VITA Technologies Winter 14 Buyers Guide

p. 6 Editor’s Foreword 2014 recap

p. 10 VITA News Building a VNX ecosystem

NEW HIGHER 3U

POWER. NEW HIGHER 6U HEALTH MONITORING PERFORMANCE. Behlman VPXtra™ 500M 3U Power Supply VME HMC-A

VPX HMC-A VPX HMC-B

VME RTM

VPX RTM

INTEGRATED COMBAT SYSTEMS (ICS) Orbit Electronics Group’s Integrated Combat Systems (ICS) has announced the availability of two new 6U VME System Health Monitors, two 6U VPX System Health Monitors, and a Rear Transition Module (RTM) for each.

BEHLMAN ELECTRONICS Orbit Power Group’s VPXtra™ 500M 3U COTS DC-toDC power unit has joined the world-famous family of 6U Behlman VPXtra™ Power Supplies. This 3U power supply is a rugged, highly reliable, conduction cooled, switch mode unit. It is VITA 62, Open VPX compliant, and delivers 550 Watts of DC power via six outputs.

The 12V, 3.3V, and 5V main outputs can be paralleled for higher power. VPXtra™ 500M accepts 18- to 36-VDC input, compliant with MIL-STD-704, and can supply highpower DC output. They require no minimum load and provide overvoltage and short circuit protection, as well as overcurrent and thermal protection.

Behlman also provides a wide range of VME and 6U VPX power supplies. See them at www.behlman.com or www.vmevpx.com.

VME HMC-B

These six products join the over 135 standard and customized VME and VPX products shown on Orbit’s web portal at www.vmevpx.com. They are among the most advanced such components available today. All 6U System Health Monitors feature a unique, proprietary feature-rich GUI; Ethernet, USB and/or RS 232 interfaces; set-up; data logging; field upgradable firmware; and data password protection.

ICS is also a leader in designing and building advanced military and industrial electromechanical assemblies.

Together, Orbit Power Group and Orbit Electronics Group provide an unmatched range of superior options and cost-effective solutions.

www.vmevpx.com YOUR PORTAL FOR OVER 135 STANDARD AND CUSTOM DESIGNED

BEHLMAN ELECTRONICS, INC. 80 Cabot Court • Hauppauge, NY 11788 USA TEL: +1 631 435-0410 • info@behlman.com

Behlman Electronics and Integrated Combat Systems are subsidiaries of Orbit International.

Open VPX is a trademark of VITA. VPXtra is a trademark of Behlman.

VME-VPX PRODUCTS

INTEGRATED COMBAT SYSTEMS (ICS) 401 Industry Road, Suite 600 • Louisville, KY 40208 TEL: +1 866 319-8085 • info@vmevpx.com

WINTER 2014 | VOLUME 32 NUMBER 4

@VitaTechnology

On the cover The annual 2015 Buyer’s Guide features new products in industries such as avionics, commercial, communications, imaging, industrial, radar, rugged, surveillance, T&M, and unmanned systems. Examples of some of these products and industries can be seen on the cover, from Annapolis Micro Systems (U.S. Navy photo by Photographer's Mate 3rd Class Douglas G. Morrison), SIE Computing Solutions, Curtiss-Wright Defense Solutions, and Meritec. The rest of the Buyer's Guide begins on page 26.

SPECIAL FEATURE Bringing LTE to OpenVPX »» p. 14

By Paul Moakes, CommAgility

12 Business Barometer

Jerry Gipper

Making predictions of 2015 trends and where technology is headed.

DEPARTMENTS

6 Editor’s Foreword

Jerry Gipper

2014 recap

8 VITA Standards Update

Jerry Gipper

VITA Standards Organization activity updates Cost benefits of FPGA and FMC for embedded systems development »» p. 18

By Jason Cella, 4DSP

10 VITA News

Alan Simmonds

Building an ecosystem for VNX

26 VITA Technologies Buyer's Guide 34 Primetime Choices 1. Publication Title

Statement of Ownership, Management, and Circulation (All Periodicals Publications Except Requester Publications)

VITA TECHNOLOGIES 4. Issue Frequency

2. Publication Number 1

9

4

1

_ 3

3. Filing Date

8

0

7

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QUARTERLY

4

OCTOBER 2014

$45.00

7. Complete Mailing Address of Known Office of Publication (Not printer) (Street, city, county, state, and ZIP+4 ®) 16626 E AVENUE OF THE FOUNTAINS, STE 201, FOUNTAIN HILLS AZ 85268

480-967-5581

16626 E AVENUE OF THE FOUNTAINS, STE 201, FOUNTAIN HILLS AZ 85268

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9. Full Names and Complete Mailing Addresses of Publisher, Editor, and Managing Editor (Do not leave blank) Publisher (Name and complete mailing address) PATRICK HOPPER - 30233 JEFFERSON AVE, ST.CLAIR SHORES, MI 48082-1787

(1) Mailed Outside-County Paid Subscriptions Stated on PS Form 3541 (Include paid distribution above nominal rate, advertiser’s proof copies, and exchange copies) b. Paid Circulation (By Mail and Outside the Mail)

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Editor (Name and complete mailing address) ROSEMARY KRISTOFF - 16626 E AVENUE OF THE FOUNTAINS, STE 201, FOUNTAIN HILLS AZ 85268 Managing Editor (Name and complete mailing address)

10. Owner (Do not leave blank. If the publication is owned by a corporation, give the name and address of the corporation immediately followed by the names and addresses of all stockholders owning or holding 1 percent or more of the total amount of stock. If not owned by a corporation, give the names and addresses of the individual owners. If owned by a partnership or other unincorporated firm, give its name and address as well as those of each individual owner. If the publication is published by a nonprofit organization, give its name and address.)

Full Name Complete Mailing Address WAYNE KRISTOFF

16626 E AVENUE OF THE FOUNTAINS, STE 201, FOUNTAIN HILLS AZ 85268

ROSEMARY KRISTOFF

16626 E AVENUE OF THE FOUNTAINS, STE 201, FOUNTAIN HILLS AZ 85268

PATRICK HOPPER

30233 JEFFERSON AVE, ST.CLAIR SHORES, MI 48082-1787

d. Free or (1) Free or Nominal Rate Outside-County Copies included on PS Form 3541 Nominal Rate Distribution (2) Free or Nominal Rate In-County Copies Included on PS Form 3541 (By Mail and Free or Nominal Rate Copies Mailed at Other Classes Through the USPS Outside (3) (e.g., First-Class Mail) the Mail) (4)

Free or Nominal Rate Distribution Outside the Mail (Carriers or other means)

e. Total Free or Nominal Rate Distribution (Sum of 15d (1), (2), (3) and (4))

f. Total Distribution (Sum of 15c and 15e)

g. Copies not Distributed (See Instructions to Publishers #4 (page #3))

h. Total (Sum of 15f and g) i. Percent Paid (15c divided by 15f times 100)

Digital meets RF »» p. 22

By Jerry Gipper, Editorial Director

11. Known Bondholders, Mortgagees, and Other Security Holders Owning or Holding 1 Percent or More of Total Amount of Bonds, Mortgages, or None Other Securities. If none, check box Full Name

Statement of Ownership, Management, and Circulation (All Periodicals Publications Except Requester Publications)

14. Issue Date for Circulation Data Below

VITA TECHNOLOGIES 15. Extent and Nature of Circulation

Contact Person ROSEMARY KRISTOFF Telephone (Include area code)

8. Complete Mailing Address of Headquarters or General Business Office of Publisher (Not printer)

13. Publication Title

6. Annual Subscription Price

SEPTEMBER 2014

16. Electronic Copy Circulation

Average No. Copies Each Issue During Preceding 12 Months

Average No. Copies No. Copies of Single Each Issue During Issue Published Preceding 12 Months Nearest to Filing Date a. Paid Electronic Copies

7785

9115

7209

8607

0

0

0

b. Total Paid Print Copies (Line 15c) + Paid Electronic Copies (Line 16a) c. Total Print Distribution (Line 15f) + Paid Electronic Copies (Line 16a)

90

90

0

0 7299

8697

0

0

0

0

0

0

0

0

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7299

8697

8697

7299

d. Percent Paid (Both Print & Electronic Copies) (16b divided by 16c Í 100)

No. Copies of Single Issue Published Nearest to Filing Date 0

7299

8697

100%

100%

I certify that 50% of all my distributed copies (electronic and print) are paid above a nominal price.

17. Publication of Statement of Ownership If the publication is a general publication, publication of this statement is required. Will be printed

Publication not required.

WINTER in the ________________________ issue of this publication.

18. Signature and Title of Editor, Publisher, Business Manager, or Owner

- PRESIDENT

Date

10/1/2014

I certify that all information furnished on this form is true and complete. I understand that anyone who furnishes false or misleading information on this form or who omits material or information requested on the form may be subject to criminal sanctions (including fines and imprisonment) and/or civil sanctions (including civil penalties).

418

486 7785

9115

100%

100%

* If you are claiming electronic copies, go to line 16 on page 3. If you are not claiming electronic copies, skip to line 17 on page 3.

Complete Mailing Address

12. Tax Status (For completion by nonprofit organizations authorized to mail at nonprofit rates) (Check one) The purpose, function, and nonprofit status of this organization and the exempt status for federal income tax purposes: Has Not Changed During Preceding 12 Months Has Changed During Preceding 12 Months (Publisher must submit explanation of change with this statement) PS Form 3526, July 2014 [Page 1 of 4 (see instructions page 4)] PSN: 7530-01-000-9931

PRIVACY NOTICE: See our privacy policy on www.usps.com.

PS Form 3526, July 2014 (Page 2 of 4)

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PRIVACY NOTICE: See our privacy policy on www.usps.com.

All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2014 OpenSystems Media © 2014 VITA Technologies enviroink.indd 1

4 | VITA Technologies Winter 2014 Buyer's Guide

10/1/08 10:44:38 AM

www.vita-technologies.com

Advertiser Index 11 Acromag – The complete package.

VITA Technologies Editorial/Production Staff Jerry Gipper, Editorial Director jerry.gipper@opensystemsmedia.com Amanda Harvey, Assistant Editor aharvey@opensystemsmedia.com

Steph Sweet, Creative Director ssweet@opensystemsmedia.com John McHale, Group Editorial Director jmchale@opensystemsmedia.com

Sales Group Tom Varcie, Sales Manager tvarcie@opensystemsmedia.com (586) 415-6500 Shannon E. Alo-Mendosa Strategic Account Manager shannona@opensystemsmedia.com (978) 501-9116 Rebecca Barker, Strategic Account Manager rbarker@opensystemsmedia.com (281) 724-8021 Eric Henry, Strategic Account Manager ehenry@opensystemsmedia.com (541) 760-5361 Kathleen Wackowski, Strategic Account Manager kwackowski@opensystemsmedia.com (978) 888-7367 Asia-Pacific Sales Elvi Lee, Account Manager elvi@aceforum.com.tw

Regional Sales Managers Barbara Quinlan, Southwest bquinlan@opensystemsmedia.com (480) 236-8818 Denis Seger, Southern California dseger@opensystemsmedia.com (760) 518-5222 Sydele Starr, Northern California sstarr@opensystemsmedia.com (775) 299-4148 Europe Sales James Rhoades-Brown james.rhoadesbrown@husonmedia.com

Reprints and PDFs republish@opensystemsmedia.com

24

Alphi Technology Corporation – Mission-critical I/O solutions

3

Annapolis Micro Systems, Inc. – WILDSTAR OpenVPX ecosystem

10

Creative Electronic Systems – Big to small we got you covered

17

Elma Electronic – Reliable. Rugged.

Has to work. Elma’s VPX platforms are all that - and more.

15

Excalibur Systems, Inc. – 1553couplers.com

35

GE Intelligent Platforms, Inc. – GE’s COTS rugged systems are ready whenever the deployment clock is ticking.

16

Highland Technology, Inc. – Long term commitment to VME

23

Innovative Integration – Digital Receiver K701

13

Interface Concept – SBCs – Intel and Freescale processors

19

LCR Embedded Systems – Rugged systems engineered for your application

7

North Atlantic Industries – Rugged systems from NAI

9

North Atlantic Industries – 3U cPCI systems

2

Orbit Power Group and Orbit Electronics Group – New higher 3U power. New higher 6U health monitoring performance.

36

Pentek, Inc. – Got tough software radio design challenges?

Unleash the new Virtex-7 Onyx boards!

21

SIE Computing Solutions, Inc. – Rugged & ready when you are

25

Vector Electronics & Technology, Inc. – VME/VXS/cPCI chassis, backplanes & accessories

20

VEROTEC Electronics Packaging – Verotec integrated packaging TecSYS development platforms

OpenSystems Media Editorial/Creative Staff John McHale, Group Editorial Director Military Embedded Systems PC/104 and Small Form Factors PICMG Systems & Technology VITA Technologies Rich Nass, Embedded Computing Brand Director Embedded Computing Design rnass@opensystemsmedia.com Joe Pavlat, Editorial Director PICMG Systems & Technology jpavlat@opensystemsmedia.com Curt Schwaderer, Editorial Director Embedded Computing Design cschwaderer@opensystemsmedia.com Monique DeVoe, Managing Editor Embedded Computing Design, DSP-FPGA.com mdevoe@opensystemsmedia.com Joy Gilmore, Assistant Webcast Manager jgilmore@opensystemsmedia.com

Brandon Lewis, Assistant Managing Editor Embedded Computing Design Industrial Embedded Systems PICMG Systems & Technology blewis@opensystemsmedia.com Lisa Daigle, Assistant Managing Editor Military Embedded Systems PC/104 and Small Form Factors ldaigle@opensystemsmedia.com Sally Cole, Senior Editor Military Embedded Systems scole@opensystemsmedia.com Rory Dear, Technical Contributor Embedded Computing Design rdear@opensystemsmedia.com Konrad Witte, Senior Web Developer Dave Diomede, Creative Services Director Joann Toth, Senior Designer

Corporate opensystemsmedia.com Patrick Hopper, Publisher phopper@opensystemsmedia.com Rosemary Kristoff, President rkristoff@opensystemsmedia.com John McHale, Executive Vice President jmchale@opensystemsmedia.com Rich Nass, Executive Vice President jmchale@opensystemsmedia.com Wayne Kristoff, CTO

Emily Verhoeks, Financial Assistant Headquarters – ARIZONA: 16626 E. Avenue of the Fountains, Ste. 201 Fountain Hills, AZ 85268 Tel: (480) 967-5581 MICHIGAN: 30233 Jefferson St. Clair Shores, MI 48082 Tel: (586) 415-6500

Subscriptions opensystemsmedia.com/subscriptions ISSN: Print 1941-3807, ISSN Online 1550-0403 VITA Technologies is published four times a year (Spring, Summer, Fall and Winter) by OpenSystems Media, 16626 E. Ave of the Fountains, Ste 201, Fountain Hills, AZ 85268. VITA Technologies is free to qualified engineers or management dealing with or considering open-system technologies.

For others, paid subscription rates inside the US and Canada are $45/year. For first-class delivery outside the US and Canada, subscriptions are $60/year (advance payment in US funds required). Periodicals postage paid at Scottsdale, AZ, and at additional mailing offices.

Canada: Publication agreement number 40048627. Return address WDS, Station A, PO Box 54, Windsor, ON N9A 615 POSTMASTER: Send address changes to VITA Technologies, 16626 E. Avenue of the Fountains, Ste. 201, Fountain Hills, AZ 85268.

www.vita-technologies.com

EVENTS Embedded Tech Trends January 19-20, 2015 Phoenix, Arizona www.embeddedtechtrends.com

AFCEA West February 11-13, 2015 San Diego, California www.westconfexpo.org

VITA Technologies Winter 2014 Buyer's Guide |

5

Editor’s Foreword

By Jerry Gipper, Editorial Director @VitaTechnology

jgipper@opensystemsmedia.com

2014 recap We are rapidly approaching that time of year when we reflect on what has transpired the past 12 months and what we can look forward to in the next 12 months. My feature “Business Barometer” on page 12 goes into more details on my predictions for technology and business processes.

2014 was a big change in pace for me as I officially took on the role as Executive Director for VITA. I had been in training under the wing of Ray Alderman who held that position for – shall we say – “a long time.” Ray has been keeping a close eye on his baby, VITA, as it took off under new leadership. To make my new role even more interesting, longtime technical director John Rynearson, the “brains” of VITA, decided to retire in May. Shortly thereafter, the “heart” of VITA, Lollie Wheeler, turned over her role as well. I estimate that over 75 years of experience decided to pass on the reins; talk about pressure!

I was not sure how to replace that much knowledge and talent so I took the opportunity to step back and see what I could do to streamline the organization. We launched an online store for purchasing specifications before John retired. I brought in Jing Kwok, a longtime VITA activist, as the technical director. With John’s help, Jing and I launched a new web-based tool, VITA Workspace, to facilitate the process of standards development and collaboration. An updated VITA website with built-in membership and event management capabilities went live in June. We have since been fine-tuning everything, making adjustments where necessary.

The support of the VITA membership has been superb, despite some of the disruptions of the new tools. Once up to speed, everyone has appreciated the improved communications and processes.

Looking forward to 2015 we need to make improvements in our product directory, become more aggressive in our marketing tactics, and continue the fine tradition of the development of standards essential to the critical embedded systems industry.

It is here that I see all kinds of opportunities. We still have much work to do with VPX – as the technology has matured there are opportunities for added capabilities and enhancements. Small form factors continue to emerge as systems naturally get smaller. The FMC community has started work on the next generation of FPGA mezzanine cards to handle higher bandwidth. Optical interconnect technology moves forward as the need for bandwidth grows.

Now it is more important than ever to become involved with setting the next generation of standards for critical embedded systems technologies. If you want to make a lasting impact on the technology key to the critical embedded computing industry then get involved with a technology standards working group. You will be surprised at how rewarding the work can be.

Embedded Tech Trends 2015 is scheduled for January 19 and 20 in Phoenix. The sponsors are busy constructing an informative set of topics (www.embeddedtechtrends.com). This is sure to be a very informative forum for the critical embedded computing industry.

In 2014 we launched the VITA Technologies Hall of Fame. It is time to submit nominations for the class of 2015.

We have developed a simple nomination and selection process that is loosely based on the NFL Hall of Fame process. Any “fan” may nominate any qualified individual, team of individuals, company, product, or technology to the VITA Technologies Hall of Fame via the nomination form on the Hall of Fame website (http://opensystemsmedia.com/ hall-of-fame/vita-technologies). The only restriction is that the nominee must have had a significant impact on the critical and intelligent embedded computing industry.

Our 2015 editorial calendar for VITA Technologies has been published. Take a look at the key topics we plan to cover in 2015 (http://opensystemsmedia.com/media-kits).

Topics on the calendar so far include: ARMed and Ready about the impact of ARM processors, Software Defined Radios, SpaceVPX, Copper vs. Optical, FMC Steps Up, VPX interoperability, and Trends in SBC Functional Density, and much more.

For VITA Technologies, we will sift through the technology, finding information that we feel is important as you continue to build new products that are based on VITA technologies. If you have specific topics you would like to read about, please contact me to discuss.

I look forward to a great 2015.

Jerry Gipper, jgipper@opensystemsmedia.com

6 | VITA Technologies Winter 2014 Buyer's Guide

www.vita-technologies.com

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VITA Standards Update

By Jerry Gipper jgipper@opensystemsmedia.com

VITA Standards Organization activity updates The November VITA Standards Organization (VSO) meeting was hosted by Xilinx at their Longmont, CO facility. Over 30 people were in attendance to participate in status updates and several working group discussions.

This update is based on the results of this meeting.

Visit the VITA website (www.vita.com) for details on upcoming VSO meetings.

ANSI/VITA 48.7-2014, VPX REDI: Mechanical Specification Using Air Flow-By Cooling Applied to VPX Objective: Defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VPX (VITA 46) and VPX REDI (VITA 48).

Status: Ratified by ANSI and VITA.

ANSI accreditation Accredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, the VSO provides its members with the ability to develop and to promote open technology standards. The VSO meets every two months to address embedded bus and board industry standards issues.

Work in progress Several working groups have current project work underway; the following roundup summarizes those projects.

VITA 46.11: System Management on VPX Objective: This standard defines a system management architecture for VPX systems.

VSO study and working group activities Standards within the VSO may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members.

Status: Currently in “VITA Draft Standard for Trial Use” status.

Input from the first round of interoperability testing is being incorporated into the specification with plans to move to ANSI ballot in 2015.

ANSI/VITA 49.0: VITA Radio Transport (VRT) Several specifications reached ANSI/VITA accreditation recently:

ANSI/VITA 42.0-2008 (R2014), XMC: Switched Mezzanine Card Base Specification Objective: This specification defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed mezzanine card form factor.

Status: Re-ratified by ANSI and VITA.

Objective: The VITA Radio Transport (VRT) standard defines a transport-layer protocol designed to promote interoperability between RF (radio frequency) receivers and signal processing equipment in a wide range of applications. The VRT protocol provides a variety of formatting options that allow the transport layer to be optimized for each application. The ANSI/VITA 49.1 VITA Radio Link Layer (VRL) standard specifies an optional encapsulation protocol for VITA-49.0 (VRT) packets.

Status: The working group has reopened this specification for requested updates.

ANSI/VITA 42.3-2014, XMC: PCI Express Protocol Layer Objective: The objective of this standard is to define an open standard for supporting PCI Express switched interconnect ­protocol on the XMC form factor.

VITA 57.4: FMC Objective: The goal of this project is to develop a next generation specification calling for a new set of connectors to support higher speed serial interfaces.

Status: Ratified by ANSI and VITA.

ANSI/VITA 61.0-2011 (R2014), XMC 2.0 Objective: This specification, based highly upon VITA 42.0 XMC, defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor, but utilizing an alternate, ruggedized, high speed mezzanine interconnect.

Status: Ratified by ANSI and VITA.

8 | VITA Technologies Winter 2014 Buyer's Guide

Status: The working group has reviewed connector options and is working on a draft specification.

VITA 62: Power Supplies for VPX Objective: Defines the power generation requirements for a module that can be used to power systems that support a VITA 62 slot on the VPX backplane.

Status: The working group is nearing VSO balloting. www.vita-technologies.com

ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX ­architectural framework specification is a living document that is continuously being updated with new profile information and corrections.

Status: The working group is currently receiving input on new profiles for the next edition.

VITA 66: Optical Interconnect On VPX – Half Width MT Objective: The VITA 66 base standard defines physical features of a stand-alone compliant blind mate Optical Interconnect for use in VPX systems. This standard defines a Half Width MT style contact variant.

Status: The working group has completed VSO balloting.

VITA 67.3: VPX: Coaxial Interconnect, 6U, Four Position SMPM Configuration

COSATM Enabled

Objective: This specification details the configuration and interconnect within the structure of VITA 67.0, enabling a 6U VPX interface containing multi-position blind mate analog connectors with up to four SMPM contacts.

Up to 3 I/O or Comms Functions

1 x 3U cPCI Slots SWaP-Optimized

Status: The working group has begun work on the draft specification.

VITA 78-NGSIS: SpaceVPX Systems Objective: This document describes an open standard for creating high-performance, fault tolerant, interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems will support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.

Status: Completed final VSO balloting and is preparing to go to public ANSI ballot at the start of 2015.

VITA 80: Interoperability Objective: This working group is chartered with developing interoperability testing for products within the OpenVPX community. The working group has defined a set of tests and released test software for comments.

Status: The working group completed the first round of interoperability testing in September. The results are being used to improve the test suite for the next round of interoperability tests.

VITA 83: Advanced Rugged Power Supply Standard Objective: The project will provide guidelines to building a high power, high input voltage power supply module that can be used to power VPX chassis, as well as other Eurocard-sized platforms, and as a standalone network-compatible unit. This draft will also provide guidelines for battery blades, super capacitor/hold up modules, and power conditioning/booster modules.

Participating in these working groups is a great way to influence the direction of the next generations of technology important to the critical embedded computing industry. Contact VITA if you are interested in participating in any of these working groups, and for details on upcoming VSO meetings.

Configure to Customize The SIU31 rugged system is the ideal solution for Mil-Aero applications requiring high density I/O, communications, Ethernet switching and processing. With 40+ off-the-shelf functions to choose from, quickly and easily configure the SIU31 to meet your specific requirements for faster deployment in air, land and sea applications.

Stand-alone operation via Ethernet communications or Choice of processor: - Freescale™ QorIQ P2041, - Dual Core Intel® i7, - Quad Core Intel® ATOM™, - Dual Core ARM Cortex™-A9 MIL-STD-461F, MIL-STD-1275 & 704A

Accelerate Your Time-to-Mission

Copies of all specifications reaching ANSI recognition are available from the VITA website. For a more complete list of VITA specs and their status, go to www.vita.com/Specifications A certified small business

www.vita.com www.vita-technologies.com

VITA Technologies Winter 2014 Buyer's Guide | NA1066 VITA_Tech.indd 1

9

10/20/14 11:32 AM

VITA News

By Alan Simmonds alan.simmonds@themis.com

Building an ecosystem for VNX The recent announcement of the VITA-VNX Marketing Alliance formation to foster open system architectures in critical and intelligent embedded systems is another positive step forward for the VITA 74 NanoX small form factor (SFF) standard, and marks a good time to remember the story behind the VITA 74 NanoX standard and the current progress that is being made.

In early 2010, the VITA 74 working group was chartered by the VITA Standards Organization (VSO) and sponsored by Elma Bustronics (now Elma Electronics), CES (Creative Electronic Systems), Molex, Samtec, and Themis Computer.

The requirement from the user community was for a standards-based approach for small conduction-cooled systems and size, weight, and power (SWaP)important applications. These applications included aerospace, unmanned vehicles, robotics, man-wearable systems, and energy exploration. Many of these programs require electronic subsystems that are both rugged and mobile or portable, something that is impossible with traditional 3U and 6U racks of backplane-based systems.

While computer-on-module (COM) standards like those for the Nano ETX Express miniature processor modules and the VITA standards for VPX, OpenVPX, XMC, and FMC inspired the direction of VITA 74, the need for a similar price point to PC/104 was perhaps the most important inspiration. The initial goals of the standard included boards that were the size of a credit card, stand-alone computers that were the size of a deck of playing cards, and systems that were the size of a Rubik’s Cube. VITA 74 systems were intended to offer tremendous weight and power savings at a fraction of the cost of larger legacy 3U and 6U systems whilst achieving comparable performance.

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10 | VITA Technologies Winter 2014 Buyer's Guide

www.vita-technologies.com

VITA 74’s modular architecture goes further to target thermally challenged conduction cooled SFF system requirements. COM SFF board standards have typically focused on the board’s electrical standards and the maximum physical dimensions and left it to the integrator to implement a workable thermal interface design, which often requires custom chip level thermal interfaces. In contrast, VITA 74 provides all interfaces defined and fixed at the module level (electrical, mechanical, and thermal), making thermal and mechanical interfacing simple and uniform.

and an indication that this steady momentum is only increasing and that many, small good things are to come.

Learn more about VNX by visiting the ecosystem webpage at www.vita.com/vnx.

Here you can learn more about the VNX technology, products, and suppliers of this revolutionizing small form factor technology for critical and intelligent embedded computing systems.

Alan Simmonds is Director of Systems Engineering at Themis Computer. He is a co-author of the VITA 74 Standard. He has a long background in SFF, computer, and video systems design. Prior to his current position he was Engineering Director at Creative Electronic Systems.

Themis Computer • 510-252-0870 • www.themis.com

Since 2010, the VITA 74 working group has received significant contribution from several merchant board manufacturers, system integrators, and defense primes. Much of the success is because this standard draws upon the experience of existing standards, which have reduced risk and schedule, but perhaps the best measure of the VITA 74 NanoX standard is the steady year-overyear growth in committed supporters and users, as well as design wins with VITA 74 in new programs. Additionally, when you look at the fruit of this labor, you see the increase in robust, SWaPready VITA 74 and NanoX systems offerings, the evolution of a standardsbased path to SFF systems, and the multiple suppliers and customers who have embraced or adopted this emerging standard. We are still at the early stages of the development of a focused ecosystem for VITA 74 but the interest is growing each week.

Work still remains to take the specification beyond its current VITA “Draft for Trial Use” status. The working group participants are eagerly gathering feedback as they prepare to take this standard to the finish line.

Themis Computer and the other VNX Marketing Alliance members are committed to combining cost-effective, lowpower processors and circuit cards with the most efficiently possible thermal management in the smallest packaging possible. We each view our participation in the VNX Marketing Alliance and the increasing emergence of products built to the VITA 74 NanoX standard as vital www.vita-technologies.com

VITA Technologies Winter 2014 Buyer's Guide |

11

SPECIAL FEATURE

Business Barometer

By Jerry Gipper, Editorial Director One of my favorite activities each year is to take a look at trends for the upcoming year, making predictions on where technology is headed. I have taken a swing at 2015 with some commentary on what happened in 2014 to support or disprove my predictions from last year.

2015 trend predictions Military programs are stabilizing. The industry is not out of the woods yet as uncertainty continues to cloud the direction a lot of programs are going to take. What is known is that new defense programs will depend more heavily on autonomous weapon systems.

Automation and robotics, especially in unmanned vehicles of all types, has continued with unmanned aerial vehicles (UAVs) leading the charge. I may sound like a broken record on this, but upgrades have continued keeping older technology in play. The new Republicandominated Congress should have a positive impact on defense program spending. Several defense department initiatives that have an open architecture slant are zeroing in on VPX as a preferred platform architecture.

Small form factor fever. The technical work in developing VITA 73, VITA 74 (VNX), and VITA 75 form factor specifications was quiet last year as all three were in “Trial Use” status. There has still not been any sign of VITA 75 products, as the original supporters appear to have put this on the back burner.

Supporters of the VITA 74 NanoX form factor recently announced the formation of the VNX Marketing Alliance with the goal of establishing an ecosystem to bring suppliers together to develop and advance NanoX. VITA 73 is limited to one supplier in PCI Systems, no word yet on plans to develop a supporting ecosystem. Rugged COM Express is still in working group, having missed its goal of getting to “Trial Use” in early 2014. The interest in small form factors remains high and will only continue to increase.

Optical interconnect products to emerge. More work was completed on the VITA 66 family of specifications, addressing the need to connect systems to optical networks and devices. As for backplanes with optical interconnection capability, the majority of specification work is still just talk but there is more of it. There is some speculation that maybe the industry needs to step back and rethink what is really needed at the backplane level. The move to place more intelligence at end-points such as sensors may lead to new ideas at the chassis. With global warming, maybe this glacier moves a bit faster.

12 | VITA Technologies Winter 2014 Buyer's Guide

The industry acknowledges the need but is still unable to make the required investments.

Proposals for smaller mezzanines for blade boards to appear in a working group. Last year I declared this trend dead, but then the FMC community reactivated work in developing the next generation of FMC modules. Two camps are emerging – with one wanting to keep as much form factor backward compatibility as possible, while a second camp would like to propose a new form factor.

I could see a scenario where both goals are obtained as this popular form factor continues to pick up market share. 1 ARM shows up as the primary processor in single board computers. ARM made a strong showing in 2014. At the start of the year, only a small handful of suppliers with an ARM-based single board computer were listed in the VITA product directory. Today there are at least a dozen suppliers with products in multiple form factors, mostly the small form factors sizes. What I did miss was that the QorIQ family is ARM-based, thus adding to the list of ARM suppliers. www.vita-technologies.com

Add to this the NVIDIA Tegra-K1 APU with 5 ARM cores and the list of processors based on ARM and used in VITA technologies grows quickly. I will have much more on this topic in the next issue of VITA Technologies.

QorIQ with AltiVec makes a return. This looked like it was going somewhere at the end of 2013 but as 2014 settled in, it became quiet. A lot of people were holding out hope for the return of AltiVec but now I am not so sure.

Suppliers start to use the guidance of VITA 51 to define the reliability levels of their products. The VITA 51 specification continues to be a top download from the VITA Online Store, third behind FMC and VPX specifications. More quality managers reach out to the Reliability Community to discover better methods for reliability prediction. This is another slow but steady growth area where the impact is very difficult to measure. 2

2014 additions I have nothing new to report on my additions made for 2014 but I do not want to lose sight of them. The trends are still valid but in the slow-moving world of critical embedded systems, there were no notable changes to mention. Here they are reiterated: 1. VPX High-Performance Embedded Computing (HPEC) platforms bring power to mobile applications.

2. Active cables improve the SWaP equation for critical embedded systems.

3. Solid State Disks (SSDs) overtake Hard Disk Drives (HDDs) as the primary storage for critical systems.

What is ahead for the next year?

New trends are developing or, in some cases, re-emerging. Let’s take a quick look at what is showing up on the radar screen.

Digital meets RF. Mercury Systems’ recent announcement of OpenRFM accents the trends to bring digital and RF into a homogenous system. Smartphone technology really put this over the top but now it is trickling into critical embedded systems. The initiative to develop an open architecture solution will speed www.vita-technologies.com

acceptance into new platforms. It may also open the door to some interesting developments in the coming years.

Tick or tock? 2014 was a quiet year for major processor announcements, but Intel has been slipping out details for their 2015 Embedded Processors roadmap with signs that 2015 could be busy. From what I can glean from roadmap speculation, late 2015 should be full of board-level product announcements using these new parts.

The business side The economy is on the upward trend but in a slow and conservative manner.

Confidence is strong but no one is willing to make a lot of bold moves just yet. At the end of the day, I am not sure that the sequester had any significant impact. All of the major primes had 2014 stock performance that outpaced the S&P 500. The tuning they made to their organizations had a positive impact to the shareholders but will we see increased demand for critical embedded computing platforms trickle down to the suppliers?

Economic events in China and Russia are causing many to rethink their global strategies. More and more companies that moved most or all of their manufacturing to China are regretting that strategy. China’s growth and rising costs have changed the math used to justify moves over a decade ago.

Russia was a popular source for software engineering. Sanctions have made using these resources challenging at best, leaving software teams scrambling to shift development centers. India has filled many of these gaps but over time we will likely see India’s growth cause yet another global strategy shift.

Summary Barring any unforeseen influences, 2015 should be a good year for the industry.

As always, I suggest that innovation is key to survival.

References 1. www.vita.com/FMC; https://www.linkedin. com/groups/FMC-FPGA-Mezzanine-Card2450735?mostPopular=&gid=2450735 2. www.vita.com/reliability; https://www. linkedin.com/groups?home=&gid=4701272

VITA Technologies Winter 2014 Buyer's Guide |

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TECHNOLOGY FEATURE

Bringing LTE to OpenVPX

By Paul Moakes

Reliable communications are critical in defense applications, and the ability to set up ad hoc networks where existing communications are absent or damaged is key to future combat systems. When assessing the next generation of technology with which to upgrade existing military communications infrastructure, it’s difficult to ignore standards-based solutions such as Long-Term Evolution (LTE) systems.

These standards are developing at such a pace that their data transfer performance is already an order of magnitude greater than that of technologies developed purely for tactical communications, such as the Joint Tactical Radio System (JTRS)1. Since LTE uses Internet Protocol (IP) for data transmission, radio security can be achieved from packet encryption technologies rather than developing a secure radio network, such as the Wideband Networking Waveform (WNW) used by the JTRS2.

And the widespread deployment of civilian LTE networks means a proliferation of field-hardened LTE solutions.

With that background, the appetite for developing a proprietary military radio network has gone and JTRS was terminated.

OpenVPX for COTS LTE is a mature technology, and a large selection of commercial off-the-shelf

(COTS) solutions already exists for base stations, user equipment (UE), and wireless test. It makes sense, then, that a move to LTE-based networks is also accompanied by a move to COTS-based solutions.

The ruggedized requirements for military systems require open standards COTS architecture that is up to the task.

OpenVPX (VITA 65.0) is a widely adopted VPX-based standard which builds on the great success VME systems have had in this arena. The VPX-REDI specifications of VITA 48.0, with conduction-cooled and air-cooled versions, provide the assurance of mechanical ruggedization in COTS-based military systems.

These specifications also deliver on size, weight, and power (SWaP) limits3.

Being an open standard, component cards are available from an ecosystem of suppliers. This helps multi-sourcing, and means that a range of chassis

14 | VITA Technologies Winter 2014 Buyer's Guide

architectures is available to suit different deployed scales and architectures. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card architectures.

Ruggedizing COTS solutions One of the major challenges in supporting the VPX-REDI specification is the move from field-proved non-rugged systems to the OpenVPX conductioncooled architecture. This is one of the challenges we are addressing today.

For example, the CommAgility AMC-D24A4-RF4 is a double-width AdvancedMC (AMC) card comprising a wireless baseband processing carrier card and RF mezzanines. Aimed at the LTE and LTE-Advanced wireless test market, but also finding use in small captive base stations, this architecture is a www.vita-technologies.com

Our task was to adapt this card for rugged VPX deployment. By looking at the design issues faced, and the choices made, we can explore the challenges faced by any COTS manufacturer in bringing LTE to VPX, and the factors that a customer should consider when reviewing vendors’ products.

The next task was the conduction cooling clamshell design that could achieve the required -40 °C to +85 °C operational range. Fortunately, the maturity of the VPX standards means that component parts, such as the card guides, of a conduction-cooled solution were readily available off the shelf. A custom heatsink could then be created based on thermal profiling of the card and incorporating the card guides.

Mechanical challenges

Backplane mapping

The first challenge addressed has been the creation of a VPX-REDI baseband processing card. The VPX height profile limits the use of mezzanine-based solutions where power dissipation is high, and in this case led to the architecture being laid out on a single baseboard.

This was achieved by making use of an increased Side 2 height profile in comparison to AMCs, thus allowing memory devices to be placed on Side 2. The VPX specification also supports the use of PCBs with more layers, which makes device fan-out easier and supports a higher density of components on Side 1.

Backplane mapping within the OpenVPX chassis is also important. Although governed by a set of pre-determined slot profiles within the specification, a wide variety of backplane architectures have been implemented. A base backplane configuration was identified, with the 2F2U configuration of a pair of ultra-thin control pipes and two fat pipes for fabric connection.

great fit for rapidly deployable military communications.

www.vita-technologies.com

The VPX-D16A4 supports build options for both RapidIO fabric connectivity and PCIe connectivity (see Figure 1).

This is required to address the two main

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Figure 1 | The CommAgility VPX-D16A4.

architectures supported by the card.

RapidIO is required for its low latency in wireless applications where digital radio data is being transported on the backplane. However, PCIe is important where the digital radio data is being generated by the baseband card from Layer 3 data provided by a general-purpose processor card in the system, typically using an Intel device where RapidIO is not natively supported.

The user-defined areas of the P1 connector were then allocated for high-speed point-to-point wireless communication

VITA Technologies Winter 2014 Buyer's Guide |

15

TECHNOLOGY FEATURE Towards an RF front end

with an RF card in the same chassis, or potentially a custom rear transition module (RTM). The DSPs support CPRI direct connection to these ports from its antenna interface (AIF).

The next challenge we are addressing is the integration of an RF front end into the same ruggedized VPX chassis.

Let’s examine some of the issues around such an integration, and some possible solutions.

The FPGA supports P1 user-defined connections to its high-speed transceivers.

These transceivers are also capable of implementing a CPRI interface, but can additionally support the JESD204B protocol now widely being deployed as an interface for data converters. As well as supporting JESD204B, the P2 connector has been defined to support RF processing cards supporting a LVDS data interface. Usually this is implemented as a synchronous DDR interface, with the clocks provided with the data bus.

Digital backplane connectivity To add an RF front end to the solution requires support for the necessary digital wireless bandwidth to the baseband card, determined by a combination of antenna diversity and data bandwidth. Higher bandwidths may dictate a JESD204B interface on the wireless transceiver rather than LVDS. Since the RF card is designed to act in tandem with the baseband card the backplane connectivity should be complementary.

Support for a 10 Gigabit Ethernet (GbE) interface direct from the ARM-enabled DSP is provided by a native XFI interface. Where the baseband card is processing Layer 3 wireless data, 10 GbE is an important data path for wireless backhaul.

Backplane architectures could support JESD204B or LVDS natively between the wireless transceivers and the baseband card. More generally, however, a local FPGA is used for flexible connectivity, allowing additional low latency

interconnects such as RapidIO to be used. The VPX-D16A4, for example, supports two 20 Gbps RapidIO fat pipes, which can also be used to connect to an RF card.

The RF card must also support control of the RF transceivers, including channel switching for time-division duplex solutions, and handling the digital up and digital down conversion (DUC/DDC) required to support multiple sub-channels in the RF channel. This role usually falls to an FPGA device acting as a control processor, which then also needs to be connected to the VPX control plane for card management.

RF backplane connectivity Having defined an approach to support digital radio data transport across the backplane, a method is required to transport the analog RF data from the card to an external chassis interface.

Air-cooled solutions can use a traditional front panel RF connector on a VPX card,

Long Term Commitment To VME

CRATE CONTROLLERS

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Isolated digital input

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Cabled PCI express

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Resistance measurement

•

Ethernet / USB

OUTPUT AND SIMULATION

DATA ACQUISITION

•

Analog and digital / Relay I/O

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Precision analog

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Arbitrary waveforms

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Synchro/ Resolver / LVDT

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Rotating machine simulation

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Tachometer / Overspeed

•

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Thermocouple / RTD / Cryo

Synchro / Resolver / LVDT simulation

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Wide range source-measurement

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Thermocouple Simulation

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Voltage and 4-20 mA I/O

www.HighlandTechnology.com 16 | VITA Technologies Winter 2014 Buyer's Guide

www.vita-technologies.com

References 1: http://embedded.communities.intel.com/servlet/JiveServlet/previewBody/7764-102-3-3098/ LTE_C2_Radisys_WP.pdf 2: http://arstechnica.com/information-technology/2012/06/how-to-blow-6-billion-on-a-tech-project/ 3: http://mil-embedded.com/articles/the-supports-vpx-based-systems/

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Paul Moakes, PhD, CEng, MIET, is technical director at CommAgility. He has previously held positions at Motorola and Blue Wave Systems. He is co-inventor of two patents in the field of MicroTCA and AdvancedMC. He holds a PhD in Electrical and Electronic Engineering from Sheffield University and a 1st Class Honours degree in Electronic Communications and Computer Systems Engineering from Bradford University.

Figure 2 | Pictured is the VITA 67.2 Connector. Image taken from VITA 67.0 specification.

with a cabled solution from the chassis to the enclosure panel. Mounting the chassis with the front panel towards the rear of the enclosure allows the cabling to be kept neatly out of the way. However, this is not conducive to servicing the cards, which requires a re-cabling of the enclosure and can’t be supported by conduction-cooled solutions.

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CommAgility +44 (0)1509-228866 • www.commagility.com

This is one of the reasons VITA 67.0 “Coaxial Interconnect for VPX” has been developed. By supporting backplane co-axial connectivity, front cards can be quickly swapped in and out of the chassis and there is no reliance on front panel I/O in a conduction-cooled environment. Using semi-rigid cabling from the analog RF section of the card to the VITA 67.0 connectors minimizes the RF loss and noise on the card (see Figure 2).

Conclusions As military comms and secure radio applications continue to adopt commercial radio standards for the air interface, there exists an opportunity for COTS-based platforms developed for the commercial world to migrate to more ruggedized platforms. This is not without its challenges. Conduction cooling and SWaP consideration place additional constraints on equipment originally designed for the central office environment.

However, OpenVPX is an ideal framework on which to achieve this. It has a mature base standard with an ecosystem of off-the-shelf building blocks, yet is flexible enough to introduce innovations such as backplane co-axial interconnect to address real-world problems. This combination of field-proven technology and foresight make OpenVPX a standard with a future. www.vita-technologies.com

Reliable. Rugged.

Has to Work.

Elma’s VPX Platforms Are All That - And More.

OpenVPX is a highly complex architecture that is well tuned for critical computing systems. No one knows VPX better than Elma – our signal integrity work, packaging, thermal and I/O interface expertise, plus years of expert embedded subsystem designs gives our customers a serious advantage. We are an extension of your team -- we fill in where you need us most, and we’re there every step of the way.

VITA Technologies Winter 2014 Buyer's Guide |

17

TECHNOLOGY FEATURE

Cost benefits of FPGA and FMC for embedded systems development

By Jason Cella The FPGA Mezzanine Card (FMC), as defined by industry standard VITA 57.1, can be used to greatly improve project risk management and bring products to market faster due to its flexibility and performance. FMCs are very effective for system upgrades and technology insertion, and using them makes it easier to incorporate new technologies such as higher resolution A/Ds and D/As as they become available.

FMCs also offer the flexibility to reuse carrier cards, firmware, and software on new projects. They also enable a standardized engineering knowledge base, which can decrease spin-up time on new projects and programs. Their compact size of 69 mm x 76.5 mm adapts well to a variety of configurations and compliments other common mezzanine formats such as PMC, XMC, and AMC. The format is an excellent choice for such applications as intelligence gathering systems, RADAR/SONAR, realtime video processing, and wireless telecommunications.

Technical benefits The FMC form factor emerged to address the need for different front panel I/O configurations for systems development. FPGA carrier cards in 3U and 6U form factors rely on fixed front panel connectivity designed for particular functions, so it can be necessary to replace the card to change the front panel I/O. While PMC and XMC modules can be used to reconfigure the front panel I/O, their size uses a large portion of the FPGA card area.

The combination of FPGA carrier cards with FMC daughter cards is the perfect choice for optimal performance and flexibility because these smaller modules address the bandwidth, latency, and connectivity limitations of PMC and XMC formats.

FMCs are half the size of XMCs and typically produce less than 12Â W of heat.

18 | VITA Technologies Winter 2014 Buyer's Guide

FMCs provide a standard form factor and modular interface on an FPGA carrier card. A simplified I/O interface design is made possible by decoupling the I/O interfaces from the FPGA, which maximizes the reuse potential of carrier cards. FMC offers the best I/O approach outside of a monolithic solution. They can serve in a number of roles such as analog-to-digital conversion, digital-to-analog conversion radio frequency transceiver, optical communication, clock distribution, and DSP. The FMC format offers additional advantages over other configurations in the areas of data throughput, latency, and system overhead. The format supports 80 LVDS pairs and 10 highspeed transceiver lanes, thus offering an aggregate bandwidth of 300 Gigabits per second (Gbps) between the mezzanine and carrier cards. By removing protocol overhead, it is also possible to eliminate latency and enable deterministic data delivery with the FMC form factor.

Reducing costs and risk The simplicity of the FMC standard reduces risk in system development by minimizing power requirements, lowering IP core costs, reducing material costs, and shortening engineering times partly because expertise in protocol standards such as PCI, PCIe, or Serial RapidIO is not required. FMCs enable www.vita-technologies.com

cost-effective project budget management because it is possible to repurpose existing designs for new I/O requirements simply by changing the FMC module and tweaking the FPGA design.

An FPGA development kit combined with an FMC t­ranslates into project savings when factored into a typical solution budget. The ability to reuse the FMC as-is in the final product reduces risk significantly while cutting down development costs and giving firmware and software engineers access to a functional platform early in the project cycle. For example, a complementary DAQ platform can be centered on a Xilinx Kintex Ultrascale FPGA KCU105 evaluation kit installed in a PCIe slot of a desktop PC or connected to a laptop via Ethernet (see Figure 1). The functionality of the card can be extended by adding daughter boards such as the 4DSP FMC116 analogto-digital converter module with 16 channels able to digitize signals at a rate of 125 Msps each. The use of such a platform during the early stages of system integration lowers engineering overhead by reducing the time spent on software and firmware integration and testing. It also allows the process to begin weeks or months earlier in the schedule by using readily available hardware.

Trends in the embedded industry The FMC format continues to gain momentum. As ­compatibility increases, it becomes easier to integrate FMCs with carrier

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Figure 1 | The Xilinx KCU105 evaluation kit provides PCIe slot host for FMCs.

cards from different vendors under VITA 57.2. As of 2014, the VITA product directory lists 16 vendors providing a wide variety of FMC modules (100+), FPGA carrier cards, or combinations of both. FMC sites are now available on most development boards from FPGA industry leaders Xilinx and Altera. Indeed, FMCs are fueling the growth of FPGAbased solutions much as the PMC and XMC formats did for embedded CPU-based systems.

FPGAs have established themselves as an effective highperformance option because their attributes make them ideal for overcoming the inherent size, weight, and power (SWaP)

LCR Embedded System’s complete line of integrated rugged industrial and military systems, from off-the-shelf to fully customized, are ideal for all aspects of mission-critical computing. To learn more about what we can do for you and your application, contact us today.

Our integrated systems feature VME, VPX, ATCA and CompactPCI architectures For chassis, backplanes and integrated systems, LCR Electronics is now LCR Embedded Systems.

(800) 747-5972 e-mail sales@lcrembedded.com www.lcrembeddedsystems.com

www.vita-technologies.com

VITA Technologies Winter 2014 Buyer's Guide |

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TECHNOLOGY FEATURE constraints for embedded DSP applications. System solutions based on user-programmable FPGAs offer advantages that cannot be overlooked, and the industry has responded accordingly. During 2012 and 2013, most commercial off-the-shelf (COTS) board suppliers rolled out new FPGA products for the embedded space.

There are several technical reasons for this growth, such as big gains in logic cell counts, serial transceiver rates, channel counts, embedded ARM processors, and DSP capabilities.

FPGA suppliers have also shifted their focus from a target market of hardware designers and HDL developers to software engineers and systems integrators. Additionally, design automation tools are improving. This has increased the number of FPGA system developers by giving a broader range of engineers the means to more quickly develop effective FPGA firmware. These trends benefit COTS board suppliers and system integrators by reducing time to market and lowering development costs.

Consequently, top FPGA suppliers have seen their sales rise as many developers turn away from the competing ASIC approach due to the prohibitive expense. Programmable chip makers recognize this substantial growth opportunity as they work to displace ASIC technologies. Global FPGA leader Xilinx, who controls about 50 percent of the PLD market, reported that

VEROTEC INTEGRATED PACKAGING

TecSYS development platforms

sales of 28 nm and 40 nm products drove revenue growth in fiscal year 2014. As a result, the company is continuing to expand its FPGA product family to better serve a growing number of high-performance computing applications for customers in such areas as military (intelligence, surveillance, and reconnaissance (ISR)), mobile communications (WCDMA radio), and enterprise data services (data centers).

As the selection of FPGAs broadens, the number of FPGAbased carrier cards multiplies, enabling previously unseen solutions with dramatically expanded functionality and an attractive combination of performance and power efficiency. Additionally, significantly more flexible logic and onboard IP help to position FPGAs to facilitate the creative engineering necessary for differentiated and competitively advantaged embedded systems when coupled with innovative FMC designs.

Jason Cella is a technical writer for 4DSP. He previously covered the IT and telecom industries as an editor and writer for Dun & Bradstreet and Hoover’s Inc. Readers may contact him at jason.cella@4dsp.com.

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4DSP 1-800-816-1751 • www.4dsp.com

E-CAST Managing SWaP in ISR systems Presented by Advanced Cooling Technologies, Curtiss-Wright, GE Intelligent Platforms, and TE Connectivity

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Even in today’s budget-constrained environment the Department of Defense (DoD) is still funding Intelligence, Surveillance, and Reconnaissance (ISR) missions from payloads in unmanned aerial vehicles (UAVs) to radar and maritime surveillance. All of these applications are driven by requirements for more and more signal processing performance and reduced size, weight, and power (SWaP). Innovation in these systems is happening at the embedded electronics level where designers are overcoming thermal and power dissipation challenges in small system footprints through unique solutions and open architectures. This e-cast of industry experts will discuss the reduced SWaP challenges in ISR systems and more.

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20 | VITA Technologies Winter 2014 Buyer's Guide

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TECHNOLOGY FEATURE

Digital meets RF

By Jerry Gipper, Editorial Director In the not too distant past, computers and RF were not to be in the same room, let alone the same piece of computing equipment. Then over the years the two became friendlier as microprocessors were used to control radios and eventually led to the creation of soft radios and today’s highly popular smart phone.

Countless critical defense applications depend on radio spectrum technology as part of their architecture. As Electronic Warfare (EW) and Electronic Attack (EA) missions, Signal Intelligence (SIGINT), and associated programs have grown in sophistication, the level of radio spectrum (sub 3kHz to 30+ GHz) technology integrated into platforms continues to grow.

The many piece parts within radio spectrum technology in support of EW, EA, and SIGINT continue to play an important role.

Mixers, filters, capacitors, limiters, oscillators, digital receivers, and more have all been part of the lexicon for decades.

Advanced Digital Radio Frequency Memory (DRFM) jammers, and Integrated Microwave Assemblies (IMAs) utilize this “kit of parts” in ways that before hadn’t been imagined. An IMA, for example, often offers customized designs for mission-specific applications. They can combine the integration of switches and switch matrices, amplifiers, attenuators, filters, oscillators, as well as other RF and microwave functions.

Technology advancements Several technology advancements have led to an overwhelming acceptance of RF into the world of digital technologies. These advancements enable products that we have come to depend on in our everyday lives. These advancements are also finding their way into the latest defense systems. Four areas in particular have benefited most.

22 | VITA Technologies Winter 2014 Buyer's Guide

PCB design Good electromagnetic interference (EMI) practices have been integrated into design tools, making it easier to address critical issues early when something can be done to correct potential problems. Printed circuit board (PCB) designers are keenly aware of impedance discontinuities so low amplitude signals are a must. PCB materials and manufacturing techniques make it possible to laminate digital and RF circuits together in ways that minimize the interference. Improvements to multi-layer board technology make it possible to isolate interfering circuits. Hybrid circuits can now be built that significantly reduce the size of a digital/RF module. Advances in Phase-Lock-Loop (PLL) circuits, frequency resolution, quality, and digital PLLs, have made them an important building block in circuits.

Cabling and interconnects Shrinking circuits make it possible to reduce trace and cable lengths, leading causes of EMI. Shielding techniques enable better protection between critical circuits, reducing or eliminating interference. Connector shielding advances have made it possible to connect to boards without causing undue RF interference. Mechanical enhancements in connectors have reduced extraneous emissions. Shielding has improved across the board as board designers have learned new techniques for designs. Active cables bring yet another level of protection, enabling lower amplitude signals to extend further at higher quality and frequencies. www.vita-technologies.com

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Figure 1 | Pictured here is the Mercury Systems OpenRFM Wideband IF module with cover.

Input output filters Filters are much more accurate and tunable. Laser-trimmed filters allow the circuitry to shrink in ways that make it possible to build even smaller devices. Many new chip-level devices have built-in filters.

Packaging/enclosure design Mechanical enhancements have made it possible to cool components while not compromising on shielding. ANSI/VITA 48.7 Air Flow-By cooling, for instance, has made it possible to provide critical cooling capability while not compromising on shielding. New materials for shielding and gaskets push the resistance to EMI higher. Packaging and circuit isolation techniques have emerged that make it possible to build even smaller devices without sacrificing RF interference.

Consumer electronics have led the charge in many of these developments. Advancements in cell phone technology where many different RF transmitters and receivers can be found in a single phone have blazed a path that many other applications can leverage.

“RF and microwave technologies have been part of the underlying fabrics of critical defense applications for generations, yet little progress has been made to date in standardizing these technologies in order to meet the DoD’s directives around affordability and open system architectures,” explained Dr. Ian Dunn, vice president of Mercury’s Embedded Products group.

Most RF and microwave systems are custom designed and built, foregoing the trends in other areas of electronics technology that leverage standards and open architectures. Each system depends on unique architectures, integration schemes, testing, and manufacturing, with little regard to design and intellectual property re-use.

“Mercury Systems saw a need for standardization in RF and microwave systems for EW and SIGINT,” continued Dr. Dunn.

“As a result, we are launching OpenRFM, an initiative created specifically to address the RF and microwave integration challenges our customers have told us they face.”

What is OpenRFM? OpenRFM is a modular, open architecture that combines hardware, firmware, and software that can be applied to EW and SIGINT challenges (see Figure 1). www.vita-technologies.com

VITA Technologies Winter 2014 Buyer's Guide |

23

TECHNOLOGY FEATURE Its benefits are that it allows: ›› Affordability driven by high channel density, modular design, advanced connector technology, and the integration of digital signal processing and RF technologies ›› Sustainability with a solution that provides maximum re-use of standardized technology that will protect investments for the long haul, making it “future proof” ›› Versatility by providing many systems designs with multiple building blocks ›› Interoperability driven by modular architecture, standardized control plane, and advanced software interface OpenRFM, with its modular, standardized, scalable approach allows prime contractors and the DoD to develop or augment existing applications to counteract evolving threats in EW and EA. It also allows for the faster deployment of applications and classified techniques that are the lifeblood of rapidly evolving EW-related programs. Programs that are growing in importance as the complexion of our defense base and the missions it serves continues to change. OpenRFM will allow already existing EW, EA, and SIGINT applications to be deployed more effectively and affordably. These include areas such as deceptive jamming, pulse jamming, and spot jamming. In the realm of electronic countermeasures OpenRFM can speed up deployment of techniques such as “cloaking” the outgoing signal with random noise. Rolling out EW applications can and will be made more predictable and affordable with the standardized OpenRFM solutions already being built.

Summary The specification that will eventually emerge is expected to ­provide a definition for the physical volume of modules; electrical characteristics; how-to slot profiles for various blades, such as VPX or AdvancedTCA; and the software/hardware abstraction layers to connect to Ethernet and PCI Express.

Mercury Systems is still iterating a strategy to make OpenRFM an industry standard with a supporting ecosystem. You can expect announcements on a standards strategy in the near future.

OpenRFM is intended to make it more affordable and faster to deploy RF technologies. Its goal is to allow digital and RF to seamlessly merge together.

Mercury is currently developing OpenRFM-based standardized subsystems that can meet the open system architecture requirements required for affordable, standardized, interoperable solutions for EW and SIGINT applications. Technical ­briefings on these standardized solutions are underway with select customers, and a technical white paper will be published soon.

For more information on OpenRFM and Mercury Systems, visit www.mrcy.com/OpenRFM. OpenRFM is a trademark of Mercury Systems.

24 | VITA Technologies Winter 2014 Buyer's Guide

www.vita-technologies.com

Avionics Sponsored By:

Kontron

VPX PLUS™ Design | Test | Deploy

Alphi Technology Corporation XMC-1553-2

XMC 2 Channels DUAL 1553Bus based on Aeroflex SUMMIT CONTROLLER. The MIL-STD-1553 (1553) XMC module is a dual redundant 1553 controller module, where each controller can support Bus Controller, Remote Terminal and Bus Monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic. The module can also support Short Stub and Long Stub.

www.Alphitech.com

Meritec’s VPX PLUS™ is today’s most versatile VPX MULTIGIG RT compatible cabling system, allowing users to access and expand upon the traditional VPX backplane. When bringing out VITA 46 and Open VPX I/O, developers can utilize eSATA, Display Port, USB, Serial Rapid I/O, InfiniBand, Ethernet, Meritec’s HERCULES® and other MIL-38999 connectors. Meritec’s VPX Plus System, along with its I/O capabilities, is designed for full bandwidth testing and can be adapted for deployment. The standard VPX terminology applies to Meritec’s VPX Plus cabling system. Fat pipes, thin pipes, ultra-thin pipes are all available in multiple lengths as COTS products; and thanks to Meritec’s unique stacking of wafers, up to eight (8) wafers can be stacked to achieve final results, thus creating a wide variety of development options.

Key Features: » The Meritec VPX-Plus is a cost effective and flexible alternative to

expensive rear transition modules.

» VPX-Plus has less electrical losses than both backplane and rear

transition modules circuitry.

» Provides a connection method allowing backplane circuit rerouting

with small electrical losses and low investment.

» 6U and 3U housing kits allow you to maintain complete control from

SIE Computing Solutions, Inc. 717 Series Air-Over Conduction Cooled ATR Enclosures The 717 Series is available in standard ARINC sizes that include 1/2 ATR Short to 1-1/2 ATR Long and any custom form factor. From bus standards to application-specific custom designs, the 717 Series provides an expansive offering of ATRs for platforms such as the VME, VME64x, VXS, VPX and CPCI architectures. Designed specifically for rugged deployment and to direct air over the thermal conducting walls, its cooling can be configured to meet application requirements by either drawing air through the walls and out a rear exhaust plenum or forcing air down the walls and directing it away from the equipment. When configured for unpressurized environments, the 717 Series can be configured with a high-altitude cooling scheme to permit ultimate performance at altitudes up to 50,000 feet.

The 717 Series can be configured with optional avionics trays for isolation from shock and vibration environments common to airborne, vetronics and shipboard applications. For applications where stringent weight requirements are an issue, SIE Computing Solutions offers a lightweight composite solution. www.sie-cs.com

ruggedness & security of the system when deployed into real world environments » Made In The USA

Your link to The Xtreme High Speed Xperts – http://www.meritec.com/flipbooks/vpx_plus/index.html#1 Phone: 888-MERITEC (637-4832) Contact: Hercules@Meritec.com www.meritec.com

vita-technologies.com/p372490

 AvionicsÆ Meritec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Alphi Technology Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 SIE Computing Solutions, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Artesyn Embedded Technologies MVME8100 Artesyn’s MVME8100 is a high performance 6U VME/VXS SBC featuring the Freescale QorIQ P5020 processor with up to 8GB DDR3-1333MHz ECC memory, 512K NVRAM, and 8GB eMMC NAND Flash. It offers expanded I/O and memory features with PCIe and SRIO fabric connectivity and multiple USB, Serial and Ethernet ports. The MVME8100 is offered in commercial and fully rugged variants for extreme environments with extended shock, vibration, temperatures and conduction cooling. It is designed for a range of high end industrial control such as SPE and photo lithography and C4ISR, including radar/sonar. It will provide technology insertion to prolong current programs while providing more computing performance and data throughput. Supported operating systems include Linux, Wind River VxWorks, and Green Hills INTEGRITY. www.artesyn.com/computing

26 | VITA Technologies Winter 2014 Buyer's Guide

vita-technologies.com/p372494

Industrial

test to deployment.

» Deployment rails, supplied with capped screws, enhance the

vita-technologies.com/p372455

vita-technologies.com/p372459

www.vita-technologies.com

Industrial Sponsored By:

Artesyn Embedded Technologies

VME & VME64x Chassis Products From Pentair

MVME4100 Artesyn’s MVME4100 provides a high-performance, cost-effective continuation for currently deployed VME infrastructure. The Freescale e500 core coupled with the current operating systems allows for double precision floating point operations. In addition, the processor-enabled supplementary encryption engine can be leveraged to address new opportunities meeting the ever-growing demands for network privacy and data security. 2GB of DDR2 RAM is provided in SO-DIMM format.

Innovative MRAM is included for truly non-volatile memory. Also included are 4GB of NAND flash, which can offer improved performance and life cycle over some rotating media. High speed 2eSST protocol and extensive I/O round out Artesyn’s MVME4100 to provide maximum performance and flexibility.

Extended temperature and rugged variants support a wide range of operating and storage temperatures in addition to increased tolerances for shock. www.artesyn.com/computing

vita-technologies.com/p372460

The Standard Product program, offered by Pentair, includes systems with options for embedded or pluggable style power supplies, various slot counts, 3U and 6U card support and various cooling and airflow schemes. 19" rack mountable as well as desktop and tower case style enclosures are available in the standard program.

Artesyn Embedded Technologies MVME7100 Artesyn’s MVME7100, featuring the SoC MPC864xD processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC74xx processors. OEMs of industrial, medical, and defense/aerospace VMEbus platforms can add performance and features for competitive advantage while still protecting the fundamental investment in VMEbus and related technologies. Customers can keep their VMEbus infrastructure (chassis, backplanes, and other VMEbus and PMC boards) while improving performance and extending the life cycle. Also, the extended life cycle of Artesyn computing products helps reduce churns in development and support efforts resulting from frequent product changes. Extended temperature variants support a wide range of operating and storage temperatures in addition to increased tolerances for shock. www.artesyn.com/computing

vita-technologies.com/p372461

Artesyn Embedded Technologies MVME2500 Artesyn’s MVME2500 series makes a perfect migration path for older generation MVME3100, MVME4100, MVME5100 and MVME5110. On-board memory includes up to 2GB DDR3 memory and 512KB non-volatile MRAM. The MVME2502 variant has 8GB soldered eMMC solid state memory for additional rugged, nonvolatile storage. Connectivity includes Gigabit Ethernet, USB 2, serial ports, SATA port and either one or two PMC/XMC sites with the MVME2500 and MVME2502 respectively. A hard drive mounting kit is available for Serial ATA or solid state hard drives. Extended temperature, rugged variants and conformal coating are available. The MVME2500 series is ideal for automation, medical, and military applications such as railway control, semiconductor processing, test and measurement, image processing, and radar/sonar. www.artesyn.com/computing

www.vita-technologies.com

Pentair’s Schroff brand offers a full range of off the shelf standard chassis products in VME and VME64x architectures. Standard systems chassis include enclosures, backplanes, cooling and power supply options. These standard products are available through Pentair’s exclusive Systems Express program, fulfilling your need with quick-turn service.

Pentair will also modify standard products to fit your specific needs. Size, color, cooling scheme, ruggedization and more options are available to support your program or project. Just contact your local sales representative or use the contact information listed below to get started!

Pentair’s Schroff brand is the industry leader in standard and modified system chassis solutions. With decades of experience in product development, superior testing facilities and seats on all major open architecture development committees, Pentair is a trusted partner that delivers state of the art, quality products you can rely on for your most demanding projects. If you don’t see the exact product you need in our standard portfolio, Pentair will modify and customize to meet the specific needs of your project.

Partner with Pentair today for success!

Product Model: 20836-310; 20836-415; 20836-715; 20836-716; 20836-815; 20836-145; 20836-245; 20836-416; 20836-717; 20836-820; 20836-220; 10836-050; 10836-045; 10836-060; 20836-444 Product URL: http://www.pentairprotect.com Phone: 1.800.525.4682 Email: AskSchroff@pentair.com

www.pentairprotect.com

vita-technologies.com/p372475

 IndustrialÆ Schroff . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Artesyn Embedded Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Artesyn Embedded Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Comtel Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 IOxOS Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

vita-technologies.com/p372462

VITA Technologies Winter 2014 Buyer's Guide |

27

Industrial

Comtel Electronics

Curtiss-Wright Defense Solutions

RGD-1 Comtel announces a new line of VPX ATR enclosures. Cooling available in convection, forced air, and liquid cooling to meet most any requirement and power demand. Designed to easily adopt for special needs like extended hold up time, customized routing, and interconnect. Comtel’s new 100Gbps capable Air-/-Plane backplane technology handles any high speed requirement and often extends the performance of existing connectors. Combine our Air-/-Plane technology with flex circuit capabilities, signal integrity, simulation, and validation and we engineer perfect solutions for even the most demanding custom applications. Enclosures in ½ and full ATR for various slot sizes and power ranges.

For more information contact: nasales@comtel-online.com www.comtel-online.com

vita-technologies.com/p372496

IOxOS Technologies

CHAMP-FX4 6U OpenVPX Virtex-7 FPGA Processor card The CHAMP-FX4 is the flagship 6U product in Curtiss-Wright Defense Solutions’ family of user-programmable Xilinx® Virtex®-7 FPGA-based computing products, designed to meet the needs of challenging embedded highperformance digital signal and image processing applications. Curtiss-Wright’s 4th generation 6U FPGA card, the CHAMP-FX4 combines the dense processing resources of three large Xilinx Virtex-7 FPGAs with over 12 GB of memory resources, all on a rugged 6U OpenVPX™ (VITA 65) form factor module.

The CHAMP-FX4 complements this processing capability with vast amounts of backplane I/O bandwidth, exceeding 100 GB/s, directly connected to the FPGAs. Gen2 Serial RapidIO® (SRIO) provides standards-based connectivity to general-purpose processing boards such as the VPX6-1957 and CHAMP-AV8. http://www.cwcdefense.com/products/dsp-fpga/6u-vpx-vxs/champ-fx4.html?vita14 vita-technologies.com/p372466

Mercury Systems Ensemble® HDS6603 High Density Server

ALTHEA 7910 IOxOS Technologies releases the third generation of its PCI Express to VME64x Transparent Bridge targeting Xilinx Artix-7 devices.

The ALTHEA 7910 implements a full VME64x Master/Slave interface with System Controller capability directly bridged to a PCI Express Endpoint fully compliant with rev.2.1. Its highly efficient Network on Chip architecture delivers low latency combined with high data bandwidth, making this solution ideally suited to upgrade your VME COTS to the next generation embedded systems.

Mercury was the first HPEC company to bring Intel® Xeon server-class processing to deployed sensor systems. Currently in its fourth generation, Mercury’s Ensemble® HDS6603 High Density Server, is the industry’s most powerful open systems architecture (OSA) blade, providing more than one TFLOP of general processing power in a single OpenVPX™ slot. This delivers cloud computing-caliber resources to the tactical edge, enabling a new level of on-platform exploitation and mission autonomy.

The result is a power-efficient single chip solution which provides higher performance compared with existing VME interfaces, a faster integration process and a robust obsolescence management strategy.

Mercury’s packaging, cooling, and interconnect domain expertise enables this capability to be embedded as an OSA solution on the platform. Leveraging scalable server-class symmetric multiple-processing (SMP), the most complex radar, EO/IR and IMINT applications are effectively handled on the platform, in real-time.

www.ioxos.ch

mrcy.com/HDS6603

vita-technologies.com/p372451

vita-technologies.com/p372472

Radar

Rugged

Annapolis Micro Systems, Inc. WILDSTAR 7 for OpenVPX 3U These FPGA boards include 1 Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If I/O is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine I/O sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single I/O Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability.

This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

www.annapmicro.com

vita-technologies.com/p372457

28 | VITA Technologies Winter 2014 Buyer's Guide

Annapolis Micro Systems, Inc. WILDSTAR A5 Conduction Cooled for OpenVPX 6U These FPGA boards include two Altera Stratix V FPGAs with 48 High Speed Serial connections performing up to 14.1 Gbps and four 32-bit DDR3 DRAM ports per FPGA clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If I/O is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices.

Each 6U card has two mezzanine I/O sites which can support up to four WILDSTAR mezzanine cards as well as a QSFP+ option (on WILDSTAR 7 and WILDSTAR A5 board) that allows for six QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single I/O Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

www.annapmicro.com

vita-technologies.com/p372458

www.vita-technologies.com

Rugged Sponsored By:

CES – Creative Electronic Systems

HERCULES® >10Gbs Ruggedized COTS High-Density Interconnect System

RIO6-8092/3/6 VME retrofit: “Your ideal partner!”

The RIO6-8092/3/6 is the ideal candidate for retrofit programs due to new system features or components obsolescence (i.e. VME bridge). It features an FPGA based VME bridge ensuring sourcing independence and a FlexIO™ static routing module allowing for easy adaptation to different backplane configuration. The RIO6-8092/3/6 combines a Freescale QorIQ™ P2 single or multi-core processor with an additional user FPGA (optional) and two PMC/XMC sites providing extended resources and design flexibility.

Engineered for the most demanding aerospace & defense applications, the RIO6-8092/3/6 is available in air-cooled and conduction-cooled versions.

Contact information: CES – Creative Electronic Systems 38 Avenue Eugene Lance • 1212 Grand-Lancy, Switzerland http://www.ces.ch

vita-technologies.com/p372463

Meritec’s Hercules multi-protocol Interconnect System

CES – Creative Electronic Systems ROCK-4 Adding processing capability to your sensors ROCK-4 acquires, filters, converts, formats and processes digital/analog signals and provides them to a Mission Computer over classical avionic interfaces. ROCK-4 addresses the needs for small and rugged standalone health monitoring computers, in order to interface sensors or concentrate data in I/O distributed systems. With its customizable front panel, ROCK-4 is easily adaptable to the specific needs of your solution.

Designed and manufactured in-house at CES, ROCK-4 benefits from long term serviceability, proactive obsolescence management, tight control of all production steps and rigorous quality testing.

Contact information: CES – Creative Electronic Systems 38 Avenue Eugene Lance 1212 Grand-Lancy, Switzerland

Key Features: » Up to 145 total contacts with 44 differential pairs in a #23 circular shell » Rugged light-weight aluminum MIL-38999 Series III Size 9, 13, 17 & 23

http://www.ces.ch

vita-technologies.com/p372464

» Matched impedance design of 100 Ohm » Fully electrically tested interconnect systems » Made In The USA

ROCK-2 ROCK-2 is a Prequalified and Packaged Commercial-Off-the-Shelf (PCOTS) Avionic Mission Computer optimized for C4ISR applications. The modular ROCK-2 family integrates all the building blocks to interface sensors, process sensor & video data and share them with other systems over classical avionic interfaces or Ethernet network. The rugged sealed forced-air-cooled chassis of ROCK-2 is engineered to sustain the most extreme environmental conditions and is available in 3 and 5 slot configurations. Designed and manufactured in-house at CES, ROCK-2 benefits from long term serviceability, proactive obsolescence management, tight control of all production steps and rigorous quality testing.

Contact information: CES – Creative Electronic Systems 38 Avenue Eugene Lance • 1212 Grand-Lancy, Switzerland

www.vita-technologies.com

threaded-coupling circular shells

» Shell plating: CAD & PTFE plating standard, others available special order » Available as Plug-Cable Assemblies & Jam-Nut or Flange Mount

Receptacles for Solder Tail, Press-Fit or Pigtail

CES – Creative Electronic Systems

http://www.ces.ch

provides cost-efficient reliability, density & speed necessary to support C5ISR for battlefield-ready critical command. Embedded in the rugged MIL-DTL-38999L Series III circular shell, Hercules is both a durable and high-bandwidth interconnect system suitable for Mil/Aero/Marine and harsh-enviro commercial/industrial applications not previously accommodated by Industry standard interconnects. The rapid emergence of high-speed switched serial fabric backplanes in the rugged embedded computer market has created a need for a connector system capable of supporting serial I/O at full bandwidth between platforms. Hercules supports throughput link speeds demonstrated in excess of 10Gbs per lane.

Hercules is currently The VITA 76 Draft Standard and, while readily accepted for over five (5) years as a proven high-speed copper interconnect, establishing the viability of Hercules as an active optic connector platform rounds out the V-76 Standards for both copper and optic cabling consideration.

vita-technologies.com/p372465

Follow the link for interactive flipbook and technical data – http://www.meritec.com/flipbooks/hercules/index.html#1 Phone: 888-MERITEC (637-4832) Contact: Hercules@Meritec.com www.meritec.com

vita-technologies.com/p372489

 RuggedÆ Meritec . . . . . . . . . . . . . . . . . . . . . . . 29

LCR Embedded Systems . . . . . . . . . . 30

Annapolis Micro Systems, Inc. . . . . . . 28

North Atlantic Industries . . . . . . . . . . . 30

Creative Electronic Systems . . . . . . . . 29

Pentek . . . . . . . . . . . . . . . . . . . . . . . . 30

Dawn VME Products . . . . . . . . . . . . . . 30

TE Connectivity . . . . . . . . . . . . . . . . . . 31

Dynatem, Inc. . . . . . . . . . . . . . . . . . . . 30

Themis Computer . . . . . . . . . . . . . . . . 31

Hartmann Electronic GmbH . . . . . . . . 30

VITA Technologies Winter 2014 Buyer's Guide |

29

Rugged

Dawn VME Products

LCR Embedded Systems

Universal AC Input VITA 62 3U Power Supply

LSF-02

Dawn VME Products PSC-6236 universal AC input VITA 62 compliant 3U power supply for air or conduction cooled OpenVPX systems. True 6 channel supply with up to 400 watts output. Mission critical wide temperature range at high power.

Input 85 VAC to 264 VAC, 47 Hz to 400 Hz. Can be special ordered to support high current single channel applications. Embedded RuSH™ technology actively monitors voltage, current and temperature, and provides protective control. Ruggedized – VITA 47 compliant.

Rugged, Reliable and Ready.

The LSF-02 is a rugged environmentally sealed tactical computing and communications platform, ideal for vehicle and man-pack applications. The LSF-02 was designed to be easily customizable. The COM-Express based architecture provides flexibility to meet different performance and power envelopes. Support for 2 Mini-PCIe slots provides options for Mil-Std-1553, ARINC 429/575/717, CAN bus, WiFi or Cellular modems. The platform also has room for 2 additional add in cards. Two optional Mil-Std 2590 batteries allows the platform to be un-mounted and be used in manpack applications.

dawnvme.com/vpx-products

www.lcrembedded.com

vita-technologies.com/p372468

vita-technologies.com/p372471

North Atlantic Industries

Dynatem, Inc. CPU-71-16 The CPU-71-16 is a high performance Single Board Computer (SBC) based on the VMEbus 6U form factor.

Offered in both convection cooled and ruggedized conduction cooled variants, the CPU-71-16 will meet the needs of commercial and military applications requiring maximum processing power, low power consumption, and fully integrated single board computing.

Sensor Interface Unit - SIU31

At the heart of the CPU-71-16 is an Intel® 2nd Generation Core™ i7 ULV Sandy Bridge Processor and QM67 Cougar Point Platform Controller Hub (PCH). These two devices form the central processing backbone of the design. The CPU-71-16 supports up to 8 GBytes of DDR3 SDRAM running at 1333 MHz. The CPU-71-16 routes x8 gen 2 PCIe to an on-board XMC site.

Configure with up to 3 I/O and Communications Function Modules — Over 40 different modules to choose from Configure to Customize The SIU31 is a highly configurable rugged system or subsystem ideally suited to support a multitude of Mil-Aero applications that require high-density I/O, communications, Ethernet switching and processing.

The SIU31 uses one NAI field-proven 3U cPCI board to deliver off-theshelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

Architected for Versatility NAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O, communications, Ethernet switch and SBC options.

Pre-existing, fully-tested functions can be combined in an unlimited number of ways to quickly and easily meet system requirements.

www.dynatem.com\cpu-71-16

www.naii.com

vita-technologies.com/p372488

Hartmann Electronic GmbH 3U VPX 700W Power Supply VITA 62 VPX Power Supply 3U 4HP 715W, DC INPUT 18-35V, OUTPUT 12V 3.3V 5V adjustable, efficiency max. 92%, extended Temperature Range -40 to +85°C, JTAG-Connection, LED-Indication for Voltages and Status, low Ripple and Noise: 12V=15mV 3.3V=4mV 5V=4mV, Overvoltage/Undervoltage Protection, Control Logic according to VITA 62 and VITA 46.

vita-technologies.com/p372473

Pentek, Inc. Model 56721 3-Ch 200 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Virtex-7 FPGA – AMC Module Model 56721 is a member of the Onyx® family of high performance AMC boards based on the Xilinx Virtex-7 FPGA. A muti-channel, highspeed data converter with a programmable DDC, it is suitable for connection to HF or IF ports of a communications or radar system. Its built-in data capture and playback features offer an ideal turnkey solution.

It includes three A/Ds, two D/As and four banks of memory. It features built-in support for Gen. 1 and 2 PCI Express.

Contact Pentek for availability of rugged and conduction-cooled versions.

http://www.hartmann-electronic.com/accessories/acc-psu.html vita-technologies.com/p372470

30 | VITA Technologies Winter 2014 Buyer's Guide

http://www.pentek.com/go/vita56721

vita-technologies.com/p372495

www.vita-technologies.com

TE Connectivity

Themis Computer

MULTIGIG RT 2-R Turn & Burn with TE’s New MULTIGIG RT 2-R Connector Quad-Redundant Contact System TE Connectivity’s MULTIGIG RT 2-R Connector quad-redundant contact system offers rugged survivability with high level shock and vibration beyond VITA 47. The new MULTIGIG RT 2-R Connector is a lightweight, high-speed connector system with a “pinless” interface tested to 10,000 mating/unmating cycles and backward compatibility to VITA 46 connector systems.

www.te.com/multigig

vita-technologies.com/p372476

Rugged

Themis SFF Tactical Systems Themis is defining the future of small form factor computing with VITA 74 compliant NanoATR™, NanoPAK™, and NanoSWITCH™ products. VITA-74 is the first standardsbased approach to rugged, small form factor, conduction-cooled systems.

With a VPX backplane fabric, VITA-74 systems offer tremendous space, weight, cooling (SWAP-C) advantages, and power savings at a fraction of the cost of larger legacy 3U and 6U systems while achieving equal or better performance.

Nano modules provide the essential building blocks for the NanoATR system.

Small Form Factor Tactical Systems • NanoPAK™ i7 Small Form Factor Computer • Intel® Core™ i7 NanoPAK™ Small Form Factor Computer • NanoATR™ Small Form Factor System • NanoSWITCH™ Rugged Gigabit Ethernet Switch • VITA 74/NanoX NanoATR™ Small Form Factor Computer Systems

www.themis.com/sff

vita-technologies.com/p372492

TE Connectivity

TE Connectivity

Fortiz Zd Connector

CeeLok FAS-T Connector

Fortis Zd High-Speed Backplane Connector

Rugged, Field Terminable, 10Gb/s Ethernet I/O Connector The CeeLok FAS-T connector system from TE Connectivity is the rugged, small form factor, field terminable, I/O connector that meets high-speed 10Gb/s Ethernet performance. Designed for military, commercial aerospace and marine environments, the CeeLok FAS-T connector easily meets today’s requirements and the expected 10 Gb/s speeds needed in the future. Crimpsnap contacts provide easy termination and field repairability, and an integral backshell offers low-cost, low-weight strain relief and 360° EMI protection.

As demands on systems for realtime intelligence intensify, the importance of high performance interconnection becomes critical. In response, TE Connectivity created the Fortis Zd High-Speed Backplane Connector, a new connector system that supports increasing bandwidth requirements in a ruggedized format to withstand the increased shock and vibration requirements of emerging military applications. Compact, lightweight and fast at 12+ Gb/s, along with 4-point redundancy makes the Fortis Zd connector the choice for next generation of high-speed electronics systems.

TheFutureUnleashed.com

TheFutureUnleashed.com

vita-technologies.com/p368566

UNMANNED Systems

vita-technologies.com/p365723

E M A G

The Unmanned Systems E-mag brought to you by Military Embedded Systems targets trends and technology in autonomous vehicles, from SWaP-constrained UAS payloads and software certification to the disruptive regulatory and market impact of unmanned systems outside the defense sector.

Read it now! http://opsy.st/Unmanned2014 www.vita-technologies.com

VITA Technologies Winter 2014 Buyer's Guide |

31

Surveillance Sponsored By:

Meritec

WILD Data Storage Solution – 12.8 TB/Slot

Hermes® high-speed connector Meritec’s Hermes® highspeed connector with 42 hermaphroditic contacts in both Plug and Receptacle; molded internal grid, machined aluminum Teflon®-coated outer shell, 10 Gbs per Differential Pair, Low-insertion force, with 10,000-plus mating cycles, is ideal for ruggedized Solid State Drives (SSDs). Designed to meet convection, IR or vapor-phase re-flow requirements, RoHS Compliant, can be manufactured in right-angle or vertical-mount configuration. Other possible applications include, but not limited to: Data Storage, UAV, Vehicle 360-degree Surveillance and more. Did we mention Rugged and Durable? http://www.meritec.com/pdf/Hermes%20Connector%2042%20Pos.pdf Your connection to The Xtreme High-Speed Xperts http://www.meritec.com

When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 12.8 TB of capacity in a single 1" slot with up to 6GB/s of write bandwidth. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 16 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.

The Storage Carrier/Canister is specifically designed to support 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).

To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design. Sensors can be accessed with a chassis manager (ChMC).

New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier. www.annapmicro.com

vita-technologies.com/p372456

 Surveillance Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Meritec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Dawn VME Products

vita-technologies.com/p372493

UAV

VPX Cube Rugged Enclosure Dawn VME Products created the “CUBE” family of enclosures to address the needs of the UAV market. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 7"L x 6"W x 7.62"H. Full environmental sealing ensures reliable operation in any environment. Embedded RuSH Technology monitors Power Supply voltage and current on all 6-channels, plus temperature, and (optionally) humidity. Flexible, Dawn patented, “Eye”-tested backplane fabric and I/O mapping supports any application. Backplane is configurable to meet any data plane connection fabric. You need it right. You want Dawn. dawnvme.com/vpx-products

vita-technologies.com/p372467

General Standards Corporation PCIe -24DSI12WRCIEPE 24-Bit, 12-Channel, 105KSPS Transducer Input Module With 12 Wide-Range Delta-Sigma Input Channels and IEPE Current Excitation, the 12-channel PCIe-24DSI12WRCIEPE analog input module provides high-density 24-bit IEPE analog input resources on a standard PCI Express module. Optimized for flexibility and performance, the board is ideal for a wide variety of applications, ranging from IEPE transducer inputs and precision voltage measurements, to the analysis of complex acoustic signals and waveforms. Read More here: http:// www.generalstandards.com/view-products2.php?BD_family=24dsi12wrciepe.

New Feature! Call for availability of a conduction cooled (CCPMC) version of this board! Read more about our new PMC Conduction Cooled products!

General Standards Corporation develops and manufactures the highestperformance Analog I/O, Digital I/O and Serial I/O products based upon a variety of buses such as PMC, PCI, PC104Plus, VME, and cPCI. http://www.generalstandards.com/

32 | VITA Technologies Winter 2014 Buyer's Guide

vita-technologies.com/p372469

www.vita-technologies.com

Dawn VME Products

Schroff/Pentair

Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization.

Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM microoverlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements. Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase. dawnvme.com

vita-technologies.com/p372452

Highland Technology, Inc.

Product Model: 10836-045 Product URL: http://www.pentairprotect.com Phone: 1.800.525.4682 Email: AskSchroff@pentair.com www.pentairprotect.com

vita-technologies.com/p372474

Avionics 26 Alphi Technology Corporation Meritec SIE Computing Solutions, Inc.

V120 VME PCI Express Crate Controller The V120 is a VME bus master crate controller, usable as a crate slot 0 arbiter or as a secondary controller. Each PCI Express cable driver board, in a PC backplane, can drive one or two V120s over standard, flexible PCI Express cable assemblies up to 7 meters long.

Designed for long-term availability, the V120 contains no proprietary VME chips. Clean, simple architecture means no jumpers and no setup needed for basic VME I/O. VME module registers are directly mapped into PC address space. The V120 provides 8184 remapping registers, each controlling a 16 kbyte PC-to-VME remapping page with flexible timing and endian controls. The default powerup mapping allows immediate access to the A16, A24, and partial A32 VME address spaces. DMA and VME64 support are optional. www.HighlandTechnology.com

This VME64x system chassis offered by Pentair’s Schroff brand supports mobile and desktop applications by housing the system components in a rugged and attractive tower case. Integrated cooling, fan control module and pluggable power supplies offer high-end features along with a 7-slot backplane for VME64x boards. Additional options include rear I/O, embedded power supply, alarm and status panel and area for mounting a peripheral DVD drive. An additional option for a VXS VITA 41 backplane is available. Trust Pentair’s Schroff brand to deliver high quality, innovative products to support your project. Modifications and customization to meet your needs are supported.

vita-technologies.com/p372487

For the latest technical information and updates on VMEbus, VPX, OpenVPX, VXS, and other VITA standards.

Industrial 26

Artesyn Embedded Technologies Comtel Electronics GmbH IOxOS Technologies Schroff Pentair

Radar 28

Annapolis Micro Systems, Inc. Curtiss-Wright Defense Solutions Mercury Systems

Rugged 28 Annapolis Micro Systems, Inc. Creative Electronic Systems Dawn VME Products, Inc. Dynatem, Inc. Hartmann Electronic GmbH LCR Embedded Systems Meritec North Atlantic Industries Pentek, Inc. TE Connectivity Themis Computer

Surveillance 32 Annapolis Micro Systems, Inc. Meritec

UAV 32

Dawn VME Products, Inc. General Standards Corporation

Test & Measurement

www.vita-technologies.com

33

Dawn VME Products, Inc. Highland Technology, Inc. Schroff Pentair VITA Technologies Winter 2014 Buyer's Guide |

33

Test and Measurement

VME 64X Tower Case System Chassis

Fabric Mapping Modules

PRIMETIME CHOICES

A revolution in military and aerospace image capture and ­ pre-processing WOLF Advanced Technology is leading a revolution in military and aerospace image capture and pre-processing. Leveraging NVIDIA’s latest technology 28 nm Tegra-K1 APU packed with five ARM cores, 6 GB low-power LPDDR3 memory, 325 GFLOPs CUDA processing and less than 20 W power usage, WOLF’s 3G-SDI FGX/Tegra-K1 dual frame grabber is a PrXMC peripheral processor board that allows complete control of captured frame grabber data for analysis or complex pre-processing without disrupting the host processor on an SBC. “The extremely low power and inherent user programmable features introduce a paradigm shift for rugged military and aerospace customers, enabling the ability to pre-process two simultaneous 3G-SDI video inputs,” says WOLF CEO Craig McLaren.

The dual 3G-SDI frame grabbers – SMPTE292M or SMPTE-424M – stream over PCIe, encoding as an h.264 transport stream or GPU processing and displaying on up to two output displays: 3G-SDI, DisplayPort, LVDS, HDMI or DVI. WOLF Advanced Technology • wolf.ca • www.vita-technologies.com/p372453

Reduce time-to-market with the performance you need The Innovative Integration ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy-to-use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need.

The ePC-Duo provides solutions for the embedded instrumentation market as well as mobile instrumentation and distributed data acquisition. System architects can use the highly configurable ePC-Duo, with COM Express processor modules and dual XMC for I/O, to add anything from RF receivers to industrial control modules to design countless application specific platforms very quickly. An onboard Xilinx FPGA can be used for custom I/O and interfaces to further refine the capabilities.

Innovative Integration • www.innovative-dsp.com • www.vita-technologies.com/p372450

Long live VMEbus!

Over 30 years since the introduction of VMEbus, the technology remains a mainstream contender. VMEbus bridge parts are critical to the continued success.

IOxOS Technologies is releasing the ALTHEA 7910, a PCI Express x4 GEN1/GEN2 to VME64x transparent bridge embeds a DMA engine that works with on-chip memory and an optional DDR3 external device.

The ALTHEA 7910 implements a full VME64x Master/Slave interface with System Controller functions with a direct bridge to a true PCI Express Endpoint, fully compliant with revision 2.1. Its highly efficient network-on-chip (NoC) architecture delivers extremely low latency combined with high data bandwidth, making this solution ideally suited to upgrade VME COTS to the next generation embedded systems. The ALTHEA 7910 package includes a Xilinx Artix-7 XC7A75T, the encrypted binary programming file, device drivers with source code, user libraries, and XprsMon. IOxOS Technologies • www.ioxos.ch • www.vita-technologies.com/p372451

Fabric mapping modules automate optimization of OpenVPX backplane topologies VPX backplane design is critical to implementing a VPX system, and the abundance of options makes it a daunting task. Dawn VME Products has introduced their Fabric Mapping Module (FMM) connector-less backplane micro-overlays to simplify and automate the optimization of backplane topologies in compliance with OpenVPX profiles.

Dawn’s FMMs use Ball Grid Array substrate technology as a micro-overlay that can be used on VPX backplanes and are tuned for high-speed signal transmission. FMMs interface a PCB-based differential pair matrix with compatible Dawn backplanes, so inter-slot communications can be customized to meet unique system requirements.

FMMs allow designers to work with flexible configurations of high-speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes..

Dawn VME Products • www.dawnvme.com • www.vita-technologies.com/p372452

34 | VITA Technologies Winter 2014 Buyer's Guide

www.vita-technologies.com

GE Intelligent Platforms

GE’s COTS Rugged Systems are ready whenever the deployment clock is ticking.

Time is a precious commodity, because there’s never enough of it. And time is money.

GE’s line of integrated COTS Rugged Systems – which now includes an advanced HPEC capability – provides the quick delivery time most developers need for their unmanned and manned ground and airborne systems. These fully integrated computing platforms can be built around Freescale™ or Intel® processors with a variety of slot configurations to provide enough options to handle most applications. The CRS series takes the risk out of rugged system development with a fully tested computing platform that integrates with our own wide range of COTS products to provide a TRL 6 solution.

Finally, a rugged system that puts “offthe-shelf” back into COTS.

For white papers and application details, visit:

defense.ge-ip.com/systems

© 2014 General Electric Company. All rights reserved. All other brands, names or trademarks are property of their respective holders.

Got Tough Software Radio Design Challenges?

Unleash The New Virtex-7 Onyx Boards!

Pentek’s Onyx® Virtex-7 FPGA boards deliver unprecedented levels of performance in wideband communications, SIGINT, radar and beamforming. These high-speed, multichannel modules include: • A/D sampling rates from 10 MHz to 3.6 GHz • D/A sampling rates up to 1.25 GHz • Multi-bandwidth DUCs & DDCs • Gen3 PCIe with peak speeds to 8 GB/sec • 4 GB SDRAM for capture & delay • Intelligent chaining DMA engines • Multichannel, multiboard synchronization ® • ReadyFlow Board Support Libraries ® Design Kit & Installed IP • GateFlow FPGA ® • GateXpress FPGA - PCIe configuration manager • OpenVPX, AMC, XMC, PCIe, cPCI, rugged, conduction cooled • Pre-configured development system for PCIe • Complete documentation & lifetime support

With more than twice the resources of previous Virtex generations plus advanced power reduction techniques, the Virtex-7 family delivers the industry’s most advanced FPGA technology.

Call 201-818-5900 or go to www.pentek.com/go/vitaonyx for your FREE online Putting FPGAs to Work in Software Radio Handbook and Onyx product catalog.

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 • Phone: 201.818.5900 • Fax: 201.818.5904 • e-mail:info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2013 Pentek, Inc. Pentek, Onyx, ReadyFlow, GateFlow & GateXpress are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.