PC/1Q4 8nd
small form factors
THE JOURNAL of MODULAR EMBEDDED DESIGN
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ADVERTISER INDEX PAGE ADVERTISER 10
ACCES I/O Products, Inc. – PCI Express mini card; mPCIe embedded I/O solutions
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GROUP EDITORIAL DIRECTOR John McHale john.mchale@opensysmedia.com ASSISTANT MANAGING EDITOR Lisa Daigle lisa.daigle@opensysmedia.com TECHNOLOGY EDITOR Mariana Iriarte mariana.iriarte@opensysmedia.com
Elma Electronic – Proven COTS building blocks
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DIRECTOR OF E-CAST LEAD GENERATION AND AUDIENCE ENGAGEMENT Joy Gilmore joy.gilmore@opensysmedia.com
General Standards Corporation – Major Navy contractors chose us!
ONLINE EVENTS SPECIALIST Sam Vukobratovich sam.vukobratovich@opensysmedia.com CREATIVE DIRECTOR Stephanie Sweet stephanie.sweet@opensysmedia.com SENIOR WEB DEVELOPER Aaron Ganschow aaron.ganschow@opensysmedia.com WEB DEVELOPER Paul Nelson paul.nelson@opensysmedia.com CONTRIBUTING DESIGNER Joann Toth joann.toth@opensysmedia.com
RESOURCE GUIDE INDEX
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ADVERTISER
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COMs and SOMs congatec
SALES/MARKETING
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Hardware WinSystems, Inc.
21 15
PEAK-System Technik RTD Embedded Technologies, Inc.
15-17 18
IoT RTD Embedded Technologies, Inc.
18-19
SBCs and Boards ADL Embedded Solutions, Inc.
MARKETING MANAGER Eric Henry eric.henry@opensysmedia.com (541) 760-5361 STRATEGIC ACCOUNT MANAGER Rebecca Barker rebecca.barker@opensysmedia.com (281) 724-8021
Hardware and Peripherals Apacer
SALES MANAGER Tom Varcie tom.varcie@opensysmedia.com (586) 415-6500
19-20
RTD Embedded Technologies, Inc.
20
WinSystems, Inc.
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STRATEGIC ACCOUNT MANAGER Bill Barron bill.barron@opensysmedia.com (516) 376-9838 STRATEGIC ACCOUNT MANAGER Kathleen Wackowski kathleen.wackowski@opensysmedia.com (978) 888-7367 SOUTHERN CAL REGIONAL SALES MANAGER Len Pettek len.pettek@opensysmedia.com (805) 231-9582 SOUTHWEST REGIONAL SALES MANAGER Barbara Quinlan barbara.quinlan@opensysmedia.com (480) 236-8818 INSIDE SALES Amy Russell amy.russell@opensysmedia.com ASIA-PACIFIC SALES ACCOUNT MANAGER Patty Wu patty.wu@opensysmedia.com BUSINESS DEVELOPMENT EUROPE Rory Dear rory.dear@opensysmedia.com +44 (0)7921337498
Shipboard Electronics/Sonar General Standards Corporation
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Wireless Epiq Solutions
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EVENTS ESC Boston Embedded Systems Conference May 15-16, 2019 Boston, MA www.esc-boston.com
IMS – International Microwave Symposium June 2-7, 2019 Boston, MA ims-ieee.org
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www.pc104.org
PC/104
Consortium
By Stephen St. Amant, PC/104 Consortium President
PC/104 and the Rogers Adoption Curve I’m certain that there were some project managers in the early 1990s who were hesitant to design with PC/104. “We’ll stick to the older, proven specifications, thank you very much.” Thankfully, there were plenty of early adopters – engineers and designers who saw the value of a stackable architecture, the elimination of the backplane, and the potential for a multivendor ecosystem of compatible products.
Figure 1 | The Rogers Adoption Curve describes how new innovations and ideas are accepted and adopted by groups and cultures.
Let’s get back to the
PCI Express. So, through the lens of the adoption curve, how do we understand PC/104 today?
innovators and early
I’ll offer two ways of thinking about it.
adopters. Single-board computer manufacturers and peripheral module designers continue to bring new technologies to the PC/104 form factor.
Everett Rogers first introduced the idea of diffusion of innovations in his 1962 book of the same name. The concept was initially rooted in agriculture (yes, I just did that) but has been widely applied to advances in technology. The curve has five stages: innovators, early adopters, early majority, late majority, and laggards. (Figure 1.) Let’s extrapolate this concept to PC/104: In its early days, the PC/104 architecture was gladly embraced by the innovators and early adopters – the people who always want to dance with the very latest technologies. The ecosystem began to grow, and the technology gained traction as more manufacturers began building to the form factor. PC/104 has evolved over its many years of existence, from ISA through to www.smallformfactors.com
In one sense, PC/104 suits the early and late majority. These risk-averse groups require a proven history, broad vendor support, and widespread market adoption. They’re looking for mountains of data and application case studies that show reliability. With PC/104, they have these things. Countless long-running embedded programs have used PC/104-based systems for years. Program managers trust PC/104 technology to function as critical components within longstanding, multibillion dollar programs. These systems have been exposed to environments across the globe, at the bottom of the sea, and out in space. But typically, the term “PC/104” calls to mind only the stackable buses and compact footprint. It does not immediately point to all the latest technologies that have been spun onto the architecture. It’s similar to how the word “cars” describes the mode of transportation, but it doesn’t highlight the breakthrough technological advancements in today’s vehicles. This brings us to a second way of thinking about the Rogers Curve and PC/104: Let’s get back to the innovators and early adopters. Single-board computer manufacturers and peripheral module designers continue to bring new technologies to the PC/104 form factor. As new hardware interface and networking standards are developed and released to the consumer market, PC/104 engineers and designers are right there at the front of the line, spinning new boards to address the pressing demands of today’s aerospace, defense, industrial, transportation, research, and manufacturing markets. Whether you need new or are dealing with long-deployed, PC/104 manufacturers and system integrators will be able to take you where you need to go. Our PC/104 Consortium member companies employ some of the brightest minds in the embedded industry, carrying the depth of experience that brings smart solutions while avoiding costly errors. The Consortium will be exhibiting within the OpenSystems Media pavilion at embedded world 2019 (see us at Booth 3A-528). We’re thrilled to be participating – we’re looking forward to seeing you there. PC/104 and Small Form Factors Resource Guide Spring 2019
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ON THE COVER: The 2019 PC/104 and Small Form Factors Resource Guide showcases products for designers in the areas of COMs and SOMs, hardware and peripherals, IoT, SBCs and boards, shipboard electronics and sonar, and wireless.
Volume 23 • Number 1
Columns
Features PC/104 MARKET SNAPSHOT PC/104 vendors head to Embedded World in strong position, atop a billion-dollar market
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PC/104 Consortium
PC/104 and the Rogers Adoption Curve By Stephen St. Amant, PC/104 Consortium President
Tech Update
Foreshadow: Researchers discover another Intel processor vulnerability
By PC/104 Staff
APPLICATION TRENDS
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Reduced SWaP and application requirements drive innovation in power supplies
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By Sally Cole, Senior Editor
Resource Guide
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By Mariana Iriarte, Technology Editor
COMs and SOMs Hardware Hardware and Peripherals IoT SBCs and Boards Processing Shipboard Electronics/Sonar Wireless
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Web Resources PC/104 CONSORTIUM
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PC/104 Consortium information
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PC/104 and Small Form Factors www.linkedin.com/groups/1854269/ @sff_mag www.smallformfactors.com
Tech Update By Sally Cole, Senior Editor
Foreshadow: Researchers discover another Intel processor vulnerability Two international teams of security researchers have independently and concurrently discovered “Foreshadow,” a new variant of the hardware vulnerability known as “Meltdown,” which exploits a bypass of Intel processors’ secure regions to access memory and data. The Foreshadow vulnerability affects Intel’s Software Guard Extension (SGX) technology, a feature in modern Intel CPUs that protects data within a secure “fortress” even if the entire system falls under an attacker’s control. Foreshadow is similar to Spectre and Meltdown, hardwarebased attacks that shook the security world in early 2018 when researchers were able to break several security features present in most Intel-based machines. As a group effort, researchers from the University of Michigan, the Belgian research group imec-Distrinet, Technion Israel Institute of Technology, the Univer sity of Adelaide (Australia), and Data61 (Canberra, Australia) published a report (foreshadowattack.eu/foreshadow-NG. pdf) about the vulnerability, which causes the complete collapse of the SGX ecosystem and compromises users’ data. “SGX can be used by developers to enable secure browsing to protect fingerprints used in biometric authentication or to prevent content being downloaded from video streaming services,” says Yuval Yarom of Data61 and the University of Adelaide’s School of Computer Science. “Foreshadow compromises the confidentiality of the ‘fortresses,’ where this sensitive information is stored; once a single fortress is breached, the whole system becomes vulnerable.” Intel was alerted about the vulnerability in mid-2018. The company’s own investigation led it to discover a new variant of Foreshadow, called Foreshadow-NG, www.smallformfactors.com
which affects nearly all Intel servers used in cloud computing. The NG type targets the Intel-based virtualization environments used by cloud computing giants Amazon and Microsoft to create thousands of virtual PCs on a single large server. Foreshadow-NG essentially breaks the digital wall that keeps individual cloud customers’ virtual PCs isolated from one another on large servers. This breakdown could enable a malicious virtual machine running to read data belonging to other virtual machines, according to the researchers. The virtualization code is present in every Intel-based computer manufactured since 2008. “Foreshadow-NG could break the fundamental security properties that many cloudbased services take for granted,” says Baris Kasikci, a University of Michigan assistant professor of computer science and engineering. Foreshadow-NG is theoretically capable of bypassing the earlier fixes for Meltdown and Spectre vulnerabilities, potentially re-exposing millions of computers across the globe to attacks. How does the attack work? Both variants of the vulnerability gain access to the victim’s machine via a side channel attack. These attacks infer information about a system’s inner workings by observing patterns in seemingly innocuous information – such as how long it takes the processor to access the machine’s memory. This information can be used to gain access to the inner workings of the machine. The attack then confuses the system’s processor by exploiting a feature called speculative execution, which is used in all modern CPUs: It speeds processing by enabling the processor to essentially guess what it will be asked to do next and plan accordingly. The attack feeds in false information that leads speculative execution into a series of wrong guesses, and the processor becomes hopelessly lost. This confusion is then exploited to cause the victim’s machine to leak sensitive information. In some cases, the researchers say that it can even alter information on the victim’s machine. While these vulnerabilities are caught before causing major damage, Ofir Weisse, a University of Michigan graduate student research assistant involved in the work, points out that such gaps expose the fragility of secure enclaves and virtualization technologies. He believes that the key to keeping technologies secure is to make designs open and accessible to researchers so that they can identify and repair vulnerabilities quickly. Data61’s Yarom says “Intel will need to revoke the encryption keys used for authentication in millions of computers worldwide to mitigate the impact of Foreshadow. Their discovery of the Foreshadow-NG variant is even more severe, but will require further research to gauge the full impact of the vulnerability.” Intel has since released software and microcode patches to protect against both varieties of attack. Cloud providers will need to install updates to guard their machines and, on an individual level, the owners of every SGX-capable Intel PC manufactured since 2016 will need an update to protect their SGX. Researchers are now exploring whether similar flaws exist in other manufacturers’ processors. PC/104 and Small Form Factors Resource Guide Spring 2019
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SPECIFICATIONS UPDATE PC/104 MARKET SNAPSHOT
PC/104 vendors head to Embedded World in strong position, atop a billion-dollar market By PC/104 Staff Attendees stream into one of the exhibition halls at Embedded World 2018 in Nuremburg, Germany. More than 32,000 people attended last year’s event.
PC/104, well into its fourth decade, remains strong globally in markets such as aerospace, defense, industrial, and medical. Such longevity is a tribute to its inherent ruggedness and the open architecture that enables PC/104 designers to continually integrate state-of-the-art processing technology from companies such as Intel and Arm. In this conversation with the PC/104 Consortium leadership, they discuss how the small form factor still fosters a robust, billion-dollar industry on the eve of the 2019 Embedded World exhibition and conference; key PC/104 suppliers look forward to hitting the exhibit floor in Nuremberg, Germany to build on the momentum in the industrial market. Q: What is the state of the PC/104 market today? PC/104 CONSORTIUM: While new architectures and small form factors have become the choice of embedded computing designers in recent years, the venerable PC/104 is forecast to see a 5 percent annual growth rate through 2020, rising to $1.1 billion in revenue. Q: Why is Embedded World important for PC/104 vendors? PC/104 CONSORTIUM: Embedded World is the preeminent showcase for embedded products and an excellent venue to promote the PC/104 community and its many products and solutions. Many new compelling technologies such as SMARC, COMe, and ETX are competing for new embedded designs. Our participation in Embedded World
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reinforces the PC/104 community’s position as a leader in the embedded market. Q: How are the consortium and its members participating in this year’s event? PC/104 CONSORTIUM: The Consortium is co-sharing a megabooth with OpenSystems Media, with featured speaking events, signage, product placement, media promotions, and partner events. The attendees will have the opportunity www.smallformfactors.com
to meet with many of the consortium’s members at booth 3A-528 to discuss their application or speak to an expert about PC/104. We are looking at having an industry panel discussion with audience Q&A following the talks.
a revision to our website to ensure up-to-date information concerning the consortium, members, and products (https://pc104.org). For our members, we’ve also initiated a new database and are in the evaluation stage of upgrading our PCIe/104 specification to Version 4.0, which will have improved stackability, among other enhancements. PC/104 Consortium Board of Directors
Designers are using PC/104 because of the wide array of processor technology, rich I/O,
Stephen St. Amant
President
Flemming Christensen
Vice President
Denis Zhiltsov
Secretary/Treasurer
Jeff Milde
Executive Director PC/104 Consortium
Roy Keeler
Vice President of Marketing
low costs, rugged design, and ease of integration.
Q: What industries are important to PC/104 vendors, who are the primary users, and why? PC/104 CONSORTIUM: We see steady growth for PC/104 technology in industrial automation, aerospace and defense, medical applications, and other embedded industries. The telecommunications industry, not being a strong adopter of PC/104, will see a decline, gradually shrinking to less than 1 percent of PC/104 applications. Designers are using PC/104 because of the wide array of processor technology, rich I/O, low costs, rugged design, and ease of integration. The PC/104 design is ideally suited for integration into small-form-factor computers such as the Parvus DuraCor product line from Curtiss-Wright Defense Solutions, the HPERC from ADLINK Technology, and the M-Max from MicroMax. Q: What are the Consortium’s goals for the next year? PC/104 CONSORTIUM: We are looking to increase the visibility of PC/104 online, in print, and in person to provide value and exposure to our global membership. We are particularly focused on enhancing our presence on social media channels such as Twitter (@pc104consortium) and LinkedIn. We are also nearly finished with www.smallformfactors.com
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APPLICATION TRENDS
Reduced SWaP and application requirements drive innovation in power supplies By Mariana Iriarte, Technology Editor
U.S. Army 1st Lt. Steven Rose launches an RQ-11 Raven unmanned aerial vehicle (UAV) near a new highway bridge project. Photo courtesy of the Department of Defense (DoD) by Spc. Michael J. MacLeod, U.S. Army.
Reduced size, weight, and power (SWaP) and increased standardization requirements for applications from unmanned aircraft to ground vehicles to portable communications systems are driving military power supply designs. Meanwhile, innovations such as gallium nitride (GaN) and silicon carbide (SiC) are improving efficiencies.
Mission priorities drive requirements for military applications, and that is no different for power supplies. For example, to enable persistent surveillance, sensor payloads need more efficient power and the push toward more portable electronics for warfighters requires the same efficiency but in smaller and smaller footprints – pressuring power supply designers to innovate more than ever before.
to longer-duration missions. This often means their power supplies need to have higher efficiency to reduce the energy dissipated as heat and thus maximize the UAV’s mission endurance.
“Power supplies are in demand across multiple segments such as avionics, unmanned aerial vehicles (UAVs), payloads, vetronics, mission computing, to name a few,” says Tom Curatolo, Director, Global Defense & Industrial Business Development, Vicor (Andover, Massachusetts). “Persistent surveillance is a common requirement for UAV intelligence, surveillance, and reconnaissance (ISR) payloads that can translate
“Often, due to the airframe’s construction, the space allotted is either equal to or less than what they had before when they had less of a power demand,” Curatolo continues. “The payloads deployed on
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“Everyone still wants power supplies to be smaller, lighter, more efficient, and at a lower cost, SWaP-C-optimized.” – John Santini, Data Device Corp.
UAVs put the emphasis on size and weight of the overall system, which typically translates to redesigning the power supply. This drives the major challenge: selecting the right technology for the power system.” Smaller footprints Demand for reduced SWaP-C (SWaP plus cost) in power supplies is nothing new. “Everyone still wants power supplies to be smaller, lighter, more efficient, and at a lower cost, SWaP-C-optimized,” says John Santini, Vice President of Power Engineering, at Data Device Corp. (DDC – Bohemia, New York). For example, “In military vehicles, users are looking for higher power because they’re doing more and more from the vehicle,” Santini continues. “We’re also seeing significant activity in portable electronics. There are a lot of portable applications where you see a greater demand for higher power density. Today, soldiers are carrying more electronics than ever before. Powering all the electronics requires batteries and highly efficient power conversion to maximize the available power from this limited source of energy.” The power supply tech is getting smaller, faster, and more efficient. “Everything is driving towards meeting requirements under SWaP-C,” says Robert Russell, Vice President, Product Marketing at Vicor. “UAVs are a great example of lowering SWaP and cost; as UAVs become more and more prevalent, new power topologies, technologies, and architectures need to mature in some of these markets to satisfy the needs of the user.” Reduced SWaP in power supplies is also a consistent requirement in military UAV www.smallformfactors.com
LITHIUM-ION TECH POWERS SOCOM SYSTEMS U.S. Special Operations Command (USSOCOM) officials are tapping into the new safety advances in lithium-ion technology via a contract with General Atomics Electromagnetic Systems (GA-EMS). In the award, GA-EMS will be delivering the company’s Lithium-ion Fault Tolerant (LiFT) battery system (see figure, right) to power up USSOCOM’s submersible craft, which must count on enough power to haul and transfer personnel and equipment to complete Special Operations missions.
Lithium-ion Fault Tolerant (LiFT) battery system. Photo courtesy of General Atomics Electromagnetic Systems.
Engineers at GA-EMS – a General Atomics subsidiary – designed the LiFT so it can be adapted for air, sea, and land platforms. However, safety remains big concern when integrating lithium-ion into any system. “Safety requirements often dictate a large amount of testing under both routine and abnormal conditions. This testing often takes considerable time and money, as well as specialized chambers and test equipment to perform,” GA-EMS officials say. It’s important to note, GA-EMS officials say, that “safe lithium-ion batteries are not a universal replacement for other technologies. Each application and system must be considered individually.” As the GA-EMS engineers searched for higher-density, efficient battery systems that deliver the promised performance of the datasheet, they found that lithiumion technology can deliver the promised performance and safety that special ops need. According to GA-EMS, “when assembled as a complete, tightly integrated system, the LiFT battery system architecture enables access to the benefits of lithium-ion battery performance while minimizing any potential danger of a catastrophic, cascading battery fire.” Therefore, the system was created specifically to prevent uncontrolled and catastrophic cascading lithium-ion failure, says GA-EMS: “This is accomplished with purely passive systems (except for the disconnects), unlike other designs which require forced-flow-cooling water to limit failures. Such systems require the forced-cooling-water system to be safety-rated, adding more parts and complexity.” Compared to lead-acid batteries that emit flammable hydrogen during charging, GA-EMS explains, the lithium-ion batteries “can have longer life cycles, and do not emit anything while charging. “The benefits have outweighed any safety concerns, as lithium-ion “batteries offer greater total energy than competing batteries, and in a range of chemistries that allow the power versus energy tradeoff to be optimized for a given application,” GA-EMS adds. Safety-wise, the LiFT system also “prevents thermal runaway using a multilayered approach, through both electrical and mechanical means. Multiple sensors are used to continuously monitor electrical output, and if a parameter indicates a problem, there are disconnects that can be opened to immediately turn off the electrical demand. There are also multiple fuses available for each cell that can blow and cease current flow. The system relies on several different mechanisms to divert energy away from a cell and its neighbors that are in thermal runaway.” Lithium-ion battery versions are available for many applications, “even extreme environments, albeit at reduced performance,” according to GA-EMS.
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APPLICATION TRENDS platforms. UAVs are a major factor in the next phase of power distribution in critical systems because “UAVs and other military systems are requiring much more power, and this is forcing people to rethink busing current around at 28 volts,” Russell adds. “System architects will need to move up to 48 volt, 380 volt, or even an 800 volt-plus bus for certain applications like tethered UAVs. (Figure 1.) Managing the heat Thermal management in power supplies is another important factor to consider. Adding electronics to an existing platform is a challenge for designers who see no end to the demands for “higher-power, higher-efficiency power supplies,” says Lou Garofolo, Product Manager – Power Supplies & Instruments, at North Atlantic Industries (NAI – Bohemia, New York). In particular, he says, “The military market strictly looks for conduction-cooled, rugged power supplies. In addition, BIT [built-in test], monitoring, and communication features are required in most power-supply applications (Figure 2).
Figure 1 | Vicor’s DCM is an isolated, regulated DC-DC converter. With its high-frequency zero-voltage switching (ZVS) topology, the DCM converter delivers high efficiency across the input line range. Photo courtesy of Vicor.
Figure 2 | The VPX57-31 offers continuous background built-in test (BIT), high-efficiency, and currentshare capabilities. Photo courtesy of North Atlantic Industries (NAI).
“NAI is seeing a trend toward VPX conduction-cooled power supplies, in both 3U and 6U form factors; we are seeing great success with our VPX product line,” he adds. VPX thus becomes an option due to its high-power capabilities. Companies including Milpower Source are “actively designing and shipping new higherpower 3U VPX VITA 62 power supplies for customers requiring tailored solutions, which not only deliver increased power density, now above 1 kW, but also offer integrated features such as hold-up and embedded MIL-STD-461 EMI filters,” says Tomer Eshed, General Manager at Milpower Source (Belmont, New Hampshire) (Figure 3). “Our design and manufacturing process, utilizing discrete components, allows us to reduce integration risk and future obsolescence.” Pushing densities and efficiencies: GaN and SiC While reduced SWaP drives many requirements for power supplies, innovation is happening with gallium nitride (GaN), a particularly hot technology
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battery technologies specifically to soon offer advanced uninterruptible power supply (UPS) solutions for the naval environment.”
Figure 3 | Lithium-ion Fault Tolerant (LiFT) battery system. Photo courtesy of General Atomics Electromagnetic Systems.
Santini concurs. “Today, if you’re looking for game-changers, some of the new semiconductors, SiC and GaN, have shown us a path to raise switching frequencies and reduce losses, especially silicon carbide in higher power applications,” Santini adds. “For instance, for shipboard 440-volt AC systems, SiC is a game-changer for lowering losses and enabling higher switching frequencies.
within military applications such as radar and electronic warfare and silicon carbide (SiC).
“Within a power supply, once you raise the switching frequency, everything just starts to shrink, so that’s a way to take it to the next level in terms of being more compact,” Santini continues. “Although similar to SiC, GaN tends to be a lower-voltage switching device and performs best in low-voltage applications. It’s another technology which is enabling higher switching frequencies, and consequently helping to shrink power supplies and increase their efficiency.”
“New technologies such as silicon carbide (SiC) MOSFETS have been trending in recent years, enabling higher power densities and operational temperatures for military subsystems,” Eshed notes. “Similarly, GaN is becoming more prevalent to continue this trend.
Driving standards and commonality Another trend driving the future of power supply designs is the DoD’s desire for more commonality and standardization in its electronic systems “Two key items which will be very important and possibly game changers are first, requirements to fully comply with VITA 46.11 and second, environmental requirements that if your products are stated to comply with the environmental of VITA 47, you must have a complete data package to present to customers,” Garofolo says.
“Battery chemistries offering higher power capacity at smaller physical volumes are an additional area we are exploring here at Milpower Source,” he adds. “We are anticipating leveraging
“VPX VITA 62 power supplies are a standardized form factor that will reduce the life cycle costs of many military platforms, supporting an open architecture approach to DOD platform integration,” Eshed says. “The ability to customize the pinouts, filtering, and holdup features of a VITA 62-compliant power supply is a game changer for the defense industry.”
SERVING ALL MARKETS The military market is known for its strict environmental requirement, but power supplies and components used in military applications may also be found in commercial applications such as avionics and automobiles – and vice versa. While the “Military market looks for full-featured, high-reliability, rugged power supplies,” Garofolo says, “the commercial market is mainly driven by cost.” “Right now, on the civil side, some of the power supplies are reaching for higher efficiency,” Santini explains. “Everybody is pushing the limit. We’re working on a project right now where the customer is looking for 95 percent efficiency, and we see a path to maybe 94-ish. Of course, that’s for commercial aviation. There are a lot of requirements to meet, such as DO-160 [avionics standard], and hitting a very high efficiency level while meeting those requirements is a challenge.” (see figure, right.)
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Commercial and military grade units often have more in common than one may think: “There have always been [military specifications], and usually equivalent commercial specs, and in so many ways they’re starting to merge,” Santini adds. “Some of the big differences that I see are in the use of full-mil hermetic parts. In the old days – 20 to 25 years – ago you were using all mil parts and that was the norm. Everyone wanted hermetic packaging. Today, what we’re seeing is a willingness to use plastic commercial parts, and some of the manufacturers have offered select parts that are plastic with a pedigree.” However, “There is a parallel with the qualification process in commercial and military applications,” Santini clarifies. “There are all the long-standing mil specs that go back many, many years, and the similar commercial specs have been evolving. Military and commercial specs actually address most of the same requirements, and these days they are only slightly different, and I think that
The 280 watt converter supplies 28 volts of power to IFEC and USB charging ports. Photo courtesy of Data Device Corp.
eventually they will merge. The automotive industry is also impacting power supply designs. “Other manufacturers, ourselves included, are using automotive-grade parts,” Santini says. “Automotive-grade parts, for all practical purposes, need to meet all the same requirements as the mil parts. For some applications, the specs may go to -55 °C instead of -40 °C, let’s say, but it’s not a big difference. This trend is leading to a lot of automotive parts being used in the military world.”
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APPLICATION GUIDE PC/104 CONSORTIUM
History of the PC/104 Consortium The PC/104 Consortium was established in February 1992 by 12 companies with a common vision of adapting desktop computer technology for embedded applications. This consortium has had a tremendous, positive effect on the embedded computer marketplace. The initial release of the PC/104 specification in March of 1992 was an open design offering the power and flexibility of an IBM compatible personal computer in a size ideally suited for embedding. Simple and elegant in design, while small but rugged in performance, PC/104 technology bridged the successes of the past with the promises of future innovations. The ISA bus of the original IBM PC –– as established by the IEEE P996 specification – is still fully supported today by PC/104 technology over two decades after it was created. When demand for a faster, higher-bandwidth bus emerged, the PC/104 Consortium once again followed the desktop PC by adding a PCI bus to the ISA bus. Following on, PC/104-Plus was introduced in February of 1997. By keeping the ISA bus and adding the PCI bus, this specification became an addition to the technology rather than a replacement of any existing technology.
When desktop PCs stopped using the ISA bus, the PC/104 Consortium was ready with PCI-104 technology. The concept of PCI with no ISA was introduced in the original PC/104-Plus specification and was subsequently formally recognized with its own specification in November 2003. Once again, the PC/104 Consortium followed the desktop PC while keeping the legacy specifications intact. This growth pattern underscores the PC/104 Consortium’s desire to support the legacy technology while developing new solutions for the future. Longevity is a requirement for embedded systems and remains one of the hallmarks of PC/104 technology. This aspect is proven time and again by the number of PC/104, PC/104-Plus, and PCI-104 products on the market today, as well as by the number of PC/104 sites on other form-factor boards. To learn more about PC/104 Consortium organization and membership, please visit www.pc104.0g or email the organization at info@pc104.org.
PC/104 Consortium Founding Members
12 y
Ampro
DMS Systems
Real Time Devices
Automation Instruments
Enclosure Technologies
Reflection Technology
BG Technologies
IOTech Inc.
Voice Connection
Diamond Systems
Quantum Software Systems
Xecom
Spring 2019 PC/104 and Small Form Factors Resource Guide
www.smallformfactors.com
PC/104 Consortium Members at Embedded World February 26-28, 2019
| Nuremberg, Germany
| www.embedded-world.de/en
PC/104 CONSORTIUM MEMBER
BOOTH NUMBER
AAEON Technology Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-350 ADL Embedded Solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-554 ADLINK Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-540 Axiomtek. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-456 bplus GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-438 Connect Tech. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-430 Diamond Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-350 ept Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-510 Fastwel Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-512 iBASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-140 OpenSystems Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3A-528 PEAK System Technik. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-483 Samtec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 4/4A-240 Versa Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-257 Win Systems Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-620 Listings and locations are as of 1/2019; subject to change
PC/104 Consortium 2019-2020 Member Directory AAEON Technology Inc. www.aaeon.com
ept Inc. www.ept.de
Red Wave Labs Ltd. www.redwavelabs.com
ADL Embedded Solutions www.adl-usa.com
EVOC Intelligent Technology www.evoc.com
RTD Embedded Technologies www.rtd.com
ADLINK Technology www.adlinktech.com
Fastwel Corp. www.fastwel.com
Samtec www.samtec.com
Advanced Micro Peripherals www.ampltd.com
General Standards Corp. www.generalstandards.com
SBS Science & Technology www.sbs.cn
Alpha Project Co. www.apnet.co.jp
Hivertec www.hivertec.com
Sealevel Systems www.sealevel.com
Apex Embedded Systems www.apexembedded.com
iBASE www.ibase.com/tw
Sundance Multiprocessor Technology www.sundance.com
Axiomtek www.axiomtek.com
MicroMax Computer Intelligence www.micromax.com
Tri M Technologies www.tri-m.com
bplus GmBH www.b-plus.com/en.home.html
MPL AG www.mpl.ch
Umezawa Musen Denki www.umezawa.co.jp
Connect Tech www.connecttech.com
PEAK System Technik www.peak-system.com
Unicorp www.unicorpinc.com
Diamond Systems www.diamondsystems.com
Perfectron www.perfectron.com
Versa Logic www.versalogic.com
Douglas Electronics www.douglas.com
PC/104 and Small Form Factors www.smallformfactors.mil-embedded.com
WinSystems www.winsystems.com
Dynamic Engineering www.dyneng.com/pc104.html
RAF Electronic Hardware www.rafdwe.com
www.smallformfactors.com
Listings and locations are as of 1/2019; subject to change
PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
PC/104 CONSORTIUM COMs and SOMs
conga-TC175 The compact conga-TC175 Computer-on-Modules (COMs) based on the 7th generation of Intel® Core™ SoC processors (codename Kaby Lake) offer compelling features with increased CPU performance, dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory. These high-performance Computer-on-Modules based on the 7th generation of Intel® Core™ processors from Intel’s IOTG embedded roadmap provide the performance required by many of the new application fields of embedded computing within a low power envelope of only 15 W. Demand is found virtually everywhere: from industrial, medical and transportation applications to infotainment and retail as well as in building and home automation. Thanks to its compatibility with the previous generation, these modules with the widely improved microarchitecture can be integrated in nearly all embedded applications thanks to their compact footprint of only 95 mm x 95mm. Furthermore they are a perfect drop-in upgrade for all existing systems based on the standardized COM Express without additional design effort. The standardized COM Express form factor, congatec's extensive industrial driver implementations as well as personal integration support and individual customization services make it particularly easy for developers to integrate this generation. Target applications are found wherever fanless and completely sealed systems must offer high performance.
congatec
www.congatec.us
FEATURES ĄĄ The conga-TC175 COM Express Compact modules come equipped with
three different low-power dual-core variants of Gen 7 Intel® Core™ i7, i5 and i3 SoC processors and offer also a cost efficient Intel® Celeron® variant.
ĄĄ The TDP of all variants is configurable from 7.5 to15 Watts, which makes
it easier to adapt the application to the energy concept of the system.
ĄĄ All modules support up to 32 GB fast and energy efficient dual channel
DDR4 memory, which boasts significantly more bandwidth and higher energy efficiency than conventional DDR3L implementations.
ĄĄ The Intel® Gen 9 HD Graphics 620 offers high graphics performance with
latest DirectX 12 capabilities and supports up to three independent displays with up to 4k @ 60 Hz via eDP 1.4, DisplayPort 1.2 and HDMI 2.0a. www.congatec.us
sales-us@congatec.com
www.linkedin.com/company/congatec/
858-457-2600 @congatecAG
COMs and SOMs
conga-TS175 The high-performance conga-TS175 Server-on-Module equipped with the high-end Intel® Xeon® and Gen 7 Intel® Core™ processors (codename Kaby Lake) sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads. Application areas for these high-end COM Express Type 6 Server-on-Modules can be found everywhere where data intensive streams need to be processed and displayed in real time. Target markets include big data processing embedded clouds, edge and fog servers, medical imaging systems, video surveillance and vision-based quality control, simulation equipment, host systems for virtualized control technology, vision systems in industrial control rooms and other plant-wide supervision systems or high-end professional gaming and digital signage. Compared to their predecessors, the new modules host increased CPU frequencies and performance, more dynamic HDR graphics thanks to 10-bit video codecs, and support super-fast Intel® Optane™ memory offering a significantly lower latency while handling the same size of data packets compared to NAND SSDs. These new modules set the latest state-of-the-art benchmark for high-end Server-on-Module applications and high-end embedded use cases with hyper threading within an embedded power envelope of less than 45 Watts.
congatec
www.congatec.us 14 y
FEATURES ĄĄ
ĄĄ
ĄĄ
High scalability from Intel® Xeon® processors to Intel® Core™ i3 processors within a 45 to 25 W TDP envelope. High bandwidth for data intensive applications with up to 32 gigabytes of fast dual channel 2400 DDR4 memory – including ECC support option. Extensive graphics capabilities for up to three independent 4k-UHD displays via a broad range of interfaces including DisplayPort 1.4, HDMI 2.0 with HDCP 2.2 as well as eDP 1.4 and dual channel LVDS and VGA for legacy displays.
sales-us@congatec.com
www.linkedin.com/company/congatec/
Spring 2019 PC/104 and Small Form Factors Resource Guide
www.congatec.us
858-457-2600 @congatecAG
www.smallformfactors.com
M.2 Apacer M.2 is a next-generation modularized Solid State Drive (SSD) that is suitable for mobile and compact computers. This product appears in 2242 and 2280 mechanical dimensions and is the leading add-in storage solution for future host computing systems. Apacer M.2 is designed with SATA-based connector pinouts, providing full compliance with either the latest PCIe NVMe 1.3 Gen3 x2 interface or SATA Revision 3.1 interface specifications to optimize access performance. Apacer M.2 delivers either PCIe or SATA compliance alongside exceptional performance and power efficiency, while its extremely thin and light form factor makes it the ideal choice for high-speed computing and real-time data processing. Apacer M.2 is provided with the latest version of Apacer's S.M.A.R.T. for lifetime monitoring and analyzing. Furthermore, with Advanced Encryption Standard (AES) and Trusted Computing Group (TCG) Opal support, Apacer M.2 ensures data security and provides users with the peace of mind that comes from knowing their data is safeguarded against unauthorized use at all times.
FEATURES ĄĄ Global Wear-Leveling Technology ĄĄ AES256 / TCG Opal 2.0 (option) ĄĄ Extended Temperature (option) ĄĄ Power Failure Management ĄĄ End-to-End Data Protection ĄĄ Thermal sensor (option) ĄĄ Support LDPC ECC www.apacer.com/en
408-518-8699
APACER MEMORY AMERICA INC
http://industrial.apacer.com/en-ww
Sales Inquiry: ssdsales@apacerus.com Tech Support: ssdfae@apacerus.com
Hardware and Peripherals
PCAN-PCI/104-Express FD FEATURES: ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
PCI/104-Express card, 1 lane (x1) Form factor PC/104 Up to four cards can be used in one system 1, 2, or 4 High-speed CAN channels (ISO 11898-2) Complies with CAN specifications 2.0 A/B and FD (ISO and Non-ISO) CAN FD bit rates for the data field (64 bytes max.) from 20 kbit/s up to 12 Mbit/s CAN bit rates from 20 kbit/s up to 1 Mbit/s Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 303-1) FPGA implementation of the CAN FD controller Microchip CAN transceiver MCP2558FD Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel CAN termination and 5-Volt supply to the CAN connection can be activated through a solder jumper Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Optionally available: PCI-104 stack-through connector
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-5
www.smallformfactors.com
CAN FD Interface for PCI/104-Express The PCAN-PCI/104-Express FD allows the connection of PCI/104-Express systems to CAN and CAN FD busses. Up to four cards can be stacked together. The CAN bus is connected via 9-pin D-Sub connectors to the supplied slot brackets. There is a galvanic isolation between the computer and the CAN side up to 500 Volts. The card is available as a single, dual, or four-channel version. The monitor software PCAN-View and the programming interface PCAN-Basic are included in the scope of supply and support the new standard CAN FD.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PCAN-PC/104 FEATURES: ĄĄ Form factor PC/104
ĄĄ Multiple PC/104 cards can be operated in parallel (interrupt sharing) ĄĄ 14 port and 8 interrupt addresses are available for configuration
using jumpers
ĄĄ 1 or 2 High-speed CAN channels (ISO 11898-2)
CAN Interface for PC/104
ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)
The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing.
ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s
ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin ĄĄ ĄĄ ĄĄ ĄĄ
(in accordance with CiA® 303-1) NXP SJA1000 CAN controller, 16 MHz clock frequency NXP PCA82C251 CAN transceiver 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)
Optionally available:
ĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each
CAN channel
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-1
The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
Hardware and Peripherals
PCAN-PC/104-Plus FEATURES:
ĄĄ Form factor PC/104
ĄĄ Use of the 120-pin connection for the PCI bus ĄĄ Up to four cards can be used in one system
CAN Interface for PC/104-Plus
ĄĄ 1 or 2 High-speed CAN channels (ISO 11898-2) ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s
ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin ĄĄ ĄĄ ĄĄ
(in accordance with CiA® 303-1) NXP SJA1000 CAN controller, 16 MHz clock frequency NXP PCA82C251 CAN transceiver 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)
The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied.
Optionally available:
The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.
CAN channel ĄĄ PC/104-ISA stack-through connector
The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
ĄĄ
ĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-2
16 y
Spring 2019 PC/104 and Small Form Factors Resource Guide
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
www.smallformfactors.com
PCAN-PC/104-Plus Quad FEATURES: ĄĄ Form factor PC/104
ĄĄ Use of the 120-pin connection for the PCI bus ĄĄ Up to four cards can be used in one system
ĄĄ 4 High-speed CAN channels (ISO 11898-2)
Four-Channel CAN Interface for PC/104-Plus
ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)
The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides.
ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s
ĄĄ Connection to CAN bus through D-Sub slot brackets, 9-pin ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
(in accordance with CiA® 303-1) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)
Optionally available:
ĄĄ PC/104-ISA stack-through connector
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-3
The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
Hardware and Peripherals
PCAN-PCI/104-Express FEATURES: ĄĄ PCI/104-Express card, 1 lane (x1) ĄĄ Form factor PC/104
ĄĄ Up to four cards can be used in one system
CAN Interface for PC/104-Express
ĄĄ 1, 2, or 4 High-speed CAN channels (ISO 11898-2) ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s
ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
(in accordance with CiA® 303-1) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Supplied only via the 5 V line 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Optionally available: PCI-104 stack-through connector
PEAK-System Technik GmbH
www.peak-system.com/quick/PC104-4
www.smallformfactors.com
The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN busses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The card is available as a single, dual, or four-channel version. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.
info@peak-system.com
www.linkedin.com/company/peak-system
+49 (0) 6151-8173-20
@PEAK_System
PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
PC/104 and Small Form Factors Resource Guide
Hardware and Peripherals
High-Speed M.2 Carrier RTD’s new M.2 SSD storage solution leverages the PCIe/104 Type 2 connector to provide NVMe and SATA connections to the host CPU. Single (SSD24100HR) or dual socket (SSD24200HR) ordering options are available, with the dual M.2 option being particularly attractive to SWaP-sensitive applications which were formerly limited to 2.5" storage solutions. Sequential writes up to 1,405 MB/sec with Apacer’s NVMe M.2 SSD modules make the SSD24x00HR a perfect high-speed storage solution for RTD’s new 25 MSPS data acquisition module.
FEATURES ĄĄ High speed SSD storage ĄĄ Up to two M.2 sockets in the socket 3 configuration (M key) support ĄĄ
Like all of RTD’s single board computers and peripheral modules, this M.2 carrier is designed and manufactured by RTD engineers in State College, Pennsylvania. Ruggedized enclosure options are available.
ĄĄ
www.rtd.com
ĄĄ
RTD Embedded Technologies, Inc. www.rtd.com
ĄĄ
SATA and PCI Express SSDs SATA SSDs supported through AHCI with theoretical transfer rates up to 6 Gbit/s per SATA link (SATA revision 3.1) PCI Express SSDs supported through NVMe (Non-Volatile Memory Express) with theoretical transfer rates up to 985 MB/s per PCIe lane (PCIe revision 3.0) Transfer rates are device dependent and may be limited by the host cpuModule’s SATA controller Uses PCIe x4 links and SATA links from the host PCIe Type 2 cpuModule
sales@rtd.com
814-234-8087
IoT
RTD Off-the-Shelf Mission Computer RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, mSATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integrity of the environmental seal.
RTD Embedded Technologies, Inc. www.rtdstacknet.com/iot 18 y
Spring 2019 PC/104 and Small Form Factors Resource Guide
FEATURES ĄĄ -40 to +85°C standard operating temperature ĄĄ Designed for high ingress protection in harsh environments ĄĄ Milled aluminum enclosure with integrated heat sinks and
heat fins
ĄĄ Rugged Intel and AMD-based Single Board Computers ĄĄ High-performance, synchronized power supply ĄĄ mSATA card carrier and optional 2.5" removable drive ĄĄ Designed to include an additional PCIe/104, PCI/104-Express
or PCI-104 peripheral module without increasing overall enclosure size
www.rtd.com
sales@rtd.com
814-234-8087
www.smallformfactors.com
Managed Scalable GigE Switch The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports. Eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides features for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH. www.rtd.com
RTD Embedded Technologies, Inc. www.rtdstacknet.com
FEATURES ĄĄ -40 to +85°C operation, passively cooled ĄĄ PCIe/104 stackable bus structure ĄĄ Eight 1000/100/10 Mbps Ethernet ports plus one host port and one
stacking switch expansion port
ĄĄ Onboard tri-color LED for each Ethernet Port ĄĄ RJ-45 jacks or 10-pin right-angle headers ĄĄ Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet
processing • Support for all major Enterprise switching features such as VLANs, Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interface ĄĄ Onboard PCI Express Ethernet Controller for interface to host cpuModule ĄĄ USB Device Port for Serial Console command-line interface ĄĄ Passive heat sink included • Available in stackable, rugged enclosures
sales@rtd.com
814-234-8087
SBCs and Boards
ADLE3900SEC Intel® E3900 Series Edge-Connect SBC Measuring just 75mm x 75mm, the ADLE3900SEC is an embedded SBC specially optimized for Size, Weight, and Power (SWAP) applications. Based on the E3900 series Intel Atom™ SoC, this tiny board delivers maximum performance in the smallest possible size. It features low-power quad and dual core processors with up to 2MB onboard cache and an integrated Intel HD Graphics engine capable of DisplayPort video output = 4K resolution at 60 Hz.
ABOUT EDGE-CONNECT ARCHITECTURE: Via the backside board-edge connector, additional I/O are easily accessible using standard and customerspecific breakout boards. Easy expansion helps reduce cabling, integration time and system size while increasing quality and overall MTBF.
FEATURES ĄĄ
Compact size (75mm x 75mm)
Easily connect to sensors, cameras and storage with a full range of onboard I/O: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie, and SATA. The Intel HD Graphics engine supports video output in either HDMI or Display Port format. An onboard M.2 socket allows users to install the fastest Solid State storage solutions on the market. Extended Temperature Ratings and hardmounted Edge-Connect design make the ADLE3900SEC ideal for rugged embedded applications.
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Low power Atom® processor (6.5W – 12W TDP)
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15 year availability
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Rugged, Soldered 4GB DDR4 Memory
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Optional -40 °C to +85 °C Screening
ĄĄ
Expansion Connector
APPLICATIONS: Industrial IoT Edge devices, Cyberthreat Security devices,
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Microsoft Azure Certified for IoT
ICS/SCADA devices, Rugged Industrial systems, Traffic Engineering, Security Video Surveillance, Small Scale Robotics, Remote Datalogging
ADL Embedded Solutions Inc. www.adl-usa.com
www.smallformfactors.com
www.adl-usa.com
sales@adl-usa.com
855-727-4200
www.linkedin.com/company/adl-embedded-solutions PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
IoT
PC/104 and Small Form Factors Resource Guide
SBCs and Boards
ADLE3900HD, ADLE3900HDC Intel® E3900 Series 3.5" SBCs ADL’s newest 3.5-inch SBCs (ADLE3900HD and ADLE3900HDC) are based on Intel’s E3900-series Atom product family which was built using Intel’s 14nm 3D Tri-gate process. It offers vastly superior compute performance and energy efficiency and Intel’s 7th generation graphics engine for stunning graphics performance. Improved power management capabilities result in standby power measured in milliwatts with days of standby time. Their high-performance graphics engine is capable of decoding 10 or more streams of 1080p video, has integrated hardware acceleration for video decode of H.264, MVC, VPG8, VC1/WMV9 and others standards. It also supports DirectX, Open GL 4.0, full HD video playback and a maximum resolution of 4K @ 60Hz.
APPLICATIONS:
FEATURES ĄĄ Intel® E3900 Series SoC Processors; DC/Quad ĄĄ CPU TDP 6.5W to 12W
ĄĄ Stunning Display Resolution of 4K @ 60 Hz
ĄĄ 3x 10/100/1000 Mbit Ethernet LAN Port; Intel i210; 2x RJ45,
1x Pin Connector
Ideal for rugged, extended temperature embedded systems with a temperature range of -40 °C to +85 °C. Suited for extreme environments such as industrial control and automation and in-vehicle communication and infotainment systems for commercial transportation systems. It’s superior graphics also make it ideal for rugged mobile computing, digital signage with secure content delivery, portable medical devices and interactive kiosks, vending, ATM and point-of-sale (POS) terminals.
ĄĄ 8x USB 2.0 Total: 4x Standard USB Connector, 4x pin
ADL Embedded Solutions Inc.
Connector
ĄĄ I-PEX Connector for Custom DVI/HDMI/DP or 1x USB 3.0
Cabling ĄĄ Microsoft Azure Certified for IoT
www.adl-usa.com
sales@adl-usa.com
855-727-4200
www.linkedin.com/company/adl-embedded-solutions
www.adl-usa.com
SBCs and Boards
Intel Atom E3800-based SBC
The CMX34BT is an advanced PC/104 single board computer and controller with a PCIe/104 stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. The CMX34BTseries CPUs are available in quad-core, dual-core, and single -core configurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel DDR3 SDRAM and a 32GB industrial-grade surface-mount SATA flash drive. www.rtd.com
RTD Embedded Technologies, Inc. www.rtd.com/atom 20 y
Spring 2019 PC/104 and Small Form Factors Resource Guide
FEATURES ĄĄ PCIe/104 stackable bus structure ĄĄ Available in modular, rugged enclosures and eBuild systems ĄĄ Intel Atom E3800 Series Processor
ĄĄ ĄĄ ĄĄ
ĄĄ ĄĄ
• Clock Speed: 1.33 GHz, 1.46 GHz, and 1.91 GHz options • Max. Core Temperature: 110°C 4GB Single-Channel DDR3 SDRAM (Surface-Mounted) 32GB Surface-mounted industrial-grade SATA flash drive 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 9 USB ports, Dual Gigabit Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/O -40 to +85°C standard operating temperature Thermal-optimized passive heat sink included sales@rtd.com
814-234-8087
www.smallformfactors.com
PX1-C415 PPC/104 OneBank™ Intel® E3900 Single Board Computer with Dual Ethernet WinSystems’ PX1-C415 single board computer is a PC/104 form factor SBC with PCIe/104™ OneBank™ expansion and the latest generation Intel® Atom™ processor. Its small size, rugged design and extended temperature make it ideal for industrial IoT applications and embedded systems in industrial control, transportation, Mil/COTS, and energy markets.
FEATURES ĄĄ Intel® Atom™ E3900 Processor (Dual or Quad-core) ĄĄ Up to 8 GB DDR3-LV System RAM ĄĄ -40°C to +85°C Operating Temperature Range ĄĄ Shock and Vibration Tested ĄĄ Multiple Displays Supported
We Specialize in High Reliability Custom Embedded Solutions
ĄĄ Connectivity and I/O for Embedded Systems ĄĄ Expansion Options: PCIe/104™ OneBank™, M.2 Socket ĄĄ 24 GPIO with Event Sense
www.winsystems.com/product/px1-c415/
WinSystems, Inc.
www.winsystems.com
sales@winsystems.com www.linkedin.com/company/winsystems-inc-/
817-274-7553 @winsystemsinc
Hardware
SBC35-C427 Industrial E3900 SBC with Dual Ethernet, Multi-Display and Robust Expansion WinSystems’ SBC35-C427 is an industrial single board computer (SBC) in 3.5-Inch form factor, featuring the Intel® Atom™ E3900 series processor. Its combination of off-the-shelf functionality with multiple expansion and configuration options make it a great fit for industrial IoT applications.
FEATURES ĄĄ -40°C to +85°C Operational Temperature Range ĄĄ 3 Simultaneous Display Outputs ĄĄ Dual Ethernet
We Specialize in High Reliability Custom Embedded Solutions
ĄĄ Hi-Definition Audio ĄĄ 8 Bidirectional GPIO ĄĄ MiniPCIe/MSATA Socket ĄĄ Onboard eMMC SSD up to 64G
www.winsystems.com/product/sbc35-c427/
WinSystems, Inc.
www.winsystems.com www.smallformfactors.com
sales@winsystems.com
www.linkedin.com/company/winsystems-inc-/
817-274-7553
@winsystemsinc
PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
SBCs and Boards
PC/104 and Small Form Factors Resource Guide
Shipboard Electronics/Sonar
64-Channel Sonar Boards • • • • • • •
Double the number of channels per board (64-channels) Custom Channel Sync Among 500 channels Max 50 Nanosecond Delay Low Power Consumption Low SKEW Low Noise Saves Space
Major Navy Contractors Choose Us! 24DSI64C200K – New Product! Available Now! 24-Bit, 64-Channel, 200KSPS, PCI-Express Module
FEATURES ĄĄ 64 differential 24-Bit simultaneously-sampled analog input
channels. Optional 48 and 32-channel versions also available.
ĄĄ Input sample rates from 1KSPS to 200KSPS per channel. ĄĄ Fixed input range available from 2Vpp (±1V) to 5Vpp (±2.5V).
Call for availability of a specific range.
ĄĄ Continuous and Burst (one-shot) sampling modes. ĄĄ Sample clock source selected as internal or external. ĄĄ Supports multiboard synchronization of analog inputs. ĄĄ On-demand internal offset and gain autocalibration of all
analog inputs.
ĄĄ Delta-Sigma input conversion minimizes or eliminates the
ĄĄ 4-Bit bi-directional digital TTL port.
need for antialias filtering.
ĄĄ Precision DC characteristics as well as wide dynamic range
AC performance.
ĄĄ High-density Front-Panel system I/O connections. ĄĄ PCI Express control interface, single-lane. ĄĄ Available in PMC or XMC form factors with reduced
ĄĄ 256K-sample analog input FIFO buffer. ĄĄ Typical dynamic range of 102dB; 120dB with 10kHz software
postfilter.
channel-count.
ĄĄ Custom Cables for this board. http://www.generalstandards.com/sonar.php
General Standards Corporation www.GeneralStandards.com 22 y
Spring 2019 PC/104 and Small Form Factors Resource Guide
sales@generalstandards.com
1-800-653-9970
www.smallformfactors.com
Sidekiq X4 RF Transceiver The programmable Sidekiq™ X4 multi-channel RF transceiver card introduces a new level of RF integration and capability, reducing product development times and improving wideband range, versatility, and performance. Integrating two Analog Devices’ ADRV9009 wideband transceivers, Sidekiq X4 creates a very flexible, high capacity RF transceiver solution that resides in VITA 57.1 FPGA Mezzanine Card (FMC) compliant form factor. These features, along with multi-band preselect filtering on each of the four receive paths, facilitate the development of complex RF solutions and applications such as: Satellite Communications; Digital Radio Frequency Memory (DRFM); EW/EA Systems; Wideband RF Record and Playback; Spectrum Monitoring; 5G Cellular Systems; 802.11 AC/AX Systems; and, Direction Finding. Sidekiq X4 supports lab and field deployments with a COTS PCIe-based FPGA carrier card integrated into a Thunderbolt™ 3 chassis. For ruggedized deployments, Sidekiq X4 can be integrated into COTS 3U or 6U VPX carrier cards. Both conduction and convection cooled options are supported. The Sidekiq X4 Platform Development Kit (PDK) provides customers with access to both a software API for interfacing to the card, as well as the source code for the FPGA reference design targeting a Xilinx Kintex® UltraScale™ XCKU060 device.
Epiq Solutions
https://epiqsolutions.com
FEATURES ĄĄ VITA 57.1 FPGA Mezzanine Card (FMC) with high pin count (HPC)
interface
ĄĄ Four RF receivers (phase coherent or independently tunable) ĄĄ Four RF transmitters (phase coherent or two phase coherent pairs) ĄĄ Continuous RF tuning range between 1 MHz and 6 GHz ĄĄ Configurable RF channel bandwidth up to 200 MHz per channel,
supporting up to 800 MHz instantaneous bandwidth (IBW)
ĄĄ Exceptional dynamic range with 16-bit A/D and 14-bit D/A converters ĄĄ 3U VPX and PCIe3/Thunderbolt™ 3 deployment options available with
COTS carriers
https://epiqsolutions.com/modules/sidekiq-x4/
sales@epiqsolutions.com
www.linkedin.com/company/epiq-solutions/
847-598-0218
Wireless
Sidekiq Z2 RF Transceiver Sidekiq™ Z2 is an industrial grade, highly integrated wideband RF transceiver plus Linux computer on a tiny module measuring just 30mm x 51mm x 5mm. Sidekiq Z2 radically simplifies typical RF product development cycles, allowing engineering teams to focus their efforts on their applications instead of time-consuming RF design and integration tasks. This tiny card is ideal for small form factor radio products needing flexibility and low power consumption, such as handheld RF test and measurement, remote RF sensing, wireless security applications, CubeSat/UAS datalinks, and more. Sidekiq Z2 combines an Analog Devices' AD9364 wideband 1x1 RF transceiver (70 MHz to 6 GHz) and a Xilinx Zynq® XC7Z010-2I System-on-Chip running Linux on its dual-core ARM Cortex A9 CPU. With integrated RF filtering, a high stability clock, RF shielding, and an industrial temperature rating (-40 to +85 deg C), Sidekiq Z2 has been designed from day one for deployments in harsh environments. For applications with stringent power consumption requirements, Sidekiq Z2 can boot Linux in under two seconds, with a typical system power consumption under two watts. The developer-focused Sidekiq Z2 has an Evaluation Kit (EVK) that includes two Sidekiq Z2 cards pre-loaded and supported by Analog Devices‘ open source IIO reference design, two simple carrier cards, and an I/O expander board for accessing GPIO and JTAG to kick-start initial development. A Platform Development Kit (PDK) can further accelerate time to market by providing compatibility with Epiq’s standard Sidekiq API, enhanced technical support, and an optimized FPGA reference design to maximize the processing potential of the FPGA.
Epiq Solutions
https://epiqsolutions.com www.smallformfactors.com
FEATURES ĄĄ Wideband RF Transceiver (Analog Devices’ AD9364) • 1Rx + 1Tx RF Transceiver (70 MHz to 6 GHz RF tuning range) • Four band Rx pre-select filter bank • Up to 61.44 Msamples/sec sample rate • 40 MHz TCVCXO ref clock with +/- 1 PPM stability ĄĄ Linux Computer (Xilinx Zynq XC7Z010-2I) • Dual-core ARM Cortex A9 CPU running Linux • 512 MB of DDR3L RAM • 32 MB of QSPI flash memory • Linux boot time of under 2 seconds ĄĄ Physical + I/O Specs • 30mm x 51mm x 5mm (full size MiniPCIe) • Weight: 8 grams • Component temperature rating: -40* deg C to +85 deg C • Typical power consumption under 2W https://epiqsolutions.com/modules/sidekiq-z2/
sales@epiqsolutions.com
www.linkedin.com/company/epiq-solutions/
847-598-0218
PC/104 and Small Form Factors Resource Guide Spring 2019
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PC/104 and Small Form Factors Resource Guide
Wireless
Major Navy Contractors Choose Us! 64-Channel Sonar Boards - Available Now! l Double
the number of channels per board (64-channels) l Custom Channel Sync Among 500 channels 24DSI64C200K - New Product! l Max 50 Nanosecond Delay 24-Bit, 64-Channel, 200KSPS, PCI-Express Module l Low Power Consumption l Low SKEW l Low Noise l Saves Space
We offer free loaner boards.
Free software drivers for Windows®, LabVIEW, and Linux.
For more information on this board: http://www.generalstandards.com/sonar.php
64 differential 24-Bit simultaneously-sampled analog input channels. Optional 48 and 32-channel versions also available. Input sample rates from 1KSPS to 200KSPS per channel. l Fixed input range available from 2Vpp (±1V) to 5Vpp (±2.5V). Call for availability of a specific range. l Delta-Sigma input conversion minimizes or eliminates the need for antialias filtering. l Precision DC characteristics as well as wide dynamic range AC performance. l 256K-sample analog input FIFO buffer. l Typical dynamic range of 102dB; 120dB with 10kHz software postfilter. l Continuous and Burst (one-shot) sampling modes. l Sample clock source selected as internal or external. l Supports multiboard synchronization of analog inputs. l On-demand internal offset and gain autocalibration of all analog inputs. l 4-Bit bi-directional digital TTL port. www.GeneralStandards.com l High-density Front-Panel system I/O connections. l PCI Express control interface, single-lane. l Available in PMC or XMC form factors with reduced channel-count. l Custom Cables for this board. l l
1-800-653-9970