.picmg.mil-embedded.com

and generates extremely bright and short X-ray flashes with laser-like properties in a self-amplifying process.

Why build it?

The technology DESY has used for highspeed, high-performance control of the beams in its accelerators, including PETRA and FLASH, were no longer state-of-theart and suitable for the next generation of accelerators. In the year 2005, several task forces for different experimental projects had to define the requirements and find a new technology as a successor for the VMEbus and as a replacement for some of DESY’s proprietary hardware.

In the years after 2005, there were two major trends in embedded systems: One was to integrate high-speed serial interfaces with existing parallel bus architectures, offering backwards compatibility and forming new standards, such as VXS, CPSB, and CPCI-Serial. Another trend was to cut ties with existing architectures and ignore backwards compatibility. Instead, some companies adopted the latest high-speed serial interfaces (VPX technology is an example), while some standards organizations combined the latest switching interfaces with additional features, such as standardized management hardware and software.

The standards emerging from these efforts are AdvancedTCA (ATCA) and MicroTCA (MTCA).

These trends made it very difficult to select the right technology, as no single standard could fulfill all the requirements of high-energy physics users. Moreover, in the early days it was unclear which new standard would be accepted in which market and have the longevity that research scientists needed.

Standards challenge The new technology needed to have the same advantages as the VMEbus, including robustness, modularity, scalability, suitability for 19-inch rack mounting, and long life cycle support; it also had to overcome the limitations of using a technology that is more than 30 years old. In addition, the functionality of DESY’s own proprietary hardware had to be considered. www.picmg.mil-embedded.com

Among the requirements: ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› ››

Open standard 19-inch-rack suitable Modular and scalable Very small individual systems, very large system installations Multiple sources for all components A viable merchant market – ecosystem of industrial partners Acceptance of the technology outside of the physics market Availability and long-term support of operating systems Bus bandwidth should be improved by a factor of 10 An evolution path to increase the bandwidth further in the future Use the latest high-speed interconnect technology Improvement of signal quality in the system to increase the resolution of the ADC/DAC conversion Higher-precision timing system to fulfill the high-precision synchronization demands of a picosecond range Availability of different footprints Better remote control and monitoring, as the installations are in tunnels with no direct local access during operation Trigger and interlock bus integrated in the backplane Integrated high-precision (picosecond range) clock distribution Better cabling management; rear cabling via rear transition modules Reduction in plugging and unplugging cables (a major source of system failures) Faster and more reliable board replacement Some cables are sensitive to motion, such as RF cables Hot-plug support Redundant power and cooling Support for redundancy of all components, but without adding costs if not implemented

Finding a solution Between 2009 and 2011, DESY and N.A.T. worked with the MicroTCA ecosystem through the PICMG standards organization to extend the trigger and clock signals in the Zone 1 connector of the MTCA standard. In 2011 the MTCA.4 standard, an evolution of the MTCA.0 standard, was ratified by PICMG to address the requirements of the physics community. The MTCA.4 standard adds rear transition module support and special trigger and low-latency clock distribution buses to the MTCA standard and increases the number of power modules slots from two to four.

During this time, the embedded computing ecosystem developed ATCA boards, AMC modules and RTMs, and built systems based on ATCA and MTCA for meticulous benchmarking. Comparing the signal quality, flexibility, system price, and the availability of commercial off-the-shelf (COTS) products, many physics researchers made the MTCA.4 platform their selected platform technology. It was chosen for accelerators and experiments inside DESY, as well as other Helmholtz institutes in Germany and worldwide in nearly all new low-level RF applications.

Following are several examples of where the MTCA.4 platform was tested intensively and successfully: Example 1: FLASH – FLASH is a free-electron laser at DESY, which was commissioned in 2004 and has been used for research with shortwave ultraviolet and soft X-ray radiation since 2005. The facility is 260 meters long and generates soft X-ray radiation down to a wavelength of four nanometers (billionths of a meter). Until 2009, FLASH was the only free-electron laser in the world to produce radiation in the soft X-ray region.

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Application Feature FLASH I uses MTCA.0 platforms as a replacement for some of its VMEbus systems to compare both technologies.

FLASH I was subsequently extended with FLASH II, which uses mainly MTCA.4 systems with the new timing capabilities.

Major parts of the FLASH installation are based now on MTCA.4 platforms and run without disruption, proving the reliability and signal quality and paving the way to next big installation: XFEL. Example 2: European XFEL – FLASH is a small version of the European XFEL, which is already producing laser flashes for science. The facilities differ mainly in the wavelengths of the light flashes generated. The new European XFEL light source was commissioned and built exclusively using MTCA.4 technology.

(Figure 1.)

MTCA.4 systems are used as couplerinterlock master and slave, low-level RF master and slave, diagnostics, experiment readout, vacuum, and magnets.

The tunnel, with a length of 3.4 kilometers, is equipped with more than 200 MTCA.4 systems, most of which are 9U high, 19 inches, wide and contain 12 slots (similar to NATIVE-R9); some are 2U high with 6 slots. The MicroTCA controller hubs (MCHs) are a combination of NAT-MCH-PHYS and NAT-MCH-PHYS80 models with their respective rear transition module (RTM) NAT-MCH-RTM, providing remote and local system control and management, GbE and PCI Express non-blocking switches, and lowlatency clock distribution.

Each system contains one or two redundant 1,000-watt power supplies with the potential to upgrade to four of N.A.T’s new NAT-PM-AC1000 units to provide double the power; an Intel processor AMC module with two local SSDs, with an upgrade path to the NAT-MCH-COMex-i7, potentially releasing an AMC slot. The system also contains an NAMC-psTimer, with picosecond timing accuracy; a machine-protection AMC (DAMC-02); a data intercommunication AMC (DAMC-TCK7, with the NAMC-TCK7 as second source); and data-acquisition ADC and DACs, Ethernet switches, digital IO, and other modules from the MicroTCA ecosystem.

XFEL and beyond Besides being used for research in its own right, FLASH also serves as a pilot facility for the European XFEL. Its operation provides major insights that benefit the European XFEL, which will generate even shorter wavelengths down to one-tenth of a nanometer. At the same time, scientists can use the FLASH facility to continue development for the planned International Linear Collider (ILC) for particle physics. (Table 1.)

MTCA.4 is the ideal standard for a project of the size of XFEL but also for smaller installations. Reusing the same components, even in small systems with only two

European XFEL

FLASH

Abbreviation for

European X-ray Free-Electron Laser

Free-Electron Laser in Hamburg

Start of commissioning

2016

2004

Length of the accelerator

1.7 kilometres

0.15 kilometres

x11

Length of the facility

3.4 kilometres

0.3 kilometres

x11

Number of accelerator modules

100

7

x14

Maximum electron energy

17.5 billion electron volts (17.5 GeV)

1 billion electron volts (1 GeV)

17.5

Maximum wavelength of the laser light

0.05 nanometre (of the order of an atom)

4.1 nanometre (of the order of an atom)

x1/82

Number of undulators (magnet structures for light generation)

3, upgradeable to 5

1

Number of experiment stations

6, upgradeable to 10

5

Location

Hamburg and Schenefelt

Hamburg

Operator

European XFEL GmbH

DESY

› 18

x2

Table 1 | Comparison of European XFEL and FLASH facilities.

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www.picmg.mil-embedded.com

›

Figure 1 | View into the 2.1-kilometer long accelerator tunnel of European XFEL with the yellow superconducting accelerator modules hanging from the ceiling (photo: DESY/D. Nölle).

boards, can be implemented cost-effectively reducing maintenance costs by having a single technology for multiple applications.

DESY is drawing up plans for PETRA IV, upgrading PETRA III to become an extremely narrowly focused, high-resolution 3D X-ray microscope, offering outstanding research prospects for cutting-edge nanoscience and materials science. When completed, it will allow scientists to examine the physical and chemical processes taking place inside materials on all scales – from millimeters through to atomic dimensions.

The PETRA III X-ray source already produces highly focused, brilliant X-ray beams, which are extremely good at penetrating matter. A key parameter for this is the socalled emittance, a measure of the cross-section and concentration of a particle beam inside an accelerator. The smaller the emittance, the better. The planned modifications associated with PETRA IV will drastically reduce the emittance even further, by up to two orders of magnitude. MicroTCA.4 will be part of that success.

Heiko Koerte – who has been with N.A.T. for nearly 26 years – is responsible for N.A.T’s worldwide sales and marketing activities. Prior to being appointed VP and Director, Sales & Marketing, in 2000, he led software development at N.A.T. for over eight years. Heiko is still involved in the definition of all strategic hardware and software products at N.A.T. He holds a diploma degree in physics from Bonn University (Bonn, Germany). Reach Heiko at heiko.koerte@nateurope.com.

Vollrath Dirksen is Strategic Business Development Manager for N.A.T. He was part of the MTCA.4 and MTCA.4.1 standardization work group for PICMG and runs frequent MTCA trainings at N.A.T., DESY MicroTCA Technology Lab, and customer sites. Before joining N.A.T. in 2007, Vollrath worked as Key Account Manager and Senior Channel Manager at Motorola Embedded Communications Computing and Blue Wave Systems in the telecom, industrial, defense, and medical markets. He holds a diploma degree in Telecommunication and Electrical Engineering from Jade University of Applied Sciences (Wilhelmshaven, Germany).

Readers may email him at vollrath@nateurope.com.

N.A.T. www.nateurope.com www.picmg.mil-embedded.com

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

Thousands of PICMG-compliant products, ranging from components and subsystems to complete applicationready systems, are commercially available, representing more than $5 billion yearly in global revenue.

PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications, military, industrial, and general-purpose embedded computing applications.

Founded in 1994, the group has more than 250 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, singleboard computer design, very-high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management.

Key standards families developed by PICMG include CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, and HPM (Hardware Platform Management). In its more than two decades of operation, PICMG has published over 50 specifications developed by participants from hundreds of companies. Work on standards across a wide range of markets, applications, and technologies continues as the boundaries of datacom, telecom, military and aerospace, industrial, man/machine interface applications, and deeply embedded computing continue to blur.

Equipment built to PICMG standards is used worldwide, with any company allowed to build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules).

A rigorous intellectual property (IP) policy ensures early discovery of any memberowned IP; moreover, all members must agree to “reasonable and non-discriminatory” (RAND) licensing of any IP written into a standard. To date, no PICMG standard requires any license or royalty to build or operate.

PICMG adheres to a formal, multistep development process. Development work can be periodically be reviewed by all member companies, although work inside of a technical subcommittee is confidential to the members of that committee until that work

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is ready for broader review by other members. Until a specification or standards-related document is ratified by the entire membership, it is confidential to PICMG. After ratification, all documents are available to the general public.

Why use PICMG standards?

PICMG standards – because the organization has such a large number of contributing companies – reflect the extremely wide and deep technical capabilities of its members. By using well-understood and proven open standards, vendors can bring products to market quickly. Customers gain from the price and performance competition that results from many vendors operating in an open marketplace.

Thousands of PICMG standards-­compliant products – ranging from components and subsystems to complete applicationready systems – are commercially available, representing more than $5 billion per year in global revenue.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org. www.picmg.mil-embedded.com

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

OPEN MODULAR COMPUTING STANDARDS There are nine distinct “families” of PICMG standards. Many have subsidiary specifications that are designed to add additional capability.

Please visit www.picmg.org/openstandards/ to learn more about each one. ›› Advanced TCA: This high-performance modular standard, also called ATCA, was developed for critical central-office telecommunications applications and is also used for a wide range of commercial and military applications. It offers a complete management infrastructure so that high-availability systems with “six nines” reliability can be deployed. ›› CompactPCI: A modular general-purpose computing system based on 3U and 6U Eurocard mechanical standards, it features hot-swap capability and can be either convection- or conduction-cooled. With hundreds of thousands of installations worldwide, this popular architecture is one of the most successful and popular standards in use today. ›› COM Express: This small-form-factor (SFF) standard is designed for deeply embedded applications where space is at a premium but high performance is required. COM Express boards can be used as standalones or plugged onto an application-specific baseboard with I/O expansion. ›› MicroTCA: Often called “AdvancedTCA’s little brother,” MicroTCA is a modular platform for building smaller and lessexpensive systems that AdvancedTCA while retaining the high-availability architecture of AdvancedTCA. MicroTCA systems use AMC modules as their basic computing and I/O building blocks. ›› Advanced MC: This standard defines a family of small, hot-swappable, and fully managed mezzanine cards that can be used to tailor I/O for large AdvancedTCA systems or used as the basis for building MicroTCA systems. They are commonly called “AMCs.” ›› CompactPCI Serial: This relatively new standard uses CompactPCI’s mechanical structure but updates the system interconnects to include PCI Express, Ethernet, SATA, and USB. It offers 20 to 40 times the backplane bandwidth of CompactPCI and is ideal for new applications or upgrades to older systems. ›› SHB Express: This upgrade to the PCI-ISA standard replaces parallel PCI interconnects with serial PCI Express lanes, improving performance and increasing compute power. A passive backplane is used, and standard desktop PCI Express cards can be used for I/O customization. ›› Hardware Platform Management: Also known as “HPM,” this software standard defines how to build fully managed, high-availability AdvancedTCA or MicroTCA systems. It is the first, and currently the only, open standard for system management. ›› PCI-ISA: PICMG’s first open standard, PCI-ISA is used to build rugged, reliable, and maintainable computers that are designed to replace desktop PCs in industrial-control communications or data-acquisition applications. The PCI-ISA standard moves all of the active circuitry normally found on a motherboard to an easily replaceable and upgradable plug-in card.

While standard PC cards plug into other slots to customize a system, a PCI-ISA system uses a passive backplane consisting of connectors with no active components. ›› New standards and under development: The cPCI Serial Space specification, a ruggedized version of CompactPCI Serial that specifically addresses the extreme environment requirements for outer space, was ratified in August 2017.

In addition, PICMG is working with members and advisory board industry leaders to develop the elements for an IIoT [industrial Internet of Things] specification. New standards arise when members identify the need to create a new embedded computing standard for a particular market or application. www.picmg.mil-embedded.com

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

THE VALUE OF OPEN STANDARDS What makes PICMG a leading standards organization?

PICMG has more than 250 member companies, all of which combine to bring an extremely wide and deep talent base to the table.

Unlike some other consortia, PICMG is not controlled by one or a few companies: It is governed by the Executive Members that work together to ratify processes and procedures, elect officers, and approve budgets. PICMG maintains a “one company-one vote” policy, which means that no single company can dominate the standards-development process.

Over the last several decades, open standards have become increasingly important for a wide range of embedded and specialized computer applications, both big and small. While the definition of “open standard” can vary, for the embedded computer world it usually means a succinct definition of everything a vendor needs to know to build equipment and write software that will work with compatible products offered by other vendors.

In an organization like PICMG, all players, whether large or small, can take an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They also can meet experts in a wide range of engineering disciplines.

PICMG also has an outstanding intellectual property (IP) policy that ensures that members must submit IP declarations throughout the standards-development process, where they can be accepted for use or rejected. To date, no PICMG standard or specification has required any user licenses or royalties. Moreover, anyone can build equipment in accordance with or use PICMG standards whether they are members or not. PICMG is truly an open organization. Dues are low: In fact, the cost of a yearly Executive membership has not changed in 20 years.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

JOINING PICMG Why join PICMG? By joining an organization like PICMG, anyone can play an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They come to know experts in a wide range of engineering disciplines. The groups that develop these open standards do so because they are interested in getting something done in a finite amount of time; whenever possible, bureaucracy and politics are kept to a minimum. Members of these development groups have a common goal: To create standards that are widely used and that each company involved can make money from. Companies can specialize in their areas of expertise without needing to be good at everything. In addition to technical collaboration, business collaborations often evolve in a symbiotic way.

Companies that participate in standards development also have a very important advantage: They are already up to speed when the standard is released and can thus be first to market with compliant and leading-edge products.

In its 20-plus years of operation, PICMG has published almost 50 open industry specifications that encompass nine basic standards families developed by participants from hundreds of companies. The Consortium plans to continue its work across a wide range of technologies. Member companies of PICMG have some big plans for the next decade, as designers in the data communications, telecommunications, industrial, and military/aerospace arenas embed technology ever more deeply into specialized and everyday products.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

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www.picmg.mil-embedded.com

LIST OF PICMG EXECUTIVE MEMBERS ADLINK Technology Inc. www.adlinktech.com

Mercury Systems, Inc. www.mrcy.com

Advantech Co., LTD www.advantech.com

MSC Technologies GmbH www.msc-technologies.eu

Airbus Defence & Space www.airbusdefenceandspace.com

N.A.T. GmbH www.nateurope.com

Amphenol www.amphenol.com

National Instruments www.ni.com

Artesyn Embedded Technologies www.artesyn.com

North Atlantic Industries www.naii.com

BAE Systems www.baesystems.com

nVent, Schroff schroff.nvent.com

congatec AG www.congatec.com

OpenSystems Media www.opensysmedia.com

DESY www.desy.de

PICMG China www.picmg.org/member/picmg-china

Elma Electronic Inc. www.elma.com

Pixus Technologies Inc. www.pixustechnologies.com

Ericsson AB www.ericsson.com

Polyrack Electronic-Aufbausysteme GmbH www.polyrack.com

European Spallation Source ERIC www.europeanspallationsource.se

Portwell, Inc. www.portwell.com

Eurotech S.p.A. www.eurotech.com

Prodrive B.V. prodrive-technologies.com

Extreme Engineering Solutions www.xes-inc.com

RECAB recab.com

Fivetech Technology Inc. www.fivetk.com

RTD Embedded Technologies, Inc. www.rtd.com

Fraunhofer FOKUS www.fokus.fraunhofer.de

Samtec www.samtec.com

Fujitsu Limited www.fujitsu.com

Sanritz Automation Co., Ltd. www.sanritz.co/jp

General Micro Systems Inc. www.gms4sbc.com

SECO SpA www.seco.it

HEITEC AG www.heitec.de

Simonson Technology Services www.simonsontech.net

Huawei www.huawei.com/en

SLAC National Accelerator Laboratory www6.slac.stanford.edu

IN2P3-CNRS www.in2p3.fr

Southco Inc. www.southco.com

Institute of High Energy Physics http://english.ihep.cas.cn

TE Connectivity www.te.com

Intel Corporation www.intel.com

Trenton Systems, Inc. www.trentonsystems.com

Keysight Technologies www.keysight.com

VadaTech Inc. www.vadatech.com

Kontron www.kontron.com

Vectology, Inc. www.vectology.jp

Meinberg Funkuhren GmbH & Co. KG www.meinberg.de

Yamaichi Electronics www.yamaichi.com

MEN Mikro Elektronik GmbH www.menmicro.com

ZTE Corporation www.zte.com

Listings are subject to change

www.picmg.mil-embedded.com

Spring 2019 | PICMG Systems & Technology Resource Guide |

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PICMG Systems & Technology Resource Guide

COM Express

COMe T10 Carrier Hosts Four AcroPack I/O Modules The ACEX4040 carrier card allows you to quickly combine a COM Express Type 10 CPU module with a mix of I/O modules for custom computing applications. With its rugged design and compact Mini-ITX form factor, this carrier card is easily mounted in a variety of enclosures for rapid development. High-density I/O connectors and numerous ports simplify interfacing to field devices and peripherals.

Select from 25+ AcroPack® modules to install any combination of analog I/O, digital I/O, serial I/O, MIL-STD 1553, CAN, and FPGA processor functions.

FEATURES ĄĄ ĄĄ

Mini-ITX format for easy mounting COM Express Type 10 processor slot (Supports Intel® Atom® (Apollo Lake) CPU module)

ĄĄ

Four AcroPack / mini PCIe slots for field I/O

ĄĄ

Peripherals: 2x GbE RJ45, 2x USB 3.0, 2x RS232, DisplayPort

ĄĄ

Storage: M.2 80mm site, removable 2.5 SSD SATA II

ĄĄ

-40° C to +85° C extended temperature range www.acromag.com/ACEX4040

Acromag, Inc.



www.acromag.com/ACEX4040

solutions@acromag.com

 www.linkedin.com/company/acromag/

 877-295-7088 @Acromag



COM Express

COM Express with AMD Ryzen™ Embedded V1000 processors COMe-B75-CT6 is a COM Express™ Compact 3.0 Type 6 Module designed by SECO with nothing less than the AMD Ryzen™ Embedded V1000 processors. The module mounts up to 4 “Zen” x86 CPU cores with the latest Radeon™ graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, which make it an ideal solution for multiple scenarios, from medical imaging to industrial controls up to premium thin client, digital signage and communications infrastructure.

FEATURES ĄĄ AMD Ryzen™ Embedded V1000 processors ĄĄ Up to 4 cores / 8 threads with the latest Radeon™ Vega graphics

and I/O Controller on a single Chip ĄĄ Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory ĄĄ 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3 ĄĄ Scalable TDP ĄĄ Also available in industrial version (-40°C ÷ +85°C)

www.seco.com/prods/eu/category/com-expresstype-vi/come-b75-ct6.html

SECO

www.seco.com

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



sales@seco.com www.linkedin.com/company/seco-spa/

PICMG Systems & Technology Resource Guide

 +39 0575 26979 @SECO_spa



www.picmg.mil-embedded.com

MSC C6B-CFLH

MSC C7B-DV, MSC C7B-DVL

The MSC C6B-CFLH delivers scalable CPU and graphics performance ranging from Intel® Core™ Processor i3 and i5 up to i7 and Xeon. This makes it the ideal workhorse for CPU and graphics intensive tasks in medical, industrial, scientific, surveillance, traffic control, media processing and gaming applications.

The MSC C7B-DV/DVL product line is a high performance computing platform with on-chip crypto accelerator and multiple 10GbE ports. It provides industry leading performance at low power consumption and is well positioned for edge/fog computing, switching/routing, network appliances, ATE, machine learning and medical applications.

• • • • • • • • • • •

• COM Express® Type 7, Basic form-factor

COM Express® Type 6, Basic form-factor Most recent 8th Generation Intel® Core™ processor Four and six processor core options Up to 32GB DDR4 DRAM with optional ECC DisplayPort/HDMI/DVI eDP/LVDS interface options Triple independent display support, res. up to 4k 4x 6Gb/s SATA 4x USB 3.1/2.0 and 4x USB 2.0 interfaces Eight PCI Express™ x1 lanes PEG port 1x16 for connecting I/O extensions and GPU/physics accelerators • Trusted Platform Module (TPM)

• Intel Atom® C3000 processor series • From two to sixteen processor cores • Up to 48GB DDR4 DRAM with optional ECC • Crypto HW acceleration for CPU offloading • Up to four 10GbE ports • 2x 6Gb/s SATA, optional eMMC SSD • Up to 3x USB 3.0 and 4x 2.0 USB • DV provides PCIe switching for extended I/O connectivity (up to 22 PCIe lanes) • DVL comes with direct lane mapping (up to 14 PCIe gen 3 lanes) • Trusted Platform Module (TPM)

At Avnet we believe in scalability and diversity of products and we share the passion for technology with our customers.

That is why our engineers created one of the most comprehensive product portfolio of PICMG COM Express® modules.

• Intel® Core™ H & U processors series

• From single to sixteen cores

• Intel Atom® C3000 processor series

• Basic, Compact and Mini form-factor boards

• Intel Atom® processor E3900 & E3800 series

• Commercial and industrial temperature options

If you want to learn more about what is coming up next on our roadmap, join us at

Embedded World in Nuremberg, Germany, 26-28 February 2019, Booth 2-238. www.msc-technologies.eu

Avnet Integrated

avnet.com/integrated www.picmg.mil-embedded.com



infomsc@avnet.eu

 www.linkedin.com/company/avnet/

 +49 7249 910 0

 @twitter.com/Avnet

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COM Express

PICMG Systems & Technology Resource Guide

COM Express

Server-on-Modules With the launch of the COM Express Type 7 specification, the PICMG has defined a highly flexible new module standard characterized by high-speed network connectivity with up to four 10 GbE interfaces as well as an increased number of up to 32 PCIe lanes for customization.

This is a perfect basis for bringing the embedded server-class Intel® Xeon® D SoC as well as the new Intel® Atom™ processors (code name Denverton) to the industrial fields.

Developers with high-performance demands for industrial automation, storage and networking applications, modular server and base station designs for telecom carriers, as well as cloud, edge and fog servers for IoT and Industry 4.0 applications are best served with modules based on the Intel Xeon D1500 processor family, such as the conga-B7XD COM Express Type 7 Server-on-Modules from congatec.

They are available with ten different server processors soldered on the module for highest robustness, ranging from the Intel® Xeon® processor D1577 to the Intel® Pentium® processor D1519 for the industrial temperature range (-40°C to +85°C). These modules offer up to 16 cores for 32 threads and a maximum turbo frequency of up to 2.70 GHz, delivered in a low thermal envelope of only 45 Watt thermal design power (TDP) and below.

For applications that are power restricted and/or do not need the high performance per core that the Intel Xeon D1500 processors provide, the new conga-B7AC modules with Intel® Atom™ C3000 processors raise the bar for embedded edge computing through 10 GbE bandwidth support. With a power consumption of only 11 to 31 Watt TDP, the new low-power multi-core Server-on-Modules feature up to 16 cores. Compared to the Intel Xeon modules, they do not support hyper threading or turbo boost.

Both new congatec COM Express Type 7 Server-on-Modules impress by a full range of server features on a very small form factor including multiple 10 Gigabit Ethernet interfaces, 32 PCIe lanes and up to 48 gigabytes of DDR4 ECC RAM. The long-term available Server-on-Modules come application-ready, offering a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Future performance upgrades are remarkably simple and cost-efficient, as only the Server-on-Module needs to be exchanged for new processor architecture.

FEATURES ĄĄ

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High scalability from 16 Core Intel® Xeon® processor technology with 45 W TDP to low-power quad core Intel® Atom™ processors with a TDP as low as 11.5 W All Server-on-Modules support the commercial temperature (0°C to 60°C) range. Selected SKUS even offer support for the industrial temperature range (-40 °C to +85 °C) conga-B7AC with Intel Atom technology (code named Denverton) offers 4x 10 Gigabit Ethernet ports, conga-B7XD with Intel Xeon technology support 2x 10 GbE Supporting up to 48 gigabytes of fast and energy efficient 2400DDR4 (ECC or Non ECC) NC-SI Network Controller Sideband Interface support to connect a Baseboard Management Controller allowing out-of-band remote manageability Up to 32 PCIe lanes for flexible server extensions such as NVMe flash storage and/or GPGPUs Comprehensive set of standard interfaces with 2x SATA Gen3 (6 Gbs), 6x USB 3.0/2.0, LPC, SPI, I2C Bus and 2x legacy UART OS support for Linux and Microsoft Windows variants

Product Link: www.congatec.com/us/products/com-express-type7.html

congatec

www.congatec.us

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

sales-us@congatec.com www.linkedin.com/company/congatec/

PICMG Systems & Technology Resource Guide

www.congatec.us

 858-457-2600 @congatecAG



www.picmg.mil-embedded.com

CPU-161-18 COM Express Compact Type 6 – Rugged Intel Xeon D The CPU-161-18 is a COM Express module that combines a high performance, truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs: 8GB of memory soldered directly on the PCB and up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases requiring extreme ruggedness and large memory.

Configurable with any member of the Xeon/Pentium D-1500 family, it supports extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.

Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one.

Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), Eurotech’s IoT Edge Framework.

Eurotech Professional Services are available for the CPU-161-18: from BIOS personalization to carrier board design, system development and production.

Deep module customization, such as feature changes are also available.

FEATURES ĄĄ Up to 12 Cores for HPEC and Microserver-ready

Applications

ĄĄ Powerful Intel Xeon D-1500 CPU ĄĄ Hybrid RAM Architecture ĄĄ Compact Size with PCIe x16 Port ĄĄ Rugged and Fanless ĄĄ Full HW/SW Customization ĄĄ Eurotech Professional Services

www.eurotech.com/en/products/boards-modules/comexpress/cpu-161-18

Eurotech

www.eurotech.com



sales@eurotech.com

 www.linkedin.com/company/eurotech

 +39 0433 485 411 @eurotechfan



COM Express

CPU-162-23 COM Express Basic Type 7 – Rugged Intel Xeon D The CPU-162-23 brings the computational performance and RAM capacity of a server to the field. It supports extended temperature range (-40 to +85°C) and ECC memory to operate reliably in industrial and rugged applications.

The CPU-162-23 can be configured with any member of the Xeon/Pentium D-1500 family, ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECC. The CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout, delivering very high speed interfaces, like up to x32 PCIe lanes, two 10Gbps (10GBASE-KR) and one 10/100/1000Mbps Ethernet port (1000BASE-T). Other interfaces include two SATA 3.0 ports, four USB 3.0 and four USB 2.0 ports.

Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-162-23 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT Edge Gateways.

Eurotech Professional Services are available for the CPU-162-23, starting from BIOS personalization and include carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES ĄĄ Up to 16 Cores for HPEC and Microserver-ready

Applications ĄĄ Powerful Intel Xeon D-1500 CPU ĄĄ Up to 64GB ECC RAM ĄĄ 2x 10Gb Ethernet ĄĄ Rugged and Fanless Design ĄĄ Full HW/SW Customization ĄĄ Eurotech Professional Services

www.eurotech.com/en/products/boards-modules/comexpress/cpu-162-23

Eurotech

www.eurotech.com www.picmg.mil-embedded.com



sales@eurotech.com

 www.linkedin.com/company/eurotech

 +39 0433 485 411 @eurotechfan



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COM Express

PICMG Systems & Technology Resource Guide

CompactPCI

A FINE TECHNOLOGY GROUP

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

FEATURES

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hotswap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.

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Made in the USA

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Most rack accessories ship from stock

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Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

Modified ‘standards’ and customization are our specialty

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Card sizes from 3U x 160mm to 9U x 400mm

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System monitoring option (CMM)

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AC or DC power input

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Power options up to 1,200 watts

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

VISIT OUR NEW WEBSITE! WWW.VECTORELECT.COM

For more detailed product information, please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application

Made in the USA Since 1947

with a Vector representative. www.vectorelect.com

Vector Electronics & Technology, Inc. www.vectorelect.com

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inquire@vectorelect.com

 800-423-5659

PICMG Systems & Technology Resource Guide

www.picmg.mil-embedded.com

3U CompactPCI Serial Carrier Card for AcroPack® or mPCIe The ACPS3310 is a 3U CompactPCI Serial carrier card for Acromag’s AcroPack mezzanine modules. Two isolated I/O expansion slots interface AcroPack or mini PCIe modules to the PCIe bus. All connections to field signals are made through front panel connectors on the carrier board which passes them to the individual AcroPack modules.

Select from 25+ AcroPack modules to install any combination of analog I/O, digital I/O, serial I/O, communication, and FPGA processor functions. This modular approach allows the user to create a board which is customized to the application, thus saving slots and reducing costs.

FEATURES ĄĄ Two AcroPack or mini-PCIe module slots support any

combination of I/O functions

ĄĄ PCI Express Version 2.1 compliant carrier ĄĄ Compliant with PICMG CPCI-S.0 R2.0 standard ĄĄ PCIe switch allows two devices to share a single 4HP

peripheral board slot in a CPCI-S chassis ĄĄ Geographical addressing identifies carrier location on the backplane ĄĄ Front panel 68-pin VHDCI CHAMP 0.8mm connectors for field I/O signals www.acromag.com/ACPS3310

Acromag, Inc.

www.acromag.com/ACPS3310



solutions@acromag.com

 877-295-7088 @Acromag

 www.linkedin.com/company/acromag/



CompactPCI/cPCI Serial Space

717-SM Series ATR Proven ATR enclosure design for rugged and high level processing applications.

The 717-SM Series ATR is the latest proven design in Atrenne’s extensive enclosure design portfolio. Designed to perform in the harshest environments, it can be deployed in a range of land, sea and air applications. Typical applications involve SIGNIT, ISR and EW where high level processing and throughput is required. The ATR is highly customizable for customer-specific application and requirements. Configurable for up to 7 slots of 3U VPX or CompactPCI modules, this ATR enclosure also comes with an additional 3U Vita 62 compliant power supply slot. The 717-SM Series continues to provide the industry with a baseline of proven and qualified designs where performance and reliability are at the highest levels as demanded by the most discerning customer.

Atrenne, A Celestica Company www.atrenne.com

www.picmg.mil-embedded.com

FEATURES ĄĄ

Configuration: Up to 7 slots of 3U VPX or CompactPCI modules

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Cooling: Air assisted, conduction cooled

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Operating Temperature: Min. -54 °C to Max. + 55 °C

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Altitude (1000 ft): 50

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Module Cooling: Conduction

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Mounting: Base or slide panel

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Construction: Dip brazed aluminum www.atrenne.com/products/717-series-1-atr

sales@atrenne.com  800-926-8722  @AtrenneOfficial  www.linkedin.com/company/atrenne-integrated-solutions/ 

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CompactPCI/cPCI Serial Space

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Industrial Automation NATvision – High performance video and image processing NATvision high performance video and image processing technology is based on today’s state of the art Xilinx and Intel Altera FPGA resource boards combining the performance and realtime advantages of FPGA hardware based algorithms with software based image processing running on ARM CPUs. NATvision system solution uses the open system standard MTCA for embedded applications. This combines flexibility and scalability with high speed data rate capabilities.

In a small 2U, 19-inch system, up to 48 GigE-Vision cameras can be terminated and synchronised, the image data pre-processed and then distributed flexibly.

Compared to existing solutions, NATvision reduces the number of cables, offers higher speed interconnects, timing and trigger signals, and reduces the development costs of FPGA/ARM based programming.

To meet time-to-market, product price expectations and performance requirements NATvision offers as development environment: • Graphical block level design with Visual Applets • ARM C/C++ code combined with FPGA high level design (HLS) • Linux-BSP with AXI interface and VHDL or Verilog coding

FEATURES ĄĄ Graphical block level design

ĄĄ Xilinx- and Intel-Altera FPGA

ĄĄ GigE-Vision, CameraLink, USB3-Vision

ĄĄ Up to 48 GigE-Vision cameras in 2U MTCA crate

ĄĄ Up to 64 Gbps PCIexpress infrastructure with 128 Gbps optical uplink ĄĄ 40 Gbps Ethernet infrastructure with 100 Gbps optical uplink

N.A.T. GmbH

https://www.nateurope.com/solutions/natvision.html



info@nateurope.com

 +49 228 965 864 0

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

4 Game-Changing Underlying Technologies for Advanced Radar

By National Instruments The electromagnetic spectrum is an increasingly contentious warfare domain, the evolution of which presents new challenges for scientists and engineers who design intelligence, surveillance, and reconnaissance (ISR) systems. The underlying technologies that enable these sophisticated systems are also evolving to meet these challenges. In this white paper, learn how four recent innovations – gallium nitride for front-end components; high-speed data converters for tx and rx; evolving FPGA technology for cognitive techniques; and high-bandwidth data buses for sensor fusion – will have the biggest enabling impact on radar technology over the next several years.

Read the white paper: https://bit.ly/2GkZOJZ

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Check out our white papers at www.picmg.mil-embedded.com/ white-papers/ www.picmg.mil-embedded.com

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Check out our white papers. http://whitepapers.opensystemsmedia.com/

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