VITA Technologies Spring 2021 with Resource Guide

p. 5 Editor’s Foreword Pfizer Fit

p. 8 Defining Standards VRT standard in action

Advertiser Index Page Advertiser

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Behlman Electronics, Inc. – When it comes to VPX, one company has the most flavors

ASSOCIATE EDITOR Emma Helfrich emma.helfrich@opensysmedia.com ONLINE EVENTS MANAGER Josh Steiger josh.steiger@opensysmedia.com CREATIVE DIRECTOR Stephanie Sweet stephanie.sweet@opensysmedia.com

Dawn VME Products – Dawn single slot OpenVPX development backplanes

SENIOR WEB DEVELOPER Aaron Ganschow aaron.ganschow@opensysmedia.com WEB DEVELOPER Paul Nelson paul.nelson@opensysmedia.com CONTRIBUTING DESIGNER Joann Toth joann.toth@opensysmedia.com

Elma Electronic – Liquid flow-though VITA 48.4 cooling technology in rugged OpenVPX ATR platform Elma Electronic – VITA 48.4 liquid flow-through cooling

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LCR Embedded Systems – VPX packaging for mission critical applications

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Pentek – The next big thing in RFSoC is here. (And it’s only 2.5 inches wide!)

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ASSISTANT MANAGING EDITOR Lisa Daigle lisa.daigle@opensysmedia.com

Behlman Electronics, Inc. – The VPX power supply family with the highest IQ

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VITA EDITORIAL DIRECTOR Jerry Gipper jerry.gipper@opensysmedia.com GROUP EDITORIAL DIRECTOR John McHale john.mchale@opensysmedia.com

Smart EC (Smart Embedded Computing) – Over 40 years of leadership

EMAIL MARKETING SPECIALIST Drew Kaufman drew.kaufman@opensysmedia.com

SALES/MARKETING DIRECTOR OF SALES AND MARKETING Tom Varcie tom.varcie@opensysmedia.com (734) 748-9660 MARKETING MANAGER Eric Henry eric.henry@opensysmedia.com (541) 760-5361 STRATEGIC ACCOUNT MANAGER Rebecca Barker rebecca.barker@opensysmedia.com (281) 724-8021 STRATEGIC ACCOUNT MANAGER Bill Barron bill.barron@opensysmedia.com (516) 376-9838 STRATEGIC ACCOUNT MANAGER Kathleen Wackowski kathleen.wackowski@opensysmedia.com (978) 888-7367 SOUTHERN CAL REGIONAL SALES MANAGER Len Pettek len.pettek@opensysmedia.com (805) 231-9582 ASSISTANT DIRECTOR OF PRODUCT MARKETING/SALES Barbara Quinlan barbara.quinlan@opensysmedia.com (480) 236-8818

Vector Electronics – VME/VXS/cPCI chassis, backplanes & accessories

STRATEGIC ACCOUNT MANAGER Glen Sundin glen.sundin@opensysmedia.com (973) 723-9672 INSIDE SALES Amy Russell amy.russell@opensysmedia.com TAIWAN SALES ACCOUNT MANAGER Patty Wu patty.wu@opensysmedia.com CHINA SALES ACCOUNT MANAGER Judy Wang judywang2000@vip.126.com EUROPEAN MARKETING SPECIALIST Steven Jameson steven.jameson@opensysmedia.com +44 (0)7708976338

WEBCASTS SOSA Conformance and What it Means to You Sponsored by Elma Electronic, Kontron, and Pentek https://bit.ly/3tE2bff

www.opensysmedia.com PRESIDENT Patrick Hopper patrick.hopper@opensysmedia.com EXECUTIVE VICE PRESIDENT John McHale john.mchale@opensysmedia.com EXECUTIVE VICE PRESIDENT Rich Nass rich.nass@opensysmedia.com EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass rich.nass@opensysmedia.com

How Will SOSA 1.0 Impact Radar & Electronic Warfare Designs Sponsored by Annapolis Micro Systems, Elma Electronic, Kontron, and Pentek https://bit.ly/3eydP5h

ECD EDITOR-IN-CHIEF Brandon Lewis brandon.lewis@opensysmedia.com TECHNOLOGY EDITOR Curt Schwaderer curt.schwaderer@opensysmedia.com SENIOR EDITOR Sally Cole sally.cole@opensysmedia.com ASSOCIATE EDITOR Perry Cohen perry.cohen@opensysmedia.com ASSISTANT EDITOR Tiera Oliver tiera.oliver@opensysmedia.com CREATIVE PROJECTS Chris Rassiccia chris.rassiccia@opensysmedia.com PROJECT MANAGER Kristine Jennings kristine.jennings@opensysmedia.com MARKETING COORDINATOR Katelyn Albani katelyn.albani@opensysmedia.com FINANCIAL ASSISTANT Emily Verhoeks emily.verhoeks@opensysmedia.com

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SPRING 2021 | VOLUME 39 | NUMBER 1

@VitaTechnology

On the cover The VITA Technologies 2021 Resource Guide showcases technologies and products based on VITA standards. The product categories are hardware and embedded hardware, EMC, OpenVPX, VME, VPX, OpenVPX, and XMC. Also in this issue: A wrap-up of the virtual Embedded Tech Trends 2021, updates on the activity of the VITA Standards Organization, data transport using sFPDP, and more.

Embedded Tech Trends 2021 Wrap-up » p. 12

FEATURES

By Jerry Gipper, VITA Editorial Director

Special Feature 12 16

Embedded Tech Trends in Depth

Embedded Tech Trends 2021 Wrap-up

By Jerry Gipper, VITA Editorial Director

VITA Technologies Hall of Fame

By Jerry Gipper, VITA Editorial Director

Technology Feature 18

High-Reliability Electronics

Lead-free or not lead-free: High-reliability options for system designers

By Ivan Straznicky, Curtiss-Wright Defense Solutions

Lead-free or not lead-free: High-reliability options for system designers

Technology Feature 22

By Ivan Straznicky, » p. 18 Curtiss-Wright Defense Solutions

Data Links

sFPDP: Optimized Data Transport

By Patrick Mechin and Philippe Marvin, Techway

DEPARTMENTS

5 Editor’s Foreword

Jerry Gipper

Pfizer Fit

6 VITA Standards Update

VITA Standards Organization activity updates

8 Defining Standards

VITA 49: VITA Radio Transport (VRT) Standard in Action

sFPDP: Optimized Data Transport » p. 22

Jerry Gipper

By Patrick Mechin and Philippe Marvin, Techway

26 VITA Technologies Resource Guide To unsubscribe, email your name, address, and subscription number as it appears on the label to: subscriptions@opensysmedia.com

All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2021 OpenSystems Media © 2021 VITA Technologies enviroink.indd 1

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www.vita-technologies.com

Editor’s Foreword

By Jerry Gipper, Editorial Director @VitaTechnology

jerry.gipper@opensysmedia.com

Pfizer Fit What a difference a year makes! Last spring, we were deep into sheltering in place as the COVID-19 pandemic unfolded. None of us knew exactly what to expect or how long the restrictions would last. We were scrambling to figure out what the “new normal” would look like. The hope of a vaccine was in the distant future, as the historic average time to develop a vaccine was well over ten years. We struggled as our leaders made a political debacle of the scientific community (I’m being generous with this statement!).

Welcome to 2021, and with the turn of the year, several very effective vaccines. As recently as last fall, it was unclear when we might have a vaccine. Now more than 25% of the U.S. population has been vaccinated, including yours truly! Two doses of the Pfizer vaccine have me ready to get back on the road. It is amazing how your outlook changes once you have been vaccinated! Virtually overnight, I started to gain a more positive outlook and recaptured my desire to get out and engage with humans again! Sorry, Zoom!

We still have a long way to go, but at the current pace, we should be in a great place by this summer. I encourage anyone who has not been vaccinated to get one. Fighting this pandemic is a team effort and everyone needs to step up.

THIS YEAR – 2021 – MARKS THE 40TH ANNIVERSARY OF THE INTRODUCTION OF VMEBUS. THE WHEELS ARE SPINNING FOR IDEAS ON POSSIBLE WAYS TO CELEBRATE THIS GREAT MILESTONE. It is still unclear what long-term impact the pandemic will have on business. There are more signs that people are returning to their offices. However, business travel is still very limited and forecasted to be restricted well into 2021, if not for the entire year. We are still contemplating holding in-person standards meetings in 2021, maybe by September. It does seem clear that we will not hold as many in-person meetings each year, perhaps two at the most in the years going forward.

I recently announced that Dean Holman, formerly of Mercury Systems, has joined the VITA staff as assistant executive director. Dean and I have been working to bring him up to speed on the daily operation of VITA. We are also looking at several improvements to provide an even better experience for VITA members and others interested in VITA technologies. I am excited to have someone of Dean’s caliber on the VITA staff.

Our industry lost a legendary figure recently: Warren Andrews passed this winter. Warren combined his engineering, marketing, and journalistic skills to identify and analyze leadingedge technologies and trends. His participation in the embedded computing industry in all of his roles inspired many to greater heights. His many articles and market analyses provided insight into this emerging part of the computer industry.

He was a close friend and mentor who had a profound influence on me and the choices I made in my career. He will be missed.

After a lot of urging and moral support, we decided to hold a virtual Embedded Tech Trends event in January. Skills learned in countless Zoom meetings throughout 2020 were put to good use! More details on the event can be found in the review article “Embedded Tech Trends 2021 Wrap-up,” found on page 12.

This year – 2021 – marks the 40th anniversary of the introduction of VMEbus. The wheels are spinning for ideas on possible ways to celebrate this great milestone. I am gathering ideas and materials to post on the VITA website and to run in the fall 2021 issue of VITA Technologies. If you have suggestions, please reach out to me.

Stay healthy, stay safe.

www.vita-technologies.com

VITA Technologies with Resource Guide Spring 2021 |

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VITA Standards Update

By Jerry Gipper jerry.gipper@opensysmedia.com

VITA standards activity updates Note: This update is based on the results of the March 2021 standards meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (http://www.vita.com) for details on upcoming VITA meetings.

ANSI accreditation Accredited as an American National Standards Institute (ANSI) developer, VITA provides its members with the ability to develop and promote open technology standards.

ANSI/VITA 46.11: VPX System Management

Objective: The VITA 46.11 standard defines a system management architecture for VPX systems.

The following standard has recently been ANSI and VITA ratified via public ballot:

Status: The standard is due for its five-year review. Improvements based on feedback from the community are under consideration.

› ANSI/VITA 67.3-2020: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

ANSI/VITA 48.0/48.2-2020: VPX REDI: Mechanical Base Standard/Conduction Cooling

All published standards are available for download by VITA members and are posted at the online VITA Store for purchase by nonmembers.

VSO study and working group activities

Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, while a working group requires sponsorship of at least three VITA members.

Several working groups have current projects underway. Here’s a roundup of these projects:

ANSI/VITA 42.0: XMC: Switched Mezzanine Card

Objective: The VITA 42.0 XMC standard defines a popular mezzanine card architecture using a PCIe interconnect to host carrier modules.

Status: The standard is due for its five-year review. The working group is reviewing revisions to bring the standard in line with current practice in related standards. A Signal Integrity (SI) appendix is being developed to include with the next release of the standard.

ANSI/VITA 46: VPX Baseline

Objective: The VITA 46.0 base standard defines physical features that enable high-speed communication in a compliant system.

Status: The standard is open for revisions. The working group is reviewing updates for compliance requirements and requirements for 12 V power.

6 | VITA Technologies with Resource Guide Spring 2021

Objective: The VITA 48 standards provide an overview of the associated plug-in units for air cooling, conduction cooling, and liquid-flow-thru (LFT) and spray cooling applications. Specific connector-mounting details are defined in VITA 46. The VITA 48 family of standards defines applicable detailed dimensions of key module and subrack interfaces. The implementations described in these standards are targeted for 3U and 6U formfactor boards on 0.85 and 1.00 centers. However, the packaging approach presented is applicable to boards with other form factors, different connector series, and alternate module pitches.

Status: The standards are being updated to allow for a 100 mm deep VPX module. The working group is developing a draft of the updates.

ANSI/VITA 48.4-2018: VPX REDI: Liquid-Flow-Thru Cooling

Objective: This standard establishes the mechanical design requirements for an LFT-cooled electronic VPX module.

Status: This working group is making revisions to the standard.

VITA 51.4: Reliability Component Derating

Objective: The goal of this working group is to develop a new component derating standard.

Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been developed.

This working group encourages industry participation and inputs for determining the appropriate derating considerations, specifically what derating levels your company typically uses.

This information would help the working group find consensus derating levels for components that are useful for the industry. www.vita-technologies.com

ANSI/VITA 61: XMC 2.0

Status: The document is in public ANSI/VITA review and ballot.

Objective: The VITA 61 XMC 2.0 standard, based upon VITA 42.0 XMC, defines an open standard for supporting highspeed, switched interconnect protocols on an existing, widely deployed form factor, but utilizing an alternate, ruggedized, high-speed mezzanine interconnector.

Objective: The VITA 74.x standards define a mechanical format for standardization of switched serial interconnects for smallform-factor applications

Status: The standard is due for its five-year review. Revisions to match VITA 42 and VITA 88 changes are in review.

Status: The study group is gathering inputs for development of a potential standard for space platforms.

VITA 62.1: Power Supply Front End for High-Voltage/ 3-Phase 3U Module

ANSI/VITA 78: SpaceVPX Systems

Objective: The VITA 62.1 standard describes requirements for building a high-voltage/3-phase/3U class front-end power-supply module that can be used to power a VPX chassis in the VITA 62 family of standards. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.

Status: The working group is developing a draft document that is in review.

ANSI/VITA 65: OpenVPX Architectural Framework for VPX

Objective: The OpenVPX architectural framework standard is a living document that is regularly updated with new profile information and corrections.

Status: New profiles based on work with the Sensor Open Systems Architecture (SOSA) consortium are being developed.

VITA 66.5: Optical Interconnect on VPX – Hybrid Variant

Objective: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blindmate optical connectors with fixed contacts on the plug-in module and floating displacement on the backplane.

Status: The working group is developing the draft document.

ANSI/VITA 67.3: VPX: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

Objective: The VITA 67.3 standard defines an open standard for configuration and interconnect within the structure of VITA 67.0, enabling an interface compatible with VITA 46 containing multiposition blind-mate analog connectors with SMPM-style contacts having fixed contacts on the plug-in module and spring action on the backplane.

Status: The standard is open for revision.

VITA 68.2: VPX: Compliance Channel

Objective: This standard defines a VPX compliance channel, including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This standard allows backplane developers to design a backplane that supports required bit-error rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane. www.vita-technologies.com

VITA 74.x: SpaceVNX

Objective: VITA 78 is an open standard for creating highperformance, fault-tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-reliability (high-availability) applications. Such systems will support a wide variety of use cases across the aerospace community, including some nonspacecraft systems. This standard leverages the VPX standards family and the commercial infrastructure that supports these standards in nonspace applications.

Status: The standard is open for revisions. The documents have completed public ANSI/VITA review and are in the commentresolution phase.

VITA 78.1: SpaceVPX Lite Systems

Objective: This standard leverages the work done on ANSI/ VITA 78 to create a standard with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the utilitymanagement module to the system-controller module to allow a radial distribution of supply power to up to eight payload modules.

Status: The working group has developed a draft document of the standard that is currently in working group ballot.

VITA 87: MT Circular Connectors

Objective: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT. Status: The working group is reviewing a draft document.

VITA 88: XMC+

Objective: The VITA 88 XMC+ standard defines an improved electrical/mechanical mezzanine connector for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints, achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.

Status: The working group is developing a draft document.

Copies of all standards reaching ANSI recognition are available from the VITA online store (www.vita.com/Purchase).

For a more complete list of VITA standards and their status, go to www.vita.com/Standards.

VITA Technologies with Resource Guide Spring 2021 |

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Defining Standards

By Jerry Gipper exec@vita.com

VITA 49: VITA Radio Transport (VRT) Standard in Action VITA is probably best known for hardware standards used for backplane-based computers. Occasionally, however, a software standard emerges out of a VITA working group. One of the most successful and widely used VITA standards is the VITA 49 family. Simply stated, VITA 49 defines a protocol standard that enables message interoperability between equipment from multiple vendors.

The VITA Radio Transport (VRT) standard, also known as VITA 49, is an informationexchange standard defining a signal/spectrum protocol that expresses spectrum observation, spectrum operations, and capabilities of RF devices to promote interoperability between radio frequency (RF) systems and related equipment. This is done independent of manufacturer, equipment type, point of use in an architecture and application. The intent of the VRT protocol is to enable RF systems to migrate from proprietary stovepipe architectures to interoperable multifunction architectures. The application space is applicable to spectrum monitoring, communications, electronic warfare (EW), and radar to name a few.

MOSA and interoperability – benefits of VITA 49

The VRT protocol enables architectures to achieve the objectives of the Modular Open Systems Approach (MOSA). Specifically, VRT enables: › Simpler and faster integration of products from multiple sources. › Integration of new components and capabilities with minimal impact on the intrinsic architecture. › Elimination of dependency upon a single supplier. › Incremental improvements without redesign of large portions of the system. › Adaptation to evolving requirements and threats. › Leveraging of commercial investments in new technologies into architectures that were previously stovepiped. › Reduction of life cycle risk. › Lower upgrade cost over the entire life cycle.

Interoperability

The VRT protocol enables message interoperability between equipment from multiple vendors. Full interoperability also requires that the underlying layers such as the physical-link layer are also matched between equipment. VRT is designed to be independent of these underlying layers; therefore, it may be utilized over common protocols such as Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Serial RapidIO, Xilinx Aurora, Race++, Serial Front Panel Data Port (sFPDP), PCI Express, Gigabit Ethernet, and others. Equipment that emits VRT-compliant streams is always accompanied by supplementary documentation specifying which VRT features are used in the corresponding packet streams. This documentation can be used to access the level of interoperability between equipment or systems.

(Figure 1.)

8 | VITA Technologies with Resource Guide Spring 2021

Some of the interoperability benefits of VITA 49 as an information exchange standard include the following: › Common language to express between diverse equipment providers, reducing integration time and effort. Equipment from multiple vendors can be combined so that technology insertion is simplified. Interoperability is accomplished by: 1. Standardization of signal data transport between receivers, exciters, signal processors, control functions, and information storage.

2. Standardization of metadata transport between transceivers and signal processors. Standard metadata that may be conveyed include sensor settings, geolocation, and a variety of equipment settings pertinent to signal-processing applications.

3. Standardization of control functions – turning contextual metadata into device settings. › Efficient packet structures for a wide variety of signal data, related contextual and control information. › Multiplexing of many signal channels onto one link interface. › Scalability from a single transceiver channel to many transceiver channels. › Flexible architectures, enabling the routing of data to any number of signal processors or FPGAs [fieldprogrammable gate arrays] in the same chassis, between multiple chassis, or to any destination without degradation of the signal. › Coherency between multiple transceiver channels for both real-time and recorded-data applications. www.vita-technologies.com

FIGURE 1

VITA 49 VRT packet types.

› High-precision timestamping for: 1. Correlating sensor data to external events.

2. Synchronizing information from multiple sources.

3. Data recording applications where the information is analyzed in non-real time.

4. Precision geolocation applications such as directionfinding (DF), beamforming, and time difference of arrival (TDOA).

VITA 49 framework vs. architecture

The VITA 49 standard is not intended to be used as a specification from which equipment can be directly built upon and vetted as interoperable with other equipment. It is referred to as a framework from which specifications can be derived. VITA 49 provides millions of options for data types and packet structures that are likely impossible to implement as one application program interface (API) without culling down to required attributes. It is expected that a governing body specify the application requirements, from which a select set of the features of VITA 49 is chosen.

This organization would then create an architecture document that references the regulations in VITA 49 and how they should be used. This document may also have other architecture attributes such as physical bus and transport type.

The ANSI/VITA 49.A-2015 Spectrum Interoperability standard is such an example applicable to spectrum-survey applications that leverages VITA 49 as a framework. It specifies a reduced set of VITA 49 signal data types and context fields and specifies physical interfaces as Gigabit Ethernet and transports such as UDP and TCP/Internet Protocol (IP).

(Figure 2.) www.vita-technologies.com

Applications of VRT

The VRT protocol can be used as an interface at many places in system architectures.

For instance, it can be used to convey information between: › › › › › ›

Integrated circuits on the same board.

Modules/boards in the same chassis.

Chassis in the same location or platforms.

Platforms in a network-centric application.

System of systems.

Operational regions.

Example applications for VITA 49

VITA 49 was created by, and is being used by, a wide industry base of organizations including RF equipment manufacturers, digital signal processor manufacturers, data recorder manufacturers, prime contractors, and government agencies. VITA 49 is designed into several interesting programs and other standards initiatives. The following are a taste of what VITA 49 can achieve.

CMOSS

One of the early adopters of VITA 49 was the C4ISR/EW [Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance/ Electronic Warfare (EW)] Modular Open Suite of Standards (CMOSS) program out of the U.S. Army C5ISR Center. CMOSS consists of a suite of layered standards that are individually useful and can be combined to form a holistic converged architecture.

The goals for CMOSS are to: › Provide pooled RF resources (e.g., antennas and amplifiers) for communications, EW, and signals intelligence systems.

FIGURE 2

VITA 49 VRT simplifies traditional RF signal processing systems.

VITA Technologies with Resource Guide Spring 2021 |

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DEFINING STANDARDS

› Share processing resources (e.g., computers and displays) and data services (e.g., position, navigation, and timing) to reduce size, weight, and power (SWaP) requirements. › Facilitate rapid insertion of new capabilities into systems.

The functional decomposition portion of the CMOSS architecture allows for sharing of RF resources such as antennas and amplifiers, defines interfaces between RF functions and components, and enables rapid component upgrades. To achieve that, the Modular Open RF Architecture (MORA) was defined: MORA integrates VICTORY and VITA Radio Transport (VITA 49.2) to standardize access and control of the RF chain across the platform.

This work is also part of a collaboration between the Army, Air Force, and Navy under the SOSA Consortium to develop a universal open architecture that leverages existing standards, maximizes economies of scale, and provides the flexibility to rapidly insert the latest capabilities.

AXIe Consortium Optical Data Interface (ODI)

The AXIe Consortium developed a specification – Optical Data Interface (ODI) – with support for speeds up to 80 GBytes/sec, suitable for high-speed instrumentation systems addressing challenging applications in 5G, military/aerospace, and advanced communication research. ODI breaks speed and distance barriers by relying on optical communication over a simple pluggable optical cable.

Though managed by the AXIe Consortium, ODI is not specific to AXIe, and works equally well with any product format, whether AXIe, PXI, LXI, VPX, or a traditional bench instrument design. Standard ODI ports on devices enable communication between instruments, processors, storage, and embedded devices.

Chris Miller, chairman of the AXIe Consortium and strategic planning manager at Keysight Technologies, said, “The ODI specification delivers data communication speeds simply not possible using electrical interconnects. Since it uses a small optical connector that can be placed on any instrument, it is not specific to the AXIe modular standard. To benefit both industry and users, we have decided to open it up to any vendor building products, regardless of form factor, and not restrict it to AXIe.” The ODI standard leverages three layers of technology. The physical layer is defined as optical technology consisting of 12 lanes of 14.1 Gb/sec each, enabling 20 GBytes/ sec per optical port. Multimode fiber cables connect ports together, using the standard MPO [Multifiber Push On] connector. Ports may be aggregated, with four ports delivering 80 GBytes/sec. The protocol layer is defined by the Interlaken standard, a device-interconnect standard common in data centers originally conceived by Cortina Systems and Cisco Systems. Interlaken is supported by the major FPGA suppliers and delivers arbitrary packets over any number of lanes. The top layer specifies packets defined by the VITA 49 VRT family of standards; VRT packets are sent between devices using standardized data formats and context packets.

THOUGH MANAGED BY THE AXIE CONSORTIUM, ODI WORKS EQUALLY WELL WITH ANY FORMAT: AXIE, PXI, LXI, VPX, OR TRADITIONAL BENCH INSTRUMENT DESIGN. be. Large-scale satellite operators often build and run their own ground stations, which can often cost $1 million or more; smaller operators enter into inflexible long-term contracts to make use of existing ground stations.

One alternative is AWS Ground Station, a fully managed service that enables customers to easily command, control, and downlink data from satellites. Users can schedule access to AWS Ground Station antennas on a per-minute basis and pay only for the time used. When using AWS Ground Station, the user ingests data from the satellite, monitors the satellite health and status, and transmits commands to change the satellite’s operations. Incoming data is streamed to an Amazon Elastic Compute Cloud (Amazon EC2) web service instance where it can then be stored or processed using other AWS services. AWS Ground Station is a fully managed service – there’s no need to build or maintain antennas, enabling the user to avoid fussing with satellites and instead letting them focus on work or research.

There are currently thousands of satellites orbiting the Earth, including all kinds of small satellites such as CubeSats, PocketQubes, and SunCubes designed by high school and college students who fabricate and contract launch. Organizations of any size now can relatively easily arrange a launch of these small satellites for Earth observation, communication, media distribution, and so forth.

There are currently six stations in place and online, with six more in the works.

Each ground station is associated with a particular AWS region. The raw analog data from the satellite is processed by a modem digitizer into a VITA 49 RF over IP data streams and routed to an EC2 instance that is responsible for doing the signal processing to turn it into a byte stream. The hourly rates make AWS a very affordable option for school and similar projects.

While it is now relatively cheap to get a satellite into low Earth orbit (LEO) or medium Earth orbit (MEO) and only slightly more expensive to achieve a more distant geostationary orbit, getting that data back to Earth is still more difficult than it should

The VITA 49 suite of standards is available for purchase at the VITA Online Store at https://www.vita.com/.

Amazon Web Services (AWS) ground stations

10 | VITA Technologies with Resource Guide Spring 2021

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THE VPX POWER SUPPLY FAMILY

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The IQI supports a dual IPMB for redundant communications and includes a diagnostic USB port.

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SPECIAL FEATURE

Embedded Tech Trends In-Depth

Embedded Tech Trends 2021 Wrap-up

By Jerry Gipper, Editorial Director

In January, Embedded Tech Trends 2021 was held virtually using Zoom video webinars and the Kahoot! game-based quiz platform. The one-day session – traditionally held over several days of in-person meetings – was attended by 21 members of the media as special-panelist guests and by 123 attendees in the audience.

Deciding to hold Embedded Tech Trends 2021 was a very challenging decision during a global health emergency.

Embedded Tech Trends is – by design – a small yet extremely effective forum during which suppliers of components, boards, and system-level solutions can meet exclusively with members of relevant industry media to discuss technologies, trends, and products. One of the primary goals of the event is to encourage networking amongst peers and members of the media. Achieving this goal virtually would be difficult at best.

It was clear early in 2020 that holding a traditional event during a pandemic would not be possible. The traditional format depends on a mix of industry sponsors and media gathering at an

event center for presentations and one-on-one meetings. I agonized for months over alternative strategies that would both be informative and enable some degree of networking.

After a lot of contemplation, my advisory team settled on a virtual conference, conducted via Zoom, that brought in the media attendees as members of the panel. In this way, they could ask questions directly and interact with the other panelists. They were encouraged to enable video (you know, “turn on your camera!”) to make the event more personal. Attendees could listen in on the panelists while also being able to submit online questions.

Since the event would be live online, it was decided that the time should be no more than two hours, with time reserved at the beginning and end for the media to talk to the presenters. The time limitation combined with no sponsorships meant that a focused theme would be very important.

The team chose “Community of Open Standards, Sharing the Vision” as the theme.

We agreed to invite a mix of standards organizations that complemented each other and the mission of Embedded Tech Trends. The presenters were encouraged to weave the message of the theme into their discussion.

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www.vita-technologies.com

SPECIAL FEATURE

To make the event a bit more unusual, informative, and a bit entertaining, several Kahoot! competitions were used to test the audience and gather feedback on the nontraditional format of Embedded Tech Trends 2021. The feedback following the virtual forum was very positive, with the audience saying that they were happy to have the opportunity to network virtually. Several commented that it was the best way to connect, considering the circumstances, although not better than in person!

The MicroTCA modular open standard is increasingly being used in particle accelerators, plasma fusion, photon science for data acquisition, and fast feedback. In addition, PICMG is expanding the roadmap to include higher performance processors, FPGAs, and faster I/O. CompactPCI Serial is undergoing enhancements to include: › Support for PCIe GEN 4 and GEN 5 › In addition to 1000BaseT and 10GBaseT, Ethernet KR4 shall also be supported › Support for USB 3.2 + (USB 4 now feasible!)

The following is a synopsis of the presentations:

PICMG 2021

By Jess Isquith, President, PICMG (www.picmg.org) Jess Isquith was the leadoff presenter, kicking things off with a brief overview of PICMG overview and introduction of leadership. Her focus was on key 2021 PICMG initiatives in the areas of COM-HPC, CompactPCI Serial, MicroTCA, and IIoT. The Computer-On-Module concept is very popular in many applications, enabling a faster time to market and reduced cost to integrators using these modules. PICMG has developed standards for high-performance modules that are being announced now. The base specification will complement a Platform Management Interface Specification, COM-HPC EEEP, and Carrier Board Design Guide. Jess highlighted the online COM-HPC Academy as an educational resource for engineers evaluating the new PICMG COM-HPC specification. The COM-HPC specification was approved and ratified by PICMG members just after Embedded Tech Trends 2021.

Doug Sandy, PICMG CTO, updated the audience on key IIoT [Industrial Internet of Things] initiatives. In support of IIoT, PICMG announced the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultrasmall-form-factor module for the enablement of smart sensors. www.vita-technologies.com

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VITA Technologies with Resource Guide Spring 2021 |

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Embedded Tech Trends In-Depth

SPECIAL FEATURE

Jess wrapped by reinforcing that PICMG has several collaboration efforts underway with other standards developers including VITA, DMTF, OCP, and SGET. Open standards encourage innovation and differentiation amongst multiple vendors – interoperability is key.

SGET – Standardization Group for Embedded Technologies

By Christian Eder, President, SGET (www.sget.org)

SGET is new to the Embedded Tech Trends forum, so Christian – who recently took the reins as SGET president – provided the audience with some background on the SGET leadership and the standards that are hosted under the domain of SGET. SGET has several small-form-factor standards under its management.

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The SMARC (“Smart Mobility ARChitecture”) is a small-form-factor computer module definition targeting applications that require low power, low costs, and high performance. The modules typically use Arm SOCs where the power envelope is typically under 6 W. The Qseven concept is a ComputerOn-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the highspeed MXM system connector. A single ruggedized MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.

Embedded NUC [Next Unit of Computing] specifies an industrial standard for small form-factor PCs inspired by the Intel NUC systems that are used in consumer products. With its PC power, Embedded NUC presents an attractive solution for industrial applications targeting a wide range of appliances while providing numerous interfaces in a compact format.

The Universal IoT Connector (UIC) is a software-only standard to enable any embedded hardware to exchange data between embedded devices and a cloud-hosted infrastructure. To overcome the obstacle of proprietary implementations for wrapping data coming from sensors, publish it securely to a cloud server infrastructure, and visualize it, UIC defines the key parts on the embedded hardware required to provide a generic set of API calls and security standards for an end-to-end solution.

The Open Standard Module specification allows for developing, producing, and distributing embedded modules for the most popular MCU32, Arm, and x86 architectures. For a growing number of IoT applications, this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space, and interfaces. www.vita-technologies.com

How Will You Shape Critical and Embedded Computing?

By Jerry Gipper, Executive Director, VITA (www.vita.com) Jerry began with a brief overview of VITA. The VITA organization was able to pivot quickly when the pandemic hit and was able to operate seamlessly, with online meetings replacing the traditional bimonthly face-to-face update and working-group meetings.

VITA has many working groups that develop new standards and improve existing standards. Jerry reviewed the list of currently active working groups with a progress report on what is in the pipeline for the coming year. No fewer than 18 working groups currently have projects underway.

Over the past two years, VITA has been developing an updated roadmap for interconnect standards used in the various standards supporting VPX technology.

This roadmap covers everything from the backplane to mezzanines, power supplies, connectivity, and I/O in support of VPX. The roadmap shows a progression of the interconnect standards and points to the challenges yet to be addressed in the next generation of standards. (See Figure 1.) This roadmap builds on work presented by TE Connectivity at past Embedded Tech Trend forums. VITA announced the release of two standards, ANSI/VITA 46.30-2020 and VITA 46.312020, that support higher data rates for VPX. VITA works with several other standards developers to encourage the adoption and ensure the success of open standards that help to open markets to the embedded computing industry.

The Open Group SOSA Consortium

By Dr. Ilya Lipkin, Technical Expert, SOSA Consortium (www.opengroup.org/sosa)

The SOSA Consortium has made a major impact on the use of open standards in U.S. Department of Defense (DoD) applications using embedded computing technology. Dr. Lipkin – an engineering expert who works with the Air Force Life Cycle Management Center (AFLCMC) – is the driving force behind that impact. He reviewed the current status of the efforts underway www.vita-technologies.com

FIGURE 1

This roadmap shows a progression of interconnect standards and details the challenges yet to be addressed in the next generation of standards.

FIGURE 2

Government teams working with the DoD have developed a roadmap of key technologies that are important to future standards. Image courtesy DEVCOM.

with the SOSA Consortium and key programs working in conjunction with the SOSA Consortium: C5ISR CMOSS and HOST. These programs have been receiving strong endorsement support at very high levels, most recently garnering a highlight in the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 report by the Committee on Armed Services House of Representatives on H.R. 6395.

The committee recognized the efforts and highly recommended that “CMOSS and SOSA military electronics standards be more tightly connected to use the same hardware pinout standards and, more importantly, the same software data transport protocols, such as the Modular Open RF Architecture (MORA), to further solidify a common Department of Defense-wide technical approach to create an open systems architecture standard by which small businesses and large primes can compete.”

Dr. Lipkin shared a lengthy list of companies involved in the open standards efforts; he also reviewed an impressive and growing list of programs of record that are benefiting from the efforts, further reinforcing the adoption of the open systems strategy.

His teams have developed a roadmap of key technologies that are important to future standards. (See Figure 2.)

Dr. Lipkin ended his presentation with a challenge to the VITA community. He recognizes that technology moves forward quickly so his challenge is: “Develop the next generation of VITA connectors in four years or less!”

In this vein, several SOSA Consortium members actually did announce the availability of SOSA-aligned products at Embedded Tech Trends.

Everyone looks forward to meeting in person in 2022.

All of these presentations are posted at www.EmbeddedTechTrends.com.

VITA Technologies with Resource Guide Spring 2021 |

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SPECIAL FEATURE

Hall of Fame

VITA Hall of Fame

By Jerry Gipper, Editorial Director

Since the announcement of VMEbus in 1981, there have been a great number of people and ideas that have had an impact on the development and advancement of open standards used in critical embedded computing systems. The intention of the VITA Technologies Hall of Fame is to honor and preserve the remembrance of those people and technologies that have had the greatest influence on the VITA open standards industry. Many others are to come – innovators and influencers, who have made a significant impact on developing, designing, and creating the technology and then ferrying the technical specifications into open standards. These are the people who have overcome the technical and procedural problems to help bring forth the products that set new expectations. It is our pleasure to honor these primary contributors to this industry.

Doug Patterson

Doug’s long involvement in open standards started back at the dawn of VME, first in the pivotal role of Director of Defense Marketing at Plessy Microsystems, which was one of the first companies to adopt VME standards in the 1980s. Doug transitioned with the company when it became Radstone Technologies, which is now a part of Abaco Systems that operates today.

Doug Patterson

Throughout his career with many leading embedded computing companies, Doug has loyally championed open standards to help facilitate interoperability and technology reuse, supporting VITA’s mission of technology excellence in real-time, modular critical embedded computing systems.

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www.vita-technologies.com

Marty helped kick off the VME buzz by coordinating the first-ever trade-press article on VME; this initial article appeared in Electronic Products, circa 1986. From there, he continued to build awareness for VITA’s technical standards through participation in industry events and marketing activities for companies employing VITA’s technical standards.

He served on the VITA Board of Directors from 2007 to 2012 and is a widely published author of open standards-based rugged embedded computing concepts for the defense and aerospace market.

He also holds three patents in advanced metered mailing systems and non-volatile memory redundancy mapping.

Most recently, Doug worked at Aitech, a provider of rugged electronics and systems for military, aerospace, and space applications, where he served as VP of Global Marketing. During his more than 15-year tenure, Doug sought to not only build on the legacy of existing VME platforms, but also to embrace the forwardlooking path that VPX provided through the company’s technology and product innovations.

Doug is currently principal of DH Patterson Associates, where he is applying his extensive technical and business expertise to a broad range of electronics companies.

Marty Simon

Nowadays, he enjoys a quiet retirement with his wife, Vera (whom he met through the VME editorial community).

Dawn Single Slot OpenVPX Development

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Marty Simon

Building a strong ecosystem of interoperable, open source computing technologies goes beyond just the technical bits and bytes. The need to understand the benefits behind the standards and what, as a community, can be built using them is an important aspect to successful market adoption.

Marty Simon, founder of The Simon Group, is known to many in our industry for his long commitment to helping member companies communicate the complex intricacies of critical embedded systems by shaping them into educational, relatable concepts as well as his expertise in publicizing the benefits and uses of open standards-based products across many industries.

While many engineering types in our industry often discuss the highly technical aspects of VITA and its open standards, Marty always had a question ready: Why is this important? His training in journalism positioned him to help discover the true meaning behind what open standards were trying to achieve, so that this essence could be explained to the markets the open standards would serve. www.vita-technologies.com

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TECHNOLOGY FEATURE

High-Reliability Electronics

Lead-free or not lead-free: High-reliability options for system designers

By Ivan Straznicky

Reliability is a key requirement for military and aerospace systems and assemblies. Curtiss-Wright has been highly focused on ruggedness and reliability as a leading supplier of COTS [commercial off-the-shelf] electronics for more than 30 years. Over a decade ago, as lead-free (LF) components started to become mainstream, we developed strategies and a vast amount of technical expertise for dealing with this huge change. The result of these extensive efforts is that we are able to offer customers the choice, based on their requirements and preferences, of both tin-lead solder and LF solder-based designs, with both exhibiting the high reliability that customers need and expect from Curtiss-Wright. We now have over ten years of LF product reliability data to back up our claim of being the trusted, proven leader in rugged electronics reliability.

The large majority of COTS electronic devices are now supplied with LF terminations. For circuit card assembly (CCA) designs using these LF parts (in particular, BGA devices), there are three main strategies: 1) Use LF components “as is” with LF solder (this is considered a “pure solder” approach); 2) Reball the

BGA with a tin-lead solder, and then use tin-lead assembly solder (also considered a “pure solder” approach); or 3) A mixed-solder approach in which LF BGAs are soldered using tin-lead solder. Curtiss-Wright supports only the first two approaches, after having amassed an abundance of data that proves their reliability. We do not offer customers the mixed-solder option, since it has not, in comparison, proven consistently reliable at the CCA level. Reliability of mixed solder is dependent on the specific devices, materials, and processes used, so “results may vary” for mixedsolder approaches.

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www.vita-technologies.com

CURTISS-WRIGHT DEFENSE SOLUTIONS www.curtisswrightds.com/

TECHNOLOGY FEATURE

Risk Area

CWDS Investigations

Comments

Tin whiskers

Testing of CCAs, with and without 3 coatings, LF vs SnPb

ATC + Temp/Humidity (500-1000 cycles + 1-2K hrs @ 85 °C/85%RH)

Pad cratering

Pad pull strength/fatigue, PWB bend testing

Bend-to-break and Cyclic testing of >600 boards (44 test cases)

Shock & vibration

Random vibration, Step stress sine vibration

12 test cases, 21 boards, 540 components (13 types)

Long term storage

Accelerated thermal aging

500 hrs at 125 °C (then vibration)

PCB interconnects

Interconnect Stress Testing (IST)

>3000 coupons tested to date

Thermal cycling

-55 to 105 °C, 30 min. dwells (ANSI/VITA 47, C4)

5 projects, 25 test cases, 75 boards, 1056 parts (20 types), >1000 cycles. Also, testing of >20 products to VITA 47 (500 cycles)

New manufacturing defects

RCCA (Root Cause/Corrective Action) – 8D methodology

Over 30,000 LF CCAs delivered to date, with % returns < SnPb

TABLE 1

Top risk areas identified by LFMP, and CW responses.

leadership for our customers. Table 1 provides one example of the extensive and comprehensive efforts CWDS has taken.

Arriving at the point where we could confidently offer lead-free in addition to tin-lead assemblies was a long and arduous process that involved gaining an understanding of the lead-free metallurgy and failure modes, working with leading experts across industry (commercial, industrial, defense, and aerospace) and academia. We also reviewed technical papers and test results from around the world and designed and performed dozens of test cases ourselves or with partners (including customers) using highly representative components, materials, processes, and tests in order to determine which cases would be reliable enough for different applications, which ones would need mitigations, and of course which mitigations worked and which ones didn’t. The result of all this work is an unparalleled reliability www.vita-technologies.com

Driving the emergence of LF component terminations and assembly solder has been legislation out of the EU, specifically regulations that govern the restriction of hazardous substances (RoHS) in electronics, and regulations concerning the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH). RoHS and REACH have influenced electronics around the world and the large majority of electronic devices are now LF, including those used by rugged COTS suppliers and their customers for military systems. Since theinception of these regulations, beginning around 2006 for RoHS, RoHS and REACH continue to evolve. For example, RoHS has become increasingly more inclusive in terms of the product areas and product categories it covers. Currently, RoHS does not include defense as a product category, which means that military systems are given an exemption and can use tin-lead solder if desired.

However, there is the possibility that defense electronics solutions will eventually get included in RoHS as a product category requiring use of LF solder. Also, REACH may eventually drive the restriction of lead, due to lead’s toxicity, such that military system designers will struggle even more to maintain the use of tin-lead solder.

Many military system designers do not yet have the need to use LF. Even so, to stay informed and prepared to make the right decision going forward, it’s important that system designers be aware of the characteristics of LF. Both COTS suppliers and their customers share an interest in developments around LF. Since many customers, like COTS suppliers, have their own assemblies, both are often faced with the same choices about how to deal with LF components.

In the last ten years, since we first started building some products using LF solder, we have amassed a significant history and a great amount of product data. What’s more, with over a decade of deliveries, measuring in the tens of thousands of assemblies soldered with LF, we have extended our industry-leading experience and expertise in this subject. While we continue to offer tin-lead to customers, for those customers who do not necessarily require tin-lead and are open to considering LF solder, we are able to provide a great amount of reliability data that shows LF to be as reliable, and in some cases even more reliable, than tin-lead.

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TECHNOLOGY FEATURE

High-Reliability Electronics

In fact, our data shows us that our LF approach does not present any higher reliability issues than are seen with tin-lead solder. For all intents and purposes, the productreliability data from CW tin-lead and LF are similar (with LF being slightly better).

Simply put, it means that in over ten years we have not seen any deleterious or surprising long-term reliability results from the deployment of LF assemblies in comparison to tin-lead equivalents. We consider this to be a significant finding. (Figure 1.)

industries. PERM is a great resource for anyone interested in discussions about LF in high reliability industries such as military and aerospace. CW is also a member of 6 other consortia focused on LF reliability.

Today, the single most common LF solder used in the world is probably SAC 305. We follow industry research very closely and we continue to do our own research into LF solders. We have determined that, for the time being, SAC305 is the best choice for a reliable LF solder. The procedure we followed to identify SAC305 as our LF solder of choice is the same path we will follow to analyze any future LF solder candidates.

That path involves research into the metallurgy of a new solder so that any failure modes it might drive will be fully understood. Failure modes are tested for, both with and without mitigations, before any determination is made about a solder’s reliability. When we conducted our research on SAC305, before and during our successful implementation of LF, we benefited from an intimate understanding of the concerns of the defense industry. For the use of SAC305 we have been able to address those concerns, including questions about solder joint reliability, tin whiskers, pad cratering, and sequential/combined environments. (Figure 2.)

Today, there is a lot of conflicting data and disparate opinions regarding the use of LF, partly because of the different solder alloy options from which system designers can choose (at least 15 possible candidates at last count). As the most popular LF solder in the world, SAC305 has benefited from the greatest amount of reliability studies, for both commercial industries and for harshenvironment industries such as defense and aerospace.

One of the key pieces of information used in our SAC305 research was developed by the Lead Free Manhattan Project (LFMP), part of the Pb-Free Electronics Risk Management (PERM) Council. The LFMP issued publications based on their research. The PERM Council, now working under the auspices of the IPC association, continues to meet and advocate for the needs of the aerospace, defense, and high performance (ADHP)

FIGURE 1

Testing of solder joint reliability (SJR). Curtiss-Wright image

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At Curtiss-Wright, we augmented the available data on SAC305 with our own research. This type of analysis requires a deep and sound understanding of electronics reliability and the different mechanisms and modes that can present themselves. On top of that knowledge, you need to overlay an understanding of the metallurgy of the solder being studied and how it might change or add to those failure modes and mechanisms.

It is very helpful to develop contacts with industry subject matter experts, such as those that participate in the LFMP, and to become a member of the key consortia that look into related issues.

Lastly, COTS suppliers should conduct their own testing: Test results will vary significantly depending, not just on the solder type, but also as a result of the types of PCB materials selected for boards, the types of components, and how they’re processed.

As a result of our work, we’ve found that SAC305 LF solder doesn’t perform very well at operating temperatures above 125 °C. For COTS vendors supplying assemblies into environments represented by VITA 47 – where the worstcase environment range is -55 °C to 105 °C – SAC305 LF solder is more than sufficient to meet application requirements. In applications such as the automotive industry, where 150 °C operating temperatures are often required, SAC305 is not a good choice. www.vita-technologies.com

In the defense and aerospace industry, reliability studies and engineering don’t stand still. We, and our customers, continue to research newer “high-performance” solders, many of which use bismuth (Bi), antimony (Sb), and/or indium (In) as additional elements. Today, much research work is being done on the reliability of these new LF solders. If these new solders are found to be as good or better than SAC305, today’s leading LF solder, they should be strongly considered for implementation in the future.

As new LF solder alternatives emerge, the time-consuming reliability studies undertaken to understand SAC305 will have to be repeated all over again. The amount of

FIGURE 2

Shown is 4-point testing of pad cratering mitigations. Curtiss-Wright image.

work and investment required to undertake that work properly suggests that – if and when a system designer needs an LF-based design – they should rely on a trusted leading COTS vendor.

Curtiss-Wright is committed to being an industry leader in developing rugged and reliable products and disseminating our reliability knowledge to customers.

While some COTS suppliers have to be persuaded, metaphorically “dragged to the table,” to discuss reliability and LF, we are proud that our customers consider us leaders in reliability technology and a trailblazer when it comes to the use of LF components and assemblies in rugged products for defense applications.

Ivan Straznicky is chief technology officer for advanced packaging at CurtissWright Defense Solutions. Ivan has three patents for cooling of rugged electronics and has written various technical papers and articles on the subject.

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VITA Technologies with Resource Guide Spring 2021 |

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TECHNOLOGY FEATURE

Data links

sFPDP: Optimized Data Transport

By Patrick Mechin and Philippe Marvin

Today’s sensors can collect and generate huge amounts of data, all of which must be moved somewhere for processing. There are several alternatives for communication links between sensors and processing elements.

Designers want to benefit from the highest-speed protocols available to design or upgrade their systems.

A popular choice is Ethernet, but there are alternatives: One of those choices is serial Front Panel Data Port (sFPDP) – as defined by VITA 17.1 – which presents a low-latency protocol for sensor data interconnection that is widely used by the military embedded industry.

The original VITA 17 standard, called Front Panel Data Port (FPDP), was defined to meet the need of high-speed and optimized communication between two points inside a processing cabinet, usually two VME racks.

The FPDP bus was intended to provide data transfer between two or more VMEbus boards at up to 160 MB/sec with the lowest possible latency, while not compromising existing VMEbus and other connections on the chassis P1 and P2 connectors. FPDP was connected by means of an 80-conductor ribbon cable connector at the front panel of the VMEbus board. The wiring topology was in the form of a bus and multiple FPDP busses may coexist in a single VMEbus enclosure. FPDP was restricted to short distances (less than 1 m or 3.28 feet), mainly point-to-point and based on a very lightweight protocol focused on efficiency rather than functionality.

Beginning in the early 2000s, communication buses started moving from parallel to serial to offer higher bandwidth and longer distance capabilities. the VITA 17.1 serial FPDP (sFPDP) was created for the embedded industry. The initial instance, released in 2015, supported data rates up to 10 Gbaud.

As in the original parallel bus version, sFPDP is simple to implement and use. Engineers can implement it within an FPGA [field-programmable gate array] or ASIC with little difficulty.

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sFPDP is a well-known protocol in defense, research, and medical markets.

Major key players – Abaco Systems, Curtiss-Wright, Galleon EC, Mercury Systems, Pentek, and others – have designed many products to simplify the implementation of sFPDP that do not require additional FPGA development by the user. These products are used in embedded applications through rugged XMC modules or in lab equipment (data recorders or test benches). Thanks to widespread deployment, sFPDP is a staple for real-time applications in the field of sensor/computer links.

Thanks to these advantages, the sFPDP protocol has been widely adopted by the defense engineering community for applications in which high-speed links and real-time are mandatory. For example, www.vita-technologies.com

TECHWAY

https://www.techway.fr/

TECHNOLOGY FEATURE

it might be used for communication between complex sensors and processing units in harsh environments for applications in radar, sonar, test, and more.

frame types originally defined in the parallel FPDP standard. The primary objective of the Serial FPDP Gen 3.0 standard is to dramatically increase the bandwidth and scalability of the Gen 1.0 standard while remaining fully backward-compatible at the user interface level to ensure easy system upgrades from Gen 1.0 to Gen 3.0.

The evolution of sFPDP

Serial FPDP Gen 3.0 offers many enhancements not found in the Gen 1.0 standard, namely multilane channel bonding, full CRC protection over all status and control signals, more than 99% bandwidth efficiency with 64B/67B encoding and scrambling, and use of individual user data block identification and error reporting that enables guaranteed delivery and retransmit mechanism.

The sFPDP standard was updated in 2018 to move away from the concept of defined link rates and instead allowed any link rate to be used. The ANSI/VITA 17.32018 sFPDP Gen 3 standard also supports multilane channel bonding and advanced 64B/67B encoding to greatly increase the bandwidth capabilities of the link.

In addition, the serialization enabled the use of optical links, thereby significantly increasing distances of communication, boosting protection against electromagnetic interference, and opening the door for communication rates well above 10 Gb/sec.

Serial FPDP Gen 3.0 is conceptually based on the control signals and data structure used by Serial FPDP Gen 1.0, and consequentially, is designed to allow a straightforward migration from sFPDP Gen 1.0 to sFPDP Gen 3.0. While not directly compatible with sFPDP Gen 1.0 at the physical level due to the different encoding scheme used, the protocol defined in this standard supports the same framing types, flow control, and link topologies as found in the sFPDP Gen 1.0 standard. The Physical Coding Sublayer (PCS) used by sFPDP Gen 3.0 is defined by the industry-standard Interlaken Framing Layer. Serial FPDP Gen 3.0 supports all of the features found in the Serial FPDP Gen 1.0 standard and also utilizes three different frame types (Serial Fiber Frames) to implement the four data

FIGURE 1

The new standard allows a higher-than-10 Gbps transfer rate with no limit. In addition to this key feature, new functionalities expand the sFPDP field of applications: ANSI/VITA 17.3-2018 enables direct communication between sensors and processing boards but also enables communication with each other over greater distances.

The benefits of sFPDP

In opposition to “general-purpose” protocols or networks, the sFPDP protocol is dedicated to point-to-point communication. It reduces the protocol overhead and optimizes latency.

Thanks to sFPDP, the links are: › Efficient: The ratio, total of transmitted data/effective volume of transmitted data, is close to 1. › Determinist: sFPDP’s ease of use allows FPGA implementation which free jitters from CPU and Linux. › Low-latency: The light and tunable data framing allows data transfers with low latency. This low latency is mandatory when talking about demanding applications like electronics countermeasures or simulation. › Reliable: Topologies offered by sFPDP protocol – point-to-point, copy, copy loop – prevent any loss of frames.

At the same time, the industrial market has seen the emergence and popularization of 10 Gb Ethernet. In a few short years, this trend has spread into embedded applications. Today, system architects compare both protocols as equal. (Figure 1.)

Yet, sFPDP and 10 Gb Ethernet are not real competitors.

sFPDP vs 10 Gb Ethernet: Let’s compare

Ethernet is ubiquitous, so hardware choices are limitless. An attractive advantage of Ethernet is the abundance of low-cost, high-performance equipment driven by the IT industry.

Typical serial FPDP process.

www.vita-technologies.com

VITA Technologies with Resource Guide Spring 2021 |

23

Data links

TECHNOLOGY FEATURE

Ethernet has key advantages for embedded applications and real time: 1. Performance evolutions of Ethernet allow use in high-speed applications (10, 25, 40 Gb Ethernet).

2. Ethernet UPD implementation offers high-bandwidth capabilities for data transfer.

3. Popularization and wide deployment of Ethernet leads to low-cost hardware dedicated to IT or consumer market.

One more thing: Ethernet and its IP, TCP, or UDP protocols do not require special hardware or firmware design skills or specific hardware.

At first glance, sFPDP and Ethernet appear to be remarkably similar. Yet, if we look deeper, we will see differences in their concepts. These differences will impact the system performance of your project.

Data rate

Both support similar data rates at the physical layer. However, sFPDP is more efficient with its lighter protocol stack.

This reduces software overhead and protocol layers making it a faster solution given equal hardware implementations.

Winner: sFPDP.

Offload

One of the strengths of Ethernet UDP/IP is that it is “specific-hardware-free.” But it must be managed by the CPU and its operating system, which are not always the best tools to manage the protocol.

Therefore, a lot of CPU resources will be wasted and removed from application data processing. Alternatively, the user can implement a dedicated offload engine but that takes it all back to dedicated hardware. So: sFPDP can easily be implemented in an FPGA, frequently available in sensor applications, thus freeing the CPU from this task. Winner: sFPDP, if an FPGA is available.

Latency

sFPDP is a light protocol (no connection or session) which allows for minimum latency, especially important in electronic countermeasures where realtime responses are critical. Even when

throwing a lot of processing power at Ethernet, it will still come up short compared to sFPDP. Winner: sFPDP.

Determinism

Determinism is critical for real-time response. For example, time-stamping data frames for higher accuracy is important for recording analysis and accurate playback. This accuracy is impossible in the case where the CPU is used to execute a UDP/IP stack on Ethernet networks.

To obtain equal accuracy, complex protocols must be deployed which are not compliant with embedded applications.

It is possible to implement the UDP/ IP protocol on an FPGA, but this is not efficient; the choice of running a heavy protocol with low determinism should be questioned if the platform is FPGAbased and a dedicated solution such as sFPDP exists.

Using an FPGA for sFPDP makes it possible to obtain a high degree of determinism for the reception and emission of data and to manage the protocol.

Winner: sFPDP.

Topology

One of the biggest advantages of Ethernet is simplicity and flexibility.

Thanks to the use of switches, hubs, or sniffers (for debug), complex, repetitive, and evolving networks can be built. However, the more complex the network, the less deterministic the data flow. Moreover, if the application implements point-to-point connection with Ethernet, most of the feature advantages of Ethernet are wasted. sFPDP offers several fundamental topology choices, whether basic system, flow control, bidirectional data flow, copy mode, and copy/loop mode that allow designers to – either temporarily or definitively – add communication nodes into a point-to-point link without modify the performance of the system.

All of these modes support the maximum throughput performance. Winner: sFPDP.

The choice: Ethernet or sFPDP

At the first sight, Ethernet appears to be a nice alternative for data transmission,

24 | VITA Technologies with Resource Guide Spring 2021

FIGURE 2

The Raven is a VITA 17.3compliant sFPDP PCIe platform with FPGA processing.

driven by low-cost equipment; once the requirements of real-time applications are considered, though, the Ethernet option appears more challenging and riskier.

If the application requires data transmission with guaranteed high-performance data throughput, secured latency, and easy implementation, sFPDP is the way to go.

Products like the Techway RAVEN PCIe board with four VITA 17.3 sFPDP ports and FPGA processing can be the best way to connect to high-performance sensors. Based on a Xilinx Kintex-7 FPGA, this sFPDP platform supports a data rate of up to 10 Gb/sec per link.

RAVEN includes support for flow control, CRC, framed/unframed, and copy/ loop modes; it’s also compliant with copper or fiber cabling. (Figure 2.)

Patrick Mechin, CEO of TECHWAY, founded the company in 2003. TECHWAY specializes in FPGA technology for realtime systems in defense and avionics applications. Patrick previously served as the COO of VMETRO (Norway).

Philippe Marvin is a field application engineer at TECHWAY; he originally joined TECHWAY as a product manager.

During the last 20 years, Philippe has worked for several companies specializing in the embedded defense market, including VMETRO (Norway), Curtiss-Wright (U.S.), and Gaci (France). www.vita-technologies.com

VITA Technologiess Resource Guide

2021 RESOURCE GUIDE INDEX Company

Category

Page

Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . .

Embedded Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-27

Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . .

Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28

IOxOS Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

29

Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

29

Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . .

OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30

Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31

Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31-32

IOxOS Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

32

Vector Electronics & Technology, Inc. . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33

Red Rock Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

34

Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34-35

Red Rock Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

36

Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

36

Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

37

Amphenol MAO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

38

Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

XMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

39

Embedded Hardware

The WILD Chassis Manager includes MIL-STD-1553 support

MADE IN

Chassis Manager Optimized for VITA 65/SOSA™ The VITA 46.11-aligned WILD VPX Chassis Manager (WABGM0) enables critical chassis control, maintenance, and security functions, was developed in alignment with the SOSA™ Technical Standard, and offers commercial-off-the-shelf (COTS) availability. ™

U. S. A.

FEATURES Ą Enables chassis control, maintenance, and security functions Ą Supports 3U and 6U OpenVPX backplanes

Ą Xilinx UltraScale+ ZU5EG MPSoC running Linux for CHmC

It is a highly-integrated module. It provides access to plug in card (PIC) JTAG and Maintenance ports, CLK1 usage via on-board Zynq FPGA, network functions, and some optional advanced security functions.

For security, the Chassis Manager implements security signal interfaces and a Xilinx UltraScale+ Zynq ZU5EG MPSoC and latest Microsemi PolarFire FPGA, which can be end-user modified with the optional BSP.

Ą Supports up to 16 slots for JTAG and maintenance port

www.annapmicro.com

Ą Commercial-off-the-shelf (COTS) availability

Annapolis Micro Systems, Inc.

www.annapmicro.com/products/wabgm0/

26 | VITA Technologies with Resource Guide Spring 2021

aggregation/muxing

Ą Directly attaches to backplane or carrier card

Ą Cabled or backplane interface for I/O functions

Ą Optional BSP enables customization of Zynq PS, PL for security Ą Supports MIL-STD-1553 and VITA 66/67 (optical/RF) Ą Aligns with VITA 46.11 and SOSA™ Standard

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

WILDSTAR Boards include optional optical and/or RF (VITA 66/67)

100GbE FPGA Boards are SOSA™-Aligned Annapolis WILDSTAR Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100Gb Ethernet over copper on the VPX backplane. Blind mate optical and/or RF (VITA 66/67) is also available. All 100GbE boards are VITA 65-compliant and align with the SOSA™ standard. ™

High Performance

These high-performance boards utilize the latest Xilinx UltraScale+ FPGAs, MPSoCs, and/or Gen 3 RFSoCs. They enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths.

High-performance digitization is via Mezzanine Card(s) connected to WFMC+ I/O site(s), or included in the RFSoC. Gen 3 delivers 8 channels of ADC, 5.0+GSps, at 14 bit resolution, and 8 channels of DAC, 10.0+GSps, at 14 bit resolution. DFE RFSoCs are available later this year.

Rugged

Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high performance air, conduction, or air-flow-through cooling for thermal control.

Designed & Manufactured in USA

All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.

MADE IN

U. S. A.

www.annapmicro.com

PART NUMBER

FORM FACTOR

FPGAs

100Gb ETHERNET

SOSA™ALIGNED

ADC/DAC

WB6XB2

6U VPX

US+ (2x) US+ MPSoC

Yes

Yes

WFMC+ Mezz (2x)

WB3XBP

3U VPX

US+ US+ MPSoC

Yes

Yes

WFMC+ Mezz

WB3XB9

3U VPX

US+ (up to 13P) US+ MPSoC

Yes

Yes

WFMC+ Mezz

WB3XS0

3U VPX

US+ RFSoC

Yes

Yes

Integrated

WB3XR0

3U VPX

US+ RFSoC (2x) US+ MPSoC

Yes

Yes

Integrated

Ą General Features • Up to three Xilinx® UltraScale+™ FPGAs • A Full Board Support Package for fast and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 and Linux support • Multiple levels of hardware and software security Ą OpenVPX Backplane I/O • Up to 38 HSS I/O lanes to VPX backplane for up to 182 GB/s of full duplex bandwidth • Up to 32 LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization Ą Front Panel I/O • WILD FMC+ (WFMC+™) next generation I/O site(s) • – Accepts standard FMC and FMC+ cards • – Supports stacking (2 I/O cards per site) • – Up to 32 HSS and 100 LVDS pairs connections to FPGA Ą Mechanical and Environmental • Air, conduction, or AFT cooled: -55°C to +85°C Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable for air-cooled variants • RTM available for additional I/O

WILDSTAR Boards are cooled via Air, Conduction, or Air-Flow-Through

Annapolis Micro Systems, Inc.

www.annapmicro.com/product-category/fpga-boards-2/ www.vita-technologies.com

 wfinfo@annapmicro.com  410-841-2514

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Embedded Hardware

VITA Technologiess Resource Guide

Hardware

100Gb Ethernet OpenVPX Chassis & Backplanes for SOSA™-Aligned Systems Annapolis WILD100™ 3U and 6U VPX Chassis and Backplanes are 40/100Gb Ethernet capable and developed in alignment with the SOSA™ Standard. The air-cooled units feature up to 16 conductioncooled slots.

Line rates of 25 Gbps on data and expansion planes are via 25/40/100Gb Ethernet, SDR/DDR/QDR/EDR InfiniBand, Gen 3/4 PCI Express, and/or custom protocols.

Included is an Annapolis-designed and manufactured COTS Chassis Manager. It is SOSA-aligned, VITA 46.11 compliant, and features a Xilinx UltraScale+ ZU5EG MPSoC and latest Microsemi PolarFire FPGA. It enables critical chassis control, maintenance, and security functions.

Optional FPGA Boards, Switches, Storage, SBC, VITA blocks and cables are also available.

WILD100 7-Slot 3U OpenVPX SOSA-Aligned Chassis (WC3170)

PART NUMBER

FORM FACTOR

TOTAL SLOTS

PAYLOAD SLOTS

100Gb ETHERNET

SOSA™ALIGNED

WC60G0

6U VPX

16

11

Yes

Yes

WC31D0

3U VPX

13

8

Yes

Yes

WC3170

3U VPX

7

4

Yes

Yes

WCG000

6U or 3U

Up to 16

Up to 11

Yes

Yes

Ą General Features

• • • • • • • • • • • • • • •

Air-cooled with up to 16 conduction-cooled slots 19" rack mountable All slots support VITA 65/SOSA profiles Payload slots support VITA 66.5C and VITA 67.3C Optional MIL-DTL-38999 SOSA-aligned circular connectors with 19 RF connections for payload slots (3U) 25 Gbps Line Rates on Data, Expansion and Control Planes – Ethernet: 100GBASE-KR4 and 40GBASE-KR4 – InfiniBand: SDR, DDR, QDR and EDR – Gen 3/4 PCI Express – Custom protocols up to 25 Gbps per lane VITA 62 power supplies – Standard or 12V-Heavy Input Power – 3-phase AC or 270VDC power inputs (6U) – 28VDC per MIL-STD-704F (3U)

Ą Chassis Manager

• • • • •

SOSA-aligned and VITA 46.11 compliant Enables control, maintenance, and security functions Xilinx UltraScale+ ZU5EG MPSoC running Linux for CHmC Integrated JTAG access/control to each slot Supports MIL-STD-1553

Ą Application Development

MADE IN

WILD100 16-Slot Top-Loading 6U OpenVPX Chassis (WC60G0)

• • • •

Standard support delivered with all systems Optional full Board Support Package – Enables customization of Zynq PS, PL for security – Provides fast and robust HDL-based environment

U. S. A.

Contact us today to request block diagrams and additional specifications. www.annapmicro.com

Annapolis Micro Systems, Inc.

www.annapmicro.com/product-category/chassis-and-backplanes/

28 | VITA Technologies with Resource Guide Spring 2021

 wfinfo@annapmicro.com  410-841-2514

www.vita-technologies.com

ADC_3210 FMC+ 14-bit ADC @ 1'300 Msps The ADC_3210/3211 is the first member of IOxOS Technologies FMC+ VITA 57.4 data acquisition product line based on latest AD high-speed low-power generation ADC devices with digital read-out through JESD204B interface, operating from 6.25 Gbps up to 13 Gbps.

The eight(8) single-ended 50 Ohms analog inputs are supplied through SSMC highfrequency connectors. AC coupling (ADC_3210) and DC coupling (ADC_3211) versions are available. Each ADC channel can optionally be connected to a wide-band digital down-converter (DDC) block, featuring decimation and low-pass/high-pass/band-pass filtering as well as digital I/Q mixing. Clock tree is implemented with a high precision on-board low jitter low phase noise clock controller LMK04616, fully programmable by the carrier-board.

The clock reference source is selectable from front panel SSMC input, FMC/FMC+ clock source or from an on-board ultra-low phase noise VCXO/programmable XCO.

FEATURES Single width FMC VITA 57.1 / FMC+ VITA 57.4 HPC (High Pin Count) format Eight (8) ADC channels of 14-bit at 1’300/625 Msps JESD204B backend signaling (2 lanes per ADC channel) Latest generation ADC technology AD 9695 dual 14-bit @ 1’300/625 Msps Ą SSMC front panel RF connectors Ą Xilinx Ultrascale/Zync+ FPGA VHDL Design Kit Ą Ą Ą Ą Ą

www.ioxos.ch

IOxOS Technologies



info@ioxos.ch

 +41 22 364 76 92

https://ch.linkedin.com/company/ioxos-technologies

www.ioxos.ch/wp-content/uploads/2019/10/ADC_3210_DS_A1.pdf

OpenVPX

RTM-9265 & 9380 Rear Transition Modules Universal 6U or 3U VPX Rear Transition Module.

06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector.

RTM-9265

FEATURES: Ą Universal 6U or 3U VPX Rear Transition Module. Ą 06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector. Ą Then Daughter cards are used to breakout individual signal lines. Ą The 06-1019341 Daughter card is for slow signals- uses 2mm headers or direct wire solder connections. Ą The 06-1019342 Daughter card is for fast signals – using Samtec differential pair coax cables. Ą These cables can be loaded for each row of the VPX connector. Ą The two large DB50 connectors have 50 pins each for slow signal break out. Ą The DB50s can be removed to have fast signals exit via Samtec cables. Ą Can be customized by Dawn for your specific connectors if needed (as long as they are available in panel mount version).

RTM-9380

www.dawnvme.com

Dawn VME Products www.dawnvme.com www.vita-technologies.com



sales@dawnvme.com

•

 800-258-DAWN (3296)

•

510-657-4444

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FMC

VITA Technologiess Resource Guide

OpenVPX

6E10 features up to 26 40/100Gb Ethernet ports

100GbE VPX Switches are SOSA™-Aligned WILDSTAR™ 6E10 (6U) and 3E10 (3U) are next-generation 100GbE Switches that deliver up to 6.4 Tb/s of switching between backplane slots of multiple channels of 100Gb Ethernet. They have front panel I/O to connect to external data sources, and 6E10 has optional VITA 66.5 optical backplane connectivity. Both are VITA 65-compliant, and align with the SOSA Standard.

FEATURES Ą Switching

• • • •

Supports 1/10/25/40/100 GbE 6.4 Tb/s of switching capability Industry-leading, true cut-through latency Separate Data and Control Plane Switches

These rugged high-performance Switches are readily integrated into any SOSA-aligned VPX system, or deployed within Annapolis’ proven WILD100™ EcoSystem.

Ą I/O

Also available: For InfiniBand support, see WILDSTAR 6B10 6U OpenVPX InfiniBand Switch.

Ą FPGAs

• Optional 40/100GbE optical interfaces to Front Panel • Optional 40/100GbE optical interfaces to VITA 66 (6E10) • 2 Xilinx® Zynq® UltraScale+™ MPSoCs

Ą General

• • • •

Multiple levels of hardware and software security Supports new SOSA/VITA 65 switch profile Air, conduction, air-flow-through, or liquid cooled Hot swappable with air-cooled variants

Ą Optional Board Support Package (BSP)

• Enables user customization of Zynq+ design • Includes HDL reference design for HPEs and PetaLinux project including necessary software source • Includes Ubuntu Linux v18.04 file system and v5.4 kernel with required patches

Ą What Can 100GbE Switches Do for You?

If you require high-performance switching for advanced HPC, ISR, or multi-function EW applications, these turnkey switches with dense, flexible I/O are for you.

The 6E10 Switch ran in an Air Force chassis at TSOA-ID, the first public demonstration of a SOSA-aligned 100GbE switch.

Contact us today to request a block diagram and additional specifications.

MADE IN

U. S. A.

www.annapmicro.com

Annapolis Micro Systems, Inc.

www.annapmicro.com/product-category/switch-boards/

30 | VITA Technologies with Resource Guide Spring 2021

wfinfo@annapmicro.com  410-841-2514 

www.vita-technologies.com

Rugged Chassis Platforms for OpenVPX/SOSA Today’s OpenVPX/SOSA designs require advanced cooling solutions and high-speed backplane expertise.

Pixus offers innovative thermal management solutions for high-powered systems in conduction, convection, and liquid cooling formats.

The company has developed a vast array of profiles for VITA 66/67, SOSA, and other designs at PCIe Gen4, 100GbE, and higher speeds. Pixus also provides Tier 2 OpenVPX Chassis Managers to VITA 46.11 specifications. For the leader in OpenVPX backplane and chassis solutions, come to Pixus Technologies.

FEATURES Ą Rugged ATR OpenVPX designs in various formats for 3U and 6U boards Ą Backplane design expertise up to and above 100GbE speeds, RT3

connector Ą Rugged rackmount designs for both air-cooled and conduction-cooled boards, powerful cooling Ą Designs geared to VITA 66, VITA 67, and SOSA requirements Ą Vast array of COTS, quick-turn prototyping platforms Ą OpenVPX Chassis Managers & specialty OpenVPX products

Pixus Technologies

 sales@pixustechnologies.com  916-297-0020

www.pixustechnologies.com

@pixustech VME

ComEth4000e

FEATURES Ą 6U VME (1 or 2 slots)

Ą Managed Layer 2+/3 switch Ą Up to 32 ports

Ą 1000BASE-T, SFP+, QSFP (front) Ą 1000BASE-T (rear)

Ą Mezzanine boards (10GBASE-T, SFP+ (1G/10G), SFP (100M/1G)

or QSFP (40G) Ą Standard, extended, rugged air-cooled grades

The ComEth4000e is a cutting-edge 6U VME Layer 2/3 Gigabit Ethernet switch dedicated to Defense and industrial high-computing applications. The ComEth4000e switch provides 10/40 Gigabit Ethernet ports made available via special mezzanine boards, on a 1-slot or 2-slot 6U form-factor. The single-slot board comes with 12 x 1000BASE-T Ethernet ports while the dual-slot board provides up to 24 x 1000BASE-T Ethernet ports on the front panel. Both configurations offer 8 x 1000BASE-T Ethernet ports as an option on the VME P0 connector, and can be equipped with up to 5 mezzanine boards (factory-build) providing 10GBASE-T, SFP+ (1G/10G), SFP (100M/1G) or QSFP (40G) ports instead of the 4 front 1000BASE-T ports. This flexible product design allows the user to choose from various Ethernet interface configuration according to its application requirements.

This managed Layer2/3 Ethernet switch is powered by a highly integrated Marvell System-on-a-Chip (SoC) with programmable packet processors. Its Ethernet switch matrix is managed with an independent Marvell ARMv7 dual-core processor, supporting the Switchware network management application. This high-performance Layer3 switch can be remotely configured by the Switchware web interface, SNMP or CLI interfaces. Moreover, this product offers IPv4/IPv6 routing capabilities. The ComEth4000e is available in standard, extended, rugged air-cooled grades.

www.interfaceconcept.com/products/Ethernet-Switches/6U-VME/336-ComEth4000e-6U-VME-11040-Gigabit-Ethernet-Switch

Interface Concept

www.interfaceconcept.com www.vita-technologies.com



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept VITA Technologies with Resource Guide Spring 2021 |

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OpenVPX/SOSA

VITA Technologiess Resource Guide

VME ComEth4070e The ComEth4070e is a cutting-edge 6U VME Layer 2/3 Ethernet switch, offering up to 32*1/10/40 Gigabit Ethernet ports.

The switch integrates a high performance Marvell System On-aChip that supports up to 320 Gbps packet throughput. Different board configurations are possible going from a version that includes 24 rear Gigabit Base-T Ethernet ports and 8 front SFP+ (1/10Gbps) to a version that includes 20 rear Gigabit Base-T Ethernet ports, 8 front SFP+ (1/10Gbs) and a front panel mezzanine. Various types of front-panel mezzanine exist to offer a QSFP+ interface (40Gbps), 4 SFP+ (1/10Gbps) or two 10GBase-T ports.

In addition, a comprehensive switch management stack, called Switchware, is running on the ComEth4070e on-board processor and supports a rich set of Layer 2/3 features that can be controlled through a Graphical User Interface. The ComEth4070e can also be managed via a serial interface (serial or TELNET or SSH) and SNMP (SNMPv2 and v3).

FEATURES Ą Managed Layer 2+/3 Ą Up to 32 ports Ą SFP+ (front) Ą 10/100/1000Base-T (rear)

The ComEth4070e is available in standard, extended, rugged aircooled and conduction-cooled grades.

Ą VME 64x compliant

www.interfaceconcept.com/products/Ethernet-Switches/6U-VME/341-ComEth4070e-6U-VME-11040-Gigabit-Ethernet-Switch

Interface Concept

www.interfaceconcept.com



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept

VME

ALTHEA 7910 – FPGA-based PCI Express to VME64x Bridge Give a new (and long) life to your VME systems!

This FPGA-based solution is aimed to upgrade VME COTS to the next generation of high-performance PCI Express embedded systems, providing a full VME64x Master/Slave interface with Slot-1 functions and interrupt management with a direct bridge to a PCI Express upstream port, that makes possible an extremely low latency combined with a high data bandwidth. Advanced VME64x data transport 2eVME and 2eSST modes, including broadcast, are natively supported with maximal burst length capability. Large data-transaction buffers guarantee maximal 2eSST data transfer support for continuous operation. A key element for this high performance is an embedded dual channel Intelligent DMA Controller (IDMAC), which allows high bandwidth simultaneous Read/Write transactions exceeding 1'600 MBytes/s data rates with PCI Express GEN2.

A true VME Renaissance.

IOxOS Technologies

FEATURES Ą Transparent PCI Express – VME64x Master/Slave Bridge with

embedded chained DMA

Ą Single chip, low power solution (< 2[W])

Ą Performance-enhancing Network on Chip (NoC) based architecture Ą True PCI Express End Point x4 GEN1/GEN2 (v 2.1)

Ą Targets Xilinx Artix-7 XC7A75T device in FGG484 package Ą Higher performance compared to legacy ASIC solutions Ą Linux, Windows 10 and VxWorks 7 device drivers

www.ioxos.ch/wp-content/uploads/2018/02/ALTHEA_7910_DS_2.pdf

32 | VITA Technologies with Resource Guide Spring 2021

www.ioxos.ch 

info@ioxos.ch

 +41 22 364 76 92

https://ch.linkedin.com/company/ioxos-technologies

www.vita-technologies.com

A FINE TECHNOLOGY GROUP

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor.

Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

FEATURES Ą

Most rack accessories ship from stock

Ą

Modified ‘standards’ and customization are our specialty

Ą

Card sizes from 3U x 160mm to 9U x 400mm

Ą

System monitoring option (CMM)

Ą

AC or DC power input

Ą

Power options up to 1,200 watts

Made in the USA Since 1947

For more detailed product information, please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.

Vector Electronics & Technology, Inc. www.vectorelect.com www.vita-technologies.com



inquire@vectorelect.com

 800-423-5659

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VME

VITA Technologiess Resource Guide

VME

6U VME SATA Carrier with Removable Drive Modules Add 32TB of data storage to your VME system!

With transfer speeds of 200 MB/S and capacities up to 32TB (2x16TB), the 6U VME SATA Carrier with Removable Drive Module provides reliable storage in extreme temperature, shock, and vibration environments.

FEATURES Ą Removable module with COTS SATA SSD Ą Capacities up to 32TB (2x16TB)

6U VME SATA Carrier with Removable Drive Module is for applications that require the frequent removal of SSD, fast transfer rates, and large capacities. It consists of 2 components: the 6U VME carrier board with SATA interface to VME backplane that mounts in one slot of 6U VME chassis and two removable SATA SSD drive modules.

Ą 100,000 mating cycles

Ą SATA2 interfaces configured for VME P0 or P2 Ą Provides boot and/or storage disk

Ą No Tools option with easily removable

A desktop unit is available that allows drive module to be used with a PC for data transfer. The drive module can be easily removed from VPX system and taken to PC.

thumbscrews

Ą Military erase, FIPS140-2, FIPS197,

Red Rock Technologies specializes in providing custom solutions per customer requirements.

Red Rock Technologies

www.redrocktech.com/products/vmebus-storage-products

TCG Opal options

www.redrocktech.com 

info@redrocktech.com

 480-483-3777

VPX ComEth4412a

FEATURES Ą Ą Ą Ą Ą Ą Ą

3U VPX Managed Layer 2+/3 switch VITA 65.0 SLT3-SWH-6F8U-14.4.15 Up to 12 Eth. ports and 6 PCIe ports 1G/10GBASE-T, 10GBASE-KR, 40GBASE-KR4, SFP+ Aligned with the SOSA™ Technical Standard Standard, extended and rugged grades in air-cooled and conduction-cooled versions

The ComEth4412a is a 3U VPX dual plane hybrid PCI Express Gen 3 and 40 Gigabit Ethernet Switch, designed in alignment with the SOSA™ (Sensor Open Systems Architecture) Technical Standard. This hybrid switch combines 2 separate switches: the Expansion/Data Plane Switch supports up to six 4-lane PCI Express Gen 1/2/3 ports with support for Upstream, Downstream and Non-Transparent modes. The Control Plane Switch is a managed L2+/L3 Ethernet switch capable of supporting up to 12 Ethernet ports operating at 1, 10 or 40 Gigabits per second. With its non-blocking architecture, the ComEth4412a is ideally suited to handle high-speed and heterogeneous PCI Express and Ethernet data flows in highly integrated low-SWaP (Size, Weight and Power) systems. The ComEth4412a 3U VPX board is compliant with the SOSA/VITA 65.0 switch profile SLT3-SWH-6F8U-14.4.15, and completes Interface Concept product portfolio aligned with the SOSA™ Technical Standard, available to sensor system designers for Defense. The ComEth4412a is controlled through an intuitive interface available as a command line (CLI) or graphical user interface (GUI), in addition to SNMP. This interface is running on the on-board management processor and is part of Interface Concept’s featurerich layer 2/3 switch management stack called “Switchware” which supports various communication protocols.

www.interfaceconcept.com/products/Ethernet-Switches/3U-VPX/328-ComEth4412a-3U-VPX-dual-plane-hybrid-PCIe-Gen23-and-11040-Gigabit-Ethernet-Switch

Interface Concept

www.interfaceconcept.com

34 | VITA Technologies with Resource Guide Spring 2021



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept

www.vita-technologies.com

ComEth4590a The ComEth4590a is a conduction-cooled 3U VPX dual-plane 10/40 Gigabit Ethernet Layer 3 Switch, which has two separate and independent on-board Ethernet switch matrices – one for the Data Plane and one for the Control Plane. These two separate switch matrices are managed by two independent dual core processors.

Each matrix supports separate instances of Interface Concept Switchware network management which allows independent network configuration for features such as network optimization, monitoring and security. The ComEth4590a features a total of 41 Serializers/ Deserializers (SerDes) or Lanes routed to the rear VPX connectors as 1000Base-KX, 10GBase-KR or even 40GBase-KR4 ports and as 10GBase-SR or 1000Base-SX fiber optical ports to the front panel.

The Cometh4590a is fully compatible with the Intelligent Platform Management Interface (IPMI and supports Precision Time Protocol (PTP) IEEE 15888-2008 (v2) for networks requiring sub-microsecond synchronization capabilities throughout the IP network. In addition to offering outstanding switching capabilities, this high-performance Layer3 switch can be remotely configured by the Switchware web interface, SNMP or CLI interfaces. It is available in conduction-cooled environmental grade. The US DoD CMOSS (C4ISR Modular Open Suite of Standards) hardware convergence initiative is a good example of an application for the Cometh4590a.

FEATURES Ą Ą Ą Ą Ą Ą Ą

3U VPX Switching for 2 independent domains VITA 65.0 Slot Profile SLT3-SWH-6F1U7U-14.4.14 Up to 34 ports 1000BASE-SX, 10GBASE-SR (front) 1000BASE-KX, 10GBASE-KX4/KR, 40GBASE-KR4 (rear) Aligned with the SOSA™ Technical Standard

www.interfaceconcept.com/products/Ethernet-Switches/3U-VPX/309-ComEth4590a-3U-VPX-dual-plane-40-Gigabit-Ethernet-Switch

Interface Concept

www.interfaceconcept.com



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept

VPX IC-ARM-VPX3a

FEATURES Ą 3U VPX

Ą NXP LX2160A ARM based Single Board Computer

Ą VITA 65.0 Slot Profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 Ą 10, 25, 40 and 100 GbE interfaces

Ą Aligned with the SOSA™ Technical Standard Ą M2 site

Ą Air-cooled and conduction-cooled versions

The new high-performance IC-ARM-VPX3a 3U VPX Single Board Computer offers the latest technological innovations with the NXP Arm® Cortex®-A72- based LX2160A Multicore Communications Processor. This board design meets systems integrators needs, with 25 Gbit/s Ethernet interfaces on a 3U VPX system backplane currently specified by the Sensor Open Systems Architecture (SOSA™) working group. The IC-ARM-VPX3a complies with the VITA 65.0 OpenVPX Slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16, and is aligned with the SOSA™ Technical Standard. Today, the NXP Arm® LX2160A processor is the only one on the market to support up to 100 Gbit/s Ethernet routed on the backplane, which significantly improves high bandwidth required in 3U VPX systems’ high-processing applications. The IC-ARM-VPX3a features 32GB of DDR4 memory, local storage options (eMMC and M.2 slot), PCIe Gen 3.0, SATA3, USB, UART and multiple 10/40 Gigabits and 25/100 Gigabit Ethernet interfaces available on the backplane.

This board complies with VITA 65.0 standard and comes with a boot loader and a Linux or VxWorks Board Support Package. It is available in air-cooled and conduction-cooled versions.

www.interfaceconcept.com/products/Single-Board-Computers/3U-VPX/351-IC-ARM-VPX3a-3U-VPX-LX2160A-Arm-based-Single-Board-Computer

Interface Concept

www.interfaceconcept.com www.vita-technologies.com



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VPX

VITA Technologiess Resource Guide

VPX

3U VPX Carrier with Removable NVMe SSD Module Add 16TB of data storage to your VPX system!

With transfer speeds of 3940 MB/S and capacities up to 16TB, the VPX NVME module provides reliable storage in extreme temperature, shock, and vibration environments.

The 3U VPX carrier with removable NVMe SSD module is for applications that require the frequent removal of SSD, fast transfer rates, and large capacities. It consists of two components: the 3U VPX carrier board with PCI express (PCIe) Gen 3x4 interface to VPX backplane that mounts in one slot of 3U VPX chassis and the removable NVMe SSD drive module.

A PC kit is available that allows NVMe drive module to be used with a PC for data transfer. The drive module can be easily removed from VPX system and taken to PC. VxWorks, Linux, and Windows support is available.

Red Rock Technologies specializes in providing custom solutions per customer requirements.

Red Rock Technologies

FEATURES Ą Ą Ą Ą Ą Ą Ą Ą Ą



www.redrocktech.com/products/vpx-storage-products

www.redrocktech.com

Removable module with COTS NVMe SSD Capacities up to 16 TB 100,000 mating cycles Air or conduction cooling OpenVPX Fat Pipe (FP) VITA 46, 47, 48, 65 Boot and/or storage disk No Tools option with easily removable thumbscrews Military erase, FIPS140-2, FIPS197, TCG Opal options info@redrocktech.com

 480-483-3777

VPX/OpenVPX

PSC-6238 800 Watt 3U OpenVPX Conduction Cooled Power Supply The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions.

Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units.

The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade.

Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.

Dawn VME Products www.dawnvme.com



sales@dawnvme.com

36 | VITA Technologies with Resource Guide Spring 2021

FEATURES Ą True 6 Channel supply provides full OpenVPX support Ą Wedge lock conduction cooled module Ą Up to 800 Watts power output with 1 inch pitch form factor Ą Onboard embedded RuSH™ technology actively monitors voltage,

current, temperature and provides protective control Ą Factory programmable power sequencing of all voltage rails Ą Shutdown control for each power rail Ą Over Voltage, Over Current and Over Temp protection

www.dawnvme.com

•

 800-258-DAWN (3296)

•

510-657-4444

www.vita-technologies.com

VP1-250-eSSD NVMe Phoenix International’s VP1-250-eSSD is the industry's first Open VPX NVM Express (NVMe) Solid State Disk data storage module with optional FIPS 140-2 certified AES 256 encryption. It is available in air cooled and conduction cooledconfigurations .

With capacities up to 15TB, the VP1-250-eSSD is a 3U VPX SSD storage module that delivers extremely high performance via a single Fat Pipe (PICe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance.

Data is delivered fast and efficiently with minimal burden on the host CPU. NVM Express (NVMe) is an industry-standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. NVMe provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed – both now and in the future.

Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems.

Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.

Phoenix International www.phenxint.com

www.phenxint.com

FEATURES Ą FIPS 140-2 Certified AES 256 encryption

Ą Out-of-the-box software, drivers and manageability enable easy

adoption and storage interoperability Ą Capacities from 800GB to 15TB Ą Sustained Read/Write Transfer Speeds of 3.5/3.1 GB/sec Ą Up to 750,000 IOPS (Random 4KB Read) Ą Streamlined protocol with efficient queuing mechanism to scale for multi-core CPUs M Ą Air Cooled or VITA 48/REDI Conduction Cooled

ade in the



info@phenxint.com

USa

 714.283.4800

VPX/OpenVPX

VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage.

Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports FIPS 140-2 AES 256 encryption.

When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media.

The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity.

Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.

Phoenix International www.phenxint.com www.vita-technologies.com

FEATURES SLC or MLC SATA Solid State Disk VITA 48/REDI Conduction Cooled Ą Operational Altitude to 80,000 Feet Ą Operational Temperature from -40 °C to +85 °C Ą Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC) Ą Optional AES 256/FIPS 140-2 Encryption Ą Ą

Made in the USa

www.phenxint.com 

info@phenxint.com

 714.283.4800

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VPX/OpenVPX

VITA Technologiess Resource Guide

VPX/OpenVPX

VITA 46, 66 & 67 Looking for one place for all of your VPX/VITA needs?

Amphenol Military and Aerospace now has you covered!

These parts are also designed for side-by-side implementation with VITA 46 hardware and are cabled to Ø.047 and Ø.086 coaxial cable types.

SV Microwave offers a complete line of COTS VITA 67 coaxial/RF motherboard, daughtercard, individual contacts and 6" and 12" cable assemblies through distribution.

SV cables VITA 67 contacts with male 2.92mm (SMK) connectors to Ø.047 and Ø.086 coaxial cable types. SV’s unique connector retention mechanism makes installing and removing the cable assemblies easier than the competition! Additionally, SV’s floating SMPM coaxial contacts ensure excellent RF performance in any mating condition.

Amphenol Aerospace’s R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 25Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.

FEATURES and benefits

VITA 46: Ą

High performance RF addition to the VPX platform

Ą

High density form factor

Ą

Excellent RF performance to 40 GHz & beyond

Ą

Half-width (4 port) and full-width (8 port) formats

Ą

COTS parts readily available through distribution

Ą

VITA 46.0 & 46.30: Ą Qualified to VITA 46 for Open VPX applications Ą Fully intermountable and intermateable to existing VITA 46 connectors Ą Meets and exceeds VITA 47 performance requirements Ą Supports Ethernet, Fiber Channel, InfiniBand, and other protocols Ą Modular COTS lightweight connector system Ą Can be combined with high power modules, RF modules (VITA 67) and Optical modules (VITA 66) Ą Evo 2 46.30 series is capable of speeds in excess of 25Gb/s

Can be combined with high power modules, Ruggedized modules (VITA 46) and Optical modules (VITA 66)

VITA 66.1 & 66.4: Ą VITA 66.1, 66.4 spec compliant Ą Spring-loaded floating MT ferrules Ą Multiple alignment guide features Ą No special tooling required for assembly Ą Supports industry standard MT ferrules – up to 24 fiber optic channels per MT)

Amphenol Military & Aerospace Operations is perfectly aligned to provide the latest technologies, cost-effective manufacturing and supply chain management, and local support to solve any military and aerospace interconnect need. http://www.amphenolmao.com/Products

Amphenol MAO

http://www.amphenolmao.com/Products

38 | VITA Technologies with Resource Guide Spring 2021

marketing@svmicrowave.com https:/ /twitter.com/AmphenolMAO



 561-840-1800

www.vita-technologies.com

IC-EM2-XMCa The IC-EM2-XMCa is an XMC storage module dedicated to add mass storage capability to any IC Single Board Computers (SBCs) or host carrier board, based on VPX, VME and cPCI formfactors. Connected to any host board by a PCIe x1/x2/x4 up to Gen3 interface, the IC-EM2-XMCa allows adding, removing, replacing and upgrading M.2 NVMe SSD mass storage units.

This XMC module increases data storage capacity of highperformance embedded systems (up to 2TB today). The IC-EM2-XMCa is an XMC storage solution that allows the hard drive mounted on a carrier, such as a SBC, to be simply and easily removed through the front panel by unfastening two screws. The IC-EM2-XMCa can accommodate the latest NVME eSSD from 2230 to the 2280 form factor (2230, 2242, 2260, 2280). The board is designed and qualified to run in air-cooled environmental grade only. The IC-EM2-XMCa can be used in any compute/storage-intensive industrial, military or aerospace application.

FEATURES Ą Standard XMC mezzanine

Ą Removable mass storage through the front panel Ą M.2 NVMe SSD modules support Ą Socket up to 2280

Ą PCIe x1/x2/x4 up to Gen3 on XMC P5 connector Ą ANSI/VITA 61.0 connectors also available Ą Air-cooled version

www.interfaceconcept.com/products/StorageIOsGraphicsSerial-RS/XMCPMC/368-IC-EM2-XMCa-Removable-mass-storage-XMC-module

Interface Concept

www.interfaceconcept.com



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept

XMC IC-RBP-XMCa

FEATURES Ą XMC Ą Zynq UltraScale+ MPSoC ZU4CG Ą 4 * 10/100/1000BASE-T channels (front or rear) Ą 1 * Gigabit Ethernet Controller Ą Redundancy protocols: PRP, HSR Ą 1*Giga Ethernet Controller (NIC) Ą Air and conduction cooled versions

The IC-RBP-XMCa is a network redundancy Switched Mezzanine Card (XMC) card, dedicated to add a dual attached redundancy capability to systems interconnected via Ethernet. This XMC module allows strengthening Ethernet communication systems in order to prevent any failure. Using standard protocols such as Parallel Redundancy Protocol (PRP), the IC-RBP-XMCa’s sending nodes replicate frames over two independent Ethernet networks that operate in parallel between senders and receivers. The receiving node processes the frame arriving first and discards the duplicate. In case of failure of one network link, seamless redundancy is provided between the dual attached nodes. The High-availability Seamless Redundancy (HSR) protocol can also be implemented in order to provide seamless failover in case of a network failure in the ring topology created between several IC-RBP-XMCa boards. The IC-RBP-XMCa management and supervision application allows managing double attached nodes, supplies network statistics, checks the integrity of the network and generates real-time events like the loss, for instance, of a network link.

This application is remotely controlled through SNMP, Graphical User Interface (GUI HTTP), Command Line Interface (CLI). The IC-RBP-XMCa is suitable for any XMC compliant SBC or host carrier board (cPCI, VME, VPX).

www.interfaceconcept.com/products/StorageIOsGraphicsSerial-RS/XMCPMC/370-IC-RBP-XMCa-Active-network-redundancy-XMC-Switch-Mezzanine-Card

Interface Concept

www.interfaceconcept.com www.vita-technologies.com



info@interfaceconcept.com  510-656-3400 www.linkedin.com/company/interface-concept VITA Technologies with Resource Guide Spring 2021 |

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VITA Technologiess Resource Guide

XMC

The Next Big Thing in

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Pentek’s Model 6001 Gen 1 and 6003 Gen 3 RFSoC QuartzXM® modules let you quickly develop and deploy RFSoC technology, while optimizing your system for SWaP. Mounted on your custom carrier or Pentek’s proven 3U VPX, SOSA Aligned 3U VPX, PCIe and SFF platforms, both QuartzXM modules come pre-loaded with a full suite of IP modules, robust software, and fully integrated hardware — all geared to shorten time to market and reduce design risk.

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Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2021 Pentek, Inc. Pentek, Quartz, QuartzXM and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.

™