PICMG Systems & Technology Spring 2016 with Resource Guide

Standards Update

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Advancing Networks

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PICMG updates, improvements PICMG at Embedded World @PICMG_Tech

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PICMG Systems & Technology Resource Guide | Spring 2016 |

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SPRING 2016 | VOLUME 20 NUMBER 1 Standards-based technology platforms for open innovation

picmg-systems.com

@PICMG_Tech

On the cover The PICMG Systems & Technology Spring 2016 Resource Guide examines the updates to a number of popular PICMG standards and highlights the many PICMG members represented at the Embedded World 2016 trade show. The Resource Guide also spotlights some of the industry’s top products, including the FCN8213 AdvancedTCA Compute Node from Mercury Systems, a secure server blade featuring the Intel Xeon-EP server-class processor and either an Altera Arria 10 or Stratix 10 FPGA coprocessor; and the Schroff AdvancedTCA ECO Modular System from Pentair, which enables designers to balance performance level and cost to match an application’s needs.

Adding advanced server-management features to ATCA IPMCs

By Mark Overgaard, Pentair Electronics Protection

Technology Focus

8

Standards Update | Joe Pavlat 5

PICMG standards updates, improvements

Advancing Networks | Jessica Isquith 6

Embedded World 2016 show big for PICMG

Technology Focus 8 The road to achieving teraflop-scale computing in AdvancedTCA

By Martijn de Gouw, Eric van Uden, and André van Herk, Prodrive Technologies

Application Feature

12

Adding advanced server-management features to ATCA IPMCs

By Mark Overgaard, Pentair Electronics Protection

Application Feature 12

The road to achieving teraflop-scale computing in AdvancedTCA

By Martijn de Gouw, Eric van Uden, and André van Herk, Prodrive Technologies

2016 Resource Guide 16

2016 Resource Guide

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PROFILE INDEX AdvancedMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AdvancedTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CompactPCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mezzanines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MicroTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Systems and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . .

PCIe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

® 2016 OpenSystems Media ® CompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC, GEN4, and their logos are registered trademarks of PICMG. TM xTCA is a trademark of PICMG. © 2016 PICMG Systems & Technology All registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners.

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Member since 1998

www.picmg-systems.com

Standards Update

PICMG standards updates, improvements

By Joe Pavlat, Editorial Director jpavlat@opensystemsmedia.com | info@picmg.org Below are highlights from the current efforts of the PICMG technical community to update and improve a number of popular PICMG standards.

The Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.1 group is working on bringing 40 GbE to MicroTCA systems. It’s currently completing signal integrity studies across the full interconnect channel. S-parameter models for the backplane and AMC are developed and simulated and work on the MicroTCA carrier hub (MCH) is being completed. Combinations of 90- and 110-ohm impedance signal pairs are being simulated to see the behavior of all corner cases. The committee will then compare the channel simulations with IEEE 40GBASE-KR4 requirements.

A 40G test backplane was designed and simulated, as well as the AMC probe card. In the coming months, we expect all simulation and characterization to be complete. The MicroTCA.0 and AMC.1 specs will then be updated with the results, including change requests that have already been addressed.

These documents will then be submitted to the broader membership for review and approval.

The physics community that developed ATCA 3.8 RTM extension and MTCA.4 with µRTM is near to issuing a set of new hardware extensions – MTCA.4.1 – introducing an additional rear backplane supporting precision analog and digital functions.

The backplane supports ancillary rear power modules that can deliver positive and negative analog power as well as standard power to µRTMs or full-height eRTMS (extended RTMs). This backplane, side space, and rear power enables a new family of applications, stimulated by the need for compact multi-GHz low-level RF systems for high-density superconducting accelerator applications. The extension document describes the backplane as a generic design adaptable for special functions if needed in a new connector zone. It also contains a special section defining “Classes of RTMs” to promote interoperability between AMCs and µRTMs among vendors.

The first completed systems are operational in the injector section of the new XFEL accelerator at the DESY research center; several other laboratories are also adopting the solution. Industry support of the critical support modules and infrastructure is quite strong. The MTCA.4.1 standard is in final editing with submission to PICMG shortly for general member review. Additionally, four software guidelines – under development for several years – are in final editing stages; these include Standard Device Model, Standard Hardware API, Standard HotPlug Procedure, and Standard Process Model. All except the Standard Process Model are active, moving into final editing mode, with completion expected by summer’s end. www.picmg-systems.com

The Hardware Platform Management (HPM) subcommittee started work in January 2015 to enable the PICMG HPM layer for Internet Protocol version 6 (IPv6). (See “Adding IoT friendliness to AdvancedTCA and related specifications” in the Winter 2015 PICMG Systems and Technology for the history and importance of IPv6 versus traditional IPv4.) Prior to this work, the PICMG HPM layer covered only IPv4.

They began by adding IPv6 coverage for PICMG 3.0 R3.0, the ATCA Base specification; and PICMG 3.7 R1.0, the ATCA Base Extensions specification. Extensions to each were accomplished via Engineering Change Notices (ECNs), which go through all formal PICMG specification review and adoption processes; once adopted, they formally amend the target specification.

IPv6 ECNs for both above specifications were adopted by PICMG in 2015. This subcommittee recommends its sister subcommittee, which is adding 40G Ethernet support in MicroTCA, also make the corresponding IPv6 additions there.

Next, a modest revision – R1.1 – was made to HPM.2, the LAN-attached IPM Controller specification. The subcommittee is near completion of R2.0 for HPM.3, the DHCP-assigned Platform Management Parameters specification, which is undergoing Member Review now. This substantial revision adds support for version 6 of the Dynamic Host Configuration Protocol (DHCPv6), which complements IPv6. As Internetconnected entities in the IoT continue to grow exponentially and the workarounds that enabled continued use of IPv4 are increasingly strained, new applications of ATCA and MicroTCA will increasingly need IPv6 support in the HPM layer.

COM Express is updated regularly when changes to silicon warrant it. The subcommittee focused on support for four 10G-KR interfaces with a new Type 7 pinout. Discussions revolve around the total number of signals supporting the 10G channels, including interfaces for PHY configuration, LEDs, and management. Simulation results are being reviewed to determine if ground guard banding is necessary for high-speed signals – there is one differential pair, which runs at 10G. Currently, the group is looking to reassign the DDI pins for the 10G signals as silicon supporting multiple 10G will likely be headless. A preliminary pinout publication is expected this spring. Additional discussion covers efforts to harmonize the AB connector usage between new module types so customers can easily migrate from Type 10 to Type 7. Increasing the existing Ethernet interface from 10/100/1000 Mb to 10G is also under consideration.

Special thanks to committee chairs Justin Moll, Ray Larsen, Mark Overgaard, and Jeff Munch for these updates.

PICMG Systems & Technology Resource Guide | Spring 2016 |

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Advancing Networks

Embedded World 2016 show big for PICMG

By Jessica Isquith, Industry Editor The Embedded World Exhibition and Conference, which was held in February in Nuremberg, Germany, was a major meeting point for PICMG member companies and those who were looking for PICMG standards-based products and technologies.

This year’s event broke new records for its three days of trade fair and congress: According to organizers, the numbers showed 30,063 trade visitors came to Embedded World (up 17 percent from the year before), around a third of whom were from outside Germany, with 939 exhibiting companies (up 4 percent from the previous year) from 38 countries.

Two of the major themes highlighted at Embedded World were IoT (Internet of Things) and security. Many exhibitors included PICMG standards-based products as critical components of their secure IoT solutions.

More than 40 PICMG members exhibited, while at least another 40 non-PICMG members featured PICMG standardsbased products in their booths. The primary standards featured were Com Express, Compact PCI, and Compact PCI serial. End uses for the vendors’ products included transportation (rail, vehicle, ships, and avionics), healthcare, gaming, satellites, and industrial automation. Vendors from all levels – component,

info@picmg.org backplane, chassis, board, and application-ready platforms – were present, enabling system designers to meet with multiple experts representing the various PICMG standards.

The keynote address at Embedded World ’16 featured Kaspersky Lab CEO Eugene Kaspersky, who highlighted the growing relevance of information technology security in the IoT realm. He quoted cybersecurity experts who find it particularly difficult to secure systems that were not originally developed to account for and guard against potential breaches of security. Kaspersky called for the introduction of embedded-system development standards to make data more secure.

One popular event is the Embedded World student day, where, on the third day of the trade show, future engineers explore the event. This year, more than 1,000 highly motivated and committed young people came from Germany, Austria, and the Czech Republic to attend a lecture by Professor Franz Josef Radermacher of the University of Ulm’s Institute for Databases and Artificial Intelligence and Research Institute for ApplicationOriented Knowledge Processing (FAW/n).

PCI Industrial Computers Manufacturers Group (PICMG) www.picmg.org • info@picmg.org

PICMG members represented at the Embedded World show

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› AAEON

› Eurotech

› Mitsubishi

› ADLINK

› Fastwel

› MSC

› ADVANTECH

› FCI

› National Instruments

› AXIOMTEK

› Fraunhofer

› OpenSystems Media

› Concurrent Technologies

› Fujitsu Tech

› Pentair/Schroff

› Congatec

› Harting

› Polyrack

› Data Modul

› Hartmann

› Portwell

› DFI

› HEITEC

› Rohde & Schwarz

› EEPD

› Huawai

› RTD Embedded

› EKF

› IBASE

› SECO

› ELMA

› IEI

› TE Connectivity

› ELTEC

› Intel

› Teledyne LeCroy

› ept

› Kontron

› ERNI

› MEN Mikro

| Spring 2016 | PICMG Systems & Technology Resource Guide

www.picmg-systems.com

Technology Focus

Adding advanced server-management features to ATCA IPMCs

By Mark Overgaard With substantial convergent forces pushing data center and network center functionality together, AdvancedTCA (ATCA) server blades can further strengthen their management credentials by adding advanced server-management facilities at the hardware platform management (HPM) level.

ATCA intelligent platform management controllers (IPMCs) are the rough equivalent of enterprise server baseboard management controllers (BMCs), which often include advanced features such as redirection of keyboard, video, and mouse (KVM) functions to remote management consoles. Such redirection can enhance the ability of a small group of system administrators to manage a large number of ATCA blade servers while minimizing the need to physically visit them, thereby maximizing management cost-effectiveness.

ATCA systems in converged network and data centers are under increasing cost pressure, so adding advanced redirection features is practical only if it can be done cost-effectively. With highly integrated IPMC silicon, the board-level incremental cost to add this functionality can be minimized as well.

to one or more inside-the-shelf networks, leveraging wellestablished PICMG-defined mechanisms such as PICMG HPM.2, the LAN-attached IPMC specification, and related specifications.

Figure 1 shows a typical approach to a “LAN-attached� ATCA IPMC: sharing the Ethernet access for the IPMC with Ethernet access for payload CPU(s) on the board. It is usually highly preferable to share the Ethernet connection(s) needed by the main CPU(s) with IPMI-based remote management traffic to avoid the cost and logistical challenges of maintaining a separate physical network for management. With recent revisions of the relevant PICMG specifications, management access via version 6 of the Internet Protocol (IPv6) is now defined.

Scaled-out server complexes that are not based on ATCA typically equip each server with a baseboard management controller (BMC), as defined in the widely used Intelligent Platform Management Interface (IPMI), which is also leveraged as a foundation of the ATCA HPM layer. Such BMCs typically support using Ethernet for remote access to those BMCs.

The most widely used sideband interface between an IPMC and the network controller (NC) is the Network Controller Sideband Interface (NC-SI), an open standard developed by the Distributed Management Task Force (DMTF). Most Ethernet NCs targeting server markets implement an NC-SI port and internal switching to allow IPMI traffic to share the NC with main CPU traffic.

Every ATCA board, including both server blades and complementary boards, has an IPMC. That IPMC is likely connected

A key IPMC benefit is management access when the main CPU(s) of a server is down, potentially allowing much quicker

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| Spring 2016 | PICMG Systems & Technology Resource Guide

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Legend: Keyboard Video

AST2500/2520 IPMC

Mouse

IPMB-0

Media

System/Payload NIC

Extended Management Power Domain

Sideband Interface

Network

ARM11 Processor Core

AST2500 Ethernet MAC 1

Video Capture and Compression Engine

IPMI Traffic with IPMC

›

NC-SI

Payload CPU(s)

Ethernet Network Controller(s)

IPv6 OK

Remote Console

Serial Console Interfaces

› Ethernet Traffic with Payload CPU(s)

Base Interface Ethernet

Figure 1 | Key communication interfaces of an IPMC and the payload CPU(s) it manages, along with the sideband interface that allows the IPMC to share the Ethernet connection(s) that primarily serve the main CPU(s). Serial console interfaces of the main CPU(s) can be routed to the IPMC, enabling remote access for them as well.

diagnosis of a failure. Obviously, in the shared Ethernet architecture shown in Figure 1, such access is only possible if the NC(s) and the IPMC are powered by separate management power. The extended management power domain in the figure highlights this aspect of the architecture. The hardware design for such a subsystem needs to be done carefully to ensure that the extended management power domain can be powered while the connected payload CPUs are not.

Another key topic in many IPMC applications is remote access to the serial ports on the payload CPU(s). Especially in scaledout configurations with massive server counts, but even in smaller configurations, it can be highly preferable to avoid connecting one or more physical serial cables to each server or each CPU within each server.

IPMI defines a serial over LAN (SoL) architecture that is useful in this context. Payload CPU serial ports can be connected to the IPMC and a remote network-connected client of the IPMC can interact with those serial ports without needing any physical serial port connections. Such serial port access can be crucial, for instance, in diagnosing a malfunctioning server remotely.

The remote client can see all serial traffic as the payload CPU(s) boots, starting from the very first character, since the SoL session(s) with the IPMC can be established before the payload CPU(s) is even powered on. www.picmg-systems.com

USB 1.1 HID Controller

USB

USB 2.0 Virtual Hub Controller

USB

PCIe

Figure 2 | Key communication interfaces supporting KVM and media redirection in an example IPMC based on ASPEED’s AST2500. Two USB ports and a PCI Express (PCIe) port on a payload CPU interact with the IPMC as if the remote keyboard/ mouse, installation drive and PCIe-accessed video were directly attached. In reality, all those devices are attached to a remote console that communicates with the IPMC via Ethernet.

Additional advanced IPMC features For some server architectures, key subsystems may rely on a richer human interface than simple serial ports. Remote access to these subsystems may require the ability to virtually attach a remote KVM to an arbitrary server in a large configuration. The remote system administrator in this case needs to be able to use the remote KVM facilities as if they were physically attached to that server and then be able to transfer that virtual attachment instantly to some other server, perhaps in a completely different physical location.

Figure 2 shows how an advanced IPMC can address these needs by redirecting KVM-related connections over the network to a remote console. Media redirection, a related feature also shown in the figure, enables a remote installation image to function as if it were a drive physically attached to a server.

The server can boot from the remote drive image as part of a diagnosis or recovery operation.

The key idea in the redirection facilities shown in Figure 2 is that the payload CPU can interact with the redirected devices exactly as if they were physically attached, not redirected to corresponding physical devices attached to the remote console. This capability is independent of the operating system running on the payload CPU. Of course, the considerable compute power and good network performance in an AST2500-based IPMC are necessary to make this practical. Furthermore, specialized video capture and compression hardware is critical to an effective implementation of video redirection. In the Figure 2 model, the payload CPU would be configured to treat that hardware as if it were the system video card.

PICMG Systems & Technology Resource Guide | Spring 2016 |

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Technology Focus analog to digital controller (ADC) for monitoring electrical parameters and 14 independent I2C controllers (with only a fraction of either of these resources used in the base reference design here).

The powerful features of Linux running on the BMC (such as rich I/O and communications subsystems) are valuable in integrating these redirection facilities. This is especially true for media redirection, where Linux already includes support for applicable USB and mass storage protocols. Furthermore, a Linux foundation potentially allows other applications, such as a web interface or other services, to coexist with the main IPMC application on the BMC CPU. Normal Linux interprocess protections help to avoid interapplication interference. Of course, total resource requirements of the various co-resident applications must be planned carefully so there is always enough capacity for the critical applications.

Another key to cost-effectiveness is using the power of Linux (running on an ARM11 processor at 600 MHz on these AST devices) and its rich open-source ecosystem of development tools and device support as the foundation layer for management applications.

Getting started One such offering is the Schroff Pigeon Point BMR-AST-IPMC reference design from Pentair. The IPMC subsystem in this solution is compliant with the most recent IPMI, ATCA, and HPM.2 specification revisions and the firmware has been field-validated over the last decade in ATCA boards and complementary modules used in telecommunications and other applications around the world.

Delivering IPMC facilities cost-effectively One key to achieving cost-effectiveness is combining hardware support for key management features with traditional system-on-chip (SoC) facilities in a single device. The AST2500, a server management processor from ASPEED Technologies, is one example of such management-optimized SoCs. Figure 3 shows a possible IPMC reference design based on the AST2500. The design takes advantage of specialized hardware features, including the video controller and multiple USB ports for redirected KVM and media. Also included is a 16-input Legend:

Master-Only I 2 C

optional block

SDI, Linux console

SD Card connector BDM

Additional EEPROMs

optional connection

The Pigeon Point BMR-AST-ATCA Starter Kit comes with schematics and a bench-top reference implementation that allows designers engineers to become immediately familiar with

Recovery Flash

Boot Flash SPI, CS#0

RTC

DDR3 Memory

24 MHz Osc.

SDIO-2 JTAG

Digital Temp.

Sensors

SPI Memory Controller

UART-5

LAN

SPI, CS#1

DDR Memory Controller

CLKIN Ethernet traffic (RGMII)

Ethernet MAC 2

EEPROM

RMII1RCLK

(for int. data)

PHY

50 MHz Osc. NC-SI traffic (RMII)

Ethernet MAC 1 I2C-3

RTM IPMB-A

ARM11 Processor Core

I2C-1

IPMB-B

I2C-2 Ready, enable

Blue LED

System UART NC-SI LPC/ eSPI

SOL traffic

PWM Controller

Fan speed monitoring

EXTRST#

USB

Media redirection

USB

PECI bus

PECI Controller

Network Controller

PCIe

Mouse/keyboard redirection

USB 2.0 Virtual Hub Controller

Fan Tach Controller

SOL UART

Video redirection

USB 1.1 HID Controller

Fan control

External Watchdog Timer circuit

(mutually exclusive)

Video Controller (AST2500-only)

AST2500/2520

User GPIO

Reset button

LPC Controller (KCS/BT)

UART-3

GPIO

HA, Handle switch

System Interfaces

eSPI Controller

Telco alarm FRU LEDs

UART-2

PECI

System/VGA BIOS Flash

System SPI Flash Controller

SPI

SRST#

I2C-5...7

ADC Controller

1.35 V

3.3 V BMR-AST-IPMC Reference Design

1.15 V

GPIO

› 10

AMC Site 1,2

Power Regulation and Sequencing

Management Power (3.3 V)

Control and monitoring

IPMB-L legs

AMC site monitoring

GPIO

Payload reset

Voltage Supervisor & Reset Generator

E-Keying

Payload

Power control

Scaled to 0...1.8 V -48 V voltage and current

-48 V Monitoring Circuit

-48 V RTN

1.5 V

Payload Power

3.3 V 5V 12 V

Payload Power voltages

AMC-TSBR

Figure 3 | An example reference design for an IPMC with advanced redirection support, in this case using the AST2500 or (without the redirection features) its variant the AST2520. The need for additional chips beyond the AST device is minimized by the high integration level of the SoC. | Spring 2016 | PICMG Systems & Technology Resource Guide

www.picmg-systems.com

IPMI-based management and the IPMC features. While the configuration architecture enables many board-specific adaptations to be implemented without extensive programming, full source code of the BMR management application is included as well. The source code may simply be used as a supplementary educational resource or more aggressively, to do extensive customizations, if needed.

THE

An equivalent BMR subsystem is included with the Pigeon Point BMR-AST-BMC Starter Kit, which also supports advanced redirection facilities, but in the context of IPMI-managed servers not based on ATCA.

The McHale Report, by mil-embedded.com Editorial Director John McHale, covers technology and procurement trends in the defense electronics community.

An IPMC with advanced redirection facilities can strengthen the competitiveness of an ATCA blade server, especially for use in the context of the converged network and data center, which are often scaled out with hundreds or thousands of servers.

Servers not based on ATCA, especially in such scaled-out configurations, can benefit from these facilities as well.

Mark Overgaard is Architect, System Management for Pentair Electronics Protection. Mark was the founder and formerly the CTO of Pigeon Point Systems, which was acquired by Pentair in July 2015 and integrated into Pentair’s Electronics Protection platform, under the Schroff brand.

Pentair Electronics Protection www.pentairprotect.com

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PICMG Systems & Technology Resource Guide | Spring 2016 |

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Application Feature

The road to achieving teraflop-scale computing in AdvancedTCA

By Martijn de Gouw, Eric van Uden, and André van Herk

The proposal: Develop a high-performance machine vision design for use in an industrialized environment, requiring overall high availability and reliability. The challenge: To develop a high-density imaging platform that could scale up to multiple 42U racks.

This project called for tight integration of the compute architecture, the interconnect buses, hardware management and thermal household, for which AdvancedTCA (ATCA) came out as the best approach. Optimizing for density means that multiple processing elements and interconnect switching components needed to be combined. One difficulty remained: ATCA was not yet ready to provide power beyond 400 watts per blade.

700 watts in AdvancedTCA A key advantage that kick-started this project was the availability of several key infrastructure components such as digital signal processor (DSP) advanced mezzanine cards (AMCs) and RapidIO carrier blades. Within three months a set of these products was delivered to accelerate the user’s application development and integration, in a setup that closely resembled the final, optimized system. The project to optimize this image processing system continued in parallel.

For deployment requirements, most notably reducing real estate on the factory floor and increasing reliability by removing cables, a decision had to be made. This decision encompassed the integration of the equivalent of six AMCs and carrier switching functions onto a single blade. Net result: a performance/density improvement of over 50 percent compared to the AMC system, and an additional cost advantage due to improving the function/overhead ratio.

In a 42U rack (Figure 1), this integration amounts to 4,000 CPU cores and 3.5 Terabytes of memory interconnected via 40 Gbps Ethernet and 20 Gbps RapidIO, all

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| Spring 2016 | PICMG Systems & Technology Resource Guide

›

Figure 1 | 42U rack and ATCA 6PU blade. www.picmg-systems.com

Processing

Aggregation

Acquisition

Processing

Processing

Processing

›

Figure 2 | Typical machine vision data flow.

Serial RapidIO, PCI Express and 10GbE fabrics Left peer

SRIO 2.1 x4

10GbE

Right peer

PCIe 3.0 x4 SRIO 2.1 x4

SRIO 2.1 x4 1GbE

TI KeyStone-2 ARM + DSP

TI KeyStone DSP

1GbE

TMS320C6678 8x C66x DSP

HyperLink

DDR DDR DDR DDR DDR

›

1GbE

66AK2H14

4x Cortex-A15 8x C66x DSP

DDR DDR DDR DDR DDR

TI KeyStone DSP

1GbE

TMS320C6678

HyperLink

8x C66x DSP

DDR DDR DDR DDR DDR

Figure 3 | Processing unit topology.

liquid-cooled, and capable of dissipating 20 kilowatts. This particular architecture put a requirement of 700 watts per ATCA blade on the table in two ways: First, the local power supply has to deliver this power to the components on the blade, while secondly, the resulting heat has to be transported out of the system. An in-house developed and manufactured closed-loop water-cooling circuit was implemented as a result.

Architecture overview External image sensors generate raw data and bring it into the system at a rate of hundreds of gigabytes per second for processing in a real-time environment. The semiconductor manufacturing line performance directly depends on the image processing throughput, putting hard real-time deadlines on pixel data processing. Data is acquired and distributed by dual slot rear transition modules (RTMs, PICMG 3.8), specially designed to handle the sustained data stream. It distributes data via multiple Serial RapidIO 2.1 quad links to the processing blades (Figure 2). Over a dual 10 Gigabit Ethernet link between the aggregation switch and the FPGA on the acquisition module, the data flow can be reversed, enabling out-of-line processing in addition to the in-line method. www.picmg-systems.com

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Application Feature The reduced processed data stream is led out of the system using 40 Gigabit Ethernet links (following PICMG 3.2 standards) by bonding four 10 Gigabit Ethernet links to the central 40 Gigabit Ethernet switch blade. The central switch blade provides the uplink to postprocessing systems using multiple front 40 Gigabit Ethernet links. DSCP-based Quality of Service is used to separate real-time data streams from non-realtime control streams.

Data acquisition: RTM The PICMG 3.8 rear-transition module (RTM) is a high-density, high-speed rear transition module providing interfacing between the outside world and the processing blades. With RapidIO, it has remote direct memory access to the processing blades, achieving a data-driven architecture and avoiding spending scarce CPU cycles on simply transferring data.

Each RTM on the design was connected by multiple 20 Gbps Serial RapidIO 2.1 links, used for real-time data transfer towards the connected 6PU processing blades. In addition, six PCI Express 3.0 links provided out-of-band, real-time control, separate

Architecture deep dive First, the 6PU blade: The 6PU blade was introduced as a generic high-performance processing blade. It is optimized for performance per watt, performance per cubic volume, and performance per dollar. This focus resulted in a highly efficient processing blade. The name “6PU” is derived from its six processing units, each of which contains one TI 66AK2H14 DSP combined with two TI TMS320C6678 DSPs, interconnected via TI’s HyperLink protocol. This results in the following key facts: › 6x Texas Instruments 66AK2H14 KeyStone-2 DSP, running at 1.2GHz; per SoC: 4x ARM MPCore and 8x C6678 DSP CorePac › 12x Texas Instruments TMS320C6678 KeyStone DSP, running at 1.2GHz; per SoC: 8x C6678 DSP CorePac › 144 Gbyte of DDR3 memory including ECC › All elements are interconnected by RapidIO 2.1, 10 Gigabit Ethernet, PCI Express 3.0 and TI’s HyperLink

RTM Zone-3

RTM Zone-3

ATCA Zone-2

ATCA Zone-1

PCIe 3.0

RapidIO 2.1

40G Ethernet

IPMI

RapidIO switch

10GbE switch

Mgmt CPU

PU

›

PU

14

PU

PU

PU

Figure 4 | 6PU blade topology.

Multichannel input

Figure 3 shows the topology of a single processing unit on the 6PU blade, while Figure 4 shows the topology of the processing units on the 6PU blade.

Extensive simulations and reviews were performed during the PCB design, to ensure the signal integrity of the folded memory topology required for such a high density of embedded DDR3 memory chips. The high density of the board (18,000 surface-mount device [SMD] components and 70,000 nets), in combination with the amount of highspeed serial differential lanes, posed quite a challenge.

PU

High speed data acquisition RTM

›

PCI Express 3.0

RapidIO

RTM Zone-3 Control

RTM Zone-3 Data

10G Ethernet IPMI RTM Zone-3 Management

Figure 5 | Data-acquisition RTM topology.

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www.picmg-systems.com

from the data plane. IPMI-spec management functionality was included to provide out-of-band diagnostics.

abstracts the rack as a whole, including low-level control of the, rack, its PDU, the ATCA subracks, and boards, down to the component level. Board firmware upgrades can be achieved using PICMG HPM.1 IPMI extensions.

Xilinx’s seventh-generation Virtex and Zynq FPGAs provided the remote direct memory access interface towards the 6PU blades. Key facts include:

Martijn de Gouw is an embedded software architect at Prodrive Technologies and has more than 10 years of experience in programming and optimizing code for high-end DSP, PowerPC, and ARM platforms. Eric van Uden is a digital hardware architect at Prodrive Technologies and has more than 13 years of experience in designing high-density boards with systems-on-chip and high-speed signaling.

André van Herk is a sales engineer at Prodrive Technologies and specializes in high-end computing architectures. His area of expertise is solving design tradeoffs at the intersection of hardware, firmware and software. Readers may reach the authors at computing@prodrive-technologies.com.

› Xilinx Virtex-7 FPGA: 4 x 4 Gigabyte DDR3 SDRAM at 1600 MT/s with ECC, Multiple RapidIO 2.1 interfaces at 20 Gbps, Multiple PCI Express 3.0 interfaces, Multiple 10 GBASE-KR Ethernet interfaces › Xilinx Zynq-7000 FPGA: Dual ARM Cortex-A9 MPCore, 1.5 Gigabyte DDR3 SDRAM with ECC

Prodrive Technologies • Prodrive-technologies.com

Figure 5 shows the topology of the dataacquisition RTM. System integration: cabinet design, cooling, IPMI, and support software Due to the high density of the processing components and their power consumption, much of the design effort was spent on the cooling architecture. Simulations were performed to get insight into the thermal performance of the system and its individual components. This research resulted in the design of highly efficient heatsinks in combination with push-pull cooling techniques. The end result: a complete closed-loop cooling cabinet that reduced noise and turbulences to a minimum.

Intelligent platform management (IPMI) was used extensively to control and monitor the entire infrastructure of the rack, ATCA subracks, blades, and RTMs. In total, more than 3,000 sensors actively monitor the status of the hardware.

Due to the out-of-band nature of IPMI, comprehensive health status can be provided without interfering in the realtime data paths of the user application.

Additionally, the IPMI controllers also monitor the link status of the RapidIO and Ethernet links and keep track of biterror-rate (BER) counters. This feature allows the user to continuously monitor the overall health status of the system using a single IPMI-over-LAN cable.

Board support packages (BSPs) for all different processors facilitate application software development. In addition, a C-based library was developed that www.picmg-systems.com

PICMG Systems & Technology Resource Guide | Spring 2016 |

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2016 RESOURCE GUIDE RESOURCE GUIDE PROFILE INDEX COMPANY CATEGORY ADLINK Technology, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COM Express Advantech Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA Advantech Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI Alphi Technology Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mezzanines Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedMC Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . Operating Systems and Tools Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PCIe Artesyn Embedded Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA Comtel Electronics GmbH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA Concurrent Technologies, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedMC Congatec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COM Express Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA Hartmann Elektronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI Intermas, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI North Atlantic Industries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI Pentair Electronics Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA Pixus Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA ProDrive Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedTCA ProDrive Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MicroTCA Red Rock Technologies, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mezzanines Smiths Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI Vector Electronics & Technology, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . Compact PCI XALYO Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AdvancedMC

19”DESKTOP CASES

INTEGRATED SYSTEMS

PAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25, 27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34, 35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19, 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23, 24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18, 19

CARD CAGES AND COMPONENTS

BACKPLANES AND EXTENDERS

19” RACK CASES PLUGGABLE POWER SUPPLIES

THERMAL SOLUTIONS



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WILDSTAR AMC

FEATURES

WILDSTAR AMC boards are MicroTCA-compliant. MicroTCA is complementary to the PICMG3.0 Advanced Telecommunications Computing Architecture (AdvancedTCA or PICMG3).

Where AdvancedTCA is optimized for very high capacity, high performance applications, MicroTCA is designed to address cost-sensitive and physically smaller applications with lower capacity, performance, and perhaps less stringent availability requirements. MicroTCA preserves many of the important philosophies of AdvancedTCA, including basic interconnect topologies and management structure. MicroTCA is a modular standard. By configuring highly diverse collections of AdvancedMCs in a MicroTCA Shelf, many different application architectures can be easily realized. The common elements defined by MicroTCA are capable of interconnecting these AdvancedMCs in many interesting ways – powering and managing them, all at high efficiency and low cost.

WILDSTAR AMC computing is a revolutionary technology combining user-programmable, reconfigurable system gates with very high memory and I/O bandwidth capacities, which allow for high-density and high-performance system designs.

To ensure safe and reliable processing, WILDSTAR 6/AMC and WILDSTAR UltraK AMC boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILDSTAR AMC boards are built with a rugged, durable design.

picmg.opensystemsmedia.com/p373351

Annapolis Micro Systems, Inc.

ĄĄ General Features • Range of FPGAs to choose from: • – Altera Stratix® V, Xilinx® Virtex® 7, Xilinx® Kintex® or Virtex® UltrascaleTM • FPGAs • – Hard 8x PCIe Gen3 endpoint for DMA and register access • – FPGAs have same pinout and are bitstream compatible • – FPGAs programmable from attached flash or Annapolis provided • software API • – 20-nm copper CMOS process • – DDR4 DRAM, QDR-IV SRAM, DDR3 DRAM and QDRII+ SRAM memory • options available • PLX PCI Express Gen3 Switch • – Up to 16x Gen3 motherboard interface • – 8x Gen3 interface to each FPGA ĄĄ Board Configuration/Control • Xilinx® Zynq-7000 SoC • Provides dedicated AXI bus to FPGA for register access without requiring PCIe interface • Allows for on-board monitoring/control without consuming PCIe bandwidth ĄĄ Front Panel IO • Wild FMC+ (WFMC+) next generation IO site based on FMC+ specification: • – Accepts standard FMC and FMC+ cards (complies to FMC+ specification) • – Allows larger form factor Annapolis cards for higher IO density • – Supports additional LVDS IO for higher density ADC and DAC solutions • – Supports stacking (2 IO cards per site) when at least one card is WFMC+ • – Up to 32 High Speed Serial and 100 LVDS connections to FPGA • Simultaneous Optics and ADC/DAC use with two slots • Protocol Agnostic HSS connections support 10/40/100 Gb Ethernet, IB capable, AnnapMicro protocol and user designed protocols ĄĄ Application Development • Open Project Builder Application Design Suite: • – Full Board Support Package for Fast and Easy Application Development • – Computational, DSP and Data Flow Control Cores (FFTs, FIR, Math, etc.)

• – Develop in GUI environment or create VHDL and use HDL environment • – Built-in Debugger for Hardware in the loop Debugging • – Communication Cores Included (10/40Gb Ethernet and AnnapMicro • Protocol cores) • – VHDL Model includes Source Code for Hardware Interfaces • – Supports High-Level Synthesis (HLS) Design Flow • JTAG Access through RTM, Ethernet, or PCIe • Board control and status monitoring can be local (stand-alone), remote (via Ethernet or PCIe) or hybrid (both local and remote) ĄĄ System Management • System Management using PCIe Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Drivers and APIs for Host Systems running Windows and Linux are included ĄĄ Mechanical and Environmental • Integrated Heat Sink and Board Stiffener • External +12V Power Connector

https://www.annapmicro.com/product-category/wildstar-6-amc/

www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

PICMG Systems & Technology Resource Guide | Spring 2016 |

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PICMG Systems & Technology Resource Guide

AdvancedMC

PICMG Systems & Technology Resource Guide

AdvancedMC

AM C1x/msd AM C1x/msd is a high performance Single Module, Full-size or Mid-size, AdvancedMC™ processor module supporting a 4th generation Intel® Core™ processor (2-core or 4-core) with up to 16 Gbytes of DDR3L-1600 ECC DRAM. AM C1x/msd is designed in compliance to AMC.0, AMC.4 Type 5 and Type 10 (single or dual x4 Serial RapidIO®), AMC.2 Type E2 (2 x Gigabit Ethernet) and AMC.3 Type S2 (2 x SATA ports). The module also features USB 2.0, RS232, SATA, a x2 PCIe Gen 2 port and introduces two 10 Gigabit Ethernet interfaces on the front panel. Supporting full hot swap and IPMI capabilities with a range of industry standard operating systems, the AM C1x/msd is designed for use in AdvancedTCA® or MicroTCA™ applications in the telecommunications, scientific, and industrial markets. Application examples include high performance embedded clusters and wireless test controllers.

FEATURES ĄĄ Full-size or Mid-size, AdvancedMC™ processor module ĄĄ 4th generation Intel® Core™ processor ĄĄ Up to 16 Gbytes of DDR3L-1600 DRAM with ECC ĄĄ Up to two x4 Serial RapidIO fabric ports ĄĄ AMC.2 Type E2 (2 x Gigabit Ethernet ports) ĄĄ 2 x 10GBase-T interfaces via front panel ĄĄ Support for onboard SATA Flash Disk Module up to 128GB picmg.opensystemsmedia.com/p373354  sales@cct.co.uk  +1 781 933 5900 or +44 1206 752626

Concurrent Technologies

http://www.cct.co.uk/sheets/AM/amc1xmsd.htm

AdvancedMC

XS-AMC5 10G OTN AMC XS-AMC5 is a highly integrated Multi-Rate Multi-Protocol PHY Advanced Mezzanine Card (AMC) supporting efficient and flexible OTN switching, mapping and multiplexing at ODU0/ODUflex granularity.

XS-AMC5 provides: • One High-Speed SFP+ interface supporting OTU2 and OC-192/STM-64

FEATURES

• Three Lower-Speed SFP interfaces supporting OTU1, OC-3/12/48, STM-1/4/16, Fiber Channel, 100/1000 Ethernet, POS and Constant Bit Rate.

The AMC is controlled from an external processor over a PCI Express interface.

Comprehensive software is provided to control and monitor the card.

For more information visit: http://xalyo.com/products/detail/xs-amc5

ĄĄ ĄĄ

1 x SFP+ Network Interface (OTU2, OC-192) 3 x SFP Client Interfaces (OTU1, OC-3/12/48, 1000BASE-X, FC)

ĄĄ

1 x PCIe x4

ĄĄ

1 x XAUI

ĄĄ

PICMG® AMC.0 R2.0, AMC.1, AMC.2

ĄĄ

Based on PMC-Sierra/Microsemi HyPHY 10Gflex picmg.opensystemsmedia.com/p373310

Xalyo Systems www.xalyo.com

18



sales@xalyo.com

| Spring 2016 | PICMG Systems & Technology Resource Guide

 +41 22 995 0001

www.picmg-systems.com

XS-AMC6 Quad 10G Ethernet AMC XS-AMC6 is a high performance Ethernet multi-rate multi-protocol Advanced Mezzanine Card (AMC) supporting offload mechanisms and virtualization.

XS-AMC6 provides four SFP+ interface supporting 1G and 10G low-latency & high-throughput Ethernet.

The AMC is controlled from an external processor over a Gen3 PCI Express interface.

FEATURES

Thanks to its Gen3 PCI Express interface, XS-AMC6 can run four 10G Ethernet ports at full speed in a PCIe x8 configuration or two 10G Ethernet at full speed in a PCIe x4 configuration.

ĄĄ

4 x SFP+ Network Interface (1G & 10G)

ĄĄ

Ethernet, iSCSI, FCoE

ĄĄ

PCIe Gen3 x8

ĄĄ

PICMG® AMC.0 R2.0, AMC.1

ĄĄ

Based on Chelsio T5

ĄĄ

Linux, Windows, Solaris and VMware Drivers

Comprehensive software is provided to control and monitor the card.

For more information visit XS-AMC6: http://xalyo.com/products/detail/xs-amc6

picmg.opensystemsmedia.com/p373311

Xalyo Systems www.xalyo.com



sales@xalyo.com

 +41 22 995 0001

AdvancedTCA

ATCA-7480 The Artesyn ATCA-7480 blade uses two Intel® Xeon® E5-2600 v3 family processors (up to 28 cores per blade), optimized data paths and Artesyn’s QuadStar™ interface to deliver the highest performance processing. Optional hardware accelerators can improve the performance of security applications.

Scalable memory capacity (up to 512GB) enables faster database access, accelerated pattern matching and helps optimize routing decisions in virtualized network environments. Sixteen memory sockets means cost sensitive applications can still achieve their required capacities using cheaper modules.

Artesyn‘s enabling software for SDN/NFV supports Intel DPDKaccelerated OpenVSwitch, OpenFlow and OpenStack plug-ins, and Wind River's Titanium Server.

FEATURES ĄĄ Two Intel® Xeon® processors, E5-2600 v3 family ĄĄ Scalable performance range with up to 14 cores per processor ĄĄ Up to 512GB main memory, DDR4, configurable for highest

capacity or cost effective memory configurations

ĄĄ QuadStar™ 40G fabric interfaces enabling multiple bandwidth and

redundancy options

ĄĄ Hardware off-loading functions for en/decryption and

compression (optional)

ĄĄ Virtualization support including Linux KVM and VMware ĄĄ Intel DPDK ready picmg.opensystemsmedia.com/p372402

Artesyn Embedded Technologies www.artesyn.com/computing www.picmg-systems.com



computingsales@artesyn.com

linkedin.com/company/artesyn

 +1 (888) 412-7832 twitter.com/artesynembedded

PICMG Systems & Technology Resource Guide | Spring 2016 |

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PICMG Systems & Technology Resource Guide

AdvancedMC

PICMG Systems & Technology Resource Guide

AdvancedTCA

Netarium ATCA Series Advantech’s ATCA solutions are more than just hardware designs as we go much further than an ordinary ODM. We ensure that our systems not only have outstanding stability secured by a world-class design quality assurance process, but are enhanced by building in features which improve availability, serviceability and usability. Features which have a moderate impact on cost as they have been carefully designed by Advantech’s in-house engineering teams and are kept consistent across the product line.

Blades The cornerstones of our ATCA product line are the blades designed in our own labs and manufactured on our own production lines. We manage the entire lifecycle and control all our costs to give customers the best service at the right price. Our x86, NPU, DSP and switch blades are designed in unison with the leading silicon suppliers to give you early access to the very latest technology to accelerate your next generation product design and give you firstmover advantage.

Systems Advantech’s Netarium™ series of ATCA systems are specifically targeted to help network equipment providers reach superior levels of performance over traditional rackmount servers or appliances and extend their product range at the high end. The series represents a new generation of systems which offer superior performance, scalability and flexibility with the latest 40/100GbE switches and application blades. We optimize the systems to achieve the highest possible density at the rack level, with a maximum number of payload blades, network ports and switching capacity. eATCA – For More High-End Real-Estate The new Extended ATCA (eATCA) system architecture from Advantech responds to next generation networking needs for more high performance I/O connectivity and increased flexibility to add application-specific optimization hardware in high-end systems. eATCA is a system architecture based on ATCA that delivers increased I/O and packet processing performance for networking platforms facilitating borderless enterprise, secure datacenter, and cloud computing applications. eATCA systems integrate standard ATCA blades with extended Rear Transition Modules (eRTMs), providing almost four times more real estate for PCIe-based I/O connectivity and enabling new capacity for acceleration and offload. eATCA & ATCA Platform Management ... Appliance Style The SMM-5060, at the core of our ATCA platform management approach makes ATCA look like a big appliance and is able to support a consistent management view across our customers’ full product line. This means OEMs utilizing appliances for their entry and mid-range networking gear will find it surprisingly easy to add an ATCA based system as an extension of their product line at the high end.

Advantech’s SMM-5060 ATCA Shelf Manager features an Intel® Atom™ processor C2000 which brings added value system control and service processing to ATCA and eATCA systems, and can be used as a centralized service access point or blade boot server. The SoC’s features enable encryption and decryption of external management traffic in business and mission critical systems. The SMM-5060 has been designed to maximize management flexibility in multi-blade systems.

FEATURES ĄĄ Netarium-14 • 14-Slot, 14U fully integrated AdvancedTCA system • 12 Dual Intel® Xeon® blades + 2 hub blades (dual star) or 10 Dual Intel® Xeon® blades + 4 hub blades (dual-dual star) • 40GbE/100GbE Switches • AC or DC power; 300W+ per slot • Advanced Shelf Management with Intel® Atom™ C2000 • OVS with DPDK offload; QuickAssist ready ĄĄ MIC-5342 Telecom Blade • Two Intel® Xeon® E5-2600 v4 Processors and Intel® DH8955 • Up to 256GB ECC Memory • Up to 4x 40GBaseKR4 on FI (dual-dual star); 2x 1000BASE-T ports on BI ĄĄ MIC-5345 Server Blade • Optimized for virtualized environments • Two Intel® Xeon® E5-2600 v4 Processors with Intel® C610 • Up to 256GB ECC memory • Up to 2x 40GBaseKR4 ports on FI ( dual star); 2x 1000BASE-T ports on BI • Single CPU version adds two 2.5" SSDs and two MO-297 SSDs (or two 2.5" SSDs and two CFast Cards) ĄĄ DSP-8901 DSP Blade • 20 Texas Instruments C6678 DSPs • 512MB/1GB DDR3 memory per DSP • BCM56321 10GbE switch for both FI and BI • Freescale QorIQ™ P2020 for Local Management Processor (LMP) • IDT Tsi577 Serial RapidIO switches ĄĄ ATCA-7310 Network Processor Blade • Dual Cavium Octeon II CN6880 1.0 GHz • Up to 64GB DDR3 1066 MHz DIMMs; 32GB per NPU • 40 GbE (KR4) & 4x 10 GbE (KR) FI with Dual Star support • 8x 10GbE SFP+ and 4x 1GbE SFP to Rear I/O ĄĄ ATCA-9223 100GbE Hub Blade • 100GbE switch blade provides switching between two 100GbE uplinks, up to eighteen 10GbE uplinks and twelve 40GbE node slots • Fabric interface bandwidth up to 960Gpbs • Broadcom BCM56150 base fabric switch with 70Gbps switching capacity • Intel® Atom Processor C2000 for flexible control plane processing • Two Virtex 7-690 • FPGAs connect 2x 100G and 8x 10G for inline processing • Switch management picmg.opensystemsmedia.com/p372659

Advantech Co Ltd

www2.advantech.com.tw/nc/newsletter/NCG/ATCA/

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| Spring 2016 | PICMG Systems & Technology Resource Guide



ncg@advantech.com

twitter.com/AdvantechNCG www.picmg-systems.com

ATCA® Systems & Blades Centellis® AdvancedTCA® platforms from Artesyn support leadingedge packet and data processors while providing a degree of ruggedness in a compact and power-efficient bladed architecture.

ATCA technology is already engaged in various military & aerospace applications that require dense computing processor blades communicating over a 10G/40G integrated network.

Artesyn also offers a rich selection of payload blades – server blades, packet processing blades and DSP-based blades – that feature various processor architectures to suit the dense computing and integrated network needs of military and aerospace applications.

Technical SpecS ĄĄ

Application-ready platform configurations shorten time-to-market

ĄĄ

Long life embedded processors and switching architectures support long life military programs

ĄĄ

Strong ecosystem of off-the-shelf or custom blades allows the Centellis platform to be easily configured for a range of applications & upgraded as new technologies become available

ĄĄ

Wide range of processor architecture options (Intel® Xeon®, Cavium OCTEON; TI or Octasic DSPs picmg.opensystemsmedia.com/p373369

Artesyn Embedded Technologies www.artesyn.com/computing



computingsales@artesyn.com

linkedin.com/company/artesyn

 +1 (888) 412-7832 twitter.com/artesynembedded

AdvancedTCA

ATCA Chassis with 14-Slot 40-GigE Backplane Elma‘s latest AdvancedTCA chassis platform handles even the toughest cooling challenges by providing up to 500 watts per slot cooling (see test results in datasheet). The riveted construction makes the chassis strong yet easy to manufacture in volumes, thereby controlling costs. Designed to meet NEBS and EMC compliance requirements.

The chassis ships with a 14-slot, dual star 40GigE backplane.

In AC or DC power versions.

FEATURES ĄĄ Holds up to 14 AdvancedTCA based blades & rear I/O cards ĄĄ Tested for up to 500W per slot cooling capability ĄĄ High performance 40 Gigabit Ethernet backplane ĄĄ Dual shelf manager and power interface board (PIB) simplifies wiring ĄĄ Quad DC 100A PEM with integrated circuit breaker and I2C sensor ĄĄ AC version includes quad 2000W AC plug-in power supplies ĄĄ Riveted construction optimized for volume manufacturing picmg.opensystemsmedia.com/p373361

Elma Electronic Inc.

sales@elma.com  510-656-3400 @elma_electronic https://www.linkedin.com/company/elma-electronic 

http://www.elma.com/en/products/systems-solutions/chassis-platforms/product-pages/type-11/atca-type11-16u-nebs-detail/ www.picmg-systems.com

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AdvancedTCA

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AdvancedTCA

CO14-G4 Comtel’s flagship 14-slot ATCA chassis is the latest in high performance platforms for ATCA! Appropriately named, CO14-G4, is a 14U height and 14 slot AdvancedTCA® chassis supporting full mesh, dual star, and dual-dual star topologies with best of breed 100Gbps Air-/-Plane backplane technology.

About COMTEL Electronics Comtel has proven to be the premier backplane company with the launch of its disruptive 100Gbps Air-/-Plane backplane technology. This technology is unprecedented because it achieves backplane speeds 2 to 3 times the rated speeds for a standard ZD connector. This means low cost, stock availability, and the highest performance backplanes in the market.

FEATURES

Comtel has acquired a leadership position in the business of electrical interconnection components and systems. The activities of the company include high-speed electrical simulation, design, prototypes and mass production for Backplanes and system solutions.

ĄĄ

515W per slot engineered Cooling

ĄĄ

Options for 675W per slot Cooling

ĄĄ

Since 1993, Comtel Electronics GmbH has been offering Backplanes and integrated systems based on a wide range of VME, VME64x, VXI, VXS, VPX, Gigabit VME64x, PXI, CompactPCI, AdvancedTCA, uTCA and custom proprietary solutions.

ĄĄ

Dual Star, Dual-Dual Star, Full Mesh topologies

ĄĄ

19", 14U Rackmount chassis

ĄĄ

Accommodates 14, ATCA boards and RTMs

ĄĄ

Redundant Pigeon Point Based Shelf Manager

ĄĄ

High Reliability Bussed or Radial IPMB

Comtel has expertise in a wide range of engineering disciplines including concept design, board assembly and testing, mechanical design and production, wiring and functional test, system engineering and software design.

ĄĄ

Comtel is a privately owned company with its headquarters in Munich, Germany. The Comtel Group incorporates production facilities in Germany, Israel, China, and soon in the USA. Furthermore the enterprise offers sales support worldwide.

ĄĄ

ĄĄ

ĄĄ

ĄĄ

Comtel is an active member of PICMG consortium, contributing in development of advanced telecommunication standards as AdvancedTCA and MicroTCA.

Ultra high performance Air-/-Plane™ backplane supporting up to 100 Gbps!

4 redundant Power Entry Modules (A1+ A2 and B1 + B2) to accommodate up to 800W per slot Pull cooling with 4 hot-swappable redundant fan trays with excellent airflow distribution The new cooling system pumps 1250cfm of air through the chassis EMI containment for front and rear card cage Compliancy: • RoHS • Designed to meet NEBS • UL/cUL/CE Certified picmg.opensystemsmedia.com/p372546

COMTEL Electronics

www.comtel-online.com

22

 nasales@comtel-online.com  +1-619-573-9770

| Spring 2016 | PICMG Systems & Technology Resource Guide

www.picmg-systems.com

Next Generation AdvancedTCA Chassis The Pixus next generation AdvancedTCA feature advances in cooling, backplane performance, and PEM design. Our 13U and 15U ATCA system platforms utilize patented RiCool reverse impellar blowers for up to 400W/slot of cooling with meeting NEBS requirements and CPTA guidelines.

Our 40GbE backplanes are creatively designed to keep costs at a minimum. Contact us about 100G backplane options. The new generation intelligent Power Entry Modules (PEMs) feature higher power options and compliance to PICMG 3.7.

With the industry‘s ”most successful ATCA chassis design“ with over 15000 global installs, choose Pixus for your AdvancedTCA system application.

FEATURES ĄĄ 6U, 13U, 15U Chassis heights with next-gen upgrades ĄĄ Superior 40GbE backplane performance while keeping costs low ĄĄ Patented RiCool Rittal blowers for unprecedented cooling

performance

ĄĄ New shelf manager options with PPS ShMM-700R & VadaTech

VT003

ĄĄ New high-power intelligent PEMS, compliant to PICMG 3.7 ĄĄ Ruggedization options, contact Pixus for details ĄĄ Full system options with switches, processors, and specialty boards picmg.opensystemsmedia.com/p373372

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

 sales@pixustechnologies.com  519-885-5775

Pixus Technologies

www.pixustechnologies.com

@pixustech AdvancedTCA

Prodrive ATCA-IX5 and AMC-IX5 Prodrive Technologies‘ Intel-based building blocks for MicroTCA and AdvancedTCA combine industry‘s leading compute architecture with the reliability, availability and serviceability (RAS) offered by xTCA form factors.

The fifth generation Xeon parts offer unprecedented x86 compute performance per watt for use in scalable embedded applications in medical, industrial, telecom and data center applications. The AMC-IX5 offers up to 8 Intel Xeon cores at up to 2.0GHz, up to 16 Gigabyte of DDR4 and a wide range of connectivity options. Both 10 Gigabit Ethernet and Serial RapidIO at 20 Gigabit per second are supported for networking, in addition to PCI Express 3.0 for peripheral interfacing. The ATCA-IX5 houses one or two Intel Xeon-EP processors, linked together via Intel's Quick Path Interconnect.

Prodrive‘s Embedded Connectivity Bridge (ECB) complements the raw processing power with flexible, high speed IO. Up to 40 gigabit Ethernet (40GbE) and 50 gigabit Serial RapidIO (SRIO) are supported to enable a broad range of applications, ranging from server applications in a virtualized environment to hard real-time and deterministic embedded applications. This blade is the ideal choice for high-end applications in many demanding markets. An open source bootloader and Linux are used for maximum logistic and application flexibility. Secure remote management is provided through IPMI-over-LAN.

Prodrive Technologies

http://prodrive-technologies.com/ www.picmg-systems.com



FEATURES ĄĄ ATCA-IX5: Intel Xeon E5-2600v4, up to 18 cores, up to 2.4GHz ĄĄ AMC-IX5: Intel Xeon-D1500, up to 8 cores, up to 2.0GHz ĄĄ On board Serial RapidIO at up to 50Gbps ĄĄ On board 10 and 40 (ATCA only) Gigabit Ethernet ĄĄ Secure IPMI-over-LAN system management (RMCP, RMCP+) ĄĄ ROHS & WEEE compliant ĄĄ Up to 7 years of warranty

computing@prodrive-technologies.com

picmg.opensystemsmedia.com/p373348

www.linkedin.com/company/prodrive-technologies

 +31 40 2676 200

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AdvancedTCA

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AdvancedTCA

Prodrive ATCA carrier & switch blades Prodrive Technologies‘ RapidIO Gen.2 carrier (PRIOC-G2), RapidIO Gen.2 switch (PRIOSB-G2) and 10/40G Ethernet (PESB) offer flexible switching solutions in the AdvancedTCA form factor. Regardless of the networking requirements, Prodrive has the right switching solution available.

Mainstream 10 and 40 Gigabit Ethernet allows integration of mainstream server blades, and linking them together in a non-blocking topology. The Ethernet blade supports open networking software to maximize value and minimize time to market.

Low latency Serial RapidIO switching supports hard real-time system use cases at 100ns latency per switch, while offering 20 Gigabit per second per port in a non-blocking architecture.

Two up to fourteen channels towards the backplane allow for maximum scalability within any AdvancedTCA chassis type. On the front panel, up to four 80W full-size AMC sites are supported. In addition, AMC sites can be exchanged for front connectivity using small form-factor pluggable (SFP+) or quad small form-factor pluggable (QSFP) connectors, supporting up to two meters of passive copper cabling. All blades support a Gigabit Ethernet management network as well as an IPMI utility network, to control and manage the switches out-of-band.

This hardware portfolio is complemented with Prodrive's powerful, awardwinning network visualization software that enables customers to quickly identify hot spots in network utilization and latency, reducing customer‘s time-to-market.

Prodrive Technologies

http://prodrive-technologies.com/



FEATURES ĄĄ Up to four 80W full-size AMC sites ĄĄ Up to 2x QSFP, 8x SFP+ front panel connectors ĄĄ RapidIO: Serial RapidIO 2.1, up to 20Gbps per port ĄĄ Ethernet: up to 40Gbps per port ĄĄ 2 up to 14 backplane channels ĄĄ ROHS & WEEE compliant ĄĄ Up to 7 years of warranty picmg.opensystemsmedia.com/p373347

computing@prodrive-technologies.com

www.linkedin.com/company/prodrive-technologies

 +31 40 2676 200

AdvancedTCA

ACB-VI Shelf Manager Based on ShMM 700 Concerned about the product lifespan of your old shelf management device? Pentair is proud to introduce the next-generation Shelf Manager ACB-VI from its Schroff brand. The new Shelf Manager ACB-VI includes the ShMM 700 module (formerly Pigeon Point Systems), delivering improved security, higher availability and more robust design.

The Shelf Manager ACB-VI supports the latest Linux kernel and offers improved security features and extended software functionality.

Additional enhancements include: • The Intelligent Platform Management Interface (IPMI) implementation has been upgraded by simplifying radial IPMI via a Field Programmable Gate Array (FPGA).

• The IPMB-0 segments are logically isolated for each slot.

• Support for communication between redundant Shelf Managers has been improved by replacing the six discrete channels used in previous versions with a stable two wire bus.

• Five independent I2Cs improve the reliability of I2C communication on the Shelf Manager and to FRUs. Begin your next project with the all new ACB-VI shelf manager.

This next-generation device is available for the long haul. Radial and bussed IPMB versions are available from stock. Contact Pentair today to get started! picmg.opensystemsmedia.com/p373368

Schroff

http://www.pentairprotect.com/schroff-na http://www.pentairprotect.com/en/schroff-na/ATCA

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| Spring 2016 | PICMG Systems & Technology Resource Guide

AskSchroff@pentair.com  1-800-525-4682 

www.picmg-systems.com

ATCA ECO Modular Chassis The Schroff AdvancedTCA ECO Modular System offers an economic design based on the ability to balance performance level and costs to match your application needs. The shelf is developed to be easily adapted to the application power and cooling needs. The modular approach allows you to choose from several configurations, like backplane topology, 250 or 450 W per slot, redundant or nonredundant power entry and many more.

The modules are assembled into the 14U, 14 slot chassis. Airflow direction is front to rear and power entry is in the rear. The chassis supports a shelf manager or has the option to run autonomously without management. On-blade shelf management is also supported. Many features have been intelligently designed to increase

manufacturing efficiency and reduce costs, such as the air filter integrated into the fan tray and the shelf FRU data SEEPROMs being mounted directly on the backplane.

Now your project can benefit from the performance of ATCA without being set back by the high costs of the full feature set.

Simply scale the chassis features to meet your requirements and enjoy the cost savings of the new Schroff ECO Modular chassis from Pentair!

Two pre-configured versions are available from stock, hundreds of configurations available to your specification. Contact Pentair to get your project started today! picmg.opensystemsmedia.com/p373367

Schroff

 AskSchroff@pentair.com  1-800-525-4682

http://www.pentairprotect.com/schroff-na http://www.pentairprotect.com/en/schroff-na/ATCA

COM Express

cExpress-BW COM Express Compact Size Type 6 Module ADLINK's cExpress-BW computer-on-module (COM) features Intel® Atom™ X5 E8000, Pentium® N3710 and Celeron® N3160/N3060/N3010 Series processor SoCs. The module provides two DDI channels (with up to 4K resolution) and one LVDS or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, Embedded DisplayPort (eDP) is optionally available to support next generation displays. The cExpress-BW also offers optional on-board SSD support and up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.

The ADLINK cExpress-BW COM with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, and determine which data to save locally and which to send to the cloud for further analysis.

FEATURES ĄĄ Intel® Atom™ X5 E8000, Pentium® N3710 and Celeron®

N3160/N3060/N3010 Series processor SoC

ĄĄ Up to 8 GB dual channel DDR3L at 1600 MHz ĄĄ 3x DDI, 1x LVDS (shared w/ DDL3), and supporting 3 independent

displays (opt. eDP)

ĄĄ GbE, three PCIe x1 (opt. five PCIe x1 with bridge) ĄĄ 2x SATA 6 Gb/s (opt. onboard SSD) ĄĄ 4x USB 3.0 and 8x USB 2.0 ĄĄ Smart Embedded Management Agent (SEMA) functions picmg.opensystemsmedia.com/p373363

ADLINK Technology

http://www.adlinktech.com www.picmg-systems.com



info@adlinktech.com

 800-966-5200 @ADLINKTech_usa

www.linkedin.com/company/adlink-technology

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COM Express

conga-TS170 congatec has expanded its COM Express Basic portfolio with new server-class embedded modules. The new Server-on-Modules are equipped with 6th generation Intel® Xeon® and Intel® Core™ i3/i5/i7 processors (codenamed Skylake). The DDR4 memory of the conga-TS170 modules provides up to twice as much system memory performance for data-intensive applications while consuming 20 percent less energy and requiring only half the footprint of DDR3 RAM. In addition, the modules offer faster processor speeds, a 60 percent accelerated system bus and an enlarged Intel® Smart Cache (up to 8 MB) as well as the PCIe Gen 3.0 support for all PCIe Lanes and the new Intel® HD Graphics P530. Overall, users can expect to benefit from enhanced system performance and packing density with lower space and energy requirements.

The new modules have been developed for the server-class of embedded designs that operate within a thermal power envelope of 25-45W TDP and require custom I/O and IoT interfaces. The new conga-TS170 modules equipped with Intel Core processors are suitable for applications including test and measurement equipment, back-end systems in medical imaging, high-performance industrial workload stations as well as intelligent vending machines.

The Intel® Xeon® module variants additionally provide ECC memory protection, which extends their usage to data critical server and gateway applications. Applications can be found in industrial IoT and cloud servers with big data analytics, carrier-grade edge node servers as well as connected Industry 4.0 automation servers that host multiple virtual machines or media servers with multiple stream real-time video transcoding.

FEATURES ĄĄ ĄĄ

ĄĄ

ĄĄ

ĄĄ

COM Express Type 6 Basic form factor Features 6th Gen Intel® Core™, Xeon™ and Celeron® • 2-chip Skylake H-Series with Intel® Series 100 chipset 30% faster memory data transfer with future proven DDR4 memory support Accelerated HW Media Codecs for Encoding/Decoding H265/HEVC 3 independent display support for Ultra HD 4K resolution @60Hz and 24bpp

ĄĄ

8x PCI Express 3.0 x1 lanes

ĄĄ

Scalable TDP from 25W to 45W

ĄĄ

Next Gen of Intel® Smart Sound Technology

In addition, the new conga-TS170 modules offer powerful tools to manage distributed IoT, M2M and Industry 4.0 applications.

Thanks to Intel® vPro technology and congatec's board management controller with watchdog timer and power loss control, the modules are fully equipped for remote monitoring, management and maintenance tasks, right down to out-of-band management. picmg.opensystemsmedia.com/p373393

congatec

www.congatec.us

26



sales-us@congatec.com www.linkedin.com/company/congatec-ag

| Spring 2016 | PICMG Systems & Technology Resource Guide

 858-457-2600 twitter.com/congatecAG

www.picmg-systems.com

Express-SL/SLE COM Express Basic Size Type 6 Module ADLINK's COM Express computer-on-module (COM) offerings include the Express-SL in PICMG COM.0 Type 6 Basic Size form factor, featuring 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. This new module also provides support for three independent UHD/4K displays and is well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.

The ADLINK Express-SL/SLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-SL/SLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, and determine which data to save locally and which to send to the cloud for further analysis.

ADLINK Technology

http://www.adlinktech.com



FEATURES ĄĄ 6th gen Intel® Core™, Xeon® and Celeron® processor with Intel®

QM170/HM170/CM236 Chipset

ĄĄ Up to 32 GB dual channel ECC or non-ECC DDR4 at 2133 MHz ĄĄ 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to

3 independent displays

ĄĄ 8 PCIe x1 and 1 PCIe x16 ĄĄ GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 ĄĄ Smart Embedded Management Agent (SEMA) functions ĄĄ Extreme Rugged operating temperature: -40°C to +85°C (opt.) picmg.opensystemsmedia.com/p373364

info@adlinktech.com

 800-966-5200 @ADLINKTech_usa

www.linkedin.com/company/adlink-technology

CompactPCI

CompactPCI Serial Backplane The Hartmann Electronic cPCI Serial product range includes cPCI Serial Backplanes from 2 up to 9 slots according to the current PICMG Specification. In addition Hartmann Electronic is offering different Serial-Power-Backplanes for redundancy and power sharing.

The Hartmann Electronic Serial-Power-Supply with 300W supports 80 Plus gold efficiency, active current sharing, PMBus communication, N+1 redundancy and is hot-swappable. It can work in a range of -40°C to +70°C. The customer can select single components or the complete assembled and preconfigured system platform with different housing and cooling configurations.

The Hartmann Standard cPCI Serial system platform is a 4U 44HP desktop rack, equipped with a 300W power supply, a 9 slot cPCI Backplane and 2 strong fans. This platform can be placed either stand alone or as a subrack inside a cabinet or wall mounted.

FEATURES ĄĄ Fully compliant with PICMG ĄĄ Supporting up to PCI-E Gen3 ĄĄ Supporting up to 10xGE ĄĄ Supporting USB ĄĄ Supporting SATA ĄĄ Up to 9 slot ĄĄ Up to 300W picmg.opensystemsmedia.com/p373371

Hartmann Electronic

www.hartmann-electronic.com www.picmg-systems.com



info@hartmann-electronic.com

 +49 711 13989 0

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CompactPCI

CompactPCI Solutions Since its inception back in the mid 1990's CompactPCI has worked its way into some of the most mission critical applications on this planet. It can be found at the nerve-centre of the world's most hi-tech trains, at the core of the telecommunication network, switching calls and providing critical signaling information in essential core network elements.

In both its commercial and ruggedized form, CompactPCI controls industrial and chemical plants, while in the military arena it is employed for battle coordination managing vital communications and command functionality. Many top tier equipment providers have been deploying Advantech CompactPCI platforms within systems like these; systems upon which the world’s networking infrastructure still relies, and upon which chemical plants and power stations depend for the safe and secure continuation of their processes.

Advantech has been a key player in CompactPCI development for well over a decade now, assisting rugged and industrial OEMs as well as telecom equipment manufacturers to design and integrate CompactPCI in their business and mission critical systems. We understand the impact which the discontinuation of a component can have on a customer’s product portfolio and we have solid lifecycle management processes in place to handle it. We’ve also learnt how to step in when a key supplier announces the end of a product line and a second source blade is urgently needed which meets the same form, fit and function.

Customized COTS – Just What You Need When You Have a Unique Problem to Solve Customization at Advantech doesn’t just stop at branding. We realise that no two suppliers’ seemingly identical CompactPCI blades are exactly the same and that features may differ in various ways like a missing I/O port or connector or often custom IPMI features which aren’t implemented. That’s where our Customized COTS (C2OTS) program comes into play. Because we design our standard products with later customization in mind our processes are tailored to support the customized COTS business model. We offer significant flexibility over a “standard-product-only” roadmap by supporting changes ranging from branding, cost optimization, mechanical and schematic changes as well as the integration of a customer’s proprietary IP. We believe that this modus operandi is critical to the long term success of CompactPCI and have adapted our development and manufacturing strategies to encourage customization innovation, delivering complex CompactPCI products uniquely tailored to meet customer’s needs without sacrificing the economy of scale offered by standard off the shelf products.

Your OEM Blade There’s almost always a special feature that your customer needs you to integrate to meet a specific requirement. Its been that way since CompactPCI started and spans back even further to the early days of VMEbus. Mezzanine card technology has evolved in various form factors and with different interconnects help address the problems caused by over-customization. But when the rubber meets the road and you can’t find that feature on COTS products, you need a partner who is ready to go the extra mile and is geared to helping you re-engineer a product to meet your needs. Advantech’s CompactPCI customization team is here to identify and scope your special requests.

Below are some of the latest products from Advantech’s CompactPCI portfolio: 3U CompactPCI and PlusIO Products ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

MIC-3022/3023 – • 4U/3U CompactPCI® Enclosures for 3U Blades MIC-3328 – • 3U CompactPCI PlusIO Intel® Core™ i7 Processor Blade MIC-3325/3326 – • Intel® Atom™ N455/D525 Low Power Processor Blade MIC-3954 – • 3U CompactPCI PlusIO Serial Peripheral Carrier MIC-3955 – • 4-port RS-232/422/485 Communication Card MIC-3756/3758 – • 64-ch/128-ch Digital I/O Cards

6U CompactPCI Products ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

MIC-3042/3043 – • 4U CompactPCI® Enclosures for 6U Blades MIC-3398 – • 6U SBC with Intel® Atom™ E3845/Celeron® J1900 MIC-3397 – • 6U SBC with Intel® Xeon® E3/Pentium® Processor MIC-3396 – • 6U SBC with 4th generation Intel® Core™ Processor MIC-3395 MIL – • Intel® Core™ i7 Rugged Processor Blade with ECC MIC-3395 – • 6U CompactPCI® 3rd generation Intel® Core™ i3/i5/i7 Processor Blade with ECC Support picmg.opensystemsmedia.com/p372658

Advantech Co Ltd

www.advantech.com/compactpci

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

ncg@advantech.com

twitter.com/AdvantechNCG www.picmg-systems.com

Intermas – Modular Assembly Systems Intermas develops, manufactures and markets components and modules for the packaging of electronics: Cabinets, housings, subracks, cassettes and an extensive range of accessories for the 19" rack systems. The electronic enclosure systems are used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI and RFI-shielded protection.

Intermas offers wiring connectors and cable interface housings in accordance with IEC 60 603-2/ DIN 41 612, bus bars, 19" cross flow fans, power supplies, and euroboard covers. Intermas has extensive product range of more than 10,000 separate components and more than 30 years of experience.

Go to www.Intermas-US.com for our new catalog.

FEATURES ĄĄ 19" subracks and housings with flexible internal layout in various

3U and 6U sizes

ĄĄ EMI and RFI-shielded protection using stable stainless steel

contact springs ensuring permanent and reliable bonding

ĄĄ CompactPCI modules with integrated bus board and power supply ĄĄ InterRail® product line to meet tough physical demands and

vibration-proof used for railway engineering, traffic engineering, and power station engineering ĄĄ Connectors and wiring accessories ĄĄ Customizations available picmg.opensystemsmedia.com/p369515

Intermas US LLC

www.Intermas-US.com

 intermas@intermas-us.com  800-811-0236

CompactPCI

75G5 – 3U cPCI I/O & Communications Board Customer-configurable NAI‘s latest generation 3U cPCI Multi-function I/O and Communications Board, the 75G5, can be configured with up to three intelligent function modules. Ideally suited for rugged military, industrial, and commercial applications, this low-power/high-performance board delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.

Versatile Architecture

ĄĄ Support for 3 independent, intelligent function modules ĄĄ Control via PCI Bus or dual Gigabit Ethernet (Gig-E) interfaces ĄĄ Connections via front panel, rear panel, or both ĄĄ 2x 10/100/1000 Base-T Ethernet: 2 to rear, or 1 to rear and 1 to

front I/O

ĄĄ Background Built-in-Test (BIT) continually checks

and reports on the health of each channel

ĄĄ Commercial and rugged models ĄĄ Operating temperature: 0°C to 70°C

commercial, -40°C to +85°C rugged

Made in the USA Certified Small Business

picmg.opensystemsmedia.com/p373365

lboccone@naii.com  631-567-1100 

http://www.naii.com/3U-cPCI-I-O-Comm-Board-75G5/P276 www.picmg-systems.com

ĄĄ 3U cPCI board with PCI Bus Master capability ĄĄ Independent x1 SerDes interface to each function module slot

NAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O, communications, and Ethernet switch functions, providing the highest packaging density and greatest flexibility of any multi-function I/O board in the industry. Pre-existing, fully-tested functions can be quickly and easily combined in an unlimited number of ways. These highly intelligent I/O boards can often operate as standalone systems, eliminating the need for an SBC and operating system, along with associated software royalty costs.

The 75G5 includes SSKs to support multiple operating systems. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.

Eliminate man-months of integration with a configured, field-proven 3U cPCI board from NAI.

North Atlantic Industries, Inc.

FEATURES

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CompactPCI

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CompactPCI

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

FEATURES

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor.

Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

For more detailed product information,

ĄĄ

Made in the USA

ĄĄ

Most rack accessories ship from stock

ĄĄ

Modified ‘standards’ and customization are our specialty

ĄĄ

Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ

System monitoring option (CMM)

ĄĄ

AC or DC power input

ĄĄ

Power options up to 1,200 watts

please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.

picmg.opensystemsmedia.com/p371649

Vector Electronics & Technology, Inc. www.vectorelect.com

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 inquire@vectorelect.com  800-423-5659

| Spring 2016 | PICMG Systems & Technology Resource Guide

www.picmg-systems.com

KVPX Series The KVPX Series is Smiths Connectors’ response to the market need for a high speed, high density embedded system interconnect which meets the mechanical footprint and electrical performance requirements of the VITA 46/48. The rugged, modular design is highly optimized for durability and high speed signal integrity, and delivers outstanding performance under a variety of extreme environmental conditions.

Fretting corrosion from relative movement of contacts during continual shock and vibration in harsh environments is the leading cause of failure in aerospace and defense system platforms. This is especially problematic at the backplane interface of embedded computers such as avionics, radar, sensors, motor controls, data storage, communications and weapon systems.

FEATURES ĄĄ Fully footprint compatible with VITA 46/48 ĄĄ Highly optimized connector design for ruggedness and high speed

signal integrity

To solve this problem, Smiths Connectors has incorporated the spaceproven 0.4 mm Hypertac® hyperboloid sockets into the KVPX backplane connector, providing field-proven reliability for immunity to fretting corrosion, long cycle life, 360° of contact and self-wipe cleaning action.

In addition, the KVPX daughter card connectors include a front face plate for protection of the pins in an unmated condition.

ĄĄ Verified for 6.25 Gbps data rate performance

Like all Smiths Connectors products, the KVPX Series is engineered to guarantee high performance in the most severe conditions in aerospace, defense, and industrial applications.

ĄĄ Flexible, modular design for standard 3U and 6U as well as custom

Smiths Connectors

www.smithsconnectors.com



ĄĄ Reliable Hypertac® contact technology for field-proven immunity to

shock and vibration

ĄĄ Ruggedized, mechanical design: faceplate protection of daughter card

pins and 360° of contact for self-wiping of each pin during insertion configurations

picmg.opensystemsmedia.com/p373379

info.us@smithsconnectors.com

www.linkedin.com/company/smiths-connectors

@smithsconnector

Mezzanines

PMC-CIV-COM-ISO User-reconfigurable isolated communication I/O with 20 LVDS, 4 RS-422, 1 RS-2322 Altera Cyclone IV FPGAs, 4 MB dual-ported SRAM. Alphi Technology designs and manufactures board level products.

We specialize in Industry Pack Modules, Industry Pack Carriers MIL-STD-1553, Serial Communications, Data Acquisition & Control and Digital Servo Controllers, Analog and Digital converters. We offer one of the largest selections of Industry Pack Modules and IP replacement. We serve the Military/Aerospace industries, Test Industry, Automotive, Semiconductor and OEM’s that requires measurement and control solutions.

FEATURES

Custom Designs: In addition, Alphi offers complete Engineering Design Services. Custom hardware, drivers and application software as well as FPGA development, we are ready to help.

ĄĄ Direct readback of register • Direct output control

ĄĄ 20 isolated I/O pins buffered LVDS interface ĄĄ 4 isolated RS-422 interface ĄĄ 1 isolated RS-232 interface ĄĄ Fully user programmable • Direction programmed ĄĄ Change of state detection & interrupt: Generated per line on positive

or negative edge

ĄĄ Bit pattern recognition ĄĄ Pre-programmed output latch with output strobe PMC interface ĄĄ VIO 3.3/5.0 Volts picmg.opensystemsmedia.com/p373375

ALPHI Technology Corporation www.Alphitech.com www.picmg-systems.com



Sales@Alphitech.com

 480-838-2428

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CompactPCI

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Mezzanines

XMC Removable CFast Module The XMC Removable CFast Module is a mezzanine storage module with a dual-channel PCI Express to SATA 3 controller that is rated for a temperature range of -40C to +85C. Provides boot drive and/or disk storage for VPX, VME, cPCI, and ATCA SBCs with XMC slot.

CFast is same form factor as Compact Flash but with SATA interface thus providing faster throughput. The CFast connectors are rated for 10,000 mating cycles to support frequent insertions/removals.

FEATURES ĄĄ Adds removable SSD to your ATCA, cPCI SBC ĄĄ Boot or Storage

ĄĄ XMC PCIe Gen2 x1 interface per VITA 42.3 ĄĄ Air or conduction cooled ĄĄ Uses COTS CFast drives

ĄĄ CFast secured by rugged retainer clip ĄĄ 10,000 mating cycles

ĄĄ CFast capacities currently up to 120GB

ĄĄ 1.8" SATA version available with up to 2TB capacity ĄĄ PMC versions also available

ĄĄ Drivers for Windows, Linux and VxWorks picmg.opensystemsmedia.com/p372671

Red Rock Technologies



www.redrocktech.com

info@redrocktech.com

MicroTCA

Prodrive Heterogeneous Processing Shelf Prodrive Technologies’ Heterogeneous Processing Shelf (PHPS) provides a resilient enclosure for use in embedded markets where long lifecycles are key. The shelf is processor and interconnect fabric independent, allowing applications engineers to select the optimal mix of processing building blocks while improving time-to-market and keeping NRE at a minimum.

The PHPS is a MicroTCA shelf with integrated MTCA Controller Hub (MCH) that can host four up to eight AMCs and up to two dual-slot PCIe cards.

Supporting both PCIe add-in cards and AMCs in a single system offers flexibility to applications engineers and maximizes ROI. Processing and storage cards can be upgraded over time, while leaving performance critical cards and the enclosure itself untouched, facilitating upgrades, minimizing time to value for new features and keeping non-recurring investments at a minimum.

The backplane provides an additional level of flexibility. The fabric channels of each AMC are organized in a point-to-point or switched topology.

Each AMC slot is equipped with Gigabit Ethernet and an IPMI management interface. Supported protocols on the AMCs include PCI Express, Serial RapidIO, SATA, 10 and 40 Gigabit Ethernet.

Prodrive Technologies

http://prodrive-technologies.com/

32



FEATURES ĄĄ 19 inch, 2U/3U enclosure with integrated MicroTCA Controller Hub ĄĄ Up to 8 full-size, single-width 80W AMC sites ĄĄ Up to 2 dual-slot, full-length 225W PCI Express slots ĄĄ Integrated Gigabit Ethernet for all AMCs ĄĄ Point-to-point and packet-switched serial protocol backplane ĄĄ ROHS & WEEE compliant ĄĄ Up to 7 years of warranty

computing@prodrive-technologies.com

picmg.opensystemsmedia.com/p373346

www.linkedin.com/company/prodrive-technologies

| Spring 2016 | PICMG Systems & Technology Resource Guide

 +31 40 2676 200

www.picmg-systems.com

Open Project Builder

FEATURES Board Support Space

The Annapolis Micro Systems, Inc Open Project Builder provides the efficiency of CoreFire Next development with the flexibility of HDL. It integrates the CoreFire environment with Annapolis HDL board support packages.

ĄĄ

ĄĄ

User Space

The user has the capability to use FPGA IP from other sources, such as CoreFire Next, HSL, other HDL, etc. Open Project Builder can also port IP to/from other platforms. It uses standard Avalon and AXI IP interfaces. Open Project Builder uses fast portability of application between Altera and Xilinx and to newer FPGA families.

ĄĄ

Algorithmic: DSP, Math, etc.

ĄĄ

Data Flow Control

ĄĄ

Bit and Type Manipulations

ĄĄ

Board Support Packages for all WILDSTAR Boards: Stratix 5, Virtex 7, Arria 10, UltraScale, Stratix 10, etc.

picmg.opensystemsmedia.com/p373350

Annapolis Micro Systems, Inc.

https://www.annapmicro.com/product-category/developmenttools/

www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

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Operating Systems and Tools

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PCIe

Wild40 for PCIe Servers Annapolis 1U and 4U PCIe servers are designed to support high power FPGA cards with dual power connectors and PCI Express Gen3 x16 to each double slot.

The combination of these servers with WILDSTAR Ultra, WILDSTAR A5 and WILDSTAR V7 PCIe cards allow transfer rates up to 16 GB/s across the PCIe bus to/from each FPGA card.

All servers come standard with dual 512GB SSD drives FEATURES for the operating system, dual built-in 10GbE-BASE-T and ĄĄ Up to 8 double slot x16 PCIe Gen 3 slots (HPC Slots) + 2 x8 PCIe Gen 3 slots redundant power supplies. There are three performance ĄĄ Up to 24x 2.5" Hot swappable Front Panel Disks choices for Intel CPU and DRAM options.

(1 used for OS)

These rack mountable PCIe servers can hold from 3-8 double wide PCIe FPGA cards and offer exceptional cooling, power and PCIe interconnection capabilities. They are a perfect companion for a high performance Annapolis PCIe FPGA card.

ĄĄ

Up to 4x 1600W Redundant power supplies

ĄĄ

2x Intel Xeon E5-2600 v2 CPU with DDR3 memory

ĄĄ

Integrated Dual-Port 1000BASE-T/10GBase-T

ĄĄ

1TB SSD System Disk

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support.

picmg.opensystemsmedia.com/p373352

Annapolis Micro Systems, Inc.

https://www.annapmicro.com/product-category/servers-pcie-ecosystem/

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 wfinfo@annapmicro.com  410-841-2514

www.picmg-systems.com

FEATURES

Wild40 for PCIe FPGA Boards WILDSTAR Ultra, WILDSTAR A5 and WILDSTAR 7 PCIe FPGA boards provide PCIe Gen3 8x Connections from each FPGA to an on-board PCIe switch which can support up to a 16x Gen3 motherboard connection. They accept standard Annapolis WILDSTAR mezzanine boards and may be optionally populated with three front panel QSFP+ transceivers. Each QSFP transceiver supports four lanes with line rates up to 14.1 Gbps which covers such protocols as 10GbE, 40GbE, QDR Infiniband, OTU3 and OC-768. WILDSTAR 6 FPGA boards support up to an 8x Gen2 interface.

ĄĄ General Features • Range of FPGAs to choose from: • – Altera Stratix® V, Xilinx® Virtex® 7, Xilinx® Kintex® or Virtex® UltrascaleTM • FPGAs • – Hard 8x PCIe Gen3 endpoint for DMA and register access • – FPGAs have same pinout and are bitstream compatible • – FPGAs programmable from attached flash or Annapolis provided • software API • – 20-nm copper CMOS process • – DDR4 DRAM, QDR-IV SRAM, DDR3 DRAM and QDRII+ SRAM memory • options available • PLX PCI Express Gen3 Switch • – Up to 16x Gen3 motherboard interface • – 8x Gen3 interface to each FPGA ĄĄ Board Configuration/Control • Xilinx® Zynq-7000 SoC • Provides dedicated AXI bus to FPGA for register access without requiring PCIe interface • Allows for on-board monitoring/control without consuming PCIe bandwidth ĄĄ Front Panel IO • Wild FMC+ (WFMC+) next generation IO site based on FMC+ specification: • – Accepts standard FMC and FMC+ cards (complies to FMC+ specification) • – Allows larger form factor Annapolis cards for higher IO density • – Supports additional LVDS IO for higher density ADC and DAC solutions • – Supports stacking (2 IO cards per site) when at least one card is WFMC+ • – Up to 32 High Speed Serial and 100 LVDS connections to FPGA • Simultaneous Optics and ADC/DAC use with two slots • Protocol Agnostic HSS connections support 10/40/100 Gb Ethernet, IB capable, AnnapMicro protocol and user designed protocols ĄĄ Application Development • Open Project Builder Application Design Suite: • – Full Board Support Package for Fast and Easy Application Development • – Computational, DSP and Data Flow Control Cores (FFTs, FIR, Math, etc.)

• – Develop in GUI environment or create VHDL and use HDL environment • – Built-in Debugger for Hardware in the loop Debugging • – Communication Cores Included (10/40Gb Ethernet and AnnapMicro • Protocol cores) • – VHDL Model includes Source Code for Hardware Interfaces • – Supports High-Level Synthesis (HLS) Design Flow • JTAG Access through RTM, Ethernet, or PCIe • Board control and status monitoring can be local (stand-alone), remote (via Ethernet or PCIe) or hybrid (both local and remote) ĄĄ System Management • System Management using PCIe Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Drivers and APIs for Host Systems running Windows and Linux are included ĄĄ Mechanical and Environmental • Integrated Heat Sink and Board Stiffener • External +12V Power Connector picmg.opensystemsmedia.com/p373366

Annapolis Micro Systems, Inc.

https://www.annapmicro.com/product-category/fpga-boards/

www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

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PCIe