Worldwide Engineering Magazine - Issue 42

Issue 42 Not just heat exchangers: Complete lines drive HRS business growth

A new identity for Atlas Copco Group

New 32-Bit MCU Features an Embedded Hardware Security Module to Safeguard Industrial and Consumer Applications

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Not just heat exchangers: Complete lines drive HRS business growth

By Matt Hale, International Sales & Marketing Director, HRS Heat Exchangers HRS is well known as a leading supplier of heat exchangers for a wide range of applications, including food, pharmaceutical, environmental, energy and wastewater. In particular we specialise in the efficient heat transfer of challenging materials – such as those with high viscosity or high fouling potential – using our comprehensive range of corrugated tube and scraped surface heat exchangers. However, our clients are increasingly looking for turnkey solutions for their thermal processing challenges.

In response to this, HRS now has a team solely dedicated to the development of complete systems, which account for more than half our total sales by value.

Since the Covid pandemic we have seen significant sales growth around the world, with turnover increasing more than 60% in 2022 compared to the previous year.

In terms of volume, component orders remain our core business; however, the number of full systems we are commissioned to produce is increasing every year and now accounts for the majority of turnover.

Most of the demand for complete systems comes from the food and drink industry, but we are also seeing a strong interest in systems for wastewater treatment, as well as specialist applications such as anaerobic digestion and zero liquid discharge.

right system first time around.

Types of systems

HRS Engineering Manager Alejandro Lopez explains: “The average length of a typical system project from order to commissioning is between 20 and 26 weeks. We design and build each system to the client’s exact specification and we also see each system through the commissioning phase. This can mean travelling anywhere in the world from our manufacturing base in Spain, although we are increasingly seeing clients opt for remote commissioning, which we are happy to facilitate.

Thanks to more than 40 years’ experience in the food sector, HRS can offer clients a range of modular or turnkey system solutions, such as our Asepticblock pasteurisers and sterilisers which combine heat treatment, aseptic filling and clean-in-place capabilities in a single system, and which can be skid-mounted for easy installation. Other systems for the food and drink sector include deaeration systems, our I Series of ice crushers and melters, direct steam injection sterilisers (DSI Series) and dedicated CIP and SIP systems. We also provide trial systems for conducting product and processing trials before committing to a final production solution.

“Our most popular systems are for pasteurising juices, similar to those in the fruit growing area near our manufacturing base in Murcia, Spain. Energy recovery, which can reduce energy consumption by 70-80% in juice processing, is increasingly popular and we are designing more systems which incorporate this.

“In the last few years, we’ve completed a number of other systems. For example, those which contain tanks, aseptic filling stations, clean-in-place systems, preparation areas and more. We are actively looking to grow our systems department and have recruited additional engineering staff to accommodate this.”

For the energy and environmental sectors, we produce a number of concentration and evaporation systems (as well as solutions for Zero Liquid Discharge), and specific systems for anaerobic digestion and wastewater treatment including Digestate Concentration Systems (DCS), Digestate Pasteurisation Systems (DPS) and Biogas Dehumidification Systems (BDS).

Although systems represent an increasing share of our business, component heat exchangers and

Bespoke system design Unlike other heat exchanger manufacturers who only sell standard heat exchanger designs, each HRS product is designed to the client’s individual needs. While this can increase the development and production period, it also means that our customers get the

HRS are seeing increased demand for complete line solutions, particularly in the food sector

other products (such as our BP Series of hydraulic piston pumps) underpin our whole business, as well as providing the foundation for many of our complete solutions.

We continue to invest in product development and innovation.

Food system case study HRS supplied a complete sterilisation and aseptic filling solution for a leading specialist in fruit product processing and logistics located in Murcia, Spain.

With the capacity to process up to 300,000 litres of fruit juice per day, the main products include concentrated juices such as lemon, orange and mandarin, grape and peach, and some mixed fruit juices.

HRS Asepticblock pasteurisers and sterilisers which combine heat treatment, aseptic filling and clean-in-place capabilities in a single system

The first part of the system sterilises the product in an HRS Thermblock steriliser featuring a multi-tube heat exchanger. The product is pre-heated in a buffer tank to 48 °C, then passes through a deaerator to mitigate oxidisation which would spoil the product. It is then heated to pasteurisation temperature (around 92 °C) for one minute to kill any bacteria, before being cooled to 31 °C to preserve quality.

The sterilised product is then placed into sterilised bags within drums using an HRS Aseptic filler.

The two-headed design ensures continuous operation, with the product placed into 200 litre bags inside a drum at a rate of 12,000 litres/hr (60 drums/hr). Once full, the drums are then then transported to final customers across Europe and the United States.

The client’s Plant Manager comments: “The HRS aseptic plant was designed and optimised to exactly meet our needs and we are very satisfied with it. It’s simple to use and manage, does exactly what it was designed to do and is extremely reliable. We have had no problems with it since it was installed. The engineering involved is excellent and I would definitely recommend both the system and HRS as a company.”

Many systems can be skid-mounted for easy installation

HRS produces a number of systems for environmental and waste treatment industries, including its Digestate Pasteurisation System

cama-UK@camagroup.com

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Worldwide Engineering Magazine Providing timely industry news, exclusive features on advancing technology, equipment, materials, show previews, content

Contents

marketing services for our valued clients and much more!

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Not just heat exchangers: Complete lines drive HRS business growth

A new identity for Atlas Copco Group

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TTI Europe Now Shipping TE Connectivity’s PowerTube High-Voltage Connectors for E-mobility Applications

New 32-Bit MCU Features an Embedded Hardware Security Module to Safeguard Industrial and Consumer Applications

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iCOMAT and CGTech push new frontiers in composite part manufacture

Microchip’s Detroit Automotive Technology Center is the Destination for Automotive Clients

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3D Inspection in a “Snapshot” with SICK Visionary T Mini AP Configuring machine vision inspections in 3D is now possible in a “snapshot”, thanks to the combination of SICK’s powerful and compact Visionary-T Mini AP camera with the new easy-to-use SICK Nova 3D Presence Inspection sensorApp. The SICK Visionary-T Mini AP uses best-in-class time-of-flight snapshot technology to set new standards of data accuracy for detailed environmental perception at rapid production speeds. It captures both the 3D depth and 2D intensity values of every pixel at an exceptional (512 × 424 px) resolution in a single shot of light, at up to 30 3D frames per second.

Common 3D Vision Tasks Common 3D inspection tasks in factory automation and logistics, such as completeness, fill level monitoring, or robot palletising, can be set up rapidly and costeffectively to run onboard the Visionary-T Mini AP camera using the SICK Nova 3D Presence Inspection sensorApp. Users simply select the 3D machine vision tools they need via an easy graphic user interface and the Visionary-T Mini AP camera is soon delivering reliable inspection results via I/O to the machine controller or over TCP/ IP. No Programming Skills “Thanks to SICK’s Nova foundation software, you don’t need programming skills to run a readymade sensorApp directly onboard our smart devices,” explains Nathaniel Hofmann, SICK’s Market Product Manager for Machine Vision and Measurement. “With the SICK Nova Presence Inspection toolset, you can easily configure a 3D machine vision solution that exactly matches your application.

“Just select the tools you need from the App to run directly on board the Visionary-T Mini AP. It’s simple to use the graphical user interface, from where you also can also access other industry-standard vision 6

tools. Or you can install one of the ready-made, application-specific solutions should you need them.”

As a programmable device, the SICK Visionary-T Mini AP is easy to configure and commission. A multicam mode is available to process image data from more than one Visionary-T Mini. With rapid 3D data transmission, the Visionary-T Mini is suitable for integration into most industrial applications.

3D Vision Toolset With a toolset of commonly used 3D vision tools, the SICK Nova Presence Inspection App easily masters tasks like emptiness checks in bins, totes and crates, presence detection of objects in 3D scenes, as well as simple measurements and quality tolerance checks.

“3D quality checks for completeness often need several,

more advanced, machine vision software tools and programming skillset to identify the quality inspection issue, but with SICK Nova Presence Inspection, they are easy to configure,” Hofmann adds. “The camera outputs results, such as confirming all parts are present and at the right locations or verifying a set of measurements.”

Using the SICK Nova Presence Inspection on Visionary T Mini, the position, height and volume of any package can be determined, for example for a robot to pick it and place it in a container or pallet.

The Visionary-T Mini’s 3D snapshot technology can also be used for continuous 3D Fill Level monitoring, for example to determine if totes are empty, filled, full or overfull, or it can measure the presence of parts in a bin or presence of ingredients in a vessel, for example.

Visionary-T Mini

With a low-weight and no moving parts, the Visionary-T Mini’s IP65/67 housing measures just 80 mm x 70 mm x 77 mm, ideal for installation in compact robotics and automation solutions. It performs reliably despite the shocks and vibrations of applications such as robot palletising and depalletising. The automatic High Dynamic Range of the Visionary-T Mini ensures even widely-varying contrasts and lighting conditions across a scene are captured in each frame without complex set up, or expert knowledge of time-of-flight settings. The high-density 512 x 424 px resolution is complemented by a 70° x 60° field of view.

The SICK Visionary-T Mini CX provides an alternative option for customers wishing to use the power of the Visionary-T Mini’s snapshot technology to stream 3D data for their own software applications. www.sick.co.uk

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Altair Announces Next-Generation Altair® HPCWorks™ 2024 Upgrades deliver powerful scheduling capabilities, cloud and AI integration, and HPC monitoring and reporting Altair (Nasdaq: ALTR), a global leader in computational science and artificial intelligence (AI), announced significant upgrades to Altair® HPCWorks™, its highperformance computing (HPC) and cloud platform. New tools and integrations include an AI-enhanced user portal, nextgeneration technology for distributed workflows, advanced HPC monitoring and reporting, and easier-than-ever cloud scaling.

“Altair HPCWorks advances Altair’s HPC capabilities and helps organizations accelerate innovation by simplifying their resource management, workload management, workflow management, and reporting,” said Sam Mahalingam, chief technology officer, Altair. “Our goal is to make it effortless for users to leverage today’s technology, so they can focus on mission-critical work rather than the tools they use.”

Boost User Productivity and Throughput with AI Altair® Access™, an AI-powered job submission and monitoring tool available in Altair HPCWorks, uses historical data analysis, job inputs, and input file mining to predict job behavior and estimate memory and walltime requirements. It also regularly retrains itself based on new data. Altair Access provides walltime estimates to Altair® PBS Professional® to optimize scheduling, resulting in significant job throughput gains of 10-15% for real workloads.

Frictionless Multi-Cluster HPC Scheduling Also included in Altair HPCWorks is Altair® Liquid Scheduling™ for PBS Professional, which deploys across multiple existing scheduling 8

domains to deliver a scalability leap for the next generation of supercomputers. Liquid Scheduling is a powerful, flexible HPC feature that meets the demands of the latest distributed workflows. It ensures that workloads run in the most efficient manner by connecting multiple clusters and sites, eliminating silos, and providing global visibility into resource utilization. The National Supercomputing Centre (NSCC) Singapore is a key development partner for Liquid Scheduling and plans to deploy the solution in 2024 as a critical component of its future infrastructure.

Fast, Intuitive Reporting for HPC Altair HPCWorks’ new reporting solution, Altair® InsightPro™, simplifies and streamlines HPC and cloud reporting. With its user-friendly interface and prebuilt reports, InsightPro makes data-driven decision-making easier than ever. It provides broad, detailed visibility into HPC and cloud environments, enabling organizations to separate missioncritical data and reporting from day-to-day metrics. This gives administrators the information they need to make quick decisions that improve utilization and efficiency. Open database access makes it easy to connect InsightPro to sophisticated data analytics solutions such as Altair® Panopticon™ and Altair® RapidMiner® for advanced AI analysis.

Take Control of the Cloud Altair’s industry-leading PBS Professional workload manager now includes direct access to Altair® NavOps®, which helps enterprises migrate computeintensive technical HPC workloads

to the cloud and provides complete visibility into HPC cloud resources.

Budget-aware spend management lets users monitor and control costs to minimize cloud expenses.

NavOps provides a single interface for dynamically scaling resources in the most popular public clouds.

This enables users to leverage cloud HPC to expedite highpriority workloads, enable peaktime resource shifts, and control operational budgets. NavOps in PBS Professional offers an easy-to-use GUI for day-to-day operations, as well as an extensive command-line interface (CLI) for IT management, including installation and configuration.

Explore HPC with Altair One™ Altair One™, Altair’s cloud innovation gateway powered by Altair HPCWorks, enables teams to seamlessly explore HPC in the cloud and on-premises. Users can now easily create private clusters using their own cloud subscriptions, fully configured with Altair applications and HPC tools, and leveraging cutting-edge CPU and GPU hardware. Additionally, Altair DriveTM gives teams control of their data in the cloud with a seamless and intuitive workflow, integrated 2D/3D viewer, and intelligent, content-aware submission to Altair HPCWorks clusters.

To learn more about the latest advancements in Altair HPCWorks, visit web.altair.com/sc23 or visit Altair at Booth #825 at SC23 from November 12-17 in Denver, Colorado.

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To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements As vehicles become more connected and technologically advanced, the need for heightened security measures also rises. New government and automotive OEM cybersecurity requirements are

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beginning to include larger key sizes and Edwards Curve ed25519 algorithm standards. In response, Microchip Technology (Nasdaq: MCHP) has launched its latest TrustAnchor Security IC, the TA101,

which can accommodate complex automotive and embedded security use cases. The TA101 supports large key sizes up to ECC P521, SHA512, RSA-4K and AES256 with greater security strength,

exceeding current standards and allowing room for future adjustments while maintaining backwards compatibility for smaller keys. The TA101 is offered as an industrial-grade CryptoAuthentication™ Security IC and as a CryptoAutomotive™ Security IC supporting AEC-Q100 Grade 1 qualified devices.

As the latest device in Microchip’s portfolio of security ICs, the TA101 is specifically designed to support automotive security, data center and industrial applications. The cryptographic companion device works alongside a microcontroller (MCU) or microprocessor (MPU) to handle cryptographic functions including public key infrastructure, certificate management and secure key storage requirements.

The TA101 offers easy patch updates, message authentication, Transport Layer Security (TLS), secure boot, High-bandwidth Digital Content Protection (HDCP), firmware updates, security upgrades, transfer of ownership, key management and WPC Qi® 1.3 authentication.

“It is critically important for OEMs to not only comply with current standards but to stay a step ahead when it comes to security. By introducing key sizes associated with 256 bits of security strength, the TA101 offers great key strength

diversity now and for future applications,” said Nuri Dagdeviren, corporate vice president of Microchip’s Secure Computing Group. “Additionally, Microchip’s modular security solution approach allows customers to choose an optimally sized and priced MCU based on the focus application of the module, while standardizing a single security solution that satisfies virtually all security requirements.”

The TA101 delivers an alternative architecture to on-die multicore MCU/MPU management of invehicle networking by offering an off-chip component to handle secure boot and message authentication. The device is compatible with a wide range of MCUs or MPUs, enabling flexible solutions that can help lower costs and reduce time to market.

The TA101 offers the Commercial National Security Algorithm (CNSA) required 1.0 suite of algorithms and the ed25519 curve in a single IC. Reducing the risk associated with secure code development and implementation, it comes preprogrammed and preprovisioned in Microchip Common Criteria ALC_DVS.2 certified facilities. To learn more about Microchip’s automotive security portfolio, visit the CryptoAutomotive Security IC page on the company’s website.

Development Tools The TA101 is supported by the CryptoAuth Trust Platform Development Kit and several TA101 socket boards that feature a mikroBUS™ connector. These socket boards can also be used with the mikroBUS Xplained Pro Extension Board, which connects to a wide variety of Xplained Pro boards for developing designs with SAM MCUs. The TA101 AUTOSAR® Microcontroller Abstraction Layer (MCAL) is ASPICE Level 2 compliant. Microchip’s CryptoAuthentication Library of software allows seamless integration into industry-standard operating systems or customized software stacks for crypto functions. The Trust Platform Development Suite (TPDS) can be used to configure prototypes and prepare them for provisioning at Microchip’s secure factories.

Pricing and Availability The TA101 is available starting at $1.60 each in 10,000-unit quantities.

For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

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A new identity for Atlas Copco Group

Atlas Copco Group today launches a new identity, including a new Group logo, a new visual identity, and a new Group message: Technology that transforms the future.

The current blue and white Atlas Copco brand and logo will continue to be used on products and services, in the same way as other brands in the Group use their respective logos. This includes around 50 brands such as Edwards, Isra, Leybold, LEWA and Chicago Pneumatic, which all have their distinct identity and unique value proposition.

“We have many strong brands driving the success of our business, 12

and decentralization remains an important part of our strategy,” said Mats Rahmström, President and CEO of the Atlas Copco Group.

“Going forward, the new Atlas Copco Group brand becomes the umbrella for all brands in the Group, including Atlas Copco. This will enable our brands to maintain their individuality, while we at the same time can increase the focus on the power of being part of something bigger.”

The new Group message: “Technology that transforms the future,” is there to reflect the Group’s contribution to society at large.

“Our customers are often at the forefront of transforming their industries and driving development forward, and we support them by

increasing their productivity, safety, quality, and energy efficiency,” said Mats Rahmström. “It is our technology and people who make the difference in the Atlas Copco Group.”

Read more here: www.atlascopcogroup.com/ corporate/en/about-us/atlascopco-group-identity

Printing and labelling across your production line

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Industry 4.0

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Product identification

Domino understands that integrating innovative, new equipment into the toughest production lines requires reliable, compliant products, simple integration and a consistent global support infrastructure. We have already launched products, including our new Thermal Inkjet Gx-Series printers, which offer in-built future-proofing to keep pace with customers’ increasingly intelligent factories.

Domino are trusted by a wide range of food, beverage, life sciences and industrial manufacturers, as well as global packaging machinery manufacturers who partner with us to offer fully-integrated solutions with customisable options.

Learn more:

www.domino-printing.com

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Shapeways Reinforces Relationship With AM Solutions And Joins Beta Partner Programme For The C2 Liquid Color Smoothing Technology AM Solutions - 3D post processing technology is delighted to announce that it has today signed an agreement at Formnext 2023 with leading digital manufacturing and 3D printing expert Shapeways Inc, which will join its Beta Partner Programme for the company’s C2 Liquid Color Smoothing technology.

This represents a further strengthening of the relationship with Shapeways which invested in AM Solutions S1 and S2 technologies earlier this year after taking part in the Beta Programme for the S2 post processing solution.

Jules Witte, Plant Manager at Shapeways’ Eindhoven-based facility says, “Our interest in the C2 from AM Solutions is because it provides AM part post processing results that are increasingly demanded by both our B2B and B2C customers. As a company, we are known for our commitment to quality and reliability, placing customer requirements at the core of our operations, and continuously pursuing top-notch solutions to meet their demands.”

The C2 from AM Solutions takes the chemical smoothing of 3D

printed parts to a new level. With its innovative 2-in-1 Liquid Color Smoothing process, it is capable of smoothing and dyeing parts in a single pass. The result is a streamlining of the process chain with both functions being performed by only one machine.

It also reduces the total capital investment required and lowers the cost per finished part. Compared to other solutions, the immersion smoothing technology used reduces the processing time and the specially developed process media operates in a more ecofriendly way.

Tobias Schamberger, Head of Sales at AM Solutions - 3D post processing technology says, “We are proud to be working so closely with a company like Shapeways which is such a prominent player in the AM space. As two companies,

we share similar objectives when it comes to AM, and that is for us developing, and for Shapeways investing in and using, technologies in the AM process chain that produce the highest quality end use parts in the most cost-effective way possible. Working with us on the C2 Beta Partner Programme endorses that Shapeways and AM Solutions both recognize the pivotal value of this technology for the AM sector.”

Witte continues, “We see the C2 as a solution that could produce quality parts, speedily, as well as reducing the overall cost per part due to its combined 2-in-1 Liquid Color Smoothing process in a more sustainable way. The test parts coming out of the machine were excellent so we expect to add a significant value for our customers by using the C2 in the future. Finally we are delighted to reinforce our relationship with AM Solutions.”

This represents a further strengthening of the relationship with Shapeways which invested in AM Solutions S1 and S2 technologies earlier this year after taking part in the Beta Programme for the S2 post processing solution.

Jules Witte, Plant Manager at Shapeways’ Eindhoven-based facility says, “Our interest in the C2 from AM Solutions is because it provides AM part post processing results that are increasingly demanded by both our B2B and B2C customers. As a company, we are known for our commitment to quality and reliability, placing

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customer requirements at the core of our operations, and continuously pursuing top-notch solutions to meet their demands.”

The C2 from AM Solutions takes the chemical smoothing of 3D printed parts to a new level. With its innovative 2-in-1 Liquid Color Smoothing process, it is capable of smoothing and dyeing parts in a single pass. The result is a streamlining of the process chain with both functions being performed by only one machine.

It also reduces the total capital investment required and lowers the cost per finished part. Compared to other solutions, the immersion smoothing technology used reduces the processing time and the specially developed process media operates in a more ecofriendly way.

Tobias Schamberger, Head of Sales at AM Solutions - 3D post processing technology says, “We are proud to be working so closely with a company like Shapeways which is such a prominent player in the AM space. As two companies, we share similar objectives when it comes to AM, and that is for us developing, and for Shapeways investing in and using, technologies in the AM process chain that produce the highest quality end use parts in the most cost-effective way possible. Working with us on the C2 Beta Partner Programme endorses that Shapeways and AM Solutions both recognize the pivotal value of this technology for the AM sector.”

Witte continues, “We see the C2 as a solution that could produce quality parts, speedily, as well as reducing the overall cost per part due to its combined 2-in-1 Liquid Color Smoothing process in a more sustainable way. The test parts coming out of the machine were excellent so we expect to add a significant value for our customers by using the C2 in the future. Finally we are delighted to reinforce our relationship with AM Solutions.”

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TTI Europe Now Shipping TE Connectivity’s PowerTube High-Voltage Connectors for E-mobility Applications TTI, Inc. – Europe, a leading specialty distributor of electronic components, is now stocking the PowerTube connector series from TE Connectivity, a world leader in connectors and sensors.

Targeting e-mobility applications in industrial and commercial vehicles, the connector series is built to handle the large electrical loads found in e-motor, inverter and battery pack subsystems.

The connector system is available in multiple wire size options, between 35mm2 and 150mm2, and can withstand up to 580A and, depending on wire size and temperature, up to 1000V. The robust design withstands enginelevel vibration and circular 360° shielding (shield current up to 30% of the main current) helps ensure high EMC performance.

Manufactured with scalability and modularity in mind, the PowerTube header is available in either 180° or 90° orientations, as well as up to 3 positions per connector. This is complemented by a unique cubeshaped busbar interface that allows connectivity independent of busbar orientation.

Along with its modularity, a refined circular design greatly simplifies cable routing and connector assembly, helping vehicle

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manufacturers to lower the total applied system cost. Thanks to IP6K9K dust and water ingress protection, Connector Position Assurance (CPA) and a High Voltage Interlock Loop (HVIL) safety feature in each pin, the PowerTube connector helps ensure reliable, safe connectivity.

“In the race toward a more sustainable future, the industry for industrial and commercial vehicles is switching from internal combustion engines to hybrid and electric alternatives,” says Dermot Byrne, Industry Marketing Director - Transportation at TTI Europe.

“With TE Connectivity’s PowerTube connector series, TTI can help ease this electrification transition for our customers.”

For more information about TE Connectivity’s PowerTube connector series, which is now available from TTI Europe, please follow this link: www.ttieurope.com/content/ ttieurope/en/manufacturers/t-z/ te-connectivity/products/teconnectivity-powertube-highvoltage-connector.html

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Altus Sees Rising Demand for Scienscope X Ray Solutions Across Europe Altus Group, a leading distributor of capital equipment in the UK and Ireland, has announced growing interest in Scienscope X-ray inspection systems from electronics manufacturers in Europe.

Leveraging a six-year partnership, Altus and Scienscope have seen increased demand as manufacturers look for innovative imaging solutions.

To meet rising market demand, Scienscope has expanded its global operations, including new investments across Europe, to provide enhanced service capabilities and rapid delivery to customers. This includes boosting its expertise by welcoming Patrick Kossik, a recent graduate of the University of Polytechnic Timisoara, as a new service engineer to further strengthen support capabilities across the region.

In addition, Scienscope has established a dedicated 120 sq. m. office space, and 150 sq. m. warehouse in Timisoara, Romania, with a complete inventory of its X-ray inspection systems and component management solutions.

This enables rapid delivery and support across the region for both prospective customers and existing users. The company will also be launching a new website soon to further improve customer engagement.

Joe Booth, CEO of Altus said: “Scienscope’s expanded European presence and new service engineer allows us to deliver even better service and support to our customers as they scale.

“Having a complete inventory of Scienscope systems readily available on a European level provides a significant advantage, allowing us to promptly deliver solutions across the region. The new demo room also gives our customers the opportunity to experience first-hand the full spectrum of capabilities offered 18

by Scienscope’s X-Ray inspection solutions in Europe.”

As component shortages drive more electronics manufacturers to optimise their supply chains and increasing miniaturisation makes inspection more critical, Scienscope’s expanded European operations will allow Altus to deliver

timely X-ray inspection solutions that meet customer needs. With intuitive software, automation and flexibility, Scienscope’s systems simplify quality inspections and component management, helping manufacturers focus on production efficiency. www.altusgroup.co.uk.

ACOPOS 6D

Creating new dimensions of adaptive manufacturing www.br-automation.com/ACOPOS6D

ACOPOS 6D allows you to move products freely through an open manufacturing space – unbound by the limits of one-dimensional production flow. Magnetic levitation provides six degrees of freedom for unprecedented processing density on a fraction of the floorspace.

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New 32-Bit MCU Features an Embedded Hardware Security Module to Safeguard Industrial and Consumer Applications Highly configurable PIC32CZ CA devices are available with a 300 MHz Arm® Cortex®-M7 processor Industrial and consumer application designers must consider implementing security functionality in their devices during the development process as security threats evolve and become more sophisticated. To allow designers to easily integrate security into their applications, Microchip Technology (Nasdaq: MCHP) today announces a new family of PIC32CZ CA 32-bit microcontrollers with a 300 MHz Arm Cortex-M7 processor, an integrated Hardware Security Module (HSM), and a wide range of connectivity and Flash memory options for added flexibility.

The new family of PIC32CZ CA devices includes the PIC32CZ CA90 with a HSM or the PIC32CZ CA80 without the integrated HSM. The HSM in the PIC32CZ CA90 is a monolithic solution that provides advanced security for industrial and consumer applications.

The HSM operates as a secure subsystem with a separate MCU on board that runs the firmware and security features including hardware secure boot, key storage, cryptographic acceleration, true random number generator and more.

For products that require added 20

security, factory provisioning is available on the PIC32CZ CA90 which, upon completion, provides customers with pre-provisioned devices ready to be deployed.

Microchip’s Trust Platform Development Suite is an in-house secure provisioning tool that enables a secure supply chain channel at scale or in low-volume production.

Correction Code (ECC) memory to mitigate data corruption.

“The PIC32CZ CA microcontrollers make it easier for our customers to implement embedded security features into their design,” said Rod Drake, corporate vice president of Microchip’s MCU32 business unit. “These are extremely versatile MCUs with the option of factory provisioning at low-volume production and other customizable configurations such as connectivity and memory to fit many different requirements.”

Development Tools

The PIC32CZ CA MCUs can be configured using a wide range of connectivity options including USART/UART, I2C, SPI, CAN FD, HighSpeed USB and Gigabit Ethernet.

The Ethernet option includes Audio Video Bridging (AVB) and Precision Time Protocol (PTP) based on the IEEE 1588 standard. These devices are scalable with 2, 4 or 8 MB of onboard Flash, 1 MB of SRAM and Error

The PIC32CZ CA devices are the latest 32-bit MCUs to join Microchip’s broad portfolio of PIC32 and SAM families that provide high-performance, functional capabilities and many features to customize and create innovative products.

The devices are supported by the PIC32CZ CA90 Curiosity Ultra Development Board, the PIC32CZ CA80 Curiosity Ultra Development Board and MPLAB® Harmony v3 to test, program and debug in the design phase.

Pricing and Availability The PIC32CZ CA80 is available for $14.80 each in 10,000-unit quantities and the PIC32CZ CA90 is available for $15.54 each in 10,000-unit quantities in a BGA 208 package.

For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

 Perfect slicing results even at warmer product temperatures  Groundbreaking in their operation, ergonomics and hygiene  High yield and reduced give-away

MULTIVAC slicers are highly impressive with their perfect slicing results within a wide temperature range.

The rapid set-up and conversion of the slicers, as well as their particularly ergonomic operation, ensure the highest possible level of flexibility is achieved.

Better slicing.

When you choose MULTIVAC, you are opting for an innovative and cost-effective slicer, the most efficient slicing line, and our unparalleled reliability.

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Anritsu Enhances Solution to Support Data Throughput Tests for HighPerformance 5G UEs Anritsu Corporation has released its new SmartStudio NR IP Performance MX800071A software for the Radio Communication Test Station MT8000A, bringing greater efficiency to data throughput tests on 5G user equipment.

5G is widely used for services such as Fixed Wireless Access (FWA), providing the last-mile link from the nearest base station to the subscriber’s building.

Anritsu developed the MX800071A to simplify and optimize data throughput tests required for developing 5G based Customer Premises Equipment (CPE) used for FWA.

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Development Background

Development Background

The increased demand for remote working and home entertainment is encouraging the development of 5G use cases featuring high-speed, large-capacity communications, with applications such as FWA being one of the most successful.

Development of CPE for FWA, and of wireless-communication modules built into CPE, requires data throughput testing using various sets of communication parameters. However, developers face difficulties with settings that require specialist knowledge, which reduces the efficiency of the development process and raises its costs. The MX800071A solves these issues by simplifying and optimizing complex parameter settings, helping increase the efficiency of tests.

Support for Various Tests with Base Station Simulator Working with the base station simulator, the MX800071A can configure a 4G and 5G SA/NSA radio environment for testing data throughput.

Easy-to-Use Interface Easy-to-set test parameters eliminate the need for specialist knowledge of complex protocols.

High Connection Reliability The MX800071A has been tested with a wide range of 4G and 5G modem chipsets and wirelesscommunication modules, ensuring excellent connectivity with most 4G and 5G UEs.

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iCOMAT and CGTech push new frontiers in composite part manufacture CGTech, the developer of VERICUT verification, simulation and optimisation software, is announcing an exciting reseller agreement with Bristol-based iCOMAT, pioneer of the first-ever defect-free tape-steering process for composite component production.

The special worldwide arrangement will see iCOMAT sell and support a dedicated version of VERICUT VCP/VCS software in support of its patented manufacturing process for composites. iCOMAT has registered notable growth since it began trading in 2019: today the company has almost 30 employees and a branch in Athens. Moreover, iCOMAT has plans to double its headcount in the coming 12 months, a move that will help spur ambitions for further international expansion.

Providing the basis for this success is iCOMAT’s unique composites production process, known as Rapid Tow Shearing (RTS). Due to manufacturing limitations, conventional composite part design relies on straight fibre layers, leading to structures which use more material than necessary and are heavier and more expensive as a result. In contrast, iCOMAT’s innovative process enables the defect-free steering of composite tapes for the first time. The placement of these tapes along complex load paths delivers highly optimised structures with dramatic weight savings and lower use of raw material in support of cost-

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effective and more sustainable composite parts. iCOMAT’s industrial cells comprise a proprietary tape-laying head mounted as an end effector to a state-of-the-art six-axis industrial robot arm, all located inside a safety cell. As part of this solution, programming and virtual simulation will come via a special version of VERICUT VCP (VERICUT Composites Programming)/VCS (VERICUT Composites Simulation) software complete with a new interface specifically for iCOMAT’s technology. iCOMAT will be the exclusive reseller of this software worldwide.

Explains Dr Dominic Bloom, Business Development Manager at iCOMAT: “Software is an integral part of our turnkey offer; customers must program and simulate their composite components to unlock optimised designs. CGTech are leaders in this field, so we definitely picked the right partner and know we can make our worldwide reseller agreement a success.”

Adds Olivier Munaux, Composites Product Manager, CGTech: “Our powerful software will drive the world’s only industrial machines that can steer wide composite tapes without defects at fast

rates. iCOMAT is pioneering this technology, disrupting the way engineers design composites, so it makes absolute sense for them to be the official global reseller of our RTS-specific VERICUT VCP/ VCS software. Together, we can push new frontiers in automated composite part manufacturing.”

Among the sectors able to benefit is aerospace. iCOMAT’s groundbreaking solutions deliver the strongest and lightest spars, fuselage panels and control surfaces, for instance. Examples include a 65% lighter lower wing skin compared with existing composite designs. The space industry, notably in launch vehicles and satellites, can also take advantage of central tubes and panels, for example, as weight has a major effect on launch costs.

In the automotive sector, iCOMAT offers the ultimate performance for winning races with the lightest and best aero-performing structures for Formula 1 and other motorsport teams. For road cars, iCOMAT combines its near-net-shape preforms (that reduce waste to almost zero) with low-cost and low-embodied carbon materials, delivering cost-efficient and sustainable solutions.

A WORLD OF PACKAGING SOLUTIONS DESIGNED FOR SUSTAINABILITY. BROUGHT TO LIFE BY SCHUBERT.

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Combined 3D printing expertise EOS and AM Solutions announce partnership EOS, one of the world’s leading technology providers for industrial 3D printing, and AM Solutions - 3D post processing technology, one of the world’s leading experts for industrial post-processing solutions, have recently combined their expertise and officially announced their partnership. Both companies are united by the goal of optimizing the process chain in the field of 3D printing and thus further paving the way to series production.

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EOS and AM Solutions - 3D post processing technology, two leading companies known for innovation and expertise in their respective fields, have joined forces to focus on advancing the entire additive manufacturing process chain. In order to make the leap to mass production, the individual steps leading to the finished product must become increasingly automated and significantly more economical.

There is a lot of potential in the interfaces. “In order to truly scale AM production, all steps within the value chain – including postprocessing – must work in concert, providing a complete solution for our customers. With AM Solutions, we have found a partner with the capabilities to reach the next level in automating the AM process chain”, says Virginia Palacios, Chief Business Officer Polymer at EOS. “We share the same goal and enrich each other with our different competencies and decades of experience on both sides”.

“Our companies are united by the same high quality standards, the pursuit of the best customer solution in each case, and the goal of establishing 3D printing as a whole economically, efficiently, and at the highest level of quality”, adds David Soldan, Head of AM Solutions - 3D post processing technology.

In addition, both companies are owner-managed, develop and produce their machines in Germany and embody the values of successful, medium-sized German companies. “Our technology’s ability to provide quality and reliability while performing at peak production levels is why we are the market leader and why we chose AM Solutions as our partner”, says Virginia Palacios.

Scalable solutions without compromises Above all, EOS and AM Solutions are working to take SLS printing to the next level on an industrial scale. The higher the output, the more reliable, faster and more efficient the subsequent steps, such as depowdering, have to be.

The key to this lies in automated, economical and highly efficient post-processing. In this way, quantities can be scaled up as required - without compromising quality and reproducibility.

Increased automation is also an important factor in addressing the growing shortage of skilled labor.

Sustainability and occupational safety are also key considerations.

“Our depowdering solutions are always designed to recycle as

much material as possible. This saves valuable resources and, ultimately, money,” explains David Soldan. As part of its Responsible Manufacturing mission, EOS places great emphasis on sustainability.

The fully automated finishing processes also replace manual processing, ensuring greater safety and a much better working environment for employees by significantly reducing the operator’s direct contact with the powder.

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RanLOS and Anritsu Unveil Innovative 5G Vehicle OTA Test Solution Versatile and cost-effective antenna OTA test solution designed for seamless integration with existing EMC chambers

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RanLOS, TOYO Corporation (TOYO), AeroGT Labs, and Anritsu today announced the availability of the first 5G antenna over-the-air (OTA) measurement system engineered with RanLOS’ OTA test solution and Anritsu’s 5G Radio Communication Test Station MT8000A. The new system represents a significant step forward in enabling advancements in 5G connected vehicles.

As autonomous driving gains momentum, and the demand for connected vehicles surge, the adoption of 5G for automotive use comes with performance requirements for successful implementation. To enable the seamless flow of dynamic, realtime data communication, highly reliable antenna performance is a key necessity to ensure the safety of autonomous and connected vehicles and to enable advanced infotainment. This requirement is addressed by optimizing and validating antenna design and installation on a vehicle.

However, to accomplish this critical task, design engineers need a consistent, reliable, and controllable test environment that can emulate real-world conditions.

RanLOS and Anritsu collaborated to meet this need by integrating a portable antenna test system with a wide dynamic range base station simulation. The combined solution supports the measurement of throughput and antenna radiation patterns under static conditions and the evaluation of throughput degradation in vehicles operating on a dynamometer. It is well-suited for assessing the performance of antennas on transportation vehicles such as

automobiles, vans, minibuses, and autonomous transport systems.

What sets the solution apart is its distinctive capability to be seamlessly integrated into preexisting EMC chambers, providing manufacturers with an opportunity to establish an essential testing environment while keeping the initial investment to a minimum.

As measurement solution providers, TOYO and AeroGT Labs, a TOYOaffiliated company specializing in OTA measurements, view this solution as an optimal choice for customers requiring a 5G OTA measurement solution for advancing next-generation mobility. Drawing from their broad EMC and antenna measurement business experiences, TOYO and AeroGT Labs lead the go-to-market efforts.

“It’s a major step to have 5G capabilities integrated into our offering”, comments Louice Rosdahl, CEO of RanLOS. “5G is 100 times faster than 4G at peak speed and will be an enabler for safer connected cars. We are grateful for the collaboration with Anritsu and look forward to delivering the benefits of this new offering to our users and customers.”

“While the 5G wireless communication quality evaluation is indispensable for the development of the nextgeneration mobility including connected and autonomous vehicles, no standard test method has been established.

In this context, the solution created by integrating Anritsu and RanLOS products offers a simple and intelligent way to evaluate the 5G on-vehicle wireless communications and

minimize initial investment,” said Yoshimichi Imaizumi, Director, Senior VP at TOYO. “By promoting this sophisticated yet cost-effective solution to the mobility industry, we contribute to the building of a safer and more trusted traffic network.”

“As transportation vehicles advance further toward an allinterconnected future, holistically evaluating and gauging 5G antenna performance in connected vehicles becomes more than a benchmarking and testing effort,” said Steve Wong, Chief Marketing Officer at AeroGT Labs. “This critical process lays the foundation for a transportation future characterized by elevated safety and enhanced efficiency.”

“This leading technology is the result of our partnership with RanLOS,” said Takeshi Shima, Director, Senior Vice President, Test & Measurement Company President at Anritsu. “By integrating the Anritsu MT8000A 5G network simulator with the RanLOS system, we offer the automobile test marketplace an advanced solution with technologically and cost-effective benefits. With the constant and rapid progress in autonomous services, in-vehicle antenna performance significantly matters. The solution ultimately equates to an improved user experience, which benefits the evolution of widely spreading smart society. We are thrilled to promote it globally, collaborating with TOYO and AeroGT Labs.”

The 5G antenna OTA measurement solution is shipping now. Please contact any one of the companies named in this news release for further information or to book a demo.

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Microchip’s Detroit Automotive Technology Center is the Destination for Automotive Clients The 24,000-square-foot facility includes new high-voltage and E-Mobility labs, as well as technical training rooms for automotive clients to develop and optimize designs The automotive industry is evolving at a rapid pace, with E-Mobility and Advanced Driver Assistance Systems (ADAS) driving the market’s need for innovative solutions.

Microchip Technology (Nasdaq: MCHP), a leading provider of smart, connected and secure embedded control solutions, today announces

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the expansion of its Detroit Automotive Technology Center in Novi, Michigan. The 24,000-squarefoot facility is the destination for automotive clients to explore new technologies and to meet with technical experts to get support for their end applications and designs.

Microchip has been part of the Detroit community since 1999, when it first opened its doors as an application and sales office.

With the recent completion of phase three of its expansion project, Microchip has more than doubled its lab space, including the addition of new labs that focus

on high-voltage and E-Mobility applications. This larger facility will also bring more technology-related jobs to the region.

“Microchip’s automotive business is a cornerstone of our company’s legacy. We remain focused on developing total system solutions, and this expansion provides our customers with immediate access to state-of-the-art resources,” said Rich Simoncic, executive vice president of Microchip. “In addition to the Detroit location, we have Automotive Technology Centers in Munich, Shanghai, Tokyo and Austin, Texas, to support our global customer base.”

“Microchip’s Automotive Technology Center demonstrates our commitment to the automotive industry by providing a destination for them to develop, test and refine applications in the design phase,” said Matthias Kaestner, corporate vice president of Microchip’s automotive business. “Our vision for the center is to provide our automotive customers with the confidence to choose the right solutions for their designs by helping them to cut design effort and time to market by providing world class technical support locally.”

Located in the heart of the automotive industry, and with top tier OEMs, suppliers and startups operating in the region, Novi is a key location for Microchip’s Detroit Automotive Technology Center and easily accessible to help OEMs with their design challenges.

The key capabilities of the Detroit Automotive Technology Center include: •

Dedicated high-voltage lab for demonstrations of reference designs featuring Microchip’s silicon carbide mSiC™ solutions, dsPIC® Digital Signal Controllers (DSCs) and our wide breadth of analog and mixed-signal solutions

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Support for central compute and zonal networks in ADAS platforms using Microchip’s PCIe® Gen 4 and Gen 5 switching hardware, singlepair Ethernet devices and development tools

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Human Machine Interface (HMI) lab to support the development of full-width cockpit displays; touchscreens; Knob-onDisplay™ (KoD™) solutions; and buttons, sliders, and wheels with EMC testing

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USB and networking development resources for pre-certification of multimedia infotainment systems and media hubs for advanced USB Type-C® 3.2 protocol applications

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Die- and product-level characterization of automotive MEMS resonators and oscillators, including vacuum and wafer-scale probe and test, long-term aging, frequency stability, phase noise and jitter test capability

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Development of automotive security solutions using

Microchip’s CryptoAutomotive™ TrustAnchor ICs, and onsite security training to learn how to implement secure elements in applications such as secure boot, message and hardware authentication and more “The new high-voltage lab will help our automotive customers develop systems using our reference design platforms and analog, digital control and power solutions,” said Clayton Pillion, vice president of Microchip’s silicon carbide business unit. “As more OEMs transition to our E-Mobility offerings, we are ready to support them from the design phase to implementation.”

As a leading supplier of embedded solutions to global automotive OEMs, Microchip offers many automotive products that are qualified in accordance with AEC-Q100 requirements.

Its automotive-qualified product portfolio includes microcontrollers, DSCs, USB and networking solutions, analog and interface products, SiC MOSFETs, serial EEPROMs and more.

Microchip also offers a broad portfolio of ISO 26262 functional safety ready and functional safety compliant devices that offer the latest hardware safety features and are supported by a comprehensive safety ecosystem to simplify the design and certification of safety-critical automotive applications.

To learn more about Microchip’s automotive products and solutions, click here.

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